CN107393855A - A kind of wafer positioner and method - Google Patents
A kind of wafer positioner and method Download PDFInfo
- Publication number
- CN107393855A CN107393855A CN201610326082.8A CN201610326082A CN107393855A CN 107393855 A CN107393855 A CN 107393855A CN 201610326082 A CN201610326082 A CN 201610326082A CN 107393855 A CN107393855 A CN 107393855A
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- China
- Prior art keywords
- wafer
- mark
- mark detector
- control module
- driving wheel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Abstract
The present invention, which provides a kind of wafer positioner and correlation technique, the device, to be included：Wafer rotating mechanism, mark detector and control module provided with pivot, wherein, the wafer rotating mechanism includes and wafer contacts and the driving wheel that drives wafer to be rotated with the pivot；Telltale mark on the mark detector detection wafer, and testing result is sent to the control module；The control module controls the driving wheel to realize that wafer positions according to the testing result of the mark detector.The wafer positioner of the present invention is rotated using drive wheel wafer replaces traditional sucker to draw mode, can avoid causing wafer to damage in positioning, can realize that multiple spot detection positions, multistage speed control, high-efficiency high-precision, and cost simple in construction is low.
Description
Technical field
The present invention relates to semiconductor fabrication, more particularly to a kind of device and method of wafer positioning.
Background technology
The alignment control of wafer is one of important step in integrated circuit fabrication process.When semiconductor crystal wafer manufactures, it will usually
The mark for positioning is made on wafer, such as is arranged on the breach of crystal round fringes, common are V-groove (V-notch),
Flat side (Flat) etc..
These telltale marks can be detected by the mode such as optical sensor or charge coupled cell (CCD) video camera.Earlier
Wafer positioner is exposed in the patent document that the Japanese Patent Application Publication number on the 23rd of August in 1994 is 05045948.Should
Positioner disclosed in patent detects semiconductor crystal wafer using charge coupled cell (CCD) video camera on rotary table
Position on rotary table simultaneously handles image to detect the position of wafer center of gravity, and the image of processing is sent in camera lens to determine crystalline substance
Round direction, so as to realize the positioning of wafer.
However, in positioner commonly used in the trade at present, no matter the detector of mark is to utilize CCD or optical sensor, base
This is all to draw wafer vacuum by sucker to be fixed on rotating disk to rotate to realize that seeking side positions with reference to detector.And pass through suction
Disk makes wafer rotation be easy to cause to damage in wafer and sucker contact site, is formed and inhales trace etc., especially for twin polishing
Wafer, this influence are more prominent.
Therefore, it is necessary to improve existing wafer positioner in fact, avoids above mentioned problem.
The content of the invention
In view of the above the shortcomings that prior art, it is an object of the invention to provide a kind of wafer positioner and method, it is used for
Solve the problems, such as to easily cause wafer damage when positioning using wafer positioner in the prior art.
In order to achieve the above objects and other related objects, the present invention provides a kind of wafer positioner, including：Provided with pivot
Wafer rotating mechanism, mark detector and control module, wherein, the wafer rotating mechanism includes and wafer contacts and driven
The driving wheel that wafer is rotated with the pivot；Telltale mark on the mark detector detection wafer, and will detection
As a result it is sent to the control module；The control module according to the testing result of the mark detector control the driving wheel with
Realize that wafer positions.
Preferably, the wafer rotating mechanism also includes servomotor and gear switching mechanism；The servomotor passes through the tooth
Taking turns switching mechanism drives the driving wheel to rotate；The control module controls the driving rotation by controlling the servomotor
Speed and direction are moved to realize that wafer positions.
Preferably, the gear switching mechanism includes：The first gear that is fixed in the servomotor rotating shaft and it is fixed on institute
State the second gear in driving wheel rotating shaft；The first gear is engaged with the second gear and drives second gear to rotate, will
The rotatory force of the servomotor is transformed on the driving wheel.
Preferably, the servomotor and the gear switching mechanism are located at the pivot of the wafer rotating mechanism.
Preferably, the wafer rotating mechanism also includes edge stoppers, and the edge stoppers are located at pivot and extended to driving wheel
Extended line on.
Preferably, the mark detector is arranged on the edge stoppers.
Preferably, the mark detector quantity is three, is evenly distributed in using the pivot as on the circumference in the center of circle.
Preferably, the driving wheel quantity is three, is evenly distributed in using the pivot as on the circumference in the center of circle.Further
Preferably, the edge stoppers quantity is three, respectively on the extended line that pivot extends to three driving wheels.
It is further preferred that the mark detector quantity is three, the edge stoppers of corresponding three driving wheels are separately positioned on
On.
Preferably, the mark detector is optical sensing detector.
Preferably, the wafer positioner is additionally provided with mechanical arm, is put into or takes out wafer.
In order to achieve the above objects and other related objects, the present invention also provides a kind of wafer positioning method, including：
Wafer provided with telltale mark is positioned on above-mentioned wafer positioner, crystal circle center is alignd with the pivot；
Rotated by the drive wheel wafer with the pivot；
When the mark detector detects the telltale mark on wafer, turning for the driving wheel is controlled by the control module
Dynamic speed and direction, to realize that wafer positions.
In order to achieve the above objects and other related objects, the present invention also provides a kind of control method of above-mentioned wafer positioner, its
In, the wafer positioner includes the first mark detector, the second mark detector and the 3rd mark detector, wherein described
Second mark detector and the 3rd mark detector are located at the left and right sides of first mark detector respectively；Methods described
Including：
When first mark detector detects the telltale mark on wafer for the first time, the control module controls all drivings
Wheel reduces rotating speed and changes original rotation direction, when first mark detector detects the telltale mark on wafer again,
The control module controls all driving wheels to stop operating to realize positioning；
When the second mark detector detects the telltale mark on wafer, the control module controls all driving wheels to make wafer suitable
Clockwise rotates and rotating speed is reached First Speed；
When the 3rd mark detector detects the telltale mark on wafer, the control module controls all driving wheels to make wafer inverse
Clockwise rotates and rotating speed is reached First Speed.
Preferably, the control module is provided with initial velocity and initial steer, when wafer has just been put into the wafer positioner,
The control module control wafer is rotated with the initial velocity and initial steer.
Preferably, first mark detector, the second mark detector and the 3rd mark detector are evenly distributed in the rotation
Turn on the circumference that center is the center of circle.
As described above, the wafer positioner and method of the present invention, have the advantages that：
The wafer positioner of the present invention replaces traditional sucker to draw mode using the rotation of drive wheel wafer, can avoid
Cause to occur inhaling trace equivalent damage on wafer during positioning, be advantageous to follow-up procedure for processing, improve the quality of production；Wafer rotation therein
Servomotor revolving force is transformed on driving wheel by rotation mechanism using gear switching mechanism, accurately controls the velocity of rotation of driving wheel
And direction, it is simple in construction, and cost is relatively low；In addition, the wafer positioner of the present invention can use multiple drive wheels brilliant
Circle rotation, and multiple mark detectors can be set, multiple spot detection positioning, multistage speed and course changing control can be realized, so as to carry
The operating efficiency of high wafer positioning and the degree of accuracy.
Brief description of the drawings
Fig. 1 is shown as wafer positioner schematic diagram provided in an embodiment of the present invention.
Fig. 2 is shown as the wafer rotating mechanism schematic diagram in wafer positioner provided in an embodiment of the present invention.
Fig. 3 is shown as the gear switching mechanism schematic diagram in wafer rotating mechanism provided in an embodiment of the present invention.
Fig. 4 is shown as gear switching mechanism working state schematic representation provided in an embodiment of the present invention.
Component label instructions
1 wafer rotating mechanism
2 mark detectors
3 control modules
101 servomotors
102 gear switching mechanisms
103 driving wheels
1011 servomotor rotating shafts
1031 driving wheel rotating shafts
1021 first gears
1022 second gears
104 edge stoppers
Embodiment
Illustrate embodiments of the present invention below by way of specific instantiation, those skilled in the art can be as disclosed by this specification
Content understand easily the present invention other advantages and effect.The present invention can also add by way of a different and different embodiment
To implement or apply, the various details in this specification can also be based on different viewpoints and application, in the essence without departing from the present invention
God is lower to carry out various modifications or alterations.It should be noted that in the case where not conflicting, the feature in following examples and embodiment
It can be mutually combined.
It should be noted that the diagram provided in following examples only illustrates the basic conception of the present invention in a schematic way, scheme then
Component count, shape and size drafting when the component relevant with the present invention is only shown in formula rather than being implemented according to reality, in fact
Kenel, quantity and the ratio of each component can be a kind of random change when border is implemented, and its assembly layout kenel may also be answered more
It is miscellaneous.
Referring to Fig. 1, the present invention provides a kind of wafer positioner, including：Wafer rotating mechanism 1 provided with pivot, mark
Remember detector 2 and control module 3；Wherein, wafer rotating mechanism 1 includes and wafer contacts and drives wafer with the rotation
The driving wheel that the heart is rotated；Mark detector 2 detects the telltale mark on wafer, and testing result is sent into control module
3；Control module 3 controls driving wheel to realize that wafer positions according to the testing result of mark detector 2.Tradition has been abandoned in the design
Vacuum cup draw wafer rotation mode, using drive wheel wafer rotate realize seek side positioning, can avoid in wafer
Center causes to inhale trace equivalent damage, is advantageous to improve the quality of production of IC manufacturing, reduces loss.
Fig. 2 is the wafer rotating mechanism schematic diagram in wafer positioner provided in an embodiment of the present invention, as the preferred of the present invention
Embodiment, the wafer rotating mechanism except driving wheel 103, in addition to：Servomotor 101 and gear switching mechanism 102.Servo
Motor 101 drives the driving wheel 103 to rotate by gear switching mechanism 102；The control module can be by controlling servo
Motor 101 come control driving wheel 103 rotate speed and direction, so as to realize wafer position.
Gear switching mechanism 102, it is preferable that as shown in figure 3, including：The first tooth being fixed in servomotor rotating shaft 1011
Wheel 1021 and the second gear 1022 being fixed in driving wheel rotating shaft 1031；First gear 1021 is stung with second gear 1022
Merge and drive second gear 1022 to rotate, so as to which the rotatory force of servomotor 101 is transformed on driving wheel 103, pass through drive
Driving wheel 103 can drive the wafer of certain mass to do directional-rotation.Preferably, servomotor 101 and gear switching mechanism 102
The pivot of the wafer rotating mechanism can be located at.Wherein, when gear switching mechanism 102 works, first gear 1021 and the
The interlocking pattern of two gears 1022 see Fig. 4.
In addition, the wafer rotating mechanism is additionally provided with edge stoppers 104, as shown in Fig. 2 edge stoppers 104 are located at the crystalline substance
On the extended line that the pivot of circle rotating mechanism extends to driving wheel 103.Edge stoppers 104 arrive the rotation of the wafer rotating mechanism
The distance for turning center should be slightly bigger than the radius for being put into wafer, and after being so put into wafer, edge stoppers 104 can be fixed on wafer outer rim,
Wafer is avoided to be skidded off when rotating.
In addition, the mark detector is arranged on edge stoppers 104 in the present embodiment, pass through the position for detecting wafer
Part whether have telltale mark.Certain mark detector can also be arranged on other suitable positions.Preferably, it is described
Mark detector can be optical sensing detector, and such as reflective fiber sensing element, this is that those skilled in the art are known
Technology, it will not be described here.It should be noted that the present invention is not restricted for mark detector using which kind of detection technique,
Which kind of also do not limited using telltale mark for the wafer detected, as long as mark detector can detect corresponding positioning mark
Note.
As the preferred scheme of the present invention, the quantity of driving wheel 103 is three, and three driving wheels 103 are evenly distributed in institute
State on the circumference that pivot is the center of circle；The quantity of edge stoppers 104 is also three, corresponds to three driving wheels 103 respectively.This
It should be noted that the present invention is not restricted for the quantity of driving wheel, those skilled in the art can set according to actual conditions and drive at place
The number of driving wheel and position, the driving wheel of more than four equally can also realize the purpose of fast positioning, and driving wheel quantity is at three
The positioning of wafer can be also realized below, and the type of drive of three driving wheels should be relatively stable.
It is further preferred that the quantity of mark detector can be three, can be evenly distributed in using the pivot as the center of circle
On circumference, in the present embodiment, three mark detectors are separately positioned on the edge stoppers 104 of three driving wheels 103, respectively
Wafer is detected by the part of these three positions, is detected so as to multiple spot, realizes the positioning of fast accurate.
Preferably, wafer positioner provided by the invention is also provided with mechanical arm, and for being put into or taking out wafer, this is
This area common technique, accompanying drawing do not show that.
The embodiment of the present invention also provides a kind of wafer positioning method using above-mentioned wafer positioner, including：
Wafer provided with telltale mark is positioned on above-mentioned wafer positioner, crystal circle center is alignd with the pivot；
Rotated by the drive wheel wafer with the pivot；
When the mark detector detects the telltale mark on wafer, turning for the driving wheel is controlled by the control module
Dynamic speed and direction, to realize that wafer positions.
Herein, described control module can realize multiple spot detection, multistage speed control according to the quantity of mark detector, so as to
Improve efficiency and the degree of accuracy of wafer positioning.
As the preferred scheme of the present invention, the present embodiment also provides a kind of control method of above-mentioned wafer positioner, wherein, institute
Stating wafer positioner includes the first mark detector, the second mark detector and the 3rd mark detector；First mark detector
For final demand position, second, third mark detector is located at the left and right sides of the first mark detector respectively；Preferably, institute
The first mark detector, the second mark detector and the 3rd mark detector is stated to be evenly distributed in using the pivot as the center of circle
On circumference；The control method includes：
When first mark detector detects the telltale mark on wafer for the first time, the control module controls all drivings
Wheel reduces rotating speed and changes original rotation direction, when first mark detector detects the telltale mark on wafer again,
The control module controls all driving wheels to stop operating, and is accurately positioned with realizing.Preferably, using mechanical arm from the position
Put and take piece, and keep the relative position of wafer constant.When the second mark detector detects the telltale mark on wafer, control
Module controls all driving wheels to make wafer rotationally clockwise and rotating speed is reached First Speed, due to the second mark detector position
In the left side of the first mark detector, the first mark detector can be turned to by telltale mark as early as possible by rotating clockwise wafer, be improved
Location efficiency；When the 3rd mark detector detects the telltale mark on wafer, control module controls all driving wheels to make wafer
Rotate in an anti-clockwise direction and rotating speed is reached First Speed, because the 3rd mark detector is located at the right side of the first mark detector,
The first mark detector can be turned to by telltale mark as early as possible by rotating counterclockwise wafer.
Preferably, the control module is provided with initial velocity and initial steer, when wafer has just been put into the wafer positioner,
Control module controls wafer to be rotated with the initial velocity and initial steer.Initial velocity, initial steer and First Speed can roots
Set and adjust according to actual conditions.
, can when the second mark detector and the 3rd mark detector detect the telltale mark on wafer using the control method
Change and turn to and provide speed, make wafer with the First Speed quick rotation, when the first mark detector is detected by its position
Rotating speed can be just reduced during the telltale mark put and positioning is realized in constantly reversion, so as to improve the efficiency of positioning, and ensure that positioning
Precision.
In summary, wafer positioner of the invention replaces traditional sucker to draw mode using the rotation of drive wheel wafer,
It can avoid causing to occur inhaling trace equivalent damage on wafer in positioning, be advantageous to follow-up procedure for processing, improve the quality of production；Its
In wafer rotating mechanism servomotor revolving force is transformed on driving wheel using gear switching mechanism, accurately control driving wheel
Velocity of rotation and direction, it is simple in construction, and cost is relatively low；In addition, the wafer positioner of the present invention can use multiple drives
Driving wheel driving wafer rotation, and multiple mark detectors can be set, multiple spot detection positioning, multistage speed and course changing control can be realized,
So as to improve the operating efficiency of wafer positioning and the degree of accuracy.So the present invention effectively overcomes various shortcoming of the prior art
And has high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any to be familiar with this skill
The personage of art all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Therefore, such as
Those of ordinary skill in the art without departing from disclosed spirit with completed under technological thought all etc.
Modifications and changes are imitated, should be covered by the claim of the present invention.
Claims (16)
1. a kind of wafer positioner, it is characterised in that described device includes：Wafer rotating mechanism provided with pivot, mark inspection
Survey device and control module；
The wafer rotating mechanism includes and wafer contacts and the driving wheel that drives wafer to be rotated with the pivot；
Telltale mark on the mark detector detection wafer, and testing result is sent to the control module；
The control module controls the driving wheel to realize that wafer positions according to the testing result of the mark detector.
2. wafer positioner according to claim 1, it is characterised in that：The wafer rotating mechanism also include servomotor and
Gear switching mechanism；The servomotor drives the driving wheel to rotate by the gear switching mechanism；The control module
The driving wheel velocity of rotation and direction are controlled by controlling the servomotor to realize that wafer positions.
3. wafer positioner according to claim 2, it is characterised in that：The gear switching mechanism includes：It is fixed on described
First gear in servomotor rotating shaft and the second gear being fixed in the driving wheel rotating shaft；The first gear and institute
State second gear to be engaged and drive second gear to rotate, the rotatory force of the servomotor is transformed on the driving wheel.
4. wafer positioner according to claim 2, it is characterised in that：The servomotor and the gear switching mechanism position
In the pivot of the wafer rotating mechanism.
5. wafer positioner according to claim 1, it is characterised in that：The wafer rotating mechanism also includes edge stoppers,
The edge stoppers are located on the extended line that pivot extends to driving wheel.
6. wafer positioner according to claim 5, it is characterised in that：The mark detector is arranged on the edge stoppers
On.
7. the wafer positioner according to any one of claim 1-5, it is characterised in that：The mark detector quantity is three
It is individual, it is evenly distributed in using the pivot as on the circumference in the center of circle.
8. the wafer positioner according to any one of claim 1-5, it is characterised in that：The driving wheel quantity is three,
It is evenly distributed in using the pivot as on the circumference in the center of circle.
9. wafer positioner according to claim 8, it is characterised in that：The edge stoppers quantity is three, is located at respectively
On the extended line that pivot extends to three driving wheels.
10. wafer positioner according to claim 9, it is characterised in that：The mark detector quantity is three, point
It is not arranged on the edge stoppers of corresponding three driving wheels.
11. the wafer positioner according to any one of claim 1-5, it is characterised in that：The mark detector is light
Learn Sensitive Detector.
12. the wafer positioner according to any one of claim 1-5, it is characterised in that：The wafer positioner is also
Provided with mechanical arm, wafer is put into or taken out.
13. a kind of wafer positioning method, it is characterised in that methods described includes：
Wafer provided with telltale mark is positioned on above-mentioned wafer positioner, makes crystal circle center and the pivot pair
Together；
Rotated by the drive wheel wafer with the pivot；
When the mark detector detects the telltale mark on wafer, the driving wheel is controlled by the control module
Velocity of rotation and direction, with realize wafer position.
14. the control method of a kind of wafer positioner according to any one of claim 1-5, it is characterised in that described
Wafer positioner includes the first mark detector, the second mark detector and the 3rd mark detector, wherein second mark
Remember that detector and the 3rd mark detector are located at the left and right sides of first mark detector respectively；Methods described bag
Include：
When first mark detector detects the telltale mark on wafer for the first time, the control module control is all
Driving wheel reduces rotating speed and changes original rotation direction, detects the positioning mark on wafer again when first mark detector
Clock, the control module controls all driving wheels to stop operating to realize positioning；
When the second mark detector detects the telltale mark on wafer, the control module controls all driving wheels to make crystalline substance
Justify rotationally clockwise and rotating speed is reached First Speed；
When the 3rd mark detector detects the telltale mark on wafer, the control module controls all driving wheels to make crystalline substance
Circle rotates in an anti-clockwise direction and rotating speed is reached First Speed.
15. the control method of wafer positioner according to claim 14, it is characterised in that：The control module is set
There are initial velocity and initial steer, when wafer has just been put into the wafer positioner, the control module controls wafer with institute
State initial velocity and initial steer rotation.
16. the control method of wafer positioner according to claim 15, it is characterised in that：The first mark detection
Device, the second mark detector and the 3rd mark detector are evenly distributed in using the pivot as on the circumference in the center of circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610326082.8A CN107393855B (en) | 2016-05-17 | 2016-05-17 | Wafer positioning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610326082.8A CN107393855B (en) | 2016-05-17 | 2016-05-17 | Wafer positioning device and method |
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| Publication Number | Publication Date |
|---|---|
| CN107393855A true CN107393855A (en) | 2017-11-24 |
| CN107393855B CN107393855B (en) | 2020-10-09 |
Family
ID=60337705
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610326082.8A Active CN107393855B (en) | 2016-05-17 | 2016-05-17 | Wafer positioning device and method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109616433A (en) * | 2018-12-03 | 2019-04-12 | 上海华力微电子有限公司 | A kind of wafer rotational speed measuring device and monitoring method |
| CN110592560A (en) * | 2019-10-18 | 2019-12-20 | 北京北方华创微电子装备有限公司 | Process disc alignment method, process disc alignment device and semiconductor processing equipment |
| WO2020001521A1 (en) * | 2018-06-29 | 2020-01-02 | 上海微电子装备（集团）股份有限公司 | Manipulator, bonding cavity, wafer bonding system and bonding method |
| TWI799346B (en) * | 2021-10-21 | 2023-04-11 | 大陸商西安奕斯偉材料科技有限公司 | Wafer V-shaped notch center positioning method, system and computer storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259056A (en) * | 1992-03-10 | 1993-10-08 | Kawasaki Steel Corp | Semiconductor substrate spin coating device |
| JPH0735395Y2 (en) * | 1990-09-27 | 1995-08-09 | 株式会社エンヤシステム | Spin chuck |
| JP2004342820A (en) * | 2003-05-15 | 2004-12-02 | Shimada Phys & Chem Ind Co Ltd | Substrate processing equipment |
| CN101194354A (en) * | 2005-06-13 | 2008-06-04 | 株式会社安川电机 | Aligner |
-
2016
- 2016-05-17 CN CN201610326082.8A patent/CN107393855B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735395Y2 (en) * | 1990-09-27 | 1995-08-09 | 株式会社エンヤシステム | Spin chuck |
| JPH05259056A (en) * | 1992-03-10 | 1993-10-08 | Kawasaki Steel Corp | Semiconductor substrate spin coating device |
| JP2004342820A (en) * | 2003-05-15 | 2004-12-02 | Shimada Phys & Chem Ind Co Ltd | Substrate processing equipment |
| CN101194354A (en) * | 2005-06-13 | 2008-06-04 | 株式会社安川电机 | Aligner |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020001521A1 (en) * | 2018-06-29 | 2020-01-02 | 上海微电子装备（集团）股份有限公司 | Manipulator, bonding cavity, wafer bonding system and bonding method |
| CN109616433A (en) * | 2018-12-03 | 2019-04-12 | 上海华力微电子有限公司 | A kind of wafer rotational speed measuring device and monitoring method |
| CN110592560A (en) * | 2019-10-18 | 2019-12-20 | 北京北方华创微电子装备有限公司 | Process disc alignment method, process disc alignment device and semiconductor processing equipment |
| CN110592560B (en) * | 2019-10-18 | 2022-02-22 | 北京北方华创微电子装备有限公司 | Process disc alignment method, process disc alignment device and semiconductor processing equipment |
| TWI799346B (en) * | 2021-10-21 | 2023-04-11 | 大陸商西安奕斯偉材料科技有限公司 | Wafer V-shaped notch center positioning method, system and computer storage medium |
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|---|---|
| CN107393855B (en) | 2020-10-09 |
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