CN110592560A - Process disc alignment method, process disc alignment device and semiconductor processing equipment - Google Patents
Process disc alignment method, process disc alignment device and semiconductor processing equipment Download PDFInfo
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- CN110592560A CN110592560A CN201910994363.4A CN201910994363A CN110592560A CN 110592560 A CN110592560 A CN 110592560A CN 201910994363 A CN201910994363 A CN 201910994363A CN 110592560 A CN110592560 A CN 110592560A
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- disc
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- positioning structure
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Abstract
The invention provides a process disc alignment method, which comprises the following steps: s1, controlling the process disc to rotate at a first preset rotating speed; s2, when the positioning structure on the process disc is detected, controlling the process disc to decelerate until the process disc stops, and controlling the process disc to rotate in the direction opposite to the last rotation direction again, wherein the rotation speed is less than the last rotation speed; s3, executing step S2 in a circulating way; and S4, controlling the technological disc to stop immediately when the rotation speed of the technological disc is reduced to be less than or equal to a second preset rotation speed and the positioning structure is detected again. In the invention, the process disc performs reciprocating rotation movement with gradually reduced speed, so that the rotation speed of the process disc is low enough when the process disc stops, the angle of continuous rotation of the process disc due to inertia when the process disc stops suddenly can be reduced, the alignment precision of the process disc is improved, the abrasion between the process disc and the motion connecting piece can be reduced, and the alignment precision is prevented from being reduced. The invention also provides a process disc alignment device and semiconductor processing equipment.
Description
Technical Field
The invention relates to the technical field of microelectronic processing, in particular to a process disc alignment method, a process disc alignment device for realizing the method and semiconductor processing equipment comprising the process disc alignment device.
Background
An apparatus for performing a Chemical Vapor Deposition (CVD) process, such as an APCVD (atomic-chemical-vapor deposition) apparatus, generally includes a reaction chamber and a process disk disposed in the reaction chamber for carrying a substrate to be processed, the process disk being capable of being rotated about a rotation center of the process disk by a rotating motor so as to place a plurality of substrates on the process disk at different placement positions one by one.
At present, before placing a substrate, usually the placing position of the substrate needs to be aligned, and this alignment process is usually completed by matching a sensing device arranged above the process disk with a positioning structure (such as a protrusion, a notch or a pattern with a special color) arranged on the process disk, specifically including: and controlling the rotating motor to drive the process disc to start rotating along a certain direction, and judging that the positioning structure is aligned when the sensing device detects that the positioning structure passes through the detection position of the positioning structure, and immediately controlling the rotating motor to stop suddenly.
However, the alignment method for the placement position of the substrate generally has a phenomenon that the alignment accuracy gradually decreases during the application process, so that the substrate cannot be accurately placed at the placement position.
Disclosure of Invention
The invention aims to provide a process disc alignment method, a process disc alignment device and semiconductor processing equipment, which can improve alignment precision and alignment efficiency of a process disc.
As a first aspect of the present invention, there is provided a process disk alignment method including:
s1, controlling the process disc to rotate along a first direction at a first preset rotating speed;
s2, when the positioning structure on the process disc is detected, controlling the process disc to decelerate until the process disc stops rotating, and controlling the process disc to rotate in the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed;
s3, executing step S2 in a circulating way;
and S4, controlling the process disk to stop immediately when the rotating speed of the process disk is reduced to be less than or equal to a second preset rotating speed and the positioning structure is detected again.
Preferably, the controlling the process disk to stop immediately comprises:
and controlling the technological disc to decelerate at the maximum braking angular acceleration until the technological disc stops.
Preferably, step S2 further includes:
and when the process disc rotates by more than a first preset angle and the positioning structure is not detected, controlling the process disc to decelerate until the process disc stops rotating, and controlling the process disc to rotate along the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed.
Preferably, the first preset angle is 360 °.
Preferably, before step S1, the method further includes:
and S0, controlling the process disk to rotate for a second preset angle along a second direction opposite to the first direction when the process disk does not start to rotate and the positioning structure can be detected.
As a second aspect of the present invention, there is provided a process disk alignment apparatus comprising: a controller, a sensor, a driver, wherein,
the driver is used for driving the process disk to rotate and stopping the process disk from rotating;
the sensor is used for detecting a positioning structure on the process disc;
the controller is connected with the driver and the sensor and is used for controlling the driver to drive the process disc to rotate along a first direction at a first preset rotating speed;
the controller is further used for controlling the driver to decelerate the process disk until the process disk stops rotating when the sensor detects the positioning structure on the process disk in a circulating way, and controlling the driver to drive the process disk to rotate in the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed;
the controller is also used for controlling the driver to stop the process disk immediately when the rotating speed of the process disk is reduced to be less than or equal to a second preset rotating speed and the sensor detects the positioning structure again.
Preferably, the controller is further configured to control the driver to decelerate the process disk until stopped at a maximum braking angular acceleration when the rotational speed of the process disk decreases to less than or equal to a second predetermined rotational speed and the sensor again detects the positioning structure.
Preferably, the controller is further configured to cyclically control the driver to decelerate the process disk until the process disk stops rotating when the process disk rotates more than a predetermined angle and the sensor has not detected the positioning structure, and to control the driver to drive the process disk to rotate in a direction opposite to a previous rotating direction again, and the rotating speed is less than the previous rotating speed.
Preferably, the controller is further configured to control the driver to drive the process disk to rotate in a second direction opposite to the first direction by a second preset angle when the positioning structure is detectable without the process disk starting to rotate the sensor.
As a third aspect of the present invention, there is provided a semiconductor processing apparatus, comprising a process chamber and a process disk disposed in the process chamber, wherein the process disk is capable of rotating and is provided with a positioning structure, and the semiconductor processing apparatus further comprises the process disk alignment device.
In the alignment method of the process disk provided by the invention, the process disk performs reciprocating rotation motion around the process disk, and each rotation speed is lower than the last rotation speed, so that the stop position of the positioning structure gradually approaches to the preset position when the process disk decelerates to stop rotating each time. And the rotating speed of the craft disc is low enough when the craft disc is stopped for the last time, so that the forward rotating angle of the craft disc when the craft disc is stopped suddenly can be reduced, and the alignment precision of the craft disc is improved. And the rotating speed of the process disc when the process disc is stopped for the last time is far less than the first preset rotating speed when the process disc starts to rotate, and the inertia of the process disc is small, so that the abrasion between the process disc and the moving connecting piece can be reduced, and the alignment precision is prevented from being reduced. In addition, the initial rotation process of the first preset rotation speed is only used for initially finding the position of the positioning structure and does not affect the final positioning precision, so that the first preset rotation speed can be higher than the rotation speed in the existing constant speed alignment method, and the alignment efficiency of the process disc is improved.
The alignment device of the process disc and the semiconductor processing equipment provided by the invention can be used for realizing the alignment method of the process disc, so that the technical effects of improving the alignment precision of the process disc, avoiding the reduction of the alignment precision of the process disc and improving the alignment efficiency of the process disc can be realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic flow chart of a process disk alignment method provided by an embodiment of the invention;
FIG. 2 is a schematic diagram of one embodiment of a process disk alignment method provided by an embodiment of the present invention;
FIG. 3 is a schematic diagram of another embodiment of a process disk alignment method provided by an embodiment of the invention;
FIG. 4 is a schematic diagram of another embodiment of a process disk alignment method provided by an embodiment of the invention;
FIG. 5 is a schematic diagram of one configuration of semiconductor processing equipment provided by an embodiment of the present invention;
FIG. 6 is a schematic diagram of another configuration of semiconductor processing equipment provided in an embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating one embodiment of indexing a process disk in a semiconductor processing apparatus in accordance with an embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating the positional relationship between the alignment apparatus for process disk provided in the embodiment of the present invention and other structures of the semiconductor processing apparatus provided in the embodiment of the present invention;
FIG. 9 is a schematic illustration of another pose of a semiconductor processing apparatus according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of the alignment method of the process disk according to the embodiment of the present invention compared with the conventional alignment effect;
fig. 11 is a schematic diagram of the alignment method of the process disk according to the embodiment of the present invention and the conventional alignment effect of the process disk at different initial angles.
Description of the reference numerals
20: an art plate 21: positioning structure
30: the sensor 40: cylinder
50: the process chamber 51: art window
60: the driver 10: controller
22: substrate slot
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The embodiment of the invention provides a process disc alignment method, as shown in fig. 1, the method comprises the following steps:
and step S1, controlling the process disc to rotate along the first direction at a first preset rotating speed.
And step S2, when the positioning structure on the process disk is detected, controlling the process disk to decelerate until the process disk stops rotating, and controlling the process disk to rotate in the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed.
Step S3, executing step S2 in a loop;
and step S4, when the rotating speed of the process disk is reduced to be less than or equal to a second preset rotating speed and the positioning structure is detected again, controlling the process disk to stop immediately.
After research, the inventor of the present invention found that in the alignment step of the existing process disk, the process disk is only controlled to rotate in one direction at a rotation speed, which is usually not very low (usually 0.6rpm) in order to ensure the alignment efficiency, so that when the positioning structure reaches the predetermined position and is suddenly stopped, the process disk continues to rotate forward at a certain angle during the sudden stop, which affects the alignment accuracy of the process disk. In addition, the inertia of the process disc is large at a high rotating speed, and the process disc and the moving connecting piece are easily abraded due to sudden stop action, so that the alignment precision of the process disc is gradually reduced.
Therefore, the inventors of the present invention have designed the process disk to perform reciprocating rotational motion around the process disk, and each rotational speed is lower than the previous rotational speed, so that the stop position of the positioning structure gradually approaches the predetermined position (i.e., the position of the detection positioning structure) each time the process disk is decelerated to stop rotation. Since the rotation speed of the process disk at the last stop is sufficiently low (equal to or less than the second preset rotation speed), the angle of forward rotation of the process disk at the time of a sudden stop (i.e., at the time of immediate stop of the process disk in step S4) can be reduced, thereby improving the alignment accuracy of the process disk. And the rotating speed (less than or equal to the second preset rotating speed) of the process disc when the process disc is stopped for the last time is far less than the first preset rotating speed when the process disc starts to rotate, and the inertia of the process disc is small, so that the abrasion between the process disc and the moving connecting piece can be reduced, and the alignment precision is prevented from being reduced.
In addition, the initial rotation process of the first preset rotation speed is only used for initially finding the position of the positioning structure, and the final positioning accuracy is not affected, so that the first preset rotation speed can be higher than the rotation speed (for example, not lower than 3rpm) in the existing constant speed alignment method, and the alignment efficiency of the process disk is improved.
It should be noted that, in the present invention, in order to reduce the wear between the process disk and the kinematic coupling, in step S2 which is executed cyclically, the angular acceleration of the process disk until the process disk is decelerated until it stops rotating is smaller than the angular acceleration of the prior art process disk when it is suddenly stopped.
To further improve the alignment accuracy of the process disk, preferably, as shown in fig. 2, the step S4 may include: and when the rotating speed of the process disc is reduced to be less than or equal to a second preset rotating speed and the positioning structure is detected again, controlling the process disc to decelerate at the maximum braking angular acceleration until the process disc stops.
The maximum braking angular acceleration is an angular acceleration at which the process disk is suddenly stopped, and the angular acceleration is larger than an angular acceleration at which the process disk is decelerated any time until the rotation of the process disk is stopped before step S4.
Because the rotating speed (less than or equal to the second preset rotating speed) of the process disc when the process disc is stopped for the last time is far less than the first preset rotating speed when the process disc starts to rotate, and the inertia of the process disc is small, the process disc is designed to be braked in an emergency stop mode for the last time, and the alignment precision of the process disc is further improved on the premise that abrasion between the process disc and the moving connecting piece is not caused.
In order to improve the alignment efficiency of the process disk, as shown in fig. 3, the step S2 may further include:
and when the process disc rotates beyond the first preset angle and the positioning structure is not detected, controlling the process disc to decelerate until the process disc stops rotating, and controlling the process disc to rotate in the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed.
In the invention, when the passing angle of the process disc is larger than the preset angle and the arrival of the positioning structure is not detected, the process disc is directly controlled to decelerate and stop rotating, and the next reverse rotation process with lower rotation speed is started, so that excessive idle circles of the process disc caused by the fact that the positioning structure cannot be detected when the rotation speed of the process disc is too high are avoided, and the alignment efficiency of the process disc is improved.
The magnitude of the first preset angle is not particularly limited, and for example, the first preset angle may be 540 ° in order to improve the accuracy of the determination of the "idling state". To improve the alignment efficiency of the process disk, the first preset angle may be preferably 360 °.
The probability that the positioning structure is not detected when the process disk is rotated at a low rotation speed is small, and therefore, the step S2 may alternatively include: and when the rotating speed of the process disc is not lower than the third preset rotating speed, the process disc rotates by more than the first preset angle and the positioning structure is not detected, the process disc is controlled to decelerate until the process disc stops rotating, the process disc is controlled to rotate in the direction opposite to the last rotating direction again, and the rotating speed is less than the last rotating speed. The third preset rotating speed is less than the first preset rotating speed, and the third preset rotating speed is greater than the second preset rotating speed.
The inventors of the present invention have also found that the positioning structure of the process disk may already be present at a predetermined position at the beginning of the alignment of the process disk. However, in the alignment method of the process disk according to the present invention, in order to improve the alignment efficiency, the rotation speed of the first several rotation processes of the process disk is preferably a higher rotation speed, and an excessively high rotation speed easily causes the positioning structure to pass through a predetermined position between adjacent sensing pulses of the sensing device, compared to the conventional alignment mode, and thus the positioning structure according to the present invention preferably has a certain width. However, the width of the positioning structure may affect the positioning structure, and the detection of the positioning structure in the solution of the present invention is actually "the edge of the positioning structure is detected", so that the alignment accuracy of the process disk cannot be guaranteed only by an accidental phenomenon that the positioning structure is initially, i.e. at a predetermined position.
In order to solve the above problem and further improve the alignment accuracy of the process disk, preferably, as shown in fig. 4, the process disk alignment method may further include, before step S1:
and step S0, controlling the process disk to rotate a second preset angle along a second direction opposite to the first direction when the process disk does not start to rotate and the positioning structure can be detected.
In the invention, when the alignment structure is designed to be at the initial position, namely at the preset position, the process disc rotates by a second preset angle along the second direction, so that the process disc restarts alignment according to the condition that the alignment structure is not at the preset position, thereby ensuring the alignment precision of the process disc.
In the present invention, one of the first direction and the second direction is clockwise, and the other is counterclockwise.
The number of times of the loop execution of the step S2 is not particularly limited, and for example, to ensure the alignment accuracy of the process disk, the number of times of the loop execution of the step S2 is preferably not less than three times.
In order to avoid the abrasion between the process disk and the moving connecting piece to cause the reduction of the alignment precision of the process disk, preferably, the process of controlling the rotation of the process disk each time comprises the following steps:
controlling the process disc to accelerate to rotate to a preset rotation speed;
controlling the process disc to rotate at a constant speed at a preset rotating speed.
In order to further reduce the abrasion between the process disk and the motion connecting piece caused by the overlarge angular acceleration, the angular acceleration of the process disk is preferably not larger than the angular acceleration when the process disk is decelerated and stops rotating in the acceleration process of controlling the process disk to start rotating.
To facilitate understanding of those skilled in the art, a specific embodiment of the alignment method for a process disk provided by the present invention is given below:
as shown in fig. 5 and 6, in the semiconductor processing apparatus, the positioning structure 21 on the process disk 20 is a notch provided at the edge of the process disk, and the notch is detected by the sensor 30. The alignment method of the craft disc comprises the following steps:
the process disk was controlled to rotate in a counterclockwise direction (first direction) at a rotational speed of 3rpm (first preset rotational speed).
(at this time, the rotating speed of the process disc is greater than the third preset rotating speed by 1.8rpm), if the positioning structure is not detected after 30s (namely, when the rotating angle is greater than the preset angle of 540 ℃), controlling the process disc to decelerate until the process disc stops rotating, and controlling the process disc to rotate clockwise again, wherein the rotating speed is 1.5 rpm;
and if the positioning structure on the process disk is detected, controlling the process disk to decelerate until the process disk stops rotating, and controlling the process disk to rotate clockwise again, wherein the rotating speed is 1.5 rpm.
(at this time, the rotating speed of the process disk is already less than the third preset rotating speed of 1.8 rpm). when the positioning structure on the process disk is detected, the process disk is controlled to decelerate until the process disk stops rotating, and the process disk is controlled to rotate in the counterclockwise direction again, and the rotating speed is 0.6 rpm.
And when the positioning structure on the process disk is detected, controlling the process disk to decelerate until the process disk stops rotating, and controlling the process disk to rotate clockwise again, wherein the rotating speed is 0.1rpm (second preset rotating speed).
(at this time, the rotating speed of the craft disc is already less than the second preset rotating speed of 0.1rpm) when the positioning structure is detected, the craft disc is controlled to stop immediately.
Under equivalent conditions, the alignment step of a conventional process disk usually includes:
rotating the process disk in a clockwise direction at a speed of 0.6 rpm;
and when the positioning structure is detected, controlling the process disc to stop suddenly.
Fig. 10 is a schematic diagram showing the time-dependent change in the rotational speed of the process disk under the control of the two methods when the angle between the initial position of the positioning structure and the position of the sensor 30 is 180 deg.. As can be seen from the attached drawings, the alignment method of the process disk provided by the invention only takes 30s to complete the alignment of the process disk, and the efficiency is far higher than the conventional alignment efficiency of 53 s.
To facilitate a more intuitive understanding of the advantages of the present invention, the efficiency of the methods provided herein differs from conventional techniques. As shown in fig. 7, the angle of the process disk 20 is divided by the number of detection pulses (20000 pulses) emitted by the sensor 30 during one rotation of the process disk 20. As shown in fig. 11, which is a schematic diagram of a relationship between an initial angle between a positioning structure on a process disk and a sensor 30 and time spent in an alignment process, it is apparent from data in the diagram that the alignment method of the process disk provided by the present invention can realize positioning within 18 to 39 seconds, whereas the conventional constant speed alignment method requires 0 to 100 seconds, and the time required for the alignment process in the alignment method of the process disk provided by the present invention is mostly lower than the time spent in the conventional alignment, and the alignment efficiency is significantly higher than the efficiency of the conventional alignment method.
An embodiment of the present invention further provides a process disk alignment apparatus, as shown in fig. 8 and 9, the process disk alignment apparatus includes a controller 10, a sensor 30, and a driver 60, wherein:
the driver 60 is used for driving the process disk 20 to rotate and also used for stopping the process disk 20 from rotating;
the sensor 30 is used for detecting the positioning structure on the process disk 20;
the controller 10 is connected to the driver 60 and the sensor 30, and is used for controlling the driver 60 to drive the process disk 20 to rotate in the first direction at a first preset rotation speed.
The controller 10 is further configured to cyclically control the driver 60 to decelerate the process disk 20 until the rotation is stopped when the sensor 30 detects the positioning structure on the process disk 20, and to control the driver 60 to drive the process disk 20 to rotate in a direction opposite to the previous rotation direction at a rotation speed less than the previous rotation speed.
The controller 10 is further configured to control the driver 60 to stop the process disk 20 immediately when the rotation speed of the process disk 20 is reduced to be equal to or less than the second preset rotation speed and the sensor 30 detects the positioning structure again.
Fig. 8 and 9 are schematic diagrams illustrating a positional relationship between the sensor 30 and the driver 60 of the process tray alignment apparatus and the process tray 20, and the above embodiments of the present invention have described in detail the beneficial effects of the process tray alignment method for semiconductor processing equipment, and are not repeated herein.
To further improve the alignment accuracy of the process disk, the controller 10 is preferably further configured to control the driver 60 to decelerate the process disk 20 to a stop at the maximum braking angular acceleration when the rotation speed of the process disk 20 decreases to less than or equal to the second predetermined rotation speed and the sensor 30 detects the positioning structure again.
To improve the alignment efficiency of the process disk, preferably, the controller 10 is further configured to cyclically control the driver 60 to decelerate the process disk 20 until the rotation is stopped when the process disk 20 rotates more than a predetermined angle and the sensor 30 has not detected the positioning structure, and to control the driver 60 to drive the process disk 20 to rotate in a direction opposite to the previous rotation direction again, and the rotation speed is less than the previous rotation speed.
To further improve the alignment accuracy of the process disk, the controller 10 is preferably further configured to control the driver 60 to drive the process disk 20 to rotate in a second direction opposite to the first direction by a second preset angle when the process disk 20 does not start rotating the sensor 30 to detect the positioning structure.
As a third aspect of the present invention, there is also provided a semiconductor processing apparatus, as shown in fig. 6, 8 and 9, the semiconductor processing apparatus includes a process chamber 50 and a process disk 20 disposed in the process chamber 50, the process disk 20 is capable of rotating, and a positioning structure 21 is disposed on the process disk 20, and the semiconductor processing apparatus further includes the process disk alignment device.
The invention is not limited to how the driver 60 of the process disk alignment device drives the process disk 20 to rotate, decelerate, accelerate, etc., for example, as shown in fig. 8 and 9, the driver 60 may include a rotating motor, and an output shaft of the rotating motor is connected to the rotation center of the process disk 20. The material of the process disk 20 is not particularly limited in the present invention, and the process disk 20 may be a graphite disk, for example. As shown in fig. 5 and 6, the process tray 20 further has a substrate slot 22 for placing a substrate thereon. The semiconductor processing apparatus may further include a robot for holding the substrates one by one after the alignment of the process disk and placing the substrates in the substrate slots 22.
The present invention is not limited to the specific structure of the positioning structure 21, as long as the positioning structure 21 can be sensed by the sensor 30, for example, the positioning structure 21 may be a protrusion, a recess, a through hole, an edge notch, or a line with a special color on the process disk 20.
As shown in fig. 6, 8 and 9, when the positioning structure 21 is a notch at the edge of the process disk 20 or a through hole penetrating through the process disk 20 in the thickness direction, the sensor 30 may be a distance measuring sensor for detecting a certain position (i.e., a predetermined position) through which the notch passes, and when the positioning structure 21 does not reach the predetermined position, the distance measuring sensor detects the distance h1 from the positioning structure to the process disk 20, and when the positioning structure 21 reaches the predetermined position, the detection pulse of the distance measuring sensor directly passes through the notch or the through hole, and the detection result becomes the distance h2 from the distance measuring sensor to the wall of the process chamber 50, thereby realizing the position observation of the positioning structure 21.
To improve the signal quality of the probing pulses, preferably, as shown in FIG. 5, a process window 51 may be included on the top wall of the process chamber 50, and the sensing device views the positioning structure 21 on the process disk 20 through the process window 51.
In order to improve the process effect of the microelectronic process, preferably, as shown in fig. 5 and 6, the semiconductor processing apparatus further includes a cylinder 40, one end of the cylinder 40 is connected to the sensor 30 (e.g., a distance measuring sensor), and the other end of the cylinder 40 is fixedly connected to the process chamber 50, and is configured to extend when the process disk 20 is aligned, so as to send the sensing device above the process window, and to shorten after the process disk 20 is aligned, so as to drive the sensor 30 away from the process window, so as to prevent the electronic devices in the sensor 30 from affecting the electromagnetic field distribution in the process chamber 50.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A process disk alignment method is characterized by comprising the following steps:
s1, controlling the process disc to rotate along a first direction at a first preset rotating speed;
s2, when the positioning structure on the process disc is detected, controlling the process disc to decelerate until the process disc stops rotating, and controlling the process disc to rotate in the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed;
s3, executing step S2 in a circulating way;
and S4, controlling the process disk to stop immediately when the rotating speed of the process disk is reduced to be less than or equal to a second preset rotating speed and the positioning structure is detected again.
2. The method of claim 1, wherein said controlling said process disk to stop immediately comprises:
and controlling the technological disc to decelerate at the maximum braking angular acceleration until the technological disc stops.
3. The method according to claim 1, wherein step S2 further comprises:
and when the process disc rotates by more than a first preset angle and the positioning structure is not detected, controlling the process disc to decelerate until the process disc stops rotating, and controlling the process disc to rotate along the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed.
4. A method according to claim 3, wherein the first predetermined angle is 360 °.
5. The method according to any one of claims 1 to 4, further comprising, before step S1:
and S0, controlling the process disk to rotate for a second preset angle along a second direction opposite to the first direction when the process disk does not start to rotate and the positioning structure can be detected.
6. An art plate aligning device, comprising: a controller, a sensor, a driver, wherein,
the driver is used for driving the process disk to rotate and stopping the process disk from rotating;
the sensor is used for detecting a positioning structure on the process disc;
the controller is connected with the driver and the sensor and is used for controlling the driver to drive the process disc to rotate along a first direction at a first preset rotating speed;
the controller is further used for controlling the driver to decelerate the process disk until the process disk stops rotating when the sensor detects the positioning structure on the process disk in a circulating way, and controlling the driver to drive the process disk to rotate in the direction opposite to the last rotating direction again, wherein the rotating speed is less than the last rotating speed;
the controller is also used for controlling the driver to stop the process disk immediately when the rotating speed of the process disk is reduced to be less than or equal to a second preset rotating speed and the sensor detects the positioning structure again.
7. The apparatus of claim 6 wherein the controller is further configured to control the drive to decelerate the process disk to a stop at a maximum braking angular acceleration when the rotational speed of the process disk falls to or below a second predetermined rotational speed and the sensor again detects the locating feature.
8. The apparatus of claim 6 wherein the controller is further configured to cyclically control the drive to decelerate the process disk until rotation is stopped when the process disk rotates more than a predetermined angle and the sensor has not detected the locating feature, and to again control the drive to rotate the process disk in a direction opposite to the previous rotation at a rotational speed less than the previous rotational speed.
9. The apparatus of any one of claims 6 to 8, wherein the controller is further configured to control the driver to drive the process disk to rotate in a second direction opposite to the first direction by a second predetermined angle when the positioning structure is detectable without the process disk rotating the sensor.
10. A semiconductor processing apparatus comprising a process chamber and a process disk arranged in the process chamber, the process disk being rotatable and provided with a positioning structure, characterized by further comprising a process disk alignment apparatus as claimed in any one of claims 6 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910994363.4A CN110592560B (en) | 2019-10-18 | 2019-10-18 | Process disc alignment method, process disc alignment device and semiconductor processing equipment |
| TW108148461A TWI715393B (en) | 2019-10-18 | 2019-12-30 | Tray positioning method, tray positioning device and associated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910994363.4A CN110592560B (en) | 2019-10-18 | 2019-10-18 | Process disc alignment method, process disc alignment device and semiconductor processing equipment |
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| Publication Number | Publication Date |
|---|---|
| CN110592560A true CN110592560A (en) | 2019-12-20 |
| CN110592560B CN110592560B (en) | 2022-02-22 |
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Also Published As
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| TWI715393B (en) | 2021-01-01 |
| CN110592560B (en) | 2022-02-22 |
| TW202117907A (en) | 2021-05-01 |
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