TWI715393B - Tray positioning method, tray positioning device and associated - Google Patents

Tray positioning method, tray positioning device and associated Download PDF

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Publication number
TWI715393B
TWI715393B TW108148461A TW108148461A TWI715393B TW I715393 B TWI715393 B TW I715393B TW 108148461 A TW108148461 A TW 108148461A TW 108148461 A TW108148461 A TW 108148461A TW I715393 B TWI715393 B TW I715393B
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tray
rotation speed
positioning
positioning structure
rotate
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TW108148461A
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TW202117907A (en
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馮旭初
高建強
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北京北方華創微電子裝備有限公司
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process

Abstract

The present invention provides a tray positioning method, including: S1, controlling a tray to rotate with a first preset rotation speed; S2, controlling the tray to slow down until it stops when a positioning structure of the tray is detected, and controlling the tray to rotate along an opposite direction of the last rotation direction with a slower speed. S3, repeating S2; S4, controlling the tray to stop immediately when the speed of the tray is down to or below a second preset rotation speed and the positioning structure is detected again. In the present invention, the tray rotates back and forth with a speed gradually reduces, so that the speed is low enough when the tray stops. The angle caused by the inertia when the tray stops immediately is reduced, the accuracy of positioning the tray can be increased, and the wear between the tray and the motion connecting part is decreased.

Description

托盤定位方法、托盤定位裝置和相關半導體加工設備Tray positioning method, tray positioning device and related semiconductor processing equipment

本發明涉及微電子加工技術領域,具體地,涉及一種托盤定位方法,一種用於實現該方法的托盤定位裝置,以及一種包括該托盤定位裝置的半導體加工設備。The present invention relates to the technical field of microelectronic processing, in particular, to a tray positioning method, a tray positioning device for implementing the method, and a semiconductor processing equipment including the tray positioning device.

用於進行化學氣相沉積(CVD,chemical vapor deposition)製程的設備,如常壓化學氣相沉積(APCVD,atmospheric-pressure chemical vapor deposition)設備等通常包括反應腔和設置在反應腔中的用於承載待加工晶圓的托盤,該托盤能夠在旋轉電機的驅動下圍繞托盤所述托盤的旋轉中心轉動,以便於將多個晶圓逐個放置在托盤上的不同放置位置。Equipment used for chemical vapor deposition (CVD, chemical vapor deposition) processes, such as atmospheric-pressure chemical vapor deposition (APCVD, atmospheric-pressure chemical vapor deposition) equipment, etc. usually include a reaction chamber and a device set in the reaction chamber A tray carrying wafers to be processed can be rotated around the center of rotation of the tray under the drive of a rotating motor, so that multiple wafers can be placed one by one in different placement positions on the tray.

目前,在放置晶圓前通常需要先對晶圓的放置位置進行定位,該定位過程通常由設置在托盤上方的感應裝置與托盤上設置的定位結構(如凸起、缺口或特殊顔色的圖形等)配合完成,具體包括:控制旋轉電機驅動托盤沿某一方向開始旋轉,當感應裝置檢測到上述定位結構經過其檢測位置時,即可判斷已定位放置位置,隨即控制旋轉電機急停。At present, it is usually necessary to locate the wafer placement position before placing the wafer. The positioning process usually involves the sensing device set above the tray and the positioning structure set on the tray (such as protrusions, notches, or special color graphics, etc. ) The completion of the cooperation includes: controlling the rotating motor to drive the tray to start rotating in a certain direction. When the induction device detects that the positioning structure has passed its detection position, it can determine the positioning and placing position, and then control the rotating motor to stop emergency.

然而,該晶圓放置位置定位方法在應用過程中通常會出現定位精度逐漸下降的現象,使得晶圓無法精確地被放入所述放置位置。However, in the application process of the wafer placement position positioning method, the positioning accuracy usually decreases gradually, so that the wafer cannot be accurately placed in the placement position.

本發明旨在提供一種托盤定位方法,該方法能夠提高托盤的定位精度和定位效率。The invention aims to provide a tray positioning method, which can improve the positioning accuracy and positioning efficiency of the tray.

作為本發明的第一個實施例,提供一種托盤定位方法,包括:S1,控制該托盤以一第一預設轉速沿一第一方向旋轉;S2,在檢測到該托盤上的一定位結構時,控制該托盤減速,直至停止旋轉,並再次控制該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度;S3,循環執行步驟S2;S4,在該托盤的旋轉速度下降到小於或等於一第二預設轉速且再次檢測到該定位結構時,控制該托盤立即停止。As a first embodiment of the present invention, a method for positioning a tray is provided, including: S1, controlling the tray to rotate in a first direction at a first preset speed; S2, when a positioning structure on the tray is detected , Control the pallet to decelerate until it stops rotating, and again control the pallet to rotate in the direction opposite to the previous rotation, and the rotation speed is less than the previous rotation speed; S3, cycle execution of step S2; S4, the rotation of the pallet When the speed drops to less than or equal to a second preset speed and the positioning structure is detected again, the tray is controlled to stop immediately.

優選地,控制該托盤立即停止包括:控制該托盤以一最大制動角加速度進行減速直至停止。Preferably, controlling the tray to stop immediately includes: controlling the tray to decelerate at a maximum braking angular acceleration until it stops.

優選地,步驟S2還包括:在該托盤旋轉超過一第一預設角度且還未檢測到該定位結構時,控制該托盤減速,直至停止旋轉,並再次控制該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。Preferably, step S2 further includes: when the tray rotates beyond a first preset angle and the positioning structure has not been detected, controlling the tray to decelerate until it stops rotating, and again controlling the tray to move in the direction opposite to the previous rotation The direction of rotation, and the rotation speed is less than the previous rotation speed.

優選地,該第一預設角度為360°。Preferably, the first preset angle is 360°.

優選地,在步驟S1之前,還包括:S0,在該托盤未開始旋轉即可檢測到該定位結構時,控制該托盤沿與該第一方向相反的一第二方向旋轉一第二預設角度。Preferably, before step S1, the method further includes: S0, when the positioning structure is detected before the tray starts to rotate, controlling the tray to rotate in a second direction opposite to the first direction by a second preset angle .

作為本發明的第二個實施例,提供一種托盤定位裝置,包括:一控制器、一感測器、一驅動器,其中,該驅動器用於驅動該托盤旋轉,還用於使該托盤停止旋轉;該感測器用於檢測該托盤上的一定位結構;該控制器與該驅動器、該感測器連接,該控制器用於控制該驅動器驅動該托盤以一第一預設轉速沿一第一方向旋轉;該控制器還用於循環地在該感測器檢測到該托盤上的該定位結構時,控制該驅動器使該托盤減速,直至停止旋轉,並再次控制該驅動器驅動該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度;該控制器還用於在該托盤的旋轉速度下降到小於或等於一第二預設轉速且該感測器再次檢測到該定位結構時,控制該驅動器使該托盤立即停止。As a second embodiment of the present invention, a tray positioning device is provided, including: a controller, a sensor, and a driver, wherein the driver is used to drive the tray to rotate and is also used to stop the tray from rotating; The sensor is used to detect a positioning structure on the tray; the controller is connected to the driver and the sensor, and the controller is used to control the driver to drive the tray to rotate in a first direction at a first preset speed The controller is also used to cyclically when the sensor detects the positioning structure on the tray, control the driver to decelerate the tray until it stops rotating, and again control the driver to drive the tray along with the previous rotation Rotate in the opposite direction, and the rotation speed is less than the previous rotation speed; the controller is also used for when the rotation speed of the tray drops to less than or equal to a second preset speed and the sensor detects the positioning structure again When, control the drive to stop the tray immediately.

優選地,該控制器還用於在該托盤的旋轉速度下降到小於或等於該第二預設轉速且該感測器再次檢測到該定位結構時,控制該驅動器使該托盤以一最大制動角加速度進行減速直至停止。Preferably, the controller is further configured to control the driver to make the tray at a maximum braking angle when the rotation speed of the tray drops to less than or equal to the second preset speed and the sensor detects the positioning structure again The acceleration decelerates until it stops.

優選地,該控制器還用於循環地在該托盤旋轉超過一預定角度且該感測器還未檢測到該定位結構時,控制該驅動器使該托盤減速,直至停止旋轉,並再次控制該驅動器驅動該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。Preferably, the controller is also used to control the driver to decelerate the tray until it stops rotating when the tray rotates more than a predetermined angle and the sensor has not detected the positioning structure, and control the driver again Drive the tray to rotate in the direction opposite to the previous rotation, and the rotation speed is lower than the previous rotation speed.

優選地,該控制器還用於在該托盤未開始旋轉該感測器即可檢測到該定位結構時,控制該驅動器驅動該托盤沿與該第一方向相反的一第二方向旋轉一第二預設角度。Preferably, the controller is further configured to control the driver to drive the tray to rotate in a second direction opposite to the first direction when the positioning structure can be detected by the sensor before the tray starts to rotate. Preset angle.

作為本發明的第三個實施例,提供一種半導體加工設備,包括一製程腔室和設置在該製程腔室內的一托盤,該托盤能夠旋轉,且該托盤上設置有一定位結構,該半導體加工設備還包括前面所述的托盤定位裝置。As a third embodiment of the present invention, a semiconductor processing equipment is provided, which includes a processing chamber and a tray arranged in the processing chamber. The tray can rotate and a positioning structure is provided on the tray. The semiconductor processing equipment It also includes the aforementioned tray positioning device.

在本發明提供的托盤定位方法中,托盤進行反覆旋轉運動,且每一次旋轉速度均低於上一次的旋轉速度,以使得托盤每次減速至停止旋轉時該定位結構的停止位置逐漸接近該預定位置。且在最後一次停止時托盤的旋轉速度足夠低,因此能夠減小托盤在急停時向前旋轉的角度,從而提高托盤的定位精度。並且,托盤在最後一次停止時的旋轉速度遠小於開始旋轉時的第一預設轉速,托盤的慣性小,從而能夠減小托盤與運動連接件之間産生磨損,避免定位精度下降。此外,由於初始時的第一預設轉速的旋轉過程僅用於初步找到定位結構位置,並不會影響最終的定位精度,因此第一預設轉速可以高於現有的定速定位方法中的旋轉速度,從而提高托盤的定位效率。In the tray positioning method provided by the present invention, the tray rotates repeatedly, and each rotation speed is lower than the previous rotation speed, so that each time the tray decelerates to stop rotation, the stop position of the positioning structure gradually approaches the predetermined position. In addition, the rotation speed of the tray at the last stop is sufficiently low, so the angle at which the tray rotates forward during an emergency stop can be reduced, thereby improving the positioning accuracy of the tray. In addition, the rotation speed of the tray at the last stop is much lower than the first preset rotation speed at the start of rotation, and the inertia of the tray is small, which can reduce the wear between the tray and the moving connector and avoid a decrease in positioning accuracy. In addition, since the initial rotation process of the first preset speed is only used to initially find the position of the positioning structure, and will not affect the final positioning accuracy, the first preset speed can be higher than the rotation in the existing fixed-speed positioning method Speed, thereby improving the positioning efficiency of the tray.

本發明提供的上述托盤定位裝置和半導體加工設備能夠用來實現上述托盤定位方法,因此也同樣能夠實現提高托盤定位精度、避免托盤定位精度下降以及提高托盤定位效率的技術效果。The above-mentioned tray positioning device and semiconductor processing equipment provided by the present invention can be used to realize the above-mentioned tray positioning method, and therefore can also achieve the technical effects of improving the positioning accuracy of the tray, avoiding the decrease of the positioning accuracy of the tray, and improving the efficiency of the tray positioning.

以下揭露提供用於實施本揭露之不同構件之許多不同實施例或實例。下文描述組件及配置之特定實例以簡化本揭露。當然,此等僅為實例且非意欲限制。舉例而言,在以下描述中之一第一構件形成於一第二構件上方或上可包含其中該第一構件及該第二構件經形成為直接接觸之實施例,且亦可包含其中額外構件可形成在該第一構件與該第二構件之間,使得該第一構件及該第二構件可不直接接觸之實施例。另外,本揭露可在各個實例中重複參考數字及/或字母。此重複出於簡化及清楚之目的且本身不指示所論述之各個實施例及/或組態之間的關係。The following disclosure provides many different embodiments or examples of different components used to implement the disclosure. Specific examples of components and configurations are described below to simplify the disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description, a first member formed on or on a second member may include an embodiment in which the first member and the second member are formed in direct contact, and may also include additional members therein An embodiment that can be formed between the first member and the second member so that the first member and the second member may not directly contact. In addition, the present disclosure may repeat reference numbers and/or letters in each example. This repetition is for the purpose of simplification and clarity and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.

此外,為便於描述,諸如「下面」、「下方」、「下」、「上方」、「上」及類似者之空間相對術語可在本文中用於描述一個元件或構件與另一(些)元件或構件之關係,如圖中圖解說明。空間相對術語意欲涵蓋除在圖中描繪之定向以外之使用或操作中之裝置之不同定向。設備可以其他方式定向(旋轉90度或按其他定向)且因此可同樣解釋本文中使用之空間相對描述詞。In addition, for ease of description, spatially relative terms such as "below", "below", "below", "above", "upper" and the like can be used herein to describe one element or component and another(s) The relationship between components or components is illustrated in the figure. Spatial relative terms are intended to cover different orientations of devices in use or operation other than those depicted in the figures. The device can be oriented in other ways (rotated by 90 degrees or in other orientations) and therefore the spatial relative descriptors used in this article can also be interpreted.

儘管陳述本揭露之寬泛範疇之數值範圍及參數係近似值,然儘可能精確地報告特定實例中陳述之數值。然而,任何數值固有地含有必然由於見於各自測試量測中之標準偏差所致之某些誤差。再者,如本文中使用,術語「大約」通常意謂在一給定值或範圍之10%、5%、1%或0.5%內。替代地,術語「大約」意謂在由此項技術之一般技術者考量時處於平均值之一可接受標準誤差內。除在操作/工作實例中以外,或除非以其他方式明確指定,否則諸如針對本文中揭露之材料之數量、時間之持續時間、溫度、操作條件、數量之比率及其類似者之全部數值範圍、數量、值及百分比應被理解為在全部例項中由術語「大約」修飾。相應地,除非相反地指示,否則本揭露及隨附發明申請專利範圍中陳述之數值參數係可根據需要變化之近似值。至少,應至少鑑於所報告有效數位之數目且藉由應用普通捨入技術解釋各數值參數。範圍可在本文中表達為從一個端點至另一端點或在兩個端點之間。本文中揭露之全部範圍包含端點,除非另有指定。Although the numerical ranges and parameters stated in the broad scope of this disclosure are approximate values, the numerical values stated in the specific examples are reported as accurately as possible. However, any numerical value inherently contains certain errors that are necessarily due to the standard deviation seen in the respective test measurement. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "approximately" means within one acceptable standard error of the mean when considered by a general technician of the technology. Except in the operation/work example, or unless explicitly specified in other ways, such as the total numerical range of the quantity of the material disclosed in this article, the duration of time, the temperature, the operating condition, the ratio of the quantity and the like, Quantities, values and percentages should be understood as modified by the term "about" in all examples. Correspondingly, unless otherwise indicated, the numerical parameters stated in the scope of the present disclosure and the accompanying invention application are approximate values that can be changed as needed. At the very least, each numerical parameter should be explained at least in view of the number of significant digits reported and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to the other or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

以下結合附圖對本發明的具體實施方式進行詳細說明。應當理解的是,此處所描述的具體實施方式僅用於說明和解釋本發明,並不用於限制本發明。The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not used to limit the present invention.

本發明實施例提供了一種托盤定位方法,如第1圖所示,該方法包括:The embodiment of the present invention provides a pallet positioning method. As shown in Figure 1, the method includes:

步驟S1:控制托盤以第一預設轉速沿第一方向旋轉。Step S1: Control the tray to rotate in a first direction at a first preset speed.

步驟S2:在檢測到托盤上的定位結構時,控制托盤減速,直至停止旋轉,並再次控制托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。Step S2: When the positioning structure on the tray is detected, the tray is controlled to decelerate until it stops rotating, and the tray is again controlled to rotate in a direction opposite to the previous rotation direction, and the rotation speed is lower than the previous rotation speed.

步驟S3:循環執行步驟S2;Step S3: cyclically execute step S2;

步驟S4:在托盤的旋轉速度下降到小於或等於第二預設轉速且再次檢測到定位結構時,控制托盤立即停止。Step S4: When the rotation speed of the tray drops to less than or equal to the second preset rotation speed and the positioning structure is detected again, the tray is controlled to stop immediately.

申請人經過研究後發現,現有的托盤定位步驟中僅控制托盤以一種旋轉速度沿一個方向進行的旋轉,為了保證定位效率,該旋轉速度通常不會很低(通常為0.6rpm),因此在定位結構到達預定位置並進行急停時,托盤仍會在急停時繼續向前旋轉一定角度,影響了托盤的定位精度。並且,在較高的旋轉速度下托盤的慣性較大,急停動作容易導致托盤與運動連接件之間産生磨損,使得托盤的定位精度逐漸下降。After research, the applicant found that the existing tray positioning step only controls the tray to rotate in one direction at a rotation speed. In order to ensure positioning efficiency, the rotation speed is usually not very low (usually 0.6 rpm). When the structure reaches the predetermined position and performs an emergency stop, the tray will continue to rotate forward to a certain angle during the emergency stop, which affects the positioning accuracy of the tray. In addition, the inertia of the tray is relatively large at a higher rotation speed, and the emergency stop action is likely to cause wear between the tray and the moving connector, and the positioning accuracy of the tray gradually decreases.

因此,申請人設計托盤圍繞托盤進行反覆旋轉運動,且每一次旋轉速度均低於上一次的旋轉速度,以使得托盤每次減速至停止旋轉時定位結構的停止位置逐漸接近預定位置(即檢測定位結構的位置)。由於在最後一次停止時托盤的旋轉速度足夠低(小於等於第二預設轉速),因此能夠減小托盤在急停時(即步驟S4中托盤立即停止時)向前旋轉的角度,從而提高托盤的定位精度。並且,托盤在最後一次停止時的旋轉速度(小於等於第二預設轉速)遠小於開始旋轉時的第一預設轉速,托盤的慣性小,從而能夠減小托盤與運動連接件之間的磨損,避免定位精度下降。Therefore, the applicant designed the tray to rotate repeatedly around the tray, and each rotation speed is lower than the previous rotation speed, so that each time the tray decelerates to stop rotation, the stop position of the positioning structure gradually approaches the predetermined position (that is, the detection positioning The location of the structure). Since the rotation speed of the tray at the last stop is sufficiently low (less than or equal to the second preset speed), the angle at which the tray rotates forward during an emergency stop (that is, when the tray is immediately stopped in step S4) can be reduced, thereby increasing the tray The positioning accuracy. In addition, the rotation speed of the tray at the last stop (less than or equal to the second preset speed) is much lower than the first preset speed at the start of rotation, and the inertia of the tray is small, which can reduce the wear between the tray and the moving connector , To avoid the decrease of positioning accuracy.

此外,由於初始時的第一預設轉速的旋轉過程僅用於初步找到定位結構位置,並不會影響最終的定位精度,因此第一預設轉速可以高於現有的定速定位方法中的旋轉速度(例如,可以不低於3rpm),從而提高托盤的定位效率。In addition, since the initial rotation process of the first preset speed is only used to initially find the position of the positioning structure, and will not affect the final positioning accuracy, the first preset speed can be higher than the rotation in the existing fixed-speed positioning method Speed (for example, can be no less than 3rpm), thereby improving the positioning efficiency of the tray.

需要說明的是,在本發明中,為了降低托盤與運動連接件之間的磨損,在循環執行的步驟S2中,托盤減速直至停止旋轉的角加速度小於現有技術中托盤急停的角加速度。It should be noted that, in the present invention, in order to reduce the wear between the tray and the moving connector, in step S2 executed cyclically, the angular acceleration of the tray decelerating until it stops rotating is less than the angular acceleration of the tray emergency stop in the prior art.

為進一步提高托盤定位精度,優選地,如第2圖所示,上述步驟S4可以包括:在托盤的旋轉速度下降到小於等於第二預設轉速且再次檢測到定位結構時,控制托盤以最大制動角加速度進行減速直至停止。To further improve the positioning accuracy of the tray, preferably, as shown in Figure 2, the above step S4 may include: when the rotation speed of the tray drops to less than or equal to the second preset speed and the positioning structure is detected again, controlling the tray to brake at the maximum The angular acceleration decelerates until it stops.

其中,最大制動角加速度是指托盤急停時的角加速度,該角加速度大於托盤在步驟S4之前任意一次減速直至停止旋轉的角加速度。Wherein, the maximum braking angular acceleration refers to the angular acceleration of the tray when it stops suddenly, and the angular acceleration is greater than the angular acceleration of the tray at any one time before step S4 decelerates until it stops rotating.

由於托盤在最後一次停止時的旋轉速度(小於等於第二預設轉速)遠小於開始旋轉時的第一預設轉速,托盤的慣性小,因此,申請人設計托盤在最後一次以緊急停止的方式制動,在保證不會造成托盤與運動連接件之間的磨損的前提下,進一步提高了托盤的定位精度。Since the rotation speed of the tray at the last stop (less than or equal to the second preset speed) is much lower than the first preset speed at the start of rotation, the inertia of the tray is small. Therefore, the applicant designed the tray to stop in an emergency at the last time Braking further improves the positioning accuracy of the pallet on the premise that it will not cause abrasion between the pallet and the moving connector.

為提高托盤的定位效率,優選地,如第3圖所示,步驟S2還可以包括:In order to improve the positioning efficiency of the tray, preferably, as shown in Figure 3, step S2 may further include:

在托盤旋轉超過第一預設角度且還未檢測到定位結構時,控制托盤減速,直至停止旋轉,並再次控制托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。When the tray rotates beyond the first preset angle and the positioning structure has not been detected, control the tray to decelerate until it stops rotating, and again control the tray to rotate in the opposite direction to the previous rotation, and the rotation speed is less than the previous rotation speed .

在本發明中,當托盤旋轉經過的角度大於預設角度且未檢測到定位結構到達時,直接控制托盤減速停止旋轉,進入下一次更低旋轉速度的反向旋轉過程,從而避免了托盤轉速過快時檢測不到定位結構而導致托盤空轉過多圈數,提高了托盤的定位效率。In the present invention, when the rotating angle of the tray is greater than the preset angle and the arrival of the positioning structure is not detected, the tray is directly controlled to decelerate and stop rotating, and enter the next lower rotation speed reverse rotation process, thereby avoiding the tray rotating speed too much. The positioning structure cannot be detected quickly, which causes the tray to rotate too many times, which improves the positioning efficiency of the tray.

本發明對第一預設角度的大小不作具體限定,例如,為提高對“空轉狀態”判斷的準確性,第一預設角度可以為540°。為提高托盤的定位效率,優選地,第一預設角度可以為360°。The present invention does not specifically limit the size of the first preset angle. For example, in order to improve the accuracy of determining the "idling state", the first preset angle may be 540°. In order to improve the positioning efficiency of the tray, preferably, the first preset angle may be 360°.

在托盤以低轉速旋轉時定位結構未被檢測到的機率較小,因此,可選地,步驟S2可以包括:當托盤的旋轉速度不低於第三預設轉速,且托盤旋轉超過第一預設角度且還未檢測到定位結構時,控制托盤減速,直至停止旋轉,並再次控制托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。其中,第三預設轉速小於第一預設轉速,第三預設轉速大於第二預設轉速。The probability that the positioning structure is not detected when the tray rotates at a low rotation speed is small. Therefore, optionally, step S2 may include: when the rotation speed of the tray is not lower than the third preset rotation speed, and the tray rotation exceeds the first preset rotation speed. When the angle is set and the positioning structure has not been detected, the tray is controlled to decelerate until it stops rotating, and the tray is again controlled to rotate in the direction opposite to the previous rotation, and the rotation speed is less than the previous rotation speed. Wherein, the third preset speed is less than the first preset speed, and the third preset speed is greater than the second preset speed.

申請人還發現,在托盤定位開始時,托盤的定位結構可能已經出現在預定位置。然而,在本發明給出的托盤定位方法中,為了提高定位效率,托盤的前幾次旋轉過程的轉速優選為較高的轉速,與常規定位模式相比,過高的轉速容易導致定位結構在感應裝置的相鄰感應脈衝之間經過預定位置,因此本發明中的定位結構優選地具有一定的寬度。但與之相伴地,受定位結構的寬度影響,在本發明的方案中,檢測到定位結構實際上是“檢測到定位結構的邊緣”,因此僅靠定位結構初始即在預定位置這一偶然現象無法保證托盤的定位精度。The applicant also found that the positioning structure of the tray may have appeared at the predetermined position when the positioning of the tray started. However, in the tray positioning method provided by the present invention, in order to improve the positioning efficiency, the rotation speed of the first few rotations of the tray is preferably a higher rotation speed. Compared with the conventional positioning mode, the too high rotation speed may easily cause the positioning structure The adjacent induction pulses of the induction device pass through a predetermined position, so the positioning structure in the present invention preferably has a certain width. But accompanying it, affected by the width of the positioning structure, in the solution of the present invention, detecting the positioning structure is actually "detecting the edge of the positioning structure", so only the accidental phenomenon that the positioning structure is initially at the predetermined position The positioning accuracy of the pallet cannot be guaranteed.

為解决上述問題,進一步提高托盤的定位精度,優選地,如第4圖所示,上述托盤定位方法還可以包括在步驟S1之前進行的:In order to solve the above-mentioned problems and further improve the positioning accuracy of the tray, preferably, as shown in Figure 4, the above-mentioned tray positioning method may further include performing before step S1:

步驟S0:在托盤未開始旋轉即可檢測到定位結構時,控制托盤沿與第一方向相反的第二方向旋轉第二預設角度。Step S0: When the positioning structure is detected before the tray starts to rotate, the tray is controlled to rotate in a second direction opposite to the first direction by a second preset angle.

在本發明中,申請人設計定位結構初始即在預定位置時,托盤沿第二方向旋轉第二預設角度,使托盤按照定位結構不在預定位置的情况重新開始定位,從而保證了托盤的定位精度。In the present invention, when the positioning structure designed by the applicant is initially at the predetermined position, the tray rotates in the second direction by a second predetermined angle, so that the tray restarts positioning according to the situation that the positioning structure is not at the predetermined position, thereby ensuring the positioning accuracy of the tray .

在本發明中,第一方向與第二方向中的一者為順時針方向,另一者為逆時針方向。In the present invention, one of the first direction and the second direction is a clockwise direction, and the other is a counterclockwise direction.

本發明對上述步驟S2循環執行的次數不做具體限定,例如,為保證托盤的定位精度,優選地,步驟S2循環執行的次數不小於三次。The present invention does not specifically limit the number of cycles of step S2. For example, in order to ensure the positioning accuracy of the tray, preferably, the number of cycles of step S2 is not less than three times.

為避免托盤與運動連接件之間的磨損導致托盤對位精度下降,優選地,每次控制托盤旋轉的過程包括:In order to avoid the wear between the tray and the moving connecting piece causing the positioning accuracy of the tray to decrease, preferably, the process of controlling the rotation of the tray each time includes:

控制托盤加速旋轉到預定的旋轉速度;Control the tray to accelerate to a predetermined rotation speed;

控制托盤以預定的旋轉速度勻速旋轉。The tray is controlled to rotate at a predetermined rotation speed at a uniform speed.

為進一步減小角加速度過大導致托盤與運動連接件之間發生的磨損,優選地,在控制托盤開始旋轉的加速過程中,托盤的角加速度不大於托盤減速停止旋轉時的角加速度。In order to further reduce the wear between the tray and the moving connector caused by excessive angular acceleration, preferably, during the acceleration process when the tray starts to rotate, the angular acceleration of the tray is not greater than the angular acceleration when the tray decelerates and stops rotating.

為便於本領域技術人員的理解,以下給出本發明提供的托盤定位方法的一種具體實施方式:To facilitate the understanding of those skilled in the art, a specific implementation of the tray positioning method provided by the present invention is given below:

如第5圖、第6圖所示,在半導體加工設備中,托盤20上的定位結構21為設置在托盤邊緣的缺口,採用感測器30對該缺口進行探測。托盤定位方法如下:As shown in FIGS. 5 and 6, in the semiconductor processing equipment, the positioning structure 21 on the tray 20 is a notch provided at the edge of the tray, and the sensor 30 is used to detect the notch. The pallet positioning method is as follows:

控制托盤以3rpm的轉速(第一預設轉速)沿逆時針方向(第一方向)旋轉。The control tray rotates in a counterclockwise direction (first direction) at a speed of 3rpm (first preset speed).

(此時托盤的旋轉速度大於第三預設轉速1.8rpm)若30秒後(即旋轉的角度大於預設角度540°時)還未檢測到定位結構,則控制托盤減速,直至停止旋轉,並再次控制托盤沿順時針方向旋轉,且旋轉速度為1.5rpm;(At this time, the rotation speed of the tray is greater than the third preset speed 1.8rpm) If the positioning structure is not detected after 30 seconds (that is, when the rotation angle is greater than the preset angle 540°), the tray is controlled to decelerate until it stops rotating, and Control the tray to rotate in the clockwise direction again, and the rotation speed is 1.5rpm;

若檢測到托盤上的定位結構,則控制托盤減速,直至停止旋轉,並再次控制托盤沿順時針方向旋轉,且旋轉速度為1.5rpm。If the positioning structure on the tray is detected, the tray is controlled to decelerate until it stops rotating, and the tray is controlled to rotate in a clockwise direction again, and the rotation speed is 1.5 rpm.

(此時托盤的旋轉速度已經小於第三預設轉速1.8rpm)當檢測到托盤上的定位結構時,控制托盤減速,直至停止旋轉,並再次控制托盤沿逆時針方向旋轉,且旋轉速度為0.6rpm。(At this time, the rotation speed of the tray is already less than the third preset rotation speed of 1.8rpm) When the positioning structure on the tray is detected, the tray is controlled to decelerate until it stops rotating, and the tray is again controlled to rotate in the counterclockwise direction, and the rotation speed is 0.6 rpm.

當檢測到托盤上的定位結構時,控制托盤減速,直至停止旋轉,並再次控制托盤沿順時針方向旋轉,且旋轉速度為0.1rpm(第二預設轉速)。When the positioning structure on the tray is detected, the tray is controlled to decelerate until it stops rotating, and the tray is controlled to rotate in a clockwise direction again, and the rotation speed is 0.1 rpm (the second preset speed).

(此時托盤的旋轉速度已經小於第二預設轉速0.1rpm)在檢測到定位結構時,控制托盤立即停止。(At this time, the rotation speed of the tray is already less than the second preset rotation speed of 0.1 rpm) When the positioning structure is detected, the control tray immediately stops.

在同等條件下,常規托盤定位的步驟通常包括:Under the same conditions, the steps of conventional pallet positioning usually include:

使托盤以0.6rpm的速度沿順時針方向旋轉;Rotate the tray clockwise at a speed of 0.6rpm;

當檢測到定位結構時,控制托盤急停。When the positioning structure is detected, the pallet is controlled to stop emergency.

如第10圖所示為定位結構的初始位置與感測器30位置之間的角度為180°時在兩種方法的控制下托盤的轉動速度隨時間變化的示意圖。由附圖可知,本發明提供的托盤定位方法僅花費30s即完成了托盤的定位,其效率遠高於用時53s的常規定位效率。As shown in Fig. 10, when the angle between the initial position of the positioning structure and the position of the sensor 30 is 180°, the rotation speed of the tray changes with time under the control of the two methods. It can be seen from the drawings that the tray positioning method provided by the present invention only takes 30 seconds to complete the positioning of the tray, and its efficiency is much higher than the conventional positioning efficiency in 53 seconds.

為便於本領域技術人員更為直觀地理解本發提供的方法的效率區別於常規技術的優勢。如第7圖所示,按照感測器30在托盤20旋轉一周時發射出的探測脈衝數量(20000個脈衝)對托盤20的角度進行劃分。如第11圖所示為托盤上定位結構與感測器30之間的初始角度與定位過程花費時間之間的關係示意圖,由圖中數據可以明顯看出,本發明提供的托盤定位方法可以在18~39秒內實現定位,而常規的定速定位方法却需要0~100秒,並且本發明提供的托盤定位方法中定位過程所需的時間在大部分情况下均低於常規定位花費的時間,其定位效率顯著高於常規定位方法的效率。In order to facilitate those skilled in the art to more intuitively understand the advantages of the method provided by the present invention that are different from conventional technologies. As shown in FIG. 7, the angle of the tray 20 is divided according to the number of detection pulses (20,000 pulses) emitted by the sensor 30 when the tray 20 rotates one revolution. As shown in Figure 11, it is a schematic diagram of the relationship between the initial angle between the positioning structure on the tray and the sensor 30 and the time spent in the positioning process. The data in the figure clearly shows that the tray positioning method provided by the present invention can be used in The positioning is achieved within 18~39 seconds, while the conventional fixed-speed positioning method requires 0-100 seconds, and the time required for the positioning process in the pallet positioning method provided by the present invention is in most cases lower than the time spent in conventional positioning , Its positioning efficiency is significantly higher than that of conventional positioning methods.

本發明實施例還提供了一種托盤定位裝置,如第8圖、第9圖所示,該托盤定位裝置包括控制器10、感測器30和驅動器60,其中:The embodiment of the present invention also provides a tray positioning device. As shown in Figures 8 and 9, the tray positioning device includes a controller 10, a sensor 30 and a driver 60, wherein:

驅動器60用於驅動托盤20旋轉,還用於使托盤20停止旋轉;The driver 60 is used to drive the tray 20 to rotate, and is also used to stop the tray 20 from rotating;

感測器30用於檢測托盤20上的定位結構;The sensor 30 is used to detect the positioning structure on the tray 20;

控制器10與驅動器60以及感測器30連接,用於控制驅動器60驅動托盤20以第一預設轉速沿第一方向旋轉。The controller 10 is connected to the driver 60 and the sensor 30 for controlling the driver 60 to drive the tray 20 to rotate in a first direction at a first preset speed.

控制器10還用於循環地在感測器30檢測到托盤20上的定位結構時,控制驅動器60使托盤20減速,直至停止旋轉,並再次控制驅動器60驅動托盤20沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。The controller 10 is also used to cyclically control the driver 60 to decelerate the tray 20 until the rotation of the tray 20 is stopped when the sensor 30 detects the positioning structure on the tray 20, and again to control the driver 60 to drive the tray 20 in the direction opposite to the previous rotation. The direction of rotation, and the rotation speed is less than the previous rotation speed.

控制器10還用於在托盤20的旋轉速度下降到小於或等於第二預設轉速且感測器30再次檢測到定位結構時,控制驅動器60使托盤20立即停止。The controller 10 is also used to control the driver 60 to stop the tray 20 immediately when the rotation speed of the tray 20 drops to less than or equal to the second preset speed and the sensor 30 detects the positioning structure again.

第8圖、第9圖所示為托盤定位裝置的感測器30和驅動器60與托盤20的位置關係示意圖,本發明上述實施例已對用於半導體加工設備的托盤定位方法的有益效果進行過詳細說明,此處不再贅述。Figures 8 and 9 are schematic diagrams showing the positional relationship between the sensor 30 and the driver 60 of the tray positioning device and the tray 20. The above-mentioned embodiments of the present invention have performed the beneficial effects of the tray positioning method for semiconductor processing equipment. The detailed description will not be repeated here.

為進一步提高托盤的定位精度,優選地,控制器10還用於在托盤20的旋轉速度下降到小於等於第二預設轉速且感測器30再次檢測到定位結構時,控制驅動器60使托盤20以最大制動角加速度進行減速直至停止。In order to further improve the positioning accuracy of the tray, preferably, the controller 10 is also used to control the driver 60 to make the tray 20 when the rotation speed of the tray 20 drops to less than or equal to the second preset speed and the sensor 30 detects the positioning structure again. Decelerate at the maximum braking angular acceleration until it stops.

為提高托盤的定位效率,優選地,控制器10還用於循環地在托盤20旋轉超過預定角度且感測器30還未檢測到定位結構時,控制驅動器60使托盤20減速,直至停止旋轉,並再次控制驅動器60驅動托盤20沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。In order to improve the positioning efficiency of the tray, preferably, the controller 10 is also used to control the driver 60 to decelerate the tray 20 until it stops rotating when the tray 20 rotates more than a predetermined angle and the sensor 30 has not detected the positioning structure. And again, the driver 60 is controlled to drive the tray 20 to rotate in a direction opposite to the previous rotation direction, and the rotation speed is lower than the previous rotation speed.

為進一步提高托盤的定位精度,優選地,控制器10還用於在托盤20未開始旋轉感測器30即可檢測到定位結構時,控制驅動器60驅動托盤20沿與第一方向相反的第二方向旋轉第二預設角度。In order to further improve the positioning accuracy of the tray, preferably, the controller 10 is also used to control the driver 60 to drive the tray 20 in a second direction opposite to the first direction when the positioning structure can be detected by the sensor 30 before the tray 20 starts to rotate. The direction is rotated by a second preset angle.

作為本發明的第三個實施例,還提供一種半導體加工設備,如第6圖、第8圖、第9圖所示,該半導體加工設備包括製程腔室50和設置在製程腔室50內的托盤20,托盤20能夠旋轉,且托盤20上設置有定位結構21,半導體加工設備還包括前述的托盤定位裝置。As a third embodiment of the present invention, there is also provided a semiconductor processing equipment, as shown in Figure 6, Figure 8, and Figure 9. The semiconductor processing equipment includes a process chamber 50 and a process chamber 50 arranged in the process chamber 50. The tray 20 is capable of rotating, and a positioning structure 21 is provided on the tray 20. The semiconductor processing equipment further includes the aforementioned tray positioning device.

本發明對托盤定位裝置的驅動器60如何驅動托盤20執行旋轉、減速、加速等動作不做具體限定,例如,如第8圖、第9圖所示,驅動器60可以包括旋轉電機,旋轉電機的輸出軸與托盤20的旋轉中心連接。本發明對托盤20的材料不做具體限定,例如,托盤20可以為石墨盤。如第5圖、第6圖所示,托盤20上還形成有用於放置晶圓的晶圓槽22。半導體加工設備還可以包括機械手,在托盤定位後,由機械手夾持晶圓將晶圓逐個放入晶圓槽22中。The present invention does not specifically limit how the driver 60 of the tray positioning device drives the tray 20 to perform rotation, deceleration, acceleration and other actions. For example, as shown in Figures 8 and 9, the driver 60 may include a rotating motor, and the output of the rotating motor The shaft is connected to the rotation center of the tray 20. The present invention does not specifically limit the material of the tray 20. For example, the tray 20 may be a graphite plate. As shown in Figs. 5 and 6, a wafer slot 22 for placing wafers is also formed on the tray 20. The semiconductor processing equipment may also include a manipulator. After the tray is positioned, the manipulator clamps the wafers and puts the wafers into the wafer slot 22 one by one.

本發明對定位結構21的具體結構不做具體限定,只要該定位結構21能夠被感測器30感應到即可,例如,定位結構21可以是托盤20上的凸起、凹陷、通孔、邊緣缺口或者特殊顔色的線條等。The present invention does not specifically limit the specific structure of the positioning structure 21, as long as the positioning structure 21 can be sensed by the sensor 30. For example, the positioning structure 21 may be protrusions, depressions, through holes, or edges on the tray 20. Gap or special color lines, etc.

如第6圖、第8圖、第9圖所示,當定位結構21為托盤20邊緣的缺口或沿厚度方向貫穿托盤20的通孔時,感測器30可以是測距感測器,該測距感測器用於對該缺口經過的某一位置(即預定位置)進行探測,在定位結構21未到達預定位置時,測距感測器探測到的是其自身到托盤20的距離h1,在定位結構21到達預定位置時,測距感測器的探測脈衝直接穿過該缺口或通孔,探測結果變成測距感測器到製程腔室50腔壁的距離h2,由此實現定位結構21的位置觀測。As shown in Figures 6, 8, and 9, when the positioning structure 21 is a notch on the edge of the tray 20 or a through hole that penetrates the tray 20 in the thickness direction, the sensor 30 can be a distance sensor. The distance measuring sensor is used to detect a certain position (that is, a predetermined position) passed by the gap. When the positioning structure 21 does not reach the predetermined position, the distance measuring sensor detects the distance h1 from itself to the tray 20, When the positioning structure 21 reaches the predetermined position, the detection pulse of the distance measuring sensor directly passes through the gap or through hole, and the detection result becomes the distance h2 from the distance measuring sensor to the wall of the process chamber 50, thereby realizing the positioning structure 21 position observation.

為提高探測脈衝的信號質量,優選地,如第5圖所示,製程腔室50的頂壁上可以包括製程窗51,感應裝置通過製程窗51觀測托盤20上的定位結構21。In order to improve the signal quality of the detection pulse, preferably, as shown in FIG. 5, the top wall of the process chamber 50 may include a process window 51 through which the sensing device observes the positioning structure 21 on the tray 20.

為提高微電子製程的製程效果,優選地,如第5圖、第6圖所示,半導體加工設備還包括氣缸40,氣缸40的一端與感測器30(如,測距感測器)連接,氣缸40的另一端與製程腔室50固定連接,用於在托盤20定位時伸長,以將感應裝置送至製程窗上方,在托盤20定位完成後縮短,以帶動感測器30離開製程窗,以避免感測器30中的電子器件影響製程腔室50內的電磁場分布。In order to improve the process effect of the microelectronics manufacturing process, preferably, as shown in FIGS. 5 and 6, the semiconductor processing equipment further includes a cylinder 40, and one end of the cylinder 40 is connected to a sensor 30 (eg, a ranging sensor) , The other end of the cylinder 40 is fixedly connected to the process chamber 50, and is used to extend when the tray 20 is positioned to send the sensing device above the process window, and shorten after the tray 20 is positioned to drive the sensor 30 to leave the process window In order to prevent the electronic devices in the sensor 30 from affecting the electromagnetic field distribution in the process chamber 50.

可以理解的是,以上實施方式僅僅是為了說明本實用新型的原理而採用的示例性實施方式,然而本實用新型並不局限於此。對於本領域內的普通技術人員而言,在不脫離本實用新型的精神和實質的情况下,可以做出各種變型和改進,這些變型和改進也視為本實用新型的保護範圍。It can be understood that the above implementations are merely exemplary implementations used to illustrate the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括一個或者更多個該特徵。在本實用新型的描述中,除非另有說明,“多個”的含義是兩個或兩個以上。The terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

在本申請的描述中,需要說明的是,除非另有明確的規定和限定,術語“安裝”、“相連”、“連接”應做廣義理解,例如,可以是固定連接,也可以是可拆卸連接,或一體地連接;可以是直接相連,也可以通過中間媒介間接相連,可以是兩個元件內部的連通。對於本領域的普通技術人員而言,可以具體情况理解上述術語在本實用新型中的具體含義。In the description of this application, it should be noted that the terms "installation", "connection", and "connection" should be interpreted broadly unless otherwise clearly specified and limited. For example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present utility model can be understood under specific circumstances.

10:控制器 20:托盤 21:定位結構 22:晶圓槽 30:感測器 40:氣缸 50:製程腔室 51:製程窗 60:驅動器10: Controller 20: tray 21: Positioning structure 22: Wafer slot 30: Sensor 40: cylinder 50: Process chamber 51: Process window 60: drive

第1圖是本發明實施例提供的托盤定位方法的流程示意圖;Figure 1 is a schematic flowchart of a tray positioning method provided by an embodiment of the present invention;

第2圖是本發明實施例提供的托盤定位方法的一種實施方式的示意圖;Figure 2 is a schematic diagram of an implementation manner of a tray positioning method provided by an embodiment of the present invention;

第3圖是本發明實施例提供的托盤定位方法的再一種實施方式的示意圖;Figure 3 is a schematic diagram of still another implementation of the tray positioning method provided by the embodiment of the present invention;

第4圖是本發明實施例提供的托盤定位方法的另一種實施方式的示意圖;Figure 4 is a schematic diagram of another implementation of the tray positioning method provided by the embodiment of the present invention;

第5圖是本發明實施例提供的半導體加工設備的一種結構的示意圖;Figure 5 is a schematic diagram of a structure of a semiconductor processing equipment provided by an embodiment of the present invention;

第6圖是本發明實施例提供的半導體加工設備的另一種結構的示意圖;Figure 6 is a schematic diagram of another structure of a semiconductor processing equipment provided by an embodiment of the present invention;

第7圖是對本發明實施例提供的對半導體加工設備中的托盤進行分度的一種實施方式的示意圖;FIG. 7 is a schematic diagram of an embodiment of indexing a tray in a semiconductor processing equipment according to an embodiment of the present invention;

第8圖是本發明實施例提供的托盤定位裝置與本發明實施例提供的半導體加工設備的其他結構之間的位置關係示意圖;Figure 8 is a schematic diagram of the positional relationship between the tray positioning device provided by the embodiment of the present invention and other structures of the semiconductor processing equipment provided by the embodiment of the present invention;

第9圖是本發明實施例提供的半導體加工設備的另一種位置的示意圖;Figure 9 is a schematic diagram of another position of the semiconductor processing equipment provided by the embodiment of the present invention;

第10圖是本發明實施例提供的托盤定位方法與常規定位效果相比較的示意圖;Figure 10 is a schematic diagram of comparing the effect of the tray positioning method provided by the embodiment of the present invention with the conventional positioning;

第11圖是托盤在不同初始角度下本發明實施例提供的托盤定位方法與常規定位效果相互比較的示意圖。FIG. 11 is a schematic diagram of comparing the effects of the tray positioning method provided by the embodiment of the present invention and the conventional positioning of the tray at different initial angles.

S1-S4:步驟 S1-S4: steps

Claims (10)

一種托盤定位方法,包括: S1:控制該托盤以一第一預設轉速沿一第一方向旋轉; S2:在檢測到該托盤上的一定位結構時,控制該托盤減速,直至停止旋轉,並再次控制該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度; S3:循環執行步驟S2; S4:在該托盤的旋轉速度下降到小於或等於一第二預設轉速且再次檢測到該定位結構時,控制該托盤立即停止。 A pallet positioning method includes: S1: Control the tray to rotate in a first direction at a first preset speed; S2: When a positioning structure on the tray is detected, control the tray to decelerate until it stops rotating, and again control the tray to rotate in a direction opposite to the previous rotation direction, and the rotation speed is less than the previous rotation speed; S3: cyclically execute step S2; S4: When the rotation speed of the tray drops to less than or equal to a second preset speed and the positioning structure is detected again, control the tray to stop immediately. 根據請求項1所述的方法,其中控制該托盤立即停止,包括: 控制該托盤以一最大制動角加速度進行減速直至停止。 The method according to claim 1, wherein controlling the tray to stop immediately includes: Control the pallet to decelerate at a maximum braking angular acceleration until it stops. 根據請求項1所述的方法,其中步驟S2還包括: 在該托盤旋轉超過一第一預設角度且還未檢測到該定位結構時,控制該托盤減速,直至停止旋轉,並再次控制該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。 The method according to claim 1, wherein step S2 further includes: When the tray rotates beyond a first preset angle and the positioning structure has not been detected, the tray is controlled to decelerate until it stops rotating, and the tray is again controlled to rotate in the direction opposite to the previous rotation, and the rotation speed is less than The last rotation speed. 根據請求項3所述的方法,其中該第一預設角度為360°。The method according to claim 3, wherein the first preset angle is 360°. 根據請求項1至4中任意一項所述的方法,其中在步驟S1之前,還包括: S0:在該托盤未開始旋轉即可檢測到該定位結構時,控制該托盤沿與該第一方向相反的一第二方向旋轉一第二預設角度。 The method according to any one of claims 1 to 4, wherein before step S1, further includes: S0: When the positioning structure is detected before the tray starts to rotate, control the tray to rotate in a second direction opposite to the first direction by a second preset angle. 一種托盤定位裝置,包括:一控制器、一感測器、一驅動器,其中, 該驅動器用於驅動該托盤旋轉,還用於使該托盤停止旋轉; 該感測器用於檢測該托盤上的一定位結構; 該控制器與該驅動器、該感測器連接,用於控制該驅動器驅動該托盤以一第一預設轉速沿一第一方向旋轉; 該控制器還用於循環地在該感測器檢測到該托盤上的該定位結構時,控制該驅動器使該托盤減速,直至停止旋轉,並再次控制該驅動器驅動該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度; 該控制器還用於在該托盤的旋轉速度下降到小於等於一第二預設轉速且該感測器再次檢測到該定位結構時,控制該驅動器使該托盤立即停止。 A tray positioning device includes: a controller, a sensor, and a driver, wherein, The driver is used to drive the tray to rotate, and is also used to stop the tray from rotating; The sensor is used to detect a positioning structure on the tray; The controller is connected with the driver and the sensor, and is used for controlling the driver to drive the tray to rotate in a first direction at a first preset speed; The controller is also used for cyclically when the sensor detects the positioning structure on the tray, control the driver to decelerate the tray until it stops rotating, and again control the driver to drive the tray in the same direction as the previous rotation Rotate in the opposite direction, and the rotation speed is less than the previous rotation speed; The controller is also used for controlling the driver to stop the tray immediately when the rotation speed of the tray drops to less than or equal to a second preset speed and the sensor detects the positioning structure again. 根據請求項6所述的裝置,其中該控制器還用於在該托盤的旋轉速度下降到小於等於該第二預設轉速且該感測器再次檢測到該定位結構時,控制該驅動器使該托盤以一最大制動角加速度進行減速直至停止。The device according to claim 6, wherein the controller is further configured to control the driver to cause the rotation speed of the tray to decrease to less than or equal to the second preset rotation speed and the sensor detects the positioning structure again The pallet decelerates at a maximum braking angular acceleration until it stops. 根據請求項6所述的裝置,其中該控制器還用於循環地在該托盤旋轉超過一預定角度且該感測器還未檢測到該定位結構時,控制該驅動器使該托盤減速,直至停止旋轉,並再次控制該驅動器驅動該托盤沿與上一次旋轉方向相反的方向旋轉,且旋轉速度小於上一次的旋轉速度。The device according to claim 6, wherein the controller is further configured to control the driver to decelerate the tray until it stops when the tray rotates more than a predetermined angle and the sensor has not detected the positioning structure Rotate, and control the driver again to drive the tray to rotate in a direction opposite to the previous rotation, and the rotation speed is less than the previous rotation speed. 根據請求項6至8中任意一項所述的裝置,其中該控制器還用於在該托盤未開始旋轉該感測器即可檢測到該定位結構時,控制該驅動器驅動該托盤沿與該第一方向相反的一第二方向旋轉一第二預設角度。The device according to any one of claim 6 to 8, wherein the controller is further configured to control the driver to drive the tray edge and the positioning structure when the sensor detects the positioning structure before the tray starts to rotate A second direction opposite to the first direction rotates by a second predetermined angle. 一種半導體加工設備,包括一製程腔室和設置在該製程腔室內的一托盤,該托盤能夠旋轉,且該托盤上設置有一定位結構,其中,該半導體加工設備還包括如請求項6至9中任意一項所述的托盤定位裝置。A semiconductor processing equipment includes a process chamber and a tray arranged in the process chamber, the tray can rotate, and a positioning structure is arranged on the tray, wherein the semiconductor processing equipment further includes as claimed in items 6 to 9 Any one of the tray positioning device.
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