KR20060092005A - Spin apparatus of wafer comprising vibration sensing unit and control method thereof - Google Patents

Abstract

The disclosed wafer spin apparatus is provided in a body frame, and includes a spin unit for rotating the wafer by a spin motor, a vibration detector for detecting vibration generated when the spin unit rotates, and converting the vibration into a frequency waveform according to the waveform of the frequency. And a control unit for controlling the rotation of the spin unit, and a method of controlling the wafer spin apparatus includes detecting vibration generated when the spin unit on which the wafer is seated rotates, converting the detected vibration into a frequency waveform, and the frequency waveform in advance. And controlling the rotation of the spin unit when the set value exceeds the allowable range. According to the wafer spin apparatus and the control method thereof, the vibration detecting unit may generate vibration when the wafer is placed and rotates. By detecting this and controlling the rotation of the spin part, it is possible to prevent breakage of the wafer due to vibration. It can provide an effect.

Wafer, Spin Device

Description

TECHNICAL FIELD {Spin apparatus of wafer comprising vibration sensing unit and control method}

1 is a schematic view showing a wafer spin apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram sequentially illustrating operations of the wafer spin device of FIG. 1.

3 is a flowchart sequentially illustrating a method of controlling the wafer spin apparatus of FIG. 1.

** Description of the symbols for the main parts of the drawings **

10: rotating body

11: rotating plate

12: clamper

20: spin motor

30: spin part

40: spin motor controller

50: main controller

60: control unit

70: detection sensor

80: detection controller

90: vibration detection unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer spin apparatus and a control method thereof, and more particularly, to a wafer spin apparatus having a vibration sensing unit for sensing vibration generated during wafer rotation for cleaning a wafer during a semiconductor manufacturing process, and a control method for controlling the wafer spin apparatus. will be.

Generally, a semiconductor chip is manufactured by forming a predetermined film on a wafer used as a semiconductor substrate and forming a pattern having electrical properties on the film.

The pattern is formed by sequential or repeated performance of unit processes such as film formation, photoresist application, exposure, development, etching, ion implantation, chemical mechanical polishing, cleaning and drying, and the like.

Among them, in the process of processing the wafer using a liquid such as chemical or DIW (Deionized Water), such as a photoresist coating process, a cleaning process and a drying process, the wafer is rotated at 100 to 1500 rpm. The device for rotating the wafer is a wafer spin device.

The wafer spin apparatus rotates after the wafer is seated on the spin portion, and there is a problem in that the wafer is damaged when the wafer is not properly seated on the spin portion or vibration of the spin portion occurs due to the rotation.

The present invention has been made to solve the above problems, and when the rotation of the wafer generates a vibration beyond the allowable range in the spin portion on which the wafer is seated, the rotation of the wafer is stopped to reduce damage to the wafer. SUMMARY OF THE INVENTION An object of the present invention is to provide an improved wafer spin apparatus and a method of controlling the same, which can reduce the rotational speed to eliminate vibrations exceeding an allowable range.

A wafer spin apparatus of the present invention for achieving the above object is provided in the body frame, the spin portion for rotating the wafer by a spin motor; A vibration detector for detecting vibrations generated when the spin unit rotates and converting the vibrations into frequency waveforms; And a controller for controlling the rotation of the spin unit in accordance with the waveform of the frequency.

Here, the vibration detection unit, the sensor is installed on the body frame for detecting the vibration generated during the rotation of the spin unit; And a sensing controller receiving the sensed vibration and converting the detected vibration into a frequency waveform.

In addition, the detection sensor is preferably an acceleration sensor.

The controller may include a spin motor controller configured to control driving of the spin motor; And a main controller for controlling the operation of the spin motor controller by comparing the frequency waveform with a preset value.

In addition, the wafer spin apparatus control method of the present invention comprises the steps of: sensing the vibration of the spin portion on which the wafer is seated; Converting the sensed vibration into a frequency waveform; And controlling the rotation of the spin unit when the frequency waveform exceeds a range of preset values.

Here, the rotation control of the spin unit preferably decelerates the rotational speed of the spin motor which is the driving source of the spin unit.

The rotation control of the spin unit preferably stops the rotation of the spin motor which is the driving source of the spin unit.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a configuration diagram schematically showing a wafer spin apparatus according to an embodiment of the present invention, Figure 2 is a configuration diagram sequentially showing the operation sequence of the wafer spin apparatus of FIG.

Referring to the drawings, the wafer spin apparatus includes a body frame 100, a spin unit 30, a vibration detector 90, and a controller 60.

The spin unit 30 includes a rotating body 10 and a spin motor 20 for rotating the rotating body 10. Among them, the rotor 10 is installed in the body frame 100, and the rotor 11 on which the wafer is seated and the clampers 12 mounted on the rotor 11 to clamp the edges of the wafer. It is provided.

The vibration detecting unit 90 is installed on the body frame 100 adjacent to the spin unit 30 to detect the vibration generated by the spin unit 30 and the detection by the detection sensor 70. And a sensing controller 80 that converts the generated vibration into a frequency waveform. Here, the sensing sensor 70 may use an acceleration sensor or a vibration sensor.

The controller 60 compares the frequency waveform converted by the spin motor controller 40 and the sensing controller 80 controlling the driving of the spin motor 20 with a preset value to control the operation of the spin motor controller 40. A main controller 50 for controlling is provided.

The wafer spin device having such a structure is driven as follows.

The wafer is seated on the rotating plate 11, and the edge is clamped by the clamper 12, and the rotating plate 11 is rotated by the spin motor 20. At this time, a liquid such as chemical or DIW is supplied to the wafer for cleaning, or a photoresist is applied.

When vibration occurs in the rotating plate 11 when the rotating plate 11 rotates, the vibration detecting sensor 70 detects this and sends the contents to the sensing controller 80, and the sensing controller 80 converts the frequency waveform into a frequency waveform. To the controller 50.

Then, the main controller 50 compares this with the value of the steady state to adjust the driving of the spin motor 20. That is, the spin motor controller 40 is controlled to regulate the driving of the spin motor, and the controlled spin motor controller 40 stops the spin motor 20 or controls the rotation speed thereof to further vibrate the wafer. Should not occur. Here, the steady state refers to a state in which there is no vibration or a vibration does not affect the breakage of the wafer, and its value varies according to the size of the wafer, and is a value calculated experimentally through a durability test of the wafer.

3 is a flowchart sequentially illustrating a method of controlling a wafer spin apparatus according to an embodiment of the present invention, and sequentially illustrates a control method of controlling the rotation of the rotating plate when vibration occurs during the rotation of the rotating plate on which the wafer is seated.

Referring to the drawing, the wafer spin device control method first detects whether vibration is generated in a rotating plate on which a wafer is seated and rotates (S1).

If vibration occurs, a sensing sensor installed in the body frame detects this and delivers the contents to the sensing controller, and the sensing controller converts it into a frequency waveform (S2) and compares it with a predetermined normal value (S3). ). Here, the value of the steady state is a waveform in which a constant amplitude is repeated periodically, the magnitude of the amplitude refers to a state that does not affect the damage of the wafer even if vibration occurs, the value varies depending on the size of the wafer, and the wafer Refers to a test value obtained by repeating the durability test several times. This steady-state value is a decibel (dB) value, where amplitude represents the strength of the frequency, that is, the strength of vibration generated in the wafer.

If the amplitude of the transformed frequency waveform is less than or equal to the steady-state amplitude value as a result of the comparison in the sensing controller, the vibration generated on the wafer is a digital code of 0 decibels, which means the vibration within the allowable range. In the opposite case, it is output as a digital code of 1 decibel, indicating that vibrations exceed the allowable range.

When the generated vibration exceeds the allowable range, the sensing controller transmits the contents to the main controller, and the received main controller controls the rotation of the spin unit by controlling the driving of the spin motor (S4). Here, the spin control of the spin (S4) to reduce the vibration generated in the spin by reducing the rotational speed of the spin motor, or to stop the rotation of the spin motor to remove the vibration generated in the spin.

According to the wafer spin apparatus having such a vibration sensing unit and a control method thereof, when a vibration that can cause damage to the wafer occurs in the wafer spin apparatus, the wafer can be prevented from being damaged by controlling the rotation of the rotating plate on which the wafer is seated. Can be.

As described above, according to the wafer spin apparatus including the vibration sensing unit of the present invention and a control method thereof, when vibration occurs in the spin unit in which the wafer is seated and rotates, the vibration sensing unit senses this to control the rotation of the spin unit. It provides an effect that can prevent breakage of the wafer.

It is to be understood that the invention is not limited to that described above and illustrated in the drawings and that many more modifications and variations are possible within the scope of the following claims.

Claims (7)

A spin unit installed in the body frame and rotating the wafer by a spin motor; A vibration detector for detecting vibrations generated when the spin unit rotates and converting the vibrations into frequency waveforms; And And a control unit for controlling the rotation of the spin unit in accordance with the waveform of the frequency. The method of claim 1, The vibration detection unit, A detection sensor installed in the body frame to detect vibration generated when the spin unit rotates; And And a sensing controller receiving the sensed vibration and converting the detected vibration into a frequency waveform. The method of claim 2, The sensing sensor is a wafer spin apparatus, characterized in that the acceleration sensor. The method of claim 1, The control unit, A spin motor controller controlling driving of the spin motor; And And a main controller for controlling the operation of the spin motor controller by comparing the waveform of the frequency with a preset value. Sensing vibration of the spin portion on which the wafer is seated; Converting the sensed vibration into a frequency waveform; And And controlling the rotation of the spin unit when the waveform of the frequency exceeds an allowable range of a predetermined value. The method of claim 5, The rotation control of the spin unit reduces the rotation speed of the spin motor which is the driving source of the spin unit. The method of claim 5, The rotation control of the spin unit stops the rotation of the spin motor which is the driving source of the spin unit.

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