JP2007273611A - Apparatus and method for processing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and method for processing a substrate capable of cleaning circumferential edge regions and circumferential end surfaces of both surfaces of a substrate, and easily changing a cleaning width of each of the circumferential edge regions. <P>SOLUTION: The substrate processing apparatus includes a first brush 84 and a second brush 88. The side surface of the tip of the first brush 84 forms a circle pyramid surface and is a cleaning surface 98 abutting on the circumferential edge region 13 and the circumferential end surface 15. On the contrary, the side surface of the tip of the second brush 88 forms a circle pyramid surface and is a cleaning surface 99 abutting on the circumferential edge region 14 and the circumferential end surface 15. The circumferential edge region 13 and the circumferential end surface 15 of the wafer W can be cleaned by allowing the cleaning surface 98 of the first brush 84 to abut on the circumferential edge region 13 and the circumferential end surface 15, and the circumferential edge region 14 and the circumferential end surface 15 of the wafer W can be cleaned by allowing the cleaning surface 99 of the second brush 88 to abut on the edge circumferential region 14 and the circumferential end surface 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for cleaning a substrate. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomasks. Substrate etc. are included.

  In the manufacturing process of a semiconductor device, contamination of the peripheral portion of the semiconductor wafer may have a non-negligible effect on the processing quality of the semiconductor wafer. Specifically, in a so-called batch processing step, a plurality of semiconductor wafers are immersed in a processing solution in a vertical posture. Therefore, if contaminants adhere to the peripheral edge of the semiconductor wafer, the contaminants are treated. There is a risk of diffusing into the liquid and reattaching to the device formation region on the surface of the semiconductor wafer.

For this reason, recently, there is an increasing demand for cleaning the peripheral portion of a substrate such as a semiconductor wafer.
As a prior art regarding the cleaning of the peripheral portion of the substrate, for example, configurations proposed in Patent Documents 1 to 3 can be given.
In Patent Document 1, a configuration is proposed in which a cylindrical brush is provided and the outer peripheral surface of the brush is brought into contact with the peripheral end surface of the substrate while rotating the substrate, thereby removing contamination on the peripheral end surface of the substrate. Yes.

  In Patent Document 2, in a configuration similar to the configuration proposed in Patent Document 1, regardless of the shape of the peripheral end surface of the substrate, contamination of the peripheral end surface of the substrate can be more satisfactorily removed. A cylindrical brush is pressed on the peripheral end surface to bite the peripheral end surface of the substrate into the outer peripheral surface of the brush, or a groove corresponding to the shape of the peripheral end surface of the substrate is formed in the outer peripheral surface of the brush, and the substrate It has been proposed to fit the peripheral end surfaces.

Further, in Patent Document 3, a groove capable of fitting the peripheral edge of the substrate is formed on the outer peripheral surface of the cylindrical brush, and the substrate is rotated in a state where the peripheral edge of the substrate is fitted in the groove. A configuration has been proposed in which each peripheral region on the front and rear surfaces of the substrate (annular region having a predetermined width from each peripheral edge on the front and rear surfaces of the substrate) and the peripheral end surface are cleaned by rotating the brush around its central axis. Yes.
JP 2003-197592 A JP 2003-151943 A US Pat. No. 6550091

However, in the configurations proposed in Patent Documents 1 and 2, since the brush does not contact the peripheral regions on the front and back surfaces of the substrate even if the contamination on the peripheral end surface of the substrate can be removed, the peripheral portions thereof. The contamination of the area cannot be removed.
On the other hand, in the configuration proposed in Patent Document 3, each peripheral region on the front surface and the back surface of the substrate can be cleaned. However, it is not possible to easily change the cleaning width (effective contact width of the brush) in each peripheral region on the front and back surfaces of the substrate. It is conceivable to change the cleaning width in each peripheral region of the front and back surfaces of the substrate by changing the amount of penetration of the peripheral portion of the substrate into the brush groove, but the amount of penetration of the peripheral portion of the substrate into the brush groove is If the amount is small, the brush does not come into contact with the peripheral end surface of the substrate and the peripheral end surface of the substrate cannot be cleaned, so this method cannot be adopted. Therefore, when changing the cleaning width in each peripheral region, it is necessary to replace the brush with one having a different groove depth, which is very laborious.

  Accordingly, an object of the present invention is to clean each peripheral region and peripheral end surface of both surfaces (one surface and the other surface on the opposite side) of the substrate, and to easily change the cleaning width in each peripheral region. A substrate processing apparatus and a substrate processing method are provided.

  In order to achieve the above-mentioned object, the invention according to claim 1 includes a substrate holding mechanism (3) for holding the substrate (W) and a substrate held by the substrate holding mechanism using an elastically deformable material. On the other hand, a first brush (84) formed in a shape that tapers in a direction perpendicular to the surface and inclined with respect to the direction perpendicular to the first brush (84), and a substrate held by the substrate holding mechanism Using a first brush moving mechanism (86, 87) for moving the first brush and an elastically deformable material, it is formed into a shape that tapers toward the opposite side to the one side in the perpendicular direction, A second brush (88) having a cleaning surface (99) inclined with respect to the normal direction, and a second brush moving mechanism (90, 90) for moving the second brush relative to the substrate held by the substrate holding mechanism. 91) and the first The brush moving mechanism and the second brush moving mechanism are controlled so that the cleaning surface of the first brush contacts the peripheral region (13) and the peripheral end surface (15) of the one surface of the substrate held by the substrate holding mechanism. And a control unit (67) for bringing the cleaning surface of the second brush into contact with the peripheral region (14) and the peripheral end surface (15) of the other surface opposite to the one surface of the substrate. A substrate processing apparatus.

In addition, the alphanumeric characters in parentheses represent corresponding components in the embodiments described later. The same applies hereinafter.
According to this configuration, the first brush moving mechanism for moving the first brush is controlled so that the cleaning surface of the first brush comes into contact with the peripheral area and the peripheral end surface of the one surface of the substrate, and the second brush The cleaning surface is brought into contact with the peripheral region and the peripheral end surface of the other surface of the substrate. Thereby, the peripheral area | region of both surfaces of a board | substrate and a peripheral end surface can be wash | cleaned.

  Further, the pressing amount of the cleaning surface of the first brush against the substrate (the amount of elastic deformation of the cleaning surface when the cleaning surface of the first brush is brought into contact with the substrate) is changed, and the peripheral region on the one surface of the substrate and the first region are changed. By changing the effective contact width with the cleaning surface of one brush, the cleaning width in the peripheral region of the one surface of the substrate can be easily changed. Further, the pressing amount of the cleaning surface of the second brush against the substrate (the amount of elastic deformation of the cleaning surface when the cleaning surface of the second brush is brought into contact with the substrate) is changed, and the peripheral region on the other surface of the substrate By changing the effective contact width with the cleaning surface of the two brushes, the cleaning width in the peripheral region of the other surface of the substrate can be easily changed.

According to a second aspect of the present invention, the control unit causes the cleaning surface of the first brush to come into contact with a peripheral area and a peripheral end surface of the one surface of the substrate held by the substrate holding mechanism. The substrate processing apparatus according to claim 1, wherein the cleaning surface is brought into contact with a peripheral region and a peripheral end surface of the other surface of the substrate.
According to this configuration, cleaning of the peripheral region and peripheral end surface of the one surface of the substrate with the first brush and cleaning of the peripheral region and peripheral end surface of the other surface of the substrate with the second brush can be simultaneously achieved. Therefore, compared with the case where these cleanings are performed at different timings, it is possible to clean the peripheral region and the peripheral end surface of both surfaces of the substrate in a short time.

According to a third aspect of the present invention, the first brush has a rotationally symmetric shape around a central axis extending in the perpendicular direction, and the first brush rotates to rotate the first brush around the central axis. The substrate processing apparatus according to claim 1, further comprising a mechanism (32).
According to this configuration, the first brush is rotated by the first brush rotating mechanism in a state where the cleaning surface of the first brush is pressed against the peripheral area and the peripheral end surface of the one surface of the substrate, thereby The peripheral region and the peripheral end surface can be scrubbed. Therefore, the peripheral region and the peripheral end surface on the one surface of the substrate can be more satisfactorily cleaned.

According to a fourth aspect of the present invention, the second brush has a rotationally symmetric shape around a central axis extending in the perpendicular direction, and the second brush rotates to rotate the second brush around the central axis. 4. The substrate processing apparatus according to claim 1, further comprising a mechanism (32).
According to this configuration, the second brush is rotated by the second brush rotating mechanism in a state where the cleaning surface of the second brush is pressed against the peripheral region and the peripheral end surface of the other surface of the substrate, thereby The peripheral region and the peripheral end surface can be scrubbed. Therefore, the peripheral region and the peripheral end surface of the other surface of the substrate can be cleaned more satisfactorily.

The invention according to claim 5 is a first relative movement mechanism (3) that relatively moves the substrate held by the substrate holding mechanism and the first brush so that the first brush moves in a circumferential direction of the substrate. 9) The substrate processing apparatus according to any one of claims 1 to 4, further comprising: 9).
According to this structure, the peripheral area | region and peripheral end surface of the one surface of a board | substrate can be efficiently wash | cleaned by the relative movement of a 1st brush and a board | substrate.

According to a sixth aspect of the present invention, there is provided a second relative movement mechanism (3) for relatively moving the substrate held by the substrate holding mechanism and the second brush so that the second brush moves in a circumferential direction of the substrate. 9) The substrate processing apparatus according to claim 1, further comprising: 9).
According to this structure, the peripheral area | region and peripheral end surface of the other surface of a board | substrate can be efficiently wash | cleaned by the relative movement of a 2nd brush and a board | substrate.

The invention according to claim 7 is a processing liquid supply mechanism (4, 5, 10, 11, 11) for supplying a processing liquid to an area inside the peripheral area of at least the one surface of the substrate held by the substrate holding mechanism. The substrate processing apparatus according to claim 1, further comprising: 12).
According to this configuration, it is possible to wash away the contamination in the region inside the peripheral region on the one surface of the substrate with the processing liquid.

  According to an eighth aspect of the present invention, there is provided a substrate holding step of holding the substrate (W) by the substrate holding mechanism (3), and toward one side in a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism. A substrate having a cleaning surface (98) formed in a tapered shape and having a cleaning surface (98) inclined with respect to the perpendicular direction is moved, and the cleaning surface of the first brush is held by the substrate holding mechanism In parallel with the one-side contact step (T5) for contacting the peripheral region (13) and the peripheral end surface (15) of the one surface of the first surface, opposite to the one side in the perpendicular direction A second brush (88) having a cleaning surface (99) formed in a shape that tapers toward the side and inclined with respect to the normal direction is moved, and the cleaning surface of the second brush is moved to the substrate holding mechanism. Said one surface of the held substrate Characterized in that it comprises a second side abutting step of abutting the peripheral region (14) and the peripheral surface of the opposite side of the other surface (15) (T5), a substrate processing method.

According to this method, in the one-side contact step, the cleaning surface of the first brush is in contact with the peripheral area and the peripheral end surface of one surface of the substrate, and in the other-side contact step, the cleaning surface of the second brush Is brought into contact with the peripheral region and the peripheral end surface of the other surface of the substrate. Thereby, the peripheral area | region and peripheral end surface of both surfaces (one surface and the other surface) of a board | substrate can be wash | cleaned.
In addition, since the one-side contact step and the other-side contact step are performed in parallel, cleaning of the peripheral area and peripheral end surface of the one surface of the substrate with the first brush, and peripheral edge of the other surface of the substrate with the second brush The cleaning of the region and the peripheral end surface can be achieved simultaneously. Therefore, compared with the case where these cleanings are performed at different timings, it is possible to clean the peripheral region and the peripheral end surface of both surfaces of the substrate in a short time.

  Further, the pressing amount of the cleaning surface of the first brush against the substrate (the amount of elastic deformation of the cleaning surface when the cleaning surface of the first brush is brought into contact with the substrate) is changed, and the peripheral region on the one surface of the substrate and the first region are changed. By changing the effective contact width with the cleaning surface of one brush, the cleaning width in the peripheral region of the one surface of the substrate can be easily changed. On the other hand, the amount of pressing of the cleaning surface of the second brush against the substrate (the amount of elastic deformation of the cleaning surface when the cleaning surface of the second brush is brought into contact with the substrate) is changed to By changing the effective contact width with the cleaning surface of the two brushes, the cleaning width in the peripheral region of the other surface of the substrate can be easily changed.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic side view of the inside of the substrate processing apparatus shown in FIG.
The substrate processing apparatus 81 is a single-wafer type apparatus that processes a semiconductor wafer W (hereinafter simply referred to as “wafer W”) as an example of a substrate one by one. A spin chuck 3 for rotating the wafer W while maintaining the wafer W substantially horizontally in the processing chamber 2 and a surface nozzle 4 for supplying a processing liquid to the surface of the wafer W (the surface on which the device is formed). A back surface nozzle 5 for supplying a processing liquid to the back surface of the wafer W, a first brush mechanism 82 for cleaning the peripheral region 13 and the peripheral end surface 15 on the front surface of the wafer W, and a peripheral region on the back surface of the wafer W 14 and a second brush mechanism 83 for cleaning the peripheral end face 15.

  The spin chuck 3 is a vacuum chuck, and is attached to the upper end of the spin shaft 7 extending in a substantially vertical direction, and the back surface (lower surface) of the wafer W in a substantially horizontal posture. An adsorption base 8 for adsorbing and holding, and a spin motor 9 having a rotation shaft coupled coaxially with the spin shaft 7 are provided. Accordingly, when the spin motor 9 is driven in a state where the back surface of the wafer W is sucked and held by the suction base 8, the wafer W rotates around the central axis of the spin shaft 7.

  Treatment liquid supply pipes 10 and 11 are connected to the front surface nozzle 4 and the back surface nozzle 5, respectively. A processing liquid from a processing liquid supply source (not shown) is supplied to these processing liquid supply pipes 10 and 11 via a processing liquid valve 12. The surface nozzle 4 discharges the processing liquid supplied through the processing liquid supply pipe 10 toward the center of the surface of the wafer W held by the spin chuck 3. The back nozzle 5 discharges the processing liquid supplied through the processing liquid supply pipe 11 between the peripheral edge of the back surface of the wafer W held by the spin chuck 3 and the suction base 8.

Note that pure water is used as the treatment liquid. In addition to pure water, functional water such as carbonated water, ionic water, ozone water, reduced water (hydrogen water) or magnetic water may be used, or ammonia water or a mixture of ammonia water and hydrogen peroxide water. A chemical solution such as a liquid can also be used.
The first brush mechanism 82 includes a first brush 84 for cleaning the peripheral region 13 and the peripheral end surface 15 on the surface of the wafer W, a first swing arm 85 that holds the first brush 84 at the tip, A first swing drive mechanism 86 that swings the first swing arm 85 in the horizontal direction about a vertical axis set outside the rotation range of the wafer W, and a first lift drive mechanism that moves the first swing arm 85 up and down. 87.

  The second brush mechanism 83 includes a second brush 88 for cleaning the peripheral region 14 and the peripheral end surface 15 on the back surface of the wafer W, a second swinging arm 89 holding the second brush 88 at the tip, A second swing drive mechanism 90 that swings the second swing arm 89 in the horizontal direction around a vertical axis set outside the rotation range of the wafer W, and a second lift drive mechanism that moves the second swing arm 89 up and down. 91.

In this embodiment, the peripheral regions 13 and 14 are annular regions having a width of 1 to 4 mm from the peripheral edge of the wafer W. Further, the peripheral portion of the wafer W refers to a portion including the peripheral region 13 on the front surface of the wafer W, the peripheral region 14 on the back surface, and the peripheral end surface 15.
FIG. 3 is a cross-sectional view showing the configuration of the first brush 84.
The first brush 84 and the second brush 88 have the same configuration, and are held by the first swing arm 85 and the second swing arm 89, respectively, in a state where they are inverted from each other. In the following, for the sake of simplicity, the configuration of the first brush 84 will be mainly described, and reference numerals of portions corresponding to the respective portions of the first brush 84 in the second brush 88 will be referred to for the respective portions of the first brush 84. Append to the code in parentheses.

  The first brush 84 (second brush 88) is made of, for example, a sponge material such as PVA (polyvinyl alcohol), and is provided on a substantially disk-shaped base 92 (93) and one surface of the base 92 (93). A substantially disc-shaped (flat columnar) body 94 (95) having a smaller diameter than the base 92 (93), and a substantially conical tip 96 (97) provided at the tip of the body 94. And integrated. The base portion 92 (93), the body portion 94 (95), and the tip portion 96 (97) have the same center axis, and the first brush 84 has a rotationally symmetric shape around the center axis. . The side surface of the front end portion 96 (97) forms a conical surface continuous with the side surface of the body portion 94 (95), and the cleaning surface 98 (99) that contacts the peripheral region 13 (14) and the peripheral end surface 15 of the wafer W. It has become.

  The first brush 84 (second brush 88) is held by the brush holder 100, and a holder mounting portion 36 (to be described later) of the first swing arm 85 (second swing arm 89) is passed through the brush holder 100. It is attached. The brush holder 100 includes a substantially cylindrical resin block 101 and a fixing member 102 for fixing the first brush 84 (second brush 88) to the resin block 101.

  A fitting groove 103 having a substantially rectangular cross section is formed on the entire peripheral surface of one end of the resin block 101. In addition, a cut groove 104 having a substantially U-shaped cross section is formed in the circumferential direction at one end portion of the resin block 101 at a position spaced apart from the fitting groove 103 radially inward. . Thereby, the part between the fitting groove | channel 103 and the notch groove 104 becomes the elastic piece 105 to which the elasticity by the flexibility of resin was provided. A plurality of hemispherical engagement protrusions 106 are formed on the outer peripheral surface of the elastic piece 105. On the other hand, a flat cylindrical screw portion 107 is integrally formed on the other end surface of the resin block 101. A screw that can be screwed with a screw formed on the holder mounting portion 36 is cut on the peripheral surface of the screw portion 107.

  The fixing member 102 is integrally provided with a disc portion 108 having a substantially circular outer shape and a substantially cylindrical cylindrical portion 109 extending from the periphery of the disc portion 108 to one side. An insertion hole 110 through which the body 94 (95) of the first brush 84 (second brush 88) can be inserted is formed at the center of the disc portion 108. The inner diameter of the cylindrical portion 109 substantially coincides with the outer diameter of the base 92 (93) of the first brush 84 (second brush 88), and the elastic piece 105 is in a state where no external force is applied to the elastic piece 105. It is formed slightly smaller than the outer diameter. Furthermore, a plurality of engaging recesses 111 that can be engaged with the respective engaging protrusions 106 are formed on the inner peripheral surface of the cylindrical portion 109.

  When the first brush 84 (second brush 88) is attached to the holder attachment portion 36, the first brush 84 (second brush 88) is attached to the fixing member 102, and the trunk portion 94 (95) is inserted into the insertion hole 110. The base 92 (93) is mounted so as to be accommodated in the cylindrical portion 109. Thereafter, the cylindrical portion 109 of the fixing member 102 is fitted into the fitting groove 103 of the resin block 101, and the engagement protrusions 106 and the engagement recesses 111 are engaged. Thus, the first brush 84 (second brush 88) is held by the brush holder 100. Then, the screw portion 107 of the brush holder 100 is screwed to the holder attachment portion 36, whereby the attachment of the first brush 84 (second brush 88) to the holder attachment portion 36 is achieved.

FIG. 4 is a cross-sectional view showing the configuration of the first swing arm 85.
The first swing arm 85 is disposed in an inner space formed by the lower casing 30, the upper casing 31 fitted to the lower casing 30, the lower casing 30 and the upper casing 31, and the first brush 84 extends vertically. A brush rotation mechanism 32 for rotating (spinning) around the axis, and an inner space formed by the lower casing 30 and the upper casing 31, and a first brush 84 in the vertical direction with respect to the peripheral region 13 on the surface of the wafer W. And a pressing pressure holding mechanism 33 for holding the pressing pressure (pressure when pressing the first brush 84 against the peripheral region 13) at a preset pressing pressure.

  An upper end portion of an arm support shaft 34 extending in the vertical direction is coupled to one end portion (base end portion) of the lower casing 30. A driving force of the first swing driving mechanism 86 (see FIG. 2) is input to the arm support shaft 34. By inputting the driving force of the first swing drive mechanism 86 to the arm support shaft 34 and reciprocatingly rotating the arm support shaft 34, the first swing arm 85 can be swung around the arm support shaft 34. it can. A first elevating drive mechanism 87 (see FIG. 2) is coupled to the arm support shaft 34, and the arm support shaft 34 is moved up and down by the first elevating drive mechanism 87 so as to be integrated with the arm support shaft 34. Thus, the first swing arm 85 can be moved up and down.

A rotating shaft 35 extending in the vertical direction is provided at the other end portion (free end portion) of the lower casing 30 so as to be rotatable and vertically movable. The rotating shaft 35 has a lower end protruding downward from the other end portion of the lower casing 30, and an upper end reaching the vicinity of the center of the upper casing 31 in the vertical direction.
A holder attachment portion 36 to which the brush holder 100 is attached is provided at a lower end portion protruding from the lower casing 30 of the rotation shaft 35. The holder mounting portion 36 includes a disc-shaped upper surface portion 37 through which the rotation shaft 35 is inserted and fixed to the rotation shaft 35, and a cylindrical side surface portion 38 that extends downward from the periphery of the upper surface portion 37. Is integrated. A screw is cut on the inner peripheral surface of the side surface portion 38, and the screw holder 100 is screwed into the screw mounting portion 107 of the brush holder 100, whereby the brush holder 100 is attached to the holder mounting portion 36. Can be attached.

In addition, a lower guide roller support member 39, an upper guide roller support member 40, and a spring locking member 41 are externally fitted to the rotation shaft 35.
The lower guide roller support member 39 is externally fitted to the rotary shaft 35 in a non-contact state with a small gap between the lower guide roller support member 39 and the peripheral surface of the rotary shaft 35. The lower guide roller support member 39 has a rotationally symmetric shape around the central axis of the rotary shaft 35, and the other end of the lower casing 30 via two bearings 42 spaced from each other. The part is supported rotatably. Further, the upper end portion of the lower guide roller support member 39 is formed in a cylindrical shape having a smaller diameter than the lower portion thereof, and a pulley 54 (to be described later) of the brush rotation mechanism 32 is relatively rotated on the upper end portion of the cylindrical shape. It is impossible to fit outside.

The upper guide roller support member 40 is provided above the lower guide roller support member 39. The upper guide roller support member 40 is externally fitted to the rotary shaft 35 in a non-contact state with a small gap between the upper guide roller support member 40 and the peripheral surface of the rotary shaft 35, and is connected to the pulley 54 by a bolt 43.
The spring locking member 41 is provided above the upper guide roller support member 40 at a distance from the upper guide roller support member 40 and is fixed to the rotation shaft 35. One end (upper end) of the coil spring 44 is locked to the spring locking member 41. The coil spring 44 is interposed between the spring locking member 41 and the upper guide roller support member 40, and the other end (lower end) is locked to the upper guide roller support member 40.

  A pair of guide rollers 45 and 46 are supported on the lower guide roller support member 39 and the upper guide roller support member 40, respectively. Each guide roller 45, 46 is rotatably provided with an axis extending in a direction orthogonal to the rotation shaft 35 as a fulcrum, and is arranged so that its peripheral surface is in contact with the peripheral surface of the rotation shaft 35. Thereby, the vertical movement of the rotating shaft 35 can be guided by the guide rollers 45 and 46, and the resistance at the time of the vertical movement can be reduced.

On the other hand, a bearing 47 is fitted on the upper end portion of the rotating shaft 35, and a cap-shaped contact member 48 is provided via the bearing 47 so as to be rotatable relative to the rotating shaft 35.
A gap between the outer peripheral surface of the lower guide roller support member 39 and the lower casing 30 is sealed with a magnetic fluid seal 49. Further, the inner peripheral surface of the lower guide roller support member 39 and the rotary shaft 35 are sealed with a bellows 50. Thereby, the atmosphere containing the processing liquid and the cleaning liquid infiltrates into the internal space formed by the lower casing 30 and the upper casing 31, and the dust generated in the internal space diffuses into the processing chamber 2 between them. Is prevented.

  The brush rotation mechanism 32 is fixed to the output shaft 51 of the brush motor 52 and the brush motor 52 provided at the position near the base end in the upper casing 31 so that the output shaft 51 extends vertically downward. A pulley 53 that is externally fitted to the lower guide roller support member 39, and a belt 55 that is wound around the pulley 53 and the peripheral surface of the pulley 54 in common. Thus, when the brush motor 52 is driven, the rotational force from the brush motor 52 is transmitted to the pulley 54 via the pulley 53 and the belt 55, and the lower guide roller support member 39 and the upper guide roller support together with the pulley 54. The member 40 rotates. As the upper guide roller support member 40 rotates, the coil spring 44 and the spring locking member 41 rotate. As a result, the rotating shaft 35 rotates and the first brush 84 attached to the lower end of the rotating shaft 35 rotates.

  The pressing pressure holding mechanism 33 includes an air cylinder 56 disposed above the contact member 48. The air cylinder 56 is disposed so that the rod 57 is directed downward and the rod 57 advances and retreats in the vertical direction. More specifically, a support plate 58 that is substantially L-shaped in side view extends upward from the bottom surface of the lower casing 30, and a cylinder that extends upward of the contact member 48 is provided on the support plate 58. A mounting plate 59 is supported. The air cylinder 56 is fixed to the upper surface of the cylinder mounting plate 59, and its rod 57 is inserted into a rod insertion hole 60 formed in the cylinder mounting plate 59. The lower end of the rod 57 is in contact with the contact member 48.

  The inside of the air cylinder 56 is divided into two spaces in the forward / backward direction (vertical direction) of the rod 57 by a piston (not shown) fixed to the base end of the rod 57. A first air supply pipe 61 in which a metering valve (not shown) is interposed is connected to the space on the rod 57 side with respect to the piston. On the other hand, a second air supply pipe 63 in which a relief valve 62 (see FIG. 4) capable of setting and changing the relief pressure is connected to the space opposite to the rod 57 with respect to the piston. When the relief pressure of the relief valve 62 is increased, the pressure of the air supplied from the second air supply pipe 63 to the air cylinder 56 increases, and the rod 57 advances from the air cylinder 56. Conversely, when the relief pressure of the relief valve 62 is lowered, the pressure of the air supplied from the second air supply pipe 63 to the air cylinder 56 is lowered, and the pressure of the air supplied from the first air supply pipe 61 to the air cylinder 56 is reduced. The rod 57 is retracted to the air cylinder 56 by the biasing force of the coil spring 44.

The support plate 58 supports a sensor mounting plate 64 extending toward the opposite side of the cylinder mounting plate 59. A strain gauge type pressure sensor 65 is mounted on the upper surface of the sensor mounting plate 64.
On the other hand, a pressing pressure detecting arm 66 is fixed to the contact member 48. The pressing pressure detection arm 66 extends from the contact member 48 toward the upper side of the pressure sensor 65, and the air cylinder with respect to the pressure sensor 65 in a state where the first brush 84 is not in contact with the wafer W. The rotating shaft 35 is brought into contact with the lowering pressure 56 (corresponding to the pressing force of the first brush 84 in the vertical direction against the peripheral region 13 on the surface of the wafer W). As a result, the pressure sensor 65 can detect the downward pressure in the vertical direction of the rotating shaft 35 by the air cylinder 56.

The second swing arm 89 has a configuration in which the first swing arm 85 is turned upside down. Therefore, detailed description of the second swing arm 89 is omitted, and in the following description, portions corresponding to the respective portions of the first swing arm 85 in the second swing arm 89 are referred to as the same portions. Use a sign.
FIG. 5 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 81.

  The substrate processing apparatus 81 includes a control unit 67 including a microcomputer. Detection signals from the pressure sensors 65 of the first brush mechanism 82 and the second brush mechanism 83 are input to the control unit 67. The controller 67 is connected to a recipe input key 68 for the user to input a process recipe (various conditions for processing the wafer W). Further, the control unit 67 includes a spin motor 9, a processing liquid valve 12, a first swing drive mechanism 86, a first lift drive mechanism 87, a second swing drive mechanism 90, a second lift drive mechanism 91, and a first brush. The brush motors 52 of the mechanism 82 and the second brush mechanism 83 and the relief valves 62 of the first brush mechanism 82 and the second brush mechanism 83 are connected as control targets.

FIG. 6 is a process diagram for explaining the processing of the wafer W in the substrate processing apparatus 81. FIG. 7 is a side view showing the state of the first brush 84 and the second brush 88 during the processing of the wafer W.
Prior to processing the wafer W, the user operates the recipe input key 68 to press the first brush 84 in the vertical direction against the peripheral region 13 on the front surface of the wafer W and to the peripheral region 14 on the back surface of the wafer W. The pressing force of the second brush 88 in the vertical direction is input. In accordance with the input from the recipe input key 68, the control unit 67 sets the relief pressure of each relief valve 62 of the first brush mechanism 82 and the second brush mechanism 83 (step T1: push pressure setting). Specifically, in a state in which the first brush 84 is not in contact with the wafer W, the pressure sensor arm 66 is in contact with the pressure sensor 65 in the first brush mechanism 82. It is possible to detect the pressure of the cylinder 56 that pushes the rotating shaft 35 downward in the vertical direction. The control unit 67 changes the relief pressure of the relief valve 62 of the first brush mechanism 82, and the first brush 84 input from the pressure-down pressure detected by the pressure sensor 65 of the first brush mechanism 82 and the recipe input key 68. When the pressures coincide with each other, the relief pressure at this time is set as the relief pressure of the relief valve 62 of the first brush mechanism 82 when the wafer W is processed. Similarly, the control unit 67 sets the relief pressure of the relief valve 62 of the second brush mechanism 83.

  Thereafter, the wafer W is loaded into the processing chamber 2 (step T2), and when the wafer W is held by the spin chuck 3, the spin motor 9 is controlled by the controller 67, and the rotation of the wafer W by the spin chuck 3 is performed. Is started (step T3). Next, the processing liquid valve 12 is opened by the controller 67, and supply of the processing liquid from the front surface nozzle 4 and the back surface nozzle 5 to the front surface and the back surface of the wafer W is started (step T4).

Further, the controller 67 controls the brush motors 52 of the first brush mechanism 82 and the second brush mechanism 83, and the first brush 84 and the second brush 88 are rotated in the same direction as the rotation direction of the wafer W, respectively. .
Thereafter, the control unit 67 controls the first swing drive mechanism 86 and the first lift drive mechanism 87 so that the cleaning surface 98 of the first brush 84 is brought into contact with the peripheral region 13 and the peripheral end surface 15 on the surface of the wafer W. The In parallel with this, the control unit 67 controls the second swing drive mechanism 90 and the second elevating drive mechanism 91 so that the cleaning surface 99 of the second brush 88 and the peripheral region 14 on the back surface of the wafer W It abuts on the end face 15 (step T5). The cleaning surface 98 of the first brush 84 and the cleaning surface 99 of the second brush 88 are brought into contact with the wafer W at substantially symmetrical positions with the center therebetween.

  Specifically, first, the first raising / lowering drive mechanism 87 is controlled to raise or lower the first brush 84 so that the cleaning surface 98 of the first brush 84 faces the peripheral end surface 15 of the wafer W. Next, the first swing drive mechanism 86 is controlled, the first swing arm 85 is turned, and the first brush 84 is moved horizontally, whereby the peripheral portion of the wafer W is placed on the cleaning surface 98 of the first brush 84. As shown in FIG. 13, the cleaning surface 98 of the first brush 84 is pressed against the peripheral region 13 and the peripheral end surface 15 of the surface of the wafer W. In parallel with the movement of the first brush 84, the second lifting / lowering drive mechanism 91 is controlled so that the cleaning surface 99 of the second brush 88 faces the peripheral end surface 15 of the wafer W. Goes up or down. Next, the second swinging drive mechanism 90 is controlled, the second swinging arm 89 rotates, and the second brush 88 moves horizontally, so that the peripheral portion of the wafer W is placed on the cleaning surface 99 of the second brush 88. As shown in FIG. 13, the cleaning surface 99 of the second brush 88 is pressed against the peripheral region 14 and the peripheral end surface 15 on the back surface of the wafer W. Thus, the peripheral regions 13 and 14 and the peripheral end surface 15 on the front and back surfaces of the wafer W are simultaneously cleaned.

  At this time, the first brush 84 is applied to the peripheral region 13 on the surface of the wafer W with the pressing pressure set by the recipe input key 68 by the action of the pressing pressure holding mechanism 33 provided in the first swing arm 85. Pressed. Accordingly, the peripheral end surface 15 of the wafer W can be cleaned, and the peripheral region 13 on the surface of the wafer W can be cleaned with a cleaning width corresponding to the pressing force of the first brush 84. Further, the second brush 88 is pressed against the peripheral area 14 on the back surface of the wafer W with the pressing pressure set from the recipe input key 68 by the action of the pressing pressure holding mechanism 33 provided in the second swing arm 89. It is done. Accordingly, the peripheral end surface 15 of the wafer W can be cleaned, and the peripheral region 14 on the back surface of the wafer W can be cleaned with a cleaning width corresponding to the pressing pressure of the second brush 88.

Further, while the peripheral edge portion of the wafer W is being cleaned in this way, the contamination attached to the central region (device forming region) on the surface of the wafer W can be washed away by the processing liquid supplied to the surface of the wafer W.
When a predetermined time has elapsed from the start of cleaning by the first brush 84 and the second brush 88, the control unit 67 causes the first swing drive mechanism 86, the first lift drive mechanism 87, the second swing drive mechanism 90, and the second lift. The drive mechanism 91 is controlled, and the first brush 84 and the second brush 88 are retracted to the home position before the start of processing (step T6). Further, while the first brush 84 and the second brush 88 are respectively returned to the home position, the brush motors 52 of the first brush mechanism 82 and the second brush mechanism 83 are stopped, and the first brush 84 and the second brush. The rotation of 88 is stopped. Further, the processing liquid valve 12 is closed by the controller 67, and the supply of the processing liquid from the front surface nozzle 4 and the back surface nozzle 5 is stopped (step T7).

Thereafter, the spin motor 9 is controlled by the controller 67, and the wafer W is rotated at a high speed (eg, 3000 rpm) (step T8). Thereby, the processing liquid adhering to the wafer W can be shaken off and the wafer W can be dried.
When the high-speed rotation of the wafer W is continued for a predetermined time, the spin motor 9 is stopped, and the rotation of the wafer W by the spin chuck 3 is stopped (step T9). Then, after the wafer W is stopped, the processed wafer W is unloaded from the processing chamber 2 (step T10).

As described above, the cleaning surface 98 of the first brush 84 can be brought into contact with the peripheral region 13 and the peripheral end surface 15 on the surface of the wafer W, and the peripheral region 13 and the peripheral end surface 15 can be cleaned. The cleaning surface 99 of the two brushes 88 can be brought into contact with the peripheral region 14 and the peripheral end surface 15 on the back surface of the wafer W to clean the peripheral region 14 and the peripheral end surface 15.
Further, by operating the recipe input key 68 to change the pressing pressure of the first brush 84 against the peripheral area 13 on the surface of the wafer W, the pressing amount of the first brush 84 in the vertical direction against the peripheral area 13 (wafer) The amount of elastic deformation in the vertical direction of the cleaning surface 98 when the cleaning surface 98 of the first brush 84 is brought into contact with W can be changed, and accordingly, the peripheral region 13 and the first brush 84 can be changed. The effective contact width with the cleaning surface 98 can be changed. Therefore, the cleaning width in the peripheral region 13 on the surface of the wafer W can be easily changed.

  On the other hand, by operating the recipe input key 68 and changing the pressing force of the second brush 88 in the vertical direction against the peripheral area 14 on the back surface of the wafer W, the pressing amount of the second brush 88 against the peripheral area 14 (wafer) The amount of elastic deformation in the vertical direction of the cleaning surface 99 when the cleaning surface 99 of the second brush 88 is brought into contact with W can be changed, and accordingly, the peripheral region 14 and the second brush 88 are The effective contact width with the cleaning surface 99 can be changed. Therefore, the cleaning width in the peripheral region 14 on the back surface of the wafer W can be easily changed.

Further, the cleaning of the peripheral region 13 and the peripheral end surface 15 on the front surface of the wafer W by the first brush 84 and the cleaning of the peripheral region 14 and the peripheral end surface 15 of the back surface of the wafer W by the second brush 88 are performed in parallel. Compared with the case where these steps are performed at different timings, the peripheral regions 13 and 14 and the peripheral end surface 15 on both surfaces of the wafer W can be cleaned in a short time.
The cleaning of the peripheral region 13 and the peripheral end surface 15 on the front surface of the wafer W with the first brush 84 and the cleaning of the peripheral region 14 and the peripheral end surface 15 on the back surface of the wafer W with the second brush 88 are performed at different timings. It may be broken.

In addition, while the first brush 84 and the second brush 88 are in contact with the wafer W, the wafer W is rotated by the spin chuck 3 so that the first brush 84 and the second brush 88 and the peripheral portion of the wafer W are relative to each other. The peripheral edge of the wafer W can be efficiently cleaned.
Further, while the first brush 84 and the second brush 88 are in contact with the wafer W, the first brush 84 and the second brush 88 are rotated in the same direction as the wafer W. As a result, the peripheral edge of the wafer W can be scrubbed, and the peripheral edge of the wafer W can be cleaned more satisfactorily. The rotation direction of the first brush 84 and the second brush 88 may be opposite to the rotation direction of the wafer W. However, when the rotation direction is the same as the rotation direction of the wafer W, the wafer W and the first brush 84 and Since the second brush 88 can be rubbed with each other, higher quality cleaning can be achieved.

  Further, in this substrate processing apparatus 81, the pressing pressure provided to the first swing arm 85 while the cleaning surface 98 of the first brush 84 is in contact with the peripheral region 13 and the peripheral end surface 15 of the surface of the wafer W. By the action of the holding mechanism 33, the pressing force of the first brush 84 in the vertical direction against the peripheral region 13 on the surface of the wafer W is held at a preset pressing pressure. Therefore, even if the wafer W is warped and deformed, the peripheral region 13 and the peripheral end surface 15 on the surface of the wafer W are excellent without causing uneven cleaning and unevenness in the peripheral width 13 of the peripheral region 13 on the surface of the wafer W. Can be washed.

Further, while the cleaning surface 99 of the second brush 88 is in contact with the peripheral region 14 and the peripheral end surface 15 on the back surface of the wafer W, the pressing pressure holding mechanism 33 provided in the second swing arm 89 works. The pressing force of the second brush 88 in the vertical direction against the peripheral region 14 on the back surface of the wafer W is held at a preset pressing force. Therefore, even if the wafer W is warped and deformed, the peripheral region 14 and the peripheral end surface 15 on the back surface of the wafer W are excellent without causing uneven cleaning and nonuniform cleaning width in the peripheral region 14 on the back surface of the wafer W. Can be washed.
<Cleaning effect confirmation test>
FIG. 8 is a graph showing the results of a test for confirming the cleaning effect of various shapes of brushes.

  The present inventors made four types of brushes A, B, C, and D using PVA, and used these brushes A to D as brush scrubbers manufactured by Dainippon Screen Mfg. Co., Ltd. (trade name “ SS-3000 ") was selectively mounted, and the peripheral portion of the wafer W was cleaned with each of the brushes A to D with this brush scrubber. Before and after this cleaning, the number of particles adhering to the peripheral region 13 on the front surface of the wafer W, the peripheral region 14 on the back surface, and the peripheral end surface 15 is measured by an edge inspection machine manufactured by Raytex Co., Ltd. ). The counting result (Pre) before cleaning is shown by a hatched bar graph in FIG. 8, and the counting result (Post) after cleaning is shown by a cross-hatched bar graph in FIG. Further, the particle removal rate (PRE) calculated from the counting results before and after cleaning is shown by a line graph in FIG. The particle removal rate (PRE) = (Pre−Post) ÷ Pre × 100 (%) is derived.

The brush A is a cylindrical brush that is disposed on the side of the wafer W and has a central axis parallel to an axis orthogonal to the surface of the wafer W. In cleaning using the brush A, the side surface of the brush A is disposed on the wafer W. Was pressed against the peripheral end surface 15 of the. The particle removal rate by this washing was about 20%.
The brush B is a disc-shaped brush whose lower surface faces the peripheral region 13 on the surface of the wafer W and is arranged substantially parallel to the surface of the wafer W. In cleaning using the brush B, the lower surface of the brush B is removed. The wafer W was pressed against the peripheral area 13 on the surface from above. However, the particles were hardly removed, and the particle removal rate by this washing was almost 0%.

The brush C is a cylindrical brush that is disposed on the side of the wafer W and has a groove that can fit the wafer W on the peripheral surface (see Patent Document 3). In cleaning using the brush C, the brush C The peripheral edge of the wafer W was fitted into the groove. The particle removal rate by this cleaning was about 10%.
The brush D is two brushes each having the same shape as the first brush 84 and the second brush 88 according to the above-described embodiment, and in the cleaning using these brushes D, as in the above-described embodiment, The peripheral region 13 on the front surface of the wafer W, the peripheral region 14 on the back surface, and the peripheral end surface 15 were cleaned. The particle removal rate by this cleaning was about 80%.

From this result, the brush D corresponding to the first brush 84 and the second brush 88 is compared with the conventional brushes A to C, the peripheral region 13 on the front surface of the wafer W, the peripheral region 14 and the peripheral region on the back surface. It is understood that the performance of cleaning the end face 15 is high.
FIG. 9 is a graph showing the relationship between the pressing force of the first brush 84 and the contact width of the brush 16 in the peripheral region 13 on the surface of the wafer W.

The brush 84 was impregnated with a photoresist, and the first brush 84 was pressed against the peripheral edge of the wafer W with a predetermined pressing pressure. Then, the width of the photoresist attached to the peripheral region 13 on the surface of the wafer W was measured. The inclination angle of the cleaning surface 98 of the first brush 84 is 45 degrees as described above. The result is shown as a line graph in FIG.
That is, when the pressing force of the first brush 84 is 1 [relative pressure value], the contact width of the first brush 84 in the peripheral region 13 on the surface of the wafer W is about 1.2 mm. When the pressing pressure of the first brush 84 was 2 [relative pressure value], the contact width of the first brush 84 in the peripheral region 13 on the surface of the wafer W was about 1.8 mm. When the pressing force of the first brush 84 was 3 [relative pressure value], the contact width of the first brush 84 in the peripheral region 13 on the surface of the wafer W was about 2.4 mm. Here, the relative pressure value is a relative pressure value when the predetermined pressure value of the pressing pressure is 1.

  From this result, it is understood that the pressing pressure of the first brush 84 and the contact width of the first brush 84 have a substantially direct relationship. Therefore, it is understood that the cleaning width in the peripheral region 13 on the surface of the wafer W can be controlled well by the pressing pressure of the first brush 84. From this result, it is expected that the cleaning width in the peripheral region 14 on the back surface of the wafer W can be well controlled by the pressing pressure of the second brush 88 as well as the first brush 88.

As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented with another form. For example, while the first brush 84 and the second brush 88 are in contact with the wafer W, the first brush 84 and the second brush 88 may be stopped without rotating.
Further, the configuration in which the first brush 84 and the second brush 88 and the peripheral portion of the wafer W are relatively moved by rotating the wafer W is taken as an example, but for example, when a rectangular substrate is a processing target. The substrate may be stationary and the brush may be moved along the peripheral edge of the substrate. Of course, the brush may be relatively moved along the peripheral edge of the substrate by moving both the substrate and the brush.

  In addition, various design changes can be made within the scope of matters described in the claims.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on one Embodiment of this invention. FIG. 2 is a schematic side view of the inside of the substrate processing apparatus shown in FIG. 1. It is sectional drawing which shows the structure of a 1st brush. It is sectional drawing which shows the structure of a rocking | fluctuating arm. It is a block diagram for demonstrating the electrical structure of the substrate processing apparatus shown in FIG. It is process drawing for demonstrating the process in the substrate processing apparatus shown in FIG. It is a side view which shows the state of the 1st brush and 2nd brush in process. It is a graph which shows the result of the test for confirming the cleaning effect by the brush of various shapes. It is a graph which shows the relationship between the pressing pressure of a brush and the contact width (cleaning width) of the brush in the peripheral area | region of the surface of a wafer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Spin chuck 4 Front surface nozzle 5 Back surface nozzle 9 Spin motor 10 Processing liquid supply pipe 11 Processing liquid supply pipe 12 Processing liquid valve 32 Brush rotation mechanism 67 Control part 84 1st brush 88 2nd brush 90 2nd rocking drive mechanism 91 1st 2 Lifting drive mechanism 98 Cleaning surface 99 Cleaning surface W Wafer

Claims (8)

A substrate holding mechanism for holding the substrate;
Using an elastically deformable material, a cleaning surface that is tapered toward one side in a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism and is inclined with respect to the perpendicular direction A first brush having
A first brush moving mechanism for moving the first brush with respect to the substrate held by the substrate holding mechanism;
A second brush having a cleaning surface that is formed in a shape that tapers toward the opposite side to the one side in the perpendicular direction using an elastically deformable material;
A second brush moving mechanism for moving the second brush with respect to the substrate held by the substrate holding mechanism;
Controlling the first brush moving mechanism and the second brush moving mechanism to bring the cleaning surface of the first brush into contact with the peripheral region and the peripheral end surface of the one surface of the substrate held by the substrate holding mechanism; A substrate processing apparatus comprising: a control unit for bringing the cleaning surface of the second brush into contact with a peripheral region and a peripheral end surface of the other surface opposite to the one surface of the substrate.   The controller is configured to bring the cleaning surface of the second brush into contact with the peripheral area and the peripheral end surface of the one surface of the substrate held by the substrate holding mechanism while bringing the cleaning surface of the second brush into contact with the cleaning surface of the substrate. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is brought into contact with a peripheral region and a peripheral end surface of the other surface. The first brush has a rotationally symmetric shape around a central axis extending in the perpendicular direction,
The substrate processing apparatus according to claim 1, further comprising a first brush rotation mechanism that rotates the first brush around the central axis. The second brush has a rotationally symmetric shape around a central axis extending in the perpendicular direction,
4. The substrate processing apparatus according to claim 1, further comprising a second brush rotation mechanism that rotates the second brush around the central axis. 5.   The apparatus further comprises a first relative movement mechanism that relatively moves the substrate held by the substrate holding mechanism and the first brush so that the first brush moves in a circumferential direction of the substrate. Item 5. The substrate processing apparatus according to any one of Items 1 to 4.   The apparatus further comprises a second relative movement mechanism that relatively moves the substrate held by the substrate holding mechanism and the second brush so that the second brush moves in a circumferential direction of the substrate. Item 6. The substrate processing apparatus according to any one of Items 1 to 5.   7. The method according to claim 1, further comprising a processing liquid supply mechanism that supplies a processing liquid to an area inside the peripheral area of at least the one surface of the substrate held by the substrate holding mechanism. 2. The substrate processing apparatus according to 1. A substrate holding step of holding the substrate by the substrate holding mechanism;
A first brush having a cleaning surface that is formed in a shape that tapers toward one side in a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism, and has a cleaning surface that is inclined with respect to the perpendicular direction; A one-side contact step of bringing the cleaning surface of the first brush into contact with the peripheral region and the peripheral end surface of the one surface of the substrate held by the substrate holding mechanism;
In parallel with the one-side contact step, a second brush having a cleaning surface that is tapered toward the opposite side to the one side in the perpendicular direction and has a cleaning surface that is inclined with respect to the perpendicular direction is moved. And a second side contact step of bringing the cleaning surface of the second brush into contact with the peripheral region and the peripheral end surface of the other surface opposite to the one surface of the substrate held by the substrate holding mechanism. A substrate processing method.

Images