JPS58182825A - Spin coater - Google Patents

Abstract

PURPOSE:To enhance the stopping positional accuracy for a semiconductor substrate by a method wherein a high speed rotary motor and a low speed rotary motor are equipped, then a resist is made uniform by using the high speed rotary motor, and the low speed rotary motor is used when the rotating semiconductor substrate is stopped. CONSTITUTION:A control 12 operates a drive part 7 so as to lower a rotary transmission part 5 and releases it resulting in stopping the high speed rotary motor 3, and thus makes a brake 13 work. At the point that the number of revolutions of a table 1 detected by a sensor 11 becomes 10 and several revolutions, the control 12 releases the brake 13 and operates the drive part 7, then contacts the rotary transmission part 6 with an idler contact rotary plate 6' via gears 8 and 9 resulting in the rotation of the low speed rotary motor 4, and thereafter rotates the table 1 at a low speed of several RPM. After the control 12 decides the rotation stopping position for the substrate 2 on the table 1 by the sensor 11 and stops the motor 4, the unloading of the substrate 2 is performed so as to operate the drive part 7 to release the rotary transmission part 6. When the next substrate is loaded on the table 1, above-mentioned processes are repeated.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a spin coater, and more particularly to a spin coater that uses high-speed and low-speed motors to make the resist uniform on a semiconductor substrate and to increase the stopping point m viscosity. .

[Technical background of the invention and its problems] Generally, a resist is applied to a semiconductor substrate such as a mask, a sea urchin, etc. High speed rotation is required to uniformly apply the resist within the Ij6-1 semiconductor substrate (3). this]
The rolling resistance varies depending on the viscosity of the resist and the required film thickness, but is approximately 1000 RPM to 6000 RPM.

Firstly, in order to set (load) or remove (unload) the semiconductor substrate on the table where resist is applied to the semiconductor substrate, it is necessary to make the stopping position of the semiconductor substrate highly accurate. It is desirable to stop the coater while keeping the rotational speed as low as possible (several tPM). By the way, IJ = arity (linear note) of the change in rotational speed of the motor conventionally used in spin coaters is based on the minimum compensation rotational speed. Since the correlation is about 10 times higher, if you try to control the rotation speed from a few RPM to several thousand RPM with one motor, running to the high speed side will cause strain on the low speed side, and currently it is impossible to drive on the low speed side. As a result, the accuracy of the stop position of the semiconductor substrate due to rotation deteriorates, making it difficult to load or unload the semiconductor substrate.

``Object of the Invention'' The present invention was made in view of the above-mentioned difficulties, and includes a high-speed rotation motor and a low-speed rotation motor. It is an object of the present invention to provide a spin coater that improves the accuracy of the stopping position of a semiconductor substrate by using a rotary motor.

[Summary of the Invention] The present invention provides a high-speed rotation motor that rotates a semiconductor substrate such as a wafer onto which a resist is dropped at high speed to form a resist film, and a high-speed rotation motor that rotates a semiconductor substrate such as a wafer onto which a resist has been dropped to a predetermined position to load and unload the substrate. a low-speed rotation motor that stops the substrate; a rotation transmission section that transmits the rotation of the high-speed rotation motor and the low-speed rotation motor to the substrate; a drive section that drives the rotation transmission section and releases the rotation transmission section; The spin coater is equipped with a sensor that detects the rotational speed and position of the substrate, and a controller that controls the high-speed rotation motor, low-speed rotation motor, and drive section according to signals from the sensor.

[Embodiments of the invention] An embodiment of the present invention will be described below with reference to the drawings.

As shown in the drawings, the present invention moves a semiconductor substrate 2 set on a table 1 to a high-speed rotation motor 3 and a low-speed rotation motor 4.
The rotation of the motor 3 is directly transmitted by the rotation transmission section 5, and the rotation of the motor 4 is transmitted to the same rotation transmission section 6 (
(idler). -! , the multiplication rotation transmission 5°6 is driven by the drive unit T through gears 8.9.10 to transmit and release the rotation, and the motors 3, 4
．． The drive unit 7 is controlled by a p-controller 12 based on signals from a sensor 11 that detects the rotation speed and position of the table 1. Further, when the rotation is transferred from the motor 3 to the motor 4, the controller 12 controls so that play +13 is activated.

The spin coater with the above configuration can coat the semiconductor substrate 2.
is loaded onto the table 1 by a feeder (not shown), and when the resist is dropped onto the substrate 2 by being suctioned and held by pneumatic pressure, etc., the control 12 causes the drive unit I to move through the gear 8.10. The rotation transmission part 5 is raised and the fourth part 5
' , the high-speed rotation motor 3 is rotated at a predetermined number of rotations, and the substrate 2 is rotated at a high speed.

After a predetermined rotation time has elapsed, the control 12 activates and releases the drive unit I to lower the rotation transmission unit 5, stops the high-speed rotation motor 3, and further lowers the table 1.
The brake 13 is activated to stop the rotation due to inertia.

When the number of rotations of the table 1 detected by the sensor 11 reaches ten or more, the controller 12 releases the brake 13 and operates the p-drive section I to transmit the rotation transmission section 6 (idler) via the gear 8.9. The low-speed rotation motor 4 is rotated by contacting the idler contact rotary plate 6', and thereafter the table 1 is rotated at a low speed of several RPM.

After determining the rotation stop position of the substrate 2 on the sensor IIK and the t-t table 1 and stopping the motor 4, the drive section 7 is activated to unload (remove) the substrate 2 and release the rotation transmission section 6. In operation, when the next substrate is loaded onto the daple 1, the above steps are repeated.

As described above, by rotating the semiconductor substrate using two motors, one for low-speed rotation and the other for high-speed rotation, it is possible to improve the uniformity of the resist film through high-speed rotation and the accuracy of the rotation stop position of the semiconductor substrate through low-speed rotation. Dechiru.

In the above embodiment, the rotation transmission section is shown as a direct drive system and an idler drive system, respectively, but in addition to these drive systems, there is no problem in using a drive force system using a clutch plate, and the above three drive systems can also be used. The objects of the present invention can be achieved by each combination of the following.

[Effects of the Invention] According to the present invention, by using a high-speed rotation motor that makes the resist film uniform and a low-speed rotation motor that increases the accuracy of the rotation stop position, the rotation speed and positioning rotation speed that are optimal for the coating conditions are restricted to the motor. In addition, since the appropriate rotational speed of the motor can always be used without being overwritten, the load on the motor can be reduced and the rotational accuracy can be improved.

[Brief explanation of drawings]

The drawings are explanatory diagrams showing the spin coater of the present invention. 1, 1...Table 1, 2...Semiconductor substrate, 3...
・High-speed rotation motor, 4...low-speed rotation motor, 5, 5
'...Rotation transmission part (direct drive), 6.6'.
...Rotation transmission part (idler drive), T...Drive part (motor) 1 8i9,10...Gear, 11...Sensor, 12...
・Controller, 13...Brake, 2

Claims (1)

[Claims] A high-speed rotation motor that rotates a semiconductor substrate such as a wafer on which a resist has been r&ed to form a resist film at high speed, and a low-speed rotation motor that stops the substrate rotating at a predetermined position in order to load and unload the substrate. , a rotation transmission unit that transmits the rotation of the high-speed rotation motor and the low-speed rotation motor to the substrate, a drive unit that drives the rotation transmission unit and releases the rotation transmission unit, and detects the rotation speed and position of the substrate. and a controller that controls a front H-port high-speed rotation motor, a low-speed rotation motor, and a drive unit according to the signal of the sensor.
Spin coater with special features.