JPH04188611A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To prevent the scattering of resist on the outer circumference of a semiconductor, and to make it possible to apply the resist uniformly by a method wherein the position of a nozzle is detected and the resist is dripped while the rotational speed of the semiconductor substrate is being controlled. CONSTITUTION:A semiconductor substrate 1 is fixed by sucking to a chuck 2, it is rotated by a rotary motor 3, and a nozzle 4 is moved in radial direction on the substrate by a ball screw 9 and a nozzle moving motor 5. The position of the nozzle 4 is detected by the nozzle position detecting sensor 6 of the rotary encoder and the like coupled to the motor 5. The signal sent from the sensor 6 is treated by a rotation control unit 7, and the substrate 1 is coated with a resist by controlling a motor power source 8 in such a manner that the relative speed of the substrate 1 and the nozzle 4 is being kept constant. As a result, the scattering of the resist dripped on the outer circumference of the substrate can be prevented, and a uniform film is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor manufacturing apparatus for coating a semiconductor substrate with a resist, and more particularly to a manufacturing apparatus equipped with means for controlling the rotational speed of the semiconductor substrate.

[Conventional technology]

Conventionally, this type of semiconductor manufacturing equipment has a mechanism that applies resist onto the semiconductor substrate by moving a nozzle in the radial direction of the semiconductor substrate while rotating the semiconductor substrate fixed on a vacuum chuck at a constant speed using a motor. was.

[Problem to be solved by the invention]

The conventional semiconductor manufacturing equipment described above applies resist while rotating the semiconductor substrate at a constant speed, so the circumferential speed of the semiconductor substrate (velocity component perpendicular to the radius of rotation) is slow at the center and increases toward the outer periphery. It gets faster. Therefore, if the resist is dropped while moving the nozzle, the dropped resist will scatter at the outer periphery of the semiconductor substrate, making it difficult to obtain a uniform film.

The present invention differs from the conventional semiconductor manufacturing apparatus described above in that the position of the nozzle is detected and the resist is dropped while controlling the rotational speed of the semiconductor substrate.

[Means to solve the problem]

The semiconductor manufacturing apparatus of the present invention includes a sensor that detects the position of a nozzle, and a unit that controls the rotational speed of a motor that rotates a semiconductor substrate depending on the position of the nozzle.

〔Example〕

FIG. 1 is a block diagram of an embodiment of the present invention. 6 A semiconductor substrate 1 is suctioned and fixed to a chuck 2 and rotated by a rotary motor 3. As shown in FIG. The nozzle 4 is moved in the radial direction on the semiconductor substrate 1 by a ball screw 9 and a nozzle moving motor 5. The position of the nozzle 4 is detected by a nozzle position detection sensor 6 such as a rotary encoder connected to a nozzle movement motor 5.

The signal from the nozzle position detection sensor 6 is processed by the rotation control unit 7, and the motor power source 8 is controlled so that the relative speed between the semiconductor substrate and the nozzle is constant, and the resist is applied to the semiconductor substrate 1. The rotational speed of the semiconductor substrate is W1. If the relative speed between the nozzle and the semiconductor substrate in the tangential direction at a point r from the rotation center is V, then v =
There is a relationship called w x r. (2) is controlled to be constant and the above relationship is satisfied.

Further, as another control means, it is also possible to control the relative speed between the semiconductor substrate and the nozzle to be constant. That is, a proportionality constant α is added such that v'=αX w X r so that the value of α can be arbitrarily inputted from the rotation control unit. This control means has the advantage of being able to arbitrarily change the relative speed V', allowing for more detailed control.

〔Effect of the invention〕

As explained above, the present invention detects the position of the nozzle and drops the resist while controlling the rotation speed of the semiconductor substrate, thereby preventing the resist from scattering on the outer periphery of the semiconductor substrate and uniformly depositing the resist. It has the effect of coating. In particular, the larger the radius of the semiconductor substrate, the greater the effect.

[Brief explanation of drawings]

FIG. 1 is a block diagram of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor substrate, 2... Chuck, 3... Rotation motor, 4... Nozzle, 5... Nozzle movement motor, 6... Nozzle position detection sensor, 7... Rotation control Unit, 8...Motor power supply, 9...Ball screw.

Claims (1)

[Claims] In semiconductor manufacturing equipment that rotates the semiconductor substrate and moves the nozzle while dropping resist onto the semiconductor substrate, a sensor detects the position of the nozzle during dropping and a motor rotates the semiconductor substrate depending on the position of the nozzle. A rotation control unit that controls the rotation speed of the semiconductor manufacturing apparatus.