KR20200021138A - Wafer jig for bonding wafers and wafer bonding equipment including the wafer jig - Google Patents

Abstract

Disclosed are a wafer jig for bonding wafers and a wafer bonding apparatus including the same, which can align loaded device wafers and carrier wafers without using equipment for alignment. According to an embodiment of the present invention, the wafer jig comprises: a base plate to support a device wafer seated on the upper surface thereof; a plurality of latch modules which are arranged on the base plate, support a carrier wafer to be separated from the device wafer by a prescribed distance, and release the carrier wafer when a pressure is received from the outside to operate to allow the carrier wafer to free-fall to the upper surface of the device wafer; a plurality of aligning pins arranged to protrude above the base plate to come in contact with the outer circumferential surfaces of the device wafer and the carrier wafer to prevent movement; and a push module which is arranged on the base plate, and operates to laterally press the orientation flat of the device wafer and the carrier wafer to allow the outer circumferential surfaces of the device wafer and the carrier wafer to come in contact with the aligning pins when the device wafer and the carrier wafer seated.

Description

Wafer jig for wafer bonding and wafer bonding apparatus comprising same {Wafer jig for bonding wafers and wafer bonding equipment including the wafer jig}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to wafer bonding technology, and more particularly, to a wafer jig used for bonding a device wafer and a carrier wafer, and a wafer bonding apparatus including the same. will be.

As the electronic devices become thinner and higher in performance, there is an increasing demand for thinner semiconductor chips. In order to reduce the thickness of the semiconductor chip, the thickness of the semiconductor chip needs to be thin. Typically, the thickness of the semiconductor chip is reduced through back grinding of the wafer. However, when the thickness of the wafer is thin, not only the wafer is easily bent, but also the handling is difficult, and thus a problem that it is difficult to process subsequent semiconductor manufacturing processes smoothly with a thin thickness wafer occurs.

In order to solve this problem, a dummy wafer called a carrier wafer is attached to a thin device wafer to perform subsequent semiconductor manufacturing processes, and after the semiconductor manufacturing process is completed, the dummy wafer is completed. The method of removing is widely used. A wafer bonding apparatus is an apparatus for bonding together by applying an adhesive between a device wafer and a carrier wafer and pressing these wafers by predetermined pressing means. And prior to pressing, the device wafer and the carrier wafer need to be aligned with each other.

Typically, the alignment of the substrate is in a chamber separate from the vacuum chamber where the pressing and bonding process takes place. In this case, it is necessary to align the substrate and then transfer it to the vacuum chamber while the substrate is well fixed using a clamp. Korean Laid-Open Patent Publication No. 10-2010-0034450, "Substrate Bonding Device", discloses a substrate bonding device including a vacuum chamber in which a pressing process is performed and an aligner provided outside thereof. Alignment of the wafer is performed in the aligner, using a notch formed at the edge of the wafer. In addition, the aligned pair of wafers are transferred to a vacuum chamber while being fixed by a fixing device, and a pressure bonding process is performed. The substrate bonding device can pressurize the wafers using a pressing device without interfering with the fixing device. The device is configured to be.

In such a conventional substrate bonding apparatus, one or more notches must be separately formed on the wafer for alignment of the wafer. In addition, since a separate equipment is required for the alignment of wafers in addition to the equipment in which the wafer bonding process is performed, not only the price of the equipment increases but also the process time increases. In addition, clamps or fixtures are used to prevent misalignment of the substrate during transfer to the vacuum chamber, which must be able to pressurize the substrate without removing or interfering the clamp during the bonding process. However, in the former case, scratches may occur on the surface of the substrate due to the clamp removed, and in the latter case, the configuration of equipment is complicated to avoid interference.

Korean Laid-Open Patent No. 10-2010-0034450, "Board Bonding Device" Korean Laid-Open Patent Publication No. 10-2016-0019453, "Substrate alignment device and method"

One problem to be solved by the present invention is a wafer jig that can be used in the pressure bonding process by aligning the device wafer and the carrier wafer mounted without using a separate alignment equipment outside the vacuum chamber for bonding the wafer and It is to provide a wafer bonding apparatus including the same.

Another problem to be solved by the present invention is a wafer bonding apparatus including a wafer jig and a wafer jig which can be used in a pressure bonding process by aligning a mounted device wafer and a carrier wafer without forming a notch for alignment at the edge of the wafer. To provide.

The wafer jig for the wafer bonding process according to an embodiment of the present invention for solving the above problems is a base plate (base plate) for supporting the first wafer seated on the upper surface, a plurality is disposed on the base plate The second wafer is supported to be spaced apart from the first wafer at a predetermined distance, and upon receiving pressure from the outside, the latch is operated to release the support for the second wafer and freely fall to the upper surface of the first wafer. A latch module, a plurality of alignment pins disposed on the base plate and protruding upwards of the base plate to contact the outer circumferential surfaces of the first wafer and the second wafer to prevent flow; And when the first wafer and the second wafer are respectively seated, the first wafer and the second wafer Each of the tapered outer peripheral surface includes a push module (push module) that is operable to press the said first wafer and said second wafer, each of the orientation flat (orientation flat) in the cross direction contacts the alignment pin.

According to one aspect of the embodiment, the latch module includes a latch block for supporting the edge of the second wafer and a latch button for receiving the pressure from the outside, when the latch button receives the pressure from the outside The latch block can be moved outward. In this case, the latch button may receive the pressure from the outside from the downward press to press the second wafer in the wafer bonding process.

According to another aspect of the embodiment, the push module includes a push block for moving forward in the retracted position and in contact with the orientation flat of each of the first wafer and the second wafer to press in the transverse direction, the push moved forward The block may contact at least half of the cross-sectional area of an orientation flat of each of the first and second wafers.

According to another aspect of the embodiment, an alignment notch may not be formed on the outer peripheral surface of each of the first wafer and the second wafer.

The wafer bonding apparatus according to an embodiment of the present invention for solving the above problems is to seat the wafer jig according to an embodiment of the present invention, the first and second wafers on the wafer jig and the bonding process A loading and unloading unit for discharging the completed first and second wafers, a jig support for supporting the wafer jig, and a press unit including a press for lowering the upper surface of the second wafer, the loading and And a transfer unit for transferring the wafer jig between the unloading unit and the press unit, and a utility unit for controlling an internal temperature and a vacuum state of the press unit and controlling a lifting movement of the press.

According to the embodiment of the present invention described above, since the wafers are aligned in the wafer jig into which the pair of wafers are mounted and loaded into the vacuum chamber to perform the pressure bonding process, a separate unit such as an aligner is placed outside the vacuum chamber. It is not necessary to be equipped with the equipment for alignment of. This shortens the overall process time required for wafer bonding, simplifies the construction of the wafer bonding apparatus and reduces the cost of equipment investment due to the reduced space. Since the wafers can be aligned by pressing the orientation flats of the wafers together with the plurality of alignment pins arranged in a dispersed manner, it is not necessary to separately form a notch for alignment at the edge of the wafer to be bonded. In addition, since the device wafers spaced apart from each other are contacted with the carrier wafer by free-falling by using a downward press to press the carrier wafer, there is no need for a separate device for free-falling the device wafer, thereby simplifying the configuration of the equipment. Can be.

1 is a view showing an example of a wafer bonding apparatus according to an embodiment of the present invention.
FIG. 2A is a perspective view showing an example of a wafer jig constituting the wafer bonding apparatus of FIG. 1. FIG.
FIG. 2B is a plan view of the wafer jig of FIG. 2A and illustrates a state before the wafer alignment process is performed.
FIG. 2C is a plan view of the wafer jig of FIG. 2A and illustrates a state after the wafer alignment process is performed. FIG.
3A is a perspective view illustrating a specific configuration of a press unit constituting the wafer bonding apparatus of FIG. 1.
3B is a front view of the press unit of FIG. 3A.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment and Example of this invention are described with reference to drawings. However, the following embodiments and examples merely show preferred configurations of the present invention by way of example, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration, software configuration, processing flow, manufacturing conditions, size, material, shape, and the like of the apparatus are not intended to limit the scope of the present invention to these unless otherwise specified. . Further, when the first component is said to be mounted, arranged or formed on the second component, it is, of course, not only when the first component is mounted, arranged or formed directly on the second component, Unless explicitly stated otherwise, it should be construed that all other third components include all the interposed between the first component and the second component.

1 is a view showing an example of a wafer bonding apparatus according to an embodiment of the present invention. Referring to FIG. 1, the wafer bonding apparatus 100 includes a wafer jig 110, a loading and unloading unit 120, a press unit 130, a transfer unit, 140 and a utility unit 150. In FIG. 1, the configuration of the wafer jig 110, the press unit 130 and the transfer unit 140 is shown in detail, which is merely exemplary. In addition, the detailed configuration of the loading and unloading unit 120 and the utility unit 140 is not shown in FIG. 1, which means that a configuration known in the art may be applied.

The wafer bonding apparatus 100, like a conventional wafer bonding apparatus, loads and aligns a pair of wafers to be bonded, such as a device wafer and a carrier wafer, and then presses the vacuum chamber. It is an apparatus for joining each other by pressing in the state which applied predetermined | prescribed heat in 130. As shown to FIG. However, unlike the conventional wafer bonding apparatus, the wafer bonding apparatus 100 of FIG. 1 is introduced into the press unit 130 in a state where a pair of wafers spaced at a predetermined distance is mounted as described below, and thus the jig supporter ( Since the alignment of the wafer is automatically performed in the wafer jig 110 seated on the 132, it is disclosed in a separate device (for example, Korean Patent Publication No. 10-2010-0034450, "Substrate Bonding Device"). Aligner) is not provided. In addition, since the wafer bonding apparatus 100 of FIG. 1 aligns the wafers by using an orientation flat of the wafer as described below, a wafer in which an additional notch for alignment is not formed at the edge can be used as the bonding target.

The wafer jig 110 is a means for supporting a pair of wafers to be bonded, for example, a device wafer and a carrier wafer, and at the same time aligning them. More specifically, the wafer jig 110 is transferred between the loading and unloading unit 120 and the press unit 130 by the transfer unit 140 as well as during the press bonding process in the press unit 130. The device wafer and the carrier wafer are supported. The wafer jig 110 is aligned with each other by using an orientation flat of each of the device wafer and the carrier wafer, which are spaced apart from each other, before the pressure bonding process in the press unit 130 is performed. Hereinafter, a detailed configuration and operation of the wafer jig 110 according to an embodiment will be described in detail.

2A is a perspective view illustrating an example of the wafer jig 110. 2B and 2C are plan views of the wafer jig 110 of FIG. 2A, respectively, and FIG. 2B shows a state before the alignment process is performed and FIG. 2C shows a pair of wafers 12 and 14 that are seated and supported. ) Shows the state after performing the alignment process. 2A to 2C, the wafer jig 110 includes a base plate 112, a latch module 114, an alignment pin 116, and a push module 118. It includes.

The base plate 112 constitutes the main body of the wafer jig 110, and the upper surface has a constant plane. The upper surface of the base plate 112 includes a flat circular support region 112a corresponding to the shape of the wafer, the latch module 114, the alignment pin 116, the push module 118, etc., to mount the device wafer 12. This may be divided into the peripheral region 112b to be installed. The distinction between the support region 112a and the peripheral region 112b does not necessarily need to be physical. For example, the support region 112a may be formed of a different material and / or height than the peripheral region 112b to be physically identified with the peripheral region 112b or at predetermined intervals on the innermost side of the peripheral region 112b. It may refer to the inner region of the imaginary circle drawn by a plurality of alignment pins 116 disposed spaced apart from each other.

In the base plate 112, more particularly in the support region 112a, the device wafer 12 and the carrier wafer 14 may be supported by, or to be bonded to, the device wafer 12 to be seated or mounted thereon. have. For this purpose, the support area 112a of the base plate 112 has a flat surface. A heater (not shown) for heating the device wafer 12 may be provided below the support region 112a of the base plate 112. In addition, in some embodiments, the base plate 112 may be provided with adsorption means (not shown) for adsorbing the wafers 12 and 14.

The latch module 114 supports the carrier wafer 14 so as to be spaced apart from the device wafer 12 seated in the support region 112a of the base plate 112. In addition, the latch module 14 operates to release the support for the carrier wafer 14 and free fall onto the top surface of the device wafer 12 when a predetermined pressure is applied from the outside as the pressure bonding process is started.

To this end, the latch module 114 may include a latch block 114a and a latch button 114b. The latch module 114 may further include predetermined latch block driving means (not shown) for moving the latch block 114a from the advanced state to the retracted state when a predetermined pressure is applied to the latch button 114b. have. According to the present embodiment, there is no particular limitation on the kind of such a latch block driving means, for example, a device configured to physically connect the latch button 114b and the latch block 114a or a predetermined device for moving the latch block 114a. It may be a power drive device.

The latch block 114a is disposed in the peripheral region 112b adjacent to the support region 112a of the base plate 112 and configured to move forward or retract outward in the center direction of the base plate 112. More specifically, the latch block 114a supports the carrier wafer 14 at the edge of the support region 112a in the state of advancing toward the center of the base plate 112. In addition, the latch block 114a does not support the carrier wafer 14 when the base plate 112 is retracted outward, so that the carrier wafer 14 supported by the latch block 114a is a device wafer. Free fall to the upper surface of (12).

And latch button 114b is a means for receiving the pressure from the exterior so that latch block 114a may retract. For example, the latch button 114b may receive a predetermined pressure by the press 134 that descends to press the carrier wafer 14 in the press unit 130. At this time, the press 134 contacts and presses the latch button 114b before contacting the carrier wafer 14, and the result is that the carrier wafer 14 supported by the latch block 114b is retracted. ) Free fall toward the device wafer 12. To this end, the latch button 114b may be formed to protrude higher than the carrier wafer 14 supported by the latch block 114b.

The latch module 114 is disposed on the base plate 112, more specifically, the peripheral area 112b is spaced apart from each other at predetermined intervals. 2A-2C, three latch modules 114 are shown spaced at equal intervals, which is exemplary. For example, the latch modules 114 may be disposed so that two are opposed to each other, or four or more are spaced apart from each other. In the latter case, the latch modules do not necessarily have to be spaced at equal intervals, and other components, such as the alignment pins 116 and the push module 118, which can stably support the carrier wafer 14, are arranged around the latch module. It may be disposed appropriately distributed so as not to overlap with.

The alignment pins 116 are formed so that a plurality of the plurality of alignment pins are protruded upward of the base plate 112. For example, the alignment pins 116 may be five as shown, which is exemplary. Considering the function of the alignment pin 116, three or more alignment pins 116 may be provided. The alignment pin 116 may have a rod shape, in which one end of the rod-shaped alignment pin 116 is fixed to the base plate 112 and the other end is formed to protrude upward of the base plate 112. Can be.

These multiple alignment pins 116 contact the outer circumferential surfaces of each of the device wafer 12 and the carrier wafer 14 to the base plate 112 of the peripheral region 112b adjacent to the support region 112a to prevent flow. Are distributed and placed. More specifically, the plurality of alignment pins 116 are distributed along the boundary between the circular support region 112b and the peripheral region 112b. And when the push module 118 presses the orientation flat of each of the device wafer 12 and the carrier wafer 14, the plurality of alignment pins 116 are in contact with the outer circumferential surfaces of the device wafer 12 and the carrier wafer 14. This prevents further movement so that they can be aligned with each other.

The push module 118 presses the device wafer 12 seated on the base plate 112 and the carrier wafer 14 supported by the latch block 114a laterally from the side to the device wafer 12 and the carrier. The outer circumferential surface of the wafer 14 is in contact with the alignment pin 116. At this time, since the push module 118 simultaneously presses the orientation flats 12a and 14a of the device wafer 12 and the carrier wafer 14 simultaneously in the transverse direction, the outer peripheral surface contacts the alignment pin 116 for further movement. This limited device wafer 12 and carrier wafer 14 may be aligned with each other.

According to one embodiment, the push module 118 comprises a push block 118a which moves forward and backward along the upper surface of the base plate 112 and drive means 118b for moving the push block 118a. Can be configured. Here, the forward movement means that the push block 118a positioned at the retracted position (for example, the peripheral region 112b of the base plate 112) is in contact with the orientation flats 12a and 14a of the wafers 12 and 14 in the transverse direction. It indicates to move in the direction of the center of the base plate 112 to press. According to this embodiment, there is no particular limitation on the specific structure of the push module 118, the kind of the driving means 118b, as well as the specific mechanism for moving the push block 118a, and a configuration known in the art may be applied. have.

In this embodiment, if the push block 118a that is transferred in the retracted position can sufficiently press the orientation flats 12a and 14a of the wafers 12 and 14 in the transverse direction, there is no particular limitation on the size thereof. However, the push blocks 118a in contact with the orientation flats 12a and 14a of the wafers 12 and 14 are preferably configured to be in contact with the orientation flats 12a and 14a over a predetermined width. If the area where the orientation flats 12a and 14a of the wafers 12 and 14 are in contact with the push block 118a is too small, the wafers 12 and 14 pressed in the transverse direction may be biased to one side. In this case, the wafers 12 and 14 pressed laterally by the push block 118a may not be evenly contacted with the plurality of alignment pins 116, so that the wafers 12 and 14 may not be properly aligned. . According to one embodiment, one surface of the push block 118a may be sized to contact 1/2 or more of the cross-sectional area of the orientation flats 12a and 14a of the wafers 12 and 14.

The operation of the push module 118 may be automatically performed in the wafer jig 110 after each of the device wafer 12 and the carrier wafer 14 are mounted to the base plate 112 and the latch block 114a. For example, when the carrier wafer 14 is mounted to the latch block 114a, the push module 118 may automatically operate to press the orientation flat of the devias wafer 12 and the carrier wafer 14. To this end, the latch block 114a may be provided with a sensor (eg, a load sensor or a motion sensor) for detecting whether the carrier wafer 14 is mounted, but this is merely exemplary.

1 and 2A to 2C, in the loading and unloading unit 120, the device wafer 12 and the carrier wafer 14 to be bonded are introduced from the outside and placed on the wafer jig 110. Mounted. At this time, the wafers 12 and 14 are located inside the alignment pins 116 which are arranged in a distributed manner, and the orientation flats 12a and 14a are mounted so as to face the push block 118a. In the loading and unloading unit 120, the wafers 12 and 14 having the bonding process completed in the press unit 130 are discharged to the outside. The loading and unloading unit 120 does not necessarily need to be a vacuum environment such as a vacuum chamber, but may be a chamber having an atmospheric environment or an open space. Loading and unloading of the wafers 12 and 14 in the loading and unloading unit 120 may be performed manually or automatically using a robot arm or the like.

In the loading and unloading unit 120, the device wafer 12 is seated on the base plate 112, more specifically, the support region 112a, and the carrier wafer 14 is spaced apart from the device wafer 12 by a predetermined distance. When mounted on the latch block 114a to be spaced apart from each other, the wafer jig 110 performs alignment with the device wafer 12 and the carrier wafer 14. As described above, this alignment process can be performed automatically after the mounting of the carrier wafer 14 as the push block 118a of the push module 118 is advanced in the retracted position. Wafers 12 and 14 that are laterally pressed by the push block 118a have their outer circumferential surfaces in full contact with the alignment pin 116.

The aligned device wafer 12 and the carrier wafer 14 are mounted on the wafer jig 110 in a state in which the alignment is maintained, that is, the push block 118a presses the orientation flats 12a and 14a. Injected to (130). In addition, after the bonding process is completed, the wafer jig 110 on which the bonded wafers 12 and 14 are mounted is discharged from the press unit 130 to the loading and unloading unit 120. The process of transferring the wafer jig 110 between the loading and unloading unit 120 and the press unit 130 may be automatically performed by the transfer unit 140. That is, the transfer unit 140 performs a function of transferring between the loading and unloading unit 120 and the press unit 130 while holding the wafer jig 110.

The transfer unit 140 is a variety of transfer means known to those skilled in the art (for example, a configuration in which a robot arm capable of gripping the wafer jig 110 as shown in FIG. 1 is mounted on a rail to enable axial rotation). It can be implemented by. Therefore, the specific structure of the transfer unit 140 disclosed in FIG. 1 is just one embodiment, and a detailed description thereof will be omitted herein.

In the press unit 130, a pressure bonding process for the aligned device wafer 12 and the carrier wafer 14 is performed. 3A is a perspective view illustrating an example of a specific configuration of the press unit 130, and FIG. 3B is a front view of the press unit 130 of FIG. 3A. 3A and 3B, the press unit 130 includes a chamber 131, a jig support 132, a press 134, and a lifting means 136.

1, 2A to 2C, 3A, and 3B, the chamber 131 may include a process chamber 131a in which a pressure bonding process is performed, and an auxiliary chamber 131b in which lifting means 136 and the like are installed. Include. The process chamber 131a is a vacuum chamber. Although not shown in the figure, a vacuum line for forming a vacuum in the process chamber 131a, an air line for forming air pressure in the air chamber 131a, and a cooling process chamber 131a are performed. Cooling means (eg, a chiller) and the like may be installed to be connected with the process chamber 131a. As such, the vacuum line, the standby line, and the cooling means, not specifically shown, constitute the utility unit 150 of the wafer bonding apparatus 100.

The auxiliary chamber 131b does not need to be a vacuum chamber, and the lifting means 136 is connected with the press 134 to move the press 134 up and down. For example, the lifting means 136 may include a cylinder that is connected to the press 134, where the press 134 is raised and lowered by the cylinder. The pressure in these cylinders can be controlled by an air regulator (not shown). In addition, the lifting speed of the press 134 may be controlled by a speed controller (not shown).

 The jig support 132 is mounted below the press unit 130, more specifically, at the bottom surface of the process chamber 131a to support the wafer jig 110 during the press bonding process by the press 134. Although not shown in the drawing, the jig support 132 may include a heater for heating the device wafer 12 by transferring heat to the base plate 112 of the wafer jig 110. For example, the jig support 132 itself may be formed as a heater block. In this case, the jig support 132 is configured as a bottom heater block in which a heater is mounted therein.

The press 134 is mounted above the press unit 130, more specifically, above the process chamber 131a so that the press 134 can be lifted and lowered to press the upper surface of the carrier wafer 14 to a predetermined pressure. do. Although not shown in the drawing, the press 134 may also include a heater for heating the carrier wafer 14. For example, the press 134 itself may be formed as a heater block, in which case the press 134 may be configured as a top heater block in which a heater is mounted therein.

In addition, as described above, the descending press 134 operates the latch module 114 before contacting the carrier wafer 14 so that the carrier wafer 14 spaced apart from the device wafer 12 is connected to the device wafer ( 12) can be contacted face-to-face. More specifically, the descending press 134 may first contact the latch button 114b to cause the latch block 114a to retreat, so that the carrier wafer 14 supported by the latch block 114a Free fall to the device wafer 12. The press 134 descending thereafter contacts the upper surface of the carrier wafer 14 to apply a predetermined pressure.

Next, the process of joining the device wafer 12 and the carrier wafer 14 in the wafer bonding apparatus 100 of FIG. 1 is demonstrated. Hereinafter, the bonding process in the wafer bonding apparatus 100 will be briefly described in order to avoid unnecessary repetition. Therefore, the matters not described below may be equally applied.

1, 2A-2C, 3A and 3B, first, in the loading and unloading unit 120, the device wafer 12 is mounted on the base plate 112 of the wafer jig 110 and continues. Thus, the carrier wafer 14 is mounted on the latch block 114a. The mounting of such wafers 12, 14 can be performed manually or automatically. In the wafer jig 110, an alignment operation of the device wafer 12 and the carrier wafer 14 is performed. For this purpose, the push flats 118a in the retracted position are advanced to move the orientation flats of the wafers 12 and 14. Pressurize in the transverse direction. Subsequently, the transfer means 140 inserts the wafer jig 110 on which the wafers 12 and 14 are arranged at predetermined intervals into the press part 130 from the loading and unloading part 120 to the press part. It is seated on the jig support 132 of 130.

Then, the temperature of the device wafer 12 is raised by operating the heater provided in the jig support 132. The heater provided in the press 134 may also be operated at the same time or may be operated while the press 134 is pressed against the carrier wafer 14. As a result, it rises to the predetermined temperature of the temperature of each of the device wafer 12 and the carrier wafer 14 so that a smooth bonding can be made at least during a bonding process.

After the operation of the heater or simultaneously with the operation of the heater, the press 134 starts to descend by the lifting means 136. The descending press 136 first contacts and presses the latch button 114b. As a result, the latch block 114a is moved backward so that the carrier wafer 14 supported by the free fall falls on the upper surface of the device wafer 12. Thereafter, the press 136 continuously presses the upper surface of the carrier wafer 14 to a predetermined pressure. As a result, the device wafer 12 and the carrier wafer 14 are completely bonded by the adhesive previously applied between the device wafer 12 and the carrier wafer 14.

When the pressure bonding process is completed, the lifting means 136 raises the press 134 to the initial position. The wafer jig 110 on which the bonded device wafer 12 and the carrier wafer 14 are mounted is transferred from the press unit 130 to the loading and unloading unit 120 by the transfer means 140. In addition, in the loading and unloading unit 120, unloading in which the bonded wafers 12 and 14 are discharged to the outside is performed, and the unloading process may be performed manually or automatically as in the loading.

As mentioned above, the above description is only an example and should not be construed as being limited thereto. The technical idea of the present invention should be specified only by the invention described in the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention. Therefore, it will be apparent to those skilled in the art that the above-described embodiments may be implemented in various forms.

12: device wafer
12a, 14a: Orientation Flat
14: carrier wafer
100: wafer bonding apparatus
110: Wafer Jig
112: base plate
114: latch module
114a: Latch Block
114b: Latch Button
116: alignment pin
118: push module
118a: push block
118b: drive means
130: press unit
131: chamber
131a: process chamber
131b: auxiliary chamber
132: jig support
134: Press
136: lifting means
140: transfer means

Claims (6)

A base plate supporting a first wafer seated on an upper surface;
A plurality of the wafers are disposed on the base plate and support the second wafer so as to be spaced apart from the first wafer by a predetermined distance. A latch module operative to free fall onto the top surface of the wafer;
An alignment pin disposed in a plurality of alignment pins so as to protrude upwardly of the base plate to contact the outer circumferential surface of each of the first and second wafers to prevent flow; And
Disposed on the base plate, and when the first and second wafers are seated, the outer circumferential surfaces of each of the first and second wafers contact the alignment pins, respectively. A wafer jig for a wafer bonding process comprising a push module operative to laterally press an orientation flat.
The method of claim 1, wherein the latch module
A latch block supporting an edge of the second wafer; And
It includes a latch button for receiving the pressure from the outside,
And the latch button moves the latch block outward when the latch button receives the pressure from the outside.
The method of claim 2,
The latch button is a wafer jig for the wafer bonding process, characterized in that for receiving the pressure from the outside from the pressing down to press the second wafer in the wafer bonding process.
The method of claim 1,
The push module includes a push block for moving forward in the retracted position to contact the orientation flat of each of the first wafer and the second wafer to press in a transverse direction,
The push jig for moving forward, wherein the push block is in contact with at least one half of the cross-sectional area of an orientation flat of each of the first wafer and the second wafer.
The method of claim 1,
A wafer jig for a wafer bonding process, wherein an alignment notch is not formed on the outer circumferential surface of each of the first wafer and the second wafer.
A wafer jig according to any one of claims 1 to 5;
A loading and unloading unit for seating each of the first and second wafers on the wafer jig and discharging the first and second wafers in which a bonding process is completed;
A press unit including a jig support for supporting the wafer jig and a press for lowering and pressing an upper surface of the second wafer;
A transfer unit for transferring the wafer jig between the loading and unloading unit and the press unit; And
And a utility unit for controlling the internal temperature and the vacuum state of the press unit and for controlling the lifting movement of the press.

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