TWI758875B - Substrate processing apparatus - Google Patents

Abstract

An object of the present invention is to provide a substrate processing apparatus capable of preventing process failures due to a warpage phenomenon of a substrate on a stage where substrate processing is performed. A substrate processing apparatus of the present invention for achieving this object includes: a plurality of chambers arranged at predetermined intervals in the circumferential direction for processing the substrate; and a turntable equipped to be rotatable for transferring the substrate among the plurality of chambers, wherein , at least one of the plurality of chambers is equipped with: a platform on which the substrate is placed; a clamping ring on the upper portion of the substrate in a manner of overlapping with an edge position portion of the substrate by a predetermined width and equipped to be raised and lowered to prevent loading The deformation of the base plate on the platform; the elastic member is equipped to act on the clamping ring with an elastic force in the direction of the platform; the clamping pin is equipped to oppose the elastic force acting on the clamping ring in such a way that a force acts on the clamping ring.

Description

Substrate processing equipment

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of preventing the warpage of the substrate caused by heat during the processing of the substrate.

Recently, in order to overcome the limitation of increased two-dimensional integration and increase the functional density of components, silicon-based semiconductor integration technology has been developed to stack more than two wafers into three-dimensional three-dimensional stacked integrated circuits (3D-stacked integrated circuits). IC) technology. Silicon has the advantages of excellent mechanical properties and high thermal conductivity and, most importantly, the accumulation of highly developed processing technology, but has the disadvantage of not being able to realize optical components such as lasers and LEDs, ultra-high-speed components such as HEMTs, and pressure. Disadvantages of electrical components, etc. Therefore, implementation of photoelectric composite elements by combining silicon-based electronic elements and light-emitting elements such as InGaAs and GaN, and realization of ultra-high-speed high-integration elements by combining silicon elements and compound semiconductor elements such as GaAs, InP, etc. Research and Development.

In this way, technologies are being developed that can realize a composite device (heterogeneous device) by bonding dissimilar components. Wafer bonding technology can be classified into room temperature bonding, low temperature (<150°C) bonding, and high temperature (>150°C) bonding depending on the bonding temperature. technology.

High temperature bonding techniques include anodic bonding, thermo-compression bonding, eutectic bonding and solder bonding, which are widely used in commercial products as mature technologies . However, high-temperature wafer bonding of dissimilar components with different thermal expansion coefficients may cause side effects such as warpage, debonding, and cracking due to thermal stress.

In particular, warpage of the wafers due to heat occurs during the heat treatment of the dissimilarly bonded wafers.

As an example, semiconductor packaging technology is being applied as a means for increasing the capacity and performance of semiconductor products. In such a semiconductor packaging process, a substrate for mounting semiconductors or a space between different semiconductors is formed. The process of electrically connecting bumping balls is called a reflow process.

The reflow process as described above is performed by applying high-temperature heat to the substrate placed on the stage. When the reflow process is performed, a warpage phenomenon occurs in the substrate due to the thermal expansion of the substrate due to the transfer of the high-temperature heat to the substrate. Therefore, if the substrate cannot be stably fixed and supported due to the warpage phenomenon of the substrate, the heat transfer on the surface of the substrate becomes uneven, resulting in serious process failure.

FIG. 1( a ) shows a normal state in which the central portion C and the outer portion of the substrate W are parallel to the horizontal plane H, and FIG. 1( b ) shows a state in which the outer portion of the substrate W′ is warped upward from the central portion C .

Korean Granted Patent No. 10-1501171 (reflow processing unit), which is a prior art related to a device for fixing and supporting a substrate in an existing substrate processing process, describes the use of a vacuum chuck capable of sucking a substrate by vacuum pressure , general technical content of mechanical clamping or electrostatic chuck.

As another prior art, it is disclosed in Granted Patent No. 10-0645647 (jig for flexible substrate) that a flexible substrate is fixed in a position not to sag using a pressing plate driven by a hinge in the upper surface of the conveying jig The structure of the state.

However, in the reflow process described above, when warpage of the substrate occurs due to thermal expansion, it is required to develop a substrate processing apparatus with an improved structure that can prevent process defects caused by the warpage of the substrate.

The present invention has been made in order to solve the above-mentioned problems, and an object thereof is to provide a substrate processing apparatus which can prevent a process failure caused by a warpage phenomenon of a substrate on a stage where substrate processing is performed.

The substrate processing apparatus of the present invention for achieving the above-mentioned object includes: a plurality of chambers arranged at predetermined intervals in the circumferential direction for processing a substrate; and a turntable 600 provided to transfer the The substrate is rotatable, wherein at least one chamber of the plurality of chambers is equipped with: a platform 110 on which the substrate is placed; and a clamping ring 120 in a manner of overlapping with an edge position portion of the substrate by a predetermined width The elastic member 150 is located on the upper part of the substrate and is equipped to be lifted and lowered to prevent the deformation of the substrate loaded on the platform 110 ; the elastic member 150 is equipped to act on the clamping ring 120 in a direction toward the platform 110 . Elastic force; clamping pins 160 equipped to apply a force to the clamping ring 120 in a manner opposite to the elastic force acting on the clamping ring 120 .

The turntable 600 includes: a turntable main body 610 that is rotated by a turntable driving part; The turntable main body 610 is separated, and the plurality of openings 620 pass through the turntable main body 610 and are formed in a number corresponding to the plurality of chambers, and the substrate processing apparatus is equipped with a stage driving portion provided for moving in the up-down direction The driving force for raising and lowering the platform 110 is provided in the first space S1 of the first chamber 100 having the platform 110 and the first space S1 provided on the lower side of the first space S1 and communicating with the plurality of chambers The second space S2 of the chamber 100 can perform loading and unloading of the substrate in a state of being spatially isolated from each other, and if the stage 110 and the turntable ring 630 are moved together in the upward direction by the driving of the stage driving part , the loading and unloading of the substrate can be performed in a state in which the turntable ring 630 is in close contact with the sheet portion 100c provided at the boundary between the first space S1 and the second space S2.

Equipped with a clamping pin driving part that provides a driving force for moving the clamping pin 160 up and down, wherein the platform driving part and the clamping pin driving part can be raised and lowered in the up-down direction at the same height lift.

The holding ring 120 and the elastic member 150 are equipped on the turntable 600 so as to rotate together when the turntable 600 rotates.

The turntable 600 includes: a turntable main body 610 that is rotated by a turntable driving part; The turntable main body 610 is separated, and the plurality of openings 620 pass through the turntable main body 610 and are formed in a number corresponding to the plurality of chambers; the substrate support member 640 is coupled to the inner side of the turntable ring 630 and is formed at the upper part of the turntable ring 630 . The substrate is placed.

The clamping pins 160 may be provided to penetrate the turntable ring 630 in the up-down direction.

The clamping pin 160 may be provided to penetrate through the edge position portion of the platform 110 in the up-down direction.

The substrate processing apparatus is equipped with: a clamping guide 130, which is equipped to be coupled to the edge position portion of the clamping ring 120 so that the upper end of the clamping pin 160 contacts the bottom surface; The turntable ring 630 extends upward, wherein one end of the elastic member 150 can be supported by the clamping guide 130 , and the other end of the elastic member 150 can be supported by the elastic member support frame 140 support.

When the platform 110 is raised by the platform driving part, the turntable ring 630 , the clamping ring 120 and the clamping pin 160 can be raised together.

A first sealing member 170 for maintaining airtightness may be provided between the upper surface of the turntable ring 630 and the sheet portion, and between the bottom surface of the turntable ring 630 and the upper surface of the edge position portion of the platform 110 may be provided. A second sealing member 180 for maintaining airtightness is provided.

The clamping ring 120 may be equipped to be able to rise and fall, so that the bottom surface of the clamping ring 120 contacts the upper surface of the edge position portion of the substrate, or the bottom surface of the clamping ring 120 is in contact with the bottom surface of the substrate. The upper surfaces of the edge position portions approach in the up-down direction to form a predetermined gap.

The plurality of chambers include: a first chamber 100 for loading and unloading the substrate; a second chamber 200, a third chamber 300, and a fourth chamber 400 for loading and unloading the first chamber. The substrates in the chamber 100 are heated for heat treatment; the fifth chamber 500 cools the substrates subjected to heat treatment in the fourth chamber 400 , wherein the substrates in the fifth chamber 500 can be transferred to the first chamber The chamber 100 is cooled and unloaded.

The second chamber 200, the third chamber 300, and the fourth chamber 400 are equipped with upper and lower heaters for heating the substrate, which are provided at the upper and lower portions of the substrate, respectively, and the turntable. 600 may be configured to pass between the upper and lower heaters while rotating.

The fifth chamber 500 is equipped with a heater for heating the substrate, and the heating temperature of the heater of the fifth chamber 500 may be set lower than heating the substrate in the fourth chamber 400 temperature to achieve cooling of the substrate.

According to the substrate processing apparatus of the present invention, the holding ring is provided at the upper portion of the edge position of the substrate loaded on the stage, whereby the warpage phenomenon of the substrate can be prevented, and the entire area of the substrate can be uniformly transferred, thereby preventing The process of the substrate is defective and the reliability of the substrate processing process is improved.

In addition, the elastic force of the elastic member acts on the upper portion of the clamp ring, thereby preventing excessive force from acting on the substrate, thereby preventing damage and breakage of the substrate and preventing warpage of the substrate.

Further, by applying a force against the elastic force of the elastic member to the lower portion of the clamp ring, the bottom surface of the clamp ring can be brought into contact with or separated from the upper surface of the substrate by a predetermined distance, and the force acting on the substrate can be adjusted.

Hereinafter, the configuration and operation of preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

2 and 3, the substrate processing apparatus 1 of the present invention includes: a plurality of chambers 100, 200, 300, 400, 500 arranged at predetermined intervals in the circumferential direction for processing substrates; The substrate is transferred between the plurality of chambers 100 , 200 , 300 , 400 and 500 so as to be rotatable.

In the substrate processing apparatus 1 of the present invention, as an example, a reflow process can be performed. Furthermore, in the substrate processing apparatus 1 of the present invention, a process using heat may be performed without performing the reflow process.

The plurality of chambers 100, 200, 300, 400, 500 may include: a first chamber 100 for loading and unloading the substrate; a second chamber 200, a third chamber 300, and a fourth chamber 400 , used to heat the substrate loaded in the first chamber 100 for heat treatment; the fifth chamber 500 is used to cool the substrate subjected to heat treatment in the fourth chamber 400 .

In the first chamber 100, not only the loading and unloading of substrates are performed, but also the heating process is performed through the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 in sequence. cooling of the substrate, and in the second chamber 200 , the third chamber 300 , the fourth chamber 400 , and the fifth chamber 500 , a process accompanying the heating treatment of the substrate may be performed.

The fifth chamber 500 may be configured to perform a cooling process before the cooling of the first chamber 100 . At this time, the fifth chamber 500 may be configured to include a heater to heat the substrate, but the substrate heating temperature is set lower than the temperature at which the substrate is heated in the fourth chamber 400 to cool the substrate.

An equipment front end module 2 (EFFM: Equipment Front End Module) is connected to one side of the first chamber 100 .

The equipment front-end module 2 has a function of loading an unprocessed substrate loaded on the substrate loading portion 2a into the first chamber 100 of the substrate processing apparatus 1 by a transfer robot (not shown) provided in the substrate transfer portion 2b, Alternatively, the substrates that have been processed in the substrate processing apparatus 1 are unloaded from the first chamber 100 and loaded onto the substrate loading unit 2a.

The temperature of the heating substrate in the second chamber 200 , the third chamber 300 , the fourth chamber 400 and the fifth chamber 500 may be set to be 100°C to 450°C. Also, the second chamber 200 , the third chamber 300 , the fourth chamber 400 , and the fifth chamber 500 may be respectively equipped with heaters that generate heat for heating the substrate. The shapes and sizes of the heaters can be changed in various ways, and the heaters can be provided on the upper and lower parts of the substrate, respectively.

The turntable 600 includes: a turntable main body 610, which is rotated by a turntable driving part (not shown); a plurality of openings 620, passing through the turntable main body 610, and corresponding to the plurality of chambers 100, 200, The numbers of 300, 400, and 500 are formed along the circumference of the circumference; an annular turntable ring 630 is provided to be detachable from the turntable main body 610 in a state of being supported and seated at the edge position of each of the openings 620 .

FIG. 3( a ) shows a state in which the turntable ring 630 is set on the turntable main body 610 , and FIG. 3( b ) shows a state in which the turntable ring 630 is separated from the turntable main body 610 .

When the turntable driving part is driven, the turntable 600 will rotate with the vertical height being fixed. The turntable ring 630 moves up and down together with the platform 110 to be described later, and the turntable ring 630 moves up and down in a state of being separated from the turntable main body 610 .

Referring to FIG. 4 and FIG. 5 , the structure and internal structure of one of the plurality of chambers 100 , 200 , 300 , 400 and 500 , that is, the first chamber 100 will be described.

The first chamber 100 includes an upper chamber 100a and a lower chamber 100b provided on the lower side of the upper chamber 100a.

A first space S1 is formed in the upper chamber 100a, and a second space S2 is formed in the lower chamber 100b.

In the first chamber 100, the loading and unloading of the substrates W are performed in a state where the first space S1 and the second space S2 are not connected to each other in space and are isolated from each other.

The first space S1 functions as a load lock portion for loading the substrates W of the substrate loading portion 2a by the transfer robot or unloading the substrates W that have completed substrate processing to the substrate loading portion 2a by the transfer robot.

The turntable 600 is arranged in the second space S2, and communicates with the adjacent other chambers 200, 300, 400, 500 to provide passages for transferring the substrate W between the chambers 100, 200, 300, 400, 500 . That is, the second space S2 has a function of a passage for transferring loaded substrates from the first chamber 100 to the second chamber 200 and transferring the processed substrates in the fifth chamber 500 to the load lock portion The vias function as well as process chambers that perform cooling of the substrate prior to unloading.

One side surface of the upper chamber 100 a is formed with an opening (not shown) for entering and leaving the loaded and unloaded substrates, and the opening is opened and closed by a gate valve (not shown).

The first chamber 100 includes the following components: a stage 110 on which the substrate W is placed; and a clamping ring 120 located on the upper portion of the substrate W so as to overlap with the edge position portion of the substrate W by a predetermined width and provided as It can be lifted and lowered to prevent deformation of the substrate W placed on the platform 110 ; the elastic member 150 is equipped to act on the clamping ring 120 with an elastic force as a force pushing in the direction of the platform 110 ; the clamping pin 160 , is equipped to make the pushing force act on the clamping ring 120 in a manner opposite to the elastic force acting on the clamping ring 120 .

The platform 110 may be equipped with a cooling unit (not shown) for cooling the substrate loaded on the upper portion of the platform 110 . And, there may be a platform driving part (not shown) that provides a driving force so that the platform 110 can be raised and lowered in the up-down direction. The upper surface of the stage 110 may be formed with a substrate support member insertion groove (not shown) corresponding to the shape of a substrate support member 640 to be described later.

The holding ring 120 is located on the upper portion of the substrate W, and as shown in FIG. 5 , is formed in a ring shape. As shown in FIG. 5 , when the edge position portion of the substrate W formed in the disk shape and the width in the radial direction of the clamp ring 120 are configured to overlap a predetermined portion when viewed in plan view, the edge position portion of the substrate W is When deformation occurs, the overlapping portion of the clamping ring 120 presses the deformed portion of the substrate W, so that the substrate W can be prevented from being deformed by physical contact.

At this time, the clamping ring 120 may be configured such that the bottom surface of the clamping ring 120 contacts the upper surface of the edge position portion of the substrate W, or may be configured to approach the upper surface of the substrate W without contacting the upper surface of the substrate W to form a predetermined gap.

A plurality of clamping guides 130 are combined with edge position ends around the outer peripheral surface of the clamping ring 120 . The inner part of the clamping guide 130 is integrated with the clamping ring 120 , and the outer part is equipped to protrude outward from the outer peripheral surface of the clamping ring 120 .

The holding ring 120 may be made of various materials such as metal, synthetic resin, and polymer.

The elastic member 150 may be constituted by a coil spring as an example. The upper end of the elastic member 150 is supported on the upper end of the elastic member support frame 140 , and the lower end of the elastic member 150 is supported on the upper surface of the clamping guide 130 .

If the clamping pin 160 moves upward, the clamping ring 120 and the clamping guide 130 will move upward to cause the elastic member 150 to be compressed. When the clamping pin 160 moves downward, the clamping ring 120 and the clamping guide 130 will be pushed by the elastic restoring force of the elastic member 150 to move downward.

The elastic member support frame 140 may be provided on the upper part of the turntable ring 630 included in the turntable 600 . With this configuration, when the turntable 600 rotates, the elastic member support frame 140 and the elastic member 150 also rotate together. In addition, when the platform 110 is raised and lowered, the turntable ring 630 will also be raised and lowered together.

The clamping pin 160 includes: a plurality of first pin parts 161 for supporting the substrate W; The force with which the clamping ring 120 rises.

The first pin portion 161 has a length in the vertical direction, and the upper end of the first pin portion 161 is in contact with the bottom surface of the substrate W to support the substrate W. As shown in FIG. The second pin portion 162 has a length in the vertical direction, and the upper end of the second pin portion 162 is in contact with the bottom surface of the clamp guide 130 to be described later, and supports the clamp guide 130 and the clamp ring 120 .

The upper end position of the second pin portion 162 is higher than the upper end position of the first pin portion 161 , and is loaded on the second pin portion 161 than the substrate W loaded on the upper end of the first pin portion 161 . The position of the clamp ring 120 at the upper end of the pin portion 162 is at a higher position. When the clamp pins 160 are moved in the up-down direction in such a state, the clamp ring 120 and the substrate W move up and down together.

A clamp pin driving portion (not shown) that provides a driving force for raising and lowering the clamp pin 160 in the up-down direction is provided. The clamping pin driving portion may be provided separately from the platform driving portion.

The up-and-down movement amount of the clamping pin 160 caused by the driving of the clamping pin driving part and the up-and-down movement amount of the table 110 caused by the driving of the table driving part may be set to be the same. That is, the clamping pin 160 and the platform 110 can move upward in the upward direction with the same movement amount, or move downward in the downward direction with the same movement amount.

A substrate support member 640 is coupled to the inner side of the turntable ring 630 . With the substrate support member 640 inserted into the substrate support member insertion groove formed on the upper surface of the stage 110 , the bottom surface of the substrate W contacts the upper surface of the stage 110 , thereby cooling the substrate W. When the stage 110 descends and the substrate support member 640 is disengaged from the substrate support member insertion groove, the substrate W is supported by the substrate support member 640 and can be rotated together by the rotation of the turntable 600 .

The substrate support member 640 may be made of various materials such as metal, synthetic resin, and polymer.

The first pin portion 161 of the clamping pin 160 is formed to penetrate the stage 110 and the substrate support member 640 in the up-down direction, and the second pin portion 162 of the clamping pin 160 is formed to pass through the stage 110 in the up-down direction. The edge position of the portion and the turntable ring 630.

The boundary portion between the upper chamber 100a and the lower chamber 100b is formed with a sheet portion 100c protruding inward. The platform 110 and the turntable ring 630 are lifted up, so that the upper surface of the turntable ring 630 is in close contact with the sheet portion 100c. A first sealing member 170 is sandwiched between the upper surface of the turntable ring 630 and the sheet portion 100c to maintain airtightness. In addition, a second sealing member 180 is sandwiched between the bottom surface of the turntable ring 630 and the upper surface of the platform 110 to maintain airtightness.

In this state, the first space S1 on the upper side and the second space S2 on the lower side of the inner space of the first chamber 100 are isolated from each other with the platform 110 as a reference.

FIG. 4 shows a state in which the first space S1 and the second space S2 are isolated from each other, and the stage 110 and the clamp pin 160 are raised by the drive of the stage driving part and the clamping pin driving part. In this state, the substrate W is loaded from the substrate loading unit 2a into the upper chamber 100a by the transfer robot, or the substrate W inside the upper chamber 100a is unloaded to the substrate loading unit 2a.

At this time, since the vertical position of the turntable main body 610 of the turntable 600 cannot be changed, the turntable ring 630 and the substrate support member 640 are separated from the turntable main body 610 and moved upward.

FIG. 6 is a state in which the stage 110 and the clamping pin 160 are lowered by the driving of the stage driving part and the clamping pin driving part.

If the platform driving part and the clamping pin driving part perform descending driving, the platform 110 and the clamping pins 160 will descend.

The turntable ring 630 , the substrate support member 640 , the elastic member support frame 140 , the elastic member 150 , the clamping ring 120 and the clamping guide 130 will descend integrally. At this time, the clamp ring 120 and the clamp guide 130 may be configured to descend by the same amount of movement.

If the turntable ring 630 and the substrate support member 640 descend to the position of the opening portion 620 of the turntable main body 610 as they descend, the turntable ring 630 will be positioned at the edge of the opening portion 620 .

Then, the stage 110 is lowered so as to be spaced apart from the substrate support member 640 , and the clamp pins 160 are lowered to a position where the upper ends of the first and second pin portions 161 and 162 are spaced apart from the substrate W and the bottom surfaces of the clamp guides 130 .

At this time, even if the driving of the stage driving portion is stopped, the clamping pin is driven so that the upper end of the second pin portion 162 of the clamping pin 160 is spaced from the bottom surface of the clamping guide 130 .

In this state, the clamp ring 120 and the clamp guide 130 are moved downward by the elastic restoring force of the elastic member 150 , and the upper surface of the clamp guide 130 is pushed away by the elastic member 150 . , the bottom surface of the clamping guide 130 will contact the upper surface of the turntable ring 630 .

In such a state, when the turntable 600 is rotated by the drive of the turntable drive unit, as shown in FIG. 7 , the substrate W is transferred to the second chamber 200 while being supported by the substrate support member 640 .

7 shows a state in which an upper stage 210 equipped with an upper heater and a lower stage 220 equipped with a lower heater are provided inside the second chamber 200, and the substrate W is passed by the turntable 600 on which the substrate W is loaded. It rotates and is transferred from the first chamber 100 to the second chamber 200 .

The clamping ring 120 may be located on the upper portion of the substrate W to prevent the substrate W from being deformed. If the clamping guide 130 is pushed downward by the elastic force of the elastic member 150 , so that the bottom surface of the clamping guide 130 is in close contact with the upper surface of the turntable ring 630 , the clamping ring 120 contacts the substrate A predetermined gap is formed between the upper surface of W or the bottom surface of the clamping ring 120 and the upper surface of the substrate W.

In such a state, when the substrate W is heat-treated, even if the edge portion of the substrate W is deformed, the substrate W can be prevented from being deformed by the clamp ring 120 . In addition, since the clamp ring 120 and the clamp guide 130 are supported by the elastic members 150 , it is possible to prevent excessive force from acting on the substrate W, thereby preventing damage and breakage of the substrate in advance.

In addition, the elastic force of the elastic member 150 acts on the upper part of the clamping ring 120 and the clamping guide 130, and is supported at the lower part by the clamping pin 160 in a manner opposite to the elastic force, and the clamping pin The driving part is adjusted so that the bottom surface of the clamp ring 120 is in contact with the upper surface of the substrate W or is spaced apart from the substrate W by a predetermined distance, so that the force acting on the substrate W can be adjusted.

The substrate is heated by the upper stage 210 and the lower stage 220, thereby realizing substrate processing. At this time, the upper stage 210 and the clamp ring 120 are spaced apart, and the lower stage 220 and the substrate support member 640 are also spaced apart.

Although FIG. 7 illustrates the second chamber 200, the third chamber 300, the fourth chamber 400, and the fifth chamber 500 are also equipped with an upper platform equipped with an upper heater and a lower heater equipped with an upper platform. lower platform. At this time, by heating the fifth chamber 500 at a lower temperature than the heating temperature of the substrate in the fourth chamber 400 , it is possible to configure the substrate to be heat-treated in the fourth chamber 400 . cooling effect.

FIG. 8 is a diagram showing a state in which the clamping pins 160 and the stage 110 are raised after the substrate W processed in the fifth chamber 500 is transferred to the first chamber 100 .

When the substrate W in the fifth chamber 500 is transferred to the first chamber 100 by the rotation of the turntable 600 , the stage driving part and the clamping pin driving part are driven, and the stage 110 and the clamping pins 160 are lifted.

The upper surface of the platform 110 is in contact with the bottom surface of the substrate W by the rise of the platform 110 , and the second pin portion 162 of the clamping pin 160 penetrates the edge position of the platform 110 and the turntable ring 630 in sequence, so that the upper end contacts the clamping pin 160 . The bottom surface of the guide 130 . At this time, the first pin portion 161 may be in a state in which the first pin portion 161 penetrates through the stage 110 , and the upper end thereof does not contact the bottom surface of the substrate W. As shown in FIG.

If the stage driving unit and the clamping pin driving unit are continuously driven in the above state, the upper surface of the turntable ring 630 is brought into contact with the bottom surface of the sheet portion 100c. At this time, the space between the turntable ring 630 and the sheet portion 100c is kept airtight by the first sealing member 170 . At the position where the turntable ring 630 comes into contact with the bottom surface of the sheet portion 100c, the driving of the stage driving portion is stopped.

At this time, the cooling unit is driven during the ascending of the substrate W, so that the cooling of the substrate W placed on the stage 110 can be performed, and the cooling of the substrate W can be additionally performed during a predetermined time period after the ascending of the substrate W is completed. .

In a state in which the upper surface of the turntable ring 630 is in contact with the bottom surface of the sheet portion 100c, when the cooling of the substrate W is completed, the clamping pin 160 will be further raised when the clamping pin driving portion is further driven to become as shown in FIG. 4 . state. At this time, the substrate W is lifted up by the first pin portion 161 to be spaced from the upper surface of the platform 110 , and the clamping guide 130 is moved upward by the second pin portion 162 against the elastic force of the elastic member 150 , thereby elastically moving upward. The member 150 is in a compressed state.

In this state, the gate valve is driven, the opening formed on one side of the upper chamber 100a is opened, and the substrate W is unloaded by the transfer robot.

As described above, the present invention is not limited to the above-mentioned embodiments, and those with basic knowledge in the technical field to which the present invention pertains can implement obvious modifications without departing from the technical idea of the present invention as claimed in the claims. , these variant implementations fall within the scope of the present invention.

1: Substrate processing device 2: Equipment front-end module 2a: Substrate loading section 2b: Substrate transfer section 100: first chamber 100a: Upper chamber 100b: lower chamber 100c: sheet part 110: Platform 120: Clamping ring 130: Clamping guide 140: Elastic parts support frame 150: elastic parts 160: Clamping pin 161: The first pin 162: The second pin 170: First sealing part 180: Second sealing part 200: Second chamber 210: Upper Platform 220: Lower Platform 300: Third chamber 400: Fourth chamber 500: Fifth chamber 600: Turntable 610: Turntable body 620: Opening 630: Turntable Ring 640: Substrate support parts H: horizontal plane C: Center W, W': substrate S1: First space S2: Second space

FIG. 1 is a diagram for explaining a warpage phenomenon of a substrate. 2 is a plan view showing the substrate processing apparatus of the present invention. 3 is a perspective view showing a turntable of the substrate processing apparatus of the present invention. 4 is a cross-sectional view showing an internal configuration of a first chamber in the substrate processing apparatus of the present invention. 5 is a plan view showing a turntable ring, a clamp ring, and a substrate of the substrate processing apparatus of the present invention. 6 is a cross-sectional view showing a state in which the clamping pins and the stage are lowered in the first chamber of the substrate processing apparatus of the present invention. 7 is a cross-sectional view showing a state in which the turntable is rotated and the wafer is transferred from the first chamber to the second chamber in the substrate processing apparatus of the present invention. 8 is a cross-sectional view of a state in which the clamping ring and the stage are raised in the first chamber of the substrate processing apparatus of the present invention.

1: Substrate processing device

2: Equipment front-end module

2a: Substrate loading section

2b: Substrate transfer section

100: first chamber

200: Second chamber

300: Third chamber

400: Fourth chamber

500: Fifth chamber

Claims (13)

A substrate processing apparatus comprising: a plurality of chambers arranged at predetermined intervals in a circumferential direction for processing a substrate; a turntable equipped to be rotatable for transferring the substrate between the chambers, wherein the chambers At least one of the chambers is equipped with: a platform on which the substrate is placed; a clamping ring positioned on the upper portion of the substrate in a manner of overlapping with an edge position portion of the substrate by a predetermined width and equipped to be raised and lowered to prevent loading on the substrate. deformation of the base plate on the platform; elastic members equipped to act on the clamping ring with an elastic force in the direction of the platform; and clamping pins equipped to oppose the elastic force acting on the clamping ring A way to make a force act on the clamping ring, wherein the turntable includes: a turntable body rotated by a turntable drive part; an annular turntable ring provided as a support and seated at the edge position of each of the plurality of opening parts The substrate processing apparatus is equipped with a stage driving section which provides a drive for raising and lowering the stage in the up-down direction, and is separated from the turntable main body in a state, the openings penetrate through the turntable main body and are formed in a number corresponding to the chambers. The force is performed in a state where the first space of the first chamber having the platform and the second space of the first chamber provided on the lower side of the first space and communicating with the chambers are spatially isolated from each other Loading and unloading of the substrate, and the platform and the turntable ring are moved together in the upward direction by the drive of the platform drive part, Then, the loading and unloading of the substrate are performed in a state where the turntable ring is in close contact with the sheet portion provided at the boundary between the first space and the second space. The substrate processing apparatus according to claim 1, wherein a clamping pin driving portion that provides a driving force for raising and lowering the clamping pin is provided, wherein the stage driving portion and the clamping pin driving portion are in an up-down direction Lift and lower at the same height when raising and lowering. The substrate processing apparatus according to claim 1, wherein the clamping ring and the elastic member are provided on the turntable so as to rotate together when the turntable rotates. The substrate processing apparatus according to claim 1, wherein the turntable further comprises: a substrate support member coupled to the inner side of the turntable ring and placing the substrate on an upper portion. The substrate processing apparatus according to claim 4, wherein the clamping pin is provided to penetrate the turntable ring in an up-down direction. The substrate processing apparatus according to claim 5, wherein the clamping pin is provided so as to penetrate the edge position portion of the stage in the up-down direction. The substrate processing apparatus according to claim 4, wherein a clamping guide is provided so as to be coupled to the edge position portion of the clamping ring and to make the upper end of the clamping pin contact the bottom surface; and an elastic member supporting frame is provided with In order to extend upward on the turntable ring, one end of the elastic member is supported by the clamping guide, and the other end of the elastic member is supported by the elastic member support frame. The substrate processing apparatus according to claim 4, wherein when the stage is raised by the driving of the stage driving part, the turntable ring, the clamping ring and the clamping pin are raised together. The substrate processing apparatus according to claim 1, wherein a first sealing member for maintaining airtightness is provided between the upper surface of the turntable ring and the sheet portion, the bottom surface of the turntable ring and the upper surface of the edge position portion of the stage A second sealing member for maintaining airtightness is provided therebetween. The substrate processing apparatus according to claim 1, wherein the clamping ring is equipped to provide lifting and lowering so that the bottom surface of the clamping ring contacts the upper surface of the edge position portion of the substrate, or the bottom surface of the clamping ring is in contact with the upper surface of the edge position portion of the substrate. The upper surface of the edge position portion of the substrate is close to each other in the up-down direction to form a predetermined gap. The substrate processing apparatus according to claim 1, wherein the chambers include: a first chamber for loading and unloading the substrate; a second chamber, a third chamber, and a fourth chamber for loading and unloading the substrate The substrate in the first chamber is heated for heat treatment; in the fifth chamber, the substrate subjected to heat treatment in the fourth chamber is cooled, and the substrate in the fifth chamber is transferred to the first chamber to be cooled and unloaded . The substrate processing apparatus according to claim 11, wherein the second chamber, the third chamber, and the fourth chamber are equipped with upper and lower heaters for heating the substrate, which are provided at the upper and lower portions of the substrate, respectively A heater, the turntable is equipped to pass between the upper heater and the lower heater while rotating. The substrate processing apparatus according to claim 12, wherein the fifth chamber is equipped with a heater for heating the substrate, and the heating temperature of the heater of the fifth chamber is set lower than that in the fourth chamber The temperature of the substrate is heated, thereby achieving cooling of the substrate.

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