CN105448785A - Semi-conductor film forming equipment, automatic positioning and clamping structures of wafer and clamping method - Google Patents
Semi-conductor film forming equipment, automatic positioning and clamping structures of wafer and clamping method Download PDFInfo
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- CN105448785A CN105448785A CN201511022294.9A CN201511022294A CN105448785A CN 105448785 A CN105448785 A CN 105448785A CN 201511022294 A CN201511022294 A CN 201511022294A CN 105448785 A CN105448785 A CN 105448785A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 230000008569 process Effects 0.000 claims abstract description 13
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 230000005484 gravity Effects 0.000 claims description 19
- 230000009471 action Effects 0.000 claims description 15
- 230000001154 acute effect Effects 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 28
- 239000012495 reaction gas Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention discloses semi-conductor film forming equipment, automatic positioning and clamping structures of a semiconductor substrate, and a clamping method. The semi-conductor film forming equipment comprises M positioning and clamping structures, wherein the M positioning and clamping structures are coaxially arranged with a base, circularly distributed at the periphery on the upper surface of the base, and used for clamping the substrate in a technological process; M is an integer larger than or equal to 3; each positioning and clamping structure comprises a positioning hole penetrating the base and a self-positioning clamping bracket; each self-positioning clamping bracket comprises a vertical lifting guide rod and a claw which are in pin connection with each other, as well as a support arranged below the base; each claw is in pin connection with the top of the corresponding vertical lifting guide rod; one end of each claw faces an axis, while the other end of the claw is far away from the axis; the outer end, far away from the axis, of each claw comprises a positioning step higher than the upper surface of the claw, and a clamping acute-angled card groove sunken into the inner side of the positioning step; and each vertical lifting guide rod penetrates the corresponding positioning hole, while the bottom of the vertical lifting guide rod is propped against the corresponding support.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to semiconductor film forming equipment, an automatic positioning and clamping structure of a semiconductor wafer and a clamping method.
Background
In recent years, semiconductor devices have been rapidly developed, and these devices are mainly composed of a plurality of thin films having different thicknesses, which are formed on a substrate (i.e., a wafer, hereinafter collectively referred to as a "substrate"), and thus, a film formation apparatus, which is the core of the semiconductor device, is an important factor in determining the quality and yield of thin film growth of the semiconductor device.
Generally, a semiconductor film forming apparatus includes a susceptor for placing a substrate in a reaction chamber, and a robot arm may perform a film forming process after concentrically placing the substrate and a reaction gas shower head on an upper surface of the susceptor. However, the film forming methods of the prior art often result in non-uniformity of the thin film due to:
firstly, after a substrate is placed on a base, the pressure in a reaction chamber can be reduced to the process pressure, and the gas pumping process can cause the drift of an unfixed substrate because the substrate is not fixed, so that the substrate and a reaction gas spray head are not concentric in the film forming process;
secondly, when the pedestal is lifted, the substrate is not fixed, and the lifting process of the pedestal can cause substrate drift, so that the substrate cannot fall on the required position of the pedestal;
thirdly, when the base rotates, the substrate can also move due to the rotation of the base because the substrate is not fixed, so that the substrate can not fall on the required position of the base, and even the substrate is thrown out of the base, thereby causing the substrate to be broken;
fourth, substrate drift can also cause non-uniform film formation between substrate pieces.
That is, the semiconductor film forming apparatus requires the substrate to be concentric with the reaction gas shower head in order to grow a uniform and high quality film, and the above-mentioned problems in the prior art significantly reduce the uniformity of film formation, thereby increasing the fraction defective of the product.
However, the semiconductor film formation process needs to be performed in a closed environment, and an operator cannot observe the position change of the substrate in the reaction chamber in real time. Generally, the substrate is not known to have moved until the robot picks up the film-grown substrate and finds that the substrate is not in the desired position, at which time the process is complete, adding unnecessary time cost.
Therefore, how to provide an automatic substrate positioning and clamping structure and a clamping method for a cavity of a semiconductor film forming apparatus, so that the substrate can be positioned in the film forming process, has become a technology to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to solve the defect that a substrate is not positioned and clamped, and provides a semiconductor film forming device, an automatic positioning and clamping structure of a semiconductor substrate and a clamping method, which can automatically fix and position the substrate and avoid the phenomenon that film forming is not uniform or even fails due to the movement of the substrate. Meanwhile, the semiconductor film forming equipment, the automatic positioning and clamping structure of the semiconductor substrate and the clamping method do not influence the uniformity of the thermal field of the base, so that the film forming is more uniform, and the difference between the sheets is eliminated to a greater extent. In order to achieve the purpose, the technical scheme of the invention is as follows:
a semiconductor film forming apparatus includes a reaction chamber and a susceptor carrying a substrate, the susceptor having a support shaft; the substrate clamping device is characterized by further comprising M positioning clamping structures, wherein the M positioning clamping structures and the base are coaxially and annularly distributed on the periphery of the upper surface of the base and used for clamping the substrate in the process; wherein M is an integer greater than or equal to 3; the positioning and clamping structure comprises:
a positioning hole penetrating through the base;
the self-positioning clamping support comprises a vertical lifting guide rod and a clamping jaw which are mutually connected through a pin shaft, and a support positioned below the base; the jack catch pin shaft is connected to the top of the vertical lifting guide rod, one end of the jack catch faces to the axis, and the other end of the jack catch is far away from the axis; the outer end far away from the axis comprises a positioning step higher than the upper surface of the clamping jaw and a clamping acute angle clamping groove recessed into the inner side of the positioning step; the vertical lifting guide rod penetrates through the positioning hole, and the bottom of the vertical lifting guide rod is abutted to the support; wherein,
when the substrate is not loaded, the outer ends of the M clamping jaws incline downwards by a preset angle by taking the pin shaft as a fulcrum under the action of the gravity center of the clamping jaws;
when the lower surface of the substrate is in contact with the upper surfaces of the clamping jaws, the outer ends of the M clamping jaws are lifted upwards to a horizontal position by taking the pin shaft as a fulcrum under the action of the gravity center of a matching body formed by the positioning clamping support and the substrate, so that the substrate is clamped in the clamping acute-angle clamping groove.
In some preferred embodiments of the present invention, the upper surface of the base has a positioning groove, the positioning groove is matched with the shape of the claw, and the positioning hole of the base is located in the positioning groove.
In some preferred embodiments of the present invention, the M positioning and clamping structures are uniformly distributed coaxially and annularly with the base.
In some preferred embodiments of the present invention, the positioning hole has an oblong opening, and the vertical lift guide rod can freely slide up and down in the positioning hole but cannot freely rotate.
In some preferred embodiments of the present invention, an included angle between the acute clamping slot and the horizontal plane is 0.1 ° to 10 °.
In some preferred embodiments of the present invention, the acute clamping groove has an angle of 1 ° with respect to the horizontal plane.
In some preferred embodiments of the present invention, an opening included angle of the clamping groove is 5 ° to 85 °.
In some preferred embodiments of the present invention, the support is a heat reflecting plate.
In some preferred embodiments of the present invention, the circumference where the M positioning and clamping structures are located is not within the thermal field area of the heat reflecting plate.
In order to achieve the above object, the present invention further provides a technical solution as follows:
a positioning and clamping structure of a semiconductor film forming device comprises a reaction chamber and a base for bearing a substrate, wherein the base is provided with a supporting shaft; the positioning and clamping structure comprises:
the positioning groove is positioned on the upper surface of the base, and a positioning hole penetrating through the base is formed in the positioning groove;
the self-positioning clamping support comprises a vertical lifting guide rod and a clamping jaw which are mutually connected through a pin shaft, and a support positioned below the base; the jack catch pin shaft is connected to the top of the vertical lifting guide rod, one end of the jack catch faces to the axis, and the other end of the jack catch is far away from the axis; the outer end far away from the axis comprises a positioning step higher than the upper surface of the clamping jaw and a clamping acute angle clamping groove recessed into the inner side of the positioning step; the vertical lifting guide rod penetrates through the positioning hole, and the bottom of the vertical lifting guide rod is abutted to the support; wherein,
when the substrate is not loaded, the outer ends of the M clamping jaws incline downwards by a preset angle by taking the pin shaft as a fulcrum under the action of the gravity center of the clamping jaws;
when the lower surface of the substrate is in contact with the upper surfaces of the clamping jaws, the outer ends of the M clamping jaws are lifted upwards to a horizontal position by taking the pin shaft as a fulcrum under the action of the gravity center of a matching body formed by the positioning clamping support and the substrate, so that the substrate is clamped in the clamping acute-angle clamping groove.
In order to achieve the above object, the present invention further provides a technical solution as follows:
a clamping method adopting the substrate automatic positioning clamping structure comprises the following steps:
step S1: lowering the susceptor to a lowered position using a lifting unit such that the bottom of the vertical lifting guide bar is in contact with the heat reflection plate; under the action of gravity, the clamping jaws are opened towards the outer ends far away from the circle center of the base;
step S2: a substrate is placed above the self-positioning clamping support by using a manipulator and is downwards moved until the lower surface of the substrate contacts with the upper surfaces of the clamping jaws;
step S3: the substrate is separated from the mechanical arm, the gravity of the substrate acts on the clamping jaw, and the clamping jaw is driven to move towards the center of the base, so that the positioning step is contacted with the outer circle of the substrate;
step S4: a lifting unit is used for driving the base to ascend to the bottom of the vertical lifting guide rod to be separated from the heat reflection plate;
step S5: the clamping jaws are cooperatively sunk in the positioning grooves under the action of gravity and automatically clamp the substrate.
According to the technical scheme, the substrate automatic positioning and clamping structure is matched with a lever mechanism according to gravity, is simple in structure, and can realize the automatic positioning and clamping function without external power, so that the substrate is fixed on the base, the film growth is more uniform, and the difference among the sheets is eliminated. The substrate automatic positioning and clamping structure provided by the invention has another beneficial characteristic that the circumference where the M automatic positioning and clamping structures are located and the automatic positioning and clamping structures are not in the heat field area of the heat reflection plate, so that the uniformity of the heat field can not be influenced, and the high quality of film forming is further ensured.
Drawings
FIG. 1 is a cross-sectional view of one embodiment of a chamber of a semiconductor film forming apparatus having a single non-rotating susceptor according to the present invention
FIG. 2 is a schematic perspective view of the self-positioning clamping bracket of the present invention
FIG. 3 is a schematic perspective view of the automatic positioning and clamping structure and the base of the present invention
FIG. 4 shows a block diagram and force diagram of a self-positioning clamp bracket with a base in a low position according to an embodiment of the invention
Figure 5 shows a force diagram for a self-positioning chucking fixture for chucking a substrate according to one embodiment of the present invention
Detailed Description
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. The present invention may, but need not, be embodied in different forms and should not be construed as limited to the embodiments set forth herein.
The automatic positioning and clamping structure and the clamping method of the semiconductor substrate can be used for any cavity of semiconductor equipment needing to fix the substrate on the base. Specifically, the automatic positioning and clamping structure and the clamping method of the semiconductor substrate can be applied to a semiconductor film equipment cavity with a lifting base or a rotating base according to the functions of the base, and are also applied to a semiconductor film equipment cavity with a fixed base; the automatic positioning and clamping structure and the clamping method of the semiconductor substrate can be suitable for a plurality of rotary bases, a single rotary base and a single non-rotary base. For convenience of description, the following embodiments will be described in detail with reference to a single-piece non-rotatable base as an example.
Referring to FIG. 1, FIG. 1 is a cross-sectional view of one embodiment of a chamber of a semiconductor film forming apparatus having a single non-rotating susceptor according to the present invention. As shown in fig. 1, a reaction chamber 1 of a semiconductor film forming apparatus has therein a susceptor 2 for placing a substrate 4, a self-positioning chuck support 3, a robot arm 5, a heat reflection plate 6, a lifting unit 7, and a reaction gas shower head 8. Wherein, the reaction chamber 1 provides a closed and clean reaction place for the substrate 4, the reaction gas spray header 8 is arranged above the reaction chamber 1 and is concentric with the reaction chamber 1, the lifting unit 7 is connected with the bottom surface of the reaction chamber 1, the base 2 is connected with the lifting unit 7 and ensures that the base 2 is concentric with the reaction chamber 1, the lifting unit 7 can drive the base 2 to move up and down, and the heat reflection plate 6 is fixed at the bottom surface of the reaction chamber 1 and is concentric with the reaction chamber 1; the self-positioning chuck support 3 cooperates with a positioning aperture 10 (shown in figure 4) in the susceptor 2 and a robot 5 may be used to transfer a substrate 4, the substrate 4 being seated on the upper surface of the susceptor 2 by the self-positioning chuck support 3 during the process.
Referring to fig. 2, fig. 2 is a schematic perspective view of a positioning and clamping bracket in the positioning and clamping structure of the present invention. As shown, the self-positioning chucking bracket 3 includes a vertically disposed vertical lifting guide bar 21 and a jaw 22, and the material of the vertical lifting guide bar 21 and the jaw 22 may be the same as that of the susceptor, and preferably, may be ceramic, quartz, or graphite, etc. The clamping jaw 22 is connected to the top of the vertical lifting guide rod 21 through a pin shaft 23, the upper surface 26 of the clamping jaw 22 is a plane, one end of the clamping jaw 22 faces the shaft center, the other end of the clamping jaw 22 is far away from the shaft center, the outer end far away from the shaft center comprises a positioning step 27 higher than the upper surface 26 of the clamping jaw 22, and the positioning step 27 is used for clamping the substrate 4. The inner side (the side facing the axis) of the positioning step 21 is provided with a clamping acute angle clamping groove 24, and the clamping groove 24 is a wedge-shaped space embedded in the inner side of the positioning step 27. Wherein, the angle from the upper end to the lower end of the slot 24 is preferably 5-85 degrees, more preferably, the angle of the slot 22 is 10 degrees.
In a preferred embodiment of the present invention, the vertical lift guide bar 21 is a long cylindrical structure having an opening at the top thereof, and the jaw 22 is located in the opening and is connected to the vertical lift guide bar 21 by a pin. The outer end of the claw 22 far away from the axis is provided with a first fulcrum 25, the gravity center of the claw 22 is positioned at the outer end of the pin shaft 23, and when no substrate is placed, the claw 22 can be ensured to take the pin shaft 23 as the fulcrum to drive the first fulcrum 25 to incline downwards. The numerical value lifting guide rod 21 is matched with the positioning hole, can freely slide up and down in the positioning hole, but cannot rotate freely.
Referring to fig. 3, fig. 3 is a schematic perspective view of an automatic positioning and clamping structure and a base according to the present invention. In the embodiment of the present invention, M self-positioning clamping structures are uniformly distributed around the base 2 coaxially and annularly with the base 2, and preferably, the number of the self-positioning clamping structures is at least 3. The automatic positioning and clamping structure comprises a self-positioning clamping support 3 which is abutted with a heat reflection plate 6 through a positioning hole penetrating through the base 2. As can be seen from FIG. 3, in this embodiment of the present invention, the center of the circle where the automatic positioning and clamping structure is located and the automatic positioning and clamping structure are not located in the thermal field region of the heat reflection plate, and such structure does not affect the uniformity of the thermal field, so as to ensure the film forming quality.
Referring to fig. 4, fig. 4 is a structural view illustrating an automatic positioning and clamping structure according to an embodiment of the present invention when a base is in a low position. As shown in the figure, the upper surface of the base 2 has a positioning groove 11, the positioning hole 10 is opened in the positioning groove 11, when the lifting unit 7 drives the base 2 to lower, the vertical lifting guide rod 21 penetrates through the positioning hole 10, and the bottom of the vertical lifting guide rod abuts against the heat reflection plate 6. When the substrate 4 is placed on the upper surface of the clamping jaw 22, because the clamping jaw 22 is added with the weight of the substrate 4, the outer ends of the M clamping jaws are upwards contracted and lifted to a horizontal position by taking the pin shaft 23 as a fulcrum under the action of the gravity center of a matching body formed by the clamping jaw 22 and the substrate. In the process of shrinking, the gravity center of the matching body formed by the M clamping jaws and the substrate 4 is gradually close to the vertical center of the clamping jaw 22, and when the M clamping jaws 22 are vertical, the matching body formed by the M clamping jaws and the substrate 4 is relatively stable, so that the M clamping jaws do not shrink inwards any more, and the substrate 4 is clamped and positioned in the clamping groove 24 through the positioning step 27. Even if the substrate is biased by the robot, one of the fingers 22 that first contacts the edge of the substrate 4 pushes the substrate 4 towards the other fingers, and after all fingers contact the edge of the substrate 4, the substrate 4 is clamped in the circle formed by the pockets of the M fingers, i.e. the substrate 4 is positioned. At this time, a lever mechanism is formed by the gravity 32 of the substrate 4 and the chuck 22, and a first chucking force 31 is generated by a lever action, wherein a horizontal component of the first chucking force 31 chucks the substrate 4 while a vertical component thereof presses the substrate 4 against the upper surface 26 of the chuck 22.
Referring to fig. 5, the base 2 is driven by the lifting unit 7 (not shown in fig. 5) to ascend until the bottom of the vertical lifting guide bar 21 is separated from the heat reflection plate 6, and the claws 22 are cooperatively recessed in the positioning grooves 11. At the same time, the lower surface of the substrate 4 contacts the upper surface of the susceptor 2, so that the first clamping force 31 (shown in fig. 4) provided by the self-weight of the substrate 4 disappears, but at the same time, the first fulcrum 25 contacts the second fulcrum 43 located at the corresponding position on the positioning recess 11, forming a lever structure with the second fulcrum 43 as a fulcrum, which forms the second clamping force 41 under the action of the weight 42 of the positioning clamping bracket 3. Wherein the second clamping force 41 can be decomposed into a force horizontally pointing to the center of the susceptor and a vertically downward force, wherein the substrate 4 is clamped again by the force horizontally pointing to the center of the susceptor, and the vertically downward force can press the substrate 4 against the upper surface of the susceptor 2.
The above description is only a preferred embodiment of the present invention, and the embodiments are not intended to limit the scope of the present invention, so that all equivalent structural changes made by using the contents of the specification and the drawings of the present invention should be included in the scope of the present invention.
Claims (10)
1. A semiconductor film forming apparatus includes a reaction chamber and a susceptor carrying a substrate, the susceptor having a support shaft; the substrate clamping device is characterized by further comprising M positioning clamping structures, wherein the M positioning clamping structures and the base are coaxially and annularly distributed on the periphery of the upper surface of the base and used for clamping the substrate in the process; wherein M is an integer greater than or equal to 3; the positioning and clamping structure comprises:
a positioning hole penetrating through the base;
the self-positioning clamping support comprises a vertical lifting guide rod and a clamping jaw which are mutually connected through a pin shaft, and a support positioned below the base; the jack catch pin shaft is connected to the top of the vertical lifting guide rod, one end of the jack catch faces to the axis, and the other end of the jack catch is far away from the axis; the outer end far away from the axis comprises a positioning step higher than the upper surface of the clamping jaw and a clamping acute angle clamping groove recessed into the inner side of the positioning step; the vertical lifting guide rod penetrates through the positioning hole, and the bottom of the vertical lifting guide rod is abutted to the support; wherein,
when the substrate is not loaded, the outer ends of the M clamping jaws incline downwards by a preset angle by taking the pin shaft as a fulcrum under the action of the gravity center of the clamping jaws;
when the lower surface of the substrate is in contact with the upper surfaces of the clamping jaws, the outer ends of the M clamping jaws are lifted upwards to a horizontal position by taking the pin shaft as a fulcrum under the action of the gravity center of a matching body formed by the positioning clamping support and the substrate, so that the substrate is clamped in the clamping acute-angle clamping groove.
2. The semiconductor film forming apparatus according to claim 1, wherein the susceptor has a positioning groove on an upper surface thereof, and the positioning hole of the susceptor is located in the positioning groove.
3. The semiconductor film forming apparatus according to claim 1, wherein the M number of positioning chuck structures are uniformly distributed annularly coaxially with the susceptor.
4. The semiconductor film forming apparatus according to claim 1, wherein an angle between the acute chucking groove and a horizontal plane is 0.1 ° to 10 °.
5. The semiconductor film forming apparatus according to claim 4, wherein an angle between the acute chucking groove and a horizontal plane is 1 °.
6. The semiconductor film forming apparatus according to claim 1, wherein an opening angle of the notch is 5 ° to 85 °.
7. The semiconductor film forming apparatus according to claim 1, wherein the support is a heat reflecting plate.
8. The semiconductor film forming apparatus according to claim 7, wherein none of the M self-positioning chucking structures and the circumference on which they are located are within the thermal field region of the heat reflecting plate.
9. A positioning and clamping structure of a semiconductor film forming device comprises a reaction chamber and a base for bearing a substrate, wherein the base is provided with a supporting shaft; the positioning and clamping structure comprises:
the positioning groove is positioned on the upper surface of the base, and a positioning hole penetrating through the base is formed in the positioning groove;
the self-positioning clamping support comprises a vertical lifting guide rod and a clamping jaw which are mutually connected through a pin shaft, and a support positioned below the base; the jack catch pin shaft is connected to the top of the vertical lifting guide rod, one end of the jack catch faces to the axis, and the other end of the jack catch is far away from the axis; the outer end far away from the axis comprises a positioning step higher than the upper surface of the clamping jaw and a clamping acute angle clamping groove recessed into the inner side of the positioning step; the vertical lifting guide rod penetrates through the positioning hole, and the bottom of the vertical lifting guide rod is abutted to the support; wherein,
when the substrate is not loaded, the outer ends of the M clamping jaws incline downwards by a preset angle by taking the pin shaft as a fulcrum under the action of the gravity center of the clamping jaws;
when the lower surface of the substrate is in contact with the upper surfaces of the clamping jaws, the outer ends of the M clamping jaws are lifted upwards to a horizontal position by taking the pin shaft as a fulcrum under the action of the gravity center of a matching body formed by the positioning clamping support and the substrate, so that the substrate is clamped in the clamping acute-angle clamping groove.
10. A chucking method using the substrate automatic positioning chucking mechanism recited in claim 9, comprising the steps of:
step S1: lowering the susceptor to a lowered position using a lifting unit such that the bottom of the vertical lifting guide bar is in contact with the heat reflection plate; under the action of gravity, the clamping jaws are opened towards the outer ends far away from the circle center of the base;
step S2: a substrate is placed above the self-positioning clamping support by using a manipulator and is downwards moved until the lower surface of the substrate contacts with the upper surfaces of the clamping jaws;
step S3: the substrate is separated from the mechanical arm, the gravity of the substrate acts on the clamping jaw, and the clamping jaw is driven to move towards the center of the base, so that the positioning step is contacted with the outer circle of the substrate;
step S4: a lifting unit is used for driving the base to ascend to the bottom of the vertical lifting guide rod to be separated from the heat reflection plate;
step S5: the clamping jaws are cooperatively sunk in the positioning grooves under the action of gravity and automatically clamp the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511022294.9A CN105448785B (en) | 2015-12-31 | 2015-12-31 | Semiconductor film-forming apparatus, wafer automatic positioning clamping structure and method for chucking |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201511022294.9A CN105448785B (en) | 2015-12-31 | 2015-12-31 | Semiconductor film-forming apparatus, wafer automatic positioning clamping structure and method for chucking |
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| Publication Number | Publication Date |
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| CN105448785A true CN105448785A (en) | 2016-03-30 |
| CN105448785B CN105448785B (en) | 2018-12-18 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029236A (en) * | 2018-10-09 | 2020-04-17 | 北京北方华创微电子装备有限公司 | Supporting device and reaction chamber |
| CN111199909A (en) * | 2018-11-19 | 2020-05-26 | 北京北方华创微电子装备有限公司 | Base component and semiconductor processing equipment |
| CN115338804A (en) * | 2022-10-13 | 2022-11-15 | 吾拾微电子(苏州)有限公司 | Adjustable wafer fixture device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111029236A (en) * | 2018-10-09 | 2020-04-17 | 北京北方华创微电子装备有限公司 | Supporting device and reaction chamber |
| CN111199909A (en) * | 2018-11-19 | 2020-05-26 | 北京北方华创微电子装备有限公司 | Base component and semiconductor processing equipment |
| CN111199909B (en) * | 2018-11-19 | 2023-06-16 | 北京北方华创微电子装备有限公司 | Base assembly and semiconductor processing equipment |
| CN115338804A (en) * | 2022-10-13 | 2022-11-15 | 吾拾微电子(苏州)有限公司 | Adjustable wafer fixture device |
| CN115338804B (en) * | 2022-10-13 | 2023-02-03 | 吾拾微电子(苏州)有限公司 | Adjustable wafer fixture device |
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| CN105448785B (en) | 2018-12-18 |
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