CN104576495A - Wafer clamping device - Google Patents
Wafer clamping device Download PDFInfo
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- CN104576495A CN104576495A CN201510010027.3A CN201510010027A CN104576495A CN 104576495 A CN104576495 A CN 104576495A CN 201510010027 A CN201510010027 A CN 201510010027A CN 104576495 A CN104576495 A CN 104576495A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer clamping device. Clamping pieces are arranged on a rotary chuck, the clamping pieces are composed of magnetic rotors, stators and screw rods, screw pairs are formed by the rotors and the screw rods, the power-on sequence of power-on currents in a plurality of sets of coils of the stators is controlled through a control unit, a magnetic field with rotating changes is formed, the rotors are driven to do rotating and lifting motion along the screw rods between the lower technology height and the upper wafer taking and placing height, check blocks on the rotors are driven to rotate between the angle of clamping a wafer and the angle of releasing the wafer, the wafer is clamped or released, the problems that due to the fact that the distance between the clamped wafer and a clean gas spraying device on the chuck is too large, the back face of the wafer cannot be effectively protected in the technology process can be effectively solved, and the back face of the wafer is prevented from being contaminated by chemical liquid. Meanwhile, enough operation space can be reserved for a mechanical arm for grabbing the wafer from the back face of the wafer when the wafer is taken and placed, and reliability of the wafer taking and placing action is improved.
Description
Technical field
The present invention relates to semiconductor integrated circuit processing cleaning equipment field, more specifically, relate to a kind of device for clamping wafer for wet clean equipment.
Background technology
Along with the high speed development of semiconductor integrated circuit manufacturing technology, the characteristic size of integrated circuit (IC) wafer has entered into the deep-submicron stage, and causes the characteristic size of the key particles of superfine circuit malfunction or damage on wafer also greatly to reduce thereupon.
In the production and processing technology process of integrated circuit, semiconductor wafer (silicon chip) usually all can through multiple tracks manufacturing process such as such as thin film deposition, etching, polishings.And these manufacturing process just become the important place that particle produces.In order to keep the clean conditions of wafer surface, eliminating the particle being deposited on wafer surface in each manufacturing process, clean must be carried out to the wafer that subjected to after per pass manufacturing process.Wet clean process, because of the superior characteristic of the cleaning resultant effect that it has, becomes the main flow cleaning method eliminating wafer surface particle.
In order to effectively remove the particle of wafer surface, when making single-chip wet clean process, wafer will be placed on rotating and clamping device (such as with the rotary chuck of holder), and rotate according to certain speed; Simultaneously to the chemical liquids of the front spray certain flow of wafer, wafer surface is cleaned.
, if the rotary speed of wafer is too low, the chemical liquids of front wafer surface will from Waffer edge infiltration to the back side of wafer; And if the rotary speed of wafer is too high, the chemical liquids of front wafer surface will get rid of the process cavity into recovery chemical liquids with higher speed, clash into, and backwash is to the front and back of wafer with process cavity.The chemical liquids of front wafer surface splash can be washed by ultrapure water, but the chemical liquids of chip back surface splash is difficult to remove.
Prior art is generally provided with the injection apparatus of clean gas (as nitrogen) on the rotary chuck of holding chip, by ejecting the back side of clean gas cover wafers of certain flow, certain pressure in technical process, be attached to chip back surface to stop chemical liquids.Now, require by the clearance control between chip back surface and clean gas injection apparatus in less scope, just can make clean gas available protecting chip back surface, avoid the pollution of chemical liquids.If but gap is therebetween too small, will make do not have enough operating spaces when picking and placeing sheet from the manipulator of chip back surface grippale tabs.
The problems referred to above make the gap between chip back surface and clean gas injection apparatus to be reduced further, thus weaken the Vaccine effectiveness of clean gas to chip back surface, easily cause partial chemical liquid splash to chip back surface, create adverse effect to yield.
Therefore, need to propose a kind of device for clamping wafer that effectively can realize back-protective.
Summary of the invention
The object of the invention is to the above-mentioned defect overcoming prior art existence; a kind of novel device for clamping wafer is provided; can according to technique height and the different demands picking and placeing wafer height; change the distance between wafer and chuck; realizing both chip back surface to be made to obtain the available protecting of clean gas at technique height, can ensure that manipulator is from chip back surface successfully grippale tabs picking and placeing wafer height again.
For achieving the above object, technical scheme of the present invention is as follows:
A kind of device for clamping wafer, comprise rotary chuck, chuck rotary drive mechanism, holder, described holder is at least three, be uniformly distributed along described chuck perimeter, for placement and holding chip carry out technique betwixt, described holder comprises the magnetic mover vertically arranged, the magnetic stator arranged around described mover gap and to be located at below described mover and to form the screw rod of vertical direction screw pair with described mover, described mover upper surface is wafer placed side, and higher than described chuck upper surface, described placed side is provided with an eccentric block, for holding chip, described stator is wound with organizes coil more, and connection control unit, described stator, the affixed described chuck of screw rod, described control unit forms by the energising order controlling electrical current in described many group coils the magnetic field rotating change, drive described mover along described screw rod below technique height with above pick and place the intercropping rotary lifting movement of wafer height, make the wafer on described placed side and the vertical range between described chuck upper surface adjustable, simultaneously, described mover is at technique height and pick and place between wafer height and drive described block to rotate between the angle and the angle of unclamping wafer of clamped wafer, make the radial distance between described block and described chuck pivot adjustable, with at technique height and pick and place rotation and lifting between wafer height and wafer clamped or unclamps.
Preferably, described chuck is provided with hollow cavity, and described holder is located in described cavity, and the wafer placed side of described mover passes described chuck upper surface, the affixed described cavity inner wall of described stator, screw rod, described chuck lower end is rotationally connected chuck rotary drive mechanism by rotating shaft, is coaxially equipped with fixed axis in described rotating shaft, and described fixed axis upper end is socketed with conducting slip ring, and described conducting slip ring penetrates in described cavity and arranges, described control unit comprises the control circuit be made up of external ac power source, rectifier, driver module, Switching Power Supply, control board, wherein, the alternating current inputted by described external ac power source, one tunnel is converted to DC bus-bar voltage through described rectifier, be carried on the described driver module that is connected with each group of coil of described stator, another road is converted to direct voltage through described Switching Power Supply, be supplied to described control board, described control board gathers the voltage that coil respectively organized by described stator, electric current, calculate the position of described mover, the frequency of each branch power switching element switch and duty ratio in driver module described in FEEDBACK CONTROL, the location of described mover is controlled, and drive described mover along described screw rod at technique height and the intercropping rotary lifting movement picking and placeing wafer height, and drive described block to rotate between the angle and the angle of unclamping wafer of clamped wafer, described driver module connects described conducting slip ring by many output leads, and each group of coil of described stator connects described conducting slip ring by current supply line in described cavity, to export each road driving voltage from described driver module to described stator.
Preferably, the helical pitch S of described screw rod meets following formula:
Wherein, the symbol in formula denominator || be absolute value sign.
Preferably, described stator, mover are respectively soft magnetism stator and permanent magnetism mover.
Preferably, the wafer placed side of described mover is plane, and described block is located at the edge of described wafer placed side.
Preferably, described block is the cylinder vertically arranged.
Preferably, described control unit controls to make each described mover synchronous axial system.
Preferably, described chuck rotary drive mechanism comprises quill shaft electric rotating machine, the quill shaft of described quill shaft electric rotating machine is arranged around described fixed axis concentric gap, described quill shaft connects described rotating shaft, described quill shaft electric rotating machine rotates by driving described quill shaft, drives the described chuck synchronous rotary of described rotating shaft and connection thereof.
Preferably, described chuck rotary drive mechanism comprises axle electric rotating machine, be connected to form synchronous axial system by Timing Belt between the rotating shaft of described axle electric rotating machine and described rotating shaft, drive the described chuck synchronous rotary be connected with described rotating shaft, described rotating shaft is rotationally connected described fixed axis.
Preferably, formed by rolling bearing between described rotating shaft and described fixed axis and be rotationally connected.
As can be seen from technique scheme, the present invention is by arranging by magnetic mover at rotary chuck, stator and the holder formed with the screw rod that mover forms screw pair, and the energising order of electrical current in many groups coil of stator is controlled by control unit, form the magnetic field rotating change, drive mover along screw rod below technique height with above pick and place the intercropping rotary lifting movement of wafer height, and drive the block on mover to rotate between the angle and the angle of unclamping wafer of clamped wafer, wafer is clamped or unclamps, thus can according to technique height and the different demands picking and placeing wafer height, change the distance between wafer and chuck.Therefore, the present invention has following distinguishing feature:
1. the present invention can effectively solve due to by clean gas injection apparatus on holding chip and chuck apart from excessive, cause the problem can not carrying out available protecting in technical process to chip back surface, avoid chemical liquids to the pollution of chip back surface.
2. the present invention while realization is to chip back surface protection, for the manipulator capturing wafer from chip back surface leaves enough operating spaces when picking and placeing sheet, can improve the reliability that wafer picks and places action.
Accompanying drawing explanation
Fig. 1 is the perspective view of a kind of device for clamping wafer of the present invention;
Fig. 2 is the structural representation of a kind of device for clamping wafer of one embodiment of the invention;
Fig. 3, Fig. 4 are the perspective view of holder;
Fig. 5 is the control circuit principle schematic of holder;
Fig. 6 is the view that mover is positioned at when picking and placeing wafer height;
Fig. 7 is the view of mover block when being positioned at the angle of unclamping wafer;
Fig. 8 is the view of mover when being positioned at technique height;
Fig. 9 is the view of mover block when being positioned at the angle of clamped wafer;
Figure 10 is the structural representation of a kind of device for clamping wafer of another embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
It should be noted that, in following embodiment, when describing embodiments of the present invention in detail, in order to clearly represent structure of the present invention so that explanation, special to the structure in accompanying drawing not according to general scale, and carried out partial enlargement, distortion and simplify processes, therefore, should avoid being understood in this, as limitation of the invention.
In following the specific embodiment of the present invention, first refer to Fig. 1, Fig. 1 is the perspective view of a kind of device for clamping wafer of the present invention.Device for clamping wafer of the present invention can the supporting treatment facility for carrying out single-chip wet clean process.As shown in Figure 1, the device for clamping wafer of invention comprises rotary chuck 2, is arranged on chuck rotary drive mechanism 1 and some holders 3 at middle part below chuck 2.The quantity of described holder 3 is at least three (diagram schematically illustrates six holders), and is uniformly distributed along the circumferencial direction of described chuck 2 upper surface, for placement and holding chip 9 carry out cleaning betwixt.When carrying out cleaning, by the chemical liquids of the front spray certain flow to wafer 9, wafer 9 surface is cleaned; Simultaneously, by clean gas (as the nitrogen) injection apparatus (figure slightly) that chuck 2 is installed, in technical process, eject the clean gas of certain flow, certain pressure, from below the back side of cover wafers 9, be attached to wafer 9 back side to stop chemical liquids.Now; require the clearance control between wafer 9 back side and clean gas injection apparatus in less scope; even if the distance between wafer 9 back side and clean gas injection apparatus is in technique height; just can make clean gas available protecting wafer 9 back side, avoid the splash of chemical liquids to pollute (understanding incorporated by reference to the introduction in background technology).
Please then consult Fig. 2, Fig. 2 is the structural representation of a kind of device for clamping wafer of one embodiment of the invention.As shown in Figure 2, the described holder 3 in Fig. 1 comprises the magnetic mover 6 vertically arranged, the magnetic stator 5 arranged around described mover 6 gap and to be located at below described mover 6 and to form the screw rod 4 of vertical direction screw pair with described mover 6.The upper surface of described mover 6 is wafer placed side, and higher than described chuck 2 upper surface.Described placed side is provided with an eccentric block 7, for holding chip 9.Described stator 5 is wound with organizes coil (can be understood with reference to prior art, scheme slightly) more, and connects external control unit outside (figure slightly).
Please continue to refer to Fig. 2.In an alternate embodiment of the present invention, described chuck 2 has hollow cavity 10, and described holder 4,5,6 is arranged in described cavity 10.Concrete mode is, upper end and described cavity 10 upper inner wall of described stator 5 fixedly mount, and below the lower end of described screw rod 4 and described cavity 10, inwall fixedly mounts.Vertical gap above described cavity 10, upper end of described holder mover 6 passes, and makes its wafer placed side higher than the upper surface of described chuck 2.
Please continue to refer to Fig. 2.The middle part of described chuck 2 lower end is used for the chuck rotary drive mechanism 1 shown in installation diagram 1.Be specially, be installed with a rotating shaft 12 in the middle part of the lower end of described chuck 2, rotating shaft 12 is rotationally connected with the chuck rotary drive mechanism driving described chuck 2 to rotate.In described rotating shaft 12, concentric gap is equipped with fixed axis 13, and described fixed axis 13 upper end is socketed with conducting slip ring 11, and described conducting slip ring 11 penetrates in described cavity 10 and arranges.The lower end of described fixed axis 13 is installed fixing by frame 17 and outside (such as supporting process equipment).
Please continue to refer to Fig. 2.In an alternate embodiment of the present invention, chuck rotary drive mechanism comprises a quill shaft electric rotating machine 15, and described quill shaft electric rotating machine 15 is provided with quill shaft 14, and described quill shaft 14 is arranged around described fixed axis 13 concentric gap.The upper end of described quill shaft 14 and the lower end of described rotating shaft 12 fixedly sleeved.Described quill shaft electric rotating machine 15 is installed fixing by fixed mount 16 and outside (such as supporting process equipment).Like this, described quill shaft electric rotating machine 15 rotates by driving its quill shaft 14, drive described rotating shaft 12 to rotate, the described chuck 2 of connection rotating shaft 12 can be made to realize level of synchronization and rotate, make the wafer 9 mover 6 of chuck 2 clamping placement accept cleaning in rotation.
In another embodiment of the present invention, refer to Figure 10, Figure 10 is the structural representation of a kind of device for clamping wafer of another embodiment of the present invention.As shown in Figure 10, described chuck rotary drive mechanism also can adopt axle electric rotating machine to realize the rotary actuation to chuck 2.Adopt the form of the present embodiment, the length of described rotating shaft 12-1 can extend to have longer length downwards.Described axle electric rotating machine adopts solid shafting electric rotating machine 22 form.Synchronous axial system is connected to form by Timing Belt 20 between the rotating shaft 21 of described axle electric rotating machine 22 and described rotating shaft 12-1.When starting axle electric rotating machine 22, described chuck 2 synchronous rotary be connected with described rotating shaft 12-1 can be driven.In order to support described rotating shaft 12-1, ensure its stability rotated, can be rotationally connected between described rotating shaft 12-1 and described fixed axis 13.As a preferred embodiment, the rolling bearing 23 arranged can be formed be rotationally connected between described rotating shaft 12-1 and described fixed axis 13 by upper and lower two spacing.Further, the outer ring tight fit connection of described rotating shaft 12-1 and described bearing 23, the inner ring tight fit connection of described fixed axis 13 and described bearing 23.
Please then consult Fig. 3 and Fig. 4, Fig. 3, Fig. 4 are the perspective view of holder.As shown in Figure 3, mover 6 and stator 5 are magnet.Further, described mover 6 and stator 5 can be the permanent magnetism mover and soft magnetism stator that adopt permanent magnetic material and soft magnetic material to be processed into respectively, and such as mover 6 can adopt that permanent magnet is made, stator 5 can adopt iron cobalt magnetically soft alloy to make.The coaxial vertically gap of mover 6 is arranged in stator 5, and keeps certain air gap between stator 5.Form screw pair with screw rod 4 below mover 6 to coordinate.Stator 5 inner ring is wound with organizes coil (figure slightly) more, in order to providing the magnetic field rotating change when being energized, ordering about mover 6 and rotating by different directions.As a preferred embodiment, the wafer placed side 18 of mover 6 upper surface can be horizontal plane, with when mover 6 rotates, provides and supports well wafer, and keep the level of wafer; Eccentric block 7 on wafer placed side 18 can be processed into vertical cylindrical, when rotating contact wafer with mover 6, can and the wafer of circle between form good pivoting friction, thus effectively avoid the generation of particle; And, block 7 can be arranged the edge being positioned at wafer placed side 18 circumference, both the distance adjustment amount on clamping direction can be increased in, coordinate simultaneously and make mover 6 have sufficient adjustable height, sheet is picked and placeed to facilitate manipulator, effective Area of bearing of wafer placed side 18 can be ensured again, avoid wafer to skid off.As shown in Figure 4, screw rod 4 forms being rotatably connected of vertical direction in mover 6 lower end with mover 6.In the present embodiment, screw rod 4 have employed external screw thread 19, mover have employed internal thread (not shown), forms screw pair and coordinates.
Refer to Fig. 5, Fig. 5 is the control circuit principle schematic of holder.As shown in Figure 5, described control unit comprises the control circuit be made up of external ac power source AC, rectifier, driver module, Switching Power Supply, control board.Described control circuit is divided into two tunnels, wherein a route external ac power source AC, rectifier, driver module are electrically connected composition successively, the many output leads of drawing from the driver output of described driver module are connected with described conducting slip ring, then are connected with each group of coil of holder stator by the current supply line be connected with described conducting slip ring; Another route external ac power source AC, Switching Power Supply, control board are electrically connected composition successively, and control board is electrically connected described driver module.
The operation principle of described control unit is, the alternating current inputted by described external ac power source AC, and a road is converted to DC bus-bar voltage through described rectifier, is carried on described driver module; Another road is converted to direct voltage through described Switching Power Supply, is supplied to described control board.Described control board respectively organizes voltage, the electric current of coil by gathering described holder stator, calculate the position of described mover, in driver module described in FEEDBACK CONTROL, the frequency of each branch power switching element switch and duty ratio, realize the positioning control to described mover.
From the description of the background technology part of this specification, when carrying out cleaning, need clean gas (as the nitrogen) injection apparatus (figure slightly) by chuck is installed, the clean gas of certain flow, certain pressure is ejected in technical process, the back side of cover wafers from below, is attached to chip back surface to stop chemical liquids.Now; require the clearance control between chip back surface and clean gas injection apparatus in less scope; even if the distance between chip back surface and clean gas injection apparatus is in technique height, just can make clean gas available protecting chip back surface, avoid the splash of chemical liquids to pollute.If but gap between chip back surface and clean gas injection apparatus is too small, will make do not have enough operating spaces when picking and placeing sheet from the manipulator of chip back surface grippale tabs.
The present invention is just based on the improvement that the problems referred to above are carried out; by making the distance adjustable between wafer and chuck; thus manipulator when can stop from cleaning according to technique height during cleaning picks and places the different demands of wafer height; change the clearance distance between chip back surface and clean gas injection apparatus, thus realize carrying out available protecting to chip back surface.
Described control unit is just by controlling the energising order of electrical current in described stator many groups coil, form the magnetic field rotating change, drive described mover along described screw rod below technique height with above pick and place the intercropping rotary lifting movement of wafer height, make the wafer on described placed side and the vertical range between described chuck upper surface adjustable; Simultaneously, described mover is at technique height and pick and place between wafer height and drive described block to rotate between the angle and the angle of unclamping wafer of clamped wafer, make the radial distance between described block and described chuck pivot adjustable, with at technique height and pick and place rotation and lifting between wafer height and clamped by wafer or unclamp.Further, by the control of described control unit, each described mover can be made to realize synchronous axial system, to be clamped by the wafer that mover is placed or to unclamp simultaneously.Like this, when wafer is in technique height and position, cleaning can be accepted at clamped condition; And be in manipulator when picking and placeing wafer height, unclamp the clamping to wafer by block again, enable manipulator under the height space condition of abundance, successfully wafer is picked and placeed.
Please continue to refer to Fig. 2.In the present embodiment, draw many output leads from the driver output of described driver module, and each output lead is connected with described conducting slip ring 11.Described fixed axis 13 can adopt quill shaft form, and each output lead can be fixed on (figure slightly) on described fixed axis 13.Each group of coil of described stator 5 is connected to described conducting slip ring 11 by current supply line 8 in described cavity 10, the current supply line 8 of drawing from each described stator 5 can contact with described conducting slip ring 11 is stable when chuck 2 rotates, keep the electrical connection between described driver module, to export each road driving voltage from described driver module to described stator 5.
In the embodiment of the invention described above, in order to make the adjustable height of described mover 6 corresponding with the rotational angle of block 7, ensure mover 6 from pick and place wafer height vertically move to technique height time, wafer can clamp by block 7 rightly, the helical pitch S of described screw rod 4 should be processed according to the condition meeting following formula:
Wherein, the symbol in formula denominator || be absolute value sign.
Below by way of Fig. 6 ~ Fig. 9, the course of action of the mover coordinated with the screw rod of the helical pitch had in above-mentioned formula is described further.Fig. 6 is the view that mover is positioned at when picking and placeing wafer height; Fig. 7 is the view of mover block when being positioned at the angle of unclamping wafer; Fig. 8 is the view of mover when being positioned at technique height; Fig. 9 is the view of mover block when being positioned at the angle of clamped wafer.As shown in Figure 6, when being in cleaning halted state, by manipulator, the wafer 9 on holder mover 6 is picked and placeed.Now, between the wafer placed side of mover 6 and chuck 2 upper surface, (can be regarded as the clearance distance between chip back surface and clean gas injection apparatus) has and picks and places wafer height H1.As shown in Figure 7, the eccentric block 7 of mover 6 is in the angle (diagram block 7 is separated with between wafer 9) of unclamping wafer simultaneously.When wafer 9 is put after to mover 6 by manipulator, cleaning can be proceeded.Holder mover 6, by the direction along clamped wafer 9, drops to technique height along screw rod from picking and placeing wafer height.Now, between the wafer placed side of mover 6 and chuck 2 upper surface, there is technique height H 2, as shown in Figure 8.Meanwhile, wafer, by being formed from the anglec of rotation the angle of the angle to clamped wafer of unclamping wafer, clamps by mover 6, (is close between diagram block 7 and wafer 9) as shown in Figure 9.Otherwise when holder mover 6 is along the direction of unclamping wafer, when rotating to the angle of unclamping wafer from the angle of clamped wafer, mover 6 will rise to along screw rod from technique height and pick and place wafer height.As can be seen from Fig. 6 and Fig. 8, picking and placeing wafer height H1 will apparently higher than technique height H 2.Thus, utilize clean gas injection apparatus, can under less technique height, the clean gas sprayed by it, forms available protecting to chip back surface; Meanwhile, by adjusting the height of mover, add the distance between wafer and chuck, when technique stops, manipulator can carry out picking and placeing sheet easily.Therefore, the present invention can ensure to clean the technique height needed, and manipulator can be provided again to pick and place the space of sheet, efficiently solve prior art Problems existing.
Again complete explanation is done to course of work when using a kind of device for clamping wafer of the present invention below.
First, the control board of control unit judges whether the position of existing clamp part mover is in the angle of unclamping wafer.If be not in this angle position, then calculate the difference between the position of existing clamp part mover and the angle of unclamping wafer, and as desired value, control driver module work, arrive the angle of unclamping wafer after making holder mover edge unclamp the direction rolling target value of wafer.
Because holder mover has internal thread, and form screw pair with the screw rod that helical pitch S meets formula (1), therefore, holder mover under the effect of rotating magnetic field, by along standing screw screw thread rotation and rise to and pick and place wafer height; Meanwhile, block is also followed mover and is rotated to the angle of unclamping wafer, and now, the radial distance between each mover block and chuck pivot increases, and is beneficial to manipulator and places wafer.
Then, wafer is placed on holder mover by manipulator.Now, the vertical distance between wafer and rotary chuck increases, manipulator can be allowed to capture wafer from chip back surface, and place it on holder mover.After wafer is placed, manipulator exits.
Then, control board is rotated by the direction of driver module control holder mover along clamped wafer again, and holder mover is dropping to technique height while rotating along screw flight, and block also follows the angle that mover rotates to clamped wafer.Now, wafer is clamped, and the distance between wafer and rotary chuck reduces, to ensure that clearance control between chip back surface and clean gas injection apparatus is more among a small circle.
When front wafer surface is when carrying out chemical liquids spray, clean gas (as the nitrogen) injection apparatus that the rotary chuck of holding chip is installed ejects the back side of clean gas cover wafers of certain flow, certain pressure, the chemical liquids of front wafer surface and splash can be stoped to be attached to chip back surface, to avoid chemical liquids to the pollution of chip back surface.
In sum, the present invention is by arranging by magnetic mover at rotary chuck, stator and the holder formed with the screw rod that mover forms screw pair, and the energising order of electrical current in many groups coil of stator is controlled by control unit, form the magnetic field rotating change, drive mover along screw rod below technique height with above pick and place the intercropping rotary lifting movement of wafer height, and drive the block on mover to rotate between the angle and the angle of unclamping wafer of clamped wafer, wafer is clamped or unclamps, thus can according to technique height and the different demands picking and placeing wafer height, change the distance between wafer and chuck.Therefore, the present invention can effectively solve due to by clean gas injection apparatus on holding chip and chuck apart from excessive, cause the problem can not carrying out available protecting in technical process to chip back surface, avoid chemical liquids to the pollution of chip back surface.Meanwhile, the present invention while realization is to chip back surface protection, for the manipulator capturing wafer from chip back surface leaves enough operating spaces when picking and placeing sheet, can improve the reliability that wafer picks and places action.
Above-describedly be only the preferred embodiments of the present invention; described embodiment is also not used to limit scope of patent protection of the present invention; therefore the equivalent structure that every utilization specification of the present invention and accompanying drawing content are done changes, and in like manner all should be included in protection scope of the present invention.
Claims (10)
1. a device for clamping wafer, comprise rotary chuck, chuck rotary drive mechanism, holder, it is characterized in that, described holder is at least three, be uniformly distributed along described chuck perimeter, for placement and holding chip carry out technique betwixt, described holder comprises the magnetic mover vertically arranged, the magnetic stator arranged around described mover gap and to be located at below described mover and to form the screw rod of vertical direction screw pair with described mover, described mover upper surface is wafer placed side, and higher than described chuck upper surface, described placed side is provided with an eccentric block, for holding chip, described stator is wound with organizes coil more, and connection control unit, described stator, the affixed described chuck of screw rod, described control unit forms by the energising order controlling electrical current in described many group coils the magnetic field rotating change, drive described mover along described screw rod below technique height with above pick and place the intercropping rotary lifting movement of wafer height, make the wafer on described placed side and the vertical range between described chuck upper surface adjustable, simultaneously, described mover is at technique height and pick and place between wafer height and drive described block to rotate between the angle and the angle of unclamping wafer of clamped wafer, make the radial distance between described block and described chuck pivot adjustable, with at technique height and pick and place rotation and lifting between wafer height and wafer clamped or unclamps.
2. clamping device according to claim 1, is characterized in that, described chuck is provided with hollow cavity, and described holder is located in described cavity, and the wafer placed side of described mover passes described chuck upper surface, the affixed described cavity inner wall of described stator, screw rod, described chuck lower end is rotationally connected chuck rotary drive mechanism by rotating shaft, is coaxially equipped with fixed axis in described rotating shaft, and described fixed axis upper end is socketed with conducting slip ring, and described conducting slip ring penetrates in described cavity and arranges, described control unit comprises the control circuit be made up of external ac power source, rectifier, driver module, Switching Power Supply, control board, wherein, the alternating current inputted by described external ac power source, one tunnel is converted to DC bus-bar voltage through described rectifier, be carried on the described driver module that is connected with each group of coil of described stator, another road is converted to direct voltage through described Switching Power Supply, be supplied to described control board, described control board gathers the voltage that coil respectively organized by described stator, electric current, calculate the position of described mover, the frequency of each branch power switching element switch and duty ratio in driver module described in FEEDBACK CONTROL, the location of described mover is controlled, and drive described mover along described screw rod at technique height and the intercropping rotary lifting movement picking and placeing wafer height, and drive described block to rotate between the angle and the angle of unclamping wafer of clamped wafer, described driver module connects described conducting slip ring by many output leads, and each group of coil of described stator connects described conducting slip ring by current supply line in described cavity, to export each road driving voltage from described driver module to described stator.
3. clamping device according to claim 1 and 2, is characterized in that, the helical pitch S of described screw rod meets following formula:
Wherein, the symbol in formula denominator || be absolute value sign.
4. clamping device according to claim 1 and 2, is characterized in that, described stator, mover are respectively soft magnetism stator and permanent magnetism mover.
5. clamping device according to claim 1 and 2, is characterized in that, the wafer placed side of described mover is plane, and described block is located at the edge of described wafer placed side.
6. clamping device according to claim 1 and 2, is characterized in that, described block is the cylinder vertically arranged.
7. clamping device according to claim 1 and 2, is characterized in that, described control unit controls to make each described mover synchronous axial system.
8. clamping device according to claim 2, it is characterized in that, described chuck rotary drive mechanism comprises quill shaft electric rotating machine, the quill shaft of described quill shaft electric rotating machine is arranged around described fixed axis concentric gap, described quill shaft connects described rotating shaft, described quill shaft electric rotating machine rotates by driving described quill shaft, drives the described chuck synchronous rotary of described rotating shaft and connection thereof.
9. clamping device according to claim 2, it is characterized in that, described chuck rotary drive mechanism comprises axle electric rotating machine, synchronous axial system is connected to form by Timing Belt between the rotating shaft of described axle electric rotating machine and described rotating shaft, drive the described chuck synchronous rotary be connected with described rotating shaft, described rotating shaft is rotationally connected described fixed axis.
10. clamping device according to claim 9, is characterized in that, is formed be rotationally connected between described rotating shaft and described fixed axis by rolling bearing.
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| CN201510010027.3A CN104576495B (en) | 2015-01-08 | 2015-01-08 | A kind of device for clamping wafer |
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| CN201510010027.3A CN104576495B (en) | 2015-01-08 | 2015-01-08 | A kind of device for clamping wafer |
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| CN108987298B (en) * | 2017-05-31 | 2020-10-16 | 上海微电子装备（集团）股份有限公司 | Rotary gluing device and method |
| CN107838045A (en) * | 2017-10-30 | 2018-03-27 | 天津必利优科技发展有限公司 | Chip fetching device |
| CN107838045B (en) * | 2017-10-30 | 2024-05-07 | 天津必利优科技发展有限公司 | Wafer taking and placing device |
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| CN110034062A (en) * | 2019-04-19 | 2019-07-19 | 德淮半导体有限公司 | Wafer clamping device and chuck |
| CN113543434A (en) * | 2020-04-16 | 2021-10-22 | 杰宜斯科技有限公司 | Energizing device for substrate processing |
| CN112885738B (en) * | 2020-09-03 | 2024-02-23 | 天虹科技股份有限公司 | Wafer fixing mechanism and wafer pre-cleaning machine using same |
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Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: BEIJING SEVENSTAR ELECTRONICS Co.,Ltd. |