CN104576495B - A kind of device for clamping wafer - Google Patents
A kind of device for clamping wafer Download PDFInfo
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- CN104576495B CN104576495B CN201510010027.3A CN201510010027A CN104576495B CN 104576495 B CN104576495 B CN 104576495B CN 201510010027 A CN201510010027 A CN 201510010027A CN 104576495 B CN104576495 B CN 104576495B
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- chip
- mover
- chuck
- stator
- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of device for clamping wafer, by being set in rotary chuck by magnetic mover, the holder that stator and the screw rod for constituting screw pair with mover are constituted, and the energization order of electrical current in multigroup coil of stator is controlled by control unit, form rotationally-varying magnetic field, driving mover makees rotary lifting movement along screw rod between lower section technique height and top pick and place wafer height, and drive the block on mover to be rotated between the angle of clamped wafer and the angle of release chip, chip is clamped or unclamped, it can effectively solve the problem that due to clamped chip with clean gas injection apparatus on chuck apart from excessive, the problem of causing effectively protect chip back surface in technical process, avoid pollution of the chemical liquids to chip back surface, simultaneously, can be that the manipulator for capturing chip from chip back surface leaves enough operating spaces when picking and placeing piece, improve the reliability that chip picks and places action.
Description
Technical field
The present invention relates to semiconductor integrated circuit processing cleaning equipment field, it is used for wet method more particularly, to one kind clear
Wash the device for clamping wafer of equipment.
Background technology
With the high speed development of semiconductor integrated circuit manufacturing technology, the characteristic size of IC wafer has enter into depth
Sub-micron regime, and cause the characteristic size of superfine circuit malfunction or the key particles of damage on chip also greatly to subtract therewith
It is small.
During the production and processing technology of integrated circuit, semiconductor wafer (silicon chip) generally all can be heavy by such as film
The multiple tracks manufacturing process such as product, etching, polishing.And these manufacturing process just turn into the important place that particle is produced.In order to keep brilliant
The clean conditions on piece surface, eliminate the particulate matter that wafer surface is deposited in each manufacturing process, it is necessary to being subjected to per pass
Chip after manufacturing process carries out cleaning treatment.Wet clean process cleans the superior characteristic of resultant effect because what it had, into
To eliminate the main flow cleaning method of wafer surface particle.
In order to effectively remove the particle of wafer surface, when making single-chip wet clean process, chip will be put
Put on rotating and clamping device (such as the rotary chuck with holder), and rotated according to certain speed；Simultaneously to chip
Front spray certain flow chemical liquids, wafer surface is cleaned.
But, if the rotary speed of chip is too low, the chemical liquids of front wafer surface will be infiltrated from wafer edge to crystalline substance
The back side of piece；And if the rotary speed of chip is too high, the chemical liquids of front wafer surface will be got rid of into recovery with higher speed
The process cavity of liquid is learned, is hit with process cavity, and backwash is to the front and back of chip.The chemistry of front wafer surface splash
Liquid can be washed by ultrapure water, but the chemical liquids of chip back surface splash are difficult to remove.
Prior art is typically provided with the injection apparatus of clean gas (such as nitrogen) on the rotary chuck of holding chip, leads to
Cross and certain flow, the back side of the clean gas covering chip of certain pressure are ejected in technical process, to prevent chemical liquids attached
Chip back surface.Now, it is desirable to by the clearance control between chip back surface and clean gas injection apparatus in less scope,
Clean gas could be caused effectively to protect chip back surface, it is to avoid the pollution of chemical liquids., will but if gap therebetween is too small
It can cause there is no enough operating spaces when picking and placeing piece from the manipulator of chip back surface grippale tabs.
Above mentioned problem further reduce in the gap between chip back surface and clean gas injection apparatus, thus
Vaccine effectiveness of the clean gas to chip back surface is weakened, part chemical liquids splash is easily caused to chip back surface, yield is produced
Adverse effect is given birth to.
It is, therefore, desirable to provide a kind of can effectively realize the device for clamping wafer of back-protective.
The content of the invention
It is an object of the invention to overcome the drawbacks described above that prior art is present, there is provided a kind of new wafer holder dress
Put, the distance between chip and chuck can be changed, realization both may be used according to technique height with picking and placeing the different demands of wafer height
Chip back surface is obtained effective protection of clean gas in technique, picking and placeing wafer height manipulator can be ensured from chip again
The back side successfully grippale tabs.
To achieve the above object, technical scheme is as follows：
A kind of device for clamping wafer, including rotary chuck, chuck rotary drive mechanism, holder, the holder is extremely
Few three, it is uniformly distributed along the chuck perimeter, for placing therebetween and holding chip carries out technique, the holder includes
The magnetic mover that is vertically arranged, the magnetic stator set around the mover gap and below the mover and with it is described
Mover constitutes the screw rod of vertical direction screw pair, and the mover upper surface is chip placed side, and higher than the chuck upper surface,
The placed side is provided with an eccentric block, for holding chip, and the stator is wound with multigroup coil, and connects control unit,
The affixed chuck of the stator, screw rod；Described control unit is by controlling the energization of electrical current in multigroup coil secondary
Sequence forms rotationally-varying magnetic field, drive the mover along the screw rod lower section technique height and top pick and place wafer height it
Between make rotary lifting movement, make the vertical range between the chip on the placed side and the chuck upper surface adjustable, meanwhile,
The mover is in technique height and picks and places the angle that the block is driven between wafer height in clamped wafer with unclamping chip
Between angle rotate, make the radial distance between the block and the chuck pivot adjustable, with technique height with taking
Put between wafer height rotation and lifting and chip is clamped or unclamped.
Preferably, the chuck is provided with hollow cavity, and the holder is in the cavity, and the chip of the mover is put
The face of putting passes the chuck upper surface, the affixed cavity inner wall of the stator, screw rod；The chuck lower end is turned by rotary shaft
Fixing axle coaxially is equipped with dynamic connecting chuck rotary drive mechanism, the rotary shaft, the fixing axle upper end is socketed with conduction
Slip ring, the conducting slip ring penetrates setting in the cavity；Described control unit is included by external ac power source, rectifier, drive
Dynamic model block, Switching Power Supply, the control circuit of control panel composition；Wherein, the alternating current inputted by the external ac power source, all the way
DC bus-bar voltage is converted to through the rectifier, the drive module being connected with each group coil of the stator is carried in
On, another road is converted to DC voltage there is provided to the control panel through the Switching Power Supply, and the control panel gathers the stator
Voltage, the electric current of each group coil, calculate the position for obtaining the mover, as each branch road in drive module described in feedback control
The frequency and dutycycle of power switch component switch, the positioning to the mover are controlled, and drive the mover described in
Screw rod is in technique height and picks and places and makees rotary lifting movement between wafer height, and drives the block at the angle of clamped wafer
Rotated between degree and the angle for unclamping chip；The drive module connects the conducting slip ring by many output leads, described
The each group coil of stator connects the conducting slip ring in the cavity by current supply line, with from the drive module to described
Stator exports each road driving voltage.
Preferably, the helical pitch S of the screw rod meets below equation：
Wherein, the symbol in formula denominator | | it is absolute value sign.
Preferably, the stator, mover are respectively soft magnetism stator and permanent magnetism mover.
Preferably, the chip placed side of the mover is plane, and the block is located at the edge of the chip placed side.
Preferably, the block is the cylinder being vertically arranged.
Preferably, described control unit control makes each mover synchronous axial system.
Preferably, the chuck rotary drive mechanism is included in quill shaft electric rotating machine, the quill shaft electric rotating machine
Empty collar is set around the fixing axle concentric gap, and the rotary shaft is connect on the quill shaft, and the quill shaft electric rotating machine leads to
The quill shaft of overdriving rotates, and drives the chuck synchronous rotary of the rotary shaft and its connection.
Preferably, the chuck rotary drive mechanism include axle electric rotating machine, the rotating shaft of the axle electric rotating machine with it is described
Connect to form synchronous axial system by timing belt between rotary shaft, drive the chuck synchronous rotary being connected with the rotary shaft,
The rotary shaft rotates the connection fixing axle.
Preferably, connection is rotated by rolling bearing formation between the rotary shaft and the fixing axle.
It can be seen from the above technical proposal that the present invention by rotary chuck set by magnetic mover, stator and with
Mover constitutes electrical current in the holder that the screw rod of screw pair is constituted, and the multigroup coil for passing through control unit control stator
Energization order, form rotationally-varying magnetic field, driving mover picks and places wafer height in lower section technique height along screw rod with top
Between make rotary lifting movement, and drive block on mover to turn between the angle of clamped wafer and the angle for unclamping chip
It is dynamic, chip is clamped or unclamped, so as to the different demands according to technique height with picking and placeing wafer height, changes chip and card
The distance between disk.Therefore, the present invention has following distinguishing feature：
1. the present invention can effectively solve the problem that due to clamped chip and clean gas injection apparatus on chuck apart from it is excessive, make
The problem of chip back surface can not effectively being protected into technical process, it is to avoid pollution of the chemical liquids to chip back surface.
2. the present invention can be that the manipulator for capturing chip from chip back surface exists while realization is protected to chip back surface
Enough operating spaces are left when picking and placeing piece, the reliability that chip picks and places action is improved.
Brief description of the drawings
Fig. 1 is a kind of dimensional structure diagram of device for clamping wafer of the invention；
Fig. 2 is a kind of structural representation of device for clamping wafer of one embodiment of the invention；
Fig. 3, Fig. 4 are the dimensional structure diagrams of holder；
Fig. 5 is the control circuit theory schematic diagram of holder；
Fig. 6 is mover positioned at view when picking and placeing wafer height；
Fig. 7 is view when mover block is located at the angle for unclamping chip；
Fig. 8 is view when mover is located at technique height；
Fig. 9 is view when mover block is located at the angle of clamped wafer；
Figure 10 is a kind of structural representation of device for clamping wafer of another embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawings, the embodiment to the present invention is described in further detail.
It should be noted that in following embodiments, when embodiments of the present invention are described in detail, in order to clear
Ground represents the structure of the present invention in order to illustrate, spy, not according to general scale, and has carried out part to the structure in accompanying drawing
Amplification, deformation and simplified processing, therefore, should avoid being understood in this, as limitation of the invention.
In embodiment of the invention below, first referring to Fig. 1, Fig. 1 is a kind of device for clamping wafer of the invention
Dimensional structure diagram.The processing that the device for clamping wafer of the present invention supporting can be used to carry out single-chip wet clean process is set
It is standby.Rotate and drive as shown in figure 1, the device for clamping wafer of invention includes rotary chuck 2, the chuck in the middle part of the lower section of chuck 2
Motivation structure 1 and some holders 3.The quantity of the holder 3 (illustrates at least three and schematically illustrates six clampings
Part), and circumferencial direction along the upper surface of chuck 2 is uniformly distributed, for placing therebetween and holding chip 9 carries out scavenger
Skill.When carrying out cleaning, by spraying the chemical liquids of certain flow to the front of chip 9, the surface of chip 9 is carried out clear
Wash；Meanwhile, by clean gas (such as nitrogen) injection apparatus (figure is omited) installed on chuck 2, one is ejected in technical process
The clean gas of constant flow, certain pressure, covers the back side of chip 9, to prevent chemical liquids from being attached to the back side of chip 9 from below.
Now, it is desirable to by the clearance control between the back side of chip 9 and clean gas injection apparatus in less scope, even if chip 9 is carried on the back
The distance between face and clean gas injection apparatus could cause clean gas effectively to protect the back side of chip 9 in technique height,
The splash of chemical liquids is avoided to pollute and (understood incorporated by reference to the introduction in background technology).
Please referring next to Fig. 2, Fig. 2 is a kind of structural representation of device for clamping wafer of one embodiment of the invention.Such as Fig. 2
Shown, magnetic mover 6 that the holder 3 in Fig. 1 includes being vertically arranged, the magnetic set around the gap of mover 6 are determined
Son 5 and the screw rod 4 that vertical direction screw pair is constituted located at the lower section of mover 6 and with the mover 6.The mover 6 it is upper
Surface is chip placed side, and higher than the upper surface of chuck 2.The placed side is provided with an eccentric block 7, for holding chip
9.The stator 5 is wound with multigroup coil (referring to prior art to be understood, scheme to omit), and connects external control unit outside (figure
Slightly).
Please continue to refer to Fig. 2.In an alternate embodiment of the present invention, the chuck 2 has hollow cavity 10, the clamping
Part 4,5,6 is arranged in the cavity 10.Concrete mode is that the upper end of the stator 5 is fixed with the upper inner wall of cavity 10
Install, the lower end of the screw rod 4 is fixedly mounted with the lower section inwall of cavity 10.The upper end of the holder mover 6 is from described
The vertical gap in the top of cavity 10 is passed, and makes its chip placed side higher than the upper surface of the chuck 2.
Please continue to refer to Fig. 2.The middle part of the lower end of chuck 2 is used for the chuck rotary drive mechanism 1 shown in installation diagram 1.
Specifically, being installed with a rotary shaft 12 in the middle part of the lower end of the chuck 2, rotary shaft 12 is with driving the chuck 2 to revolve
The chuck rotary drive mechanism turned rotates connection.Concentric gap is equipped with fixing axle 13, the fixing axle in the rotary shaft 12
13 upper ends are socketed with conducting slip ring 11, and the conducting slip ring 11 penetrates setting in the cavity 10.The lower end of the fixing axle 13
Installed and fixed with outside (such as supporting process equipment) by frame 17.
Please continue to refer to Fig. 2.In an alternate embodiment of the present invention, chuck rotary drive mechanism includes a quill shaft rotation
Rotating motor 15, the quill shaft electric rotating machine 15 is provided with quill shaft 14, and the quill shaft 14 is around the same between centers of the fixing axle 13
Gap is set.The upper end of the quill shaft 14 and the lower end of the rotary shaft 12 are fixedly sleeved.The quill shaft electric rotating machine 15 leads to
Cross fixed mount 16 and fixation is installed with outside (such as supporting process equipment).So, the quill shaft electric rotating machine 15 passes through
Drive its quill shaft 14 to rotate, drive the rotary shaft 12 to rotate, you can the chuck 2 of connection rotary shaft 12 is realized synchronization
Horizontal rotation, makes the chip 9 for clamping placement on the mover 6 of chuck 2 receive cleaning in rotation.
In another alternative embodiment of the invention, referring to Fig. 10, Figure 10 is a kind of chip of another embodiment of the present invention
The structural representation of clamping device.As shown in Figure 10, the chuck rotary drive mechanism can also be realized using axle electric rotating machine
Rotation driving to chuck 2.Using the form of the present embodiment, the length of the rotary shaft 12-1 can extend downwards with compared with
Long length.The axle electric rotating machine uses the form of solid shafting electric rotating machine 22.The rotating shaft 21 of the axle electric rotating machine 22 and institute
State between rotary shaft 12-1 and synchronous axial system is formed by the connection of timing belt 20.When start axle electric rotating machine 22 when, you can drive with
The synchronous rotary of the chuck 2 of the rotary shaft 12-1 connections.In order to be supported to the rotary shaft 12-1, it is ensured that it rotates
Stability, can between the rotary shaft 12-1 and the fixing axle 13 carry out rotation connection., can as a preferred embodiment
Rotation will be formed by the rolling bearing 23 of two spacing settings up and down between the rotary shaft 12-1 and the fixing axle 13
Connection.Also, the rotary shaft 12-1 and the bearing 23 outer ring tight fit connection, the fixing axle 13 and the bearing 23
Inner ring tight fit connection.
Please referring next to Fig. 3 and Fig. 4, Fig. 3, Fig. 4 are the dimensional structure diagrams of holder.As shown in figure 3, the He of mover 6
Stator 5 is magnet.Further, the mover 6 and stator 5 can permanent-magnet material be respectively adopted and soft magnetic materials is processed into
Permanent magnetism mover and soft magnetism stator, such as mover 6 can be made of permanent magnet, stator 5 can use iron cobalt system soft magnetism
Alloy is made.The coaxial vertical gap of mover 6 is arranged in stator 5, and certain air gap is kept between stator 5.The lower section of mover 6 with
The formation screw pair of screw rod 4 coordinates.The inner ring of stator 5 is wound with multigroup coil (figure is omited), to provide rotationally-varying magnetic when being powered
, drive mover 6 to be rotated by different directions.As a preferred embodiment, the chip placed side 18 of the upper surface of mover 6 can be level
Plane, there is provided being supported well to chip, and to keep the level of chip when mover 6 is rotated；It is inclined on chip placed side 18
Heart block 7 can be processed into vertical cylinder, when rotating contact chip with mover 6, can form good between circular chip
Good pivoting friction, so as to be prevented effectively from the generation of particle；Also, block 7 can be set positioned at the circumference of chip placed side 18
Edge, can both increase on clamping direction apart from regulated quantity, while coordinating makes mover 6 have sufficient adjustable height, with side
Just manipulator picks and places piece, ensures that effective Area of bearing of chip placed side 18, it is to avoid chip is skidded off.As shown in figure 4, screw rod
4 form being rotatably connected for vertical direction in the lower end of mover 6 with mover 6.In the present embodiment, screw rod 4 employs external screw thread 19, moved
Son employs internal thread (not shown), forms screw pair and coordinates.
Referring to Fig. 5, Fig. 5 is the control circuit theory schematic diagram of holder.As shown in figure 5, described control unit includes
The control circuit being made up of external ac power source AC, rectifier, drive module, Switching Power Supply, control panel.The control circuit point
For two tunnels, wherein a route external ac power source AC, rectifier, drive module are sequentially connected electrically composition, from the drive module
Many output leads drawing of driving output be connected with the conducting slip ring, then the power supply by being connected with the conducting slip ring
Wire is connected with each group coil of holder stator；Another route external ac power source AC, Switching Power Supply, control panel are electrically connected successively
Composition is connect, control panel electrically connects the drive module.
The operation principle of described control unit is, by the alternating current of the external ac power source AC input, all the way through described
Rectifier is converted to DC bus-bar voltage, is carried in the drive module；Another road is converted to direct current through the Switching Power Supply
There is provided to the control panel for voltage.The control panel is by gathering voltage, the electric current of the holder stator each group coil, meter
The position for obtaining the mover is calculated, as the frequency of each branch power switching element switch in drive module described in feedback control
And dutycycle, realize the location control to the mover.
It was found from the description of the background section of this specification, when carrying out cleaning, it is necessary to by pacifying on chuck
Clean gas (such as nitrogen) injection apparatus (figure is omited) of dress, ejects certain flow, the cleaning of certain pressure in technical process
Gas, covers the back side of chip, to prevent chemical liquids from being attached to chip back surface from below.Now, it is desirable to by chip back surface with it is clean
Clearance control between net gas injection apparatus is in less scope, even if between chip back surface and clean gas injection apparatus
Distance could cause clean gas effectively to protect chip back surface in technique height, it is to avoid the splash pollution of chemical liquids.But if
Gap between chip back surface and clean gas injection apparatus is too small, it will so that being taken from the manipulator of chip back surface grippale tabs
There is no enough operating spaces during film releasing.
The present invention is based on the improvement that above mentioned problem is carried out, by making chip and the distance between chuck adjustable,
Manipulator during so as to be stopped according to technique height during cleaning with cleaning picks and places the different demands of wafer height, changes brilliant
Clearance distance between the piece back side and clean gas injection apparatus, is effectively protected so as to realize to chip back surface.
Described control unit is exactly based on the energization order for controlling electrical current in the multigroup coil of stator, to form rotation
The magnetic field of transformationization, drives the mover to be rotated along the screw rod between lower section technique height and top pick and place wafer height
Elevating movement, makes the vertical range between the chip on the placed side and the chuck upper surface adjustable；Meanwhile, the mover
In technique height and pick and place and drive between wafer height the block in the angle of clamped wafer and unclamp between the angle of chip
Rotate, make the radial distance between the block and the chuck pivot adjustable, with high with picking and placeing chip in technique height
Between degree rotation and lifting and by chip clamp or unclamp.Also, by the control of described control unit, each mover can be made
Synchronous axial system is realized, the chip placed on mover is simultaneously clamped on or unclamped.So, when chip is in technique height and position
When, cleaning can be received in clamped condition；And in manipulator pick and place wafer height when, again can by block unclamp to chip
Clamping, enable manipulator under the conditions of sufficient height space, successfully chip picked and placeed.
Please continue to refer to Fig. 2.In the present embodiment, many output leads are drawn from the driving output of the drive module,
And be connected each output lead with the conducting slip ring 11.The fixing axle 13 can use quill shaft form, and each output lead can
It is fixed in the fixing axle 13 (figure is omited).The each group coil of the stator 5 passes through current supply line 8 in the cavity 10
The conducting slip ring 11 is connected to, the current supply line 8 drawn from each stator 5 can be sliding with the conduction when chuck 2 rotates
Ring 11 is steadily contacted, and the electrical connection between the drive module is kept, to be exported from the drive module to the stator 5
Each road driving voltage.
In embodiments of the invention described above, in order that the adjustable height of the mover 6 is relative with the rotational angle of block 7
Should, it is ensured that in mover 6 from when picking and placeing wafer height vertical shift to technique height, block 7 rightly can clamp chip, should
The helical pitch S of the screw rod 4 is processed according to the condition for meeting below equation：
Wherein, the symbol in formula denominator | | it is absolute value sign.
Below by way of Fig. 6~Fig. 9, the action process of pair mover coordinated with the screw rod with the helical pitch in above-mentioned formula is made
Further illustrate.Fig. 6 is mover positioned at view when picking and placeing wafer height；Fig. 7 is that mover block is located at release chip
Angle when view；Fig. 8 is view when mover is located at technique height；Fig. 9 is that mover block is located at folder
The view during angle of tight chip.As shown in fig. 6, when in cleaning halted state, manipulator pair can be passed through
Chip 9 on holder mover 6 is picked and placeed.Now, (it can be regarded as between the chip placed side of mover 6 and the upper surface of chuck 2
Clearance distance between chip back surface and clean gas injection apparatus) have pick and place wafer height H1.As shown in fig. 7, mover 6
Eccentric block 7 is simultaneously in the angle (being separated between diagram block 7 and chip 9) for unclamping chip.When manipulator by chip 9 put to
After on mover 6, you can proceed cleaning.Holder mover 6 is by along the direction of clamped wafer 9, along screw rod from picking and placeing
Wafer height drops to technique height.Now, there is technique height H2 between the chip placed side of mover 6 and the upper surface of chuck 2,
As shown in Figure 8.Meanwhile, mover 6 will form the angle from release chip to the anglec of rotation the angle of clamped wafer, by crystalline substance
Piece is clamped, and (is close to as shown in Figure 9 between diagram block 7 and chip 9).Conversely, the side when holder mover 6 along release chip
To when rotating to the angle for unclamping chip from the angle of clamped wafer, mover 6 will highly rise to along screw rod from technique and pick and place
Wafer height.Can be seen that from Fig. 6 and Fig. 8 pick and place wafer height H1 will be apparently higher than technique height H2.So as to utilize cleaning
Gas injection apparatus, by the clean gas that it sprays, can form effective guarantor to chip back surface under less technique height
Shield；Meanwhile, by adjusting the height of mover, add the distance between chip and chuck, when technique stops, manipulator
Easily carry out picking and placeing piece.Therefore, the present invention both can guarantee that the technique height that cleaning needs, and manipulator can be provided again and picks and places piece
Space, efficiently solves the problem of prior art is present.
Below again to making complete explanation using course of work during a kind of device for clamping wafer of the invention.
First, whether the control panel of control unit judges the position of existing clamp part mover in the angle for unclamping chip.
If being not in the angle position, the difference between the position of calculating existing clamp part mover and the angle for unclamping chip, and with
This is desired value, control drive module work so that holder mover reaches pine along after the direction rolling target value for unclamping chip
Open the angle of chip.
The screw rod formation screw pair of formula (1) is met because holder mover has internal thread, and with helical pitch S, therefore, is pressed from both sides
Gripping member mover along the screw thread rotation of standing screw and will rise in the presence of rotating excitation field and pick and place wafer height；Meanwhile,
Block also follows mover to rotate to the angle for unclamping chip, now, radial direction between each mover block and chuck pivot away from
From increase, so that manipulator places chip.
Then, manipulator is placed the wafer on holder mover.Now, the vertical distance between chip and rotary chuck
It has been increased that, manipulator can be allowed to capture chip from chip back surface, and place it on holder mover.Chip is placed and finished
Afterwards, manipulator is exited.
Then, control panel controls holder mover to be rotated along the direction of clamped wafer by drive module again, and holder is moved
Son drops to technique height while being rotated along screw flight, and block also follows mover to rotate to the angle of clamped wafer.
Now, chip is clamped, and the distance between chip and rotary chuck reduce, to ensure that chip back surface sprays with clean gas
Clearance control between device is in smaller range.
When front wafer surface is carrying out chemical liquids spray, clean gas (such as nitrogen installed on the rotary chuck of holding chip
Gas) injection apparatus eject certain flow, certain pressure clean gas cover chip the back side, can prevent front wafer surface and return
The chemical liquids splashed are attached to chip back surface, it is to avoid pollution of the chemical liquids to chip back surface.
In summary, the present invention is by setting by magnetic mover, stator in rotary chuck and constituting screw pair with mover
The holder that is constituted of screw rod, and pass through the energization order that control unit controls electrical current in multigroup coil of stator, shape
Into rotationally-varying magnetic field, driving mover makees rotation and lifting along screw rod between lower section technique height and top pick and place wafer height
Motion, and drive block on mover in the angle of clamped wafer and unclamp and rotate between the angle of chip, chip is clamped or
Unclamp, so as to the different demands according to technique height with picking and placeing wafer height, change the distance between chip and chuck.Cause
This, the present invention can effectively solve the problem that due to clamped chip and clean gas injection apparatus on chuck apart from it is excessive, cause technique
During the problem of can not effectively be protected to chip back surface, it is to avoid pollution of the chemical liquids to chip back surface.Meanwhile, the present invention
Can be that the manipulator for capturing chip from chip back surface leaves enough when picking and placeing piece while realization is protected to chip back surface
Operating space, improve the reliability that chip picks and places action.
Above-described is only the preferred embodiments of the present invention, the embodiment and the patent guarantor for being not used to the limitation present invention
Scope, therefore the equivalent structure change that every specification and accompanying drawing content with the present invention is made are protected, similarly be should be included in
In protection scope of the present invention.
Claims (10)
1. a kind of device for clamping wafer, including rotary chuck, chuck rotary drive mechanism, holder, it is characterised in that the folder
Gripping member is at least three, is uniformly distributed along the chuck perimeter, for place therebetween and holding chip carry out technique, the folder
Gripping member is including the magnetic mover being vertically arranged, the magnetic stator around mover gap setting and below the mover
And the screw rod of vertical direction screw pair is constituted with the mover, the mover upper surface is chip placed side, and higher than the card
Disk upper surface, the placed side is provided with an eccentric block, and for holding chip, the stator is wound with multigroup coil, and connects
Control unit, the affixed chuck of the stator, screw rod；Described control unit is by controlling electrical current in multigroup coil
Energization order form rotationally-varying magnetic field, drive the mover to pick and place crystalline substance with top in lower section technique height along the screw rod
Make rotary lifting movement between piece height, make the vertical range between the chip on the placed side and the chuck upper surface can
Adjust, meanwhile, the mover is in technique height and picks and places the angle and pine for driving the block in clamped wafer between wafer height
Rotation between the angle of chip is opened, makes the radial distance between the block and the chuck pivot adjustable, with technique
Height and pick and place between wafer height rotation and lifting and chip is clamped or unclamped.
2. clamping device according to claim 1, it is characterised in that the chuck is provided with hollow cavity, the holder
In the cavity, the chip placed side of the mover passes the chuck upper surface, the affixed chamber of the stator, screw rod
Internal wall；The chuck lower end is rotated by rotary shaft and is coaxially equipped with connecting chuck rotary drive mechanism, the rotary shaft
Fixing axle, the fixing axle upper end is socketed with conducting slip ring, and the conducting slip ring penetrates setting in the cavity；The control is single
Member includes the control circuit being made up of external ac power source, rectifier, drive module, Switching Power Supply, control panel；Wherein, by institute
State external ac power source input alternating current, be converted to DC bus-bar voltage through the rectifier all the way, be carried in it is described fixed
In the drive module of each group coil connection of son, another road is converted to DC voltage through the Switching Power Supply, and there is provided to institute
Control panel is stated, the control panel gathers voltage, the electric current of the stator each group coil, calculates the position for obtaining the mover, with
This is the frequency and dutycycle of each branch power switching element switch in drive module described in feedback control, and the mover is determined
Position is controlled, and drives the mover in technique height and to pick and place along the screw rod and make rotation and lifting fortune between wafer height
It is dynamic, and drive the block in the angle of clamped wafer and unclamp rotation between the angle of chip；The drive module passes through
Many output leads connect the conducting slip ring, and each group coil of the stator connects institute in the cavity by current supply line
Conducting slip ring is stated, to export each road driving voltage from the drive module to the stator.
3. clamping device according to claim 1 or 2, it is characterised in that the helical pitch S of the screw rod meets below equation：
Wherein, the symbol in formula denominator | | it is absolute value sign.
4. clamping device according to claim 1 or 2, it is characterised in that the stator, mover are respectively soft magnetism stator
With permanent magnetism mover.
5. clamping device according to claim 1 or 2, it is characterised in that the chip placed side of the mover is plane, institute
State the edge that block is located at the chip placed side.
6. clamping device according to claim 1 or 2, it is characterised in that the block is the cylinder being vertically arranged.
7. clamping device according to claim 1 or 2, it is characterised in that described control unit control makes each mover
Synchronous axial system.
8. clamping device according to claim 2, it is characterised in that the chuck rotary drive mechanism revolves including quill shaft
Rotating motor, the quill shaft of the quill shaft electric rotating machine is set around the fixing axle concentric gap, and institute is met on the quill shaft
Rotary shaft is stated, the quill shaft electric rotating machine drives the institute of the rotary shaft and its connection by driving the quill shaft to rotate
State chuck synchronous rotary.
9. clamping device according to claim 2, it is characterised in that the chuck rotary drive mechanism includes axle electric rotating
Machine, connects to form synchronous axial system between the rotating shaft of the axle electric rotating machine and the rotary shaft by timing belt, drive with it is described
The chuck synchronous rotary of rotary shaft connection, the rotary shaft rotates the connection fixing axle.
10. clamping device according to claim 9, it is characterised in that pass through between the rotary shaft and the fixing axle
Rolling bearing formation rotates connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510010027.3A CN104576495B (en) | 2015-01-08 | 2015-01-08 | A kind of device for clamping wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510010027.3A CN104576495B (en) | 2015-01-08 | 2015-01-08 | A kind of device for clamping wafer |
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| Publication Number | Publication Date |
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| CN104576495A CN104576495A (en) | 2015-04-29 |
| CN104576495B true CN104576495B (en) | 2017-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510010027.3A Active CN104576495B (en) | 2015-01-08 | 2015-01-08 | A kind of device for clamping wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4018473A4 (en) * | 2019-08-19 | 2023-09-27 | Oem Group, LLC | Systems and methods for a lift and rotate wafer handling process |
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| CN104867849B (en) * | 2015-05-28 | 2018-01-26 | 北京七星华创电子股份有限公司 | A kind of device for preventing chip back surface from polluting |
| CN105448785B (en) * | 2015-12-31 | 2018-12-18 | 北京北方华创微电子装备有限公司 | Semiconductor film-forming apparatus, wafer automatic positioning clamping structure and method for chucking |
| CN105470176B (en) * | 2015-12-31 | 2018-08-10 | 北京北方华创微电子装备有限公司 | Semiconductor film-forming apparatus, substrate automatic positioning clamping structure and method for chucking |
| US10068792B2 (en) * | 2016-05-31 | 2018-09-04 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| CN106548971A (en) * | 2016-10-11 | 2017-03-29 | 武汉新芯集成电路制造有限公司 | A kind of chuck of wet method single chip washer platform |
| CN108987298B (en) | 2017-05-31 | 2020-10-16 | 上海微电子装备（集团）股份有限公司 | Rotary gluing device and method |
| CN107838045B (en) * | 2017-10-30 | 2024-05-07 | 天津必利优科技发展有限公司 | Wafer taking and placing device |
| CN108672182A (en) * | 2018-06-29 | 2018-10-19 | 上海健康医学院 | A kind of support device for spraying electromechanical equipment |
| CN109023234B (en) * | 2018-08-09 | 2020-08-28 | 深圳市华星光电半导体显示技术有限公司 | Mask plate replacing device and replacing method |
| CN110034062A (en) * | 2019-04-19 | 2019-07-19 | 德淮半导体有限公司 | Wafer clamping device and chuck |
| KR20210128064A (en) * | 2020-04-16 | 2021-10-26 | 주식회사 제우스 | Energizing device for substrate processing |
| CN112885738B (en) * | 2020-09-03 | 2024-02-23 | 天虹科技股份有限公司 | Wafer fixing mechanism and wafer pre-cleaning machine using same |
| CN115706044A (en) * | 2021-08-06 | 2023-02-17 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment, wafer chuck thereof and wafer cleaning method |
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| CN104576495A (en) | 2015-04-29 |
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