CN114953231A - Semiconductor processing equipment and calibration device - Google Patents
Semiconductor processing equipment and calibration device Download PDFInfo
- Publication number
- CN114953231A CN114953231A CN202210594169.9A CN202210594169A CN114953231A CN 114953231 A CN114953231 A CN 114953231A CN 202210594169 A CN202210594169 A CN 202210594169A CN 114953231 A CN114953231 A CN 114953231A
- Authority
- CN
- China
- Prior art keywords
- cam
- wafer
- cutting workpiece
- pull rod
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Transmission Devices (AREA)
Abstract
The embodiment of the application provides semiconductor process equipment and a calibration device. The calibration device includes: the device comprises an installation platform, a driving mechanism and a calibration mechanism; the mounting platform is used for mounting the driving mechanism and the calibration mechanism; the driving mechanism comprises a cam and a driver, the cam is positioned at the top of the mounting platform and is provided with a plurality of convex parts and concave parts which are alternately arranged; the driver is used for driving the cam to rotate; the calibration mechanism comprises a plurality of movable bearing components, the movable bearing components are distributed radially along the radial direction of the cam and are used for bearing the wafer cutting workpiece together, and the movable bearing components are matched with the cam and are used for being selectively and synchronously far away from or close to the cam when the cam rotates so as to calibrate the position of the wafer cutting workpiece. According to the embodiment of the application, the position of the wafer cutting workpiece is calibrated, the wafer cutting workpiece and the electrostatic chuck are prevented from being shifted in the transmission process, and therefore the product yield is greatly improved.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to semiconductor process equipment and a calibration device.
Background
At present, with the rapid development of 12-inch three-dimensional integration and advanced packaging fields, the requirements for wafer utilization rate, yield and particle control are higher and higher, and the plasma dicing process becomes a development trend of wafer dicing. The plasma cutting process flow is that a wafer and a Frame (Frame) are stuck on a UV film (a plastic film made of special materials, wherein one surface of the plastic film is sticky), and the Frame is arranged around the periphery of the wafer, and the combination is called a wafer cutting workpiece; the plasma etches the wafer on the wafer cutting workpiece, and the wafer is cut into a plurality of chips (chips) after the etching is finished.
In the prior art, a manipulator transfers a wafer cutting workpiece from a cassette (cassette) to an electrostatic chuck of a process chamber, and in order to ensure stability of a process result, the position of the wafer cutting workpiece transferred to the electrostatic chuck at each time cannot have an error, that is, the center deviation of the wafer cutting workpiece relative to the center of the electrostatic chuck cannot exceed 0.5 mm. However, in the prior art, the wafer can only be calibrated and positioned alone, and the position of the wafer cutting workpiece cannot be calibrated, so that the yield of the process result is seriously influenced.
Disclosure of Invention
The application provides semiconductor process equipment and a calibration device aiming at the defects of the prior art, and is used for solving the technical problem that the yield of process results is influenced because the position of a wafer cutting workpiece cannot be calibrated and positioned in the prior art.
In a first aspect, an embodiment of the present application provides an apparatus for calibrating a wafer-cut workpiece, wherein a wafer is fixed to a side of the wafer-cut workpiece, the apparatus comprising: the device comprises an installation platform, a driving mechanism and a calibration mechanism; the mounting platform is used for mounting the driving mechanism and the calibrating mechanism; the driving mechanism comprises a cam and a driver, the cam is positioned at the top of the mounting platform, and the cam is provided with a plurality of convex parts and concave parts which are alternately arranged; the driver is used for driving the cam to rotate; the calibration mechanism comprises a plurality of movable bearing components, the movable bearing components are distributed radially along the radial direction of the cam and are used for bearing the wafer cutting workpiece together, and the movable bearing components are matched with the cam and are used for being selectively and synchronously far away from or close to the cam when the cam rotates so as to calibrate the position of the wafer cutting workpiece.
In an embodiment of this application, the aligning gear is still including mounting structure, mounting structure is including center block and a plurality of branch, and is a plurality of branch is followed radially is the distribution of center block, center block is located between cam and the mounting platform, and with the cam sets up with one heart, and is a plurality of remove bearing component one-to-one ground and slide and locate a plurality of on the branch, center block has seted up the through-hole along its thickness direction, the one end of driver pass the through-hole with the cam is connected.
In an embodiment of the present application, the movable carrier assembly includes a slide rail, a pull rod structure and an elastic component, wherein the pull rod structure is used for carrying the wafer cutting workpiece and is slidably disposed on the branch through the slide rail; one end of the elastic component is fixedly arranged on the branch, and the other end of the elastic component is connected with the pull rod structure and used for providing elastic acting force to drive the pull rod structure to be close to the cam so as to calibrate the position of the wafer cutting workpiece.
In an embodiment of the present application, the pull rod structure includes a bearing component, a roller component and a pull rod body, the pull rod body is slidably disposed on the branch through the slide rail, the bearing component and the roller component are respectively disposed at two ends of the pull rod body, and the roller component is configured to selectively abut against and contact with the convex portion of the cam; the bearing component is used for bearing the wafer cutting workpiece and clamping the edge of the wafer cutting workpiece when the pull rod structure is close to the cam, so that the wafer cutting workpiece is subjected to pretightening force towards the cam.
In an embodiment of the present application, the elastic component includes a fixed block and an elastic component, the fixed block is disposed on the branch and located between the roller component and the bearing component; the elastic piece is arranged along the extending direction of the pull rod body, one end of the elastic piece is connected with the bearing part, and the other end of the elastic piece is connected with the fixed block.
In an embodiment of the application, the bearing component includes a supporting portion and a clamping portion, the supporting portion has a supporting surface for bearing the wafer cutting workpiece, and the clamping portion is convexly disposed on one side of the supporting surface far away from the cam, and is used for clamping an edge of the wafer cutting workpiece when the pull rod structure is close to the cam.
In an embodiment of the present application, the alignment mechanism includes four movable carrier assemblies, and the engaging portions of the four movable carrier assemblies are used for engaging with four straight edges of the outer periphery of the wafer cutting workpiece, so as to align the position of the wafer cutting workpiece.
In an embodiment of the present application, the calibration device further includes a plurality of ejector pin assemblies, and the ejector pin assemblies are disposed through the mounting platform and are uniformly distributed along a circumferential direction of the cam; the plurality of ejector pin assemblies are used for being lifted when the cam rotates for a first preset angle so as to support the wafer cutting workpiece, and driving the wafer cutting workpiece to descend and be placed on the bearing part at the same time, wherein when the cam rotates for the first preset angle, the roller part is in abutting contact with a convex part of the cam, so that the plurality of pull rod structures are synchronously far away from the cam; the plurality of ejector pin assemblies are further used for driving the calibrated wafer cutting workpiece to ascend when the cam rotates by a second preset angle so that the wafer cutting workpiece can be transmitted through the manipulator, and when the cam rotates by the second preset angle, the bearing part is far away from the wafer cutting workpiece by a preset distance.
In an embodiment of the present application, the bearing component has self-lubricating property, and the predetermined distance is less than or equal to 0.5 mm.
In an embodiment of the present application, the thimble assembly includes a telescopic cylinder, a bellows, and a thimble, the telescopic cylinder is disposed at the bottom of the mounting platform, and a top of the telescopic cylinder is connected to a bottom of the bellows; the corrugated pipe penetrates through the mounting hole of the mounting platform, and the top of the corrugated pipe is used for mounting the ejector pin.
In an embodiment of the present application, the driving mechanism further includes a mounting frame, a coupler, and a transmission shaft, the mounting frame is disposed at a bottom center position of the mounting platform, and the driver is disposed at a bottom of the mounting frame; the coupling is arranged in the mounting frame and is connected with an output shaft of the driver; the bottom end of the transmission shaft is connected with the coupler, and the top end of the transmission shaft penetrates through the mounting platform and is connected with the cam.
In a second aspect, the present application provides a semiconductor processing apparatus, comprising a transfer chamber, a process chamber, a robot, and the calibration device provided in the first aspect, wherein the robot and the calibration device are disposed in the transfer chamber, and the robot is configured to transfer the wafer cut workpiece before calibration to the calibration device and to transfer the wafer cut workpiece after calibration to the process chamber.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
according to the embodiment of the application, the plurality of movable bearing assemblies are arranged on the periphery of the cam and radially distributed along the radial direction of the cam, and the convex part of the cam abuts against the movable bearing assemblies through rotation of the cam by a first preset angle, so that the plurality of movable bearing assemblies are synchronously far away from the cam, and at the moment, the plurality of movable bearing assemblies can jointly bear the wafer cutting workpiece; through the continuous rotation of the cam, the plurality of movable bearing assemblies can be close to the cam synchronously due to the fact that the plurality of movable bearing assemblies lose the abutting of the convex parts, the wafer cutting workpiece is driven to move to a concentric state towards the center of the cam, the position of the wafer cutting workpiece is calibrated, and therefore when the mechanical arm transmits the wafer cutting workpiece to the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck cannot deviate, and the yield of the wafer cutting workpiece is improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a calibration apparatus according to an embodiment of the present disclosure;
fig. 2 is a schematic partial enlarged structural view of a calibration device according to an embodiment of the present disclosure;
fig. 3A is a schematic top view of a calibration apparatus according to an embodiment of the present disclosure;
fig. 3B is a schematic cross-sectional structural diagram of an alignment apparatus according to an embodiment of the present disclosure;
fig. 3C is a schematic partial sectional view of an alignment apparatus according to an embodiment of the present disclosure;
fig. 4A is a schematic top view of an idle calibration device according to an embodiment of the present disclosure;
FIG. 4B is a schematic cross-sectional view of a thimble assembly of an alignment apparatus supporting a wafer-cut workpiece according to an embodiment of the present disclosure;
fig. 4C is a schematic cross-sectional view illustrating a calibration mechanism of the calibration apparatus carrying a wafer-cut workpiece according to an embodiment of the present disclosure;
FIG. 4D is a schematic diagram illustrating a partial cross-sectional structure of an alignment mechanism of an alignment apparatus according to an embodiment of the present disclosure;
fig. 5 is a schematic top view of a calibration device according to an embodiment of the present disclosure in a calibration state;
fig. 6A is a schematic top view of a calibration device in a transmission state according to an embodiment of the present disclosure;
fig. 6B is a schematic cross-sectional structural diagram of a calibration device in a transmission state according to an embodiment of the present application;
fig. 6C is a schematic partial cross-sectional view of a calibration device according to an embodiment of the present disclosure in a transmission state;
fig. 7A is a schematic structural diagram of another view angle of an alignment apparatus according to an embodiment of the present disclosure;
fig. 7B is a schematic cross-sectional structural diagram of an alignment apparatus according to an embodiment of the present disclosure.
Detailed Description
The present application is described in detail below and examples of embodiments of the present application are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements with the same or similar functionality throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
An embodiment of the present application provides a calibration apparatus for a wafer-cut workpiece, wherein a wafer is fixed on a side surface of the wafer-cut workpiece, and a schematic structural diagram of the calibration apparatus is shown in fig. 1, fig. 2, fig. 7A, and fig. 7B, and the calibration apparatus includes: the device comprises an installation platform 1, a driving mechanism 2 and a calibration mechanism 3; the mounting platform 1 is used for mounting the driving mechanism 2 and the calibration mechanism 3; the driving mechanism 2 comprises a cam 21 and a driver 22, the cam 21 is positioned at the top of the mounting platform 1, and the cam 21 is provided with a plurality of convex parts 211 and concave parts 212 which are alternately arranged; the driver 22 is used for driving the cam 21 to rotate; the calibration mechanism 3 comprises a plurality of movable bearing components 31, wherein the plurality of movable bearing components 31 are distributed radially along the radial direction of the cam 21 and are used for bearing the wafer cutting workpiece together, and the plurality of movable bearing components 31 are matched with the cam 21 and are used for being selectively and synchronously far away from or close to the cam 21 when the cam 21 rotates so as to calibrate the position of the wafer cutting workpiece.
As shown in fig. 1, fig. 2, fig. 7A and fig. 7B, the semiconductor processing equipment is used for performing a plasma dicing process, for example, but the embodiment of the present application is not limited to a specific type thereof, and a person skilled in the art can adjust the setting according to actual situations. The mounting platform 1 may be a rectangular plate-shaped structure, which is specifically disposed in a transfer chamber of a semiconductor processing apparatus, for mounting the driving mechanism 2 and the alignment mechanism 3, but the embodiment of the present application does not limit the specific shape of the mounting platform 1. The driving mechanism 2 is integrally arranged at the central position of the mounting platform 1 in a penetrating way, the driver 22 is positioned at the bottom of the mounting platform 1, and the cam 21 is positioned at the top of the mounting platform 1. The driver 22 may employ a servo motor or a stepping motor for driving the cam 21 to rotate precisely. The cam 21 has four convex portions 211 and four concave portions 212 in the circumferential direction, and any two adjacent convex portions 211 have concave portions 212 therebetween, that is, the cam 21 has a plurality of convex portions 211 and concave portions 212 alternately arranged, but the embodiment of the present application does not limit the specific number of convex portions 211 and concave portions 212 as long as the number of convex portions 211 and concave portions 212 is the same and alternately arranged. The calibration mechanism 3 is arranged at the top of the mounting platform 1, and the calibration mechanism 3 comprises four movable bearing components 31, wherein the four movable bearing components 31 are radially and uniformly distributed along the radial direction of the cam 21. One end of the movable bearing component 31 is used for being matched with the convex part 211 and the concave part 212 for transmission; the other ends of the movable carrier assemblies 31 cooperate with each other for carrying a wafer-cut workpiece. In practical application, the cam 21 is driven by the driver 22 to rotate by a first preset angle, and the four protrusions 211 abut against the movable carrier 31, so that the movable carrier 31 is away from the cam 21 synchronously. The alignment mechanism 3 is idle at this time, and a robot (not shown) can transfer the wafer cutting workpiece 100 onto the alignment mechanism 3, as shown in fig. 3A and 4A. When the cam 21 continues to rotate under the driving of the driver 22, the moving bearing assemblies 31 get close to the cam 21 synchronously because the moving bearing assemblies 31 lose the abutting of the convex parts 211. At this time, the alignment mechanism 3 is in an alignment state, and the plurality of movable carrier assemblies 31 simultaneously drive the wafer cutting workpiece 100 to move toward the center of the cam 21, so as to adjust the positions of the wafer cutting workpiece 100 and the cam 21 to be concentric, as shown in fig. 5. Because the four movable bearing assemblies 31 move simultaneously, the position of the wafer cutting workpiece is adjusted rapidly, so that the mechanical arm can transmit the wafer cutting workpiece to the process chamber conveniently, and the wafer cutting workpiece and the electrostatic chuck are prevented from being deviated.
According to the embodiment of the application, the plurality of movable bearing assemblies are arranged on the periphery of the cam and radially distributed along the radial direction of the cam, and the convex part of the cam abuts against the movable bearing assemblies through rotation of the cam by a first preset angle, so that the plurality of movable bearing assemblies are synchronously far away from the cam, and at the moment, the plurality of movable bearing assemblies can jointly bear the wafer cutting workpiece; through the continuous rotation of the cam, the plurality of movable bearing assemblies can be close to the cam synchronously due to the fact that the plurality of movable bearing assemblies lose the abutting of the convex parts, the wafer cutting workpiece is driven to move to a concentric state towards the center of the cam, the position of the wafer cutting workpiece is calibrated, and therefore when the mechanical arm transmits the wafer cutting workpiece to the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck cannot deviate, and the yield of the wafer cutting workpiece is improved.
It should be noted that the embodiment of the present application does not limit the specific number of the mobile bearing assemblies 31, for example, the number of the mobile bearing assemblies 31 is three or five. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, fig. 2, fig. 7A and fig. 7B, the calibration mechanism 3 further includes a mounting structure 34, the mounting structure 34 includes a central block 341 and a plurality of branches 342, the plurality of branches 342 are radially distributed along a radial direction of the central block 341, the central block 341 is located between the cam 21 and the mounting platform 1 and is concentrically disposed with the cam 21, the plurality of movable bearing assemblies 31 are slidably disposed on the plurality of branches 342 in a one-to-one correspondence manner, the central block 341 is provided with a through hole along a thickness direction thereof, and one end of the driver 22 passes through the through hole and is connected with the cam 21.
As shown in fig. 1, 2, 7A and 7B, the mounting structure 34 includes a central block 341 and four branches 342, the central block 341 is a cylindrical structure, and the four branches 342 are radially distributed along the radial direction of the central block 341, that is, the mounting structure 34 is a cross-shaped structure as a whole. The mounting structure 34 is integrally arranged on the mounting platform 1, and the central block 341 is positioned between the mounting platform 1 and the cam 21 and is arranged concentrically with the cam 21; the four movable bearing assemblies 31 are respectively arranged on the four branches 342 and can be slidably arranged relative to the branches 342 so that the bearing part 315 can be far away from or close to the cam 21. The center block 341 may further have a through hole formed in a central position thereof, and the through hole may be coaxial with the cam 21 and used for connecting the output shaft of the driver 22 with the cam 21 after passing through the through hole, that is, the center block 341 may be disposed in a circular ring structure. By adopting the design, the installation structure 34 is arranged, so that a certain distance is reserved between the movable bearing component 31 and the installation platform 1, the movable bearing component is convenient to highly match with a manipulator, and the movable bearing component is suitable for the existing semiconductor process equipment, so that the applicability and the application range are greatly improved.
It should be noted that, the present embodiment does not limit that the calibration mechanism 3 must include the mounting structure 34, for example, the plurality of movable bearing assemblies 31 may be directly slidably disposed on the mounting platform 1. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the movable supporting assembly 31 includes a sliding rail 311, a pull rod structure 312 and an elastic component 313, wherein the pull rod structure 312 is used for supporting a wafer-cutting workpiece and is slidably disposed on the branch 342 through the sliding rail 311; one end of the elastic component 313 is fixedly disposed on the branch 342, and the other end is connected to the pull rod structure 312 for providing an elastic force to drive the pull rod structure 312 to approach the cam 21, so as to calibrate the position of the wafer cutting workpiece.
As shown in fig. 1 and fig. 2, the movable carrier assembly 31 includes a sliding rail 311, a pull rod structure 312 and an elastic component 313, the sliding rail 311 extends along the extending direction of the branch 342, and the cross section of the sliding rail 311 is an inverted trapezoid structure. The pull rod structure 312 extends along the extension direction of the branch 342, and an inverted trapezoidal groove is formed on the bottom surface of the pull rod structure 312, so as to be matched with the slide rail 311 for sliding arrangement. One end of the pull rod structure 312 is used for cooperating with the convex part 211 of the cam 21 for transmission, and the other end is used for bearing the wafer cutting workpiece, when the convex part 211 of the cam 21 abuts against the pull rod structure 312, the pull rod structure 312 integrally moves towards the direction away from the cam 21. The elastic component 313 extends along the extension direction of the branch 342, one end of the elastic component 313 is fixedly connected with the branch 342, and the other end is connected with the pull rod structure 312, when the pull rod structure 312 loses the abutting force of the convex portion 211, the elastic component 313 can provide an elastic acting force to drive the pull rod structure 312 to move towards the direction close to the cam 21, so that the wafer cutting workpiece moves towards the center of the cam 21, and the wafer cutting workpiece is concentric with the cam 21. By adopting the above design, the embodiment of the present application can adopt a simpler structure, that is, the reciprocating motion of the movable bearing component 31 on the branch 342 can be realized, so that the application and maintenance cost can be reduced, and the failure rate can be greatly reduced to prolong the service life.
It should be noted that, in the embodiment of the present application, specific structures of the slide rail 311 and the pull rod structure 312 are not limited, for example, a slide groove is formed on the slide rail 311, and the pull rod structure 312 is slidably fitted in the slide groove. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the pull rod structure 312 includes a roller component 314, a bearing component 315 and a pull rod body 316, the pull rod body 316 is slidably disposed on the branch 342 through the slide rail 311, the bearing component 315 and the roller component 314 are respectively disposed at two ends of the pull rod body 316, and the roller component 314 is configured to selectively contact against the convex portion 211 of the cam 21; the bearing component 315 is used for bearing the wafer cutting workpiece and engaging with the edge of the wafer cutting workpiece when the pull rod structure 312 is close to the cam 21, so that the wafer cutting workpiece is pre-stressed towards the cam 21. Specifically, the pull rod body 316 is slidably fitted on the branch 342 through the slide rail 311, and the two ends of the pull rod body 316 are respectively provided with the roller component 314 and the bearing component 315. One end of the pull rod body 316 close to the cam 21 is provided with a bending structure, which includes a vertical plate and a horizontal plate, the vertical plate is integrally formed at the end of the pull rod structure 312, and the horizontal plate is integrally formed at the top of the vertical plate. The roller component 314 is arranged at the bottom of the transverse plate through an installation shaft, and the outer peripheral surface of the roller component 314 can be in rolling fit with the outer peripheral surface of the convex part 211 so as to reduce transmission resistance, so that the working efficiency is improved, and meanwhile, particle pollution caused by friction between the cam 21 and the pull rod body 316 can be avoided. The bearing component 315 is disposed at the other end of the pull rod body 316, and the bearing component 315 can be used for bearing the wafer-cutting workpiece and can be used for engaging an edge of the wafer-cutting workpiece, so as to engage the edge of the wafer-cutting workpiece when the pull rod structure 312 is close to the cam 21, so that the wafer-cutting workpiece is pre-stressed towards the cam 21 and simultaneously moves towards the center of the cam 21 to achieve the position calibration. By adopting the design, the wafer cutting device is simple in implementation structure, and can improve the efficiency of wafer cutting workpiece calibration while reducing the transmission resistance.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the elastic component 313 includes a fixing block 3131 and an elastic component 3132, the fixing block 3131 is disposed on the branch 342 and located between the roller component 314 and the bearing component 315; the elastic member 3132 is disposed along the extending direction of the drawbar body 316, and has one end connected to the bearing part 315 and the other end connected to the fixing block 3131. Specifically, the bottom end of the fixed block 3131 is connected to the branch 342, and an avoiding notch is formed in the middle of the bottom of the fixed block 3131 for avoiding the sliding rail 311 and the pull rod body 316, so that the pull rod body 316 can reciprocate in the avoiding notch. The fixing block 3131 is located between the roller unit 314 and the bearing unit 315, and is disposed adjacent to the roller unit 314. The elastic member 3132 is located between the fixing block 3131 and the bearing member 315, and one end of the elastic member 3132 is connected to the fixing block 3131 and the other end is connected to the bearing member 315. The elastic element 3132 is, for example, a coil spring, so that the lever body 316 is always biased toward the cam 21. By adopting the design, the structure of the embodiment of the application is simple and easy to realize, and the horizontal pretightening force can be provided for the pull rod body 316, so that the application and maintenance cost is greatly reduced.
In an embodiment of the present application, as shown in fig. 1 to fig. 3A, the bearing member 315 includes a supporting portion 3151 and an engaging portion 3152, the supporting portion 3151 has a supporting surface for bearing the wafer-cutting workpiece, and the engaging portion 3152 is protruded on a side of the supporting surface away from the cam 21 for engaging an edge of the wafer-cutting workpiece when the pull rod structure 312 is close to the cam 21. Specifically, the supporting portion 3151 may be a rectangular parallelepiped structure, the supporting portion 3151 is disposed on the pull rod body 316, and a top surface of the supporting portion 3151 is a supporting surface for bearing a wafer cutting workpiece. The engaging portion 3152 may be a rod-shaped structure, which may be integrally formed on the supporting surface of the supporting portion 3151, and the engaging portion 3152 is disposed far from the cam 21, so that the supporting surface of the supporting portion 3151 may be used for bearing the wafer cutting workpiece. In practical application, the four supporting portions 3151 are used for bearing the bottom surface of the wafer cutting workpiece, the four engaging portions 3152 are used for engaging four edge positions of the wafer cutting workpiece, and when the four pull rod structures 312 are synchronously close to the cam 21, the four engaging portions 3152 simultaneously engage the edge positions of the wafer cutting workpiece, so as to achieve alignment of the wafer cutting workpiece. Further, the first spacing L1 between the two oppositely disposed engaging portions 3152 is provided, the value of the first spacing L1 depends on the maximum allowable offset calibration amount, which is the maximum unidirectional offset of the wafer-cut workpiece, and referring to fig. 4A, when the outer circumference of the wafer-cut workpiece 100 has four uniformly distributed straight sides, the first spacing L1 should be calculated as the maximum offset calibration amount (which may also be offset in the opposite direction) which is twice the width between the straight sides of the wafer-cut workpiece 100 (for example, the maximum offset calibration amount is 5 mm), and the first spacing L1 may be 380 mm +5 mm × 2 ═ 390 mm, where 380 mm is the width between two symmetrical straight sides of the wafer-cut workpiece 100. When the wafer cut workpiece 100 exceeds the maximum offset, an alarm mechanism may be used to alarm, but the embodiment of the present application is not limited to the specific implementation of the alarm mechanism. By adopting the design, the wafer cutting device is simple in structure, and can be arranged according to different wafer cutting workpieces 100, so that the applicability and the application range of the wafer cutting device are greatly improved.
It should be noted that the embodiments of the present application do not limit the specific shapes of the supporting portion 3151 and the engaging portion 3152, for example, the shapes of the supporting portion 3151 and the engaging portion 3152 may adopt an arc structure, so as to be suitable for the circular wafer cutting workpiece 100. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, fig. 3A and fig. 4A, the alignment mechanism 3 includes four movable carrier elements 31, and the engaging portions 3152 of the four movable carrier elements 31 are used for engaging with four straight edges of the outer periphery of the wafer cut workpiece 100 to align the position of the wafer cut workpiece 100. Specifically, the four movable carrier assemblies 31 are radially and uniformly distributed along the circumferential direction of the cam 21, so that the engaging portions 3152 of the four movable carrier assemblies 31 can engage with the four straight edges of the outer periphery of the wafer cutting workpiece 100. When the four movable carrier assemblies 31 synchronously approach the cam 21, the four engaging portions 3152 can push the four straight edges of the wafer cut workpiece 100 to move toward the center of the cam 21, so as to calibrate the wafer cut workpiece 100. However, the number of the movable carrier assemblies 31 is not limited to a specific number in the embodiment of the present application, as long as the number of the movable carrier assemblies 31 corresponds to the number of straight edges of the outer periphery of the wafer cut workpiece 100. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 to 4D, the calibration device further includes a plurality of ejector pin assemblies 4, the ejector pin assemblies 4 are disposed on the mounting platform 1 in a penetrating manner and are uniformly distributed along the circumferential direction of the cam 21; the plurality of ejector pin assemblies 4 are configured to be lifted when the cam 21 is placed at a first predetermined angle to support the wafer-cutting workpiece 100, and to drive the wafer-cutting workpiece 100 to be lowered and simultaneously placed on the bearing member 315, wherein when the cam 21 rotates at the first predetermined angle, the roller member 314 abuts against and contacts the convex portion 211 of the cam 21, so that the plurality of pull rod structures 312 are synchronously away from the cam 21; the plurality of pin assemblies 4 are further configured to lift the calibrated wafer-cutting workpiece 100 when the cam 21 rotates by a second predetermined angle, so that the wafer-cutting workpiece 100 can be transferred by the robot, wherein the bearing member 315 is away from the cam 21 by a predetermined distance L when the cam 21 rotates by the second predetermined angle.
As shown in fig. 1 to 4D, three ejector pin assemblies 4 are disposed on the mounting platform 1, and are uniformly and alternately distributed along the circumference of the cam 21, for supporting the wafer cutting workpiece 100 in cooperation with each other. A portion of the ejector pin assembly 4 is located at the bottom of the mounting platform 1, and the ejector pin 43 of the ejector pin assembly 4 may be located above the mounting platform 1, and the ejector pin 43 may be lifted and lowered with respect to the mounting platform 1 for contacting the bottom surface of the wafer cut workpiece 100. When the cam 21 rotates by a first predetermined angle, the roller 314 abuts against the convex portion 211 of the cam 21 to make the plurality of pull rod structures 312 away from the cam 21, that is, the alignment mechanism 3 is in an idle state, the robot can transfer the wafer cut workpiece 100 onto the alignment mechanism 3, at this time, the thimble 43 of the thimble assembly 4 is lifted so that a second distance L2 is provided between the top end of the thimble 43 and the supporting surface of the supporting portion 3151, and the second distance L2 may be set to be greater than 0 mm and less than 3 mm for supporting the wafer cut workpiece 100 in mutual cooperation, as shown in fig. 3C. Further, the three ejector pin assemblies 4 can drive the wafer-cutting workpiece 100 to descend, so as to drive the wafer-cutting workpiece 100 to descend onto the alignment mechanism 3, so that the wafer-cutting workpiece 100 is simultaneously placed on the plurality of bearing members 315, and a third distance L3 is provided between the ejector pin 43 of the ejector pin assembly 4 and the supporting surface of the supporting portion 3151, where the third distance L3 may be set to be greater than 0 mm and less than 3 mm, and the specific process may refer to fig. 4A to 4D. It should be noted that, in the embodiment of the present application, specific values of the third distance L3 are not limited, as long as the thimble 43 of the thimble assembly 4 is lower than the supporting surface of the supporting portion 3151, and therefore, the embodiment of the present application is not limited thereto.
Referring to fig. 5 to 6C, when the cam 21 rotates for the first predetermined angle and then continues to rotate, since the roller component 314 gradually loses the abutting of the convex portion 211, the roller component 314 can approach the cam 21 and is finally accommodated in the concave portion 212, that is, the plurality of bearing components 315 synchronously approach the cam 21, at this time, the calibration mechanism 3 is in the calibration state, and under the action of the plurality of bearing components 315, the wafer cutting workpiece 100 and the cam 21 are finally in the concentric state, as shown in fig. 5. When the cam 21 rotates by a second predetermined angle, the convex portion 211 of the cam 21 can push against the roller portion 314 again, the bearing portion 315 can be away from the cam 21 by a predetermined distance L, and at this time, the engaging portion 3152 of the bearing portion 315 is separated from the straight edge of the wafer-cut workpiece 100, so that the calibration mechanism 3 is in a transmission state, and the ejector pins 43 of the three ejector pin assemblies 4 are lifted simultaneously to drive the calibrated wafer-cut workpiece 100 to lift and separate from the supporting portion 3151, thereby facilitating the robot to take away the calibrated wafer-cut workpiece 100, as shown in fig. 6A to 6C. By adopting the design, the wafer cutting workpiece 100 can be transmitted by matching with the mechanical arm, so that the wafer cutting workpiece 100 is calibrated, the calibrated wafer cutting workpiece 100 is transmitted, mechanical interference with the mechanical arm is avoided, and the usability and the failure rate of the embodiment are improved.
In an embodiment of the present application, as shown in fig. 1 to 6C, the bearing component 315 has self-lubrication, and the predetermined distance L is less than or equal to 0.5 mm. Specifically, the bearing members 315 are made of resin, so that the supporting surfaces of the supporting portions 3151 have self-lubrication, and when the bearing members 315 are away from the cam 21 by a predetermined distance L, and the four bearing members 315 are simultaneously away from the cam 21, the position of the wafer cut workpiece 100 does not shift due to the self-weight of the wafer cut workpiece 100 and the self-lubrication of the bearing members 315, that is, the center of the wafer cut workpiece 100 is still overlapped with the center of the cam 21. Further, since the bearing component 315 is away from the cam 21 by a predetermined distance L, the engaging portion 3152 and the straight edge of the diced wafer 100 also have the predetermined distance L, so as to avoid the movement distance from being too large to drive the diced wafer 100 to shift, the predetermined distance L may be set to be greater than 0 mm and less than or equal to 0.5 mm. By adopting the design, the embodiment of the invention still keeps the concentric arrangement with the cam 21 in the process of conveying the calibrated wafer cutting workpiece 100, thereby further improving the calibration accuracy of the wafer cutting workpiece 100. It should be noted that the embodiment of the present application does not limit the specific material of the bearing component 315, as long as it has a self-lubricating characteristic with respect to the wafer-cutting workpiece 100. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, fig. 7A and fig. 7B, the thimble assembly 4 includes a telescopic cylinder 41, a bellows 42 and a thimble 43, the telescopic cylinder 41 is disposed at the bottom of the mounting platform 1, and the top of the telescopic cylinder 41 is connected to the bottom of the bellows 42; the corrugated tube 42 is inserted into the mounting hole of the mounting platform 1, and the top of the corrugated tube 42 is used for mounting the thimble 43. Particularly, three mounting holes are formed in the mounting platform 1, and the three ejector pin assemblies 4 are respectively arranged in the three mounting holes in a penetrating mode. The telescopic cylinder 41 is located at the bottom of the mounting platform 1 and is aligned with the mounting hole. The bottom end of the bellows 42 is connected with the top of the telescopic cylinder 41, the bellows 42 is inserted into the mounting hole, and the top end of the bellows is used for mounting the thimble 43, and the top end of the thimble 43 can be used for contacting and abutting against the bottom surface of the wafer cutting workpiece 100. The telescopic cylinder 41 is used for driving the thimble 43 to extend and retract relative to the mounting platform 1 so as to drive the wafer cutting workpiece 100 to lift and descend. By adopting the design, the structure of the embodiment of the application is simple and easy to realize, and the application and maintenance cost of the embodiment of the application is greatly reduced.
In an embodiment of the present application, as shown in fig. 1, fig. 7A and fig. 7B, the driving mechanism 2 further includes a mounting frame 23, a coupler 24 and a transmission shaft 25, the mounting frame 23 is disposed at a bottom center position of the mounting platform 1, and the driver 22 is disposed at a bottom of the mounting frame 23; a coupling 24 is provided in the mounting frame 23 and is connected to an output shaft of the driver 22; the bottom end of the transmission shaft 25 is connected with the coupler 24, and the top end of the transmission shaft passes through the mounting platform 1 to be connected with the cam 21. Specifically, the mounting frame 23 may have a hollow cubic structure, and the mounting frame 23 is disposed at a central position of the bottom of the mounting platform 1 and fixedly connected to the mounting platform by welding or fastening members. The driver 22 can be a servo motor or a stepping motor, the driver 22 is disposed at the bottom of the mounting frame 23, an output shaft of the driver 22 can extend into the mounting frame 23, the coupler 24 is disposed in the mounting frame 23, two ends of the coupler are respectively connected to the output shaft and the transmission shaft 25, and the transmission shaft 25 penetrates through the mounting platform 1 and is connected to the cam 21. With the above design, the coupling 24 can absorb the vibration of the driver 22 greatly, so as to improve the accuracy of transmission and further improve the accuracy of calibration.
To further illustrate the implementation and advantages of the embodiments of the present application, a specific implementation of the present application is described below with reference to fig. 1 to 7B.
When the calibration mechanism 3 is in the idle state, the cam 21 rotates by a first predetermined angle, specifically referring to the position shown in fig. 3A, the convex portion 211 of the cam 21 abuts against the roller 314, and the elastic member 313 is in the stretching state, the stretching amount may be determined according to the elastic force of the elastic member 3132, and the elastic force of the elastic member 3132 may be set to be not less than 5N. The robot may transfer the wafer cut workpiece 100 onto the alignment mechanism 3, and the wafer cut workpiece 100 is placed on the plurality of ejector pin assemblies 4 in advance, as shown in fig. 4A and 4B. The thimble 43 of the thimble assembly 4 descends to drive the wafer-cutting workpiece 100 to fall on the plurality of bearing members 315 at the same time, and at this time, a third distance L3 is formed between the top end of the thimble 43 and the supporting surface of the supporting portion 3151 to prevent the thimble 43 and the wafer-cutting workpiece 100 from colliding and rubbing, and the third distance L3 may be set to 3 mm, as shown in fig. 4C and 4D.
Further, after the driver 22 drives the cam 21 to rotate by a first preset angle, the cam 21 is continuously driven to rotate counterclockwise, the elastic force of the elastic element 3132 can make the bearing component 315 move toward the center of the cam 21, because the moving distances of the four bearing components 315 are the same, the center of the wafer cutting workpiece 100 gradually approaches toward the center of the cam 21, and the roller component 314 is always attached to the outer peripheral surface of the cam 21, so that the movement of the wafer cutting workpiece 100 is relatively stable, as shown in fig. 5. After the cam 21 rotates to an angle (less than 45 °), the elastic force of the elastic member 3132 is gradually reduced due to the gradual reduction of the stretching amount of the elastic member 3132, until all four bearing members 315 clamp the wafer-cut workpiece 100 and the center of the wafer-cut workpiece 100 coincides with the center of the cam 21, at which time the elastic force of the elastic member 3132 is minimized, but the elastic member 3132 should still be in a stretched state, and the elastic force is not less than 3N, so as to ensure that the wafer-cut workpiece 100 is concentric with the cam 21. Further, when the driver 22 continuously drives the cam 21 to rotate to 45 °, the roller component 314 is completely separated from the convex portion 211 of the cam 21 and is located in the concave portion 212 of the cam 21, and since the elastic component 3132 is still in a stretched state, each of the bearing components 315 has an elastic force with the same magnitude and the same direction pointing to the center of the cam 21 for the wafer-cutting workpiece 100, so as to ensure that the center of the wafer-cutting workpiece 100 completely coincides with the center of the cam 21, thereby completing the station calibration of the wafer-cutting workpiece 100.
Finally, the driver 22 drives the cam 21 to rotate by a second predetermined angle, and the four bearing members 315 move away from the cam 21 at the same time, so that a predetermined distance L is formed between the engaging portion 3152 of the bearing member 315 and the straight edge of the wafer cut workpiece 100, where the predetermined distance L may be greater than or equal to 0 and less than or equal to 0.5 mm, as shown in fig. 6B and 6C. At this time, the three ejector pin assemblies 4 simultaneously drive the wafer-cutting workpiece 100 to ascend, so that the robot transfers the calibrated wafer-cutting workpiece 100 to the electrostatic chuck of the process chamber. Therefore, the embodiment of the application realizes the calibration and transmission of the wafer cutting workpiece 100 through a simpler structure, thereby avoiding the deviation of the positions of the wafer cutting workpiece 100 and the electrostatic chuck, and further improving the yield of products.
Based on the same inventive concept, the embodiment of the application provides semiconductor process equipment, which comprises: the robot arm is used for transmitting the wafer cutting workpiece before calibration to the calibration device and transmitting the wafer cutting workpiece after calibration to the process chamber.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
according to the embodiment of the application, the plurality of movable bearing assemblies are arranged on the periphery of the cam and radially distributed along the radial direction of the cam, and the convex part of the cam abuts against the movable bearing assemblies through rotation of the cam by a first preset angle, so that the plurality of movable bearing assemblies are synchronously far away from the cam, and at the moment, the plurality of movable bearing assemblies can jointly bear the wafer cutting workpiece; through the continuous rotation of the cam, the movable bearing assemblies can synchronously approach the cam and drive the wafer cutting workpiece to move to a concentric state towards the center of the cam due to the fact that the movable bearing assemblies lose the propping of the convex parts, and the position of the wafer cutting workpiece is calibrated, so that when the manipulator transmits the wafer cutting workpiece into the process chamber, the position of the wafer cutting workpiece and the position of the electrostatic chuck cannot deviate, and the yield of the wafer cutting workpiece is improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is only a few embodiments of the present application and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present application, and that these improvements and modifications should also be considered as the protection scope of the present application.
Claims (12)
1. A calibration apparatus for a wafer cut workpiece having a wafer fixed to one side thereof, the apparatus comprising: the device comprises an installation platform, a driving mechanism and a calibration mechanism;
the mounting platform is used for mounting the driving mechanism and the calibrating mechanism;
the driving mechanism comprises a cam and a driver, the cam is positioned at the top of the mounting platform, and the cam is provided with a plurality of convex parts and concave parts which are alternately arranged; the driver is used for driving the cam to rotate;
the calibration mechanism comprises a plurality of movable bearing components, the movable bearing components are distributed radially along the radial direction of the cam and are used for bearing the wafer cutting workpiece together, and the movable bearing components are matched with the cam and are used for being selectively and synchronously far away from or synchronously close to the cam when the cam rotates so as to calibrate the position of the wafer cutting workpiece.
2. The calibrating apparatus according to claim 1, wherein the calibrating mechanism further comprises a mounting structure, the mounting structure comprises a central block and a plurality of branches, the plurality of branches are radially distributed along a radial direction of the central block, the central block is located between the cam and the mounting platform and is concentrically arranged with the cam, the plurality of movable bearing components are slidably arranged on the plurality of branches in a one-to-one correspondence manner, the central block is provided with a through hole along a thickness direction thereof, and one end of the driver passes through the through hole and is connected with the cam.
3. The calibration apparatus according to claim 2, wherein the movable carrier assembly comprises a slide rail, a pull rod structure and an elastic member, the pull rod structure is used for carrying the wafer-cutting workpiece and is slidably disposed on the branch through the slide rail; one end of the elastic component is fixedly arranged on the branch, and the other end of the elastic component is connected with the pull rod structure and used for providing elastic acting force to drive the pull rod structure to be close to the cam so as to calibrate the position of the wafer cutting workpiece.
4. The calibration device according to claim 3, wherein the pull rod structure comprises a bearing component, a roller component and a pull rod body, the pull rod body is slidably disposed on the branch through the slide rail, the bearing component and the roller component are respectively disposed at two ends of the pull rod body, and the roller component is configured to selectively abut against and contact with the convex portion of the cam; the bearing component is used for bearing the wafer cutting workpiece and clamping the edge of the wafer cutting workpiece when the pull rod structure is close to the cam, so that the wafer cutting workpiece is subjected to pretightening force towards the cam.
5. The alignment device as claimed in claim 4, wherein the resilient member comprises a fixed block and a resilient member, the fixed block being disposed on the branch and between the roller member and the bearing member; the elastic piece is arranged along the extending direction of the pull rod body, one end of the elastic piece is connected with the bearing part, and the other end of the elastic piece is connected with the fixed block.
6. The apparatus according to claim 4, wherein the supporting member comprises a supporting portion and a engaging portion, the supporting portion has a supporting surface for supporting the wafer-cut workpiece, and the engaging portion is protruded from a side of the supporting surface away from the cam for engaging with an edge of the wafer-cut workpiece when the pull rod structure is close to the cam.
7. The alignment apparatus as claimed in claim 6, wherein the alignment mechanism comprises four movable carrier members, and the engaging portions of the four movable carrier members are adapted to engage with four straight edges of the outer periphery of the wafer cut workpiece to align the position of the wafer cut workpiece.
8. The calibrating device according to claim 4, further comprising a plurality of pin assemblies, wherein a plurality of pin assemblies are arranged on the mounting platform and are uniformly distributed along the circumferential direction of the cam; the plurality of ejector pin assemblies are used for being lifted when the cam rotates for a first preset angle so as to support the wafer cutting workpiece, and driving the wafer cutting workpiece to descend and be placed on the bearing part at the same time, wherein when the cam rotates for the first preset angle, the roller part is in abutting contact with a convex part of the cam, so that the plurality of pull rod structures are synchronously far away from the cam;
the plurality of ejector pin assemblies are further used for driving the calibrated wafer cutting workpiece to ascend when the cam rotates by a second preset angle so that the wafer cutting workpiece can be transmitted through the manipulator, and when the cam rotates by the second preset angle, the bearing part is far away from the wafer cutting workpiece by a preset distance.
9. The calibration device of claim 8, wherein the carrier has self-lubricating properties and the predetermined distance is 0.5 mm or less.
10. The calibration device according to claim 8, wherein the thimble assembly comprises a telescopic cylinder, a bellows and a thimble, the telescopic cylinder is disposed at the bottom of the mounting platform, and the top of the telescopic cylinder is connected to the bottom of the bellows; the corrugated pipe penetrates through the mounting hole of the mounting platform, and the top of the corrugated pipe is used for mounting the ejector pin.
11. The calibration device according to any one of claims 1 to 10, wherein the driving mechanism further comprises a mounting frame, a coupling and a transmission shaft, the mounting frame being disposed at a bottom central position of the mounting platform, the driver being disposed at a bottom of the mounting frame; the coupling is arranged in the mounting frame and is connected with an output shaft of the driver; the bottom end of the transmission shaft is connected with the coupler, and the top end of the transmission shaft penetrates through the mounting platform and is connected with the cam.
12. A semiconductor processing apparatus comprising a transfer chamber, a process chamber, a robot and a calibration device according to any one of claims 1 to 11, the robot and the calibration device being disposed in the transfer chamber, the robot being configured to transfer the wafer cut workpiece before calibration to the calibration device and to transfer the wafer cut workpiece after calibration to the process chamber.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210594169.9A CN114953231A (en) | 2022-05-27 | 2022-05-27 | Semiconductor processing equipment and calibration device |
| PCT/CN2023/096490 WO2023227099A1 (en) | 2022-05-27 | 2023-05-26 | Semiconductor process apparatus and calibration device |
| TW112119733A TWI851240B (en) | 2022-05-27 | 2023-05-26 | Semiconductor process equipment and calibration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210594169.9A CN114953231A (en) | 2022-05-27 | 2022-05-27 | Semiconductor processing equipment and calibration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114953231A true CN114953231A (en) | 2022-08-30 |
Family
ID=82957749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210594169.9A Pending CN114953231A (en) | 2022-05-27 | 2022-05-27 | Semiconductor processing equipment and calibration device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114953231A (en) |
| WO (1) | WO2023227099A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023227099A1 (en) * | 2022-05-27 | 2023-11-30 | 北京北方华创微电子装备有限公司 | Semiconductor process apparatus and calibration device |
| CN117650092A (en) * | 2023-12-06 | 2024-03-05 | 北京北方华创微电子装备有限公司 | Centering device and centering method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117727676B (en) * | 2024-02-07 | 2024-05-03 | 无锡星微科技有限公司 | Calibrating device and wafer transmission system with same |
| CN118073251B (en) * | 2024-04-25 | 2024-06-21 | 陇芯微(西安)电子科技有限公司 | Full-automatic material equipment of sending out of semiconductor encapsulation thimble |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141027A (en) * | 2007-12-04 | 2009-06-25 | Hirata Corp | Aligner and edge clamp detecting method using the same |
| CN105575868A (en) * | 2014-11-10 | 2016-05-11 | 上海理想万里晖薄膜设备有限公司 | Substrate calibration method and device |
| CN107591351A (en) * | 2016-07-06 | 2018-01-16 | 北京北方华创微电子装备有限公司 | Manipulator and semiconductor processing equipment |
| CN111312653A (en) * | 2020-03-16 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor processing equipment |
| CN215200206U (en) * | 2021-04-09 | 2021-12-17 | 大族激光科技产业集团股份有限公司 | Cutting positioning jig |
| CN114361086A (en) * | 2021-12-28 | 2022-04-15 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and wafer transmission system thereof |
| CN114420618A (en) * | 2021-12-27 | 2022-04-29 | 江苏邑文微电子科技有限公司 | Automatic wafer position calibration device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106182474B (en) * | 2016-08-30 | 2019-01-29 | 天通日进精密技术有限公司 | Work-piece rotating device and work piece cut equipment with the work-piece rotating device |
| JP7306859B2 (en) * | 2019-04-09 | 2023-07-11 | 株式会社ディスコ | Processing method of transparent plate |
| CN112201607B (en) * | 2020-10-12 | 2023-09-29 | 华海清科股份有限公司 | Wafer centering mechanism, wafer conveying device and wafer thinning equipment |
| CN114953231A (en) * | 2022-05-27 | 2022-08-30 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and calibration device |
-
2022
- 2022-05-27 CN CN202210594169.9A patent/CN114953231A/en active Pending
-
2023
- 2023-05-26 WO PCT/CN2023/096490 patent/WO2023227099A1/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141027A (en) * | 2007-12-04 | 2009-06-25 | Hirata Corp | Aligner and edge clamp detecting method using the same |
| CN105575868A (en) * | 2014-11-10 | 2016-05-11 | 上海理想万里晖薄膜设备有限公司 | Substrate calibration method and device |
| CN107591351A (en) * | 2016-07-06 | 2018-01-16 | 北京北方华创微电子装备有限公司 | Manipulator and semiconductor processing equipment |
| CN111312653A (en) * | 2020-03-16 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor processing equipment |
| CN215200206U (en) * | 2021-04-09 | 2021-12-17 | 大族激光科技产业集团股份有限公司 | Cutting positioning jig |
| CN114420618A (en) * | 2021-12-27 | 2022-04-29 | 江苏邑文微电子科技有限公司 | Automatic wafer position calibration device |
| CN114361086A (en) * | 2021-12-28 | 2022-04-15 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and wafer transmission system thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023227099A1 (en) * | 2022-05-27 | 2023-11-30 | 北京北方华创微电子装备有限公司 | Semiconductor process apparatus and calibration device |
| CN117650092A (en) * | 2023-12-06 | 2024-03-05 | 北京北方华创微电子装备有限公司 | Centering device and centering method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023227099A1 (en) | 2023-11-30 |
| TW202347585A (en) | 2023-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114953231A (en) | Semiconductor processing equipment and calibration device | |
| CN109414813B (en) | Method and system for providing misalignment correction in a robot | |
| CN107877536B (en) | Transfer unit, transfer device, and holding unit | |
| US7644968B2 (en) | Substrate holding device | |
| US20070271753A1 (en) | Gripper device for mounting rubber elastic rings and finger for a gripper device of this type | |
| WO2013022622A2 (en) | Systems having multi-linkage robots and methods to correct positional and rotational alignment in multi-linkage robots | |
| CN112388348B (en) | Zero clamping device | |
| CN113161282B (en) | Supporting device for semiconductor equipment and semiconductor equipment | |
| US20180350654A1 (en) | Two axis goniometer to accomplish fine, permanent, calibration of lift pin hoop orientation | |
| CN115332139A (en) | Position calibration method for positioning tool and manipulator | |
| KR20010086852A (en) | Remote center compliance device with variable center | |
| CN107127065B (en) | Fluid micro-jetting device and execution system thereof | |
| CN101246984B (en) | Cavity filter frequency adjustment mechanism | |
| CN112331602B (en) | Semiconductor process equipment and pushing piece device | |
| KR101991990B1 (en) | Actuator and adhesive chuck device | |
| KR100306302B1 (en) | device for position of LCD panel algine | |
| CN214625011U (en) | Wafer chuck | |
| CN112349648B (en) | Needle lifting mechanism and semiconductor process equipment | |
| CN220710282U (en) | Multi-size wafer compatible alignment device and semiconductor device | |
| CN112635380A (en) | Wafer centering device | |
| CN221092775U (en) | Magnetic attraction mechanism | |
| CN217833235U (en) | Floating mechanism for assembling workpieces | |
| CN218927018U (en) | Centering positioning device | |
| CN219747762U (en) | Assembly jig and assembly equipment | |
| CN111048466B (en) | Wafer clamping device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |