CN112635380A - Wafer centering device - Google Patents
Wafer centering device Download PDFInfo
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- CN112635380A CN112635380A CN202110012806.2A CN202110012806A CN112635380A CN 112635380 A CN112635380 A CN 112635380A CN 202110012806 A CN202110012806 A CN 202110012806A CN 112635380 A CN112635380 A CN 112635380A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The application provides a wafer centering device, which relates to the technical field of semiconductors and comprises a first centering adjusting member and a second centering adjusting member which are arranged at intervals along a preset direction; adjustment portions formed in the first centering adjustment member and the second centering adjustment member, respectively; the adjusting part included in the first centering adjusting member and the adjusting part included in the second centering adjusting member correspond to each other to form an adjusting group; the n adjusting groups respectively correspond to n specification wafers to be positioned, wherein n is greater than or equal to 2 and is an integer. The application provides a wafer centering device, n adjustment group correspond n specification wafers of undetermined location respectively, and n is more than or equal to 2, so can carry out high-efficient location to the wafer of multiple specification, and need not to change first centering adjustment member and second centering adjustment member, has improved production efficiency, has avoided loaded down with trivial details dismouting process.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a wafer centering device.
Background
In the manufacturing process of semiconductor wafers, automated equipment is generally used to perform the process, for example, in some situations where wafers need to be transferred, a robot is used to transfer the wafers.
For example, during the whole wafer cleaning process, the robot may be used to grab the wafer and transfer the wafer. During wafer transfer, the position coordinates of the wafer are critical. If the position of the wafer deviates, the robot may not be able to take and place the wafer, and even the wafer or the robot may be damaged.
Thus requiring the positioning of the wafer. However, in the prior art, the function of the equipment for positioning the wafer is often single, the wafer with fixed specification can only be positioned generally, the parts of the positioning equipment participating in positioning the wafer are usually set to be detachable, the parts participating in positioning the wafer with different models are replaced to adapt to the wafers with different specifications, the dismounting process is complicated, and the production efficiency is reduced.
Disclosure of Invention
The application aims to provide a wafer centering device for efficiently positioning wafers of various specifications.
The application provides a wafer centering device, wafer centering device includes:
a first centering adjustment member and a second centering adjustment member arranged at intervals along a predetermined direction;
adjustment portions formed in the first centering adjustment member and the second centering adjustment member, respectively;
the adjusting parts included in the first centering adjusting member and the adjusting parts included in the second centering adjusting member correspond to each other respectively to form an adjusting group;
the n adjusting groups respectively correspond to n specification wafers to be positioned, wherein n is greater than or equal to 2 and is an integer.
Preferably, the adjusting part is formed in a stepped shape.
Preferably, defining a first one of said adjustment groups comprises two first adjustment portions formed in said first centering adjustment member and said second centering adjustment member, respectively, said first adjustment portions comprising:
a first positioning surface for applying a force to the wafer to position the wafer;
a first demarcation surface from which a lower end of the first locating surface terminates.
Preferably, defining an mth one of the adjustment groups includes two mth adjustment portions formed in the first centering adjustment member and the second centering adjustment member, respectively, the mth adjustment portions including:
an m-th positioning surface for applying a force to the wafer to position the wafer, and terminating at an upper end at an m-1 th interface surface;
an mth interface surface terminating at a lower end thereof;
wherein m is greater than 1, m is less than or equal to n, and m is an integer.
Preferably, the first positioning surface and the mth positioning surface are respectively formed as arc surfaces adapted to the wafers respectively corresponding to the first positioning surface and the mth positioning surface.
Preferably, the first centering adjustment member and the second centering adjustment member each have a side forming the adjustment portion defined as a working side;
both ends of at least one of the first positioning surface and the m-th positioning surface in the horizontal direction are respectively ended at two side portions adjacent to the working side in the horizontal direction;
both ends of the boundary surface corresponding to the at least one in the horizontal direction are respectively terminated at both side portions adjacent to the working side in the horizontal direction.
Preferably, the wafer centering device further includes a first driving mechanism, and the first centering adjustment member and the second centering adjustment member are provided to the first driving mechanism and are driven to synchronously approach or move away from each other.
Preferably, the wafer centering device further comprises:
first and second centering stop members spaced apart along the predetermined direction for stopping the first and second centering adjustment members, respectively, and disposed to have n inter-each distances corresponding to n sizes of the wafers.
Preferably, the wafer centering device further comprises:
the second driving mechanism is used for outputting lifting motion;
a mounting member having a first end connected to the second drive mechanism and a second end extendable between the first and second centering adjustment members;
and the adsorption component is arranged at the second end of the mounting component and is used for bearing the wafer.
Preferably, the wafer centering device further comprises a base, and the first driving mechanism and the second driving mechanism are detachably arranged on the base.
The application provides a wafer centering device, n adjustment group correspond n specification wafers of undetermined location respectively, and n is more than or equal to 2, so can carry out high-efficient location to the wafer of multiple specification, and need not to change first centering adjustment member and second centering adjustment member, has improved production efficiency, has avoided loaded down with trivial details dismouting process.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic diagram illustrating an assembly view of a wafer centering apparatus according to an embodiment of the present disclosure;
fig. 2 shows a schematic view of an enlarged view of a part of the structure in fig. 1.
Reference numerals:
1-base station; 2-a first fixing member; 3-centering the cylinder; 4-a first centering adjustment member; 5-a first centering stop member; 6-centering the sucker; 7-a second centering adjustment member; 8-a mounting member; 9-centering cylinder; 10-second fixing element.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
The wafer centering device provided by the embodiment comprises a base station, a first fixing piece, a centering air cylinder, a first centering adjusting component, a first centering limiting component, a centering sucker, a second centering adjusting component, an installation component, a centering air cylinder and a second fixing piece. The specific structure, connection relationship and operation principle of the aforementioned components in the present embodiment will be described in detail below with reference to fig. 1 and 2.
Referring first to fig. 1, fig. 1 is a schematic view showing an isometric view of an assembly drawing of a wafer centering device provided in the present embodiment, wherein a base table 1 may be formed in a plate-like structure including an upper surface and a lower surface facing away from each other.
As shown in fig. 1, the upper surface of the base 1 may be formed as a plane and serves as a mounting surface for mounting the first fixing member 2, the centering cylinder 3, the first centering adjustment member 4, the first centering stopper 5, the centering chuck 6, the second centering adjustment member 7, the mounting member 8, the centering cylinder 9 and the second fixing member 10, and the lower surface of the base 1 may be used for mounting the wafer centering apparatus as a whole at a certain position in the process flow. For example, the base 1 may be formed in a rectangular plate shape, and the four corners thereof may be previously formed with through holes so as to fix the base 1 by fasteners. Therefore, the arrangement of the base platform 1 enables the wafer centering device to be modularized, and the rest components can be arranged on the base platform 1 in advance, so that the transfer and the quick installation of the position of the wafer centering device are facilitated, and the time consumed for debugging equipment before the process is implemented is reduced.
Referring to fig. 2 in particular, fig. 2 is a schematic diagram showing an enlarged view of a part of the structure in fig. 1, and in fact, fig. 2 completely shows the structure of the rest of the components except for the base platform 1, so in the above description, the structure and the function of the base platform 1 are described with reference to fig. 1 first, and the structure, the connection relationship and the operation principle of the rest of the components will be described with reference to fig. 2 in the following.
As shown in fig. 2, the centering cylinder 3 is detachably attached to the upper surface of the base 1 via the first fixing member 2. Wherein the first fixing member 2 may be formed as a plate member, the first fixing member 2 may be disposed at the bottom of the centering cylinder 3, and in one example, the first fixing member 2 is disposed at the bottom of the centering cylinder 3 in a detachable connection manner, such as a screw connection manner. Advantageously, the area of the plate member may be larger than the area of the bottom of the centering cylinder 3, so that when the centering cylinder 3 and the first fixing member 2 are viewed perpendicularly to the upper surface of the base platform 1, a portion of the first fixing member 2 will be located outside the centering cylinder 3, and the first fixing member 2 can be detachably (e.g., the aforementioned screw connection) provided on the upper surface of the base platform 1 by using the portion of the first fixing member 2.
Still referring to fig. 2, the structure of the centering cylinder 3 will be further described below. In an embodiment, the centering cylinder 3 may be formed as a bidirectional telescopic cylinder, and specifically, it may include a cylinder body and two piston rods provided to the cylinder body. The two piston rods are capable of extending and retracting relative to the cylinder, and the distal ends of the two piston rods may be close to or remote from each other.
As shown in fig. 2, the above two piston rods are not shown in fig. 2, and for convenience of description, one of the two piston rods is defined as a first piston rod, and the other of the two piston rods is defined as a second piston rod. The first centering adjustment member 4 and the second centering adjustment member 7 are respectively disposed on the first piston rod and the second piston rod, and are used for positioning the wafer located therebetween. Specifically, the first and second centering members 4 and 7 may have the same structure, and the second centering member 7 on the working side is illustrated in fig. 2 as an example and will be described in detail below.
Still referring to fig. 2, the second centering adjustment member 7 may be formed in a generally block-like configuration facing the side of the first centering adjustment member 4, i.e., the side facing a wafer (not shown) positioned between the first centering adjustment member 4 and the second centering adjustment member 7, defined as the working side as mentioned above. In an embodiment, the working side of the second centering adjustment member 7 is formed in a stepped structure, and in particular, the working side may include a plurality of steps for positioning wafers of different specifications, respectively.
In order to clarify the positioning principle of the step portion on the wafer, the structure of the step portion will be described first. In an embodiment, the step portion includes a positioning surface extending in the vertical direction and a boundary surface extending in the horizontal direction. The positioning surface is used for contacting with the side part of the wafer so as to adjust the position of the wafer, and the wafer is positioned in the process. The boundary surface can be understood as the boundary of a step with the remaining steps.
In an embodiment, the boundary surface may be formed in a plane so that the lower end equivalent to the positioning surface is cut off from the positioning surface, which facilitates determination of the height of the positioning surface, thereby facilitating processing of the positioning surface and the boundary surface and improving the accuracy of positioning the positioning surface on the wafer. Further, the positioning surface may be formed as a curved surface to better conform to the side of the wafer to be positioned for positioning thereof. Advantageously, the radius of the positioning surface is set to be the same as the radius of the side of the wafer corresponding to the positioning surface, to improve the accuracy of the positioning.
As shown in fig. 2, according to the above-described features, two steps are shown in fig. 2, wherein the step located above may be used for positioning a wafer with a larger radius, and may be defined as a first step, which includes a positioning surface defined as a first positioning surface, and a boundary surface defined as a second boundary surface. An underlying step may be used to position a smaller radius wafer, which step may be defined as a first step portion that includes a positioning surface defined as a second positioning surface and a dividing surface defined as a second dividing surface.
With further reference to fig. 2, wherein the upper end of the second locating surface terminates at the first dividing surface, the upper end of the first locating surface may terminate at a planar end surface. Therefore, when the height of the wafer is within the height range of the second positioning surface, both sides of the wafer are positioned by the second positioning surface of the first centering adjustment member 4 and the second positioning surface of the second centering adjustment member 7 being synchronously close, respectively. When the height of the wafer is within the height range of the first positioning surface, the two sides of the wafer are positioned by the first positioning surface of the first centering adjustment member 4 and the first positioning surface of the second centering adjustment member 7 synchronously approaching. The height change of the wafer is achieved by the centering chuck 6 and centering cylinder 9 described below, which will be explained in the following description.
Referring further to fig. 2, in the embodiment, the first step portion and the second step portion further have the following differences, which are explained by taking the first positioning surface of the first step portion and the second positioning surface of the second step portion as an example. In an embodiment, the second centering adjustment member 7 comprises four side portions, wherein one side portion faces away from the working side and the other two side portions extend between the working side and the side portion facing away from the working side, and the first positioning surface ends in the horizontal direction respectively end (or almost end) at the other two side portions, compared to the second positioning surface ends in the horizontal direction at a distance from the other two side portions.
Likewise, as shown in fig. 2, so does the first and second interface surfaces. Therefore, if the step structure is formed by removing material, the second step portion can be formed by removing less material compared with the first step portion, which is more beneficial to improving the processing efficiency and reducing the processing time. The first step portion has an advantage in that it has a sufficiently large contact portion with the side portion of the wafer to be positioned, which can improve the stability of the wafer during the positioning process.
On this basis, the wafer centering device further comprises a first centering limiting member 5 and a second centering limiting member, the structure of the first centering limiting member 5 is shown in fig. 1 and fig. 2, the structure of the second centering limiting member can be the same, and the first centering limiting member 5 is taken as an example for explanation.
As shown in fig. 2, the first centering stop member 5 may be provided to the cylinder body of the centering cylinder 3, for example, detachably attached by a fastener. The first pair of middle limiting members 5 are used for limiting the first pair of middle adjusting members 4, namely, the first pair of middle limiting members 5 form a stop, so that the first pair of middle adjusting members 4 are prevented from further moving towards the second pair of middle adjusting members 7 to cause wafer damage. Therefore, the first centering limiting member 5 and the second centering limiting member are arranged at intervals in the moving direction of the first centering adjusting member 4, the distance between the first centering limiting member and the second centering limiting member can be slightly larger than the diameter of the wafer to be positioned, a plurality of internal thread holes can be prefabricated on the cylinder body of the centering cylinder 3 due to the fact that the first centering limiting member and the second centering limiting member are detachable, and the first centering limiting member 5 and the second centering limiting member can have corresponding distances according to the number of specifications of the wafer to be positioned. That is, although not shown in the drawings, the stepped structure included in the two adjustment members may have more stepped portions.
On this basis, the working principle and the connection relationship of the centering suction cup 6, the mounting member 8, the centering cylinder 9 and the second fixing member 10 will be described below with reference to fig. 2. As shown in fig. 2, the centering cylinder 9 is provided on the upper surface of the base 1 via a second fixing member 10, and the second fixing member 10 may be formed of, for example, angle steel, one side plate portion of which is connected to the centering cylinder 9, and the other side plate portion of which is detachably provided on the base 1, for example, by screwing.
In an embodiment, the piston rod of the centering cylinder 9 is arranged to extend and contract in the vertical direction, and the mounting member 8 has a first end extending between the first and second centering adjustment members 4 and 7 and a second end connected to the piston rod of the centering cylinder 9, so that the mounting member 8 can be driven by the centering cylinder 9 to perform a lifting movement. Further, the centering chuck 6 is mounted on the upper end surface of the first end of the mounting member 8, and the upper end surface of the centering chuck 6 may be formed as an adsorption end surface which may be opened with a hole or a groove and communicates with a cavity formed inside the centering chuck 6, the cavity communicates with an external connection hole at a side portion of the centering chuck 6, and the external connection hole may be externally connected with a vacuum pump (not shown in the figure), so that the wafer is adsorbed on the adsorption end surface when the wafer is placed on the adsorption end surface.
Specifically, the centering chuck 6 is first raised to a height corresponding to the wafer of the corresponding specification, which is the height of the step corresponding to the wafer of the corresponding specification. The robot then places the wafer on the centering chuck 6, and the wafer is carried by the centering chuck 6. Further, the first centering adjustment member 4 and the second centering adjustment member 7 are synchronously close to each other to perform a wafer centering positioning action. Then, the centering chuck 6 sucks the wafer to fix the position of the wafer, and then the first centering adjustment member 4 and the second centering adjustment member 7 can be reset, and finally the wafer is taken away by the robot.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all changes that can be made in the details of the description and drawings, or directly/indirectly implemented in other related technical fields, are intended to be embraced therein without departing from the spirit of the present application.
Claims (10)
1. A wafer centering device, comprising:
a first centering adjustment member and a second centering adjustment member arranged at intervals along a predetermined direction;
adjustment portions formed in the first centering adjustment member and the second centering adjustment member, respectively;
the adjusting parts included in the first centering adjusting member and the adjusting parts included in the second centering adjusting member correspond to each other respectively to form an adjusting group;
the n adjusting groups respectively correspond to n specification wafers to be positioned, wherein n is greater than or equal to 2 and is an integer.
2. The wafer centering device of claim 1, wherein the adjusting portion is formed in a stepped shape.
3. The wafer centering apparatus of claim 2, wherein defining a first one of said adjustment groups comprises two first adjustment portions formed in said first centering adjustment member and said second centering adjustment member, respectively, said first adjustment portions comprising:
a first positioning surface for applying a force to the wafer to position the wafer;
a first demarcation surface from which a lower end of the first locating surface terminates.
4. The wafer centering apparatus of claim 3, wherein defining an mth of said adjustment groups comprises two mth adjustment portions formed in said first centering adjustment member and said second centering adjustment member, respectively, said mth adjustment portions comprising:
an m-th positioning surface for applying a force to the wafer to position the wafer, and terminating at an upper end at an m-1 th interface surface;
an mth interface surface terminating at a lower end thereof;
wherein m is greater than 1, m is less than or equal to n, and m is an integer.
5. The wafer centering device of claim 4,
the first positioning surface and the mth positioning surface are respectively formed into arc surfaces which are matched with the wafers respectively corresponding to the first positioning surface and the mth positioning surface.
6. The wafer centering device of claim 4,
the first centering adjustment member and the second centering adjustment member each have a side forming the adjustment portion defined as a working side;
both ends of at least one of the first positioning surface and the m-th positioning surface in the horizontal direction are respectively ended at two side portions adjacent to the working side in the horizontal direction;
both ends of the boundary surface corresponding to the at least one in the horizontal direction are respectively terminated at both side portions adjacent to the working side in the horizontal direction.
7. The wafer centering device of claim 1, further comprising a first driving mechanism, wherein the first centering adjustment member and the second centering adjustment member are disposed on the first driving mechanism and driven to synchronously approach or depart from each other.
8. The wafer centering device of claim 7, further comprising:
first and second centering stop members spaced apart along the predetermined direction for stopping the first and second centering adjustment members, respectively, and disposed to have n inter-each distances corresponding to n sizes of the wafers.
9. The wafer centering device of claim 7, further comprising:
the second driving mechanism is used for outputting lifting motion;
a mounting member having a first end connected to the second drive mechanism and a second end extendable between the first and second centering adjustment members;
and the adsorption component is arranged at the second end of the mounting component and is used for bearing the wafer.
10. The wafer centering device of claim 9, further comprising a base, wherein the first drive mechanism and the second drive mechanism are each detachably disposed on the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110012806.2A CN112635380A (en) | 2021-01-06 | 2021-01-06 | Wafer centering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110012806.2A CN112635380A (en) | 2021-01-06 | 2021-01-06 | Wafer centering device |
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| Publication Number | Publication Date |
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| CN112635380A true CN112635380A (en) | 2021-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110012806.2A Pending CN112635380A (en) | 2021-01-06 | 2021-01-06 | Wafer centering device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114188261A (en) * | 2021-10-20 | 2022-03-15 | 扬州思普尔科技有限公司 | Dustless wafer loading platform |
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| CN201084721Y (en) * | 2007-07-20 | 2008-07-09 | 中芯国际集成电路制造(上海)有限公司 | A wafer positioning mechanism |
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
| US9748128B1 (en) * | 2016-06-01 | 2017-08-29 | Micron Technology, Inc. | Systems and methods for wafer alignment |
| CN210379006U (en) * | 2019-09-16 | 2020-04-21 | 冠礼控制科技（上海）有限公司 | Three-step wafer clamping and positioning mechanism |
| CN212230402U (en) * | 2020-06-29 | 2020-12-25 | 上海福赛特机器人有限公司 | Wafer circumference positioning device |
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2021
- 2021-01-06 CN CN202110012806.2A patent/CN112635380A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201084721Y (en) * | 2007-07-20 | 2008-07-09 | 中芯国际集成电路制造(上海)有限公司 | A wafer positioning mechanism |
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
| US9748128B1 (en) * | 2016-06-01 | 2017-08-29 | Micron Technology, Inc. | Systems and methods for wafer alignment |
| CN210379006U (en) * | 2019-09-16 | 2020-04-21 | 冠礼控制科技（上海）有限公司 | Three-step wafer clamping and positioning mechanism |
| CN212230402U (en) * | 2020-06-29 | 2020-12-25 | 上海福赛特机器人有限公司 | Wafer circumference positioning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114188261A (en) * | 2021-10-20 | 2022-03-15 | 扬州思普尔科技有限公司 | Dustless wafer loading platform |
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