CN109686689B - Wafer loading and unloading device - Google Patents
Wafer loading and unloading device Download PDFInfo
- Publication number
- CN109686689B CN109686689B CN201811533653.0A CN201811533653A CN109686689B CN 109686689 B CN109686689 B CN 109686689B CN 201811533653 A CN201811533653 A CN 201811533653A CN 109686689 B CN109686689 B CN 109686689B
- Authority
- CN
- China
- Prior art keywords
- mounting
- guide block
- driving mechanism
- positioning compensation
- compensation mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductors, in particular to a wafer loading and unloading device. The wafer handling device includes: the device comprises a slide holder, a positioning compensation mechanism, a first driving mechanism and a second driving mechanism; the slide holder is arranged on the positioning compensation mechanism, the first driving mechanism is arranged above the second driving mechanism, the second driving mechanism can drive the positioning compensation mechanism to move towards one end close to or far away from the retaining ring, a plurality of damping pieces are arranged on the positioning compensation mechanism, the damping pieces are used for enabling the positioning compensation mechanism to continuously abut against the outer edge of the retaining ring, the first driving mechanism is connected with the slide holder, and the first driving mechanism can drive the slide holder to be opposite to the positioning compensation mechanism to move up and down. The technical problem that in the prior art, the retaining ring becomes thinner gradually along with the machining process, so that the wafer loading and unloading mechanism needs to be positioned repeatedly and the working efficiency is low is solved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer loading and unloading device.
Background
Chemical Mechanical Polishing (CMP) has many applications in the manufacture of semiconductor integrated circuit chips. Chemical mechanical polishing equipment is developing towards integration, intellectualization and automation. The wafer conveying process of the high-automation chemical mechanical polishing equipment is mainly completed through a manipulator, and a wafer loading and unloading mechanism is needed between the manipulator and a polishing execution station to complete the wafer loading and unloading process.
Because the polishing head retaining ring in the chemical mechanical polishing device body becomes thinner gradually along with the processing process in the chemical mechanical polishing process, the traditional wafer loading and unloading mechanism needs to be repeatedly positioned when contacting with the retaining ring, thereby affecting the working efficiency of the whole device.
Disclosure of Invention
The invention aims to provide a wafer loading and unloading device, which aims to solve the technical problems that in the prior art, a retaining ring becomes thinner gradually along with the processing process, so that the wafer loading and unloading mechanism needs to be positioned repeatedly and the working efficiency is low.
The invention provides a wafer handling device, comprising: the device comprises a slide holder, a positioning compensation mechanism, a first driving mechanism and a second driving mechanism;
the slide holder is arranged on the positioning compensation mechanism, the first driving mechanism is arranged above the second driving mechanism, the second driving mechanism can drive the positioning compensation mechanism to move towards one end close to or far away from the retaining ring, a plurality of damping pieces are arranged on the positioning compensation mechanism, the damping pieces are used for enabling the positioning compensation mechanism to continuously abut against the outer edge of the retaining ring, the first driving mechanism is connected with the slide holder, and the first driving mechanism can drive the slide holder to be opposite to the positioning compensation mechanism to move up and down.
Further, the positioning compensation mechanism comprises a mounting table, a plurality of guide blocks and a plurality of damping pieces;
a plurality of guide block evenly distributed is in the border of mount table, the guide block with be provided with at least one damping piece between the mount table, the one end of damping piece with the guide block is close to the one end of mount table is connected, the other end of damping piece be used for with the surface of mount table is connected.
Further, one end of guide block is provided with the limiting plate, the limiting plate sets up the guide block is kept away from one side at the center of mount table, the other end detachably of guide block sets up on the mount table.
Further, the other end of the guide block is provided with a plurality of first mounting holes and a plurality of second mounting holes, the second mounting holes are arranged between the first mounting holes and the edge of the guide block, one end of the damping piece is arranged in the first mounting holes, and the other end of the damping piece is arranged on the surface of the mounting table;
the surface of the mounting table is provided with a first through hole corresponding to the second mounting hole, the connecting piece penetrates through the surface of the mounting table and is connected with the second mounting hole, and the diameter of the connecting piece is smaller than that of the first through hole.
Further, the mount table is the cross, the guide block is four, four the guide block sets up and is being close to the border of mount table, and with the specific certain interval in border of mount table.
Further, the positioning compensation mechanism further comprises a mounting plate;
it is a plurality of guide block evenly distributed is in the border of mounting panel, it is a plurality of damping piece evenly distributed is in the mounting panel with between the mount table, and every the guide block below all is provided with at least one the damping piece.
Furthermore, the surface of the guide block, which is close to one side of the center of the mounting table, is arc-shaped and is used for being matched with the outer contour of the slide holder, so that the slide holder can move up and down relative to the guide block.
Further, the slide holder comprises a base plate, a bearing part and a plurality of guide rods;
the base plate is used for being arranged among the guide blocks, the bearing part is arranged on the base plate and used for bearing wafers, the guide rods are uniformly distributed on one side, close to the installation table, of the base plate, second through holes corresponding to the guide rods are formed in the installation table, and the guide rods penetrate through the second through holes and are connected to the base plate.
Furthermore, a wafer detection hole is formed in the protrusion.
Further, the positioning compensation mechanism further comprises a mounting frame, the mounting frame is arranged on one side, away from the guide block, of the mounting table, the mounting frame is arranged at the center of the mounting table, and the mounting frame is used for mounting the first driving mechanism.
The invention provides a wafer handling device, comprising: the device comprises a slide holder, a positioning compensation mechanism, a first driving mechanism and a second driving mechanism; the slide holder is arranged on the positioning compensation mechanism, the first driving mechanism is arranged above the second driving mechanism, the second driving mechanism can drive the positioning compensation mechanism to move towards one end close to or far away from the retaining ring, a plurality of damping pieces are arranged on the positioning compensation mechanism, the damping pieces are used for enabling the positioning compensation mechanism to continuously abut against the outer edge of the retaining ring, the first driving mechanism is connected with the slide holder, and the first driving mechanism can drive the slide holder to be opposite to the positioning compensation mechanism to move up and down. Adopt foretell scheme, location compensation mechanism is used for and keeps the ring butt, second actuating mechanism drive location compensation mechanism to predetermined position, when the retaining ring is by continuous wearing and tearing, the damping piece of the last setting of location compensation mechanism can make guide block and retaining ring contact, the rethread first actuating mechanism drive slide holder is accomplished and is taken out or place the wafer from retaining ring is inside, can the attenuate along with the course of working gradually in order to improve to have among the prior art retaining ring, lead to constantly carrying mechanism to wafer loading and unloading to carry out the repeated positioning, the technical problem that work efficiency is low.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of a wafer handling apparatus according to the present invention;
FIG. 2 is a schematic view of a positioning mechanism of a wafer handler according to a first aspect of the present invention;
FIG. 3 is a schematic structural view of a guide block on a positioning mechanism of the wafer handling device according to the present invention;
FIG. 4 is a schematic view of a second view of the positioning mechanism of the wafer handler of the present invention;
FIG. 5 is a schematic structural view of a stage of the wafer handler of the present invention;
FIG. 6 is a schematic structural diagram of a second embodiment of a second view angle of a positioning mechanism of a wafer handler according to the present invention.
Icon: 100-a slide holder; 200-positioning compensation mechanism; 300-a second drive mechanism; 400-a waterproof mechanism; 500-a liquid collection mechanism; 110-a base plate; 120-projection; 130-a central boss; 150-a guide bar; 160-a nozzle; 121-wafer inspection holes; 210-a mounting table; 220-a guide block; 230-a mounting frame; 240-a damping member; 250-a connector; 260-mounting a plate; 221-a limiting plate; 222-a first mounting hole; 223-second mounting hole.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
FIG. 1 is a schematic view of a wafer handling apparatus according to the present invention; FIG. 2 is a schematic view of a positioning mechanism of a wafer handler according to a first aspect of the present invention; FIG. 4 is a second perspective view of the positioning mechanism of the wafer handler of the present invention. As shown in fig. 1, 2 and 4, the present invention provides a wafer handling apparatus, comprising: the slide holder 100, the positioning compensation mechanism 200, the first driving mechanism and the second driving mechanism 300;
the slide holder 100 is arranged on the positioning compensation mechanism 200, the first driving mechanism is arranged above the second driving mechanism 300, the second driving mechanism can drive the positioning compensation mechanism 200 to move towards one end close to or far away from the retaining ring, a plurality of damping pieces 240 are arranged on the positioning compensation mechanism 200, the damping pieces 240 are used for enabling the positioning compensation mechanism 200 to be continuously abutted against the outer edge of the retaining ring, the first driving mechanism is connected with the slide holder 100, and the first driving mechanism can drive the slide holder 100 to move up and down relative to the positioning compensation mechanism 200.
In this embodiment, the positioning compensation mechanism 200 is used to abut against a retaining ring, the second driving mechanism 300 drives the positioning compensation mechanism 200 to a predetermined position, when the retaining ring is continuously worn, the damping member 240 arranged on the positioning compensation mechanism 200 can make the guide block 220 contact with the retaining ring, and then the first driving mechanism drives the wafer stage 100 to complete taking out or placing the wafer from the retaining ring, so as to solve the technical problem that in the prior art, the retaining ring becomes thinner gradually along with the processing process, which leads to continuous repeated positioning of the wafer loading and unloading mechanism, and the working efficiency is low.
On the basis of the above embodiment, further, the positioning compensation mechanism 200 includes a mounting table 210, a plurality of guide blocks 220, and a plurality of damping members 240;
the guide blocks 220 are uniformly distributed at the edge of the mounting table 210, at least one damping piece 240 is arranged between the guide blocks 220 and the mounting table 210, one end of the damping piece 240 is connected with one end, close to the mounting table 210, of the guide block 220, and the other end of the damping piece 240 is used for being connected with the surface of the mounting table 210.
The damping member 240 may be a spring, an elastic pin, or a buffer.
In this embodiment, at least one damping member 240 is disposed at one end of the guide block 220 close to the mounting table 210, the second driving mechanism 300 drives the mounting table 210 to a predetermined height, so that the top end of the guide block 220 abuts against the edge of the retaining ring, at this time, the damping member 240 is compressed by a force, and after the retaining ring is worn, the damping member 240 can push the guide block 220 to move upward by a certain distance, so that the top end of the guide block 220 contacts with the retaining ring, thereby ensuring the normal operation of the whole device.
FIG. 3 is a schematic structural diagram of a guide block on a positioning mechanism of the wafer handling device according to the present invention. As shown in fig. 3, on the basis of the above embodiment, further, one end of the guide block 220 is provided with a limit plate 221, the limit plate 221 is arranged on one side of the guide block 220 away from the center of the mounting table 210, and the other end of the guide block 220 is detachably arranged on the mounting table 210.
Further, the other end of the guide block 220 is provided with a plurality of first mounting holes 222 and a plurality of second mounting holes 223, the second mounting holes 223 are disposed between the first mounting holes 222 and the edge of the guide block 220, one end of the damping member 240 is disposed in the first mounting holes 222, and the other end of the damping member 240 is disposed on the surface of the mounting table 210;
the surface of the mounting table 210 is provided with a first through hole corresponding to the second mounting hole 223, the connecting member 250 passes through the surface of the mounting table 210 to be connected with the second mounting hole 223, and the diameter of the connecting member 250 is smaller than that of the first through hole.
One side of the guide block 220 close to the center of the mounting table 210 may be a plane or an arc.
Wherein the number of the first mounting holes 222 and the second mounting holes 223 is the same, preferably, two first mounting holes 222 and two second mounting holes 223 are provided on each guide block 220.
In this embodiment, the setting of limiting plate 221 can make guide block 220 when contacting with the retainer ring, the retainer ring can be whole by the centre gripping of guide block 220, first mounting hole 222 is used for installing damping piece 240, connecting piece 250 passes the first through-hole that sets up on mount table 210 and is connected with second mounting hole 223, thereby ensure guide block 220 in vertical direction's stability, because the diameter of connecting piece 250 is less than the diameter of first through-hole, can make guide block 220 have certain swing in horizontal direction like this, can be better with the contact of retainer ring, improve the precision of location.
On the basis of the above embodiment, further, the mounting table 210 is cross-shaped, the number of the guide blocks 220 is four, and the four guide blocks 220 are arranged at the edge close to the mounting table 210 and at a specific certain distance from the edge of the mounting table 210.
Wherein, the distance between the guide block 220 and the edge of the mounting table 210 may be 20 mm.
In this embodiment, the guide block 220 is set to four, four guides are matched with the installation table 210 in a cross shape, and the guide block 220 and the edge of the installation table 210 have a certain distance, so that the guide block 220 is suitable for a continuously changing retaining ring, and the positioning accuracy of the device is higher.
FIG. 6 is a schematic structural diagram of a second embodiment of a second view angle of a positioning mechanism of a wafer handler according to the present invention. As shown in fig. 6, on the basis of the above embodiment, further, the positioning compensation mechanism further includes a mounting plate 260;
it is a plurality of the guide block evenly distributed is in the border of mounting panel 260, it is a plurality of damping piece evenly distributed is in mounting panel 260 with between the mount table, and every the guide block 220 below all is provided with at least one damping piece 240.
In this embodiment, the guide blocks are disposed on the mounting plate 260, the mounting plate 260 is connected to the mounting platform 210, and at least one damping member 240 is correspondingly disposed below each guide block 220, so that the guide blocks still have a compensation function, and thus the guide blocks can be mounted on the mounting plate 260 first, and then the mounting plate 260 is mounted on the mounting platform.
On the basis of the above embodiment, further, a surface of the guide block 220 on a side close to the center of the mounting table 210 is arc-shaped and is used for matching with an outer contour of the slide holder, so that the slide holder can move up and down relative to the guide block 220.
In this embodiment, one side of the guide block 220 near the center of the mounting table 210 is arc-shaped so as to be matched with the slide holder 100, so that the slide holder can move up and down relative to the guide block, and the friction between the slide holder and the guide block is reduced.
FIG. 5 is a schematic structural diagram of a stage of the wafer handler of the present invention. As shown in fig. 5, on the basis of the above embodiment, further, the stage 100 includes a base plate 110, a carrying portion and a plurality of guide rods 150;
the base plate 110 is arranged among the plurality of guide blocks 220, the bearing part is arranged on the base plate 110 and used for bearing wafers, the plurality of guide rods 150 are uniformly distributed on one side, close to the installation table, of the base plate 110, second through holes corresponding to the guide rods are formed in the installation table, and the guide rods penetrate through the second through holes and are connected to the base plate.
The bearing part comprises a plurality of protrusions 120 and a central boss 130, the central boss 130 is arranged at the center of the base plate 110, the protrusions 120 are uniformly distributed at the edge of the base plate 110, the protrusions 120 are used for contacting with a wafer, and one end of each protrusion 120, which is far away from the central boss 130, abuts against the guide block 220;
wherein, the height of the central boss 130 is 2-3mm less than that of the protrusion 120, and the upper surface of the central boss 130 can be arc-shaped, plane or spherical.
The number of the protrusions 120 is four, and the shape of the base plate 110 is the same as that of the mounting table 210.
In this embodiment, the protrusion 120 is used to abut against the wafer to support the wafer on the stage 100, the central boss 130 is configured to correct possible deflection deformation of the wafer itself, the base plate 110 is driven to move up and down by the first driving mechanism to mount or dismount the wafer, and the guide rod 150 passes through the second through hole provided on the stage 210 to connect with the base plate 110, so as to ensure the stability of the stage 210 during movement.
On the basis of the above embodiment, further, the protrusion 120 is provided with a wafer detection hole 121.
In this embodiment, the detection hole may be communicated with a fluid line having a positive pressure or a fluid line having a negative pressure, and the wafer on the protrusion 120 is detected by a change in pressure.
On the basis of the above embodiment, further, the positioning compensation mechanism 200 further includes a mounting bracket 230, the mounting bracket 230 is disposed on a side of the mounting table 210 away from the guide block 220, the mounting bracket 230 is disposed in the center of the mounting table 210, and the mounting bracket 230 is used for mounting the first driving mechanism.
Further, the stage 100 further includes a plurality of nozzles 160, the plurality of nozzles 160 are uniformly distributed on the base plate 110, and a plurality of through holes matched with the nozzles 160 are formed on the mounting table 210, so that a pipeline communicated with the nozzles 160 is communicated with the nozzles 160 through the through holes.
In this embodiment, the nozzle 160 may eject a fluid or a gas-liquid mixture at an angle or shape to clean the load-lock surface inside the retaining ring to ensure wafer cleanliness.
On the basis of the above embodiment, further, the device further comprises a waterproof mechanism 400 and a liquid collecting mechanism 500;
one end of the waterproof mechanism 400 is connected with the bottom end of the positioning compensation mechanism 200, the other end of the waterproof mechanism 400 is connected with the liquid collection mechanism 500, and the second driving mechanism 300 is arranged at the lower end of the liquid driving mechanism.
In this embodiment, the waterproof mechanism 400 is provided to ensure that the second driving mechanism 300 is not damaged, and the liquid collecting mechanism 500 can collect the used liquid, thereby reducing the probability of harm generation during the operation of the whole device.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A wafer handling device, comprising: the device comprises a slide holder, a positioning compensation mechanism, a first driving mechanism and a second driving mechanism;
the slide holder is arranged on the positioning compensation mechanism, the first driving mechanism is arranged above the second driving mechanism, the second driving mechanism can drive the positioning compensation mechanism to move towards one end close to or far away from the retaining ring, a plurality of damping pieces are arranged on the positioning compensation mechanism, the damping pieces are used for enabling the positioning compensation mechanism to be continuously abutted against the outer edge of the retaining ring, the first driving mechanism is connected with the slide holder, and the first driving mechanism can drive the slide holder to move up and down relative to the positioning compensation mechanism;
the positioning compensation mechanism comprises a mounting table, a plurality of guide blocks and a plurality of damping pieces;
a plurality of guide block evenly distributed is in the border of mount table, the guide block with be provided with at least one damping piece between the mount table, the one end of damping piece with the guide block is close to the one end of mount table is connected, the other end of damping piece be used for with the surface of mount table is connected.
2. The wafer handling device of claim 1, wherein one end of the guide block is provided with a position-limiting plate, the position-limiting plate is disposed on a side of the guide block away from the center of the mounting stage, and the other end of the guide block is detachably disposed on the mounting stage.
3. The wafer handling device of claim 2, wherein the other end of the guide block is provided with a plurality of first mounting holes and a plurality of second mounting holes, the second mounting holes being provided between the first mounting holes and the edge of the guide block, one end of the damping member being provided in the first mounting holes, the other end of the damping member being provided on the surface of the mounting table;
the surface of the mounting table is provided with a first through hole corresponding to the second mounting hole, the connecting piece penetrates through the surface of the mounting table and is connected with the second mounting hole, and the diameter of the connecting piece is smaller than that of the first through hole.
4. The wafer handling device of claim 3, wherein the mounting stage is cross-shaped, the number of the guide blocks is four, and four of the guide blocks are disposed near and spaced apart from an edge of the mounting stage.
5. The wafer handling device of claim 4, wherein the positioning compensation mechanism further comprises a mounting plate;
it is a plurality of guide block evenly distributed is in the border of mounting panel, it is a plurality of damping piece evenly distributed is in the mounting panel with between the mount table, and every the guide block below all is provided with at least one the damping piece.
6. The wafer handling device of claim 1, wherein a surface of the guide block on a side near a center of the mounting stage is curved to match an outer contour of the stage so that the stage can move up and down relative to the guide block.
7. The wafer handling device of claim 6, wherein the stage comprises a base, a carrier, and a plurality of guide rods;
the base plate is used for being arranged among the guide blocks, the bearing part is arranged on the base plate and used for bearing wafers, the guide rods are uniformly distributed on one side, close to the installation table, of the base plate, second through holes corresponding to the guide rods are formed in the installation table, and the guide rods penetrate through the second through holes and are connected to the base plate.
8. The wafer handling device of claim 7, wherein the stage has wafer inspection holes.
9. The wafer handling device of claim 1, wherein the positioning compensation mechanism further comprises a mounting bracket disposed on a side of the mounting stage away from the guide block, the mounting bracket being disposed at a center of the mounting stage, the mounting bracket being configured to mount the first drive mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533653.0A CN109686689B (en) | 2018-12-14 | 2018-12-14 | Wafer loading and unloading device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533653.0A CN109686689B (en) | 2018-12-14 | 2018-12-14 | Wafer loading and unloading device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109686689A CN109686689A (en) | 2019-04-26 |
| CN109686689B true CN109686689B (en) | 2020-09-29 |
Family
ID=66187735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811533653.0A Active CN109686689B (en) | 2018-12-14 | 2018-12-14 | Wafer loading and unloading device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109686689B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805416B (en) * | 2020-05-25 | 2022-03-22 | 北京烁科精微电子装备有限公司 | Bearing platform with wafer positioning function |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883973A (en) * | 2010-03-11 | 2013-01-16 | 恩特格林斯公司 | Thin wafer shipper |
| CN106684025A (en) * | 2016-12-23 | 2017-05-17 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer positioning device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PT1925577E (en) * | 2006-11-24 | 2009-10-12 | Jonas & Redmann Automationstec | Method for forming a back-to-back wafer batch to be positioned in a process boat and handling system for forming the back-to-back wafer batch |
| CN101704218A (en) * | 2009-12-14 | 2010-05-12 | 中国电子科技集团公司第四十五研究所 | Silicon slice positioning and loading device of chemical mechanical polishing equipment |
| CN102371535B (en) * | 2010-08-11 | 2014-07-23 | 中国电子科技集团公司第四十五研究所 | Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment |
| CN102049730B (en) * | 2010-12-29 | 2012-02-15 | 清华大学 | Wafer replacing device used in chemical mechanical polishing equipment |
| CN102270597B (en) * | 2011-08-16 | 2014-04-09 | 清华大学 | Wafer switching equipment and wafer bracket assembly applied to same |
| US10317460B2 (en) * | 2013-06-07 | 2019-06-11 | Maxim Integrated Products, Inc. | Precision alignment unit for semiconductor trays |
| CN108389821A (en) * | 2018-05-04 | 2018-08-10 | 成都华聚科技有限公司 | A kind of wafer individually picks and places and precise positioning mechanism with MASK |
-
2018
- 2018-12-14 CN CN201811533653.0A patent/CN109686689B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883973A (en) * | 2010-03-11 | 2013-01-16 | 恩特格林斯公司 | Thin wafer shipper |
| CN106684025A (en) * | 2016-12-23 | 2017-05-17 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer positioning device |
Non-Patent Citations (1)
| Title |
|---|
| 可控式弹性卸料装置;张弘武;《模具工业》;19830625(第06期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109686689A (en) | 2019-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6517130B1 (en) | Self positioning vacuum chuck | |
| US4529353A (en) | Wafer handling apparatus and method | |
| KR20110106813A (en) | Workpiece transport method and workpiece transport apparatus | |
| US6805616B2 (en) | Wafer planarization apparatus and planarization method thereof | |
| KR102512399B1 (en) | Substrate holding device | |
| CN109686689B (en) | Wafer loading and unloading device | |
| KR100364946B1 (en) | Ic test system for testing bga packages | |
| CN109686696A (en) | A kind of chuck assembly | |
| CN112975792A (en) | High-precision alignment follow-up self-adaptive floating suction head | |
| CN214670086U (en) | Flexible adsorption assembly, silicon wafer handing-over mechanism and silicon wafer handing-over device | |
| CN215973905U (en) | Adsorption device and chip detection equipment | |
| KR20070097820A (en) | Robot for transferring wafer | |
| CN217822727U (en) | Wafer manipulator | |
| CN208629471U (en) | A kind of floating locating module | |
| US11037809B2 (en) | Transfer device and method for transferring substrate without unexpected rotation | |
| CN109664188B (en) | Wafer loading and unloading device | |
| CN112635380A (en) | Wafer centering device | |
| CN219633654U (en) | Wafer clamp disassembling workbench | |
| CN117558668B (en) | Double fork type mechanical arm for conveying wafers and conveying device | |
| KR20200142454A (en) | Robot hand | |
| CN110936290A (en) | Automatic glass positioning system and positioning method thereof | |
| CN116895596B (en) | Wafer transfer robot sucking disc finger and wafer processing equipment | |
| KR20240027548A (en) | Processing apparatus | |
| CN219998191U (en) | Flip chip suction nozzle device for reducing damage rate | |
| CN117747516B (en) | Wafer feeding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230410 Address after: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi Precision Technology Co.,Ltd. Address before: 100176 No.1, Taihe Third Street, Beijing Economic and Technological Development Zone, Beijing Patentee before: BEIJING SEMICONDUCTOR EQUIPMENT INSTITUTE (THE 45TH Research Institute OF CETC) |
|
| TR01 | Transfer of patent right |