CN109686689A - Wafer device for attaching/detaching - Google Patents
Wafer device for attaching/detaching Download PDFInfo
- Publication number
- CN109686689A CN109686689A CN201811533653.0A CN201811533653A CN109686689A CN 109686689 A CN109686689 A CN 109686689A CN 201811533653 A CN201811533653 A CN 201811533653A CN 109686689 A CN109686689 A CN 109686689A
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- Prior art keywords
- erecting bed
- attaching
- guide pad
- driving mechanism
- slide holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
The present invention relates to technical field of semiconductors, more particularly, to a kind of wafer device for attaching/detaching.Wafer device for attaching/detaching includes: slide holder, positioning compensation mechanism, the first driving mechanism and the second driving mechanism；The slide holder is located in the positioning compensation mechanism, the top of second driving mechanism is arranged in first driving mechanism, second driving mechanism can drive the positioning compensation mechanism to the end motion close to or far from retaining ring, and multiple damping pieces are provided in the positioning compensation mechanism, the damping piece is for making the positioning compensation mechanism continue to abut with the outer edge of the retaining ring, first driving mechanism is connect with the slide holder, and first driving mechanism can drive the relatively described positioning compensation mechanism of the slide holder to move up and down.Retaining ring exists in the prior art as process can be gradually thinning to improve, results in the need for constantly carrying out resetting, ineffective technical problem to wafer load/unload mechanism.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly, to a kind of wafer device for attaching/detaching.
Background technique
In semiconductor integrated circuit chip manufacturing process, CMP process (CMP) has many applications.Chemical machine
Tool polissoir just develops towards integrated, intelligent, automation direction.Wherein, the chemical-mechanical polisher of high automation
Wafer transmission process, it is main to be completed by manipulator, it is executed in manipulator and polishing and needs wafer to load and unload carrier aircraft between station
Structure completes the loading and unloading process of wafer.
Due in executing CMP process, rubbing head retaining ring in chemical-mechanical polisher ontology with
Process can be gradually thinning, in this way, traditional wafer load/unload mechanism needs duplicate to be determined when contacting with retaining ring
Position, to influence the working efficiency of single unit system.
Summary of the invention
The purpose of the present invention is to provide kind of a wafer device for attaching/detaching, retaining ring exists in the prior art with adding to improve
Work process can be gradually thinning, results in the need for constantly carrying out resetting to wafer load/unload mechanism, ineffective technology is asked
Topic.
A kind of wafer device for attaching/detaching provided by the invention, comprising: slide holder, positioning compensation mechanism, the first driving mechanism
With the second driving mechanism；
The slide holder is located in the positioning compensation mechanism, and first driving mechanism is arranged in second driving machine
The top of structure, second driving mechanism can drive the positioning compensation mechanism to one end fortune close to or far from retaining ring
It is dynamic, and multiple damping pieces are provided in the positioning compensation mechanism, the damping piece is for continuing the positioning compensation mechanism
It is abutted with the outer edge of the retaining ring, first driving mechanism is connect with the slide holder, the first driving mechanism energy
The relatively described positioning compensation mechanism of the slide holder is enough driven to move up and down.
Further, the positioning compensation mechanism includes erecting bed, multiple guide pads and multiple damping pieces；
Multiple guide pads are evenly distributed on the edge of the erecting bed, set between the guide pad and the erecting bed
It is equipped at least one damping piece, one end of the damping piece is connect with the guide pad close to one end of the erecting bed, described
The other end of damping piece with the surface of the erecting bed for connecting.
Further, one end of the guide pad is provided with limit plate, and the limit plate setting is separate in the guide pad
The side at the center of the erecting bed, the other end of the guide pad are removably disposed on the erecting bed.
Further, the other end of the guide pad is provided with multiple first mounting holes and multiple second mounting holes, described
Second mounting hole is arranged between first mounting hole and the edge of the guide pad, and one end of the damping piece is arranged in institute
It states in the first mounting hole, the surface of the erecting bed is arranged in the other end of the damping piece；
The surface of the erecting bed is provided with first through hole corresponding with second mounting hole, and connector passes through the peace
The surface of dress platform is connect with second mounting hole, and the diameter of the connector is less than the diameter of the first through hole.
Further, the erecting bed is in cross, and the guide pad is four, and four guide pads are positioned close to
The edge of the erecting bed, and with the specific certain spacing in the edge of the erecting bed.
Further, the positioning compensation mechanism further includes mounting plate；
Multiple guide pads are evenly distributed on the edge of the mounting plate, and multiple damping pieces are evenly distributed on described
Between mounting plate and the erecting bed, and at least one described damping piece is provided with below each guide pad.
Further, the guide pad is arc-shaped close to the surface of erecting bed center side, is used for and the slide glass
Platform outer profile matching so that the slide holder can the relatively described guide pad move up and down.
Further, the slide holder includes basal disc, supporting part and multiple guide rods；
For being arranged between multiple guide pads, the supporting part is arranged on the basal disc basal disc, is used for
With carrying wafer, multiple guide rods are evenly distributed on the basal disc and set on the side of the erecting bed, the erecting bed
It is equipped with the second through-hole corresponding with the guide rod, the guide rod passes through second through-hole and is connected on the basal disc.
Further, wafer detection hole is provided in the protrusion.
Further, the positioning compensation mechanism further includes mounting rack, and the mounting rack setting is separate in the erecting bed
The center of the erecting bed is arranged in the side of the guide pad, the mounting rack, and the mounting rack is for installing described first
Driving mechanism.
A kind of wafer device for attaching/detaching provided by the invention, comprising: slide holder, positioning compensation mechanism, the first driving mechanism
With the second driving mechanism；The slide holder is located in the positioning compensation mechanism, and first driving mechanism setting is described the
The top of two driving mechanisms, second driving mechanism can drive the positioning compensation mechanism to close to or far from retaining ring
One end motion, and multiple damping pieces are provided in the positioning compensation mechanism, the damping piece is for making the positioning compensation machine
Structure continues to abut with the outer edge of the retaining ring, and first driving mechanism is connect with the slide holder, first driving
Mechanism can drive the relatively described positioning compensation mechanism of the slide holder to move up and down.Using above-mentioned scheme, positioning compensation machine
Structure is used for and retaining ring abuts, and the second driving mechanism drives positioning compensation mechanism to scheduled position, when retaining ring is continuous
When abrasion, the damping piece of the setting in positioning compensation mechanism can be such that guide pad contacts with retaining ring, then pass through the first driving machine
Structure drives slide holder to complete that wafer is taken out inside the retaining ring or placed, with improve exist in the prior art retaining ring with
Process can be gradually thinning, results in the need for constantly carrying out resetting, ineffective technology to wafer load/unload mechanism
Problem.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of wafer device for attaching/detaching provided by the invention；
Fig. 2 is the structural schematic diagram at the first visual angle of wafer device for attaching/detaching positioning mechanism provided by the invention；
Fig. 3 is the structural schematic diagram of guide pad on wafer device for attaching/detaching positioning mechanism provided by the invention；
Fig. 4 is the structural schematic diagram at second of visual angle of wafer device for attaching/detaching positioning mechanism provided by the invention；
Fig. 5 is the structural schematic diagram of the slide holder of wafer device for attaching/detaching provided by the invention；
Fig. 6 is the knot of second of embodiment at second of visual angle of wafer device for attaching/detaching positioning mechanism provided by the invention
Structure schematic diagram.
Icon: 100- slide holder；200- positioning compensation mechanism；The second driving mechanism of 300-；400- proof mechanism of water；500- liquid
Body collecting mechanism；110- basal disc；120- protrusion；130- central boss；140- sealing element；150- guide rod；160- nozzle；121- is brilliant
Loop truss hole；210- erecting bed；220- guide pad；230- mounting rack；240- damping piece；250- connector；260- mounting plate；
221- limit plate；The first mounting hole of 222-；The second mounting hole of 223-.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Fig. 1 is the structural schematic diagram of wafer device for attaching/detaching provided by the invention；Fig. 2 is that wafer provided by the invention is on chip
The structural schematic diagram at the first visual angle of handler positioning mechanism；Fig. 4 is wafer device for attaching/detaching positioning mechanism provided by the invention
The structural schematic diagram at second of visual angle.As shown in Fig. 1,2 and 4, a kind of wafer device for attaching/detaching provided by the invention, comprising: carry
Piece platform 100, positioning compensation mechanism 200, the first driving mechanism and the second driving mechanism 300；
The slide holder 100 is located in the positioning compensation mechanism 200, and first driving mechanism is arranged described second
The top of driving mechanism 300, second driving mechanism can drive the positioning compensation mechanism 200 to close to or far from holding
One end motion of ring, and multiple damping pieces 240 are provided in the positioning compensation mechanism 200, the damping piece 240 is for making institute
It states positioning compensation mechanism 200 to continue to abut with the outer edge of the retaining ring, first driving mechanism and the slide holder 100
Connection, first driving mechanism can drive the relatively described positioning compensation mechanism 200 of the slide holder 100 to move up and down.
In the present embodiment, positioning compensation mechanism 200 is used for and retaining ring abuts, and the driving positioning of the second driving mechanism 300 is mended
Mechanism 200 is repaid to scheduled position, when retaining ring is constantly worn, the damping piece of the setting in positioning compensation mechanism 200
240 can be such that guide pad 220 contacts with retaining ring, then by the first driving mechanism drive slide holder 100 complete by wafer from
It takes out or places inside retaining ring, retaining ring exists in the prior art as process can be gradually thinning to improve, cause to need
Resetting, ineffective technical problem constantly are carried out to wafer load/unload mechanism.
On the basis of the above embodiments, further, the positioning compensation mechanism 200 includes erecting bed 210, multiple leads
To block 220 and multiple damping pieces 240；
Multiple guide pads 220 are evenly distributed on the edge of the erecting bed 210, the guide pad 220 and the peace
At least one damping piece 240 is provided between dress platform 210, one end of the damping piece 240 and the guide pad 220 are close to described
One end of erecting bed 210 connects, and the other end of the damping piece 240 with the surface of the erecting bed 210 for connecting.
Wherein, damping piece 240 can be spring, resilient key or buffer.
In the present embodiment, one end of erecting bed 210 is provided at least one damping piece 240 in guide pad 220, second
Driving mechanism 300 drives erecting bed 210 to arrive scheduled height, so that the top of guide pad 220 is abutted with the edge of retaining ring, this
When, 240 stress of damping piece is compressed, and after retaining ring is worn, damping piece 240 can push guide pad 220 to move up one
Fixed distance, so that the top of guide pad 220 is contacted with retaining ring, to ensure the normal operation of single unit system.
Fig. 3 is the structural schematic diagram of guide pad on wafer device for attaching/detaching positioning mechanism provided by the invention.Such as Fig. 3 institute
Show, on the basis of the above embodiments, further, one end of the guide pad 220 is provided with limit plate 221, the limit
The side at center of the guide pad 220 far from the erecting bed 210 is arranged in plate 221, and the other end of the guide pad 220 can
Releasably it is arranged on the erecting bed 210.
Further, the other end of the guide pad 220 is provided with multiple first mounting holes 222 and multiple second mounting holes
223, second mounting hole 223 is arranged between first mounting hole 222 and the edge of the guide pad 220, the resistance
One end of damping member 240 is arranged in first mounting hole 222, and the other end of the damping piece 240 is arranged in the erecting bed
210 surface；
The surface of the erecting bed 210 is provided with first through hole corresponding with second mounting hole 223, connector 250
Surface across the erecting bed 210 is connect with second mounting hole 223, and the diameter of the connector 250 is less than described
The diameter of first through hole.
Wherein, guide pad 220 can be a plane or an arc surface close to 210 center one side of erecting bed.
Wherein, the first mounting hole 222 is identical with the quantity of the second mounting hole 223, it is preferable that sets on each guide pad 220
First mounting hole 222 and two the second mounting holes 223 there are two setting.
In the present embodiment, the setting of limit plate 221 can make guide pad 220 when contacting with retaining ring, and retaining ring can
Whole is directed to the clamping of block 220, and the first mounting hole 222 passes through on erecting bed 210 for installing damping piece 240, connector 250
The first through hole of setting is connect with the second mounting hole 223, to ensure guide pad 220 in the stability of vertical direction, due to even
The diameter of fitting 250 is less than the diameter of first through hole, and guide pad 220 can be made to have certain swing in lateral direction in this way,
It can preferably be contacted with retaining ring, improve the precision of positioning.
On the basis of the above embodiments, further, the erecting bed 210 is in cross, and the guide pad 220 is four
A, four guide pads 220 are positioned close to the edge of the erecting bed 210, and specific with the edge of the erecting bed 210
Certain spacing.
Wherein, the spacing at the edge of guide pad 220 and erecting bed 210 can be 20mm.
In the present embodiment, guide pad 220 is set as four, and four guiding match in criss-cross erecting bed 210, leads
There is certain spacing to the edge of block 220 and erecting bed 210, guide pad 220 can be made to be suitable for continually changing retaining ring,
Keep the positioning accuracy of device higher.
Fig. 6 is the knot of second of embodiment at second of visual angle of wafer device for attaching/detaching positioning mechanism provided by the invention
Structure schematic diagram.As shown in fig. 6, on the basis of the above embodiments, further, the positioning compensation mechanism further includes mounting plate
260；
Multiple guide pads are evenly distributed on the edge of the mounting plate 260, and multiple damping pieces are evenly distributed on
Between the mounting plate 260 and the erecting bed, and at least one described damping is provided with below each guide pad 220
Part 240.
In the present embodiment, guide pad is arranged on mounting plate 260, and mounting plate 260 is connect with erecting bed 210, and every
It corresponds to below a guide pad 220 at least provided with a damping piece 240, guide pad is made still to have balanced function, and this in this way
On the mounting plate 260 that sample guide pad can be first mounted on, then mounting plate 260 is mounted on erecting bed.
On the basis of the above embodiments, further, the guide pad 220 is close to the 210 center side of erecting bed
Surface it is arc-shaped, for being matched with the slide holder outer profile, so that the slide holder can be on the relatively described guide pad 220
Lower movement.
In the present embodiment, guide pad 220 is arc-shaped close to the side at 210 center of erecting bed, in order to match with slide holder 100
It closes, slide holder is enable to move up and down relative to guide pad, reduce the frictional force between slide holder and guide pad.
Fig. 5 is the structural schematic diagram of the slide holder of wafer device for attaching/detaching provided by the invention.As shown in figure 5, above-mentioned
On the basis of embodiment, further, the slide holder 100 includes basal disc 110, supporting part and multiple guide rods 150；
For being arranged between multiple guide pads 220, the supporting part is arranged in the basal disc basal disc 110
On 110, it is used to be evenly distributed on the basal disc 110 close to the one of the erecting bed with carrying wafer, multiple guide rods 150
Side, the second through-hole corresponding with the guide rod is provided on the erecting bed, and the guide rod passes through second through-hole and is connected to
On the basal disc.
Wherein, supporting part includes multiple raised 120 and central boss 130, and central boss 130 is arranged in the basal disc 110
Center, multiple described raised 120 are evenly distributed on 110 edge of basal disc, and described raised 120 are used for and wafer contacts, and
Described raised 120 one end far from the central boss 130 is abutted with the guide pad 220；
Wherein, the height of central boss 130 is less than the height 2-3mm of protrusion 120, and the upper surface of central boss 130 can be
Arc, plane or spherical surface.
Wherein, the quantity of protrusion 120 is four, and the shape of basal disc 110 is identical as the shape of erecting bed 210.
In the present embodiment, protrusion 120 with wafer for abutting, by wafer support on slide holder 100, central boss
130 setting is driven by the first driving mechanism and is moved down on basal disc 110 to correct the issuable deflection deformation of wafer itself
It is dynamic, wafer is installed or removed, guide rod 150 is connect across the second through-hole being arranged on erecting bed 210 with basal disc 110,
To ensure degree of stability of the erecting bed 210 in moving process.
On the basis of the above embodiments, further, wafer detection hole 121 is provided on described raised 120.
In the present embodiment, detection hole can be connected to the fluid circuit for being connected with positive pressure or be connected to the fluid hose for being connected with negative pressure
Whether road, being detected in protrusion 120 by the variation of pressure has wafer.
On the basis of the above embodiments, further, the positioning compensation mechanism 200 further includes mounting rack 230, described
Side of the erecting bed 210 far from the guide pad 220 is arranged in mounting rack 230, and the mounting rack 230 is arranged in the peace
The center of platform 210 is filled, the mounting rack 230 is for installing first driving mechanism.
Further, the slide holder 100 further includes multiple nozzles 160, and multiple nozzles 160 are distributed in described
On basal disc 110, multiple via holes with the nozzle 160 cooperation are set, so that with the nozzle 160 on the erecting bed 210
The pipeline of connection passes through the via hole and is connected to the nozzle 160.
In the present embodiment, nozzle 160 can be protected by fluid or gas-liquid mixture at a certain angle or shape is sprayed to clean
Handling surface inside support ring, to ensure the cleannes of wafer.
It on the basis of the above embodiments, further, further include proof mechanism of water 400 and liquid collecting mechanism 500；
One end of the proof mechanism of water 400 is connect with the bottom end of the positioning compensation mechanism 200, the proof mechanism of water 400
The other end connect with the liquid collecting mechanism 500, the fluid-driving mechanism is arranged in second driving mechanism 300
Lower end.
In the present embodiment, for ensureing that the second driving mechanism 300 will not be damaged, liquid is received for the setting of proof mechanism of water 400
Used liquid can be collected by collecting mechanism 500, the probability that harm when reducing single unit system work generates.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of wafer device for attaching/detaching characterized by comprising slide holder, positioning compensation mechanism, the first driving mechanism and
Two driving mechanisms；
The slide holder is located in the positioning compensation mechanism, and second driving mechanism is arranged in first driving mechanism
Top, second driving mechanism can drive the positioning compensation mechanism to the end motion close to or far from retaining ring, and
Be provided with multiple damping pieces in the positioning compensation mechanism, the damping piece for make the positioning compensation mechanism continue with it is described
The outer edge of retaining ring abuts, and first driving mechanism is connect with the slide holder, and first driving mechanism can drive
The relatively described positioning compensation mechanism of the slide holder moves up and down.
2. wafer device for attaching/detaching according to claim 1, which is characterized in that the positioning compensation mechanism includes installation
Platform, multiple guide pads and multiple damping pieces；
Multiple guide pads are evenly distributed on the edge of the erecting bed, are provided between the guide pad and the erecting bed
At least one damping piece, one end of the damping piece are connect with the guide pad close to one end of the erecting bed, the damping
The other end of part with the surface of the erecting bed for connecting.
3. wafer device for attaching/detaching according to claim 2, which is characterized in that one end of the guide pad is provided with limit
The side at center of the guide pad far from the erecting bed is arranged in plate, the limit plate, and the other end of the guide pad can
Releasably it is arranged on the erecting bed.
4. wafer device for attaching/detaching according to claim 3, which is characterized in that the other end of the guide pad is provided with more
First mounting hole and the guide pad is arranged in a first mounting hole and multiple second mounting holes, second mounting hole
Between edge, one end of the damping piece is arranged in first mounting hole, and the other end of the damping piece is arranged described
The surface of erecting bed；
The surface of the erecting bed is provided with first through hole corresponding with second mounting hole, and connector passes through the erecting bed
Surface connect with second mounting hole, and the diameter of the connector be less than the first through hole diameter.
5. wafer device for attaching/detaching according to claim 4, which is characterized in that the erecting bed is in cross, described to lead
It is four to block, four guide pads are positioned close to the edge of the erecting bed, and specific with the edge of the erecting bed
Certain spacing.
6. wafer device for attaching/detaching according to claim 2, which is characterized in that the positioning compensation mechanism further includes installation
Plate；
Multiple guide pads are evenly distributed on the edge of the mounting plate, and multiple damping pieces are evenly distributed on the installation
Between plate and the erecting bed, and at least one described damping piece is provided with below each guide pad.
7. wafer device for attaching/detaching according to claim 2, which is characterized in that the guide pad is in the erecting bed
The surface of heart side is arc-shaped, for matching with the slide holder outer profile, so that the slide holder being capable of the relatively described guiding
Block moves up and down.
8. wafer device for attaching/detaching according to claim 7, which is characterized in that the slide holder includes basal disc, supporting part
With multiple guide rods；
For being arranged between multiple guide pads, the supporting part is arranged on the basal disc basal disc, for hold
Wafer is carried, multiple guide rods are evenly distributed on the basal disc and are provided on the side of the erecting bed, the erecting bed
The second through-hole corresponding with the guide rod, the guide rod pass through second through-hole and are connected on the basal disc.
9. wafer device for attaching/detaching according to claim 8, which is characterized in that be provided with wafer detection on the slide holder
Hole.
10. wafer device for attaching/detaching according to claim 2, which is characterized in that the positioning compensation mechanism further includes peace
It shelves, side of the erecting bed far from the guide pad is arranged in the mounting rack, and the mounting rack is arranged in the installation
The center of platform, the mounting rack is for installing first driving mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533653.0A CN109686689B (en) | 2018-12-14 | 2018-12-14 | Wafer loading and unloading device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533653.0A CN109686689B (en) | 2018-12-14 | 2018-12-14 | Wafer loading and unloading device |
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| CN109686689A true CN109686689A (en) | 2019-04-26 |
| CN109686689B CN109686689B (en) | 2020-09-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805416A (en) * | 2020-05-25 | 2020-10-23 | 北京烁科精微电子装备有限公司 | Bearing platform with wafer positioning function |
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