CN209298091U - Wafer aligned component and wafer processing process - Google Patents
Wafer aligned component and wafer processing process Download PDFInfo
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- CN209298091U CN209298091U CN201822097058.9U CN201822097058U CN209298091U CN 209298091 U CN209298091 U CN 209298091U CN 201822097058 U CN201822097058 U CN 201822097058U CN 209298091 U CN209298091 U CN 209298091U
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- 238000012545 processing Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000008569 process Effects 0.000 title claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 52
- 230000003213 activating effect Effects 0.000 claims abstract description 8
- 230000001360 synchronised effect Effects 0.000 claims abstract description 7
- 230000009471 action Effects 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 230000008450 motivation Effects 0.000 claims description 3
- 230000003993 interaction Effects 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 7
- 230000004913 activation Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010338 mechanical breakdown Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Robotics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of wafer aligned component and wafer processing process, wafer aligned component is used in wafer processing process using and is configured to correct position of the control chip in the holding position limited by multiple wafer support members, wafer aligned component includes: chip pushing mechanism, it has scheduled operational movement range in the plane of chip, so that chip pushing mechanism is not contacted with chip when the correct position that chip is in holding position, and when chip is not in the correct position in holding position, the interaction of the marginal portion of pushing component and chip, chip to be pushed into the correct position of chip；And pneumatic system, it is constructed and operates as the operational movement for activating chip pushing mechanism and for activating the movement of grasping device, so that the operation of chip pushing mechanism and grasping device is synchronized.The wafer aligned component provides accurate, reliable and simple solution to chip misalignment issues.
Description
Technical field
The utility model provide it is a kind of in manufacturing equipment when processing article article to prospective component.In semiconductor
In industry, the utility model is particularly useful to chip processing during being handled by semiconductor processing tools equipment.
Background technique
In the semiconductor processing tools (for example, manufacture, metering test, etc.) of many types, make semiconductor wafer phase
Positioned internal alignment is very important.This alignment usually requires to define two major parameters: chip oriented and chip
Center displacement.Usually marking on the wafer defines chip oriented with the help of (such as, plane or recess), which is oriented to
Certain crystallographic axis on silicon substrate.
Such as various wafer handlings are described in US 6,038,029, US 6,964,276 and US 6,860,790
Structure, all these patents are all granted to present assignee.For example, the chip for being suitable for being used together with integrated metering tool
Processing system is associated with by the robot of wafer tape to processing system (or mechanical arm, such as vacuum grip device).
Utility model content
There is a need in the art for a kind of novel articles to prospective component.The purpose of this utility model is mainly in semicon industry
In be used for wafer processing procedure, and be therefore described below with reference to this concrete application.However, it should be understood that the utility model
Principle concrete application without being limited thereto, and terms used herein " chip " should be broadly interpreted to cover any article/structure/
Substrate.As described above, wafer processing process is associated with automation executor or robot.Robot picks up chip and will be brilliant
Piece is placed on the various positions in semiconductor processing equipment.In processing equipment chip movement based on an assumption that when chip from
One position is centered chip when being moved to another position.It the position of chip can be due in any module of processing equipment
Movement and change.This possibly even causes wafer breakage and/or chip to misplace.
Therefore, a key factor in semiconductor processes (metering) tool performance is, it is ensured that substrate or chip are described
It is suitably centered before and during executing processing (measurement) step on chip.This is because the deviation center of chip may hinder
Hinder or make it impossible to find plane/recess.In this case, it may be unable to measure (processing) chip or chip completely
Dislocation causes frequent recess searching to retry, this is the process wasted time.Metering system multiple predefined surveys on the wafer
Amount executes measurement on position.This is needed in these positions in system " navigation " to measured chip, and in chip deviation
The heart (even if finding plane/recess) may interfere with navigation procedure, this causes navigation to need more time (due to retrying), Huo Zhe
In certain situations, even more so that navigation is impossible.
The novel wafer aligned component of the utility model is a kind of driving component, is pure mechanical mechanism and makes
Recess error and chip oriented error can be reduced.These errors usually by processing equipment by robot in chip
The inaccurate position that chip is generated on the support component of processing system is performed chip movement and causes.Moreover, the utility model
Active wafer alignment mechanical mechanism improve chip placement repeatability.
A wider aspect according to the present utility model, provides a kind of wafer aligned component, the wafer aligned component
For in wafer processing process using and be configured to control chip in the holding position limited by multiple wafer support members
Chip is maintained at its outer surface before chip is transferred on grasping device by the correct position in setting, the wafer support member
Place.Wafer aligned component includes: chip pushing mechanism, which has scheduled operation fortune in the plane of chip
Dynamic range, so that chip pushing mechanism is not contacted with chip when the correct position that chip is in holding position, and when crystalline substance
When piece is not in the correct position in holding position, the marginal portion of chip pushing mechanism and chip interacts, by chip
It is pushed into its correct position；And pneumatic system, the pneumatic system are constructed and are operated as the behaviour for activating chip pushing mechanism
Make the movement for moving and being used to activate grasping device, so that the operation of chip pushing mechanism and grasping device is synchronized.
Term " wafer processing process " hereinafter will refer to be suitable for the processing system used in metering/measuring system
System.The novel active wafer of the utility model is mountable to prospective component any commercially available in the market (for example, being integrated into)
On integrated metering tool, such as NovaScan 3090, NovaScan 3090Next, Nova i500, Nova i500Plus
(can be bought on the market from the Nowe measurement equipment limited liability company of Israel).
In some embodiments, chip pushing mechanism includes bar, the bar be configured to around horizontal pivot axis line from
Rear position is pivotally moved to front position and vice versa.Bar can have front, be configured to have bending appearance before this
Face so that when chip is not in the correct position in holding position, the crooked outer surface of bar during pivoting action with chip
Marginal portion interaction, chip is pushed into its correct position.
In some embodiments, when chip is in the correct position in holding position, bar can be " freely " from its rear
Position is pivotally moved to front position, and does not interact with the edge of chip.
In some embodiments, chip pushing mechanism is configured to be mounted on metering system, wherein front position is being protected
It holds at the plane of position.
In some embodiments, pneumatic system is connected to bar, and the pneumatic system is configured to make bar selectively
Its front position is pivotally moved to from its rear position and vice versa.Drive module can also be configured to for operating grasping
Device.
In some embodiments, wafer aligned component includes sensor, which is configured to monitoring wafer and pushes away
The operational movement of motivation structure.Wafer aligned component may include control unit, which is connected to sensor and is configured to
For receiving the signal for indicating the operational movement of chip pushing mechanism from sensor.Control unit may be structured to for monitor by
Period that the operational movement range of chip pushing mechanism limits and/or from its rear position to its front position and on the contrary by bar
The period that displacement also limits.Control unit may be structured to for stopping grasping device when the period being more than a threshold value
Operation.
Another wider aspect according to the present utility model, provides a kind of wafer processing process, the wafer processing process
It include: multiple wafer support members, wafer support member is configured to for chip to be maintained at its outer surface, to limit
Holding position before chip is transferred on grasping device；Grasping device, the grasping device are used to keep brilliant during chip processing
Piece；And wafer aligned component, the wafer aligned component are constructed and operate the correct position for control chip in holding position
It sets；Wherein, wafer aligned component includes: chip pushing mechanism, which has scheduled in the plane of chip
Operational movement range, so that chip pushing mechanism is not contacted with chip when chip is in the correct position in holding position, and
And when chip is not in the correct position in holding position, the marginal portion of chip pushing mechanism and chip interacts, with
Chip is pushed into its correct position；And pneumatic system, the pneumatic system are constructed and operate to push machine for activating chip
The operational movement of structure and the movement for being used to activate grasping device, so that the operation of chip pushing mechanism and grasping device is synchronized.
Chip pushing mechanism can be constructed as described above.
In some embodiments, wafer processing process includes sensor, which is configured to monitoring wafer and pushes away
The operational movement of motivation structure.
In some embodiments, wafer processing process includes control unit, which is connected to sensor and quilt
It is configured to receive the signal for indicating the operational movement of chip pushing mechanism from sensor.Control unit may be structured to be used for
Period that monitoring is limited by the range of the operational movement of chip pushing mechanism and/or by bar from its rear position to position in front of it
It sets and what vice versa is displaced the period limited.Control unit may be structured to stop grabbing when the period is more than a threshold value
The operation of holder.
Another wider aspect according to the present utility model provides a kind of for making chip center in chip processing system
Method in system, this method comprises: chip pushing mechanism is activated with the predetermined operation motion range in the plane of chip, so that
When chip is in the correct position in holding position, chip pushing mechanism is not contacted with chip, and when chip is not in guarantor
When holding the correct position in position, the marginal portion of pushing component and chip pushing component interacts so that chip is being pushed into it just
True position；And keep the operation of pushing component synchronous with the movement of grasping device.
The wafer aligned component provides accurate, reliable and simple solution to chip misalignment issues.
Detailed description of the invention
Subject matter disclosed herein in order to better understand, and how to be executed in practice to illustrate it, now
Non-limiting example will only be passed through with reference to attached drawing and describe embodiment, in the accompanying drawings:
Figure 1A is shown suitable for the general construction of the wafer processing process used in metering/measuring system and operation；
Figure 1B to Fig. 1 C is (Figure 1B) and (Fig. 1 C) the utility model when chip dislocation when chip is in exact position
Wafer aligned component simplified schematic side view；
Fig. 1 D is the simplified schematic side view of the bar of the wafer aligned component of some embodiments according to the present utility model；
Fig. 2A to Fig. 2 B is to be equipped with the utility model when chip is respectively at inaccurate position and exact position
The top view of the chip processing unit (system) of chip processing (measurement) system of wafer aligned component；
Fig. 3 A to Fig. 3 D shows the different view in part of the wafer aligned component of the utility model；Particularly, Fig. 3 A
Show the rearview of wafer aligned component；Fig. 3 B to Fig. 3 C shows its side view；Fig. 3 D shows the back portion of bar
Enlarged side view；
Fig. 4 A is the simplified schematic side view of the wafer aligned component of some embodiments according to the present utility model；And
Fig. 4 B is the exploded view of the example for the pipeline being routed between drive module and the air supply device of grasping device.
Specific embodiment
Figure 1A, which is schematically shown, to be suitable for used in metering/measuring system (for example, integrated metering system)
The general construction and operation of chip processing unit (system) or processor 10.Wafer processing process 10 is configured to and authorizes this Shen
System described in above-mentioned U.S. Patent No. 6,964,276 of assignee please is substantially similar.
Wafer processing process 10 includes the grasping device 12 (such as vacuum grip device) for keeping chip.Grasping device 12 is rotatable
(as indicating arrow 15), and can be moved along vertical axis 17.For this purpose, grasping device 12 is mountable in Linear actuator
On with along vertical axis 17 translate.System 10 include bottom (under) buffer cell 16, the bottom (under) buffer cell 16 is located at
The top of grasping device 12 and the support component 34 including being used to support wafer W, and system 10 may include top (on) buffer cell
22, the top (on) buffer cell 22 includes wafer support member 24.Wafer support member 34 is preferably fixed, and point
Not She Zhi there are two Different Slope sloping portion 34A and 34B.Also as shown, wafer processing process 10 can be integral type
A part of measurement/metering system 28 comprising the optical window 30 for the chip that optical check or measurement are kept.
As shown in further in figure 1A, wafer processing process 10 according to the present utility model further includes wafer aligned list
Member/component 100.As will be further more specifically described below, it is to pass through that wafer aligned component 100, which is constructed and operates,
Selectively push chip to correct position, to control correct position of the chip in the holding position limited by support component 34
It sets.As shown, wafer aligned component 100 is preferably equidistantly placed on the front of wafer processing process 10 with front supporting member 34
On.
As will be described further below, wafer aligned component 100 is configured to from its initial position (initial position
It is the rear position or retrieving position relative to holding position) being moved to final position, (final position is front position or takes
Out position) so that while being moved to its final position, at its outer rim (marginal portion) and physical wafer contact, and
And if only if chip realizes impetus on chip when being in out of position, and at it initially by robot (mechanical arm)
It is not contacted in the case where bringing correct position into chip.Also as will be described further below, the operation of wafer aligned component
(that is, impetus) is synchronous with the movement of grasping device.
In general, executing the different processing of wafer processing process on the wafer W while handling chip by grasping device 12
Step (for example, measurement).Usually wafer W is taken to wafer processing process 10 via robot (mechanical arm-is not shown), band is on earth
Portion's support component 34.Wafer W is placed in bottom support member 34 by the control of wafer processing process 10.Grasping device 12 moves up,
And wafer W is obtained from bottom support member 34.Further, wafer W is measured while keeping chip by grasping device 12.?
After completion handles (measurement) step, wafer W is transferred to top braces element 24 by grasping device 12.In order to which wafer W is turned
Top braces element 24 is moved on to, top braces element is displaced outwardly and (is kept away from each other) so that vacuum grip device 12 can make
Wafer W moves up in-between.After this, top braces element 24 moves inward, and grasping device 12 declines, then by chip
W is loaded on top braces element 24.Mechanical arm further will grasp wafer W from top braces element 24 to leave chip processing
System 10.
Grasping device 12 can have hole or paster shape region on its surface towards wafer W, and the hole or paster shape region are worked as
It is adhered to by suction with it at corresponding surface region and when the surface of wafer W contacts.Grasping device 12, which can be, for example to be awarded
Give the vacuum grip device of type described in Israel's number of patent application 160297 of the common assignee of present patent application.Bottom
Support component 34 is preferably fixed, and there are two different inclination (slope) part 34A and 34B (that is, stop part) for tool.
If exact position of the wafer W not in holding position, when wafer aligned component 100 keeps wafer W mobile towards correct position
When, wafer W is slided on sloping portion 34A, until it abuts against more vertical (backstop) part 34B of support component 34 simultaneously
It is centered.Figure 1B to Fig. 1 C shows the schematic letter for being configured to the wafer aligned component 100 of correct position of control chip
Change figure.Wafer aligned component 100 especially further includes chip pushing mechanism 120, is had in the plane of the chip indicated with P pre-
Fixed operational movement range.Chip is supported by multiple wafer support members (34 of Figure 1A), which defines guarantor
It holds position H and chip is maintained at its outer surface.Chip pushing mechanism 120 can be the component of bar type, and may include
It is configured to around horizontal pivot axis line A between rear position B and front position F (as shown in the dotted line position in figure)
The bar of pivoting action.When chip pushing mechanism 120 is not activated, bar is in common rear position B.It is pushed in actuating chip
When mechanism 120, bar move/is pivoted in the front position F of operation, is then discharged back into the rear position B of withdrawal.
Therefore, bar is configured to be pivotally moved to front position from rear position around horizontal pivot axis line, and anti-
?.It is noted that wafer aligned component 100 is configured such that motion range quilt of the bar in horizontal plane (plane of chip)
Limitation.This range can adjust screw by assembly and suitably adjust, as will be described in below in relation to Fig. 3 B to Fig. 3 C.Such as figure
Shown, when chip is in the exact position on the H of holding position, the edge of chip is except the motion range of bar, and therefore bar
It is not contacted when being moved to front position from rear position with wafer W.
As being shown by a solid line in Fig. 1 C, wafer W can be at the out of position in the H of holding position, this is often as
Robot is inaccurate.As described above, robot transferring plates and being loaded on the wafer support member 34 of Figure 1A.Element 34
With slope, and it is desirable that wafer W should pass through the center correct position in gravity " slide-in " holding position H.However, if
Wafer W is placed on inaccurate position by robot, then due to the light weight of wafer W, wafer W may be shelved on this inaccurate position
It sets.In general, this may send out in wafer W not " insertion " holding position H (the square upward displacement in the front side towards system) completely
It is raw.
It should be understood that term " front side " refers to the side for making chip enter processing system by robot.Therefore, in chip
Out of position in, front of the edge of chip from holding position towards system is stretched out, and bar pushes chip so that chip
Towards " inside " movement in " rear " side of system, to suitably center in holding position.More specifically, when operated, pushing away
The bar of dynamic component 120 and the marginal portion of wafer W interact, and wafer W is pushed to be moved into its correct position.Work as chip
When W is moved inward, wafer W abuts against the stop boss or slope 34A of support component 34, and is thus centered.More specifically
Ground, 110 are operated and it are made to be moved to its front position F from its rear position B before bar, so that wafer W is inwardly displaced, such as
Shown in arrow I.In this way, wafer W is pushed and the accurate/correct position in holding position that centers.
The angular movement when size and bar of bar move between rear position and front position is appropriately selected to make
, when chip is not in exact position, before bar 120/front surface 110 (bar 120 is by it towards holding position) to
Interior promotion chip.After the operation of pushing component 120, chip is set to enter correct position, shown in dotted line.
As shown in the example of Figure 1B to Fig. 1 C, 110 is can be plane or substantially planar before bar.Fig. 1 D is shown
110 side view before the bar of another example, wherein face 110 not instead of plane, irregular (such as cam-like
) curved surface.As shown, the geometry of this flexure plane 110 can limit the eccentric part being inclined at an angle,
With the protrusion profile for being configured to inwardly promotion chip.110 irregular (such as cam-like) curved surface before bar
So that chip (for example, semiconductor wafer) inwardly can be shifted smoothly.
Fig. 2A to Fig. 2 B shows the top of chip processing unit (system) or processor 10 with wafer aligned component 100
View.Wafer W is kept at its bottom position and top position by the array of support component (24 in Figure 1A or 34),
Each this array includes multiple support components that chip is maintained to the circumferential area that it is separated.Four are shown in the figure
This top braces element 24.Wafer W is in its bottom position, and the bottom by limiting following hiding holding position supports
Element 34 (not being seen in the figure that) is kept.Wafer aligned component 100 is placed on by preferably before the wafer processing process 10
Bottom support member (that is, region of substantially the same height) limit plane.About this point, it should be noted that this is practical new
The novel wafer aligned component 100 of type can be used together with any existing chip processing (measurement) systems/tools.Especially
Ground, the mountable existing processor Nova i500 in 3090 Next tool of NovaScan of novel wafer aligned component 100
On (can be bought on the market from the Nowe measurement equipment limited liability company of Israel).Novel 100 quilt of wafer aligned component
It is constructed so as to receive the power for operating wafer aligned component 100 from the power input of current processor.Moreover, chip pair
The power consumption of prospective component 100 haves no need to change existing power consumption system and cable.It is noted that the wafer aligned component of the utility model
100 is preferably purely mechanic, is only manufactured by using mechanical organ, provides chip misalignment issues accurate, reliable
And simple solution.
In the example of Fig. 2A, wafer W be on the holding position in the plane of bottom support member (not shown) " no
Accurately " position.Wafer W is illustrated as in its two position before and after the actuating of wafer aligned component 100 in the figure
Set: solid line shows the inaccurate position that chip is in front of the actuating of wafer aligned component 100, and dotted line shows chip
Be brought to the exact position after the actuating of wafer aligned component 100 (towards its movement), wherein before bar 110 with it is brilliant
The edge of piece interacts, and wafer W is pushed into its exact position on holding position.
In Fig. 2 B (it is the amplifier section view of the element in Fig. 2A), wafer W is in (not to be shown by bottom support member
The exact position kept out).Here, the distance between bar and Waffer edge D are greater than bar (in wafer plane) motion range
The upper limit.In this case, bar " freely " pivots, so that (it is operating as the back side from bar 110 before bar
Set and be moved to front position) it is not contacted with the outer surface of wafer W.
With reference to the construction for the wafer aligned component 100 (linkage) that the utility model is illustrated in greater detail and the reality of operation
Fig. 3 A to Fig. 3 C of example.
Fig. 3 A shows the rearview of wafer aligned component 100, which includes being configured to around (level)
Pivot axis A is pivotally moved to the bar 102 of front position F (and vice versa) from rear position B and the bar has front
110.In Fig. 3 A to Fig. 3 C, the rear non-actuated position of bar is illustrated.Pivot axis A passes through the pivot of the middle part of bar
Point.As described above, wafer aligned component 100 is configured such that the motion range of bar is limited and can be conditioned.(in chip
In plane) range of horizontal movement limits by the pivoting action of opposite small angle range.This range can be by providing adjusting machine
Structure (for example, screw) 116 is adjusted, which limits angle (pivot) movement of bar when secured.
Shown in the specific but unrestricted example such as Fig. 3 B, the construction is so as to prospective component 100 and regulating mechanism
116 are coupled to common support frame 113/ is supported by common support frame 113, so that (pivotal point on bar) bar
Pivot axis A is fixed to a part of frame, and regulating mechanism 116 includes the bar 102 being mounted below pivot axis A
The screw of the position on frame in the plane P of pivoting action, so that screw thread adjustment axis is perpendicular to pivot axis.More specifically
Ground, pivot axis A pass through the position at the upper part 113A of frame and the adjustment axis at the low portion 113B of frame.Spiral shell
Nail 116 defines the bottom part of bar along movement of the adjustment axis between its closed position and various opening (screw thread) positions
Motion range, and define the maximum magnitude of the top section of bar in this way, that is, the operation model of pushing component
It encloses.Fig. 3 B also partially illustrates drive module, is usually indicated with 104, be constructed and operate for for activate grasping device and
Bar 102 (movement of driving grasping device and bar).This drive module is preferably implemented as Pneumatic module.
Fig. 3 C shows side view identical with Fig. 3 B, enables to display wafer aligned with translucent frame
The inner body of component 100.Bar can be pivoted around horizontal pivot axis line A, and can be driven by drive module, and the drive module is especially
It further include pneumatic linear actuator 114.In actuating pneumatic cylinder 114, the end portion 112 of bar moves between predetermined position, wherein bar encloses
Its front position is pivotally rotated to from its rear position around axis A.
In some embodiments, wafer aligned component 100 can be activated together with the activation of grasping device 12, so that bar 112
Wafer W will not be damaged during the processing or unloading of wafer W.During the activation of wafer aligned component 100, vacuum grip device 12
It moves up at the certain altitude below wafer W, and is not contacted with wafer W.After the operation of wafer aligned component, very
Empty grasping device 12 is moved up to firmly hold wafer W.Therefore grasping device 12 can be mounted on Linear actuator to be used for
It translates, and can pneumatically be activated along vertical axis 14.In this case, pneumatic linear actuator 114 may be connected to identical pneumatic tube
Line actuating vacuum grasping device 12, so that wafer aligned component 100 is fast whenever pneumatically activating grasping device 12 to move up
It is activated fastly chip to be shifted onto the center of holding position H, and is discharged back into the initial rear position of its bar.Pneumatic linear actuator
The short pulse of the 114 receivable air parallel with the pulse for the air for being intended to move up vacuum grip device 12 or pressure.This
Sample, in the case where mechanical breakdown, the chip being loaded on vacuum grip device will not be damaged.For example, wafer aligned component 100 to
Period (promotion and release time) that is preceding and moving backward is about 100 milliseconds.Wafer aligned component 100 is configured such that
The air consumption of wafer aligned component 100 does not influence grasping device movement.Pneumatic linear actuator can for example from pneumatic logic module, (it be pure
Based on pneumatic module) pulse is obtained, which is converted into any pneumatic input (slowly rise or steeply rise) instantaneous defeated
Out (for example, by using commercially available KLG-121 (brown spool) in the market).
Fig. 3 D shows before bar 110 enlarged side view, with irregular (such as the cam at the top of it before bar
Shape) crooked outer surface.As shown, the geometry of front 110 defines the eccentric part being inclined at an angle, tool
There is the protrusion profile for being configured to inwardly push chip during operation.
With reference to Fig. 4 A, it illustrates the schematic of the wafer aligned component 200 of other embodiments according to the present utility model
Simplification figure.In some embodiments, wafer aligned component 200 may include sensor as described in detail later, control unit, peace
Loading board, indicator or reset button.Sensor 140 is constructed and is operated for the movement for control-rod, and for safety
The detection of bar rear position (movement) can be increased.Preferably, the optical sensor without moving parts can be used and thus increase
Add reliability.
Wafer aligned component 200 may also include sensor 142, which is configured to the grasping device 12 of control figure 1A
Movement.All moving parts and sensor of wafer aligned component 200 may be connected to control unit 130, in control unit suitable
When renewable software with the help of control all movements.Control unit 130 is connected to sensor 140 and 142, and can be by structure
It makes to stop grasping device 12 if bar is shifted and is not yet released in position in its rear after certain period
Operation.
If control unit 130 will stop grasping for example, the period interior bar at about 800 milliseconds is not completely released
The movement of device 12.Wafer aligned component 200 may also include safety indicator 144 (for example, LED) and/or reset button 146, should
Safety indicator 144, which is emitted in the operation of chip pushing mechanism 120, there is the signal of error, and the reset button 146 is for weight
Set the operation of chip pushing mechanism 120.The activation of reset button 146 has reset safety indicator 144 and has reconnected controlled letter
Number.If control unit 130 receives error signal from sensor 140, control unit 130 disconnects sensor 142 and activates peace
Full indicator 144, the safety indicator 144 will for example become red from green.When by resetting control unit error switch come
When re-establishing signal communication, it will make it possible to restore.
Fig. 4 B shows the exploded view (unassembled) of the drive module 104 of some embodiments according to the present utility model.It drives
Dynamic model block 104 is configured to such Pneumatic module comprising can be by any pneumatic input (slowly rise or steeply rise)
It is converted into the pneumatic logic impulse element 106 instantaneously exported and via air line 104A and pneumatic logic impulse element 106
The pneumatic linear actuator of the actuating of fluid communication.In a specific and unrestricted example, the pneumatic linear actuator 114 of actuating can be expense
The EZH-2.5/9-10-B type of Si Tuo (Festo), and pneumatic logic impulse element 106 can be Beckman valve company
The Klg-121 type of (Bechman Valve Co.).In some embodiments, drive module 104 further includes air line
104B is in fluid communication with the pneumatic logic impulse element 106 for the pneumatic structure for being connected to activation vacuum grip device 12.
Claims (21)
1. a kind of wafer aligned component, the wafer aligned component in wafer processing process for using and the chip pair
Prospective component is configured to correct position of the control chip in the holding position limited by multiple wafer support members, the chip
The chip is maintained at the appearance of the wafer support member by support component before the chip is transferred on grasping device
At face, which is characterized in that the wafer aligned component includes:
Chip pushing mechanism, the chip pushing mechanism have scheduled operational movement range in the plane of the chip, make
When the proper chip is in the correct position in the holding position, the chip pushing mechanism does not connect with the chip
Touching, and when the chip is not in the correct position in the holding position, the chip pushing mechanism with it is described
The marginal portion of chip interacts, and the chip is pushed into the correct position of the chip；And
Pneumatic system, the pneumatic system is constructed and operates to be used in combination for the operational movement for activating the chip pushing mechanism
In the movement for activating the grasping device, so that the operation of the chip pushing mechanism and the grasping device is synchronized.
2. wafer aligned component according to claim 1, which is characterized in that the chip pushing mechanism includes bar, described
Bar is configured to be pivotally moved to front position from rear position around horizontal pivot axis line and vice versa.
3. wafer aligned component according to claim 2, which is characterized in that the bar has front, and the front is by structure
It makes as with crooked outer surface, so that when the chip is not in the correct position in the holding position, the bar
The crooked outer surface during the pivoting action with the marginal portion of the chip interact, the chip is pushed away
Enter the correct position of the chip.
4. wafer aligned component according to claim 2 or 3, which is characterized in that when the chip is in the holding position
When the correct position in setting, the bar is freely pivoted to the front position from the rear position of the bar.
5. wafer aligned component according to claim 2 or 3, which is characterized in that the chip pushing mechanism is configured to
It is mounted on metering system, wherein the front position is at the plane of the holding position.
6. wafer aligned component according to claim 2 or 3, which is characterized in that the pneumatic system is connected to described
Bar, and the pneumatic system be configured to make the bar selectively from the rear position of the bar be pivotally displaced to
The front position of the bar.
7. wafer aligned component according to claim 2 or 3, which is characterized in that the wafer aligned component further includes passing
Sensor, the sensor are configured to monitor the operational movement of the chip pushing mechanism.
8. wafer aligned component according to claim 7, which is characterized in that the wafer aligned component further includes that control is single
Member, described control unit is connected to the sensor, and described control unit is configured to connect from the sensor
Receive the signal for indicating the operational movement of the chip pushing mechanism.
9. wafer aligned component according to claim 8, which is characterized in that described control unit is configured to monitor
The period limited by the operational movement range of the chip pushing mechanism.
10. wafer aligned component according to claim 9, which is characterized in that described control unit is configured to supervise
It surveys the front position by the bar from the rear position of the bar to the bar and the displacement that vice versa limits
Period.
11. wafer aligned component according to claim 9 or 10, which is characterized in that described control unit is configured to use
Stop the operation of the grasping device when being more than a threshold value when the period.
12. a kind of wafer processing process, which is characterized in that the wafer processing process includes:
Multiple wafer support members, the wafer support member are configured to for chip to be maintained at the wafer support member
Outer surface, to be limited to the holding position before the chip is transferred on grasping device；
Grasping device, the grasping device are used to keep the chip during chip processing；And
Wafer aligned component, the wafer aligned component are constructed and operate to control the chip in the holding position
Correct position；Wherein, the wafer aligned component includes: chip pushing mechanism, and the chip pushing mechanism is in the chip
There is scheduled operational movement range, so that when the chip is in the correct position in the holding position in plane
When, the chip pushing mechanism is not contacted with the chip, and when the chip be not in it is described in the holding position
When correct position, the marginal portion of the chip pushing mechanism and the chip interacts, will be described in chip push-in
The correct position of chip；And pneumatic system, the pneumatic system are constructed and operate to push away for activating the chip
The operational movement of motivation structure and the movement for being used to activate the grasping device, so that the chip pushing mechanism and the grasping device
Operation be synchronized.
13. wafer processing process according to claim 12, which is characterized in that the chip pushing mechanism includes bar, institute
Bar is stated to be configured to be pivotally moved to front position from rear position and vice versa around horizontal pivot axis line.
14. wafer processing process according to claim 13, which is characterized in that the bar has front, the front quilt
It is configured with crooked outer surface, so that when the chip is not in the correct position in the holding position, it is described
The crooked outer surface of bar interacts during the pivoting action with the marginal portion of the chip, by the chip
It is pushed into the correct position of the chip.
15. wafer processing process described in 3 or 14 according to claim 1, which is characterized in that when the chip is in the holding
When the correct position in position, the bar is freely pivoted to the front position from the rear position of the bar.
16. wafer processing process described in 3 or 14 according to claim 1, which is characterized in that the pneumatic system is connected to institute
Bar is stated, and the pneumatic system is configured to make the bar selectively pivotally to move from the rear position of the bar
Move the front position of the bar.
17. wafer processing process described in 3 or 14 according to claim 1, which is characterized in that the wafer processing process further includes
Sensor, the sensor are configured to monitor the operational movement of the chip pushing mechanism.
18. wafer processing process according to claim 17, which is characterized in that the wafer processing process further includes control
Unit, described control unit is connected to the sensor, and described control unit is configured to from the sensor
Receive the signal for indicating the operational movement of the chip pushing mechanism.
19. wafer processing process according to claim 18, which is characterized in that described control unit is configured to supervise
Survey the period limited by the operational movement range of the chip pushing mechanism.
20. wafer processing process according to claim 19, which is characterized in that described control unit is configured to supervise
It surveys the front position by the bar from the rear position of the bar to the bar and the displacement that vice versa limits
Period.
21. wafer processing process described in 9 or 20 according to claim 1, which is characterized in that described control unit is configured to use
Stop the operation of the grasping device when being more than a threshold value when the period.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL256289A IL256289B (en) | 2017-12-13 | 2017-12-13 | Wafer aligning assembly |
| IL256289 | 2017-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209298091U true CN209298091U (en) | 2019-08-23 |
Family
ID=61274015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822097058.9U Active CN209298091U (en) | 2017-12-13 | 2018-12-13 | Wafer aligned component and wafer processing process |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20190001530U (en) |
| CN (1) | CN209298091U (en) |
| IL (1) | IL256289B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220090946A (en) | 2020-12-23 | 2022-06-30 | 서동수 | Fish detection Bluetooth fishing gear |
| CN113380685B (en) * | 2021-04-22 | 2024-06-21 | 碳芯微电子科技(深圳)有限公司 | Automatic adjustable integrated circuit chip manufacturing equipment |
| CN117153760B (en) * | 2023-11-01 | 2024-04-12 | 迈为技术(珠海)有限公司 | Bonding sheet centering mechanism and bonding sheet centering method |
-
2017
- 2017-12-13 IL IL256289A patent/IL256289B/en active IP Right Grant
-
2018
- 2018-12-13 KR KR2020180005797U patent/KR20190001530U/en not_active Application Discontinuation
- 2018-12-13 CN CN201822097058.9U patent/CN209298091U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190001530U (en) | 2019-06-21 |
| IL256289B (en) | 2019-01-31 |
| IL256289A (en) | 2018-02-01 |
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