CN208674091U - Carrier component and mechanical arm - Google Patents
Carrier component and mechanical arm Download PDFInfo
- Publication number
- CN208674091U CN208674091U CN201821353392.XU CN201821353392U CN208674091U CN 208674091 U CN208674091 U CN 208674091U CN 201821353392 U CN201821353392 U CN 201821353392U CN 208674091 U CN208674091 U CN 208674091U
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- Prior art keywords
- carrier
- wafer
- detector
- carrier component
- mechanical arm
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- 235000008434 ginseng Nutrition 0.000 description 1
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- 238000007689 inspection Methods 0.000 description 1
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a kind of carrier component and a kind of mechanical arm, the carrier component includes: carrier, has front and back, the front of the carrier is for placing wafer；Detection module is set to the back side of the carrier, for detecting the relative position between carrier and wafer susceptor when carrier is moved to above wafer base station.The carrier component is able to detect the relative position of carrier Yu wafer base station, so that the position when mechanical arm with the carrier component can fetch and deliver wafer according to the detection structure of carrier component to carrier automatically is calibrated, improves calibration efficiency.
Description
Technical field
The utility model relates to field of semiconductor devices more particularly to a kind of carrier components and mechanical arm.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.
Wafer is the carrier for producing used in integrated circuits, is most common semiconductor material, is divided into 6 inches, 8 inches of isotactics by its diameter
Lattice have been developed that the wafer of 12 inches even more big specification in recent years in order to meet the needs of semiconductors manufacture.With wafer
The continuous increase of size, the requirement to wafer manufacturing process are also continuously improved.
In wafer manufacturing process, need to usually transmit wafer by mechanical arm, for example, wafer wafer cassette and wafer cassette it
Between transmission, transmission etc. of transmission and wafer of the wafer between wafer cassette and cassette between wafer cassette and reaction chamber
Deng.Mechanical arm includes mechanical arm and the end effector positioned at mechanical arm end, obtains wafer by end effector.
Mechanical arm can carry out obtaining or place wafer after end effector is moved to suitable position by flexible and upper and lower translation.
In order to improve the positional accuracy of wafer transmission, need to calibrate the position of mechanical arm.In vacuum technology
When cavity does transmission arm calibration, need then to open process cavity and transmission cavity pressure release to atmospheric pressure two cavitys it
Between valve, mechanical arm is sent to the position inside cavity manually, is calibrated with truing tool.Then pass through replacement cavity the inside
Component, maintenance makes cavity reach process environments by a series of work later.When this process needs to expend longer
Between, the manpower and consumables cost of cost are larger.
Utility model content
Technical problem to be solved by the utility model is to provide a kind of carrier component and mechanical arms, can be self-service
Calibration mechanical arm fetches and delivers the position of wafer, improves calibration efficiency.
To solve the above-mentioned problems, the utility model provides a kind of carrier component, comprising: carrier has front
And the back side, the front of the carrier is for placing wafer；Detection module is set to the back side of the carrier, holds for working as
When load plate is moved to above wafer base station, the relative position between carrier and wafer susceptor is detected.
Optionally, the detection module includes the first detector, for obtaining mark point and carrier on wafer susceptor
Between relative position, to detect the relative position between carrier and wafer susceptor.
Optionally, the mark point is located at the center of wafer susceptor.
Optionally, the detection module further includes the second detector, the position being located on wafer susceptor for detecting wafer
And the situation of wafer.
Optionally, first detector and the second detector are all set on the central axis of the carrier.
Optionally, first detector includes the first camera, and second detector includes second camera.
Optionally, first camera is standard viewing angle camera, and the second camera is wide-angle camera.
Optionally, first detector and the second detector include light source.
To solve the above problems, specific embodiment of the present utility model also provided a kind of mechanical arm, including above-mentioned
Carrier component；It is connected to the mechanical arm of the carrier component, is moved for controlling the carrier component.
Optionally, further include controller, connect with the detection module, for obtaining the testing number of the detection module
According to, and position when fetching and delivering wafer to the carrier component according to the detection data is calibrated.
The carrier component of the utility model is able to detect the relative position of carrier Yu wafer base station, to have described
The mechanical arm of carrier component can fetch and deliver position when wafer to carrier automatically according to the detection structure of carrier component
It is calibrated, improves calibration efficiency.
Detailed description of the invention
Fig. 1 and Fig. 2 is the structural schematic diagram of the carrier component of one specific embodiment of the utility model；
Fig. 3 is the phase between the carrier component detection wafer base station and carrier of one specific embodiment of the utility model
Schematic diagram when to position；
Fig. 4 is located at opposite on wafer base station for the carrier component detection wafer of one specific embodiment of the utility model
Schematic diagram when position；
Fig. 5 is the part of module structural schematic diagram of the mechanical arm of one specific embodiment of the utility model.
Specific embodiment
The specific embodiment of carrier component provided by the utility model and mechanical arm is done in detail with reference to the accompanying drawing
It describes in detail bright.
Fig. 1 and Fig. 2 are please referred to, is the structural schematic diagram of the carrier component of one specific embodiment of the utility model.Its
Middle Fig. 1 is the front schematic view of carrier component；Fig. 2 is the schematic rear view of carrier component.
The carrier component 100 includes carrier 110 and the detection module 120 for being set to 110 back side of carrier.
The carrier 110 includes positive (Fig. 1 institute presentation surface) and the back side (Fig. 2 institute presentation surface), and the front is for putting
Set wafer.In the specific embodiment, the carrier 110 has the first end boss 111 and the second end boss 112, and described the
One end boss 111 and the second end boss 112 to positive direction protrusion, first end boss 111 and the second end boss 112 it
Between 110 surface of carrier as loading end, for placing wafer.When wafer is placed on the loading end, described first
End boss 111 and the second end boss 112 can limit the position of wafer, avoid wafer from moving during transportation, cause
The problems such as positional shift or landing.In other specific embodiments, the carrier 110 can also have other shapes,
This is not construed as limiting.Also there is gas vent 113, for balancing when wafer is placed on carrier 110 on the carrier 110
The air pressure of wafer upper and lower surface.
The back side of the carrier 110 is provided with detection module 120.In the entrance reaction chamber of carrier 110, first can
The wafer for being moved to the top of wafer base station is fetched and delivered at position, and the back side of carrier 110 is described towards the wafer base station at this time
Detection module 120 is used to detect the relative position between carrier 110 and wafer susceptor.
In the specific embodiment, the detection module 120 includes the first detector 121 and the second detector 122.At it
In his specific embodiment, the detection module 120 can also only include first detector 121 and second detector
Any one in 122.
First detector 121 includes the first camera, for detect the mark point on wafer base station and carrier it
Between relative position, to detect the relative position between carrier 110 and wafer susceptor, judge carrier 110 whether with institute
State wafer base station aligned in position.For the ease of obtaining clear image, first detector 121 further includes a first light source, is used
In when first camera obtains wafer base station surface image, 310 surface of wafer base station is illuminated.In other specific embodiment parties
In formula, first detector 121 can also be other kinds of imaging sensor or optical sensor etc..Due to described
One detector 121 only needs to obtain the position of the mark point on wafer base station, and visual requirement is lower, therefore, the specific embodiment party
In formula, first camera can use standard viewing angle camera, to reduce cost.
Second detector 122 includes second camera, for detect position that wafer is located on wafer susceptor and
The situation of wafer.The second camera needs to obtain the image of whole wafer, therefore, it is necessary to angular field of view it is larger, it is described
Second camera can use wide-angle camera.The carrier 110 can first pass through described second before obtaining wafer
Detector 122 judges whether wafer position is correct, and obtains the state of wafer, the position of carrier 110 easy to adjustment in time.
For the ease of obtaining clear image, second detector 122 further includes a second light source, for obtaining in the second camera
When taking wafer base station surface image, wafer base station surface is illuminated.
For the ease of detection, first detector 121 and the second detector 122 are all set in the length along carrier 110
It spends on the central axis AA' in direction.In the specific embodiment, first detector 121 and the second detector 122 distinguish position
In 133 two sides of gas vent.In other specific embodiments, first detector 121 and the second detector 122 may be used also
To be set to along the central axis BB' of the width direction of carrier 110 or at other suitable positions.
Referring to FIG. 3, carrier 110 carries wafer 10 and is moved to wafer in one specific embodiment of the utility model
When fetching and delivering position, the signal when relative position between wafer base station 310 and carrier 110 is obtained by the first detector 121
Figure.
The specific embodiment provides a kind of mechanical arm, including the carrier component 100 and is connected to described hold
The mechanical arm 320 of load plate component 100.Specifically, the machinery arm 320 is connected to the carrying of the carrier component 100
110 one end of disk.The machinery arm 320 can carry out the operation such as flexible and upper and lower translation, and carrier 110 is moved to suitable position
It sets.
When mechanical arm carries out wafer transmission, mechanical arm 320 controls carrier 110 and wafer is sent into processing chamber housing 300
Afterwards, the wafer for moving carrier 110 to the top of wafer base station 310 first fetches and delivers position, with 310 position alignment of wafer base station it
Afterwards, then by wafer 10 it is transferred to 310 surface of wafer base station.If the position of the position of the carrier 110 and wafer base station 310 it
Between have deviation, will lead to the malposition that wafer 10 is placed on wafer base station 310, influence the progress of subsequent treatment process.
310 surface of wafer base station is provided with mark point 311, the ginseng detected as relative position between carrier 110 and wafer base station 310
Examination point.The mark point 311 can be located at center or the other positions of wafer susceptor 310.
In the specific embodiment, by being set to first detector 121 at 110 back side of carrier, wafer is obtained
Relative position between mark point 311 on pedestal 310 and carrier 110, it is opposite between mark point 311 and carrier 110
Position represents the relative position between wafer base station 310 and carrier 110.In the specific embodiment, pass through the first inspection of setting
The position of device 121 and mark point 311 is surveyed, so that when first detector 121 and 311 aligned in position of mark point, carrying
Disk 110 and the relative position of wafer base station 310 are accurate, and carrier 110 is located at accurate wafer and fetches and delivers on position.It is specific at other
In embodiment, when carrier 110, which is located at accurate wafer, fetches and delivers position, first detector 121 and the mark point
There can also be other relative positional relationships between 311.In the specific embodiment, first detector 121 includes first
Camera, the image of the mark point 311 for obtaining 310 surface of wafer base station, to carry out the detection of relative position.
Referring to FIG. 4, obtaining wafer 10 by the second detector 122 in one specific embodiment of the utility model
Situation in position and wafer 10 on wafer base station 310.It can be and wafer 10 is transferred to wafer base station in carrier 110
After on 310, the position and state of wafer 10 are detected, the crystalline substance on wafer base station 310 can also be obtained in carrier 110
Before circle 10, the position and state of wafer 10 are detected.Second detector 122 includes a wide-angle camera, is used for
The general image of the wafer 10 on wafer base station 310 is obtained, to whether detect position that wafer 10 is located on wafer base station 310
Accurately.Can also observe whether wafer 10 occurs fragmentation, whether surface there are the states such as pollution by second detector 122.
Referring to FIG. 5, the mechanical arm further includes a controller 500, for being connected to the detection module 120.It should
In specific embodiment, the controller 500 is connect with first detector 121 and the second detector 122 respectively, for obtaining
The detection data of first detector 121 and the second detector 122 is taken, and according to the detection data to the carrier group
It is calibrated the position for fetching and delivering wafer of part.Self-service calibration may be implemented in the mechanical arm, without opening chamber, carries out artificial
Calibration, improves calibration efficiency, and saved cost.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of carrier component characterized by comprising
Carrier has front and back, and the front of the carrier is for placing wafer；
Detection module is set to the back side of the carrier, for when carrier is moved to above wafer base station, detection to be carried
Relative position between disk and wafer susceptor.
2. carrier component according to claim 1, which is characterized in that the detection module includes the first detector, is used
In obtaining the mark point on wafer susceptor and the relative position between carrier, to detect between carrier and wafer susceptor
Relative position.
3. carrier component according to claim 2, which is characterized in that the mark point is located at the center of wafer susceptor.
4. carrier component according to claim 2, which is characterized in that the detection module further includes the second detector,
For detecting the situation of position and wafer that wafer is located on wafer susceptor.
5. carrier component according to claim 4, which is characterized in that first detector and the second detector are all provided with
It is placed on the central axis of the carrier.
6. carrier component according to claim 4, which is characterized in that first detector includes the first camera,
Second detector includes second camera.
7. carrier component according to claim 6, which is characterized in that first camera is standard viewing angle camera shooting
Head, the second camera are wide-angle camera.
8. carrier component according to claim 6, which is characterized in that first detector and the second detector wrap
Include light source.
9. a kind of mechanical arm characterized by comprising
Such as carrier component described in any item of the claim 1 to 8；
It is connected to the mechanical arm of the carrier component, is moved for controlling the carrier component.
10. mechanical arm according to claim 9, which is characterized in that further include controller, connect with the detection module
It connects, wafer is fetched and delivered to the carrier component for obtaining the detection data of the detection module, and according to the detection data
When position calibrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821353392.XU CN208674091U (en) | 2018-08-22 | 2018-08-22 | Carrier component and mechanical arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821353392.XU CN208674091U (en) | 2018-08-22 | 2018-08-22 | Carrier component and mechanical arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208674091U true CN208674091U (en) | 2019-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821353392.XU Expired - Fee Related CN208674091U (en) | 2018-08-22 | 2018-08-22 | Carrier component and mechanical arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208674091U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111430289A (en) * | 2020-05-07 | 2020-07-17 | 上海果纳半导体技术有限公司 | Wafer positioning and calibrating device and wafer positioning and calibrating method |
| CN113097116A (en) * | 2021-06-09 | 2021-07-09 | 北京北方华创微电子装备有限公司 | Wafer transfer device and semiconductor processing equipment |
-
2018
- 2018-08-22 CN CN201821353392.XU patent/CN208674091U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111430289A (en) * | 2020-05-07 | 2020-07-17 | 上海果纳半导体技术有限公司 | Wafer positioning and calibrating device and wafer positioning and calibrating method |
| CN113097116A (en) * | 2021-06-09 | 2021-07-09 | 北京北方华创微电子装备有限公司 | Wafer transfer device and semiconductor processing equipment |
| CN113097116B (en) * | 2021-06-09 | 2021-10-15 | 北京北方华创微电子装备有限公司 | Wafer transfer device and semiconductor processing equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190329 |
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| CF01 | Termination of patent right due to non-payment of annual fee |