IL256289B - Wafer aligning assembly - Google Patents

Wafer aligning assembly

Info

Publication number
IL256289B
IL256289B IL256289A IL25628917A IL256289B IL 256289 B IL256289 B IL 256289B IL 256289 A IL256289 A IL 256289A IL 25628917 A IL25628917 A IL 25628917A IL 256289 B IL256289 B IL 256289B
Authority
IL
Israel
Prior art keywords
aligning assembly
wafer aligning
wafer
assembly
aligning
Prior art date
Application number
IL256289A
Other languages
Hebrew (he)
Other versions
IL256289A (en
Original Assignee
Nova Measuring Instr Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nova Measuring Instr Ltd filed Critical Nova Measuring Instr Ltd
Priority to IL256289A priority Critical patent/IL256289B/en
Publication of IL256289A publication Critical patent/IL256289A/en
Priority to CN201822097058.9U priority patent/CN209298091U/en
Priority to KR2020180005797U priority patent/KR200498392Y1/en
Publication of IL256289B publication Critical patent/IL256289B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
IL256289A 2017-12-13 2017-12-13 Wafer aligning assembly IL256289B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IL256289A IL256289B (en) 2017-12-13 2017-12-13 Wafer aligning assembly
CN201822097058.9U CN209298091U (en) 2017-12-13 2018-12-13 Wafer aligned component and wafer processing process
KR2020180005797U KR200498392Y1 (en) 2017-12-13 2018-12-13 Wafer aligning assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL256289A IL256289B (en) 2017-12-13 2017-12-13 Wafer aligning assembly

Publications (2)

Publication Number Publication Date
IL256289A IL256289A (en) 2018-02-01
IL256289B true IL256289B (en) 2019-01-31

Family

ID=61274015

Family Applications (1)

Application Number Title Priority Date Filing Date
IL256289A IL256289B (en) 2017-12-13 2017-12-13 Wafer aligning assembly

Country Status (3)

Country Link
KR (1) KR200498392Y1 (en)
CN (1) CN209298091U (en)
IL (1) IL256289B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220090946A (en) 2020-12-23 2022-06-30 서동수 Fish detection Bluetooth fishing gear
CN113380685B (en) * 2021-04-22 2024-06-21 碳芯微电子科技(深圳)有限公司 Automatic adjustable integrated circuit chip manufacturing equipment
CN117153760B (en) * 2023-11-01 2024-04-12 迈为技术(珠海)有限公司 Bonding sheet centering mechanism and bonding sheet centering method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100234693B1 (en) * 1996-09-21 1999-12-15 김영환 Wafer centering device of stepper apparatus
KR19990018393A (en) * 1997-08-27 1999-03-15 윤종용 Wafer centering device to improve alignment during exposure
KR100506494B1 (en) * 2003-04-17 2005-08-05 주식회사 제일 Centering Apparatus
KR20050066114A (en) * 2003-12-26 2005-06-30 동부아남반도체 주식회사 Device for sensing and aligning the position of a wafer and the method thereof
KR101553709B1 (en) * 2008-11-14 2015-09-17 주성엔지니어링(주) Loadrock chamber for manufacturing semiconductor device and apparatus for manufacturing semiconductor device using the same
US9859141B2 (en) * 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers

Also Published As

Publication number Publication date
IL256289A (en) 2018-02-01
CN209298091U (en) 2019-08-23
KR20190001530U (en) 2019-06-21
KR200498392Y1 (en) 2024-09-30

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Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed