CN115632022A - Wafer transfer vacuum arm - Google Patents
Wafer transfer vacuum arm Download PDFInfo
- Publication number
- CN115632022A CN115632022A CN202211397186.XA CN202211397186A CN115632022A CN 115632022 A CN115632022 A CN 115632022A CN 202211397186 A CN202211397186 A CN 202211397186A CN 115632022 A CN115632022 A CN 115632022A
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- wafer
- vacuum
- arm
- support frame
- wafer transfer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductors, and particularly discloses a wafer transfer vacuum arm which comprises a support frame and a sucker assembly, wherein the support frame is used for bearing a wafer, at least the part of the support frame, which is in contact with the wafer, is of a hollow structure, the support frame is provided with an air inlet and a vacuum port which are communicated with the hollow structure, and the air inlet, the hollow structure and the vacuum port form a vacuum pipeline for vacuumizing; the support frame is located to the sucking disc subassembly, and with vacuum port intercommunication, the wafer can be adsorbed to the output of sucking disc subassembly. This wafer shifts vacuum arm bears the weight of the wafer through setting up the support frame, and handheld this wafer shifts vacuum arm can carry out the transfer of station to the wafer, through set up hollow structure with the position of wafer contact, can avoid the heat of wafer to see through the support frame fast and cause the scald to operating personnel, and hollow structure still participates in vacuum gas's transmission for the sucking disc subassembly can adsorb the wafer, avoids independent vacuum line, has reduced equipment cost.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer transfer vacuum arm.
Background
In the wafer production process, the automatic production is realized by transferring the stations through automatic equipment, but when the transfer equipment breaks down, the wafers cannot be transferred, and the production flow is further influenced.
The existing method is to manually take the wafer and transfer the station, but the manual taking process is easy to touch the surface of the wafer, so that the wafer is polluted. In addition, after the wafer is subjected to high-temperature treatment, the wafer is directly and manually taken, so that the situation of scalding is caused, and when the wafer is cooled to the room temperature, a long time is required, so that the efficiency of automatic production is reduced.
Therefore, there is a need to develop a wafer transfer vacuum arm to solve the problem of scalding caused by manually moving a high-temperature wafer or the problem of low production efficiency caused by transferring after cooling.
Disclosure of Invention
The invention aims to provide a wafer transfer vacuum arm to solve the problems that a high-temperature wafer is burnt due to manual movement, or the wafer is transferred after being cooled so that the production efficiency is low.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a wafer transfer vacuum arm, comprising:
the wafer vacuum forming device comprises a support frame, a vacuum pump and a vacuum pump, wherein the support frame is used for bearing a wafer, at least the part of the support frame, which is in contact with the wafer, is of a hollow structure, the support frame is provided with an air inlet and a vacuum port which are communicated with the hollow structure, and the air inlet, the hollow structure and the vacuum port form a vacuum pipeline for vacuumizing;
the sucking disc subassembly, the sucking disc subassembly is located the support frame, the input of sucking disc subassembly with vacuum port intercommunication, the output of sucking disc subassembly can adsorb the wafer.
Optionally, the sucking disc subassembly includes suction nozzle and crimping piece, the suction nozzle is the column, just the periphery of suction nozzle is equipped with annular step, annular step is less than the export of suction nozzle, crimping piece rigid coupling in the support frame, and the crimping annular step.
Optionally, the crimping part comprises a connecting part and crimping parts arranged at two ends of the connecting part, wherein the two crimping parts extend towards the direction of the suction nozzle and are used for crimping the annular step, and the two crimping parts are symmetrical about the center of the suction nozzle.
Optionally, the crimping portion is provided with an avoiding groove, the groove bottom of the avoiding groove is crimped on the annular step, the support frame and the periphery of the vacuum port are provided with a sinking groove, and the crimping connecting portion is located in the sinking groove.
Optionally, the support frame comprises a support member and a holding member connected with each other; the supporting piece is used for bearing the wafer, is of a hollow structure and is provided with the adsorption hole and the air inlet hole.
Optionally, the supporting piece comprises a transition part, and a first arm and a second arm which are arranged at one end of the transition part, the first arm and the second arm are arranged in parallel and at intervals, the first arm and the second arm are both in a hollow structure, and the first arm and the second arm are both provided with the vacuum holes; the air inlet is arranged at the transition part.
Optionally, the wafer transfer vacuum arm includes at least three limiting members, and the three limiting members are dispersedly disposed on the first arm and the second arm, and are all used for abutting against the periphery of the wafer.
Optionally, the wafer transfer vacuum arm includes at least three supporting members, and the three supporting members are all disposed on the supporting frame and are used for supporting the wafer.
Optionally, the wafer transfer vacuum arm includes a vacuum generator, and the vacuum generator is disposed at an end of the support frame away from the wafer and is used for providing vacuum for adsorbing the wafer.
Optionally, the support frame is provided with a vacuum connector communicated with the air inlet, and an external pipeline is connected between the vacuum connector and external vacuum generation equipment.
The beneficial effects of the invention are as follows:
the invention provides a wafer transfer vacuum arm, which is used for bearing a wafer by arranging a support frame, can transfer stations of the wafer by holding the wafer transfer vacuum arm by hands, can prevent heat of the wafer from quickly penetrating through the support frame to scald operators by arranging a hollow structure at a position in contact with the wafer, can adsorb the wafer by arranging a sucker component, and can prevent the wafer from falling off due to sliding with the support frame in the moving process, wherein the hollow structure also participates in the transmission of vacuum gas, so that an independent vacuum pipeline is avoided, and the equipment cost is reduced.
Drawings
FIG. 1 is a schematic diagram of a wafer transfer vacuum arm according to an embodiment of the present invention;
FIG. 2 is an enlarged partial view of FIG. 1 at A;
FIG. 3 is a schematic top view of a wafer transfer vacuum arm according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a side view of a wafer transfer vacuum arm according to an embodiment of the present invention.
In the figure:
1. a support frame; 11. a support member; 111. a transition portion; 112. a first arm; 113. a second arm; 12. a grip;
2. a sucker component; 21. a suction nozzle; 211. an annular step; 22. a crimping member; 221. a connecting portion; 2211. countersinking; 222. a crimping part; 2221. an avoidance groove;
3. a limiting member;
4. a support member;
5. a vacuum generator.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
As shown in fig. 1-4, the present embodiment provides a wafer transfer vacuum arm, which includes a supporting frame 1 and a suction cup assembly 2, wherein the supporting frame 1 is used for carrying a wafer, at least a portion of the supporting frame 1 contacting the wafer is a hollow structure, the supporting frame 1 is provided with an air inlet and a vacuum port communicating with the hollow structure, and the air inlet, the hollow structure and the vacuum port form a vacuum pipeline for vacuum pumping; the sucking disc subassembly 2 is located support frame 1, and communicates with the vacuum port, and the wafer can be adsorbed to the output of sucking disc subassembly 2.
This wafer shifts vacuum arm bears the weight of the wafer through setting up support frame 1, this wafer shifts vacuum arm is handed and can carry out the transfer of station to the wafer, through setting up hollow structure in the position with the wafer contact, the heat that can avoid the wafer sees through support frame 1 fast and causes the scald to operating personnel, through the setting of sucking disc subassembly 2, can adsorb the wafer, it leads to falling to slide to avoid moving process and support frame 1 to appear, wherein, hollow structure still participates in the transmission of vacuum gas, avoid independent vacuum pipeline, the equipment cost is reduced.
Generally, it is necessary to extend the wafer transfer vacuum arm into the lower portion of the wafer and lift the wafer, so that the wafer transfer vacuum arm with a large thickness interferes with other equipment and cannot enter the lower portion of the wafer, for this reason, in the present embodiment, the chuck assembly 2 includes a suction nozzle 21 and a pressing member 22, the suction nozzle 21 is cylindrical, the periphery of the suction nozzle 21 is provided with an annular step 211, the annular step 211 is lower than the outlet of the suction nozzle 21, and the pressing member 22 is fixedly connected to the support frame 1 and presses the annular step 211. The arrangement of the structure reduces the overall thickness of the sucker assembly 2, and the sucker assembly can conveniently extend into the lower part of a wafer.
In this embodiment, the crimping member 22 includes a semicircular connecting portion 221 and crimping portions 222 provided at both ends of the connecting portion 221, the two crimping portions 222 each extend toward the suction nozzle 21 and crimp the annular step 211, and the two crimping portions 222 are symmetrical with respect to the center of the suction nozzle 21. The structure is simple, and the suction nozzle 21 can be quickly fixed.
Specifically, two ends of the connecting portion 221 are respectively provided with a countersunk hole 2211, and a countersunk screw passes through the countersunk hole 2211 and then is connected with a fixing screw hole of the supporting frame 1. The arrangement of the countersunk hole 2211 prevents the nut portion of the countersunk screw from being higher than the connecting portion 221, and prevents the wafer from being adsorbed and interfered.
The pressing part 222 is provided with an avoiding groove 2221, the bottom of the avoiding groove 2221 is pressed against the annular step 211, the support frame 1 and the periphery of the vacuum port are provided with a sinking groove, and the pressing connection part 221 is located in the sinking groove. Due to the arrangement of the size, on one hand, the thickness of the connecting part 221 can be ensured, so that the counter sink 2211 can be prepared; on the other hand, the thickness of the press-contact part 222 is reduced, which is beneficial to reducing the distance between the annular step 211 and the outlet of the suction nozzle 21, and is further beneficial to reducing the length of the suction nozzle 21, so that the structure of the suction disc assembly 2 is more compact and the cost is low.
The support frame 1 comprises a supporting part 11 and a holding part 12 which are connected; the supporting member 11 is used for supporting the wafer, and the supporting member 11 is a hollow structure and is provided with an adsorption hole and an air inlet hole. With the help of above-mentioned setting be convenient for manually hold, improved the convenience that shifts. The holding part 12 may be a hollow structure and is communicated with the hollow structure of the supporting part 11, and the air inlet hole is formed at one end of the holding part 12 far away from the supporting part 11.
In order to reduce the mass, in this embodiment, the supporting member 11 includes the transition portion 111 and the first arm 112 and the second arm 113 that are arranged at one end of the transition portion 111, the first arm 112 and the second arm 113 are parallel and arranged at intervals, the first arm 112 and the second arm 113 are both hollow structures, the first arm 112 and the second arm 113 are both provided with vacuum holes, and the air inlet hole is arranged in the transition portion 111.
In this embodiment, the wafer transfer vacuum arm includes at least three limiting members 3, and the three limiting members 3 are disposed on the first arm 112 and the second arm 113 in a dispersed manner and are used for abutting against the outer periphery of the wafer. The three limiting parts 3 are made of stainless steel or rubber respectively. The center of the wafer is located in a triangle formed by connecting the three limiting parts 3.
The limiting members 3 are four, two of which are disposed at two ends of the first arm 112 and located at two sides of one of the vacuum holes, and the other two limiting members 3 are disposed at two ends of the second arm 113 and located at two sides of the other vacuum hole.
The wafer transfer vacuum arm comprises at least three supporting pieces 4, the three supporting pieces 4 are arranged on the supporting frame 1 and used for supporting wafers, the surfaces, abutted by the supporting pieces 4 and the wafers, of the supporting faces are supporting faces, and the ratio of the outer diameter size of each wafer to the diameter size of each supporting face is 40:1-100:1. the center of the wafer is located within the triangle formed by the connection of the three supports 4.
The arrangement reduces the supporting area of the supporting piece 4 as much as possible, and reduces the processing difficulty on the premise of ensuring the flatness; on the other hand, the smaller contact surface is contacted, so that the heat transferred to the support frame 1 is reduced; finally, the contact with a small area does not influence the deformation of the wafer in the adsorption process of the sucker component 2, so that the wafer is prevented from being broken, and the final yield of the wafer is improved.
Ideally, after the chuck assembly 2 adsorbs the wafer, the wafer is supported by the three supporting members 4 without any deformation. However, the above accuracy is a theoretical accuracy and is difficult to achieve. To this end, in this embodiment, the distance between each support 4 and the chuck assembly 2 is greater than 50 mm. Because under the certain prerequisite of the amount of deflection of wafer, the distance between support piece 4 and sucking disc subassembly 2 is big more, has been favorable to having improved the size that the wafer can take place to deform more, and then reduces the required precision of difference in height between sucking disc subassembly 2 and the support piece 4, reduces the processing cost.
The support member 4 is provided with three, two arranged on the first arm 112 and the second arm 113, the transition portion 111 is provided with a support arm, and the third is arranged on the support arm. The support arm is hollow structure, further reduces the heat transfer.
Preferably, the first arm 112 and the second arm 113 are both of a flat structure to further improve the ease of insertion under the wafer. However, the first arm 112 and the second arm 113 having the flat structure have a reduced load-bearing capacity and are likely to be bent. Therefore, in the present embodiment, the first arm 112 and the second arm 113 having a hollow structure are provided with ribs. Taking the first arm 112 as an example, the stiffener is in a sheet shape, extends along the extending direction of the first arm 112, and is perpendicular to the suction surface of the suction nozzle 21 on the first arm 112, i.e. perpendicular to the end surface of the wafer. In order not to influence the air flow in the hollow structure, the reinforcing ribs are partially provided with transverse holes so that the air can freely flow in the whole hollow structure.
The wafer transfer vacuum arm comprises a vacuum generator 5, and the vacuum generator 5 is arranged at one end of the support frame 1 far away from the wafer and is used for providing vacuum for adsorbing the wafer. The structure can realize the independent operation function of the wafer transfer vacuum arm, and further improves the flexibility of the wafer transfer work. In this embodiment, the vacuum generator 5 is disposed at an end of the holding member 12 away from the supporting member 11. Wherein, the interior of the holding piece 12 is provided with a vent hole, one end of the vent hole is communicated with the hollow structure of the supporting piece 11, the other end is an air inlet hole, and the output end of the vacuum generator 5 is communicated with the air inlet hole.
In another embodiment, the support frame 1 is provided with a vacuum connector communicated with the air inlet, and the external pipeline is connected between the vacuum connector and the external vacuum generating equipment. Wherein the external vacuum generating device may be the vacuum generator 5 and may provide vacuum for a plurality of devices requiring vacuum. The arrangement enables the wafer transfer vacuum arm to be externally connected with vacuum equipment, wherein the length of the external pipeline can be set according to the wafer transfer distance. The vacuum joint and the external pipeline are connected by a quick connector.
The supporting member 11 and the holding member 12 are made of aluminum alloy. Wherein, the length of the supporting piece 11 is 295 mm, the length of the holding piece 12 is 270 mm, the width is 60 mm, and the thickness is 8 mm. The width of the first arm 112 and the second arm 113 is 45 mm, the thickness is 5 mm, the maximum distance between the two arms is 280 mm, the center distance of the two sucker components 2 is 226 mm, the vacuum generator 5 fixed on the support frame 1 is powered by a 12v battery, the length of the vacuum generator 5 is 152 mm, the width is 60 mm, the thickness is 88 mm, and the width direction of the vacuum generator 5 is consistent with the length direction of the holding part 12.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A wafer transfer vacuum arm, comprising:
the wafer-level vacuum forming device comprises a support frame (1), wherein the support frame (1) is used for bearing a wafer, at least the part of the support frame (1) in contact with the wafer is of a hollow structure, the support frame (1) is provided with an air inlet and a vacuum port which are communicated with the hollow structure, and the air inlet, the hollow structure and the vacuum port form a vacuum pipeline for vacuumizing;
sucking disc subassembly (2), sucking disc subassembly (2) are located support frame (1), the input of sucking disc subassembly (2) with the vacuum port intercommunication, the output of sucking disc subassembly (2) can adsorb the wafer.
2. The wafer transfer vacuum arm according to claim 1, wherein the chuck assembly (2) comprises a suction nozzle (21) and a pressing member (22), the suction nozzle (21) is cylindrical, an annular step (211) is arranged on the periphery of the suction nozzle (21), the annular step (211) is lower than an outlet of the suction nozzle (21), and the pressing member (22) is fixedly connected to the support frame (1) and presses against the annular step (211).
3. The wafer transfer vacuum arm according to claim 2, wherein the crimping part (22) comprises a connecting part (221) and crimping parts (222) arranged at two ends of the connecting part (221), wherein both crimping parts (222) extend towards the suction nozzle (21) and crimp the annular step (211), and both crimping parts (222) are symmetrical about the center of the suction nozzle (21).
4. The wafer transfer vacuum arm according to claim 3, wherein the crimping portion (222) is provided with an avoiding groove (2221), a groove bottom of the avoiding groove (2221) is crimped on the annular step (211), the supporting frame (1) and the periphery of the vacuum port are provided with a sinking groove, and the crimping connecting portion (221) is located in the sinking groove.
5. The wafer transfer vacuum arm as claimed in claim 1, characterized in that the support frame (1) comprises a support (11) and a grip (12) connected; the bearing piece (11) is used for bearing the wafer, and the bearing piece (11) is of a hollow structure and is provided with the adsorption hole and the air inlet hole.
6. The wafer transfer vacuum arm according to claim 5, wherein the support member (11) comprises a transition portion (111) and a first arm (112) and a second arm (113) which are arranged at one end of the transition portion (111), the first arm (112) and the second arm (113) are arranged in parallel and spaced apart, the first arm (112) and the second arm (113) are both of a hollow structure, and the first arm (112) and the second arm (113) are both provided with the vacuum holes; the air inlet is arranged on the transition part (111).
7. The wafer transfer vacuum arm according to claim 6, comprising at least three stoppers (3), wherein the stoppers (3) are distributed on the first arm (112) and the second arm (113) for abutting against the outer periphery of the wafer.
8. The wafer transfer vacuum arm according to any of claims 1-7, characterized in that it comprises at least three support members (4), each support member (4) being provided to the support frame (1) for supporting the wafer.
9. The wafer transfer vacuum arm according to any of claims 1 to 7, characterized in that the wafer transfer vacuum arm comprises a vacuum generator (5), wherein the vacuum generator (5) is arranged at an end of the support frame (1) remote from the wafer for providing a vacuum for attracting the wafer.
10. Wafer transfer vacuum arm according to any of claims 1 to 7, characterized in that the support frame (1) is provided with a vacuum connection communicating with the gas inlet, and an external line is connected between the vacuum connection and an external vacuum generating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211397186.XA CN115632022A (en) | 2022-11-09 | 2022-11-09 | Wafer transfer vacuum arm |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211397186.XA CN115632022A (en) | 2022-11-09 | 2022-11-09 | Wafer transfer vacuum arm |
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| Publication Number | Publication Date |
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| CN115632022A true CN115632022A (en) | 2023-01-20 |
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| CN202211397186.XA Pending CN115632022A (en) | 2022-11-09 | 2022-11-09 | Wafer transfer vacuum arm |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117607665A (en) * | 2024-01-24 | 2024-02-27 | 深圳市森美协尔科技有限公司 | Probe station |
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2022
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117607665A (en) * | 2024-01-24 | 2024-02-27 | 深圳市森美协尔科技有限公司 | Probe station |
| CN117607665B (en) * | 2024-01-24 | 2024-05-03 | 深圳市森美协尔科技有限公司 | Probe station |
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