CN214848566U

CN214848566U - Silicon wafer handing-over adsorption equipment

Info

Publication number: CN214848566U
Application number: CN202121427145.1U
Authority: CN
Inventors: 吴火亮; 江旭初; 董亚聪; 徐腾肖; 唐海明; 李仲禹
Original assignee: Shanghai Yinguan Semiconductor Technology Co Ltd; Shanghai Precision Measurement Semiconductor Technology Inc
Current assignee: Shanghai Yinguan Semiconductor Technology Co Ltd; Shanghai Precision Measurement Semiconductor Technology Inc
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2021-11-23
Anticipated expiration: 2031-06-25

Abstract

The utility model belongs to the field of semiconductor manufacturing equipment, and discloses a silicon wafer cross-connecting adsorption device, which comprises a sucker and a base, wherein the end surface of the sucker is provided with an adsorption hole, the sucker also comprises a first pipeline mechanism and a plurality of cross-connecting mechanisms which are arranged inside, the first pipeline mechanism comprises a first cross-connecting pipeline component and a first adsorption pipeline component which are not communicated with each other, the first cross-connecting pipeline component is communicated with the cross-connecting mechanism, and the first adsorption pipeline component is communicated with the adsorption hole; the base sets up the one side of keeping away from the absorption hole at the sucking disc, the inside second pipeline mechanism that is equipped with of base, second pipeline mechanism is including second handing-over pipeline and the second adsorption pipeline that each other does not communicate, second handing-over pipeline one end and first handing-over pipeline subassembly intercommunication, the other end is connected with the air supply source, second adsorption pipeline one end and first adsorption pipeline subassembly intercommunication, the other end is connected with the air supply source, according to handing-over mechanism in the gaseous atmospheric pressure difference that leads to, the silicon chip bracing piece can do relatively the sucking disc terminal surface and reciprocate.

Description

Silicon wafer handing-over adsorption equipment

Technical Field

The utility model relates to a semiconductor manufacturing equipment field especially relates to a silicon chip handing-over adsorption equipment.

Background

In semiconductor manufacturing process equipment, an adsorption mechanism and a handover mechanism are arranged on a workbench, the adsorption mechanism is used for adsorbing and processing silicon wafers, the handover mechanism is used for transferring the silicon wafers, the adsorption mechanism of the workpiece platform needs to rotate at a large angle, and the adsorption mechanism and the handover mechanism need to complete handover work of the silicon wafers.

The existing transfer mechanism is of a motor driving structure, the motor driving structure has two forms, one form is that a motor is placed outside a workpiece table, although the transfer mechanism can realize the transfer of a silicon wafer and an adsorption mechanism, the transfer mechanism cannot rotate with the adsorption mechanism at a large angle; the other type is that the motor is placed inside the workpiece table, and although the handing-over mechanism can realize the handing-over and rotation of the silicon wafer and the adsorption mechanism, the structure is complex, the whole structure is huge, and the use is inconvenient. The existing transfer mechanism has a complex structure and high production cost, and the work of the transfer mechanism and the work of the adsorption mechanism can interfere with each other.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip handing-over adsorption equipment, simple structure, convenient to use.

To achieve the purpose, the utility model adopts the following technical proposal:

a silicon wafer cross-connecting adsorption device comprises:

the end face of the sucker is provided with an adsorption hole, the sucker further comprises a first pipeline mechanism and a plurality of cross-connecting mechanisms, the first pipeline mechanism and the plurality of cross-connecting mechanisms are arranged in the sucker, the first pipeline mechanism comprises a first cross-connecting pipeline assembly and a first adsorption pipeline assembly which are not communicated, the first cross-connecting pipeline assembly is communicated with the cross-connecting mechanism, and the first adsorption pipeline assembly is communicated with the adsorption hole;

the base is arranged on one side, away from the adsorption hole, of the sucker, a second pipeline mechanism is arranged inside the base and comprises a second cross pipeline and a second adsorption pipeline which are not communicated with each other, one end of the second cross pipeline is communicated with the first cross pipeline assembly, the other end of the second cross pipeline is connected with an air supply source, one end of the second adsorption pipeline is communicated with the first adsorption pipeline assembly, and the other end of the second adsorption pipeline is connected with the air supply source;

the handing-over mechanism includes the silicon chip bracing piece, according to the atmospheric pressure difference of the logical gas in the handing-over mechanism, the silicon chip bracing piece can be relative the sucking disc terminal surface does and reciprocates.

Preferably, one side of the sucker, which is close to the base, is provided with at least one handover air inlet and at least one adsorption air inlet, the handover air inlet is not communicated with the adsorption air inlet, the first handover pipeline assembly is communicated with the handover air inlet, and the first adsorption pipeline assembly is communicated with the adsorption air inlet;

a second cross-connection pipeline is communicated with the first cross-connection pipeline assembly sequentially through the cross-connection communication groove and the cross-connection air inlet hole;

the base is provided with an adsorption communicating groove, all the adsorption air inlets are communicated with each other, and the second adsorption pipeline is communicated with the first adsorption pipeline assembly sequentially through the adsorption communicating groove and the adsorption air inlets.

Preferably, the first interface duct assembly comprises at least one first unit, each of the first units comprising:

the air inlet structure comprises a plurality of transverse cross-connecting pipelines and a longitudinal cross-connecting pipeline, wherein one end of the longitudinal cross-connecting pipeline is communicated with one cross-connecting air inlet, the other end of the longitudinal cross-connecting pipeline is communicated with one end of the plurality of transverse cross-connecting pipelines, and the other end of each of the plurality of transverse cross-connecting pipelines is communicated with one cross-connecting mechanism.

Preferably, the first adsorption duct assembly includes a plurality of second units, each of the second units including:

the horizontal adsorption pipeline is communicated with one end of the longitudinal adsorption pipeline, one end of the horizontal adsorption pipeline is connected with one adsorption air inlet, and the other end of the longitudinal adsorption pipeline is connected with the adsorption hole.

Preferably, the silicon wafer handover adsorption device further comprises a first sealing ring and a second sealing ring, wherein the first sealing ring and the second sealing ring are arranged between the sucker and the base, the first sealing ring is located between the handover communication groove and the adsorption communication groove, and the second sealing ring is located at the outermost side of the handover communication groove and the adsorption communication groove.

As preferred, handing-over mechanism still includes handing-over base and spacing subassembly, it holds the chamber to have seted up in the handing-over base, the silicon chip bracing piece sets up hold the intracavity, spacing subassembly is used for spacing to the bracing piece, it is still including setting up to hold the chamber the sealed chamber of bracing piece below, first handing-over pipeline subassembly communicate in the sealed chamber.

Preferably, the handover mechanism further comprises a sealing member for sealing a gap between the inner wall of the handover base and the outer wall of the silicon wafer supporting rod.

Preferably, the delivery mechanism further comprises a reset piece, and the reset piece is used for resetting the delivery mechanism.

Preferably, the plurality of the connection mechanisms are uniformly distributed along the circumferential direction of the suction cup, and the first connection pipeline assembly and the first adsorption pipeline assembly are uniformly distributed in the suction cup.

Preferably, the silicon wafer handing-over adsorption device further comprises a rotating mechanism, the rotating mechanism is arranged between the base and the suckers, the rotating mechanism comprises a fixing part and a rotating part, the fixing part and the rotating part are coaxial, the fixing part is connected to the base, the rotating part is connected to the suckers, the handing-over communicating groove and the adsorption communicating groove are both circular or annular structures which are coaxially arranged with the suckers, and when the suckers rotate, the handing-over air inlet hole and the communicating state of the handing-over communicating groove can be kept, and the adsorption air inlet hole and the communicating state of the adsorption communicating groove can be kept.

The utility model has the advantages that:

the utility model discloses a set up first pipeline mechanism and second pipeline mechanism in sucking disc and base respectively, make first handing-over pipeline subassembly communicate respectively in handing-over mechanism and second handing-over pipeline, first absorption pipeline subassembly communicates respectively in adsorbing hole and second absorption pipeline, sets up the double air flue mode, accomplishes handing-over and the absorption work of silicon chip respectively. The first connecting pipeline component supplies air to the connecting mechanism to enable the silicon wafer supporting rod to move up and down and be lower than or higher than the end face of the sucking disc, so that the silicon wafer connecting work is completed; the first adsorption pipeline assembly supplies air to the adsorption holes, so that the silicon wafer is adsorbed and clings to the surface of the sucker. The utility model provides a silicon chip handing-over adsorption equipment through setting up two air flue modes, makes handing-over work and adsorption work mutual noninterference, when guaranteeing handing-over mechanism job stabilization, has still simplified silicon chip handing-over adsorption equipment's overall structure, simple structure, and it is convenient to implement. And through the gas circuit structural design of sucking disc and base, can not produce the wire winding problem when making the sucking disc can 360 rotations, improved the device's suitable scene. And simultaneously, the utility model discloses can realize handing-over and the rotation of silicon chip and adsorption apparatus simultaneously, and simple structure, convenient to use.

Drawings

FIG. 1 is a cross-sectional view of a silicon wafer transfer adsorption apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic side view of the silicon wafer transfer adsorption apparatus according to an embodiment of the present invention;

FIG. 3 is a bottom axial view of a chuck according to an embodiment of the present invention;

fig. 4 is a cross-sectional axial view of a base and a rotating mechanism provided in a first embodiment of the silicon wafer cross-connecting adsorption device of the present invention;

FIG. 5 is a cross-sectional view of a chuck according to a first embodiment of the present invention;

fig. 6 is a cross-sectional axial view of a silicon wafer transfer adsorption device according to an embodiment of the present invention in an initial state of a transfer mechanism;

fig. 7 is a cross-sectional axial view of a silicon wafer transfer adsorption device according to an embodiment of the present invention in an operating state of a transfer mechanism;

FIG. 8 is a side view of a silicon wafer supporting rod according to a first embodiment of the silicon wafer cross-connecting adsorption device of the present invention;

fig. 9 is a cross-sectional axial view of a second embodiment of the silicon wafer transfer adsorption device of the present invention.

In the figure:

1. a suction cup; 11. an adsorption hole; 12. a first interface conduit assembly; 121. transversely connecting pipelines; 122. longitudinally connecting pipelines; 13. a first adsorption duct assembly; 131. a transverse adsorption pipeline; 132. a longitudinal adsorption pipe; 14. connecting the air inlet holes; 15. an adsorption air inlet; 16. handing over the holding tank;

2. a handover mechanism; 21. a silicon wafer support rod; 211. a support rod main body; 212. a support rod head; 213. a reset piece accommodating groove; 22. a handover base; 221. sealing the cavity; 23. a limiting component; 231. an end cap; 232. a limiting plug; 24. a reset member; 25. a seal member;

3. a base; 31. a second interface duct; 311. a first seal ring; 32. a second adsorption conduit; 321. a second seal ring; 33. an adsorption communicating groove;

4. a rotation mechanism; 41. a fixing member; 42. a rotating member.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the embodiments of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features through another feature not in direct contact. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the embodiments of the present invention, the terms "upper", "lower", "right", and the like are used in the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of operation, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The first embodiment is as follows:

the embodiment provides a silicon wafer handover adsorption device, which relates to the field of semiconductor manufacturing equipment, and as shown in fig. 1, fig. 2, fig. 6 and fig. 7, the silicon wafer handover adsorption device comprises a sucker 1 and a base 3, an adsorption hole 11 is arranged on the end surface of the sucker 1, the sucker 1 further comprises a first pipeline mechanism and a plurality of handover mechanisms 2, the first pipeline mechanism comprises a first handover pipeline component 12 and a first adsorption pipeline component 13, the first handover pipeline component 12 is not communicated with the handover mechanisms 2, and the first adsorption pipeline component 13 is communicated with the adsorption hole 11; base 3 sets up the one side of keeping away from adsorption hole 11 at sucking disc 1, the inside second pipeline mechanism that is equipped with of base 3, second pipeline mechanism is including second handing-over pipeline 31 and second adsorption pipeline 32 that each other does not communicate, second handing-over pipeline 31 one end and first handing-over pipeline subassembly 12 intercommunication, the other end is connected with air supply source (not drawn), second adsorption pipeline 32 one end and first adsorption pipeline subassembly 13 intercommunication, the other end is connected with the air supply source (not drawn), handing-over mechanism 2 includes silicon chip bracing piece 21, the atmospheric pressure of the gas that leads to is different in according to handing-over mechanism 2, silicon chip bracing piece 21 can reciprocate relatively 1 terminal surface of sucking disc.

This embodiment makes first handing-over pipeline subassembly 12 communicate respectively in handing-over mechanism 2 and second handing-over pipeline 31 through set up first pipeline mechanism and second pipeline mechanism in sucking disc 1 and base 3 respectively, and first absorption pipeline subassembly 13 communicates respectively in adsorption hole 11 and second absorption pipeline 32, sets up two air flue modes, accomplishes handing-over and the absorption work of silicon chip respectively. The first handover pipeline component 12 leads positive pressure gas to the handover mechanism 2, so that the silicon wafer support rod 21 is higher than the end surface of the sucker 1, thereby completing handover work of the silicon wafer, the first handover pipeline component 12 stops leading positive pressure gas or leading negative pressure gas to the handover mechanism 2, so that the silicon wafer support rod 21 is lower than the end surface of the sucker 1, and the silicon wafer falls on the sucker 1; the first adsorption pipeline assembly 13 introduces negative pressure gas into the adsorption holes 11, so that the silicon wafer falling on the sucker 1 is adsorbed, and the silicon wafer is tightly attached to the surface of the sucker 1. The silicon chip handing-over adsorption equipment that this embodiment provided through setting up two air flue modes, makes handing-over work and adsorption work mutual noninterference, when guaranteeing handing-over mechanism 2 job stabilization, has still simplified silicon chip handing-over adsorption equipment's overall structure, simple structure, and it is convenient to implement.

In particular, as shown in fig. 2, several interface mechanisms 2 are evenly distributed along the circumference of the suction cup 1. Be provided with handing-over holding tank 16 (as shown in fig. 5) that a plurality of even intervals set up on sucking disc 1 for place handing-over mechanism 2, make a plurality of handing-over mechanisms 2 evenly set up along 1 circumference of sucking disc, increased handing-over mechanism 2 to the support stationarity of silicon chip. In contrast, the tubes of the first interface tube assembly 12 and the first suction tube assembly 13 are also evenly distributed within the suction cup 1. In this implementation, three transfer mechanisms 2 are arranged, and the three transfer mechanisms 2 are uniformly distributed at intervals of 120 degrees at the edge of the sucker 1. The pipes of the first interface pipe assembly 12 and the first adsorption pipe assembly 13 are also evenly distributed within the suction cup 1.

Specifically, as shown in fig. 1 to 4, at least one cross air inlet 14 and at least one adsorption air inlet 15 are disposed on one side of the suction cup 1 close to the base 3, the cross air inlet 14 and the adsorption air inlet 15 are not communicated, the first cross pipe assembly 12 is communicated with the cross air inlet 14, and the first adsorption pipe assembly 13 is communicated with the adsorption air inlet 15; a cross connecting groove is formed in the base 3, so that all the cross connecting air inlets 14 are mutually communicated, the second cross connecting pipeline 31 is communicated with the cross connecting groove, and the cross connecting air inlets 14 fall into a projection area of the cross connecting groove on the sucker 1; the cross air inlet hole 14 is communicated with the cross communicating groove; the second cross connecting pipeline 31 is communicated with the first cross connecting pipeline component 12 through the cross connecting communicating groove and the cross connecting air inlet hole 14 in sequence; an adsorption communicating groove 33 is formed in the base 3, so that all the adsorption air inlets 15 are communicated with each other, the second adsorption pipeline 32 is communicated with the adsorption communicating groove 33, and the adsorption air inlets 15 fall into a projection area of the adsorption communicating groove 33 on the sucker 1; the adsorption air inlet hole 15 is communicated with the adsorption communicating groove 33; the second adsorption pipeline 32 is communicated with the first adsorption pipeline assembly 13 sequentially through the adsorption communication groove 33 and the adsorption air inlet hole 15.

In this embodiment, a handover communicating groove coinciding with the second handover channel 31 and an adsorption communicating groove 33 are provided, a handover air inlet hole 14 is provided in the center of the circle of the side of the suction cup 1 close to the base 3 and the projection area of the second handover channel 31 (handover communicating groove) on the suction cup 1 coincides, so that the air pressure is sequentially transmitted to the suction cup 1 through the air supply source, the second handover channel 31 (handover communicating groove) and the handover air inlet hole 14; three adsorption air inlets 15 (shown in fig. 3) are arranged around the handover air inlet 14 and the projection areas of the adsorption communication grooves 33 on the suction cup 1 coincide, the adsorption communication grooves 33 arranged on the base 3 communicate with the corresponding three adsorption air inlets 15, so that the three adsorption air inlets 15 are communicated with each other through the adsorption communication grooves 33 (shown in fig. 4), the second adsorption pipeline 32 communicates with the adsorption communication grooves 33, and air pressure is conveniently conveyed to the suction cup 1 sequentially through the air supply source, the second adsorption pipeline 32, the adsorption communication grooves 33 and the adsorption air inlets 15.

In particular, as shown in fig. 4, the silicon wafer transferring and adsorbing device further includes a first seal 311 and a second seal 321 provided between the chuck 1 and the base 3, the first seal 311 is located between the transferring communicating groove and the adsorbing communicating groove 33, and the second seal 321 is located at the outermost side of the transferring communicating groove and the adsorbing communicating groove 33. In this embodiment, the first sealing ring 311 is sleeved on the joint of the first delivery pipe assembly 12 and the second delivery pipe 31 (i.e. between the delivery communicating groove and the adsorption communicating groove 33), so as to isolate the gas in the second delivery pipe 31 and the second adsorption pipe 32, thereby completing the sealing operation of the first delivery pipe assembly 12 and the second delivery pipe 31. The second sealing ring 321 is sleeved at the joint of the first adsorption pipeline assembly 13 and the second adsorption pipeline assembly 32 (i.e. the outermost side of the connection groove and the adsorption connection groove 33), and isolates the first adsorption pipeline assembly 13 and the second adsorption pipeline assembly 32 from the outside air, thereby completing the sealing operation of the first adsorption pipeline assembly 13 and the second adsorption pipeline assembly 32.

Specifically, as shown in fig. 1 to 5, the first cross-over duct assembly 12 includes at least one first unit, each first unit includes a plurality of cross-over ducts 121 and a longitudinal cross-over duct 122, one end of the longitudinal cross-over duct 122 is connected to one cross-over air inlet hole 14, the other end thereof is connected to one end of each of the plurality of cross-over ducts 121, and the other end of each of the plurality of cross-over ducts 121 is connected to one cross-over mechanism 2. In this embodiment, a first unit is provided, which includes a vertical cross-connecting pipe 122 and three horizontal cross-connecting pipes 121; the number of the transverse cross connecting pipelines 121 is consistent with that of the cross connecting mechanisms 2; one end of each of the transverse handover pipelines 121 is converged to one of the longitudinal handover pipelines 122 along the center of the suction cup 1 and communicated with one end of each of the longitudinal handover pipelines 122, the number of the transverse handover pipelines 121 is consistent with that of the handover mechanisms 2, the other end of each of the transverse handover pipelines 121 is communicated with the handover mechanisms 2, and the other end of each of the longitudinal handover pipelines 122 is connected to the handover air inlet 14.

Specifically, as shown in fig. 1 to 5, the first adsorption duct assembly 13 includes a plurality of second units, each of the second units includes a transverse adsorption duct 131 and a plurality of longitudinal adsorption ducts 132, one end of the transverse adsorption duct 131 is communicated with one end of the longitudinal adsorption ducts 132, one end of the transverse adsorption duct 131 is connected to one adsorption air inlet hole 15, and the other end of the longitudinal adsorption duct 132 is connected to the adsorption hole 11. The gas passes through the second adsorption duct 32, the adsorption air intake holes 15, and the transverse adsorption duct 131 in order, and then is transferred to the adsorption holes 11 through the longitudinal adsorption duct 132. Preferably, in the present embodiment, three sets of suction holes 11 are provided along the radial direction of the suction cup 1, and correspondingly, three second units are provided, and each second unit corresponds to one set of suction holes 11; the transverse adsorption pipeline 131 in each second unit is correspondingly communicated with one adsorption air inlet hole 15. In other embodiments, the number and relative positions of the first unit in the first interface duct assembly 12 and the second unit in the first adsorption duct assembly 13 may be interchanged, and the number and relative positions of the interface inlet 14 and the adsorption inlet 15 may be interchanged accordingly.

Particularly, as shown in fig. 1 and 4, the silicon wafer handover adsorption apparatus further includes a rotating mechanism 4, the rotating mechanism 4 is disposed between the base 3 and the chuck 1, the rotating mechanism 4 includes a fixing member 41 and a rotating member 42, the fixing member 41 and the rotating member 42 are coaxial, the fixing member 41 is connected to the base 3, the rotating member 42 is connected to the chuck 1, the handover communicating groove and the adsorption communicating groove 33 are both circular or annular structures coaxially disposed with the chuck 1, and when the chuck 1 rotates, the communicating state between the handover air inlet hole 14 and the handover communicating groove can be maintained, and the communicating state between the adsorption air inlet hole 15 and the adsorption communicating groove 33 can be maintained. Preferably, the rotating mechanism 4 is driven by a motor in this embodiment. The fixing part 41 of the rotating mechanism 4 is fixedly connected to the base 3, the rotating part 42 is connected to the sucker 1, and the rotating part 42 rotates, so that the sucker 1 is driven to rotate by 360 degrees, the rotating angle of the sucker 1 is increased, and at the moment, the first connecting pipeline assembly 12 and the second connecting pipeline 31 are communicated with the circle center of the sucker 1 close to one surface of the base 3; the adsorption communication groove 33 and the three adsorption air inlet holes 15 are arranged in an annular structure with the same radius, and the circle centers of the adsorption communication groove 33 and the suction cup 1 are coaxial, so that the three adsorption air inlet holes 15 and the adsorption communication groove 33 are always communicated when the suction cup 1 rotates. Through the gas circuit structural design of sucking disc 1 and base 3, make sucking disc 1 can 360 rotations, when not influencing the normal work of two air flues, base 3 can not rotate thereupon, consequently connects the trachea of air supply and can not produce the wire winding problem, has improved the device's suitable scene.

Particularly, as shown in fig. 6 and 7, the handover mechanism 2 further includes a handover base 22 and a limiting component 23, a containing cavity is formed in the handover base 22, the silicon wafer support rod 21 is disposed in the containing cavity, the limiting component 23 is used for limiting the support rod 21, the containing cavity further includes a sealing cavity 211 disposed below the support rod 21, and the first handover pipeline component 12 is communicated with the sealing cavity 221. Preferably, the limiting assembly 23 comprises an end cover 231 and a limiting plug 232, the end cover 231 and the limiting plug 232 are respectively plugged at two ends of the accommodating cavity of the transfer base 22, the surface of the end cover 231 is flush with the end surface of the suction cup 1, and the silicon wafer supporting rod 21 is limited, so that the silicon wafer supporting rod 21 can penetrate through the end cover 231 to support a silicon wafer, a through hole is formed in the end cover 231, and the silicon wafer supporting rod 21 is partially penetrated. The limiting plug 232 plugs the lower end of the accommodating cavity of the handover base 22 to play a role in limiting the silicon wafer supporting rod 21. In other embodiments, the end cap 231, the stopper 232 and the interface base 22 may be integrally formed. The transverse handover pipeline 121 of the first handover pipeline assembly 12 is communicated with the sealed cavity 221, so that the gas is transported through the second handover pipeline 31, the handover air inlet 14 and the longitudinal handover pipeline 122 in sequence, and finally transported into the sealed cavity 221 through the transverse handover pipeline 121, so that the silicon wafer support rod 21 moves up and down in the accommodating cavity.

Preferably, in this embodiment, positive pressure is introduced into the sealing cavity 221, so that the silicon wafer supporting rod 21 moves upward; the silicon wafer support rod 21 is moved downward by supplying a negative pressure or stopping supplying a positive pressure into the sealing chamber 221.

In particular, as shown in fig. 6 and 7, the interface mechanism 2 further comprises a reset member 24, and the reset member 24 is used for resetting the interface mechanism 2. The reset piece 24 is arranged, so that the handover mechanism 2 can return to the initial position after completing the handover silicon wafer work, and the next handover silicon wafer work is carried out.

Preferably, as shown in fig. 6 to 8, the silicon wafer supporting rod 21 includes a supporting rod main body 211 and a supporting rod head 212 connected to the supporting rod main body 211, and the restoring member 24 is disposed at the supporting rod head 212 and abuts against the end cap 231. In the present embodiment, the restoring element 24 is a spring, and the spring is sleeved on the supporting rod head 212. In an initial state, the silicon wafer support rod 21 abuts against the limiting plug 232 (as shown in fig. 6) through the spring, positive pressure is introduced into the sealed cavity 221, the silicon wafer support rod 21 moves upward and is away from the limiting plug 232, the spring is compressed, the support rod head 212 penetrates through the end cover 231 (as shown in fig. 7), and the end cover 231 limits the silicon wafer support rod 21 to continuously move upward. The negative pressure is introduced into the sealed cavity 221 or the positive pressure is stopped, the pressure in the sealed cavity 221 is reduced, and the spring is reset, so that the silicon wafer support rod 21 is pushed to move downwards to be close to the limiting plug 232 until the support rod main body 211 abuts against the limiting plug 232.

Preferably, as shown in fig. 8, the silicon wafer supporting rod 21 is provided with a reset piece receiving groove 213 on the main body for receiving the reset piece 24. In this embodiment, the spring is sleeved on the supporting rod head 212 and placed in the restoring member receiving groove 213.

In particular, the interface mechanism 2 further comprises a sealing member 25, wherein the sealing member 25 is used for sealing the gap between the inner wall of the interface base 22 and the outer wall of the silicon wafer supporting rod 21. In this embodiment, a sealing installation groove is formed in the support rod main body 211, and the sealing member 25 is disposed in the sealing installation groove and abuts against the inner wall of the delivery base 22 (as shown in fig. 6 and 7) to seal the sealing cavity 221, thereby ensuring the air tightness of the sealing cavity 221.

Example two:

the suction cup 1, the rotating mechanism 4, the base 3, the first pipe mechanism, the second pipe mechanism, the silicon wafer support rod 21 and the position limiting assembly 23 of the present embodiment do not differ from the first embodiment, but differ only in that the restoring member 24 of the present embodiment is disposed in the sealing cavity 221, as shown in fig. 9. In the embodiment, the reset element 24 is a spring, and in the initial state, the head 212 of the silicon wafer support rod 21 passes through the end cap 231 and is higher than the end surface of the chuck 1. After the silicon wafer is handed over, the silicon wafer supporting rod 21 is moved downwards by introducing negative pressure into the sealing cavity 221, the spring is compressed, and the head 212 of the supporting rod is lower than the surface of the cover plate 231, namely lower than the end surface of the suction cup 1, so that the silicon wafer falls on the suction cup 1. When the negative pressure is stopped to be introduced into the sealed cavity 221 or the positive pressure is introduced into the sealed cavity 221, the spring returns to the initial state, and pushes the silicon wafer support rod 21 to move upwards.

Optionally, the reset element 24 may also be a tension spring, and the action of the tension spring is similar to that of the spring in the first embodiment, in the initial state, the head 212 of the support rod is lower than the end surface of the suction cup 1, when the positive pressure is introduced into the sealing cavity 221, the silicon wafer support rod 21 moves upward, and the tension spring makes the head 212 of the support rod higher than the end surface of the suction cup 1, so as to complete the silicon wafer handover.

Alternatively, as shown in fig. 9, a sealing installation groove is provided on the delivery base 22, and the sealing member 25 is provided on the sealing installation groove and abuts against the outer wall of the silicon wafer support rod 21.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A silicon wafer transfer adsorption device is characterized by comprising:

the sucker (1) is provided with an adsorption hole (11) on the end face, the sucker (1) further comprises a first pipeline mechanism and a plurality of cross-connecting mechanisms (2), the first pipeline mechanism comprises a first cross-connecting pipeline assembly (12) and a first adsorption pipeline assembly (13), the first cross-connecting pipeline assembly (12) and the first adsorption pipeline assembly (13) are not communicated with each other, the first cross-connecting pipeline assembly (12) is communicated with the cross-connecting mechanisms (2), and the first adsorption pipeline assembly (13) is communicated with the adsorption hole (11);

the base (3) is arranged on one side, far away from the adsorption hole (11), of the sucker (1), a second pipeline mechanism is arranged inside the base (3), the second pipeline mechanism comprises a second cross-over pipeline (31) and a second adsorption pipeline (32) which are not communicated with each other, one end of the second cross-over pipeline (31) is communicated with the first cross-over pipeline assembly (12), the other end of the second cross-over pipeline is connected with an air supply source, one end of the second adsorption pipeline (32) is communicated with the first adsorption pipeline assembly (13), and the other end of the second adsorption pipeline is connected with the air supply source;

handing-over mechanism (2) include silicon chip bracing piece (21), according to the atmospheric pressure of the logical gas is different in handing-over mechanism (2), silicon chip bracing piece (21) can be relative sucking disc (1) terminal surface does and reciprocates.

2. The silicon wafer handover adsorption device according to claim 1, wherein at least one handover air inlet hole (14) and at least one adsorption air inlet hole (15) are formed in a side of the chuck (1) close to the base (3), the handover air inlet hole (14) and the adsorption air inlet hole (15) are not communicated, the first handover pipe assembly (12) is communicated with the handover air inlet hole (14), and the first adsorption pipe assembly (13) is communicated with the adsorption air inlet hole (15);

a cross-over communicating groove is formed in the base (3) to enable all the cross-over air inlets (14) to be communicated with each other, and the second cross-over pipeline (31) is communicated with the first cross-over pipeline assembly (12) through the cross-over communicating groove and the cross-over air inlets (14) in sequence;

an adsorption communicating groove (33) is formed in the base (3) to enable all the adsorption air inlets (15) to be communicated with each other, and the second adsorption pipeline (32) is communicated with the first adsorption pipeline assembly (13) sequentially through the adsorption communicating groove (33) and the adsorption air inlets (15).

3. The wafer interface chucking apparatus of claim 2, wherein said first interface conduit assembly (12) comprises at least one first unit, each of said first units comprising:

the air distribution device comprises a plurality of transverse cross-connecting pipelines (121) and a longitudinal cross-connecting pipeline (122), wherein one end of the longitudinal cross-connecting pipeline (122) is communicated with one cross-connecting air inlet hole (14), the other end of the longitudinal cross-connecting pipeline is communicated with one end of each of the plurality of transverse cross-connecting pipelines (121), and the other end of each of the plurality of transverse cross-connecting pipelines (121) is communicated with one cross-connecting mechanism (2).

4. The silicon wafer cross-over adsorption device according to claim 2, wherein the first adsorption duct assembly (13) comprises a plurality of second units, each of the second units comprising:

the horizontal adsorption device comprises a horizontal adsorption pipeline (131) and a plurality of longitudinal adsorption pipelines (132), wherein one horizontal adsorption pipeline (131) is communicated with one ends of the longitudinal adsorption pipelines (132), one end of one horizontal adsorption pipeline (131) is connected with one adsorption air inlet hole (15), and the other end of each longitudinal adsorption pipeline (132) is connected with the adsorption hole (11).

5. The silicon wafer transfer/adsorption apparatus according to claim 2, further comprising a first seal ring (311) and a second seal ring (321) disposed between the chuck (1) and the base (3), wherein the first seal ring (311) is located between the transfer communicating groove and the adsorption communicating groove (33), and the second seal ring (321) is located at an outermost side of the transfer communicating groove and the adsorption communicating groove (33).

6. The silicon wafer handing-over adsorption device of claim 1, wherein the handing-over mechanism (2) further comprises a handing-over base (22) and a limiting component (23), a containing cavity is formed in the handing-over base (22), the silicon wafer supporting rod (21) is arranged in the containing cavity, the limiting component (23) is used for limiting the supporting rod (21), the containing cavity further comprises a sealing cavity (221) arranged below the supporting rod (21), and the first handing-over pipeline component (12) is communicated with the sealing cavity (221).

7. The silicon wafer handing-over adsorption device of claim 6, wherein the handing-over mechanism (2) further comprises a sealing member (25), and the sealing member (25) is used for sealing a gap between the inner wall of the handing-over base (22) and the outer wall of the silicon wafer supporting rod (21).

8. The silicon wafer handing-over adsorption device of claim 6, characterized in that, the handing-over mechanism (2) further comprises a resetting piece (24), and the resetting piece (24) is used for resetting the handing-over mechanism (2).

9. The silicon wafer handing-over adsorption device according to claim 1, wherein a plurality of the handing-over mechanisms (2) are uniformly distributed along the circumferential direction of the chuck (1), and the pipes of the first handing-over pipe assembly (12) and the first adsorption pipe assembly (13) are uniformly distributed in the chuck (1).

10. The silicon wafer handing-over adsorption device of claim 2, further comprising a rotation mechanism (4), the rotating mechanism (4) is arranged between the base (3) and the sucker (1), the rotating mechanism (4) comprises a fixed part (41) and a rotating part (42), the fixed part (41) and the rotating part (42) are coaxial, the fixed part (41) is connected with the base (3), the rotating piece (42) is connected with the sucker (1), the connecting and communicating groove and the adsorbing and communicating groove (33) are both circular or annular structures which are coaxial with the sucker (1), when the sucking disc (1) rotates, the communication state of the handover air inlet hole (14) and the handover communication groove can be kept, and the communication state of the adsorption air inlet hole (15) and the adsorption communication groove (33) is kept.