CN218631977U - Picking, placing and overturning device suitable for wafers - Google Patents

Abstract

The utility model relates to a pick-and-place and turnover device suitable for wafers, which comprises a pick-and-place component and a turnover driving component, wherein the pick-and-place component is at least provided with two adsorption end surfaces, each adsorption end surface is provided with an exhaust port and a plurality of diversion trenches, and the diversion trenches extend from the exhaust port to the outside in a divergent shape; the taking, placing and turning device further comprises an air supply part, wherein the wafer is flatly placed on the corresponding adsorption end face, the air supply part exhausts air between the wafer and the corresponding adsorption end face from the corresponding exhaust port, and airflow flows along each flow guide groove and forms negative pressure on the corresponding side face of the wafer. The utility model can pick up or/and place at least two wafers at one time, effectively improve the production efficiency and meet the requirement of mass production; meanwhile, according to the Bernoulli principle, negative pressure can be formed on the corresponding side face of the wafer, the formed negative pressure area is large, the adsorption stability of the wafer is effectively improved, and the wafer is prevented from falling off.

Description

Picking, placing and overturning device suitable for wafers

Technical Field

The utility model belongs to wafer processing equipment field, concretely relates to get and put and turning device suitable for wafer.

Background

As is well known, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and is a silicon wafer formed by grinding, polishing and slicing a silicon crystal bar, wherein when the wafer is subjected to surface electroplating treatment, the wafer subjected to electroplating treatment on an electroplating station needs to be taken down, the wafer to be electroplated is placed on the electroplating station, and in the process, the wafer needs to be subjected to a series of picking and turning actions.

The patent with the publication number of CN213905337U discloses a wafer carrying and overturning device, which comprises an overturning adsorption unit, a rotary adsorption platform, a structural unit and a slideway unit, wherein the overturning adsorption unit is arranged on the slideway unit and connected with the slideway unit to play roles of carrying and overturning wafers, the rotary adsorption platform is arranged in front of the overturning adsorption unit and connected with the structural unit to play roles of bearing wafers and rotating the wafers, the structural unit is arranged below the rotary adsorption platform and connected with a working plane to play a role of fixing the rotary adsorption platform, and the slideway unit is connected with the working plane to play a role of driving the overturning adsorption unit to move in a three-dimensional space. The first rotary joint in the overturning adsorption unit is of a hollow cylindrical structure, the outer diameter of the hollow cylindrical structure is matched with the diameter of a round hole of the upper clamp plate of the shifting fork, the first rotary joint is arranged on the upper clamp plate of the shifting fork, one end of the first rotary joint is connected with the upper clamp plate of the shifting fork, and the other end of the first rotary joint is connected with the vacuum generating device through an air pipe; a second rotary joint in the rotary adsorption platform is arranged below the special adsorption platform, one end of the second rotary joint is connected with the special adsorption platform through the air passage and the through hole, and the other end of the second rotary joint is connected with a vacuum generation device through an air pipe.

However, in the actual production process, the wafer picking, placing and turning by using the prior art scheme is easy to have the following defects:

1. obviously, the overturning adsorption unit and the rotary adsorption platform form vacuum between the adsorption surface and the wafer body through a vacuum device, so that the wafer is adsorbed and fixed. According to the general knowledge of those skilled in the art, it is known that the wafer is sucked by such a suction method, and the force applied to the wafer is limited to the portion where the vacuum is formed, so that the force applied to the entire surface of the wafer is not uniform. Therefore, when the wafer is driven to turn over, the wafer is easily separated from the adsorption end part under the influence of inertia, and the wafer is damaged and scrapped;

2. the adsorption end part related in the prior art can only adsorb one wafer at a time, has low efficiency and is difficult to meet the requirement of mass production.

Disclosure of Invention

The utility model aims to solve the technical problem that a modified is applicable to getting of wafer and puts and turning device is provided.

In order to solve the technical problem, the utility model discloses take following technical scheme:

a picking, placing and turning device suitable for wafers comprises a picking and placing component and a turning driving component used for driving the picking and placing component to turn, wherein the picking and placing component is at least provided with two adsorption end surfaces, each adsorption end surface is provided with an exhaust port and a plurality of flow guide grooves which are inwards sunken and communicated with the exhaust port, and the flow guide grooves extend outwards in a divergent manner from the exhaust port;

the taking, placing and turning device further comprises air supply components respectively communicated with the air outlets, wherein the wafer is flatly placed on the corresponding adsorption end face, the air supply components exhaust air between the wafer and the corresponding adsorption end face from the corresponding air outlets, and the air flow flows along each flow guide groove and forms negative pressure on the corresponding side face of the wafer.

Preferably, the plurality of flow channels are distributed in a circumferential array around the exhaust port. With this arrangement, the air flow can pass through the corresponding side face covering the entire wafer when flowing along the guide grooves, and thus, according to the bernoulli principle, negative pressure can be generated on the corresponding side face of the entire wafer.

Preferably, when the wafer is flatly placed on the adsorption end face, the central line of the corresponding exhaust port coincides with the central line of the wafer. By the arrangement, the wafer is placed on the adsorption end face, negative pressure on the corresponding side face of the wafer is guaranteed to be uniformly distributed, stress on the surface of the wafer is uniform during adsorption, and deformation is reduced.

Preferably, the pick-and-place component comprises a body and two suckers, wherein the suckers are formed on one adsorption end surface of the body, and the two suckers are respectively arranged at two ends of the body. By the arrangement, when one wafer is turned over, the picking or/and placing action of the other wafer can be carried out.

Specifically, the exhaust ports formed on the two adsorption end faces are aligned along the length direction of the body. Set up like this, with the body upset to vertical state, two adsorb the terminal surface and be located the top and the bottom of body respectively, treat that electroplating wafer and electroplated wafer adsorb respectively at the top and the bottom of body, that is to say, only need 180 upset bodies this moment, can take off the electroplated wafer on electroplating the station to will treat simultaneously that electroplating wafer and electroplating the station are aimed at and are aligned, so that realize placing fast on electroplating the station and treat electroplating the wafer.

Preferably, the lateral wall of the body is provided with air inlets which are matched with the two air outlets in a one-to-one correspondence manner, an air flow channel is formed between each air inlet and the corresponding air outlet, and the air supply part is communicated with the two air inlets respectively. The arrangement is characterized in that the air flow channel is formed in the body, the structure is compact, the volume is small, and the turning motion of the body is convenient to be implemented in a narrow electroplating equipment space.

Specifically, two air flow channels are not communicated with each other, and the air supply part comprises two relatively independent nozzles, wherein the two nozzles are connected with the two air inlets in a one-to-one correspondence manner. So arranged, each chuck can independently perform suction and release of the wafer.

Furthermore, a plurality of telescopic rods are arranged between each sucker and the end face of the corresponding body, and when the wafer is adsorbed, the suckers can freely move in a telescopic mode along the length direction of the body. By the arrangement, when the wafer is ensured to be attached to the adsorption end face, the sucking disc can realize adaptive telescopic motion to form buffering, so that the wafer is prevented from being deformed.

Specifically, each sucker comprises a first sucker body and a second sucker body, wherein the first sucker body is annular and is fixedly arranged on the corresponding end face of the body, the second sucker body is arranged on the inner side of the first sucker body, the telescopic rod is connected between the second sucker body and the corresponding end face of the body, and when the telescopic rod contracts, the second sucker body abuts against the first sucker body. By means of the arrangement, the second tray body moves along with the telescopic rod in a contracting mode, the first tray body plays a limiting role in the second tray body, and the phenomenon that the wafer impacts the body due to the fact that the second tray body excessively contracts is avoided.

In addition, the body is formed with the connecting portion of outside extension from the lateral wall, and upset drive unit includes the pivot, the driving piece that is connected with the pivot, and wherein the pivot is from a tip and connecting portion fixed connection mutually, and during the upset, driving piece drive pivot is rotated round self axis, and the synchronous up-and-down motion of body thereupon.

Because of the implementation of above technical scheme, the utility model discloses compare with prior art and have following advantage:

the utility model can pick up or/and place at least two wafers at one time through at least two adsorption end surfaces, thereby effectively improving the production efficiency and meeting the requirements of mass production; meanwhile, airflow divergently flows from the exhaust port along the guide grooves on the adsorption end face, negative pressure can be formed on the corresponding side face of the wafer according to the Bernoulli principle, the formed negative pressure area is large, the adsorption stability of the wafer is effectively improved, and the wafer is prevented from falling off.

Drawings

The invention will be described in further detail with reference to the following drawings and specific embodiments:

fig. 1 is a schematic structural view of a device for picking, placing and turning a wafer according to the present invention;

FIG. 2 is a top view of FIG. 1;

FIG. 3 isbase:Sub>A schematic sectional view taken along line A-A in FIG. 2;

FIG. 4 is a schematic sectional view taken along line B-B in FIG. 2;

in the drawings: 1. a pick-and-place component; 10. a body; k2, an air inlet; t, an airflow channel; b. a connecting portion; c2, connecting grooves; 11. a suction cup; 111. a first tray body; 112. a second tray body; m, an adsorption end face; k1, an exhaust port; c1, a diversion trench; g. a telescopic rod;

2. a gas supply part; 20. a nozzle;

3. a flip drive member; 30. a rotating shaft; 31. a drive member.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, the taking, placing and flipping device for a wafer of the present embodiment includes a taking component 1, a gas supply component 2, and a flipping driving component 3.

Specifically, the pick-and-place component 1 comprises a body 10 and a sucker 11 which is arranged on the body 10 and is provided with an adsorption end surface m.

Specifically, the air supply part 2 includes two relatively independent nozzles 20 for supplying the air flow.

In this example, the body 10 is cylindrical, and two suction cups 11 are provided at both ends of the cylinder.

As shown in fig. 2 to 4, an air outlet k1 is formed on each suction cup 11, two air inlets k2 which are matched with the two air outlets k1 in a one-to-one correspondence manner are formed on the side wall of the body 10, wherein each air inlet k2 is communicated with the corresponding air outlet k1 to form an air flow channel t which is located inside the body 10, the two air flow channels t are not communicated with each other, the two nozzles 20 are respectively connected with the two air inlets k2, and the air flow sprayed out from each nozzle 20 passes through the corresponding air flow channel t and is discharged from the corresponding air outlet k 1. By the arrangement, the airflow channel is formed in the body, so that the structure is compact, the size is small, and the body can turn over in a narrow electroplating equipment space; and each sucker can independently suck and release the wafer.

Meanwhile, the exhaust ports k1 formed on the two suction cups 11 are aligned along the length direction of the body 10. The body is arranged in such a way that the body is turned to a vertical state, the two adsorption end faces are respectively located at the top end and the bottom end of the body, the wafer to be electroplated and the electroplated wafer are respectively adsorbed at the top end and the bottom end of the body, namely, the body is turned by 180 degrees at the moment, the electroplated wafer on the electroplating station can be taken down, and meanwhile, the wafer to be electroplated is aligned with the electroplating station, so that the wafer to be electroplated can be rapidly placed on the electroplating station.

Specifically, each suction cup 11 includes a first tray 111 and a second tray 112, wherein the first tray 111 is annular and fixedly disposed on a corresponding end surface of the body 10, and the second tray 112 is disposed inside the first tray 111.

Specifically, the exhaust port k1 is formed in the center of the second tray 112, and the end surface of the second tray 112 is further formed with a plurality of flow guide grooves c1 recessed inwards and communicated with the exhaust port k1, wherein the flow guide grooves c1 extend from the exhaust port k1 in a divergent manner outwards along the radial direction of the wafer flatly placed on the adsorption end surface m, when the wafer is flatly placed on the adsorption end surface m, the nozzle 20 exhausts air from the corresponding exhaust port k1 to a position between the wafer and the corresponding adsorption end surface m, and the air flow flows along each flow guide groove c1 and forms a negative pressure on the corresponding side surface of the wafer. According to Bernoulli's principle, the flow velocity of the air flow on the corresponding side of the wafer is greater than the flow velocity of the air flow on the opposite side during adsorption, so that a negative pressure can be generated on the corresponding side of the wafer

For convenience, when the wafer is horizontally placed on the adsorption end surface m, the center line of the corresponding exhaust port k1 coincides with the center line of the wafer, and the plurality of flow guide grooves c1 are distributed in an array around the circumferential circumference of the exhaust port k 1. With the arrangement, the airflow can pass through the corresponding side surface covering the whole wafer when flowing along the flow guide groove, so that negative pressure can be generated on the corresponding side surface of the whole wafer; meanwhile, the wafer is placed on the adsorption end face, so that negative pressure on the corresponding side face of the wafer is uniformly distributed, the stress on the surface of the wafer is uniform during adsorption, and deformation is reduced.

In addition, four telescopic rods g are further arranged between each second disc 112 and the end face of the corresponding body 10, so that when the wafer is adsorbed, the suction cup 11 can freely move in a telescopic manner along the length direction of the body 10. By the arrangement, when the wafer is ensured to be attached to the adsorption end face, the sucker can realize adaptive telescopic motion to form buffering, so that the wafer is prevented from being deformed.

Specifically, four telescopic rods g between each second disc 112 and the end face of the corresponding body 10 are circumferentially distributed around the exhaust port k1 at intervals, positioning grooves (not shown in the figure, but not difficult to think) which are recessed inwards and matched with the four telescopic rods g in a one-to-one correspondence are formed in the corresponding end face of the body 10, and when the telescopic rods g are contracted, the second disc 112 abuts against the first disc 111. Set up like this, the second disk body is along with the telescopic link shrink motion, and first disk body plays limiting displacement to the second disk body, avoids the excessive shrink of second disk body and leads to wafer striking body.

In this embodiment, the main body 10 further has a connecting portion b extending outward from the side wall, the turning driving member 3 includes a rotating shaft 30 and a driving member 31 for driving the rotating shaft 30 to rotate around its own axis, wherein the rotating shaft 30 is fixedly connected to the connecting portion b from an end portion thereof, and when turning, the driving member 31 drives the rotating shaft 30 to rotate around its own axis, and the main body 10 turns up and down synchronously.

Specifically, the end surface of the connecting portion b, which is far away from the body 10, is recessed inward and is formed with a connecting groove c2 matched with the rotating shaft 30, and the rotating shaft 30 is inserted into the connecting groove c2 from one end.

In summary, the present embodiment has the following advantages:

1. at least two wafers can be picked up or/and placed at one time through the two adsorption end surfaces, so that the production efficiency is effectively improved, and the requirement of mass production is met;

2. the airflow divergently flows from the exhaust port along the guide grooves on the adsorption end face, so that negative pressure can be formed on the corresponding side face of the wafer according to the Bernoulli principle, and the formed negative pressure area is large, so that the adsorption stability of the wafer is effectively improved, and the wafer is prevented from falling off;

3. the air flow channel is formed in the body, so that the structure is compact, the volume is small, and the turning motion of the body is convenient to implement in a narrow electroplating equipment space;

4. each sucker can independently suck and release the wafer without mutual interference;

5. the electroplated wafer on the electroplating station can be taken down only by turning the body 180 degrees, and the wafer to be electroplated is aligned with the electroplating station simultaneously, so that the wafer to be electroplated can be quickly placed on the electroplating station;

6. when the wafer is ensured to be attached to the adsorption end face, the sucking disc can realize adaptive telescopic motion to form buffering, so that the wafer is prevented from being deformed.

The present invention has been described in detail, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and the protection scope of the present invention can not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (10)

1. The utility model provides a get and put and turning device suitable for wafer, its is including getting put the part, and be used for driving get put the upset drive part of part upset motion, its characterized in that: the pick-and-place component is at least provided with two adsorption end surfaces, each adsorption end surface is provided with an air outlet and a plurality of guide grooves which are sunken inwards and communicated with the air outlet, and the guide grooves extend outwards in a divergent manner from the air outlet;

get put and turning device still including communicating every respectively the air feed part of gas vent, wherein the wafer is kept flat and is corresponded on the adsorption end face, the air feed part is from corresponding the gas vent to the wafer with correspond exhaust between the adsorption end face, the air current is along every the guiding gutter flows and is in form the negative pressure on the corresponding side of wafer.

2. The wafer pick-and-place and turnover device as claimed in claim 1, wherein: the guide grooves are distributed in a circumferential array around the exhaust port.

3. The pick-and-place and turn-over device for wafers as claimed in claim 1 or 2, wherein: when the wafer is flatly placed on the adsorption end face, the center line of the corresponding exhaust port is overlapped with the center line of the wafer.

4. The wafer pick-and-place and turnover device as claimed in claim 1, wherein: the pick-and-place component comprises a body and suckers formed with one adsorption end face, wherein the body is cylindrical, and the suckers are arranged at two ends of the body respectively.

5. The device of claim 4, wherein the wafer turning mechanism comprises: the exhaust ports formed on the two adsorption end faces are aligned along the length direction of the body.

6. Pick, place and turn device suitable for wafers according to claim 4 or 5, characterized in that: the side wall of the body is provided with air inlets which are matched with the two air outlets in a one-to-one correspondence manner, wherein each air inlet corresponds to an air flow channel formed between the air outlets, and the air supply part is communicated with the two air inlets respectively.

7. The wafer pick-and-place and turnover device as claimed in claim 6, wherein: two the airflow channel does not communicate the setting each other, air feed part includes two relatively independent nozzles, wherein two the nozzle with two the air inlet one-to-one is connected.

8. The wafer pick-and-place and turnover device as claimed in claim 4, wherein: and a plurality of telescopic rods are further arranged between each sucking disc and the end face corresponding to the body, and when the wafer is adsorbed, the sucking discs freely stretch and retract along the length direction of the body.

9. The device of claim 8, wherein the wafer-turning device comprises: every the sucking disc includes first disk body and second disk body, wherein first disk body is cyclic annular and fixed the setting is in on the body corresponds the terminal surface, the second disk body sets up the inboard of first disk body, the telescopic link is connected the second disk body with correspond between the terminal surface of body, just during the telescopic link shrink motion, the second disk body is contradicted on the first disk body.

10. The device of claim 4, wherein the wafer turning mechanism comprises: the body is formed with the connecting portion of outside extension from the lateral wall, upset drive part include the pivot, with the driving piece that the pivot is connected, wherein the pivot from an end with connecting portion fixed connection, during the upset, the driving piece drive the pivot rotates round self axis, the synchronous up-and-down upset motion of body thereupon.

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