CN213531236U

CN213531236U - Laser cutting wafer precision moving structure

Info

Publication number: CN213531236U
Application number: CN202021701307.1U
Authority: CN
Inventors: 时文飞; 邢智聪; 朱擎宇
Original assignee: Zhengzhou Rtit Research Institute
Current assignee: Zhengzhou Rtit Research Institute
Priority date: 2020-08-16
Filing date: 2020-08-16
Publication date: 2021-06-25
Anticipated expiration: 2030-08-16

Abstract

The utility model provides a precision moving structure for laser cutting of wafers, which comprises a frame, wherein an X sliding seat moving along the X direction is arranged on the frame; an XY sliding seat moving along the Y direction is arranged on the X sliding seat; a rotating seat is arranged on the XY sliding seat; the rotary seat is provided with a wafer vacuum chuck, and at least 3 piezoelectric ceramics are arranged between the rotary seat and the wafer vacuum chuck. The frame is provided with a CCD detection mechanism connected with the controller, the CCD detection mechanism sends image information of a wafer tray on the wafer vacuum chuck to the controller, and the piezoelectric ceramic is electrically connected with the controller. The utility model discloses thereby adjustment pressure pottery makes its high emergence change make wafer upper surface not slope, obtains higher machining precision in the course of working.

Description

Laser cutting wafer precision moving structure

Technical Field

The utility model belongs to silicon wafer laser beam machining field, concretely relates to laser cutting wafer precision removes structure.

Background

When a silicon wafer is subjected to laser processing, a wafer tray is required to be placed on a wafer vacuum chuck, and then the wafer is cut on the silicon wafer according to a drawn scribe line. During processing, the upper surface of the wafer tray needs to be ensured to be in a flat state and cannot be inclined. This is generally ensured by the precision of the machining and assembly process of the equipment. However, the wafer and the wafer tray themselves have a certain error to cause uneven surface, which affects the silicon wafer to achieve higher processing precision.

SUMMERY OF THE UTILITY MODEL

The utility model provides a laser cutting wafer precision removes structure.

The purpose of the utility model is realized with the following mode: a laser cutting wafer precision moving structure comprises a machine frame, wherein an X sliding seat moving along the X direction is arranged on the machine frame; an XY sliding seat moving along the Y direction is arranged on the X sliding seat; a rotating seat is arranged on the XY sliding seat; the rotary seat is provided with a wafer vacuum chuck, and at least 3 piezoelectric ceramics are arranged between the rotary seat and the wafer vacuum chuck.

The frame is provided with a CCD detection mechanism connected with the controller, the CCD detection mechanism sends image information of a wafer tray on the wafer vacuum chuck to the controller, and the piezoelectric ceramic is electrically connected with the controller.

The center of the upper surface of the rotary seat can be fixedly provided with a fixed hemisphere of which the outer surface is a partial sphere, the center of the lower surface of the wafer vacuum chuck is provided with a fixed hemisphere hole matched with the fixed hemisphere, the center of the fixed hemisphere is on the axis of the wafer vacuum chuck, and the wafer vacuum chuck can rotate around the fixed hemisphere in multiple directions when the height of the piezoelectric ceramic changes.

A rotating seat zero position positioning mechanism is arranged between the rotating seat and the XY sliding seat: and a rotating seat displacement sensor is arranged on the side edge of the XY sliding seat, and a rotating seat displacement sensor detection strip is arranged at the corresponding position of the rotating seat.

An X linear motor is arranged on the rack along the X direction; the X sliding seat is fixed with a rotor of the X linear motor; an XY linear motor is arranged on the X sliding seat along the Y direction, and the XY sliding seat is fixed with the power of the XY linear motor.

The utility model has the advantages that: the CCD detection mechanism photographs the upper surface of the wafer and processes and analyzes the wafer, and the result is sent to the controller. When the upper surface of the wafer is not a plane, the controller sends a signal to the piezoelectric ceramic, and the height of the piezoelectric ceramic is adjusted to change, so that the upper surface of the wafer is not inclined, and higher processing precision is obtained in the processing process.

Drawings

FIG. 1 is a schematic diagram of a dicing platform of a wafer processing apparatus.

Fig. 2 is a schematic view of the position of the piezoelectric ceramics.

Wherein 7 is a cutting table, 70 is an X slide base, 71 is an XY slide base, 72 is a rotary base, 75 is a wafer vacuum chuck, 76 is a piezoelectric ceramic, and 77 is a fixed shaft.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Relational terms such as first, second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

As shown in fig. 1-2, a precision moving structure for laser cutting a wafer includes a frame, on which an X sliding seat 70 moving along an X direction is disposed; an XY slide base 71 moving along the Y direction is arranged on the X slide base 70; a rotating seat 72 is arranged on the XY sliding seat 71; a wafer vacuum chuck 75 is disposed on the spin base 72. At least 3 piezoelectric ceramics 76 are arranged between the rotary base 72 and the wafer vacuum chuck 75. One end of the piezoelectric ceramic 76 is connected to the upper surface of the rotary base 72, and the other end is connected to the lower surface of the wafer vacuum chuck 75. The spin base 72 and the wafer vacuum chuck 75 are connected by a piezoelectric ceramic 76. And a CCD detection mechanism for detecting the cutting condition is arranged above the frame and can comprise a camera and a graphic processing system, and the CCD detection mechanism is electrically connected with the controller. The CCD detection mechanism photographs the upper surface of the wafer and processes and analyzes the wafer, and the result is sent to the controller. When the upper surface of the wafer is not a plane, the controller sends a signal to the piezoelectric ceramic 76, and adjusts the piezoelectric ceramic 76 to change its height so that the upper surface of the wafer does not tilt.

A fixed hemisphere 76 having a partial sphere outer surface may be fixedly disposed at a central position of an upper surface of the rotary base 72, and a fixed hemisphere hole corresponding to the fixed hemisphere 76 is disposed at a central position of a lower surface of the wafer vacuum chuck 75. The center of the fixed hemisphere 76 is on the axis of the turntable 72 and the wafer vacuum chuck. The fixed hemisphere 76 and the fixed hemisphere hole allow the wafer vacuum chuck 7 to rotate in multiple directions around the fixed hemisphere 76, thereby accommodating height adjustment of the piezoelectric ceramic 76.

A zero position positioning mechanism of the rotary seat 72 is arranged between the rotary seat 72 and the XY sliding seat 71. Specifically, a rotating seat displacement sensor is arranged on the side edge of the XY sliding seat 71, and a rotating seat displacement sensor detection strip is arranged at the position corresponding to the rotating seat 72. After the wafer tray that is processed each time is taken away, the rotary base 72 rotates to the zero position, that is, the rotary base displacement sensor senses the rotary base displacement sensor detection strip. After the unprocessed wafer tray moves on the wafer vacuum chuck 75 on the rotary base 72, the optical equipment can send a signal to enable the rotary base 72 to rotate to a proper position relative to the zero position after photographing and analyzing the unprocessed wafer tray. The upper surface of the wafer vacuum chuck 75 is provided with an adsorption groove, the adsorption groove is provided with a downward adsorption hole, and the adsorption hole is connected with the space where the vacuum generator is located. The structure of the wafer vacuum chuck 75 belongs to the prior art, and can be as in patent CN105321863A and other disclosed structures, which are not described in detail.

The X-direction and the Y-direction are perpendicular. The wafer tray is disposed above the rotary base 72 and moves with the rotary base 72. Generally, the position of the wafer tray on the rotary base 72 is determined by an optical device and a signal is sent to rotate the rotary base 72 by a proper angle, thereby positioning. The rotary table 72 can be rotated to ensure that the scribing direction on the wafer is parallel to the moving direction of the X slide table 70 and the moving direction of the XY slide table 71, respectively. Thus, the X slide holder 70 and the XY slide holder 71 can be moved at different times, and the saw teeth are not generated in the scribing direction during laser dicing, thereby improving the precision of laser dicing of silicon wafers. An X linear motor is arranged on the rack along the X direction; the X sliding seat 70 is fixed with a rotor of the X linear motor; an XY linear motor is arranged on the X sliding seat 70 along the Y direction, and the XY sliding seat 71 is fixed with the power of the XY linear motor. Two parallel X linear motors are arranged on the rack in parallel, and two ends of an X sliding seat 70 are respectively arranged on the rotors of the X linear motors; two parallel XY linear motors are arranged on the X sliding seat 70 in parallel, and two ends of the XY sliding seat 71 are respectively arranged on the rotors of the two XY linear motors. The X-linear motor and XY-linear motor step distance may be 0.5 to 1 micron. The structure is actually one of high-precision two-dimensional linear motor platforms, and the rotary seat 72 is arranged on the high-precision two-dimensional linear motor platform. The method can particularly refer to the existing high-precision two-position linear motor platform product. The rotary base 72 is a high precision rotary platform. The specific results of the high-precision rotary platform which is the existing product on the market are not described in detail.

In the specific implementation: the XY slide 71 moves to a processing transfer position for receiving a wafer tray, and the upper rotary rotates to a zero position. The wafer tray is received and then sucked and fixed to the wafer vacuum chuck 75. And the XY sliding seat moves to the lower part of the laser processing mechanism, the CCD detection mechanism photographs the upper surface of the wafer and performs processing analysis, and the result is sent to the controller. When the upper surface of the wafer is not a plane, the controller sends a signal to the piezoelectric ceramic 76, and adjusts the piezoelectric ceramic 76 to change its height so that the upper surface of the wafer does not tilt. After the adjustment is completed, the XY slide base 71 starts the X-direction linear movement and the Y-direction linear movement to cut the wafer surface by the laser mechanism.

It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. Therefore, should not be construed as limiting the scope of the invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.

Claims

1. A laser cutting wafer precision moving structure comprises a machine frame, wherein an X sliding seat moving along the X direction is arranged on the machine frame; an XY sliding seat moving along the Y direction is arranged on the X sliding seat; a rotating seat is arranged on the XY sliding seat; set up wafer vacuum chuck on the roating seat, its characterized in that: at least 3 piezoelectric ceramics are arranged between the rotary seat and the wafer vacuum chuck.

2. The precision moving structure for laser cutting wafers as claimed in claim 1, wherein: and the frame is provided with a CCD detection mechanism connected with the controller, and the CCD detection mechanism sends image information of a wafer tray on the wafer vacuum chuck to the controller and the piezoelectric ceramic electric connection controller.

3. The precision moving structure for laser cutting wafers as claimed in claim 1, wherein: the center of the upper surface of the rotary seat can be fixedly provided with a fixed hemisphere of which the outer surface is a partial sphere, the center of the lower surface of the wafer vacuum chuck is provided with a fixed hemisphere hole matched with the fixed hemisphere, the center of the fixed hemisphere is on the axis of the wafer vacuum chuck, and the wafer vacuum chuck can rotate around the fixed hemisphere in multiple directions when the height of the piezoelectric ceramic changes.

4. The precision moving structure for laser cutting wafers as claimed in any one of claims 1 to 3, wherein: a rotating seat zero position positioning mechanism is arranged between the rotating seat and the XY sliding seat: and a rotating seat displacement sensor is arranged on the side edge of the XY sliding seat, and a rotating seat displacement sensor detection strip is arranged at the corresponding position of the rotating seat.

5. The precision moving structure for laser cutting wafer as claimed in claim 4, wherein: an X linear motor is arranged on the rack along the X direction; the X sliding seat is fixed with a rotor of the X linear motor; an XY linear motor is arranged on the X sliding seat along the Y direction, and the XY sliding seat is fixed with the power of the XY linear motor.