CN110320462A - A kind of test device and wafer automatic testing machine - Google Patents

Abstract

The invention discloses a kind of test device and wafer automatic testing machines, belong to wafer sort technical field.The test device includes testboard, further includes the rotary table of microscope carrier and rotation on the microscope carrier, and the testboard is set to the top of the rotary table；The rotary table bottom is equipped with adjustable column, and the adjustable column is rotatablely connected through the microscope carrier and with the microscope carrier；The bottom of the adjustable column is equipped with adjusting rod, pushes the adjusting rod, and the adjusting rod is able to drive the adjustable column and rotary table rotation.A kind of wafer automatic testing machine, including above-mentioned test device.Rotary table is rotatablely connected with microscope carrier by the way that testboard to be set on rotary table and realizes that the position in horizontal plane of testboard is adjustable by the present invention.

Description

A test device and automatic chip tester

technical field

The invention relates to the technical field of wafer testing, in particular to a testing device and an automatic testing machine for wafers.

Background technique

In the existing automatic wafer tester, the wafer to be tested is placed on the jig of the test tool and contacts the probes on the test board to complete the program test and obtain the test result. However, according to the size and structure of the detected wafer and the size and structure of the test board, it is necessary to adaptively adjust the position of the fixture on the horizontal plane so that the wafer and the test board are fully in contact to ensure the smooth progress of the test process.

Therefore, it is urgent to provide a testing device and an automatic wafer testing machine to solve the above-mentioned problems.

Contents of the invention

The object of the present invention is to provide a testing device and an automatic wafer testing machine, which can realize the position adjustment of the testing platform on the horizontal plane.

In order to achieve the above purpose, the following technical solutions are provided:

A test device, comprising a test platform, and also includes a carrier and a rotary table that is rotatably arranged on the carrier, the test table is arranged on the upper part of the rotary table; the bottom of the rotary table is provided with an adjustment The adjustment column runs through the carrier and is rotatably connected with the carrier; the bottom of the adjustment column is provided with an adjustment rod, which can drive the adjustment rod and the adjustment rod. The rotary table turns.

Preferably, the axis of the adjustment rod is perpendicular to the axis of the adjustment column.

Preferably, the adjusting rod is configured to be able to vertically pass through the adjusting column.

Preferably, an adjustment block is provided on the side of the carrier, a bar-shaped groove is provided on a side of the adjustment block close to the adjustment column, and a free end of the adjustment rod is arranged in the bar-shaped groove.

Preferably, the adjustment block is also provided with a first screw differential head, the measuring rod of the first screw differential head can extend into the inside of the adjustment block and abut against the adjustment rod, and rotate the first screw differential head. The fine-tuning knob of the differential head changes the protruding length of the measuring rod of the first screw differential head, and then drives the adjusting rod to move in the bar-shaped groove.

Preferably, the adjusting block is further provided with a first locking bolt, and the first locking bolt is configured to be able to lock the adjusting rod.

Preferably, the testing device further includes a lifting mechanism and a supporting mechanism, and the supporting mechanism includes a supporting top plate and a supporting bottom plate arranged parallel to each other at intervals, and a supporting vertical plate arranged between the supporting top plate and the supporting bottom plate , the stage is arranged between the support top plate and the support bottom plate, and the lifting mechanism is configured to be able to drive the stage close to or away from the support top plate.

Preferably, the testing device further includes a height adjustment mechanism configured to be able to adjust the height of the supporting top plate relative to the supporting bottom plate.

Preferably, the height adjustment mechanism includes a third screw differential head arranged on the support top plate, and the measuring rod of the third screw differential head passes through the support top plate and abuts against the top surface of the support vertical plate. Next, turn the fine-tuning knob of the third screw differential head to change the protruding length of the measuring rod of the third screw differential head, and then drive the supporting top plate to move closer or farther away from the supporting bottom plate.

An automatic wafer testing machine, comprising the testing device described in any one of the solutions above.

Compared with prior art, the beneficial effect of the present invention:

In the present invention, the test platform is arranged on the rotary worktable, and the rotary worktable is connected with the carrier in rotation, and the rotation of the rotary worktable and the test platform is completed by pushing the adjusting rod, so that the position of the test platform on the horizontal plane can be adjusted, so that The wafer placed on the test bench can fully contact the test board to ensure the smooth progress of the test process.

Description of drawings

Fig. 1 is the structural representation of a kind of wafer automatic testing machine in the embodiment of the present invention;

Fig. 2 is the front view of a kind of wafer automatic testing machine in the embodiment of the present invention;

Fig. 3 is a schematic structural view of a frame in an embodiment of the present invention;

Fig. 4 is a schematic structural view of a tray device in an embodiment of the present invention;

Fig. 5 is a schematic structural view of a tray in an embodiment of the present invention;

Fig. 6 is a partially enlarged schematic diagram of place A in Fig. 4;

7 is a schematic structural view of a transfer device in an embodiment of the present invention;

8 is a schematic structural view of a transfer device in an embodiment of the present invention after removing the second substrate;

Fig. 9 is a partially enlarged schematic diagram of place B in Fig. 8;

Fig. 10 is a schematic structural view of a test device in an embodiment of the present invention;

Fig. 11 is a side view of a test device in an embodiment of the present invention;

Fig. 12 is a partially enlarged schematic diagram of place C in Fig. 10;

Fig. 13 is a partial structural schematic diagram 1 of a test device in an embodiment of the present invention;

Fig. 14 is a partial structural schematic diagram II of a test device in an embodiment of the present invention;

Fig. 15 is a partial structural schematic diagram III of a test device in an embodiment of the present invention.

Reference signs:

100-feed tray; 101-groove;

1-frame; 11-main body; 12-carrying platform; 121-through slot; 13-baffle plate; 14-carrying plate;

2- tray device; 21- top plate installation; 211- opposite beam sensor; 22- bottom plate installation; 23- connecting rod; 24- tray support block; 25- first drive mechanism; A shading plate; 252-drive motor; 26-the first photoelectric switch; 27-positioning block; 28-guiding block; 281-connecting part; 282-guiding part; 2823-positioning surface;

3-transfer device; 31-first substrate; 311-first slide rail; 312-second photoelectric switch; 32-second substrate; 321-second slide rail; 322-third photoelectric switch; 323-accommodating groove ; 33-the first driving assembly; 331-the first driving source; 332-the first driving wheel; 333-the first driven wheel; 3352-the second fixed plate; 336-the first mounting frame; 34-the second driving assembly; 341-the second driving source; 342-the second driving wheel; 343-the second driven wheel; 344-the second conveyor belt; 345- 346-the second mounting frame; 35-the first slider; 36-the second slider; 361-the fourth light shield; 37-suction nozzle assembly; 371-suction nozzle cylinder; 372-suction nozzle Fixed plate; 373-nozzle body; 374-air control valve; 375-second guide rod;

4-test device; 40-angle adjustment mechanism; 401-rotary table; 402-adjustment block; 4021-strip groove; 403-adjustment column; 404-adjustment rod; Lock bolt; 407-lock nut; 41-support mechanism; 411-support top plate; 412-support bottom plate; 413-support vertical plate; 4131-fourth photoelectric switch; 414-support support plate; -lifting mechanism; 421-lifting drive source; 422-first connecting plate; 43-test bench assembly; 431-test bench; Push plate; 4343-push thimble; 4344-third guide rod; 44-test board assembly; 441-test board; Connecting block; 452-buffer; 46-linear guide rail structure; 461-third slide block; 462-third slide rail; 47-displacement adjustment mechanism; 471-cross guide rail displacement platform; 472-second spiral differential; The second locking bolt; 48-height adjustment mechanism; 481-the third screw differential head; 482-cross guide rail structure; 483-the fourth locking bolt; 49-the second connecting plate;

5-Display device.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually placed when the product of the invention is used, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device Or elements must have a certain orientation, be constructed and operate in a certain orientation, and thus should not be construed as limiting the invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or Connected integrally; either mechanically or electrically. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "under" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

Embodiment one

Referring to FIGS. 1 and 2 , this embodiment discloses an automatic wafer testing machine, which includes a frame 1 , a transfer device 3 mounted on the frame 1 , a tray device 2 , a testing device 4 and a display device 5 . The rack 1 is also equipped with an electric control device, which mainly includes a PLC module, which is used to control the timing actions of various devices of the integrated chip automatic testing machine, so as to realize the automatic operation of chip testing. The display device 5 is configured to be able to display the running status and test results of each device, so as to facilitate manual real-time monitoring of the test process.

Specifically, with reference to FIG. 3 , the frame 1 includes a main body 11 and a carrying platform 12 located on the top of the main body 11, the main body 11 is used to accommodate the electronic control device; the carrying platform 12 is used to carry the transfer device 3 and the tray device 2; Optionally, the carrying platform 12 is made of marble to stably support the transfer device 3 and the tray device 2 . The frame 1 also includes a baffle 13 surrounding the outside of the loading platform 12; the baffle 13 is a U-shaped structure, so that the baffle 13 can surround the entire loading platform and the transfer device 3 and the tray device 2 on it, Prevent the outside from interfering with the operation of the transfer device 3 or touching the tray device 2; the test device 4 is located at the open end of the U-shaped baffle 13, so that the transfer device 3 can transfer the wafer on the tray device 2 to the opening at the open end. Tested on test device 4. Optionally, the frame 1 further includes a bearing plate 14 on which the test device 4 is arranged. One end of the carrying plate 14 is detachably connected to the main body 11 , and the other end is detachably connected to the carrying platform 12 to ensure the stability of the positional relationship between the test device 4 and the tray device 2 . Further, the carrying plate 14 is connected to the carrying platform 12 through a wedge-shaped reinforcing plate, which improves the stability of the carrying plate 14 . Optionally, the display device 5 is arranged on the side wall of the main body 11 through a universal bracket, so that it does not affect the testing process of the entire automatic testing machine, and can also flexibly change the placement position.

In order to improve the efficiency of wafer testing, there are multiple testing devices 4 arranged linearly along the first direction. In the present embodiment, testing device 4 is provided with five, therefore can carry out the test of five wafers simultaneously, has significantly improved the efficiency of wafer testing; The limitation of the moving speed of 3, the setting quantity of the test device 4, or the test device 4 in the use state can be further specifically defined.

The tray device 2 is used to carry a tray 100 on which wafers are placed. There are multiple tray devices 2, and multiple tray devices 2 can be divided into three categories. The first category is an empty tray device, which is used to carry an empty tray without wafer placement. The second category is a tray device to be tested. , untested wafers are placed on the tray 100 carried by it, and the third type is a classification tray device. Since the test results of the wafers can be divided into multiple grades, the classification tray device is also classified according to the grade of the test results. Divided into multiple, each level corresponds to a sorting tray device, and the tested wafers are placed on the tray 100 representing the sorting tray device of the corresponding level according to the test results. The arrangement of the above-mentioned three types of tray devices 2 enables the automatic testing machine to automatically classify and store wafers according to the test results, effectively improving the automation and intelligence of wafer testing. In this embodiment, there are twelve material tray devices 2, and the twelve material tray devices 2 are optionally distributed in a matrix on the carrying platform 12, wherein an empty material tray device and a material tray device to be tested are provided. Ten sorting tray devices. Certainly, during specific implementation, according to the grade division of wafer test result, the quantity of sorting tray device can be specifically limited again; Simultaneously, the number of empty tray device and the tray device to be tested is set to at least one; According to each tray The difference in the number of trays 100 that can be carried by the device 2, the number of wafers that can be placed on each tray 100, and the transfer mode of the transfer device 3, etc., the empty tray device and the tray device to be tested are different. Can be set to multiple.

In this embodiment, after all the wafers of the tray 100 carried on the tray device to be tested are taken, the remaining empty tray will be transferred to the empty tray device by the transfer device 3; As far as the device is concerned, the empty trays carried on it can be transferred to the corresponding sorting tray device by the transfer device 3 for sorting and storing the tested wafers; thereby realizing the empty tray during the wafer testing process. The turnover utilization improves the utilization rate of the tray 100 and further improves the test efficiency and intelligence of the automatic wafer test. During the specific implementation, when the automatic testing machine is initially started, it should be ensured that the empty tray device is provided with several empty trays, so as to realize the continuity of the transfer of empty trays between different tray devices 2 .

Embodiment two

This embodiment is to provide a tray device 2 that can be used in the wafer automatic testing machine in the first embodiment. Specifically, referring to FIG. 4 , the tray device 2 includes an installation top plate 21 and an installation bottom plate 22. Optionally, the installation top plate 21 and the installation bottom plate 22 are arranged at intervals and connected by a connecting rod 23, and the connecting rod 23 is vertically arranged between the installation top plate 21 and the installation bottom plate 22. Install between the bottom plate 22. Further, in order to enable the automatic testing machine to test more wafers, each tray device 2 is configured to allow a plurality of trays 100 to be stacked vertically between the top plate 21 and the bottom plate 22. In the space, the transfer device 3 completes the reciprocating movement of the wafer located on the uppermost tray 100 between the tray device 2 and the test device 4 according to the instructions, or completes the transfer of the empty tray between the tray device to be tested and the empty tray device. Transfer between empty trays and sorting trays. Further optional, the carrying platform 12 is provided with the same number of through-slots 121 as the tray device 2, the through-slots 121 are set through the entire carrying platform 12 and communicate with the inside of the main body 11, and each of the through-slots 121 is correspondingly provided with a The tray device 2 enables the trays 100 stacked between the installation top plate 21 and the installation bottom plate 22 to be stored in the main body 11, making full use of the space of the rack 1 and compressing the size of the entire wafer automatic testing machine. Wherein, the installation top plate 21 is fixedly connected with the carrying platform 12 to realize the fixing of the tray device 2 and the carrying platform 12 . Optionally, the fixing method may be bolt fixing or clamping, but is not limited to the above-mentioned methods. The installation top plate 21 is a frame structure, and the feed tray 100 is a plate structure, and the top feed tray 100 is placed in the frame structure of the installation top plate 21, and the centers of the two coincide with each other; optionally, the feed tray 100 and the installation The inner frame of the top plate 21 is rectangular, and the four sides of the tray 100 are arranged parallel to the four sides of the inner frame on which the top plate 21 is installed. Further, referring to FIG. 5 , a plurality of grooves 101 are opened on the tray 100 , and the grooves 101 are used for storing wafers. Furthermore, the wafers on the tray 100 are arranged in a matrix, which is convenient for the transfer device 3 to obtain the specific position of the wafer and the position to which the wafer needs to be moved according to the Cartesian coordinates.

Further, since the tray device 2 is provided with a plurality of stacked trays 100, every time a tray 100 is turned out or transferred into, the overall height of the stacked trays 100 on the tray device 2 will be reduced. Change, in order to ensure that the transfer device 3 completes the transfer of the wafers or trays 100 of each tray device 2 in the horizontal plane of the same height, the uppermost tray 100 of each tray device 2 should be kept on the same level, so , The tray device 2 also includes a tray holder 24 for carrying the tray 100 and a first drive mechanism 25 for driving the tray holder 24 to lift; the tray 100 is stacked vertically on the tray holder 24 , and drive all the trays 100 to lift as a whole under the drive of the first driving mechanism 25 . During specific implementation, when the uppermost tray 100 of the tray device 2 is transferred, the first drive mechanism 25 drives the tray 100 to move up the height of one tray 100 as a whole, so that the next tray 100 moves to the transferred tray. The position of 100 is convenient for the transfer device 3 to carry out subsequent operations on the new tray 100 in the same position; when the transfer device 3 transfers a new tray 100 to a certain tray device 2, the first drive mechanism 25. Drive the tray 100 to move down as a whole by the height of the tray 100, the original uppermost tray 100 can be stored in the space between the installation top plate 21 and the installation bottom plate 22, and the transfer device 3 pairs the new uppermost tray 100 Complete the next steps. Further, when a batch of wafers has been fully tested and needs to be taken out by the automatic testing machine, the first driving mechanism 25 is used to raise the tray support block 24 to the highest height, so that all stacked trays 100 can be automatically tested. Take it out from the machine. In this embodiment, the plane where the optional carrying platform 12 is located is the transfer plane.

Optionally, still referring to FIG. 4 , the first drive mechanism 25 includes a lifting platform 251 and a driving motor 252, the tray holder 24 is arranged on the lifting platform 251, the main body of the driving motor 252 is arranged on the installation base plate 22, and the driving motor 252 After the output shaft stretches out from the installation base plate 22, it is connected with the lifting platform 251 through the screw nut structure, the nut of the screw nut structure is fixed with the lifting platform 251, and the leading screw of the leading screw nut is connected with the output shaft of the drive motor 252, and the The threaded connection with the nut realizes the conversion of rotary motion to linear motion, and then realizes the lifting platform 251 up and down, so that the tray support block 24 can move freely between the installation top plate 21 and the installation bottom plate 22. In some other embodiments, the first driving mechanism 25 may also adopt a cylinder lifting structure or a rack and pinion lifting structure. Optionally, in order to improve the lifting accuracy of the lifting platform 251, the lifting platform 251 is provided with a first guide through hole, and at least one of the installation top plate 21 and the installation bottom plate 22 is provided with a first guide rod. In the first guiding through hole, the guiding function is realized through the relative sliding of the first guiding rod in the first guiding through hole. Further optionally, a first guide sleeve is disposed in the first guide through hole to ensure smoothness during the guide process. Optionally, in this embodiment, the connecting rod 23 can be used as the first guide rod. Optionally, the lifting platform 251 is integrally formed with the tray support block 24, so as to facilitate the synchronization of lifting and driving.

In order to limit the descending height of the tray support block 24, a first photoelectric switch 26 is arranged on the installation base 22, and a first light-shielding plate 2511 is provided at the bottom of the lifting platform 251. When the switch 26 is between the transmitting end and the receiving end, the first photoelectric switch 26 is triggered to generate a signal that the lifting platform 251 goes down to the limit position, and the further downward movement of the lifting platform 251 is prevented.

Further, the upper surface of the tray 100 is provided with a first positioning protrusion, the lower surface of the tray 100 is provided with a first positioning groove, and the tray 100 passes through the first positioning protrusion and the first positioning groove of the tray 100 above it. The clamping connection, and the clamping connection between the first positioning groove and the first positioning protrusion of the tray 100 below, realize the stable stacking of two adjacent trays 100 . Further, the first positioning protrusion and the first positioning groove of the tray 100 can be a rectangular structure compatible with the tray 100, and correspondingly, the groove 101 for holding the wafer is opened on the first positioning protrusion superior. Of course, in other embodiments, the upper surface of the tray 100 may also be provided with a first positioning groove, the lower surface of the tray 100 may be provided with a first positioning protrusion, and the groove 101 is set in the first positioning groove. , the stable stacking of the trays 100 is also achieved by mutual clamping. Further, the upper surface of the tray support block 24 is provided with a positioning block 27. When the lower surface of the tray 100 is provided with a first positioning groove, the outer contour shape of the positioning block 27 is suitable for the inner contour shape of the first positioning groove. Matching, so that the bottom tray 100 can be stably placed on the tray support block 24, and play the role of positioning the tray 100 to prevent it from shaking. When the lower surface of the tray 100 is provided with the first positioning protrusion, the positioning block 27 is provided with a positioning slot, and the inner contour shape of the positioning slot is adapted to the outer contour shape of the first positioning protrusion, and still plays a role. The role of positioning the lowermost tray 100. Optionally, the positioning block 27 can be integrally formed with the tray support block 24 , or can be connected in a detachable manner; the replacement of the positioning block 27 can be facilitated according to the specific structure of the tray 100 .

When more trays 100 are stacked in the vertical direction, due to the accumulation of assembly errors and the existence of their own deflection, the entire tray 100 will not be kept vertical, but will be tilted or twisted to a certain extent, resulting in the highest position. The position of the upper tray 100 is shifted, and the shifted position of the tray 100 will affect the accuracy of picking and placing the wafer by the transfer device 3 and affect the continuity of the testing process. In order to solve the above problems, with reference to Fig. 4 and Fig. 6, guide block 28 is set on the side of the inner frame of installation top plate 21, and guide block 28 comprises vertically arranged connection portion 281 and guide portion 282, and connection portion 281 is connected with installation top plate 21 The guide part 282 is provided with a first guide surface 2821 and a positioning surface 2823 which are sequentially connected from bottom to top on the side away from the installation top plate 21, the positioning surface 2823 is parallel to the vertical direction, and the first guide surface 2821 is inclined relative to the positioning surface 2823. That is, the end of the first guide surface 2821 that is not connected to the positioning surface 2823 is closer to the installation top plate 21 than the end of the first guide surface 2821 that is connected to the positioning surface 2823, so that when the material tray 100 rises from the bottom, the material tray 100 is positioned on the first guide surface. The position is corrected under the guiding action of surface 2821, and gradually moves toward the center of the inner frame until the tray 100 goes up to the space surrounded by positioning surface 2823; There is a second guide surface 2822 connected to the upper part of the positioning surface 2823; the second guide surface 2822 is inclined relative to the positioning surface 2823, that is, the end of the second guide surface 2822 that is not connected to the positioning surface 2823 is closer than the second guide surface 2822 to the positioning surface. The end connected by 2823 is closer to the installation top plate 21. When the material tray 100 is relatively lowered, the position of the material tray 100 can be corrected under the guidance of the second guide surface 2822, and gradually move to the center of the inner frame until the material tray 100 goes down. to the space enclosed by the positioning surface 2823. Further optionally, when the installation top plate 21 is a rectangular structure, guide blocks 28 are provided on the four sides of its inner frame, so that the material tray 100 can be guided by the guide blocks 28 at four different positions when it is lifted. The position is corrected by shifting downward to the middle, ensuring the accuracy of the position of the tray 100 within the inner frame of the top plate 21, and improving the efficiency of position correction of the tray 100. Optionally, when only one guide block 28 is provided on each side, the guide block 28 is arranged in the middle of a certain side of the installation top plate 21 . Furthermore, in some other embodiments, each side of the inner frame on which the top plate 21 is installed is not limited to having only one guide block 28 , and two or more guide blocks may be provided.

The installation top plate 21 is provided with an installation groove, the connecting portion 281 of the guide block 28 is connected in the installation groove, and the guide portion 282 of the guide block 28 is arranged outside the installation groove. Optionally, the connecting portion 281 and the installation top plate 21 are fixed by first bolts. Specifically, a first through hole is opened on the groove wall of the installation groove, and a second through hole is opened on the connecting portion 281. After the first bolt passes through the second through hole and the first through hole in turn, the guide block is completed by using a nut. 28 and the fixing of top plate 21 are installed. Further, the second through hole is a long hole, and the second through hole extends along the direction perpendicular to the side where the corresponding guide block 28 is installed, by changing the position of the first bolt in the long hole, the guide block 28 can be adjusted The distance between the positioning surface 2823 and the side with the guide block 28 improves the applicability of the tray device 2, and personnel can adjust the distance between the actual tray 100 or the gap between the tray 100 and the positioning surface 2823 according to the size of the actual tray 100. The difference of the error, rationally adjust the installation position of the guide block 28, reasonably set the size of the space surrounded by the positioning surface 2823, so that the center of the material tray 100 located in the space can coincide with the center of the installation top plate 21, and avoid the material tray 100. The position is greatly shifted to ensure the accurate transfer of the transfer device 3 .

In order to be able to monitor whether the uppermost tray 100 is placed in the frame structure of the installation top plate 21, a through-beam sensor 211 is provided on the inner frame of the installation top plate 21, still refer to Fig. 4 and Fig. 6, specifically, the through-beam sensor 211 The sensor 211 is structurally separated from each other, and the emitter and receiver whose optical axes are opposite to each other are respectively located on two opposite sides of the inner frame, and the light emitted by the emitter directly enters the receiver. When the tray 100 is placed in the frame structure where the top plate 21 is installed, the light between the transmitter and the receiver is blocked by the tray 100, and the through-beam sensor 211 generates Signals within the inner border of the body.

Embodiment three

This embodiment is to provide a transfer device 3 that can be used in the wafer automatic testing machine in Embodiment 1. The transfer device 3 is configured to realize that the material tray 100 is between different material tray devices 2, and the wafer is placed between the material tray devices. 2 and the movement between the test device 4 to complete the feeding or discharging action. 7 and 8, the transfer device 3 includes a first slide rail 311, a first drive assembly 33, a second slide rail 321, a second drive assembly 34 and a suction nozzle assembly 37, the suction nozzle assembly 37 includes a suction The nozzle body 373 is used to directly pick up the tray 100 or the wafer. The first drive assembly 33 is configured to drive the suction nozzle assembly 37 to move along the first slide rail 311, and the second drive assembly 34 is configured to drive the suction nozzle assembly 37 and the second slide rail 311. A sliding rail 311 moves along the second sliding rail 321 as a whole, and the extension directions of the first sliding rail 311 and the second sliding rail 321 are perpendicular to each other. In this embodiment, the extension directions of the first slide rail 311 and the second slide rail 321 can be understood as the X-axis and Y-axis in the Cartesian coordinate system of the transfer plane, respectively, and the drive assembly can receive the system instructions to drive the suction nozzle assembly 37 moves to the corresponding coordinate position of the transfer plane along the X axis and the Y axis, and picks up the tray 100 or the wafer at this position. In this embodiment, let the X axis be the first direction, and the Y axis be the second direction. Further, the transfer device 3 also includes a first base body 31 provided with a first slide rail 311 and a second base body 32 provided with a second slide rail 321, the first drive assembly 33 is arranged on the first base body 31, and the second drive assembly 34 is disposed on the second base body 32 , and the second driving assembly 34 directly drives the first base body 31 to move relative to the second base body 32 to realize the movement of the first sliding rail 311 relative to the second sliding rail 321 . Further optionally, the carrying platform 12 can be directly used as the second base body 32 .

Specifically, the first driving assembly 33 includes a first driving source 331, a first driving wheel 332, a first driven wheel 333, a first conveyor belt 334 wound on the first driving wheel 332 and a second driven wheel 343, and fixed on The first belt connector 335 on the first conveyor belt 334, the first belt connector 335 is provided with a first slide block 35 near the side of the first slide rail 311, and the first belt connector 335 is away from a side of the first slide rail 311 The side is provided with a nozzle body 373; the first driving source 331 and the first driving wheel 332 are arranged at one end of the first slide rail 311, the first driven wheel 333 is arranged at the other end of the first slide rail 311, and the first driving source 331 The first conveyor belt 334 is driven to rotate, and the first belt connector 335 moves synchronously with the first conveyor belt 334. Through the sliding cooperation between the first slider 35 and the first slide rail 311, the precise guidance in the first direction is realized. At the same time, the nozzle body 373 It can move synchronously with the first belt connector 335 to realize the displacement of the suction nozzle body 373 in the first direction. Optionally, the first driving source 331 includes a servo motor and a reducer, and the output end of the reducer is connected to the first driving wheel 332 . Optionally, in order to improve the stability of the suction nozzle assembly 37 moving along the first slide rail 311, referring to FIG. There are also two first sliders 35 on the top, and each first slider 35 is correspondingly slidably arranged on a first slide rail 311. The setting of the two first slide rails 311 improves the movement of the suction nozzle assembly 37. stability, and also improves the accuracy of transfer along the first direction. Of course, in actual implementation, the number of the first sliding rails 311 is not limited to two in this embodiment, and more can also be provided. Optionally, the first driving source 331 and the first base body 31 are fixed by a first mounting plate, and the first driven wheel 333 and the first base body 31 are relatively fixed by a first mounting bracket 336 to satisfy the transmission operation of the first conveyor belt 334 . Optionally, the first base body 31 can be made of a section bar, and a chute along the first direction is provided on the section bar. The first mounting frame 336 is provided with a first threaded through hole, and the second bolt is sequentially screwed into the first threaded through hole and the first threaded through hole. In the chute, the first mounting frame 336 is fixed on the first substrate 31, and the tension of the first conveyor belt 334 can be adjusted by fine-tuning the position of the first mounting frame 336 on the profile to ensure the smooth progress of the conveying process.

The second driving assembly 34 includes a second driving source 341, a second driving wheel 342, a second driven wheel 343, a second conveyor belt 344 wound around the second driving wheel 342 and the second driven wheel 343 and fixed on the second conveyor belt. 344 on the second belt connector 345, the second belt connector 345 is connected to the first base 31, so that when the second driving source 341 drives the second conveyor belt 344 to rotate, the second conveyor belt 344 can drive the entire first base 31 to move. In order to ensure that the first base body 31 and the suction nozzle body 373 on it move along the second direction, a second slide rail 321 is provided on the upper part of the second base body 32, and a second slider 36 is provided on the lower part of the first base body 31. The sliding fit of the two sliding blocks 36 on the second sliding rail 321 realizes the precise guiding of the first base 31 along the second direction. Optionally, in this embodiment, the second drive assembly 34 is located in the middle of the second base 32, and there are two second slide rails 321, and the two second slide rails 321 are symmetrically arranged on the second drive assembly The two sides of 34 are arranged in such a way that the driving force can be evenly transmitted, so that the whole first base body 31 can move uniformly and synchronously along the second direction, avoiding the deviation of a certain side. Optionally, the structure of the second driving source 341 is the same as that of the first driving source 331 , and both use a servo motor and a reducer to generate driving force. Optionally, a receiving groove 323 is provided on the second base body 32, and the second driving assembly 34 is located in the receiving groove 323 to hide the second driving assembly 34, which can not only avoid contact with the suction nozzle moving along the first slide rail 311 The assembly 37 interferes and also reduces the size of the automatic wafer tester. Further optionally, the second driving source 341 and the second base body 32 are fixed by the second mounting plate, and the second driven wheel 343 and the second base body 32 are relatively fixed by the second mounting frame 346, so as to satisfy the transmission operation of the second conveyor belt 344 . Optionally, the second base body 32 is provided with a second threaded through hole, and the second mounting frame 346 is provided with an adjusting elongated hole, and the third bolt is sequentially screwed into the adjusting elongated hole and the second threaded through hole, and the The second mounting bracket 346 is fixed on the second base body 32 , and by fine-tuning the position of the third bolt in the adjustment slot, the tension of the second conveyor belt 344 can be changed to improve the transmission efficiency.

Further, referring to Fig. 8 and Fig. 9, the nozzle assembly 37 includes a nozzle cylinder 371, a nozzle fixing plate 372 and a nozzle body 373 arranged on the nozzle fixing plate 372, the output end of the nozzle cylinder 371 is connected to the nozzle The fixed plate 372 is connected, and then drives the suction nozzle fixed plate 372 and the suction nozzle body 373 to rise and fall, thereby completing the feeding and unloading of the material tray 100 or wafer; further, the suction nozzle assembly 37 also includes an air control valve 374, a suction nozzle cylinder The input end of 371 is connected with the air control valve 374, and the air control valve 374 communicates with the electric control device of the testing machine, and receives the signal of the electric control device to control the action of the suction nozzle cylinder 371. Optionally, a first fixing plate 3351 is provided above the first belt connecting member 335, and a second fixing plate 3352 is arranged below the first belt connecting member 335, and the second fixing plate 3352 can optionally be connected with the first belt connecting member 335 vertical connection; the first fixed plate 3351 is connected with an air control valve 374, the second fixed plate 3352 is provided with a nozzle cylinder 371, and the output end of the nozzle cylinder 371 extends vertically downwards from the second fixed plate 3352 to connect with the suction The nozzle fixing plate 372 is connected to drive the nozzle fixing plate 372 closer to or away from the second fixing plate 3352; the setting of the first fixing plate 3351 and the second fixing plate 3352 enables the nozzle assembly 37 to follow the first belt connector 335 as a whole The synchronous movement along the first sliding rail 311 ensures the stability and consistency of the suction nozzle assembly 37 when working. Further, one of the nozzle fixing plate 372 and the second fixing plate 3352 is provided with a second guide rod 375, and the other is provided with a second guide through hole, and the second guide rod 375 is inserted into the second guide through hole In order to realize the guiding function when the suction nozzle cylinder 371 drives the suction nozzle fixing plate 372 up and down, to avoid the deviation of the suction nozzle body 373 and the inability to accurately take and unload materials. In this embodiment, the second guide rod 375 is disposed on the nozzle fixing plate 372 , and the second guiding through hole is disposed on the second fixing plate 3352 . Optionally, a second guide sleeve is provided on the second fixing plate 3352 , and the second guide sleeve is sleeved on the periphery of the second guide rod 375 to ensure the guiding function of the second guide rod 375 .

In this embodiment, there are multiple suction nozzle bodies 373, which can be divided into three types according to the different objects to be sucked. One is the suction nozzle body of the tray, which is used to suck the tray 100 and transfer the tray 100 to the Measuring material tray device moves to empty material tray device, or moves to sorting material tray device by empty material tray device; The wafer to be tested is moved to the test device 4; the third type is the blanking nozzle body, which is used to suck the tested wafer on the test device 4 and move it to the corresponding sorting tray according to the test results On the tray 100 of the device. Further, the number of each type of nozzle body 373 is not specifically limited, but each type of nozzle body 373 is correspondingly provided with a nozzle fixing plate 372 and a nozzle cylinder 371, so that different types of nozzle bodies 373 Action does not interfere. Specifically, in this embodiment, since the tray device 2 has a rectangular structure, four tray suction nozzle bodies are provided, and the four tray suction nozzle bodies are distributed in a rectangular shape on their corresponding suction nozzle fixing plates 372, and Each tray suction nozzle body can correspond to one side of the suction tray 100, which ensures the strong suction of the tray 100, and then the smooth progress of the transfer process; in addition, in this embodiment, the suction nozzle body and the The blanking suction nozzle body is all arranged as one, and is respectively fixed on the corresponding suction nozzle fixing plate 372, and is driven up and down by the corresponding suction nozzle cylinder. Optionally, at least two second guide through holes are provided on each nozzle fixing plate 372 to guide the corresponding nozzle body 373 .

Optionally, in this embodiment, protective covers are provided on the outer sides of the first driving wheel 332, the first driven wheel 333, the second driving wheel 342 and the second driven wheel 343, so as to maintain the appearance of the entire testing machine. At the same time, prevent persons from coming into contact with the drive components. Further, referring to FIG. 7 , two second photoelectric switches 312 are arranged on the first substrate 31 , and the two second photoelectric switches 312 are arranged at intervals along the first direction, and their positions respectively represent the positions of the suction nozzle assembly 37 along the first direction. The two extreme positions that can be reached in the direction, correspondingly, a second light-shielding plate is provided on the first fixing plate 3351, and when the first conveyor belt 334 drives the first fixing plate 3351 to move along the first direction, the second light-shielding plate can It is located at the transmitting end and the receiving end of the second photoelectric switch 312 to generate a signal for the suction nozzle assembly 37 to move there, and transmit it to the electric control device. Similarly, two third photoelectric switches 322 are arranged at intervals on the second substrate 32, and are arranged beside the second slide rail 321, respectively representing the two positions that the suction nozzle assembly 37 can reach along the second direction. Limit position; Correspondingly, on the second slide block 36, be provided with the 3rd shading plate, when the second conveyor belt 344 drives the 2nd slide block 36 to move along the second direction, the 3rd shading plate can be positioned at the 3rd photoelectric switch 322 The transmitting end and the receiving end are used to generate a signal that the suction nozzle assembly 37 moves there, and transmit it to the electric control device.

Embodiment four

This embodiment is to provide a testing device 4 that can be used in the wafer automatic testing machine in the first embodiment to complete the testing of the wafer. Specifically, with reference to Fig. 10 and Fig. 11, test device 4 includes being located at support mechanism 41, lifting mechanism 42, test bench assembly 43 and test board assembly 44, and support mechanism 41 plays the effect of supporting whole test device 4; Test bench assembly 43 includes a test bench 431, which is used to place the wafer to be tested; the test board assembly 44 includes a test board 441, and the lifting mechanism 42 is used to drive the test bench 431 to lift, so that the wafer to be tested placed thereon is in contact with the test board 441, and the test is completed. . Further, the test device 4 can output the test results to the electric control device, the electric control device determines the classification level of the wafer according to the test results, and transmits the signal to the transfer device 3, and the transfer device 3 will test the completed wafer according to the signal instruction Transfer to the tray 100 of the corresponding sorting tray device.

Further, the test platform assembly 43 further includes a carrier 432 , the test platform 431 is arranged on the upper part of the carrier 432 , and the upper surface of the test platform 431 is provided with a test plane, and the wafer is placed on the test plane. Since the position of the test board 441 remains relatively fixed during the testing process, in order to ensure that the wafers are in full contact with the test board 441 every time, the placement position of each wafer to be tested on the test plane should be kept fixed. In order to solve the above problems, with reference to Fig. 12, the test bench assembly 43 also includes a positioning bar 433 located on the test plane and a pushing structure 434 located on the test bench 431, the positioning bar 433 protrudes from the test plane, and the wafer to be tested is placed on After testing the plane, the pushing structure 434 can push the wafer to be tested until it abuts against the side wall of the positioning bar 433 , thereby completing the positioning of the wafer to be tested. Furthermore, the shape and structure of the wafer to be tested is adapted to the shape and structure surrounded by the side walls of the positioning bar 433 to ensure sufficient contact between the wafer and the side walls of the positioning bar 433 and maintain the stability of the wafer position. Optionally, in this embodiment, the wafer is set to a regular rectangular structure, so a first positioning bar 433 and a second positioning bar 433 perpendicular to each other can be provided on the test plane, both protruding from the test plane by a certain height, And one end of the first positioning bar 433 abuts against the side wall of the second positioning bar 433, so that the side walls of the first positioning bar 433 and the second positioning bar 433 form a right angle structure; when the wafer is placed on the test plane, use The pushing structure 434 repeatedly pushes the wafer to be tested so that its two sides perpendicular to each other can abut against the side walls of the first positioning bar 433 and the second positioning bar 433 respectively, and the wafer to be tested reaches a fixed position and is in this position. The wafer to be tested at the position can be fully contacted with the test board 441 after being raised, so as to ensure the smooth progress of the test. Further, the first positioning bar 433 extends along the fourth direction, the second positioning bar 433 extends along the fifth direction, and the fifth direction and the fourth direction are perpendicular to each other. In this embodiment, both the fourth direction and the fifth direction are parallel to the horizontal plane.

Specifically, referring to FIG. 12 again, the pushing structure 434 includes a pushing cylinder 4341, a pushing plate 4342 connected to the output end of the pushing cylinder 4341, a plurality of pushing pins 4343 arranged on the pushing plate 4342, and the free ends of the pushing pins 4343 can be connected with The wafers to be tested placed on the test table 431 are in contact with each other. In practice, the push cylinder 4341 moves to drive the push plate 4342 and the push pin 4343 on it to move in a specific direction until the wafer to be tested on the test plane is pushed to abut against the side wall of the positioning bar 433 . Optionally, in order to increase the accuracy of the pushing direction, the pushing structure 434 also includes a third guide rod 4344 arranged on the test bench 431 and a third guide through hole arranged on the pushing plate 4342, the third guide rod 4344 is arranged on In the third guide through hole, the sliding guide of the push plate 4342 is realized. Optionally, a third guide sleeve is provided in the third guide through hole to ensure smooth relative sliding of the third guide rod 4344 . Further, the pushing structure 434 includes two, respectively a first pushing structure and a second pushing structure, which are respectively used to push the wafer to be tested along the fourth direction and the fifth direction. Therefore, the pushing direction of the pushing cylinder 4341 of the first pushing structure and the second pushing structure is consistent with the fourth direction and the fifth direction respectively, and the extending direction of the pushing pin 4343 and the third guide rod 4344 is also consistent with the pushing direction. Optionally, in this embodiment, the test platform 431 is a cuboid structure, and the first pushing structure and the second pushing structure are respectively arranged on two sides of the testing platform 431 perpendicular to each other. Further optionally, in order to ensure the stability of pushing the thimble 4343 along the fourth direction or the fifth direction, a thimble groove can be set on the test plane, the thimble groove extends along the fourth direction or the fifth direction, and the thimble 4343 is pushed to be arranged on the thimble In the groove, the offset of the push pin 4343 is further limited, ensuring that the push pin 4343 can move in a specific direction; the push pin 4343 protrudes from the test plane to a certain height, so as to contact the wafer to be tested to complete the push. Optionally, according to the size of the wafer, the number of pushing pins 4343 of each pushing structure 434 can be two, three or more, so as to fully contact with the wafer and push the wafer evenly.

11 and 13, the support mechanism 41 includes a support top plate 411 and a support bottom plate 412 arranged parallel to each other at intervals, and a support vertical plate 413 vertically arranged between the support top plate 411 and the support bottom plate 412, the support bottom plate 412 and the load plate 14 To connect, the test board assembly 44 is set on the support top plate 411 , and the test bench assembly 43 is set between the support top plate 411 and the support bottom plate 412 . Further, in order to improve the stability of the support mechanism 41, the support vertical plate 413 is also provided with a support support plate 414 parallel to the support bottom plate 412, and the support support plate 414 and the support bottom plate 412 are connected by a support rod 415, so as to The supporting function of the supporting mechanism 41 is strengthened. Optionally, the test bench assembly 43 and the support rod 415 are located on opposite sides of the support vertical plate 413 , which can prevent the support rod 415 from interfering with the test bench assembly 43 and further improve the stability of the support vertical plate 413 .

10 and 13, the lifting mechanism 42 includes a lifting drive source 421 and a first connecting plate 422 connected to the output end of the lifting driving source 421, and the first connecting plate 422 is connected to the carrier 432 of the test bench assembly 43 through a second connection. The boards 49 are connected together, and the lifting driving source 421 drives the first connecting board 422 , the second connecting board 49 and the stage 432 to move up and down along the third direction, so that the test bench assembly 43 and the test board assembly 44 are approached and separated. In this embodiment, the third direction is the vertical direction, which is perpendicular to the horizontal plane, and can be understood as the Z axis in the Cartesian coordinate system. Optionally, the lifting driving source 421 adopts a rodless cylinder, the main body of the rodless cylinder is fixed on the support vertical plate 413, the lifting slider of the rodless cylinder is connected with the first connecting plate 422, and the lifting slider drives the first connecting plate 422 moves. In some other embodiments, the lifting driving source 421 may also adopt a screw nut lifting structure or a rack and pinion lifting structure. Further, the lifting mechanism 42 and the test bench assembly 43 are located on the opposite side of the supporting vertical plate 413, that is, the lifting mechanism 42 is arranged between the supporting support plate 414 and the supporting bottom plate 412, so that the lifting mechanism 42 will not interfere with the movement of the test bench assembly 43 . Optionally, there are two second connecting plates 49 , and the two second connecting plates 49 are distributed symmetrically with respect to the support vertical plate 413 , so that the test bench assembly 43 is lifted and lowered evenly under force. Optionally, referring to FIG. 13 , in order to prevent the device from being damaged due to the rising or falling height of the test bench assembly 43 beyond the preset range, two fourth photoelectric switches 4131 are respectively arranged on the upper and lower parts of the support vertical plate 413, representing the test bench 431 respectively. The limit position that can rise and fall, the fourth shading plate 361 is set on the second connecting plate 49, when the second connecting plate 49 drives the test bench assembly 43 to lift to the fourth shading plate 361 is located at the emission end of the fourth photoelectric switch 4131 When connecting with the receiving end, the fourth photoelectric switch 4131 is triggered to generate a signal to prevent the test platform 431 from moving up and down further. Further, in order to buffer the impact of the test board 441 contacting the wafer, a buffer structure 45 is respectively provided on the upper and lower parts of the first connecting plate 422. When the first connecting plate 422 is about to rise or about to fall to the limit position, the buffer structure will 45 can be in contact with the support bottom plate 412 or the support top plate 411 to play a buffering effect. Optionally, the buffer structure 45 includes a buffer connection block 451 and a buffer 452 vertically disposed on the buffer connection block 451 , and the buffer connection block 451 is connected to the first connection plate 422 . Optionally, the second connection plate 49 can be directly connected to the buffer connection block 451 to realize synchronous driving of the buffer 452 and the test bench assembly 43 by the first connection plate 422 . In this embodiment, the buffer 452 is selected to use AirTAC's ACA-1007 oil pressure buffer.

Further, in order to improve the accuracy of the lifting mechanism 42 driving the test bench 431 to lift up and down in the third direction, a linear guide rail structure 46 is also provided between the test bench assembly 43 and the support vertical plate 413, specifically, referring to FIGS. 10 , 11 and 15 , the linear guide rail structure 46 includes a third slide block 461 provided on the stage 432 and a third slide rail 462 provided on the support vertical plate 413, the third slide rail 462 extends along the third direction, and the third slide block 461 slides It is arranged on the third slide rail 462 to realize the sliding guide of the test bench assembly 43 in the third direction. Optionally, the carrier platform 432 is connected to the third slider 461 through a third connecting plate, and at the same time, the third connecting plate is connected vertically to the second connecting plate 49 to improve the stability of the test platform 431 in lifting.

Specifically, referring to FIG. 11 , the test board assembly 44 also includes a pressing plate 442 arranged below the supporting top plate 411. There are two pressing plates 442, and they are respectively located on both sides of the supporting top plate 411 along the length direction. Below each pressing plate 442 Each is provided with a spring plate 443, and the spring plate 443 uses its own elastic force to sandwich the test plate 441 between the pressure plate 442 and the spring plate 443; the pressure plate 442 has a certain thickness, so that there is a gap between the test plate 441 and the supporting top plate 411, To buffer the impact that occurs when the wafer is in contact with the test board 441 , to achieve uniform and sufficient contact between the wafer and the test board 441 . Optionally, the side of the supporting top plate 411 is further provided with a limit block 444 , which acts as a limit when the test board 441 is installed.

In order to improve the test accuracy, before each use, the test bench 431 needs to be calibrated and adjusted, so that the pre-placed position of the wafer to be tested on the test plane can correspond to the test board 441 as much as possible, so that the test bench 431 is raised and waits for a test. The full contact of wafer and test plate 441 is tested. Specifically, with reference to Figures 10, 14 and 15, the test device 4 includes an angle adjustment mechanism 40, and the angle adjustment mechanism 40 includes a rotary table 401 that is rotated on a carrier 432, and the rotary table 401 and the carrier 432 rotate through a bearing structure connected, and at the same time, the test platform 431 is arranged on the top of the rotary table 401, and the test platform 431 can rotate with the rotary table 401 relative to the carrier 432 to adjust the angle of the test platform 431 in the horizontal plane. Further, the angle adjustment mechanism 40 also includes an adjustment column 403 vertically arranged at the bottom of the rotary table 401. The adjustment column 403 vertically runs through the entire carrier 432 and is rotationally connected with the carrier 432 through the above-mentioned bearing structure. The optional adjustment column 403 is a cylinder shaped structure; the bottom of the adjusting column 403 is provided with an adjusting lever 404, which can be driven to rotate the adjusting column 403 and the rotary table 401 to facilitate the operation of the staff. Further, the axis of the adjustment rod 404 is perpendicular to the axis of the adjustment column 403 , so that the adjustment column 403 and the rotary table 401 can be driven to rotate with a relatively small thrust. Optionally, the adjustment rod 404 is arranged vertically through the entire adjustment column 403 to increase the interaction area between the adjustment rod 404 and the adjustment column 403 , so that the adjustment rod 404 pushes the adjustment column 403 more conveniently and labor-saving. Further, in order to adjust the angle of the test bench 431 within a certain range and avoid excessive deflection of the test bench 431, an adjustment block 402 is provided on the side of the carrier table 432, and an adjustment block 402 is provided on the side wall near the adjustment column 403. There is a strip groove 4021 (refer to Figure 14 for details), the extension direction of the strip groove 4021 is located in the horizontal plane, the free end of the adjusting rod 404 is arranged in the strip groove 4021, and the free end of the adjusting rod 404 is in the strip groove 4021 If the positions are different, the adjustment column 403 and the rotary table 401 will rotate at different angles until the free end of the adjustment rod 404 abuts against the groove wall at the end of the strip groove 4021 to stop the further movement of the adjustment rod 404 and make the rotation work The stage 401 performs angle adjustment within a limited angle range to avoid excessive adjustment. Further, in order to quantify the angle adjustment, a first screw differential head 405 is provided on the adjustment block 402, and the measuring rod of the first screw differential head 405 extends into the inside of the adjustment block 402 and abuts against the side wall of the adjustment rod 404, Rotate the fine-tuning knob of the first screw differential head 405 to change the extension length of the measuring rod, and then drive the adjustment rod 404 to move in the bar groove 4021, and the adjustment angle of the adjustment rod 404 can be understood through the reading of the first screw differential head 405 , to realize the quantization of angle adjustment. Further, the measuring rod of the first screw differential head 405 is in vertical contact with the adjusting rod 404 . Further, the adjustment block 402 is also provided with a first locking bolt 406 , after the angle adjustment is completed, the first locking bolt 406 locks the adjustment rod 404 to limit its further movement and keep the angle of the test bench 431 fixed. Optionally, the side wall between the lower part of the stage 432 and the upper part of the adjustment rod 404 on the adjustment column 403 is also provided with an external thread, and the locking nut 407 locks the adjustment column 403 and the bearing structure through a threaded connection to ensure adjustment. The column 403 can drive the rotary table 401 to rotate on the same horizontal plane without deviation.

Further, with reference to Figures 10, 11 and 12, the test device 4 also includes a displacement adjustment mechanism 47, and the displacement adjustment mechanism 47 includes a cross-rail displacement platform 471 arranged between the rotary table 401 and the test bench 431, and the cross-rail displacement platform 471 The whole is set on the rotary table 401, and can rotate synchronously with the rotary table 401; the loading surface of the cross guide rail displacement platform 471 is connected with the bottom surface of the test table 431, and then drives the test table assembly 43 to move synchronously with the loading surface as a whole . Optionally, the intersecting guide rail displacement platform 471 in this embodiment is mainly used to realize the displacement of the test bench 431 along the fourth direction and the fifth direction, so on two mutually perpendicular side walls of the intersecting guide rail displacement platform 471 A second spiral differential 472 head and a second spiral differential 472 head are provided to realize the quantification of the displacement of the test bench 431 in two directions. Further, the two mutually vertical side walls of the intersecting guide rail displacement platform 471 are respectively provided with a second locking bolt 473 and a third locking bolt. , and then use the second locking bolt 473 and the third locking bolt to lock the loading surface of the cross rail displacement platform 471 so that it cannot move anymore.

Through the arrangement of the above-mentioned angle adjustment mechanism 40 and displacement adjustment mechanism 47, the test table 431 can be rotated on the horizontal plane, and the displacement adjustment in the fourth direction and the fifth direction can be performed, so that the test board 441 corresponds to the wafer to be tested. But in the third direction, due to the different thicknesses between different wafers and different test boards 441, before mass testing, it is necessary to calibrate and adjust the height between the supporting top plate 411 and the supporting bottom plate 412 of the test device 4 to ensure the lifting The mechanism 42 is driven by the lifting of the specific lifting distance in the cycle, and the wafer to be tested can always fully contact the test board 441. Therefore, the testing device 4 also includes a height adjustment mechanism 48. Referring to FIGS. 10 and 14, the height adjustment mechanism 48 includes a device The third screw differential head 481 on the support top plate 411, the measuring rod of the third screw differential head 481 extends along the third direction, after passing through the support top plate 411, it abuts against the top surface of the support vertical plate 413, and rotates the third screw differential head 481. The fine-tuning knob of the differential head 481 changes the protruding length of the measuring rod, and then drives the support top plate 411 to approach or move away from the support bottom plate 412 along the third direction, thereby changing the test plate 441 and the test bench 431 arranged on the support top plate 411 The distance between them is until the wafer to be tested can be fully contacted with the test board 441 under a specific lifting displacement. Further, the support top plate 411 and the support vertical plate 413 are slidingly connected by the cross guide rail structure 482, the cross guide rail structure 482 can realize the high-precision and smooth linear motion of the support top plate 411 relative to the support vertical plate 413, and improve the support top plate 411 along the first The accuracy of movement in three directions, further, the cross guide rail structure 482 includes a fourth slide rail arranged on the support vertical plate 413 and a fourth slide block provided on the support top plate 411, the fourth slide rail extends along the third direction, In order to realize the guiding of the supporting top plate 411 in the third direction. Optionally, there are two cross rail structures 482, which are located on both sides of the supporting top plate 411 respectively. Further, the height adjustment mechanism 48 also includes a fourth locking bolt 483, which locks the cross guide rail structure 482 after the height adjustment of the support top plate 411 is completed, so as to avoid relative sliding between the fourth slider and the fourth slide rail.

Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention, and the present invention The scope is determined by the scope of the appended claims.

Claims (10)

1. a kind of test device, including testboard (431), which is characterized in that further include that microscope carrier (432) and rotation are set to the load Rotary table (401) on platform (432), the testboard (431) are set to the top of the rotary table (401)；It is described Rotary table (401) bottom be equipped with adjustable column (403), the adjustable column (403) through the microscope carrier (432) and with the load Platform (432) rotation connection；The bottom of the adjustable column (403) is equipped with adjusting rod (404), pushes the adjusting rod (404), described Adjusting rod (404) is able to drive the adjustable column (403) and the rotary table (401) rotation.

2. test device according to claim 1, which is characterized in that the axis of the adjusting rod (404) and the adjusting The axis perpendicular of column (403).

3. test device according to claim 2, which is characterized in that the adjusting rod (404) is configured to vertically Through the adjustable column (403).

4. test device according to claim 1, which is characterized in that the side of the microscope carrier (432) is equipped with adjusting block (402), the adjusting block (402) is equipped with strip groove (4021) close to the side of the adjustable column (403), the adjusting rod (404) free end is set in the strip groove (4021).

5. test device according to claim 4, which is characterized in that be additionally provided with the first spiral shell on the adjusting block (402) Revolve differential head (405), the measuring staff of the first spiral differential head (405) can extend into the adjusting block (402) it is internal and with institute Adjusting rod (404) abutting is stated, the vernier knob of the first spiral differential head (405) is rotated, changes the first spiral differential The measuring staff extension elongation of head (405), and then the adjusting rod (404) is driven to move in the strip groove (4021).

6. test device according to claim 4, which is characterized in that be additionally provided with the first locking on the adjusting block (402) Bolt (406), first clamping screw (406) are configured to lock the adjusting rod (404).

7. test device according to claim 1, which is characterized in that the test device further include elevating mechanism (42) and Supporting mechanism (41), the supporting mechanism (41) include being parallel to each other and spaced roof supporting (411) and support baseboard (412), and set on the support riser (413) between the roof supporting (411) and the support baseboard (412), the load Platform (432) is set between the roof supporting (411) and the support baseboard (412), and the elevating mechanism (42) is configured as The microscope carrier (432) can be driven close to or far from the roof supporting (411).

8. test device according to claim 7, which is characterized in that the test device further includes height adjustment mechanism (48), the height adjustment mechanism (48) is configured to adjust the roof supporting (411) relative to the support baseboard (412) height.

9. test device according to claim 8, which is characterized in that the height adjustment mechanism (48) includes set on described The measuring staff of third spiral differential head (481) on roof supporting (411), the third spiral differential head (481) passes through the branch Support plate (411) is abutted with the top surface of support riser (413) afterwards, rotates the fine tuning of the third spiral differential head (481) Knob changes the measuring staff extension elongation of the third spiral differential head (481), and then drives the roof supporting (411) opposite The support baseboard (412) close to or far from.

10. a kind of wafer automatic testing machine, which is characterized in that including the described in any item test devices of claim 1-9.