CN110320462A - A kind of test device and wafer automatic testing machine - Google Patents
A kind of test device and wafer automatic testing machine Download PDFInfo
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- CN110320462A CN110320462A CN201910600069.0A CN201910600069A CN110320462A CN 110320462 A CN110320462 A CN 110320462A CN 201910600069 A CN201910600069 A CN 201910600069A CN 110320462 A CN110320462 A CN 110320462A
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- test device
- adjusting rod
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- 238000012360 testing method Methods 0.000 title claims abstract description 152
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- 235000012431 wafers Nutrition 0.000 description 30
- 238000006073 displacement reaction Methods 0.000 description 14
- 230000005693 optoelectronics Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Abstract
The invention discloses a kind of test device and wafer automatic testing machines, belong to wafer sort technical field.The test device includes testboard, further includes the rotary table of microscope carrier and rotation on the microscope carrier, and the testboard is set to the top of the rotary table；The rotary table bottom is equipped with adjustable column, and the adjustable column is rotatablely connected through the microscope carrier and with the microscope carrier；The bottom of the adjustable column is equipped with adjusting rod, pushes the adjusting rod, and the adjusting rod is able to drive the adjustable column and rotary table rotation.A kind of wafer automatic testing machine, including above-mentioned test device.Rotary table is rotatablely connected with microscope carrier by the way that testboard to be set on rotary table and realizes that the position in horizontal plane of testboard is adjustable by the present invention.
Description
Technical field
The present invention relates to wafer sort technical field more particularly to a kind of test device and wafer automatic testing machines.
Background technique
In existing wafer automatic testing machine, chip to be measured is placed on the jig of test fixture, and and test board
On probe contact, complete program test, obtain test result.But according to the dimensional structure and test board of the chip of detection
The difference of dimensional structure needs adaptability regulating jig in the position of horizontal plane, so that chip comes into full contact with test board, guarantees
Test process is gone on smoothly.
It would therefore be highly desirable to provide a kind of test device and wafer automatic testing machine solves the above problems.
Summary of the invention
The purpose of the present invention is to provide a kind of test device and wafer automatic testing machines, can be realized testboard in level
Position on face is adjusted.
To achieve the above object, the following technical schemes are provided:
A kind of test device, including testboard further include the rotary table of microscope carrier and rotation on the microscope carrier, institute
State the top that testboard is set to the rotary table；The rotary table bottom is equipped with adjustable column, and the adjustable column runs through
The microscope carrier is simultaneously rotatablely connected with the microscope carrier；The bottom of the adjustable column is equipped with adjusting rod, pushes the adjusting rod, the tune
Pole is able to drive the adjustable column and rotary table rotation.
Preferably, the axis perpendicular of the axis of the adjusting rod and the adjustable column.
Preferably, the adjusting rod is configured to extend vertically through the adjustable column.
Preferably, the side of the microscope carrier is equipped with adjusting block, the adjusting block is equipped with close to the side of the adjustable column
The free end of strip groove, the adjusting rod is set in the strip groove.
Preferably, the first spiral differential head is additionally provided on the adjusting block, the measuring staff of the first spiral differential head
It can extend into inside the adjusting block and abutted with the adjusting rod, rotate the vernier knob of the first spiral differential head, change
Become the measuring staff extension elongation of the first spiral differential head, and then the adjusting rod is driven to move in the strip groove.
Preferably, being additionally provided with the first clamping screw on the adjusting block, first clamping screw is configured to
Lock the adjusting rod.
Preferably, the test device further includes elevating mechanism and supporting mechanism, the supporting mechanism includes mutually flat
Capable and spaced roof supporting and support baseboard, and the support between the roof supporting and the support baseboard
Riser, the microscope carrier are set between the roof supporting and the support baseboard, and the elevating mechanism is configured to drive
The microscope carrier is close to or far from the roof supporting.
Preferably, the test device further includes height adjustment mechanism, the height adjustment mechanism is configured to
Adjust height of the roof supporting relative to the support baseboard.
Preferably, the height adjustment mechanism includes the third spiral differential head on the roof supporting, it is described
The measuring staff of third spiral differential head abuts after passing through the roof supporting with the top surface of the support riser, rotates the third spiral shell
The vernier knob for revolving differential head changes the measuring staff extension elongation of the third spiral differential head, and then drives the roof supporting
The relatively described support baseboard close to or far from.
A kind of wafer automatic testing machine, including test device described in any of the above-described scheme.
Compared with prior art, beneficial effects of the present invention:
Rotary table and microscope carrier are rotatablely connected by the present invention by the way that testboard to be set on rotary table, are utilized
It pushes adjusting rod to complete the rotation of rotary table and testboard, realizes that the position in horizontal plane of testboard is adjustable, so that surveying
The chip placed in test stand can come into full contact with test board, guarantee going on smoothly for test process.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of wafer automatic testing machine in the embodiment of the present invention；
Fig. 2 is a kind of front view of wafer automatic testing machine in the embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of rack in the embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of tray device in the embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of charging tray in the embodiment of the present invention；
Fig. 6 is the partial enlargement diagram in Fig. 4 at A；
Fig. 7 is a kind of structural schematic diagram of shifting apparatus in the embodiment of the present invention；
Fig. 8 is the structural schematic diagram in the embodiment of the present invention after a kind of the second matrix of shifting apparatus removal；
Fig. 9 is the partial enlargement diagram in Fig. 8 at B；
Figure 10 is a kind of structural schematic diagram of test device in the embodiment of the present invention；
Figure 11 is a kind of side view of test device in the embodiment of the present invention；
Figure 12 is the partial enlargement diagram in Figure 10 at C；
Figure 13 is a kind of partial structure diagram one of test device in the embodiment of the present invention；
Figure 14 is a kind of partial structure diagram two of test device in the embodiment of the present invention；
Figure 15 is a kind of partial structure diagram three of test device in the embodiment of the present invention.
Appended drawing reference:
100- charging tray；101- groove；
1- rack；11- main body；12- carrying platform；121- through slot；13- baffle；14- loading plate；
2- tray device；21- installs top plate；211- emission sensor；22- mounting base；23- connecting rod；24- charging tray
Tray；The first driving mechanism of 25-；251- lifting platform；The first barn door of 2511-；252- driving motor；The first optoelectronic switch of 26-；
27- locating piece；28- guide pad；281- interconnecting piece；282- guide part；The first guide surface of 2821-；The second guide surface of 2822-；
2823- positioning surface；
3- shifting apparatus；The first matrix of 31-；The first sliding rail of 311-；The second optoelectronic switch of 312-；The second matrix of 32-；321-
Second sliding rail；322- third optoelectronic switch；323- holding tank；The first driving assembly of 33-；The first driving source of 331-；332- first
Driving wheel；The first driven wheel of 333-；The first conveyer belt of 334-；The first leather belt buckle of 335-；The first fixed plate of 3351-；3352-
Second fixed plate；The first mounting rack of 336-；The second driving assembly of 34-；The second driving source of 341-；The second driving wheel of 342-；343-
Second driven wheel；The second conveyer belt of 344-；The second leather belt buckle of 345-；The second mounting rack of 346-；The first sliding block of 35-；36-
Two sliding blocks；The 4th barn door of 361-；37- component suction nozzle；371- suction nozzle cylinder；372- suction nozzle fixed plate；373- suction nozzle body；
374- Pneumatic valve；The second guide rod of 375-；
4- test device；40- angle adjusting mechanism；401- rotary table；402- adjusting block；4021- strip groove；403-
Adjustable column；404- adjusting rod；405- the first spiral differential head；The first clamping screw of 406-；407- locking nut；41- supports machine
Structure；411- roof supporting；412- support baseboard；413- supports riser；The 4th optoelectronic switch of 4131-；414- supports supporting plate；415-
Support rod；42- elevating mechanism；421- goes up and down driving source；The first connecting plate of 422-；43- testboard component；431- testboard；
432- microscope carrier；433- positioning strip；434- pushing structure；4341- pusher cylinder；4342- pushing plate；4343- pushes thimble；
4344- third guide rod；44- test board component；441- test board；442- pressing plate；443- diving board；444- limits baffle；45- is slow
Rush structure；451- buffers link block；452- buffer；46- linear guide rail structure；461- third sliding block；462- third sliding rail；
47- is displaced regulating mechanism；471- cross slideway displacement platform；472- the second spiral differential；The second clamping screw of 473-；48- high
Spend regulating mechanism；481- third spiral differential head；482- cross slideway structure；The 4th clamping screw of 483-；The connection of 49- second
Plate；
5- display device.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that term " on ", "lower", "left", "right", "vertical", "horizontal",
The orientation or positional relationship of the instructions such as "inner", "outside" be based on the orientation or positional relationship shown in the drawings or the invention produce
Product using when the orientation or positional relationship usually put, be merely for convenience of description of the present invention and simplification of the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitation of the present invention.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and should not be understood as referring to
Show or imply relative importance.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or two with
On.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be
Mechanical connection, is also possible to be electrically connected.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
Embodiment one
With reference to shown in Fig. 1 and 2, present embodiment discloses a kind of wafer automatic testing machine, including rack 1, it is set in rack 1
Shifting apparatus 3, tray device 2, test device 4 and display device 5.Electric control gear is additionally provided in rack 1, electric control gear is main
The automatic of wafer sort is realized for controlling the timing movement for integrating each device of wafer automatic testing machine including PLC module
It is turned into industry.Display device 5 is configured to show the operating status and test result of each device, convenient for artificial prison in real time
Survey testing process.
Specifically, with reference to Fig. 3, rack 1 includes main body 11 and the carrying platform 12 set on 11 top of main body, main body
11 for accommodating electric control gear；Carrying platform 12 is for carrying shifting apparatus 3 and tray device 2；Optionally, carrying platform 12 is adopted
With marble material, shifting apparatus 3 and tray device 2 are supported to stablize.Rack 1 further includes enclosing set on 12 outside of carrying platform
Baffle 13；Baffle 13 is U-shaped structure, enables the shifting apparatus 3 by entire loading platform and thereon of baffle 13 and charging tray dress
It sets 2 to surround, prevent extraneous interference shifting apparatus 3 operation or touches tray device 2；Test device 4 is set to U-shaped baffle 13
Chip on tray device 2 is transferred in the test device 4 at open end convenient for shifting apparatus 3 and tests by open end.It can
Selection of land, rack 1 further include loading plate 14, and test device 4 is just set on the loading plate 14.One end of loading plate 14 and main body 11
It is detachably connected, the other end is detachably connected with carrying platform 12, and guarantee test device 4 is steady with 2 positional relationship of tray device
It is fixed.Further, the steady of the carrying of loading plate 14 is improved by the stiffening plate connection of wedge shape between loading plate 14 and carrying platform 12
It is qualitative.Optionally, display device 5 is set on the side wall of main body 11 by gimbals, and making it neither influences entire automatic survey
The test process of test-run a machine, additionally it is possible to carry out the flexible transformation of placement location.
In order to improve the efficiency of wafer sort, test device 4 is provided with multiple, and multiple test devices 4 are in along first direction
Linear array.In the present embodiment, there are five test device 4 is set, therefore the test of five chips can be carried out simultaneously, significantly improved
The efficiency of wafer sort；Certainly in some other embodiments, according to the shifting of the testing time of each chip and shifting apparatus 3
The restriction of dynamic speed, the setting quantity of test device 4 or the test device 4 in use state can be specifically limited again.
Tray device 2 is placed with chip on charging tray 100 for carrying charging tray 100.Tray device 2 be provided with it is multiple, it is multiple
Tray device 2 can be divided into three classes, and the first kind is empty tray device, the empty tray placed for carrying no chip, and the second class is
Tray device to be measured is placed with not tested chip on the charging tray 100 carried, and third class is classification tray device, by
Multiple grades can be divided into the test result of chip, therefore are also according to the grade classification of test result by classification tray device
Multiple, each grade corresponds to a classification tray device, and the chip for testing completion is placed in representative accordingly according to test result
On the charging tray 100 of the classification tray device of grade.The setting of above-mentioned three classes tray device 2, enable automatic test machine according to
Test result carries out the classified storage of chip automatically, effectively improves automation, the intelligence degree of wafer sort.This implementation
In example, tray device 2 is provided with 12, and 12 tray devices 2 are optionally distributed on carrying platform 12 in matrix,
In, an empty tray device, a tray device to be measured, ten classification tray devices are set.Certainly, when it is implemented, according to
The quantity of the grade classification of wafer test results, tray device of classifying can be specifically limited again；Meanwhile empty tray device and to be measured
The number of tray device is set as at least one；The difference for 100 number of charging tray that can be carried according to each tray device 2,
The difference etc. of the transfer mode of the difference and shifting apparatus 3 for the chip number that can be placed on each charging tray 100, empty tray device
And tray device to be measured may be configured as it is multiple.
It is remaining after the completion of all wafers of the charging tray 100 carried on tray device to be measured are drawn in the present embodiment
Empty tray will be transferred on empty tray device by shifting apparatus 3；For empty tray device, the empty tray carried thereon again may be used
It is transferred on corresponding classification tray device by shifting apparatus 3, for storing classifiedly the chip that test is completed；It is achieved in sky
Turnover of charging tray during wafer sort utilizes, and while improving the utilization rate of charging tray 100, further improves chip
Automatically the testing efficiency and intelligence degree tested.When it is implemented, should guarantee empty tray in automatic test machine initial start
Device is provided with several empty trays, realizes the continuity of empty tray transfer between tray device 2 not of the same race.
Embodiment two
The present embodiment is to provide a kind of tray device 2 that can be used in the wafer automatic testing machine in embodiment one.Tool
Body, with reference to Fig. 4, tray device 2 includes that installation top plate 21 and mounting base 22 optionally install top plate 21 and mounting base
22 intervals are arranged and are connected by connecting rod 23, and connecting rod 23 is vertical between installation top plate 21 and mounting base 22.Into one
Step ground, in order to make automatic test machine be able to carry out the test of more multi-wafer, each tray device 2 is both configured to allow multiple
Charging tray 100 is stacked in along the vertical direction in the space between installation top plate 21 and mounting base 22, and shifting apparatus 3 is according to having indicated
At reciprocating movement of the chip being located on the top charging tray 100 between tray device 2 and test device 4, or complete empty material
Transfer of the disk between tray device to be measured and empty tray device and between empty tray device and classification tray device.Into one
Walk it is optional, be provided on carrying platform 12 with the equal number of through slot 121 of tray device 2, through slot 121 run through entire carrying platform
12 setting and be connected inside main body 11, a tray device 2 is correspondingly arranged in each through slot 121, so that being stacked in
Charging tray 100 between installation top plate 21 and mounting base 22 can be stored in main body 11, make full use of 1 space of rack, be pressed
Contract the size of entire wafer automatic testing machine.Wherein, installation top plate 21 is fixedly connected with carrying platform 12, to realize tray device
2 with the fixation of carrying platform 12.Optionally, fixed form can be used bolt and fix or be clamped, it is not limited to above-mentioned side
Formula.Installation top plate 21 is frame structure, and charging tray 100 is plate structure, and the charging tray 100 of the top is placed in the framework of installation top plate 21
In structure, and the center of the two overlaps；Optionally, the interior frame of charging tray 100 and installation top plate 21 is rectangular configuration, and
Four sides of charging tray 100 and four sides of the interior frame of installation top plate 21 are arranged in parallel one by one.Further, with reference to Fig. 5,
Multiple grooves 101 are offered on charging tray 100, groove 101 is for storing chip.Further, the chip on charging tray 100 is in matrix
Arrangement, the specific location where chip is obtained according to rectangular co-ordinate convenient for shifting apparatus 3 and need mobile chip position extremely
It sets.
Further, since tray device 2 is equipped with the multiple charging trays 100 stacked, often produce or be transferred into a material
The whole height of disk 100, the charging tray 100 stacked on the tray device 2 will change, in order to guarantee shifting apparatus 3 same
The transfer that the chip or charging tray 100 of each tray device 2 are completed in the horizontal plane of one height, should make each tray device 2 most
Top charging tray 100 is maintained at same level, and therefore, tray device 2 further includes 24 He of charging tray tray for carrying charging tray 100
The first driving mechanism 25 for driving charging tray tray 24 to go up and down；Charging tray 100 is stacked in along the vertical direction on charging tray tray 24, and
All 100 integral elevatings of charging tray are driven under the driving of one driving mechanism 25.When it is implemented, working as the material of 2 the top of tray device
When disk 100 is transferred, the whole height for moving up a charging tray 100 of the first driving mechanism 25 driving charging tray 100 makes next charging tray
100 are moved to the position for being transferred charging tray 100, carry out convenient for shifting apparatus 3 to the new charging tray 100 in same position subsequent
Operation；When the charging tray 100 new by one of shifting apparatus 3 is transferred at a certain tray device 2, the first driving mechanism 25 driving material
The whole height for moving down a charging tray 100 of disk 100, original the top charging tray 100 are able to be stored in installation top plate 21 and installation
In space between bottom plate 22, shifting apparatus 3 completes subsequent operation to new the top charging tray 100.Further, when a collection of brilliant
Piece has been fully completed detection, when needing to be taken out by automatic test machine, is risen charging tray tray 24 using the first driving mechanism 25
It, can be by all charging trays 100 stacked by being taken out on automatic test machine to maximum height.In the present embodiment, optional carrying platform
12 place planes are transfer plane.
Optionally, referring still to Fig. 4, the first driving mechanism 25 includes lifting platform 251 and driving motor 252, charging tray tray
24 are set on lifting platform 251, and the main body of driving motor 252 is set on mounting base 22, and the output shaft of driving motor 252 stretches out peace
It being connect with lifting platform 251 by screw-nut structure after dress bottom plate 22, the nut and lifting platform 251 of screw-nut structure are fixed,
The lead screw of feed screw nut and the output axis connection of driving motor 252 realize revolution by the threaded connection between lead screw and nut
The conversion to linear motion is moved, and then realizes the oscilaltion of lifting platform 251, enables charging tray tray 24 in installation top plate 21
Moving freely between mounting base 22.In some other embodiments, cylinder lifting is can also be used in the first driving mechanism 25
Structure or rack-and-pinion lifting structure etc..Optionally, it in order to improve the accuracy that lifting platform 251 is gone up and down, is set on lifting platform 251
There is the first guide through hole, the first guide rod, the first guide rod are equipped at least one of installation top plate 21 and mounting base 22
In the first guide through hole, guiding role is realized by opposite sliding of first guide rod in the first guide through hole.Into one
Step optionally, is provided with the first guide sleeve in the first guide through hole, to guarantee the smoothness during guiding.Optionally, this implementation
In example, connecting rod 23 can be used as the first guide rod.Optionally, lifting platform 251 and charging tray tray 24 are integrally formed, and are easy to implement liter
The synchronism of driving drops.
In order to limit the downlink height of charging tray tray 24, the first optoelectronic switch 26, lifting platform 251 are set on mounting base 22
Lower part be equipped with the first barn door 2511, be located at the first optoelectronic switch 26 when lifting platform 251 comes downwards to the first barn door 2511
When between transmitting terminal and receiving end, the first optoelectronic switch 26 of triggering generates the signal that lifting platform 251 comes downwards to extreme position, prevents
The further downlink of lifting platform 251.
Further, it is equipped with the first positioning protrusion in the upper surface of charging tray 100, it is fixed that the lower surface of charging tray 100 is equipped with first
Position slot, charging tray 100 is clamped by the first locating slot of the first positioning protrusion and square stock disk 100 thereon, and passes through the first locating slot
It is clamped with the first positioning protrusion of charging tray 100 below, realizes that the stabilization of two adjacent charging trays 100 stacks.Further, expect
The first positioning protrusion and the first locating slot of disk 100 can be rectangular configuration compatible with charging tray 100, correspondingly, for holding
The groove 101 of chip is just opened on the first positioning protrusion.Certainly, in other examples, the upper of charging tray 100 can also be enabled
Surface is equipped with the first locating slot, is equipped with the first positioning protrusion in the lower surface of charging tray 100, groove 101 is opened in the first locating slot
It is interior, equally realize that the stabilization of charging tray 100 stacks by the way of being mutually clamped.Further, the upper surface of charging tray tray 24 is set
There is locating piece 27, when the lower surface of charging tray 100 is equipped with the first locating slot, the outer contour shape of locating piece 27 and the first locating slot
Internal periphery shape be adapted, the charging tray 100 of bottom is stably placed on charging tray tray 24, positioning material is played
The effect that disk 100 prevents it from shaking.When the lower surface of charging tray 100 is equipped with the first positioning protrusion, positioning is set on locating piece 27
Card slot, and the Internal periphery shape of locating groove is adapted with the outer contour shape of the first positioning protrusion, still plays positioning bottom
The effect of charging tray 100.Optionally, locating piece 27 can be integrally formed with charging tray tray 24, be can also be used and be detachably connected；Using can
The mode of dismantling connection, can be convenient for according to the replacement of the specific structure of charging tray 100 progress locating piece 27.
When more charging tray 100 is when vertical direction is stacked, due to cumulative and itself amount of deflection the presence of rigging error,
Will lead to 100 entirety of charging tray cannot keep inclination or torsion vertical, but that occur certain, lead to the charging tray in the top
100 generation positional shift, and the position of the charging tray 100 deviated will affect the accuracy that shifting apparatus 3 picks and places chip, influence to survey
Try the continuity of process.To solve the above-mentioned problems, it with reference to Fig. 4 and Fig. 6, is led in the side setting of the interior frame of installation top plate 21
To block 28, guide pad 28 includes vertically disposed interconnecting piece 281 and guide part 282, and interconnecting piece 281 is connect with installation top plate 21,
Guide part 282 is provided with sequentially connected first guide surface 2821 and positioning surface from the bottom to top far from installation 21 side of top plate
2823, positioning surface 2823 is parallel with vertical direction, and the first guide surface 2821 is obliquely installed relative to positioning surface 2823, i.e., first leads
One end that the one end not connect to face 2821 with positioning surface 2823 is connect compared with the first guide surface 2821 with positioning surface 2823 closer to
Top plate 21 is installed, so that charging tray 100 carries out under the guiding role of the first guide surface 2821 when charging tray 100 is risen by bottom
Position is corrected, gradually mobile to the center of interior frame, until charging tray 100 goes upward to positioning surface 2823 and encloses in the space set；Into one
Step ground, guide pad 28 are additionally provided with the second guide surface for being connected to 2823 top of positioning surface on the side wall far from installation 21 side of top plate
2822；Second guide surface 2822 is tilted relative to positioning surface 2823, i.e., the second guide surface 2822 is not connect with positioning surface 2823
One end that one end is connect compared with the second guide surface 2822 with positioning surface 2823 is closer to installation top plate 21, when 100 relative drop of charging tray
When, charging tray 100 can carry out position correction again under the guiding role of the second guide surface 2822, gradually move to the center of interior frame
It is dynamic, until charging tray 100 comes downwards to positioning surface 2823 and encloses in the space set.Still optionally further, when installation top plate 21 is rectangle knot
When structure, it is provided with guide pad 28 on four sides of interior frame, enables charging tray 100 in lifting four different positions
It sets and is deviated under the guiding of the guide pad 28 at place to centre, carry out the correction of position, be guaranteed in the interior frame of installation top plate 21
Charging tray 100 position accuracy, improve 100 position of charging tray correction efficiency.Optionally, when every a side is only arranged one
When a guide pad 28, guide pad 28 is set to the middle position of certain a side of installation top plate 21.Further, some other
In embodiment, the every a side for installing the interior frame of top plate 21 is not limited to that a guide pad 28 is only arranged, and can be set two
It is a or more.
Mounting groove is set on installation top plate 21, the interconnecting piece 281 of guide pad 28 is connected in mounting groove, while guide pad 28
Guide part 282 be set to mounting groove outside.Optionally, affixed by the first bolt between interconnecting piece 281 and installation top plate 21.Specifically
Ground offers first through hole on the cell wall of mounting groove, and the second through-hole, the first screw bolt passes are opened up on interconnecting piece 281
After second through-hole and first through hole, guide pad 28 is completed using nut and the fixation of top plate 21 is installed.Further, the second through-hole
For strip hole, and the second through-hole extends along the direction of the side perpendicular to installation respective shoe 28, by changing the first bolt
Position in strip hole, can adjust between the positioning surface 2823 of guide pad 28 and the side equipped with the guide pad 28 away from
From improving the applicability of tray device 2, personnel can be according to the size or charging tray 100 and positioning surface of practical charging tray 100
The difference of gap error between 2823 rationally adjusts the installation site of guide pad 28, and reasonable set positioning surface 2823, which encloses, to be set
Space size enables the center for the charging tray 100 being located in the space to coincide with installation 21 center of top plate, avoids charging tray 100
Larger offset occurs for position, guarantees the accurate transfer of shifting apparatus 3.
In order to monitor whether the charging tray 100 of the top is placed in the frame structure of installation top plate 21, in installation top plate
21 interior frame is equipped with emission sensor 211, and referring still to Fig. 4 and Fig. 6, specifically, emission sensor 211 is in structure
On be separated from each other and transmitter and receiver that optical axis is staggered relatively are located on two sides being oppositely arranged of interior frame,
The light that transmitter issues is directly entered receiver.When charging tray 100 be placed in installation top plate 21 frame structure in when, transmitter and
Light between receiver is blocked by charging tray 100, and emission sensor 211 just produces charging tray 100 and is located at installation top plate 21
Framework interior frame in signal.
Embodiment three
The present embodiment is to provide a kind of shifting apparatus 3 of wafer automatic testing machine that can be used in embodiment one, transfer
Device 3 be configured as realizing charging tray 100 between different tray devices 2 and chip tray device 2 and test device 4 it
Between movement, complete feeding or blowing action.Specifically, with reference to Fig. 7 and Fig. 8, shifting apparatus 3 includes the first sliding rail 311, and first
Driving assembly 33, the second sliding rail 321, the second driving assembly 34 and component suction nozzle 37, component suction nozzle 37 include suction nozzle body 373,
For directly drawing charging tray 100 or chip, the first driving assembly 33 is configured as driving component suction nozzle 37 and moves along the first sliding rail 311
Dynamic, the second driving assembly 34 is configured as driving component suction nozzle 37 and 311 entirety of the first sliding rail is moved along the second sliding rail 321, the
The extending direction of one sliding rail 311 and the second sliding rail 321 is mutually perpendicular to.It can be by the first sliding rail 311 and the second sliding rail in the present embodiment
321 extending direction is interpreted as X-axis and Y-axis in the rectangular coordinate system of transfer plane respectively, and driving assembly can receive system
Instruction, driving component suction nozzle 37 is moved to the corresponding coordinate position of transfer plane along X-axis and Y-axis, draws at the position
Charging tray 100 or chip.In the present embodiment, enabling X-axis is first direction, and Y-axis is second direction.Further, shifting apparatus 3 also wraps
The second matrix 32 of the second sliding rail 321 of the first matrix 31 and setting of the first sliding rail 311 of setting is included, the first driving assembly 33 is set to
On first matrix 31, the second driving assembly 34 is set on the second matrix 32, and the second driving assembly 34 directly drives the first matrix 31
It is mobile relative to the second matrix 32, to realize movement of first sliding rail 311 relative to the second sliding rail 321.Still optionally further, it can incite somebody to action
Carrying platform 12 is directly as the second matrix 32.
Specifically, the first driving assembly 33 include the first driving source 331, the first driving wheel 332, the first driven wheel 333, around
The first conveyer belt 334 on the first driving wheel 332 and the second driven wheel 343 and be fixed on the first conveyer belt 334
One leather belt buckle 335, the first leather belt buckle 335 are equipped with the first sliding block 35, the first belt close to the side of the first sliding rail 311
Connector 335 is equipped with suction nozzle body 373 far from the side of the first sliding rail 311；First driving source 331 and the first driving wheel 332 are set
In one end of the first sliding rail 311, the first driven wheel 333 is set to the other end of the first sliding rail 311, the first driving source 331 driving the
The rotation of one conveyer belt 334, the first leather belt buckle 335 follows 334 synchronizing moving of the first conveyer belt, passes through the first sliding block 35 and the
The accurate guiding realized in a first direction that is slidably matched of one sliding rail 311, while suction nozzle body 373 can follow the first belt to connect
335 synchronizing moving of fitting realizes the displacement of suction nozzle body 373 in a first direction.Optionally, the first driving source 331 includes servo
Motor and speed reducer, the output end of speed reducer are connect with the first driving wheel 332.Optionally, in order to improve component suction nozzle 37 along
With reference to Fig. 8 two the first sliding rails 311 being spaced apart are arranged, accordingly in the mobile stability of one sliding rail 311 on the first matrix 31
The first leather belt buckle 335 on the first sliding block 35 be also provided with there are two, each first sliding block 35 correspondence is slideably positioned in
On one the first sliding rail 311, the setting of two the first sliding rails 311 improves the mobile stability of component suction nozzle 37, also improves
Along the accuracy of first direction transfer.Certainly in the specific implementation, the number of the first sliding rail 311 is not limited in the present embodiment
Two, may also set up more.Optionally, the first driving source 331 is fixed with the first matrix 31 by the first mounting plate, first from
Driving wheel 333 is relatively fixed by the first mounting rack 336 with the first matrix 31, to meet the transmission operation of the first conveyer belt 334.It can
Profile can be selected in selection of land, the first matrix 31, and the sliding slot along first direction is offered on profile, and the first mounting rack 336 is equipped with first
Tapped through hole is sequentially screwed into the first tapped through hole and sliding slot by the second bolt, the first mounting rack 336 is fixed on the first base
On body 31, by position of the first mounting rack 336 of fine tuning on profile, the tension of adjustable first conveyer belt 334 guarantees to pass
Pass through going on smoothly for journey.
Second driving assembly 34 includes the second driving source 341, the second driving wheel 342, the second driven wheel 343, is set around the
The second conveyer belt 344 on two driving wheels 342 and the second driven wheel 343 and the second belt being fixed on the second conveyer belt 344
Connector 345, the second leather belt buckle 345 are connect with the first matrix 31, so that the second driving source 341 drives the second conveyer belt
When 344 rotation, it is mobile that the second conveyer belt 344 is able to drive entire first matrix 31.In order to guarantee first matrix 31 and thereon
Suction nozzle body 373 moves in a second direction, and the second sliding rail 321, the lower part of the first matrix 31 is arranged on the top of the second matrix 32
Equipped with the second sliding block 36, realize the first matrix 31 along second party by the second sliding block 36 being slidably matched on the second sliding rail 321
To accurate guiding.Optionally, in the present embodiment, the second driving assembly 34 is located at the middle position setting of the second matrix 32, and
There are two the settings of second sliding rail 321, and two the second sliding rails 321 are symmetrically set to the two sides of the second driving assembly 34, is arranged such
Driving force can be uniformly transferred, makes the whole movement that can uniformly synchronize in a second direction of the first matrix 31, avoids that certain side occurs
Offset.Optionally, the second driving source 341 is identical as the structure of the first driving source 331, is all made of servo motor and speed reducer produces
Raw driving force.Optionally, holding tank 323 is equipped on the second matrix 32, the second driving assembly 34, which is located in holding tank 323, to be set
It sets, to hide the second driving assembly 34, can not only avoid interfering with the component suction nozzle 37 moved along the first sliding rail 311,
The size of wafer automatic testing machine can also be reduced.Still optionally further, the second driving source 341 and the second matrix 32 pass through the second peace
Loading board is fixed, and the second driven wheel 343 is relatively fixed by the second mounting rack 346 with the second matrix 32, to meet the second conveyer belt
344 transmission operation.Optionally, the second matrix 32 is equipped with the second tapped through hole, and the second mounting rack 346, which is equipped with, adjusts strip
Hole is sequentially screwed by third bolt and is adjusted in strip hole and the second tapped through hole, the second mounting rack 346 is fixed on the second base
On body 32, by fine tuning third bolt in the position for adjusting strip hole, thus it is possible to vary the tension of the second conveyer belt 344 is improved and passed
Send efficiency.
Further, with reference to Fig. 8 and Fig. 9, component suction nozzle 37 is including suction nozzle cylinder 371, suction nozzle fixed plate 372 and is set to suction
The output end of suction nozzle body 373 in mouth fixed plate 372, suction nozzle cylinder 371 is connect with suction nozzle fixed plate 372, and then is driven and inhaled
Mouth fixed plate 372 and suction nozzle body 373 are gone up and down, to complete the feeding and blanking of charging tray 100 or chip；Further, suction nozzle
Component 37 further includes Pneumatic valve 374, and the input terminal of suction nozzle cylinder 371 is connect with Pneumatic valve 374, Pneumatic valve 374 and test machine
Electric control gear communication connection receives the signal of electric control gear, controls suction nozzle cylinder 371 with this and acts.Optionally, the first belt connects
The top of fitting 335 is equipped with the first fixed plate 3351, and the lower section of the first leather belt buckle 335 is equipped with the second fixed plate 3352, the
Two fixed plates 3352 are optional vertical with the first leather belt buckle 335 to be connect；It is connected with Pneumatic valve 374 in first fixed plate 3351,
Second fixed plate 3352 is equipped with suction nozzle cylinder 371, and the output end of suction nozzle cylinder 371 stretches out the second fixed plate 3352 straight down
Connect afterwards with suction nozzle fixed plate 372, drive suction nozzle fixed plate 372 relative to the second fixed plate 3352 close to or far from；First is solid
The setting of fixed board 3351 and the second fixed plate 3352 can follow the first leather belt buckle 335 along the so that component suction nozzle 37 is whole
One sliding rail, 311 synchronizing moving ensure that stability and consistency when component suction nozzle 37 works.Further, suction nozzle fixed plate
372 and the second one of them in fixed plate 3352 be equipped with the second guide rod 375, another is equipped with the second guide through hole, the
Two guide rods 375 are inserted in the second guide through hole, leading when realizing that suction nozzle cylinder 371 drives suction nozzle fixed plate 372 to go up and down
To effect, suction nozzle body 373 is avoided to shift, it cannot precisely feeding and blanking.In the present embodiment, the second guide rod 375 is set
In in suction nozzle fixed plate 372, the second guide through hole is set in the second fixed plate 3352.Optionally, it is set in the second fixed plate 3352
There is the second guide sleeve, the second guide sleeve is sheathed on 375 periphery of the second guide rod, ensure that the guiding role of the second guide rod 375.
In the present embodiment, suction nozzle body 373 is provided with multiple, can be divided into three classes according to the difference of drawn object, and one
Class is charging tray suction nozzle body, is used to draw charging tray 100, and by charging tray 100 by tray device to be measured be moved to empty tray device,
Or classification tray device is moved to by empty tray device；Second class is feeding suction nozzle body, is used to draw tray device to be measured
In charging tray 100 on chip to be measured, and be moved at test device 4；Third class is blanking suction nozzle body, is used to inhale
The chip for completing test in test device 4 is taken, and is moved to the charging tray of corresponding classification tray device according to test result
On 100.Further, the number of every a kind of suction nozzle body 373 is not specifically limited, but every a kind of suction nozzle body 373 is corresponding
One suction nozzle fixed plate 372 and a suction nozzle cylinder 371 are set, so that the movement of inhomogeneous suction nozzle body 373 is not interfered.Tool
Body, in the present embodiment, since tray device 2 is rectangular configuration, there are four setting charging tray suction nozzle body settings, and four charging trays are inhaled
Mouth ontology is in distributed rectangular in its corresponding suction nozzle fixed plate 372, and each charging tray suction nozzle body can correspond to absorption charging tray
100 side, ensure that the strong absorption to charging tray 100, and then transfer process is gone on smoothly；In addition, the present embodiment
In, feeding suction nozzle body and blanking suction nozzle body are disposed as one, and are individually fixed in corresponding suction nozzle fixed plate 372,
And it is driven and is gone up and down by corresponding suction nozzle cylinder.Optionally, it is logical that at least two second guiding are respectively provided in each suction nozzle fixed plate 372
Hole, to realize the guiding of corresponding suction nozzle body 373.
Optionally, in the present embodiment, the first driving wheel 332, the first driven wheel 333, the second driving wheel 342 and second from
The outside of driving wheel 343 is covered with protective cover, to keep the beauty of entire test machine, while personnel being avoided to touch driving group
Part.Further, with reference to Fig. 7, set that there are two the second optoelectronic switch 312, two 312 edges of the second optoelectronic switch on the first matrix 31
The setting of first direction interval, present position have respectively represented component suction nozzle 37 along attainable two limit positions of first direction institute
It sets, correspondingly, the second barn door is equipped in the first fixed plate 3351, when the first conveyer belt 334 drives the first fixed plate 3351
When moving along first direction, the second barn door can be located at transmitting terminal and the receiving end of the second optoelectronic switch 312, to generate suction nozzle
Component 37 is moved to the signal at this, and is transferred to electric control gear.Similarly, two thirds are also equipped at intervals on the second matrix 32
Optoelectronic switch 322, and the side for being located at the second sliding rail 321 is arranged, having respectively represented component suction nozzle 37 can reach in a second direction
Two extreme positions arrived；Correspondingly, third barn door is equipped on the second sliding block 36, when the second conveyer belt 344 drives second
When sliding block 36 moves in a second direction, third barn door can be located at transmitting terminal and the receiving end of third optoelectronic switch 322, to produce
Raw component suction nozzle 37 is moved to the signal at this, and is transferred to electric control gear.
Example IV
The present embodiment is to provide a kind of test device 4 of wafer automatic testing machine that can be used in embodiment one, with complete
The test of pairs of chip.Specifically, with reference to Figure 10 and Figure 11, test device 4 include set on supporting mechanism 41, elevating mechanism 42,
Testboard component 43 and test board component 44, supporting mechanism 41 play the role of the entire test device 4 of support；Testboard component 43
Including testboard 431, for placing chip to be measured；Test board component 44 includes test board 441, and elevating mechanism 42 is surveyed for driving
Test stand 431 is gone up and down, and contacts chip to be measured placed thereon with test board 441, completes test.Further, test device 4
Test result can be exported to electric control gear, electric control gear determines the classification grade of the chip according to test result, and transmits letter
Number give shifting apparatus 3, the wafer transfer that shifting apparatus 3 is completed test according to signal designation to corresponding classification tray device
In charging tray 100.
Further, testboard component 43 further includes microscope carrier 432, and testboard 431 is set to the top of microscope carrier 432, testboard
Test plane is arranged in 431 upper surface, and chip is just placed in the test plane.Position due to test board 441 was being tested
Keep relatively fixed in journey, in order to guarantee that chip comes into full contact with test board 441 every time, each chip to be measured is in test plane
On placement location should be kept fixed.To solve the above-mentioned problems, with reference to Figure 12, testboard component 43 further includes being set to test
Positioning strip 433 in plane and the pushing structure on testboard 431 434, positioning strip 433 protrude test plane setting, to
After survey chip is placed in test plane, pushing structure 434 can push chip to be measured until the side wall of itself and positioning strip 433 offsets
It connects, and then completes the positioning of chip to be measured.Further, the side wall of the shape and structure of chip to be measured and positioning strip 433, which encloses, sets
Shape and structure be adapted, to guarantee sufficiently abutting for chip and 433 side wall of positioning strip, maintain the stability of wafer position.It can
Selection of land sets chip in the present embodiment as the rectangular configuration of rule, therefore can be equipped with orthogonal first in test plane
Positioning strip 433 and the second positioning strip 433, the two protrude test plane certain altitude, and one end of the first positioning strip 433 and the
The side wall of two positioning strips 433 abuts, so that the side wall of the first positioning strip 433 and the second positioning strip 433 forms right-angle structure；Work as crystalline substance
When piece is placed to test plane, it is repeated several times using pushing structure 434 and pushes chip to be measured, make two orthogonal side
Side can be abutted with the side wall of the first positioning strip 433 and the second positioning strip 433 respectively, and chip to be measured reaches fixed position, place
Chip to be measured at the position can come into full contact with after rising with test board 441, guarantee going on smoothly for test.Further,
First positioning strip 433 extends along fourth direction, and the second positioning strip 433 extends along the 5th direction, the 5th direction and fourth direction phase
It is mutually vertical.Fourth direction and the 5th direction are parallel with horizontal plane in the present embodiment.
Specifically, referring again to Figure 12, pushing structure 434 includes pusher cylinder 4341, the output with pusher cylinder 4341
The pushing plate 4342 of connection is held, multiple promotion thimbles 4343 in pushing plate 4342 push the free end energy of thimble 4343
It is enough to be abutted against with the chip to be measured being placed on testboard 431.When it is implemented, pusher cylinder 4341 acts, pushing plate is driven
4342 and promotion thimble 4343 thereon moved along specific direction, until the chip to be measured in test plane to be pushed to and position
The side wall of item 433 abuts.Optionally, in order to increase the accuracy of pushing direction, pushing structure 434 further includes being set to testboard
Third guide rod 4344 on 431 and the third guide through hole in pushing plate 4342, third guide rod 4344 are set to third
In guide through hole, the slide-and-guide of pushing plate 4342 is realized.Optionally, it is equipped with third guide sleeve in third guide through hole, guarantees the
The smoothness of the opposite sliding of three guide rod 4344.Further, there are two pushing structure 434 includes, respectively first pushes knot
Structure and the second pushing structure, the two are respectively used to push chip to be measured along fourth direction and along the 5th direction.Therefore, it first pushes
The pushing direction of structure and the pusher cylinder of the second pushing structure 4341 is consistent with fourth direction and the 5th direction respectively, is pushed away
The extending direction of dynamic thimble 4343 and third guide rod 4344 is also consistent with pushing direction.Optionally, it is surveyed in the present embodiment
Test stand 431 is rectangular parallelepiped structure, and the first pushing structure and the second pushing structure are located at the orthogonal two sides of testboard 431
Setting.Still optionally further, it in order to guarantee the stationarity for pushing thimble 4343 to move along fourth direction or the 5th direction, can survey
Thimble slot is opened up in examination plane, thimble slot extends along fourth direction or the 5th direction, and push thimble 4343 to be set in thimble slot, into
One step limits the offset for pushing thimble 4343, ensure that and pushes thimble 4343 that can move along specific direction；Push thimble
4343 protrusion test plane certain altitude settings, to complete to push with contact wafers to be measured.Optionally, according to wafer size size
Difference, each pushing structure 434 promotion thimble 4343 setting quantity can for two, three or more, filled with reaching
Divide the effect for contact wafers, uniformly pushing chip.
With reference to Figure 11 and 13, supporting mechanism 41 includes being parallel to each other and spaced roof supporting 411 and support baseboard
412, and the support riser 413 being vertical between roof supporting 411 and support baseboard 412, support baseboard 412 and loading plate
14 connections, test board component 44 are set on roof supporting 411, and testboard component 43 is set to roof supporting 411 and support baseboard 412
Between.Further, in order to improve the stability of supporting mechanism 41, support be additionally provided on riser 413 it is equal with support baseboard 412
Capable support supporting plate 414, and support and connected between supporting plate 414 and support baseboard 412 by support rod 415, to reinforce support machine
The supporting role of structure 41.Optionally, testboard component 43 and support rod 415 are located at the heteropleural setting of support riser 413, both
It can prevent support rod 415 from interfering with testboard component 43, also further improve the stability of support riser 413.
With reference to Figure 10 and Figure 13, elevating mechanism 42 includes lifting driving source 421 and connects with the output end of lifting driving source 421
The first connecting plate 422 connect, the first connecting plate 422 are connected with the microscope carrier 432 of testboard component 43 by the second connecting plate 49,
Lifting driving source 421 drives the first connecting plate 422, the second connecting plate 49 and microscope carrier 432 to go up and down together along third direction, realizes
Testboard component 43 and test board component 44 it is close with it is separate.In the present embodiment, third direction is vertical direction, with level
Face is perpendicular, it can be understood as the Z axis in rectangular coordinate system.Optionally, lifting driving source 421 uses rodless cylinder, no bar gas
The main body of cylinder is fixed on support riser 413, and the lifting slider of rodless cylinder is connect with the first connecting plate 422, by lifting slider
Drive the first connecting plate 422 mobile.In some other embodiments, feed screw nut lifting knot is can also be used in lifting driving source 421
Structure or rack-and-pinion lifting structure.Further, elevating mechanism 42 and testboard component 43 are located at the heteropleural of support riser 413
Setting, i.e. elevating mechanism 42 are set between support supporting plate 414 and support baseboard 412, so that elevating mechanism 42 will not interfere with test
Platform component 43 acts.Optionally, the second connecting plate 49 is set as two, and two the second connecting plates 49 are relative to support riser 413
It is symmetrical, go up and down 43 uniform stressed of testboard component.Optionally, with reference to Figure 13, testboard component 43 rises in order to prevent
Or falling head causes device to damage beyond preset range, two the 4th light are respectively set in the upper and lower part of support riser 413
Electric switch 4131, respectively represented testboard 431 can raising and lowering extreme position, the is arranged on the second connecting plate 49
Four barn doors 361, when the second connecting plate 49 drives the lifting of testboard component 43 to the 4th barn door 361 to be located at the 4th optoelectronic switch
When between 4131 transmitting terminal and receiving end, the 4th optoelectronic switch 4131 of triggering generates signal, prevents the further of testboard 431
Lifting.Further, each in the upper and lower part of the first connecting plate 422 for the impact of buffering test plate 441 and contact wafers
Equipped with a buffer structure 45, when the first connecting plate 422 soon rises or soon drops to extreme position, buffer structure 45 can
It contacts with support baseboard 412 or roof supporting 411 and plays buffering effect.Optionally, buffer structure 45 includes buffering link block 451
With the buffer 452 being vertical on buffering link block 451, buffering link block 451 is connect with the first connecting plate 422.Optionally,
Second connecting plate 49 can directly be connect with buffering link block 451, to realize the first connecting plate 422 to buffer 452 and testboard
The synchronous drive of component 43.In the present embodiment, the selection of buffer 452 uses the ACA-1007 type oil buffer of Ya De visitor.
Further, the accuracy that goes up and down along third direction of testboard 431, testboard are driven in order to improve elevating mechanism 42
It is additionally provided with linear guide rail structure 46 between component 43 and support riser 413, specifically, with reference to Figure 10,11 and 15, linear guide knot
Structure 46 includes the third sliding block 461 on microscope carrier 432 and the third sliding rail 462 on support riser 413, third sliding rail
462 extend along third direction, and the sliding of third sliding block 461 is set on third sliding rail 462, to realize testboard component 43 in third party
To slide-and-guide.Optionally, it is connected between microscope carrier 432 and third sliding block 461 by third connecting plate, while third connecting plate
It is vertical between the second connecting plate 49 to connect, to improve the stability of the lifting of testboard 431.
Specifically, with reference to Figure 11, test board component 44 further includes the pressing plate 442 set on 411 lower section of roof supporting, pressing plate
There are two 442 settings, and is located at the two sides setting of roof supporting 411 along its length, and the lower section of each pressing plate 442 is all provided with
It is equipped with a diving board 443, test board 441 is located between pressing plate 442 and diving board 443 by diving board 443 using own resilient；Pressing plate
442 have certain thickness, so that gap is equipped between test board 441 and roof supporting 411, with buffer wafers and test board 441
The impact occurred when contact realizes that chip comes into full contact with the uniform of test board 441.Optionally, the side of roof supporting 411 is also
Equipped with limit baffle 444, position-limiting action when test board 441 is installed is played.
In order to improve measuring accuracy, before every use, it is required to carry out calibration adjusting to testboard 431, so as to be measured
Chip can be corresponding as much as possible with test board 441 in the pre- position of putting of test plane, realizes crystalline substance to be measured after the rising of test stand 431 to be measured
Piece comes into full contact with test board 441.Specifically, with reference to Figure 10,14 and 15, test device 4 includes angle adjusting mechanism 40, angle
Spending regulating mechanism 40 includes the rotary table 401 that rotation is set on microscope carrier 432, and rotary table 401 and microscope carrier 432 pass through axis
Bearing structure rotation connection, while by testboard 431 set on the top of rotary table 401, testboard 431 can follow rotation work
Make platform 401 to rotate relative to microscope carrier 432 together, to adjust the angle of testboard 431 in the horizontal plane.Further, angular adjustment
Mechanism 40 further includes the adjustable column 403 for being vertical at 401 bottom of rotary table, and adjustable column 403 extends vertically through entire microscope carrier 432
And be rotatablely connected with microscope carrier 432 by above-mentioned bearing arrangement, optional adjustable column 403 is cylindrical structure；The bottom of adjustable column 403
Equipped with an adjusting rod 404, adjusting rod 404 is pushed, adjustable column 403 and rotary table 401 can be driven to rotate, facilitate work
Make personnel's operation.Further, the axis of adjusting rod 404 and the axis of adjustable column 403 are mutually perpendicular to, to realize using lesser
Thrust just can push adjustable column 403 and rotary table 401 to rotate.Optionally, adjusting rod 404 extends vertically through entire adjustable column
403 settings, to increase active area between adjusting rod 404 and adjustable column 403, so that promotion of the adjusting rod 404 to adjustable column 403
It is more convenient laborsaving.Further, in order to carry out the angular adjustment of testboard 431 in a certain range, testboard 431 is avoided
Excessive deflection, the side of microscope carrier 432 are equipped with adjusting block 402, and adjusting block 402 is equipped with one close to the side side wall of adjustable column 403
The extending direction of strip groove 4021 (with specific reference to Figure 14), strip groove 4021 is located in horizontal plane, and the free end of adjusting rod 404 is set
In in the strip groove 4021, the free end of adjusting rod 404 present position in strip groove 4021 is different, adjustable column 403 and rotation
Workbench 401 just rotates different angles, until the free end of adjusting rod 404 is abutted with the cell wall of 4021 end of strip groove, hinders
The further movement for keeping off adjusting rod 404, makes rotary table 401 carry out angular adjustment in limited angular range, avoided
Degree adjusts the generation of phenomenon.Further, in order to make angular adjustment realize quantization, the first spiral is provided on adjusting block 402
Differential head 405, the measuring staff of the first spiral differential head 405 protrude into 402 inside of adjusting block and abut with the side wall of adjusting rod 404, revolve
The vernier knob for turning the first spiral differential head 405 changes the extension elongation of measuring staff, and then drives adjusting rod 404 in strip groove
It is moved in 4021, the adjusting angle of adjusting rod 404 can be understood by the reading of the first spiral differential head 405, realizes angle
Spend the quantization adjusted.Further, the measuring staff of the first spiral differential head 405 is vertical abut with adjusting rod 404.Further,
The first clamping screw 406 is additionally provided on adjusting block 402, to angular adjustment after, the first clamping screw 406 lock adjusting rod
404, it limits it and moves again, the angle of testboard 431 is kept to fix.Optionally, it is located under microscope carrier 432 on adjustable column 403
External screw thread is additionally provided on side wall between 404 top of portion and adjusting rod, locking nut 407 is connected through a screw thread adjustable column 403
It locks with bearing arrangement, is not sent out with guaranteeing that adjustable column 403 is able to drive rotary table 401 and rotates in same level
Raw offset.
Further, with reference to Figure 10,11 and 12, test device 4 further includes displacement regulating mechanism 47, is displaced regulating mechanism 47
Including the cross slideway displacement platform 471 being set between rotary table 401 and testboard 431, cross slideway displacement platform 471
It is whole to be set on rotary table 401, and rotary table 401 can be followed to rotate synchronously；The load of cross slideway displacement platform 471
Object plane is connected with the bottom surface of testboard 431, and then drives testboard component 43 is whole to follow loading surface synchronizing moving.It is optional
Ground, the cross slideway displacement platform 471 in the present embodiment are mainly used for realizing testboard 431 along fourth direction and the 5th direction
Displacement, therefore the second spiral differential is respectively arranged on two orthogonal side walls of the cross slideway displacement platform 471
472 and the second spiral differential 472 realize the quantization that testboard 431 is displaced in two directions.Further, intersection is led
The second clamping screw 473 and third locking screw are respectively arranged on two side walls being arranged in a mutually vertical manner of rail displacement platform 471
Bolt, test stand 431 to be measured are lowered level in the adjusting of cross slideway displacement platform 471 and are postponed, and 473 He of the second clamping screw is recycled
Third clamping screw locks the loading surface of cross slideway displacement platform 471, move it can not again.
By the setting of above-mentioned angle adjusting mechanism 40 and displacement regulating mechanism 47, enable testboard 431 in level
Face is rotated, and adjust in the displacement in fourth direction and the 5th direction, so that test board 441 is opposite with chip to be measured
It answers.But on third direction, since the thickness between different chips and different test boards 441 is different, it is in high volume being tested
Before, it is also necessary to calibration adjusting is carried out to the height between the roof supporting 411 and support baseboard 412 of test device 4, guarantees lifting
Under the lifting driving of the specific lifting distance to move in circles, chip to be measured can come into full contact with always with test board 441 for mechanism 42,
Therefore test device 4 further includes height adjustment mechanism 48, and with reference to Figure 10 and Figure 14, height adjustment mechanism 48 includes being set to branch support
The measuring staff of third spiral differential head 481 on plate 411, third spiral differential head 481 extends along third direction, passes through branch support
It is abutted after plate 411 with the top surface of support riser 413, rotates the vernier knob of third spiral differential head 481, change the stretching of measuring staff
Length, so drive roof supporting 411 relative to support baseboard 412 along third direction close to or far from and then changing and be set to
The distance between test board 441 and testboard 431 on roof supporting 411, until can guarantee that chip to be measured is specifically rising
Demotion can come into full contact under moving with test board 441.Further, pass through between roof supporting 411 and support riser 413 and intersect
Guide rail structure 482 is slidably connected, and it is high-precision relative to support riser 413 that cross slideway structure 482 can be realized roof supporting 411
Degree, smoothly linear motion improve the accuracy that roof supporting 411 is moved along third direction, further, cross slideway structure
482 include the 4th sliding rail on support riser 413 and the Four-slider on roof supporting 411, and the 4th sliding rail is along the
Three directions extend, to realize roof supporting 411 in the guiding of third direction.Optionally, there are two cross slideway structure 482 is set,
And it is located at the two sides setting of roof supporting 411.Further, height adjustment mechanism 48 further includes the 4th clamping screw 483,
Cross slideway structure 482 is locked after the height adjustment for completing roof supporting 411, is avoided between Four-slider and the 4th sliding rail again
Opposite sliding occurs.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of test device, including testboard (431), which is characterized in that further include that microscope carrier (432) and rotation are set to the load
Rotary table (401) on platform (432), the testboard (431) are set to the top of the rotary table (401)；It is described
Rotary table (401) bottom be equipped with adjustable column (403), the adjustable column (403) through the microscope carrier (432) and with the load
Platform (432) rotation connection；The bottom of the adjustable column (403) is equipped with adjusting rod (404), pushes the adjusting rod (404), described
Adjusting rod (404) is able to drive the adjustable column (403) and the rotary table (401) rotation.
2. test device according to claim 1, which is characterized in that the axis of the adjusting rod (404) and the adjusting
The axis perpendicular of column (403).
3. test device according to claim 2, which is characterized in that the adjusting rod (404) is configured to vertically
Through the adjustable column (403).
4. test device according to claim 1, which is characterized in that the side of the microscope carrier (432) is equipped with adjusting block
(402), the adjusting block (402) is equipped with strip groove (4021) close to the side of the adjustable column (403), the adjusting rod
(404) free end is set in the strip groove (4021).
5. test device according to claim 4, which is characterized in that be additionally provided with the first spiral shell on the adjusting block (402)
Revolve differential head (405), the measuring staff of the first spiral differential head (405) can extend into the adjusting block (402) it is internal and with institute
Adjusting rod (404) abutting is stated, the vernier knob of the first spiral differential head (405) is rotated, changes the first spiral differential
The measuring staff extension elongation of head (405), and then the adjusting rod (404) is driven to move in the strip groove (4021).
6. test device according to claim 4, which is characterized in that be additionally provided with the first locking on the adjusting block (402)
Bolt (406), first clamping screw (406) are configured to lock the adjusting rod (404).
7. test device according to claim 1, which is characterized in that the test device further include elevating mechanism (42) and
Supporting mechanism (41), the supporting mechanism (41) include being parallel to each other and spaced roof supporting (411) and support baseboard
(412), and set on the support riser (413) between the roof supporting (411) and the support baseboard (412), the load
Platform (432) is set between the roof supporting (411) and the support baseboard (412), and the elevating mechanism (42) is configured as
The microscope carrier (432) can be driven close to or far from the roof supporting (411).
8. test device according to claim 7, which is characterized in that the test device further includes height adjustment mechanism
(48), the height adjustment mechanism (48) is configured to adjust the roof supporting (411) relative to the support baseboard
(412) height.
9. test device according to claim 8, which is characterized in that the height adjustment mechanism (48) includes set on described
The measuring staff of third spiral differential head (481) on roof supporting (411), the third spiral differential head (481) passes through the branch
Support plate (411) is abutted with the top surface of support riser (413) afterwards, rotates the fine tuning of the third spiral differential head (481)
Knob changes the measuring staff extension elongation of the third spiral differential head (481), and then drives the roof supporting (411) opposite
The support baseboard (412) close to or far from.
10. a kind of wafer automatic testing machine, which is characterized in that including the described in any item test devices of claim 1-9.
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| CN201910600069.0A CN110320462A (en) | 2019-07-04 | 2019-07-04 | A kind of test device and wafer automatic testing machine |
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| CN201910600069.0A CN110320462A (en) | 2019-07-04 | 2019-07-04 | A kind of test device and wafer automatic testing machine |
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| CN111398768A (en) * | 2020-04-14 | 2020-07-10 | 西安易恩电气科技有限公司 | Automatic change power semiconductor device test fixture |
| CN112405131A (en) * | 2020-12-03 | 2021-02-26 | 湖北中烟工业有限责任公司 | Filament cutter with knife grinder and use method thereof |
| CN113376046A (en) * | 2021-07-05 | 2021-09-10 | 西南交通大学 | Rotary reciprocating friction and wear test device |
| CN114252661A (en) * | 2021-12-21 | 2022-03-29 | 环旭电子股份有限公司 | Automatic buckling device and method for chip testing clamp |
| CN115144734A (en) * | 2022-07-29 | 2022-10-04 | 河北圣昊光电科技有限公司 | Swing adjusting device and chip testing machine with same |
| CN116774373A (en) * | 2023-08-24 | 2023-09-19 | 中铁十六局集团城市建设发展有限公司 | Real-time non-contact short-distance measuring device based on computer vision measurement |
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| CN116774373A (en) * | 2023-08-24 | 2023-09-19 | 中铁十六局集团城市建设发展有限公司 | Real-time non-contact short-distance measuring device based on computer vision measurement |
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