CN101233800B - Electronic component mounter and mounting method - Google Patents
Electronic component mounter and mounting method Download PDFInfo
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- CN101233800B CN101233800B CN2006800283502A CN200680028350A CN101233800B CN 101233800 B CN101233800 B CN 101233800B CN 2006800283502 A CN2006800283502 A CN 2006800283502A CN 200680028350 A CN200680028350 A CN 200680028350A CN 101233800 B CN101233800 B CN 101233800B
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Abstract
It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency. This method is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
Description
Technical field
The present invention relates to a kind of method that is used for measurement component height (thickness), wherein, described parts are picked up by the suction of erector suction nozzle, and are installed on the member such as plate or the like.
Background technology
The height of electronic unit to be installed is one of important parameter of erector.More specifically, if be used to install electronic unit transmission head (transfer head) institute fixing electronic unit actual height be assigned to this electronic unit and be stored with control erector value different, when being installed to this electronic unit on the plate, various problems can take place then.For example, the actual height of electronic unit less than the storage data conditions under, before electronic unit arrives plate, will be released, thus its may and no show plate on the tram.On the contrary, if the actual height of electronic unit greater than the storage data, then electronic unit will be pressed onboard too powerfully, thereby may make plate, electronic unit or suction nozzle be damaged.
Traditionally, for the altitude information with electronic unit is input in the erector, will be from the altitude information and manual input of electronic unit manufacturer there electron gain parts, perhaps take out electronic unit from carrier band (tape) of being used for preserving electronic unit or the like, and use vernier caliper or the like to measure, and manual input measurement value.
Yet the height of electronic unit may change, and this depends on manufacturer or make batch, even and the performance of electronic unit not change also be like this.For example, presently used electronic unit supply shortage under the situation about shortening to the time (beginning the delivery up to plate from receiving plate production order) of delivery of ordering goods just can only use the parts of another manufacturer to substitute with having no option.In this case, even the performance of parts does not change, also must the manual data of importing substitutions of elements.The input of this data is not only very loaded down with trivial details, and also causes measure error or mistake under the data conditions of the height of measuring substitutions of elements and manual input block, thereby causes the actual height of parts and the difference between the data imported.
Therefore, for fear of measure error and mistake and guarantee the actual height of electronic unit and be stored in accurate coupling between the data in the erector, applied for being used for the patent application of erector as shown in Figure 1, it comprises detector, is used for the detection part size so that obtain and store the size (referring to for example Japanese Patent Application Publication No.07-38294) of these parts automatically.
Recent years, a kind of so-called multi-functional erector is used widely, and this erector is installed various electronic units thereon, scope from small parts to very big parts.
If (particularly, the height of parts following problem then can take place in this multi-functional erector in) detector applies will to be used to detect size.If on the transmission head of detector attached to erector, then just can from transmit head pick up by suction parts till above it moves to plate during in measure the height of these parts, thereby highly measurement can not cause time waste.On the other hand, need large-sized detector to detect the height of big parts.If on the transmission head of this detector attached to erector, then the size of detector and weight can cause burden with the transmission head of installing component to high-speed mobile, thereby can not keep transmitting the positioning accuracy of head.
In addition, because the large scale detector has low resolution usually, if therefore this detector detects the height of micro-element, then the height measure error will be too big, so that can not these parts be installed without any problem ground.Have high-resolution large scale detector and cause the increase of cost inevitably.
Summary of the invention
Therefore, the present invention considers above problem and conceives out that target of the present invention provides a kind of method, is used to use the transducer with less measuring range to come the height of the various parts of measuring range from small parts to bigger parts.
To achieve these goals, component height method of measurement according to the present invention is a kind of like this component height method of measurement, it is applied to be furnished with the erector that transmits head, described transmission head has parts absorption-fixing suction nozzle, described transmission head is used for transfer member and described parts is installed to plate, and described method comprises: described parts are reduced in the high accuracy scope of transducer of the height that is used to measure described parts; And use the height of the described parts of described sensor measurement.
Correspondingly, owing to measure the height of described parts after in the high accuracy scope that parts is reduced to transducer, therefore, can accurately measure the height of described parts.
This method also comprises: tentatively reduce described suction nozzle and draw the also parts of fixing, and use the reduction amount of described suction nozzle and the signal of exporting from described transducer, come the height of the described parts of preliminary surveying.In the reduction step of described parts, preferably,, described parts are reduced within the high accuracy scope of described transducer based on the height of the described parts that in described preliminary surveying, record.
Correspondingly, because the height of described parts is based on the reduction amount of described suction nozzle and measures from the signal of described transducer output, height that therefore can the various parts of measuring range from micro-element to bigger parts is even transducer is less relatively.In addition, even use the transducer that changes to another positional precision from a position, also can guarantee high measurement accuracy by the described parts of twice measurement.
Further preferably, this method comprises: reduce the not suction nozzle of fixing parts, and obtain the information relevant with the upright position, lower end of this suction nozzle.
Correspondingly, the erector for needs replacement suction nozzle becomes and can avoid the dimensional accuracy of suction nozzle as much as possible or adhere to the influence of precision to the height measurements of parts.
Preferably, when the height of measurement component, under the situation of the height that records less than predetermined value, when the upright position with the lower end of described suction nozzle is held in a predetermined position, the height of described parts is measured on certainty ground, and be equal to or greater than at the height that records under the situation of predetermined value, when the upright position with the lower end of described suction nozzle was held in a predetermined position, the height of described parts was measured on certainty ground.
Correspondingly, when measuring the height of small relatively parts, the repetitive error of suction nozzle rather than its reduction error have bigger influence to the measured value of component height.On the contrary, for thick relatively parts, the reduction error of suction nozzle has bigger influence to the measured value of component height.When repetitive error when reducing error, can be reduced in the possibility that gross error takes place in the component height.
Notice that described reduction error is the error between the actual reduction amount of value of setting for the reduction suction nozzle and suction nozzle.Repetitive error is when repeating to reduce set point several times, the variation error between the actual reduction value of suction nozzle.
In addition, when after suction nozzle is remained on inactive state, on horizontal plane, transducer and parts being movable relative to each other, carry out a kind of in measuring of preliminary surveying and certainty.
Correspondingly, can remove transducer, so that installing component.Can also a plurality of parts of one-shot measurement.
In addition, a kind ofly be used to make computer to carry out the program of above step, a kind of height measuring equipment that comprises above step as the unit perhaps comprises the erector of this height measuring equipment, also can realize above-mentioned identical target, and produce above-mentioned identical effect.
According to the present invention, can use the height of the various parts of high accuracy part measuring range from small parts to bigger parts of less transducer, thus can be with the height of high level of accuracy detection electronics.
As further information, following the open of Japanese patent application that includes specification, accompanying drawing and claim is incorporated into this by reference in its entirety about the application's technical background:
The Japanese patent application No.2005-223681 of application on August 2nd, 2005;
The Japanese patent application No.2005-224892 of application on August 3rd, 2005; And
The Japanese patent application No.2005-237334 of application on August 18th, 2005.
Description of drawings
From below in conjunction with illustrating the description of the invention of accompanying drawing of the specific embodiment of the invention, these and other purposes of the present invention, advantage and feature will become apparent.In the accompanying drawings:
Fig. 1 is the concept map that the detector of conventional size is shown;
Fig. 2 is the plane graph of electronic component mounter in one embodiment of the invention;
Fig. 3 A is the front view of the transmission head of the electronic component mounter in one embodiment of the present of invention;
Fig. 3 B is the end view of the transmission head of the electronic component mounter in one embodiment of the present of invention;
Fig. 4 is the structure chart of the control system of the electronic component mounter in one embodiment of the present of invention;
Fig. 5 explains the figure that is used for the method for detection electronics in one embodiment of the present of invention;
Fig. 6 is the flow chart of the operating sequence of the electronic component mounter in one embodiment of the present of invention;
Fig. 7 A explains the diagrammatic sketch that is used for first method of detection electronics in one embodiment of the present of invention;
Fig. 7 B explains the diagrammatic sketch that is used for second method of detection electronics in one embodiment of the present of invention;
Fig. 8 is the flow chart of the operating sequence of the electronic component mounter in one embodiment of the present of invention;
Fig. 9 is the external perspective view of electronic component mounter according to an embodiment of the invention, has the profile of this erector inside;
Figure 10 is the plane graph that internal structure is shown, and has comprised the main element of electronic component mounter;
Figure 11 A is the top perspective that transmits head;
Figure 11 B is the bottom perspective view that transmits head;
Figure 12 is the notion end view that illustrates attached to the projector on the scanning survey unit and line sensor;
Figure 13 is the functional block diagram that the functional structure of electronic component mounter is shown;
Figure 14 is the flow chart of the operating sequence of electronic component mounter;
Figure 15 is the end view that the preliminary surveying of electronic unit is shown;
Figure 16 illustrates the electronic unit end view of observational measurement really;
Figure 17 is the flow chart that the sequence of operation that measurement concerns between set point that is used to reduce suction nozzle and actual reduction amount is shown;
Figure 18 is the end view that illustrates the measurement of the reduction amount of suction nozzle;
Figure 19 is the flow chart that the operating sequence that is used to measure the electronic unit height in one embodiment of the invention is shown;
Figure 20 is the end view that the arrangement of thicker relatively electronic unit is shown, and this arrangement is used to measure described thicker electronic unit relatively; And
Figure 21 is the end view that the arrangement of relatively thin electronic unit is shown, and this arrangement is used to measure described relatively thin electronic unit.
Embodiment
(first embodiment)
Next, one embodiment of the present of invention are described with reference to the drawings.Fig. 2 is the plane graph of electronic component mounter in one embodiment of the invention; Fig. 3 A is the front view of the transmission head of the electronic component mounter in one embodiment of the present of invention; Fig. 3 B is the end view of the transmission head of the electronic component mounter in one embodiment of the present of invention; Fig. 4 is the structure chart of the control system of the electronic component mounter in one embodiment of the present of invention; Fig. 5 explains the diagrammatic sketch that is used for the method for detection electronics in one embodiment of the present of invention; And Fig. 6 is the flow chart of the operating sequence of the electronic component mounter in one embodiment of the present of invention.
At first, with reference to figure 2, Fig. 3 A and Fig. 3 B, the overall structure of electronic component mounter is described.In Fig. 2, be placed on the approximate center of pedestal 1 along the transport path 2 of directions X extension.Transport path 2 transmits the plate 3 of installing component thereon, and it is positioned over the precalculated position.Notice that in the present invention, the direction of transfer of plate is a directions X, and on horizontal plane, be the Y direction with the direction of directions X quadrature.Electronic unit feeding unit 4 has been placed in both sides on the Y of transport path 2 direction.Each electronic unit feeding unit 4 comprises the parts feeder, is used to erector that electronic unit (hereinafter referred to as " parts ") is provided.In the present embodiment, a plurality of banded feeders 5 abreast, are removably arranged.In banded feeder 5, a plurality of parts have been stored.
A pair of Y coordinate table 6 is placed on the two ends on the directions X of pedestal 1.A pair of X coordinate table is arranged on these two Y coordinate tables 6, and is driven with moving along y-axis shift by Y coordinate table 6.Transmit 8 a side, and drive, thereby move along X-axis by X coordinate table 7 attached to each X coordinate table 7.Y coordinate table and X coordinate table 7 are horizontal movement unit, are used for moving horizontally on pedestal 1 transmitting 8.
In Fig. 3 A and Fig. 3 B, transmit 8 and be attached to X coordinate table 7 via plate 9.A plurality of suction nozzle unit 20 are attached to framework 10 and are supported by framework 10.In the present embodiment, placed two row suction nozzle unit on the Y direction, each row has 4 suction nozzle unit 20 of serial arrangement.
In Fig. 3 B, suction nozzle 21 is attached to the lower end of each suction nozzle unit 20.Each suction nozzle unit 20 comprises driver element (up-and-down drive unit) 22 and rotary drive unit 23 (see figure 4)s up and down, as the unit that is used to drive suction nozzle 21.Driver element 22 is by forming with the lower part up and down: ball screw (ball screw) (not shown) of fixing on the vertical direction; The nut that is screwed together with this ball screw; And the motor that is used for axially rotating this ball screw, suction nozzle 21 is connected on this nut.The axial rotation vertical moving nut of ball screw, this causes moving up and down of suction nozzle 21.As mentioned above, the driving of the driver element up and down 22 by controlling each suction nozzle unit 20 can be carried out the adjusting separate with other suction nozzles to the level height (level) (upright position) of each suction nozzle 21.In addition, be rotated independently of each other with other suction nozzles, therefore can change the horizontal direction of the parts of 21 absorptions of each suction nozzle and fixing owing to drive each suction nozzle 21 by rotary drive unit 23.
In Fig. 3 A and Fig. 3 B, first line sensor 13 is attached to and transmits 8, and is retained on transducer 13 and can detects parts on each suction nozzle 21 lower surface and draw on the fixing horizontal height of side on surface (hereinafter referred to as " drawing the surface ").This first line sensor 13 can move along the arrangement of suction nozzle 21, keeps this fixing horizontal height simultaneously.When being positioned at by each suction nozzle 21, first line sensor 13 drawn and during the side of the parts P of fixing its detection part P.First line sensor 13 continues to move, thus detection part P sequentially.Like this, first line sensor 13 detects by each suction nozzle 21 and is drawn also the height of each parts P of fixing and the level height of installation surface thereof.Notice that installation surface is when being installed to parts on the plate, the surface of the parts that contact with the upper surface of plate.Installation surface is the lower surface of electrode normally, but the installation surface with parts of projection then is the lower surface of this projection.First line sensor 13 serves as second checkout gear, and it detects by drawing the also parts of fixing in many suction nozzle unit of parts side.
In Fig. 2, second line sensor 14 is placed between transport path 2 and the electronic unit feeding unit 4, detects the parts of being drawn and being picked up by the suction nozzle 21 of the transmission below parts 8.This second line sensor 14 is taken the image of component mounting surface, and handles this image by graphics processing unit 39 (see figure 4)s, with detection part whether exist, the absorption attitude of parts or the like.Second line sensor 14 serves as first checkout gear, and it detects by the many suction nozzle unit below parts and is drawn the also parts of fixing.
Next, the structure of the control system of electronic component mounter is described with reference to figure 4.Control unit 30 is connected to transport path 2, Y coordinate table 6, X coordinate table 7, first line sensor 13, second line sensor 14 and the drive system via bus 31, be the driver element up and down 22 and the rotary drive unit 23 of suction nozzle unit 20, and it is based on the driving of NC program 37 controls to each drive system.The NC procedure stores is in the data cell 32 that is connected to bus 31, and this data cell 32 is gone back memory unit storehouse 33, suction nozzle data 34, plate data 35, Control Parameter 36 except NC program 37.The part dimension data 33a of every kind of unit type of part library 33 storages.The datum-plane altitude information 34a of suction nozzle data 34 each suction nozzle 21 of storage, it is the basis of measurement component height.Datum-plane altitude information 34a is the data of level height at the tip of the expression suction nozzle 21 that is used for the measurement component height, or expression is from the downward stroke of the upper limit of the level height of suction nozzle 21, and comprises the level height data on the absorption surface of each suction nozzle 21.Control unit 30 also is connected to computing unit 38, graphics processing unit 39, display unit 40 and operation/input unit 41 via bus 31.
Next, with reference to figure 5 method that is used for by first line sensor 13 and second line sensor, 14 detection parts is described.Fig. 5 show by each suction nozzle 21 drawn and parts P, first line sensor 13 and second line sensor 14 of fixing between the position relation.The parts of each suction nozzle fixing different size.At this, micro-element is 0402,0603 and 1005 chip parts, and they have fine distinction on size (for example length, width, highly, or the like).This micro-element also comprises 1608R and 2625R chip part, and does not have this fine dimension difference but have 0.5mm or other chip parts of low height more.
Notice that in the present embodiment, above-mentioned micro-element is the example as parts to be drawn, but the present invention is not limited to this micro-element, can use any other parts.
Each suction nozzle 21 is driven by driver element 22 up and down, thereby regulates its level height based on the datum-plane altitude information 34a of each suction nozzle 21.The datum-plane height of each suction nozzle 21 is set to, make each suction nozzle 21 not only draw the high-precision part that the side of each parts P of fixing also is positioned at first line sensor 13, in can detection range (from upper limit L1 to lower limit L2), and the installation surface of each parts P be positioned at the focusing range (but detection range) of second line sensor 14.As mentioned above, but the datum-plane height of each suction nozzle 21 must be set at the feasible parts P that draws just is positioned within the above-mentioned detection range.No matter the size of the parts P that draws is how, driver element 22 is up and down controlled, remain on the datum-plane height so that measure the measurement level height of the height of each suction nozzle 21, therefore use the high accuracy of measuring level height to come the height of detection part P.
For being positioned at by being adjusted to that each suction nozzle 21 of datum-plane height is separately drawn and the parts P of fixing, but the side of these parts P is positioned at the detection range (upper limit L1 is to lower limit L2) of first line sensor 13, and the installation surface of parts P is positioned at the focusing range (but detection range) of second line sensor 14.Therefore, move horizontally first line sensor 13 by side and keep level height constant simultaneously, the feasible level height that can detect the installation surface of these parts P continuously along parts P.In addition, drawn the also parts P of fixing by each suction nozzle 21 on second line sensor 14, make and to take the image of the installation surface of parts P continuously by order is mobile.
By computing unit 38 by the installation surface of the parts P that calculates first line sensor 13 and detected level height and datum-plane altitude information 34a in difference between the level height on absorption surface of the suction nozzle 21 that comprises, obtain the height of each parts P.
As mentioned above, by being drawn and the parts P of fixing will be reduced to the level height that first line sensor 13 can come detection part P with the high precision degree, be made the height that line sensor 13 can measurement component P of winning by each suction nozzle 21.
(second embodiment)
Next, an alternative embodiment of the invention is described.
The purpose of second embodiment is as follows.
According to the method described in disclosed references (Japanese Patent Application Publication No.2002-09496), drawn and the installation surface of the parts P of fixing is alignd with the level height of the focal position of second line sensor 14 by each suction nozzle 21, and no matter the height of each parts P how, thereby the level height of suction nozzle 21 is adjusted to the level height that obtains by the height that deducts each parts P from the level height of this focal position.More specifically, the level height of each suction nozzle 21 is managed by an absolute value.By with suction nozzle 21 be screwed in the nut coupling on the ball screw and control the axial rotation of this ball screw, the level height of regulating each suction nozzle 21.Therefore, when regulating the level height of suction nozzle 21, the error that is caused by the machining accuracy of ball screw is to the direct influence of having moved up and down of suction nozzle 21.For example, this error is about ± 50 μ m with respect to the stroke of 300mm.Therefore, when managing the level height of each suction nozzle 21 by absolute value, this level height also comprises approximately ± error of 50 μ m.
Since current at parts P size and weight on reduce, normal when drawing parts P measured parts P height and between the measured height trickle size difference is only arranged when normally not drawing parts P (being tilted the mode of absorption with parts P).For example, width and the tilt length of 0603 chip micro-element P are respectively 0.3mm and 0.35mm, and the difference between them is 0.05mm (that is 50 μ m).
In other words, must judge whether this micro-element P is normally drawn by only accurately detecting the difference of 50 μ m.Therefore, drawn the also height this micro-element P, that comprise the error that equates level of fixing if detect by suction nozzle 21, then the absorption attitude of this micro-element P may be detected improperly.
Therefore, as an example, present embodiment show a kind of be used for detecting accurately and effectively and measure by suction nozzle 21 drawn and the method for the height of the electronic unit (being specially micro-element) of fixing.Notice that the structure of electronic component mounter in the present embodiment is identical with structure in above first embodiment.
In order to detect the parts P that is drawn by each suction nozzle 21 that repeats fitting operation, the measurement level height of each suction nozzle 21 is controlled, so that it becomes the datum-plane height of being scheduled to for each suction nozzle 21.The height of the new parts P that draws is that the difference that level height and the suction nozzle 21 that comprises in datum-plane altitude information 34a by the installation surface of calculating the parts P that first line sensor 13 detected drawn between the surperficial level height obtains.
In other words, if parts to be measured are micro-elements, then can when using first line sensor, 13 measurement component height, keep the measurement level height of each suction nozzle 21 constant.
If keep the measurement level height of suction nozzle 21 constant, then the nut of driver element 22 repeats to screw with ball screw at same position as suction nozzle level height control unit up and down.Therefore, can limit the influence of the machine error that the machining accuracy by these nuts and ball screw causes.Thereby, make to reduce variation in the measurement level height on the absorption surface of the suction nozzle of regulating based on datum-plane altitude information 34a 21, and therefore can be with the height of high-acruracy survey parts P.
Note, can set the datum-plane height of each suction nozzle 21 arbitrarily, but as long as suction nozzle 21 is drawn and the parts P of fixing lays respectively in the detection range of first line sensor 13 and second line sensor 14.Because the measurement level height of each suction nozzle 21 is independently adjusted its own datum-plane height, therefore can measures by each suction nozzle 21 and be drawn the also height of the parts P of fixing with high accuracy.
Notice that although show parts P bigger than its actual conditions, the actual size of parts P is very small, and does not have perceptible difference between their height in Fig. 5.Therefore, second line sensor 14 can be taken the image of the installation surface of all parts P continuously, and will its installation surface horizontal alignment.
Next, the operating sequence of electronic component mounter is described with reference to figure 6.After beginning is installed, many suction nozzle unit is moved to the position of picking up on the banded feeder 5 that provides in the electronic unit feeding unit 4, thereby make each suction nozzle 21 can draw parts P (S1).After picking up parts, respectively the level height of suction nozzle 21 is adjusted to their datum-plane height (S2).Next, move first line sensor 13, from drawn also the side of the parts P of fixing by suction nozzle it is detected, and obtain the level height (S3) of the installation surface of each parts P.Above second line sensor 14, sequentially move the suction nozzle 21 drawn parts P, make that second line sensor 14 can be from the below detection part P of each parts P, and take the image (S4) of the installation surface of parts P.More specifically, S3 and S4 are drawn the also side of the parts P of fixing and the process that detection part P is come in the below from the suction nozzle of being regulated by the process level height of many suction nozzle unit 21.
Next, according to the difference between the level height on the absorption surface of the level height of the installation surface of the parts P that in S3, is detected and the suction nozzle 21 that in datum-plane altitude information 34a, comprises, calculate the height of each parts P, and itself and the sized data 33a in part library 33 are compared.Surpassed at the height of the parts P that is calculated under the situation of tolerance of height of the parts P that in sized data 33a, comprises, judging part P is drawn and fixing with unusual attitude (for example vertical position and obliquity), rather than with its installation surface normal attitude down, and execute exception is drawn processing (S5).Graphics processing unit 39 is handled the image of the installation surface of each the parts P that takes based on sized data 33a in S4.When judging part P caused installing owing to its wrong size and displacement, execute exception was drawn and is handled (S6).Execute exception is drawn and is handled in S5 or S6, gives up these parts P and draws new parts P (S1).Parts P to this new absorption repeats the operation of above S2 to S4, and when detected unusual absorption quantity surpasses pre-determined number, this situation is considered as mistake, and stops machine run.
Drawn and during fixing with normal attitude when in S3 and S4, detecting parts P, come the position (S7) of correcting unit P, then parts P is installed to its on the installation site on the plate 3 (S8) by the moving horizontally of suction nozzle 21, vertical moving and rotation.
After this, repeat the fitting operation of above S1 repeatedly, install up to finishing parts to S8.The measurement level height that is used to draw each suction nozzle 21 of new parts P at every turn repeating is adjusted to the datum-plane height (S2) of himself.In other words, S2 is such processing: wherein, each when repeating fitting operation, the level height that is used for repeating drawing many each suction nozzles of suction nozzle unit of new electronic unit be adjusted to each suction nozzle predetermined, the datum-plane height of himself.
Before by second line sensor, 14 detection parts (S4), can detect (S3) to it by first line sensor 13, vice versa.Two detections can be carried out simultaneously.Because first line sensor 13 is attached to and transmits 8 in the present embodiment, therefore 8 detection parts when moving can transmitted.In other words, can draw and the suction nozzle 21 of fixing parts P when mobile, comes detection part P by first line sensor 13 above second line sensor 14 and plate 3.Therefore, can improve the speed and the efficient of fitting operation.Note, also can come parts are detected by being placed on first line sensor 13 on the pedestal 1 and moving along the side of first line sensor 13 and to transmit 8.
As mentioned above, according to electronic component mounter of the present invention and installation method, can use the high accuracy of the measurement level height of suction nozzle, measure by each suction nozzle of many suction nozzle unit and drawn the also height of the parts of fixing, and can detect continuously by many suction nozzle unit and be drawn the also parts of fixing.Therefore, can come detection part, thereby not only can avoid the substandard products plate but also can improve the performance of erector with high efficiency and high accuracy.
(the 3rd embodiment)
Next, with reference to figure 7 method that is used for by first line sensor 13 and second line sensor, 14 detection parts is described.In the present embodiment, be first parts and second parts with part classification to be installed, use different detection methods to detect first parts and second parts respectively.Notice that the structure of electronic component mounter in the present embodiment is identical with above first and second embodiment.
In the present embodiment, first parts are micro-elements, 0402,0603 and 1005 chip capacitors for example, and they size (for example length, width, highly, tilt length or the like) on subtle difference is arranged.This micro-element also comprises 1608R and 2625R chip capacitor and other chip parts, and it does not have this nuance dimensionally, but has 0.5mm or littler height.On the other hand, second parts are not to be classified as parts first parts, relatively large.The height of first parts does not have marked change between type, and the height of second parts alters a great deal between type.
At first, with reference to figure 7A the method that is used to detect first parts is described.Fig. 7 A show drawn by each suction nozzle 21 and the first parts P1, first line sensor 13 and second line sensor 14 of fixing between the position relation.
Each suction nozzle 21a holds the first parts P1 of different size.Each suction nozzle 21a is driven by driver element 22 up and down, thereby regulates its level height based on self datum-plane altitude information 34a of suction nozzle 21.The datum-plane height of each suction nozzle 21a is set to, but make not only and to be drawn the detection range that the side of each first parts P1 of fixing also is positioned at first line sensor 13 (from upper limit L1 to lower limit L2), and the installation surface of each first parts P1 is positioned at the focusing range (but detection range) of second line sensor 14 by each suction nozzle 21a.
Draw also all first parts P1 of fixing for each suction nozzle 21a that is adjusted to its datum-plane height separately, but the side of these first parts P1 is positioned at the detection range (from upper limit L1 to lower limit L2) of first line sensor 13, and its installation surface is positioned at the focusing range (but detection range) of second line sensor 14.Therefore, by moving first line sensor 13 along the side of the first parts P1 and being maintained fixed level height, can detect the level height of the installation surface of each first parts P1 continuously.In addition, drawn the also first parts P1 of fixing, the feasible image that can take the installation surface of each first parts P1 continuously by above second line sensor 14, sequentially moving by each suction nozzle 21a.
By calculating the difference between the level height on the absorption surface of the level height of the installation surface of the first parts P1 that first line sensor 13 is detected and the suction nozzle 21a that in datum-plane altitude information 34a, comprised, obtain the height of each first parts P1 by computing unit 38.
In order to detect the first parts P1 that is drawn by each the suction nozzle 21a that repeats fitting operation, the measurement level height of each suction nozzle 21a is controlled, to be the datum-plane height of suction nozzle 21a.By calculating the difference between the level height on the level height of the installation surface of the first parts P1 that first line sensor 13 is detected and the absorption surface that is included in the suction nozzle 21a among the datum-plane altitude information 34a, obtain the height of the first parts P1 of new absorption.
In other words, if when parts to be detected are micro-elements as the first parts P1, can when using first line sensor, 13 measurement component height, keep the measurement level height of suction nozzle 21a constant.
If it is constant that the measurement level height of suction nozzle 21a keeps, then the nut suction nozzle as the driver element up and down 22 of suction nozzle level height control unit repeats to screw with ball screw at same position.Therefore, can limit influence by the machine error that machining accuracy caused of these nuts and ball screw.Thereby, can reduce the variation in the measurement level height on the absorption surface of the suction nozzle 21a that regulates based on datum-plane altitude information 34a, and therefore can be with the height of the high-acruracy survey first parts P1.
Note, can set the datum-plane height of each suction nozzle 21a arbitrarily, but as long as suction nozzle 21a draws and the first parts P1 of fixing lays respectively in the detection range of first line sensor 13 and second line sensor 14.Because the measurement level height of each suction nozzle 21a is independently adjusted the datum-plane height, therefore can measures by each suction nozzle 21a and be drawn the also level height of the first parts P1 of fixing with high accuracy.
Note, although in Fig. 7 A, the first parts P1 is shown bigger than its actual conditions, the actual size of the first parts P1 is very small, and does not have perceptible difference between their height.Therefore, second line sensor 14 can be taken the image of the installation surface of all first parts P1 continuously, and will its installation surface horizontal alignment.
Next, with reference to figure 7B the method that is used to detect second parts is described.Fig. 7 B shows by each suction nozzle 21b and is drawn the also second parts P2 and the relation of the position between second line sensor 14 of fixing.Each suction nozzle 21b holds the second parts P2 of different size.
Each suction nozzle 21b is driven by driver element 22 up and down, thus the level height of regulating suction nozzle 21b based on the sized data 33a of each second parts P2, and with the level height of the installation surface of all second parts P2 at level height L3 horizontal alignment.Level height L3 is set at an interior value of focusing range (but detection range) of second line sensor 14, and drawn the also second parts P2 of fixing by above second line sensor 14, sequentially moving, can be taken the image of the installation surface of each second parts P2 continuously by each suction nozzle 21b.
As mentioned above, by on the horizontal plane installation surface of each second parts P2 (significant change is highly arranged between they are dissimilar) being alignd, second line sensor 14 can detect the second parts P2 continuously.Notice that reference number 21a and 21b distribute to suction nozzle 21 in order to illustrate purpose, suction nozzle 21a is identical suction nozzle 21 with suction nozzle 21b.
Next, the operation of electronic component mounter is described with reference to figure 8.At first, judge that parts to be installed are first parts or second parts (S21).If parts to be installed are first parts, then after having drawn parts, the level height of suction nozzle 21 is adjusted to their datum-plane height (S22) respectively.Next, move first line sensor 13, to be drawn also the side of the first parts P1 of fixing from suction nozzle it is detected, and obtain the level height (S23) of the installation surface of each first parts P1.Above second line sensor 14, sequentially move the suction nozzle 21 of having drawn the first parts P1, thereby make second line sensor 14 to detect it, and take the image (S24) of the installation surface of each first parts P1 from the below of the first parts P1.More specifically, S23 and S24 are used for drawing and the side of first parts of fixing and lower surface first detect processing to what first parts detected from the suction nozzle 21 that the process level height of many suction nozzle unit is regulated.
Next, according to the difference between the level height on the absorption surface of the level height of the installation surface of the first parts P1 that in S23, is detected and the suction nozzle 21 that in datum-plane altitude information 34a, comprises, calculate the height of each first parts P1, and itself and the sized data 33a in part library 33 are compared.Surpassed at the height of the first parts P1 that is calculated under the situation of tolerance of height of the first parts P1 that in sized data 33a, comprises, judge that the first parts P1 is drawn and fixing with unusual attitude (for example vertical position and obliquity), rather than with its installation surface normal attitude down, and execute exception is drawn processing (S25).Graphics processing unit 39 is handled the image of the installation surface of each first parts of taking based on sized data 33a in S24.When judging part caused being installed on the tram owing to its wrong size and displacement, execute exception was drawn and is handled (S26).Execute exception is drawn and is handled in S5 or S6, gives up these first parts and draws new first parts (S21).First parts to this new absorption repeat the operation of above S22 to S24, and when detected unusual absorption quantity surpasses pre-determined number, this situation are considered as mistake, and stop machine run.
Drawn and during fixing with normal attitude when in S23 and S24, detecting parts P, proofread and correct first position component (S27) by the moving horizontally of suction nozzle 21, vertical moving and rotation, then first parts are installed to its on the installation site on the plate 3 (S28).
After, repeat the installation steps of above S21, up to finishing fitting operation to S28.The measurement level height that is used to draw each suction nozzle 21 of new parts P at every turn repeating is adjusted to the datum-plane height (S22) of himself.In other words, S22 first regulate to handle, and wherein, each when repeating fitting operation, the level height of each suction nozzle that is used for repeating drawing many suction nozzle unit of new electronic unit is adjusted to predetermined, the datum-plane height of himself of each suction nozzle.
On the other hand,, then regulate the level height of suction nozzle 21 respectively based on sized data 33a if parts to be installed are second parts, and with level height horizontal alignment (S29) on same level height of the installation surface of all second parts.S29 second regulate to handle, and wherein, the level height of each suction nozzle is adjusted so that suction nozzle draws the level height of the installation surface of all second parts of fixing also at same level height horizontal alignment in many suction nozzle unit.
Next, above second line sensor 14, sequentially move the suction nozzle 21 of having drawn second parts, thereby make second line sensor 14 to detect it, and take the image (S30) of the installation surface of each second parts from the below of second parts.S30 is used for from the lower surface of second parts second detection that second parts detect being handled, and the installation surface of second parts is alignd in same level height.
Can be by first line sensor, 13 detection parts before by second line sensor, 14 detection parts, vice versa.Two detections can be carried out simultaneously.In the present embodiment, transmit 8, therefore can transmit 8 detection parts when moving because first line sensor 13 is attached to.In other words, can draw and the suction nozzle 21 of fixing first parts when mobile, detects first parts by first line sensor 13 above second line sensor 14 and plate 3.Therefore, can improve the speed and the efficient of fitting operation.Note, also can come parts are detected by being placed on first line sensor 13 on the pedestal 1 and moving along the side of first line sensor 13 and to transmit 8.
As mentioned above, according to electronic component mounter of the present invention and installation method, the parts detection method is different between unit type to be installed (i.e. first parts and second parts).Therefore, can adopt the detection method that is suitable for unit type to be installed to detect parts to be installed.In addition, so first parts to micro-element, can use the high-precision measurement level height of suction nozzle to measure and be drawn and the height of the parts of fixing, and can detect continuously by many suction nozzle unit and be drawn the also parts of fixing by each suction nozzle of many suction nozzle unit.Therefore, can come detection part, thereby not only can avoid the substandard products plate but also can improve the performance of erector with high efficiency and high accuracy.
(the 4th embodiment)
Next, embodiments of the invention will be described with reference to the drawings.In the present embodiment, the detailed measurements method that is used for normal elements is described, rather than at the micro-element described in above the 3rd embodiment.
Fig. 9 is the external perspective view of parts erector according to an embodiment of the invention, has the profile of this erector inside.
More precisely, erector 110 is such erectors: it can install various electronic units onboard, comprise micro-element and bigger parts (such as connector), and it is a kind of high-speed multifunctional erector that various electronic units can be installed, and comprises micro-element (such as resistor and capacitor) and bigger IC parts (for example quad flat package (QFP) and ball grid array (BGA)).
Figure 10 is the plane graph that the main internal structure of parts erector 100 is shown.
Figure 11 transmits a perspective view of 110, and particularly, Figure 11 A transmits a top perspective of 110, and Figure 11 B transmits a bottom perspective view of 110.
As shown in figure 11, transmitting 110 is such unit: it obtains a plurality of electronic units from parts feeding unit 115, these electronic units are transported to plate top, and it is installed on onboard precalculated position, and transmit 110 and comprise: a plurality of suction nozzle unit 112; As the suction nozzle 111 of fixing unit, it is attached to corresponding suction nozzle unit 112 with alternative way; And scanning survey unit 130, it can move on the direction that suction nozzle unit 112 is arranged.
Figure 12 schematically shows the projector 131 that is attached on the scanning survey unit 130 and the end view of first line sensor 132.
As shown in Figure 12, scanning survey unit 130 is equipped with the projector 131 on a sidewall, be used for 130 internal transmission light in the scanning survey unit, and on another sidewall of scanning survey unit 130, be equipped with first line sensor 132 of vertical placement, be used to receive the light that is throwed from the projector 131.
Notice that Figure 12 schematically shows the scanning survey unit 130 that directions X is watched from Figure 11.Among Figure 12,111 indication suction nozzles, the electronic unit that P indication suction nozzle 111 will be drawn.
In addition, scanning survey unit 130 is furnished with second line sensor 133 in the bottom, and it is towards the bottom surface of the electronic unit of 111 fixings of suction nozzle, so that take the image of parts.
Figure 13 is the functional block diagram that the functional structure of parts erector 100 is shown.
As shown in the drawing, parts erector 100 comprises: mechanism unit 101, and it reduces electronic unit P and inswept scanning survey unit 130, to measure the height of electronic unit P; And height measurement unit 140, it controls this mechanism unit 101, to measure the height of electronic unit P.
As mentioned above, mechanism unit 101 comprises: suction nozzle unit 112, and it moves up and down suction nozzle 111, and is furnished with encoder 114, and encoder 114 is exported the reduction amount of suction nozzle 111 as digital signal; And scanning survey unit 130, it is furnished with first line sensor 132, and can slide on the direction of suction nozzle unit 112.
Note,, omitted description it although the mechanism unit 101 of erector 100 is equipped with other devices or the like.In addition, mechanism unit 101 also has electronic unit P is installed to function on the plate 120.
For example, can be by amount of movement and each suction nozzle 111 position on scanning direction method that be associated, that be used to specify the parts P that is measuring with scanning survey unit 130, be used to specify the method for parts to be measured and the measurement order on the moving direction of scanning survey unit 130, or the like, specify suction nozzle unit 112.
Overall situation control unit 145 is to be used for following processing unit: control head control unit 143 and scan control unit 144 based on the program that is stored in memory cell 146, so that its can be under the situation of preliminary surveying preliminary measurement component, and control head control unit 143 and scan control unit 144 so that its can be under the situation that certainty is measured certainty ground measurement component.Overall situation control unit 145 is judged the height of the electronic unit P that is used for preliminary surveying, and controls head control unit 143 according to the result of determination in preliminary surveying and carry out the certainty measurement.
At this, preliminary surveying is such processing: reduce suction nozzle 111 so that the lower surface of parts P enters the measuring range of first line sensor 132, and by preliminary the height of measurement component P of first line sensor 132.
The certainty measurement is such processing: based on the height of the parts P that preliminary surveying obtained, reduce suction nozzle 111, so that the lower surface of parts P is positioned at the high accuracy scope of first line sensor 132, and by the height of first line sensor, 132 certainty ground measurement component P.
Measuring unit 141 is the interfaces that receive from the signal of the encoder 114 and first line sensor 132, and is to be the processing unit of the signal (signal of indication true altitude) that can easily handle of height measurement unit 140 with this conversion of signals.
High computational unit 142 is based on the processing unit that calculates the height of electronic unit P from signal of measuring unit 141 or the like.
Next, a kind of method of using the aforesaid erector 100 of structure to measure the height of electronic unit P is described.
Figure 14 is the diagrammatic sketch that the sequence of operation of erector 100 execution is shown.
At first, suction nozzle 111 is drawn electronic unit P (S501) from parts feeding unit 115.Transmission in the present embodiment 110 can be drawn and fixing 8 electronic units nearly, below explains to be based on and draws and the hypothesis of a plurality of electronic unit P of fixing.
Next, scan control unit 144 is motion scan measuring unit 130 on the alignment direction of suction nozzle unit 112, so that 130 scannings of scanning survey unit transmit the electronic unit P (S502) of 110 fixings.
Next, as shown in figure 15, under the situation that 132 pairs of scannings of first line sensor (S502) respond, (be "Yes" among the S503), promptly detect under the situation of the part that existence is blocked from the light of the projector 131 (being "Yes" among the S503) at first line sensor 132, high computational unit 142 is based on from the signal of first line sensor 132 with from the signal of the encoder in the suction nozzle unit 112, tentatively calculate the height (S506) of electronic unit P, and the height that is calculated tentatively is kept in the memory cell 146.
More specifically, measuring unit 141 receives the signal from first line sensor 132 when the light from the projector 131 is blocked, and the signal relevant with L2 shown in Figure 15 is sent to high computational unit 142.In this case, measuring unit 141 also receives the signal from encoder, and the signal relevant with L1 shown in Figure 15 is sent to high computational unit 142.Notice that L1 reduces the amount of suction nozzle 111 from initial position (Figure 15 " 0 "), this initial position is the basis that is used for suction nozzle 111 is reduced to the reduction amount of the position that first line sensor 132 responds.L2 is the distance of the extreme lower position of the scope that (Figure 15 for " C ") is blocked to light from the vertical reference position of first line sensor 132.
Notice that the preset range that is included in above and below, above-mentioned vertical reference position part is the highly sensitive part of first line sensor 132.
High computational unit 142 is from the measuring unit 141 acquisitions signal relevant with L1 and L2, and based on the preset distance L0 between the reference position C of the initial position 0 and first line sensor 132 (being 6mm in the present embodiment), according to equation PT (height of electronic unit P)=L0-L1-L2, tentatively calculate the height of electronic unit P.At this, because L2 is the value of locating to obtain around the two ends of first line sensor 132, therefore the precision of this measurement is lower, thereby this value comprises bigger error.
To all carrying out above-mentioned processing operation transmitting all suction nozzles 111 that are equipped with in 110.
On the other hand, even (be "No" among the S503) in first line sensor 132 under the also responseless situation having carried out above-mentioned scanning, the suction nozzle 111 (for example, additionally reducing 1mm) that head control unit 143 only is reduced in the responseless position of transducer further (S504).
Repeat above-mentioned processing (S502 to S505), up to the height (S507) that has tentatively calculated all electronic unit P that suction nozzle 111 held.
As the result of above processing, the height of all electronic unit P of primary Calculation is stored in (S506) in the memory cell 146.
Notice that Figure 15 is not shown default setting also, and show the state after having reduced suction nozzle 111 to a certain degree.In addition, suction nozzle 111 is reduced step by step, because all suction nozzles 111 all are in the stable state at specified level height place, so that scanning survey unit 130 scans it from the side of all electronic unit P, and sequentially measures its height.
In primary Calculation after the height of all parts, head control unit 143 each suction nozzle unit 112 of control, so that reduce each suction nozzle 111 based on signal from encoder 114, thereby make the lower surface of electronic unit P of 111 fixings of each suction nozzle be positioned at the place, reference position (than the position of initial position 0 low 6mm) of first line sensor 132, (S508) as shown in figure 16 based on the value of primary Calculation.
Next, scan control unit 144 gated sweep measuring units 130, so that it is moved, measuring unit 141 uses first line sensor 132 to measure the position (S509) of the lower surface of each electronic unit P simultaneously.
At last, the height (S510) of each electronic unit P is measured in high computational unit 142 based on reduction amount (from the signal of encoder) the certainty ground of measured value of first line sensor 132 and suction nozzle 111.
Adopt the height of measuring each electronic unit P with above identical method, i.e. height by each electronic unit P of equation PT=L0-L1-L2 certainty ground calculating.At this, because the lower surface of each electronic unit P is positioned at the near (L2 of the most responsive reference position C of first line sensor
0), can measure the height of electronic unit P herein with full accuracy certainty ground, L2 is more accurate, and only comprises less error.Notice that in Figure 16, the lower surface of electronic unit P is positioned at C place, reference position exactly, but it can depart from this reference position C with the error that is caused by primary Calculation.
Said structure and processing allow to measure based on the reduction amount of each suction nozzle 111 height of the various electronic unit P from small parts to big parts, even use the first less relatively line sensor 132 of size.In addition, because first line sensor 132 is measured described height on its sensitiveest part certainty ground, therefore can obtain the high accuracy value.
In addition, highly measure, the parts of having measured can also be installed on the plate 120 because the transmission of installing component 110 is carried out this.Therefore, do not need only to be used for highly measuring the electronic unit P of demand.
Be furnished with scanning survey unit 130 owing to transmit 110, therefore can transmit 110 move in the height of measurement component P, therefore can not cause temporal loss.Because scanning survey unit 130 is very little, therefore not only can avoid owing to transmit the reduction of the positioning accuracy of a transmission that 110 oneself heights cause 110, and this small size scanning survey unit 130 can also be with the high-acruracy survey component height.
Note, although described present embodiment based on height measurement unit 140 and erector 100 integrated hypothesis, but height measurement unit 140 might not be integrated with erector 100, can be used as to be used to control the device of erector 100 and to separate with erector 100.
Although measure for certainty, the lower surface of parts P is positioned at C place, reference position, and the present invention is not limited to this location.The lower surface of parts P only need be positioned at the high accuracy part (in high sensitivity range) of first line sensor 132.
In addition, can use the altitude information of the electronic unit P in part library to substitute the value that preliminary surveying obtained, measure so that carry out certainty based on this altitude information.In other words, the high sensitivity that can be placed on first line sensor 132 by the lower surface with parts P is partly measured described height.
In preliminary surveying, suction nozzle 111 is not progressively to reduce, but can once reduce based on the altitude information of the electronic unit P in part library.
(the 5th embodiment)
Next, another embodiment of the present invention is described with reference to the drawings.In the present embodiment, the detail operations of measuring micro-element is described.
At this, micro-element is 0402,0603 and 1005 chip parts, and they have nuance on the size such as length, width, height or the like.This micro-element also comprises 1608R and 2625R chip part and does not have this nuance dimensionally but have 0.5mm or other chip parts of low height more.
Identical among the configuration of present embodiment and the above embodiment, the height measurement method in the present embodiment is all identical to step S507.Therefore, omitted description to it.
Figure 17 illustrates the flow chart that is used to measure in the processing of the reduction set point of suction nozzle 111 and the relation between the actual reduction amount.
Figure 18 is the end view that the reduction amount of measuring suction nozzle 111 is shown.
As shown in the drawing, head control unit 143 reduces the suction nozzle 111 (S801) of not holding electronic unit P.More specifically, give head control unit 143 with set point (for example 5.5mm) in advance, so that the lower surface of suction nozzle 111 be positioned on the reference position of first line sensor 132 preset distance (for example, 0.5mm) level height on, and head control unit 143 based on from the signal controlling suction nozzle unit 112 of encoder 114 so that reduce suction nozzle 111.
Next, scan control unit 144 scans (S802) when gated sweep measuring unit 130 moves, and simultaneously, measuring unit 141 obtains from reference position C to suction nozzle the distance L 2 of 111 lower surface.
Next, deduct the distance L 2 that is obtained the distance L 0 (for example 6mm) of high computational unit 142 between initial position 0 and reference position C, so that calculate actual reduction amount L1 (S803).
As above result calculated, obtained the relation between above set point and actual reduction amount L1.In the present embodiment, if because the hypothesis set point is 5.5mm, then the amount L1 that is obtained has trickle deviation, so repetitive error will be far smaller than the reduction error.
Figure 19 is the flow chart of the sequence of operation that the height of measurement electronic unit P in the present embodiment is shown.
After the primary Calculation of the height of having finished electronic unit P, (be "Yes" among the S507 in above embodiment), judge whether the height of the electronic unit P of primary Calculation is predetermined value or bigger (S901).This predetermined value can be set to for example actual reduction amount of suction nozzle 111 and 5 to 10 times value of the error between this set point.For example, if error is 50 μ m, then predetermined value is set at 0.5mm.
Because present embodiment at micro-element, therefore is judged to be "No" in S901.On the contrary, if installation is normal elements rather than micro-element, then in S901, be judged to be "Yes".
Notice that comparative result between preliminary surveying value and the predetermined value judges although be based on, and can judge according to unit type in S901.For example, if micro-element will be installed then in S901, be judged to be "No", if the parts outside the micro-element will be installed then in S901, be judged to be "Yes".
Next, at the height of primary Calculation is under predetermined value or the bigger situation (being "Yes" among the S901), as shown in figure 20, reduce suction nozzle 111, so that the lower surface of suction nozzle 111 is arranged in the position (S902) of measuring electronic unit P as above embodiment really qualitatively.
On the other hand, under the situation of height less than predetermined value of primary Calculation (being "No" among the S901), then as shown in figure 21, use and the identical set point of when measuring the reduction amount of suction nozzle 111 before, having set of value (5.5mm), electronic unit P is reduced to measuring position (S903).
Next, scanning survey unit 130 is scanned (S904), so that from first line sensor, 132 picked up signal.
At last, calculate the height PT (S905) of electronic unit P.Use equation PT=L0-L1-L2, measure the height of electronic unit P by the method identical with above embodiment.At the height of the electronic unit P of preliminary surveying is under predetermined value or the littler situation, with this set point as the L1 in the above equation, and be to use under the situation of not holding electronic unit P by measuring the value that is obtained.
By adopting said method, not only can reduce the error that comprises among the L2, but also can when the height of the electronic unit P that measures relative thin, be reduced in the error that comprises among the L1.Therefore, can reduce the error that comprises among the PT (measured height value).
Although below only describe some embodiments of the present invention in detail, the person skilled in the art will easily understand, can much revise in the exemplary embodiment and can not break away from innovation of the present invention and advantage in itself.Therefore, all such modifications all will be within the scope of the present invention.
Industrial applicability
According to the present invention, can be with the height of high-acruracy survey electronic unit. Therefore, the present invention can be used for following field, wherein draws the electronic unit in the electronic unit feeding unit with suction nozzle and attaches it on the member to be installed such as plate.
Claims (10)
1. component height method of measurement that is applied to be furnished with the erector that transmits head, described transmission head has parts absorption-fixing suction nozzle, and described transmission head is used for transfer member and described parts is installed to plate, and described method comprises:
The preliminary surveying step reduces by described suction nozzle and draws and the parts of fixing, and uses the reduction amount of described suction nozzle and from the signal of the transducer output of the height that is used for measurement component, measure the height of the vertical direction of described parts;
Reduce step,, parts are reduced within the high accuracy scope of described transducer based on the height of the parts that in described preliminary surveying step, record; And
Use the measuring process of the height of the described parts of described sensor measurement.
2. component height method of measurement according to claim 1 also comprises:
Lower end position obtains step, reduces the not suction nozzle of fixing parts, and obtains the information relevant with the upright position of this suction nozzle lower end.
3. according to one in claim 1 and 2 described component height method of measurement,
Wherein, described measuring process comprises: under the situation of height less than predetermined value that records, described suction nozzle lower end is remained on the precalculated position of vertical direction in described preliminary surveying step, and the height of described parts is measured on certainty ground.
4. according to one in claim 1 and 2 described component height method of measurement,
Wherein, described measuring process comprises: the height that records in described preliminary surveying step is equal to or greater than under the situation of predetermined value, and the parts lower end is remained on the precalculated position of vertical direction, and the height of described parts is measured on certainty ground.
5. according to one in claim 1 and 2 described component height method of measurement,
Wherein, make described suction nozzle static in vertical direction after, described transducer and described parts are relatively moved, and carry out one of described preliminary surveying step and described measuring process.
6. component height method of measurement according to claim 1,
Wherein said transmission head has a plurality of suction nozzles and described transducer, and
Described measuring process comprises: draw also each parts of fixing by making the described suction nozzle of described sensor scan, measure the height of described parts.
7. component mounting method that is applied to be furnished with the erector that transmits head, described transmission head has parts absorption-fixing suction nozzle, and described transmission head is used for transfer member and described parts is installed to plate, and described method comprises:
The preliminary surveying step reduces by described suction nozzle and draws and the parts of fixing, and uses the reduction amount of described suction nozzle and from the signal of the transducer output of the height that is used for measurement component, measure the height of the vertical direction of described parts;
Reduce step,, parts are reduced in the high accuracy scope of described transducer based on the height of the parts that in described preliminary surveying step, record;
Measuring process uses the height of the described parts of described sensor measurement; And
Installation steps, the height based on measured parts is installed to parts on the plate.
8. component height measuring equipment, by described component height measuring equipment being applied to be furnished with the height that the erector that transmits head comes measurement component, described transmission head has parts absorption-fixing suction nozzle, described transmission head is used to transmit described parts and described parts is installed to plate, and described equipment comprises:
Reduce amount detection unit, be used to detect the reduction amount of described suction nozzle;
The head control unit is used to control the vertical moving of described suction nozzle;
The high computational unit is used for calculating described suction nozzle and drawing the also height of the described parts of fixing based on from the signal of described transducer output and the signal of exporting from described reduction amount detection unit;
Reduce the unit, be used for described parts are reduced in the high accuracy scope of transducer of the height that is used to measure described parts;
Overall situation control unit, be used to control described transmission head, so that the height of the described parts of primary Calculation, control described transmission head once more based on the height of primary Calculation then, so that described parts are reduced within the high accuracy scope of described transducer, measure the also height of the described parts of certainty ground calculating; And
Measuring unit is used to use described transducer to measure the height of described parts.
9. be furnished with the erector that transmits head for one kind, described transmission head has parts absorption-fixing suction nozzle, and described transmission head is used for transfer member and described parts are installed to plate, and described erector comprises:
Reduce amount detection unit, be used to detect the reduction amount of described suction nozzle;
The head control unit is used to control the vertical moving of described suction nozzle;
The high computational unit is used for calculating described suction nozzle and drawing the also height of the described parts of fixing based on from the signal of described transducer output and the signal of exporting from described reduction amount detection unit;
Reduce the unit, be used for described parts are reduced in the high accuracy scope of transducer of the height that is used to measure described parts;
Overall situation control unit, be used to control described transmission head, so that the height of the described parts of primary Calculation, control described transmission head once more based on the height of primary Calculation then, so that described parts are reduced within the high accuracy scope of described transducer, measure the also height of the described parts of certainty ground calculating; And
Measuring unit is used to use the height of the described parts of described sensor measurement,
Wherein, have a plurality of described suction nozzles,
Described transducer is drawn and this parts are detected in the side of the described parts of fixing from described suction nozzle, and
Described reduction unit is used to be independent of other suction nozzles to be regulated the height of a plurality of described suction nozzles, and when repeating installation action, the height of each suction nozzle of fixing parts is adjusted to a constant altitude respectively with repeatedly drawing also at every turn.
10. erector according to claim 9,
Wherein, described reduction unit is used for optionally carrying out: be used for the height of each suction nozzle is adjusted to respectively the control of certain altitude; And be used for each suction nozzle drawn and control that the lower surface of the parts of fixing aligns on horizontal plane.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP223681/2005 | 2005-08-02 | ||
| JP2005223681A JP2007042766A (en) | 2005-08-02 | 2005-08-02 | Mounting device and mounting method of electronic component |
| JP224892/2005 | 2005-08-03 | ||
| JP2005224892A JP4626437B2 (en) | 2005-08-03 | 2005-08-03 | Electronic component mounting method |
| JP2005237334 | 2005-08-18 | ||
| JP237334/2005 | 2005-08-18 | ||
| PCT/JP2006/315543 WO2007015561A1 (en) | 2005-08-02 | 2006-07-31 | Electronic component mounter and mounting method |
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| Publication Number | Publication Date |
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| CN101233800A CN101233800A (en) | 2008-07-30 |
| CN101233800B true CN101233800B (en) | 2011-07-27 |
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| CN2006800283502A Active CN101233800B (en) | 2005-08-02 | 2006-07-31 | Electronic component mounter and mounting method |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102241007A (en) * | 2011-06-27 | 2011-11-16 | 鸿富锦精密工业（深圳）有限公司 | Detaching device |
| JP6031265B2 (en) * | 2012-06-15 | 2016-11-24 | Juki株式会社 | Parts inspection device |
| JP5997990B2 (en) | 2012-09-13 | 2016-09-28 | ヤマハ発動機株式会社 | Electronic component mounting apparatus and method of using electronic component mounting apparatus |
| JP6528133B2 (en) * | 2016-03-04 | 2019-06-12 | パナソニックＩｐマネジメント株式会社 | Component mounting device |
| CN106767455A (en) * | 2016-12-15 | 2017-05-31 | 惠科股份有限公司 | Automatic measurement method and equipment for transfer handover platform of driving chip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1421119A (en) * | 2000-03-28 | 2003-05-28 | 西门子公司 | Method and device for monitoring electric component in pick-and-place device for substrates |
| US6608320B1 (en) * | 1998-11-05 | 2003-08-19 | Cyberoptics Corporation | Electronics assembly apparatus with height sensing sensor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277635A (en) * | 1988-09-14 | 1990-03-16 | Fujitsu Ltd | Measuring robot |
| JP2816787B2 (en) * | 1992-11-09 | 1998-10-27 | ヤマハ発動機株式会社 | Suction nozzle control device for mounting machine |
| JP4405012B2 (en) * | 1999-11-05 | 2010-01-27 | パナソニック株式会社 | Component recognition method and component mounting method |
| JP2002009496A (en) * | 2000-06-21 | 2002-01-11 | Matsushita Electric Ind Co Ltd | Method and device for mounting electronic part |
| JP2005109287A (en) * | 2003-10-01 | 2005-04-21 | Juki Corp | Electronic component mounter |
-
2005
- 2005-08-02 JP JP2005223681A patent/JP2007042766A/en active Pending
-
2006
- 2006-07-31 CN CN2006800283502A patent/CN101233800B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6608320B1 (en) * | 1998-11-05 | 2003-08-19 | Cyberoptics Corporation | Electronics assembly apparatus with height sensing sensor |
| CN1421119A (en) * | 2000-03-28 | 2003-05-28 | 西门子公司 | Method and device for monitoring electric component in pick-and-place device for substrates |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2002-111288A 2002.04.12 |
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| Publication number | Publication date |
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| CN101233800A (en) | 2008-07-30 |
| JP2007042766A (en) | 2007-02-15 |
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