CN103901334A - Micro-adjustable wafer test machine - Google Patents
Micro-adjustable wafer test machine Download PDFInfo
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- CN103901334A CN103901334A CN201210583444.3A CN201210583444A CN103901334A CN 103901334 A CN103901334 A CN 103901334A CN 201210583444 A CN201210583444 A CN 201210583444A CN 103901334 A CN103901334 A CN 103901334A
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Abstract
The invention relates to a micro-adjustable wafer test machine which comprises a wafer platform deck, a cam slider mechanism, a precision micro-adjustment mechanism, an elastic relaxation device, a motion stop device and a probe testing device. The cam slider mechanism drives the wafer platform deck to move up and down. The precision micro-adjustment mechanism comprises an XY adjustment platform, an angle rotation adjustment platform, a cross guide rail vertical adjustment system and an observation lens XY displacement platform. Through a spring and a circular elastic steel sheet of the elastic relaxation device, the operation of operation personnel is time-saving and effort-saving. Through a spring positioning pin of the motion stop device, the wafer platform deck rapidly rests after the motion stops. According to the invention, through the precision micro-adjustment mechanism, the damage of a probe is reduced and frequent probe replacement is avoided; through the motion stop device, shaking caused by inertial when the motion stops is avoided, and the test precision and efficiency are improved; through the elasticity of the elastic relaxation device, a load can quickly arrive at a place, the operation time is shortened; and the efficiency is improved.
Description
Technical field
The present invention relates to a kind of wafer test machine, relate in particular to a kind of fine-tuning wafer test machine.
Background technology
Along with designs trend increases towards unit area current densities, the direction of increased functionality is advanced, the number of pins of required by electronic product is also along with increase, carrying out system single chip design, when multi-chip module encapsulation or system in package, for avoiding causing the cost of idleness of scrapping of whole pack module, checking on of wafer sort before encapsulation and single crystal grain non-defective unit, make complete and reliable wafer sort increasingly important, current wafer test machine, all that wafer to be measured is put in wafer carrier, manually microscope carrier mechanism being pushed to probe seat deposits, rotating handles makes wafer carrier mechanism, make wafer contact probe, in above-mentioned test step, test machine does not have fine adjustment, all settle at one go, can cause like this damage of probe, moreover test machine needs manual the contacting of probe and wafer that complete for twice, inefficiency, make workman easily cause fatigue.
Summary of the invention
The technical problem to be solved in the present invention is to avoid above-mentioned the deficiencies in the prior art part and proposes a kind of fine-tuning wafer test machine, realizes movement and the vertical motion of wafer carrier by cam slide mechanism, saves time, and raises the efficiency.Further aim of the present invention is the fine setting by wafer carrier, and protection probe, guarantees that wafer contacts with probe more accurate.
The present invention relates to a kind of fine-tuning wafer test machine, it comprises a wafer carrier, a cam slide mechanism, a Precision trimming mechanism, an elastic force loosening device, a motion stop device, a probe tester.
Described in above-mentioned cam slide mechanism, cam slide mechanism includes cam, axle center, bearing seat, rocking handle, register pin, slide block, line slideway, leading plate, guide plate web joint, locating piece, base plate and guide plate; Line slideway is fixed on leading plate and is vertically mounted on base plate, bearing seat is vertically mounted on base plate, guide plate is installed in parallel on slide block, guide plate web joint is vertically fixed on guide plate, cam pulls by rocking handle, the rotation of coupling shaft, band movable slider moves up and down in line slideway, realizes moving up and down of wafer carrier.
Above-mentioned Precision trimming mechanism comprises that XY adjusts platform, angular turn is adjusted platform, the vertical adjustment System of cross slideway and observation camera lens XY displacement platform.
Above-mentioned XY adjusts platform, by X to realizing the displacement action of observed wafer on X and Y both direction with two groups of cross slideways of Y-direction and spring and milscale.
Above-mentioned angular turn is adjusted platform and is comprised test round platform, adjusting seat, Connection Block, reference column, milscale, spring, ball bearing, surface bearing and back-up ring; Reference column is connected with test round platform, and stretch in the U-shaped groove of adjusting seat, reference column one side mounting spring, an other side is installed milscale, spring one end is fixed with grub screw, the other end withstands reference column, realizes the angular turn of wafer carrier by the mechanical connection of reference column, milscale, spring and wafer carrier.
The vertical adjustment System of above-mentioned cross slideway is for adjusting the fine setting of wafer carrier Y-direction.
Above-mentioned observation camera lens XY displacement platform includes observation imaging assembled shaft, X adjustment block, and X support chip, X back shaft, X adjusts screw rod, Y adjustment block, Y support chip, Y back shaft, Y adjusts screw rod, minitrim wheel and copper sheathing; Observation imaging assembled shaft is installed in X adjustment block, and observation imaging device is fixed in observation assembled shaft, by X to realizing the displacement action of observation camera lens on X and Y both direction with the motion of two groups of guide pillar screw structures of Y-direction.
Above-mentioned elastic force loosening device is contained in cam slide mechanism, realizes time saving and energy saving while operating of operating personnel by spring and round and elastic steel disc;
Above-mentioned motion stop device makes wafer carrier static rapidly after motion stops by spring sheet-holder;
Above-mentioned probe tester comprises that multiple probe decks are fixed in wafer carrier, and folder needle tray is set in probe, and this probe is arranged in folder needle tray.
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Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of a kind of fine-tuning wafer test machine of the present invention.
Fig. 2 is the structural representation of cam slide of the present invention mechanism.
Fig. 3 is the structural representation that angular turn of the present invention is adjusted platform.
Fig. 4 is the motion schematic diagram that angular turn of the present invention is adjusted platform.
Fig. 5 is the structural representation that the present invention observes camera lens XY displacement platform.
Fig. 6 is the structural representation of elastic force loosening device of the present invention.
Embodiment
Under the preferred embodiment shown in be by reference to the accompanying drawings described in further detail.
In Fig. 1, a kind of fine-tuning wafer test machine, it comprises a wafer carrier 11, a cam slide mechanism 12, a Precision trimming mechanism 13, an elastic force loosening device 14, a motion stop device 15, a probe tester 16.In Fig. 2, described cam slide mechanism 12 includes cam 1101, axle center 1102, bearing seat 1103, rocking handle 1104, register pin 1105, slide block 1106, line slideway 1107, leading plate 1108, guide plate web joint 1109, locating piece 1110, base plate 1111 and guide plate 1112; Line slideway 1107 is fixed on leading plate 1108 and is vertically mounted on base plate 1111, bearing seat 1103 is vertically mounted on base plate 1111, guide plate 1112 is installed in parallel on slide block 1106, guide plate web joint 1109 is vertically fixed on guide plate 1112, cam 1101 pulls by rocking handle 1104, coupling shaft rotates, and band movable slider 1106 moves up and down in line slideway 1107, realizes moving up and down of wafer carrier.Precision trimming mechanism comprises that XY adjusts platform 17, angular turn is adjusted platform 18, the vertical adjustment System 19 of cross slideway and observation camera lens XY displacement platform 20.XY adjusts platform 17, by X to realizing the displacement action of observed wafer on X and Y both direction with two groups of cross slideways of Y-direction and spring and milscale.In Fig. 3, angular turn is adjusted platform 18 and is comprised milscale 1113, wafer carrier 1114, adjusting seat 1115, Connection Block 1116, reference column 1117, spring 1118, ball bearing 1119, surface bearing 1120 and back-up ring 1121; In Fig. 4, reference column 1117 is connected with wafer carrier 1114, and stretch in adjusting seat 1115U type groove, reference column 1,117 one side mounting spring 1118, an other side is installed milscale 1113, spring 1118 one end are fixed with grub screw, and the other end withstands reference column 1117, realize the angular turn of wafer carrier 1114 by the mechanical connection of reference column 1117, milscale 1113, spring 1118 and wafer carrier 1114.The vertical adjustment System 19 of cross slideway is for adjusting the fine setting of wafer carrier 1114Y direction.In Fig. 5, observation camera lens XY displacement platform 20 comprises observation imaging assembled shaft 1122, X adjustment block 1123, X support chip 1124, X back shaft 1125, X adjusts screw rod 1126, Y adjustment block 1127, Y support chip 1128, Y back shaft 1129, Y adjusts screw rod 1130, minitrim wheel 1131 and copper sheathing 1132; Observation imaging assembled shaft 1122 is installed in X adjustment block 1123, and observation imaging device is fixed in observation assembled shaft 1122, by X to realizing the displacement action of observation camera lens on X and Y both direction with the motion of two groups of guide pillar screw structures of Y-direction.In Fig. 6, elastic force loosening device 14 is contained in cam slide mechanism 12, realizes time saving and energy saving while operating of operating personnel by spring 1133 and round and elastic steel disc 1134.Motion stop device 15 makes wafer carrier 1114 static rapidly after motion stops by spring sheet-holder.Probe tester 16 comprises that multiple probe decks are fixed in wafer carrier, and folder needle tray is set in probe, and probe is arranged in folder needle tray.。
Claims (9)
1. a fine-tuning wafer test machine, it comprises a wafer carrier, a cam slide mechanism, a Precision trimming mechanism, an elastic force loosening device, a motion stop device, a probe tester.
2. fine-tuning wafer test machine according to claim 1, is characterized in that, described cam slide mechanism includes cam, axle center, bearing seat, rocking handle, register pin, slide block, line slideway, leading plate, guide plate web joint, locating piece, base plate and guide plate; Line slideway is fixed on leading plate and is vertically mounted on base plate, bearing seat is vertically mounted on base plate, guide plate is installed in parallel on slide block, guide plate web joint is vertically fixed on guide plate, cam pulls by rocking handle, coupling shaft rotates, and band movable slider moves up and down in line slideway, realizes moving up and down of wafer carrier.
3. fine-tuning wafer test machine according to claim 1, is characterized in that, described Precision trimming mechanism comprises that XY adjusts platform, angular turn is adjusted platform, the vertical adjustment System of cross slideway and observation camera lens XY displacement platform.
4. Precision trimming according to claim 3 mechanism, is characterized in that, described XY adjusts platform, by X to realizing the displacement action of observed wafer on X and Y both direction with two groups of cross slideways of Y-direction and spring and milscale.
5. Precision trimming according to claim 3 mechanism, is characterized in that, described angular turn is adjusted platform and comprised milscale, wafer carrier, adjusting seat, Connection Block, reference column, spring, ball bearing, surface bearing and back-up ring; Reference column is connected with test round platform, and stretch in the U-shaped groove of connection adjusting seat, reference column one side mounting spring, an other side is installed milscale, spring one end is fixed with grub screw, the other end withstands reference column, realizes the angular turn of wafer carrier by the mechanical connection of reference column, milscale, spring and wafer carrier.
6. Precision trimming according to claim 3 mechanism, is characterized in that, the vertical adjustment System of described cross slideway is for adjusting the fine setting of wafer carrier Y-direction.
7. Precision trimming according to claim 3 mechanism, is characterized in that, described observation camera lens XY displacement platform includes observation imaging assembled shaft, X adjustment block, X support chip, X back shaft, X adjusts screw rod, Y adjustment block, Y support chip, Y back shaft, Y adjusts screw rod, minitrim wheel and copper sheathing; Observation imaging assembled shaft is installed in X adjustment block, and observation imaging device is fixed in observation assembled shaft, by X to realizing the displacement action of observation camera lens on X and Y both direction with the motion of two groups of guide pillar screw structures of Y-direction.
8. fine-tuning wafer test machine according to claim 1, is characterized in that, described elastic force loosening device is contained in cam slide mechanism, realizes time saving and energy saving while operating of operating personnel by spring and round and elastic steel disc.
9. fine-tuning wafer test machine according to claim 1, is characterized in that, described motion stop device makes wafer carrier static rapidly after motion stops by spring sheet-holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210583444.3A CN103901334A (en) | 2012-12-28 | 2012-12-28 | Micro-adjustable wafer test machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210583444.3A CN103901334A (en) | 2012-12-28 | 2012-12-28 | Micro-adjustable wafer test machine |
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| CN103901334A true CN103901334A (en) | 2014-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210583444.3A Pending CN103901334A (en) | 2012-12-28 | 2012-12-28 | Micro-adjustable wafer test machine |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107796961A (en) * | 2017-09-27 | 2018-03-13 | 上海旻艾信息科技有限公司 | A kind of trimming rack for semiconductor die testing |
| CN109001607A (en) * | 2018-06-14 | 2018-12-14 | 深圳市劲升迪龙科技发展有限公司 | A kind of wafer semi-automatic test machine |
| CN109683271A (en) * | 2018-12-29 | 2019-04-26 | 上海铭源数康生物芯片有限公司 | A kind of optical lens center is to mutatis mutandis adjustable apparatus |
| CN110320462A (en) * | 2019-07-04 | 2019-10-11 | 范群意 | A kind of test device and wafer automatic testing machine |
| CN111198285A (en) * | 2018-11-16 | 2020-05-26 | 杭州海康微影传感科技有限公司 | Wafer test probe station |
| CN111208400A (en) * | 2018-11-16 | 2020-05-29 | 杭州海康微影传感科技有限公司 | Wafer test equipment and test method |
| CN112394274A (en) * | 2019-08-13 | 2021-02-23 | 芯恩（青岛）集成电路有限公司 | Wafer test equipment |
| CN112698111A (en) * | 2020-12-14 | 2021-04-23 | 佛山科学技术学院 | Movable three-dimensional electromagnetic field measuring device |
| CN113413219A (en) * | 2021-06-16 | 2021-09-21 | 拜斯特医疗科技(北京)有限公司 | Surgical instrument positioning and supporting device |
| CN116038774A (en) * | 2023-03-31 | 2023-05-02 | 无锡卓海科技股份有限公司 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1831497A (en) * | 2005-03-07 | 2006-09-13 | 韩金龙 | Automatic device of LED testing table |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN201233434Y (en) * | 2008-04-14 | 2009-05-06 | 无锡市易控系统工程有限公司 | Full automatic wafer testing platform device |
| CN201597785U (en) * | 2009-11-20 | 2010-10-06 | 格兰达技术（深圳）有限公司 | Hot-press packaging device for compact-type full-automatic IC tube taping machine |
| TW201037312A (en) * | 2009-04-02 | 2010-10-16 | Hon Tech Inc | Micro-sensing IC test sorting machine |
-
2012
- 2012-12-28 CN CN201210583444.3A patent/CN103901334A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1831497A (en) * | 2005-03-07 | 2006-09-13 | 韩金龙 | Automatic device of LED testing table |
| CN2877897Y (en) * | 2005-09-30 | 2007-03-14 | 南京熊猫仪器仪表有限公司 | Wafer sorting device |
| CN201233434Y (en) * | 2008-04-14 | 2009-05-06 | 无锡市易控系统工程有限公司 | Full automatic wafer testing platform device |
| TW201037312A (en) * | 2009-04-02 | 2010-10-16 | Hon Tech Inc | Micro-sensing IC test sorting machine |
| CN201597785U (en) * | 2009-11-20 | 2010-10-06 | 格兰达技术（深圳）有限公司 | Hot-press packaging device for compact-type full-automatic IC tube taping machine |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107796961A (en) * | 2017-09-27 | 2018-03-13 | 上海旻艾信息科技有限公司 | A kind of trimming rack for semiconductor die testing |
| CN109001607A (en) * | 2018-06-14 | 2018-12-14 | 深圳市劲升迪龙科技发展有限公司 | A kind of wafer semi-automatic test machine |
| CN109001607B (en) * | 2018-06-14 | 2020-11-20 | 深圳市芯探科技有限公司 | Semi-automatic wafer test machine |
| CN111198285B (en) * | 2018-11-16 | 2022-05-03 | 杭州海康微影传感科技有限公司 | Wafer test probe station |
| CN111198285A (en) * | 2018-11-16 | 2020-05-26 | 杭州海康微影传感科技有限公司 | Wafer test probe station |
| CN111208400A (en) * | 2018-11-16 | 2020-05-29 | 杭州海康微影传感科技有限公司 | Wafer test equipment and test method |
| CN109683271A (en) * | 2018-12-29 | 2019-04-26 | 上海铭源数康生物芯片有限公司 | A kind of optical lens center is to mutatis mutandis adjustable apparatus |
| CN110320462A (en) * | 2019-07-04 | 2019-10-11 | 范群意 | A kind of test device and wafer automatic testing machine |
| CN112394274A (en) * | 2019-08-13 | 2021-02-23 | 芯恩（青岛）集成电路有限公司 | Wafer test equipment |
| CN112698111A (en) * | 2020-12-14 | 2021-04-23 | 佛山科学技术学院 | Movable three-dimensional electromagnetic field measuring device |
| CN112698111B (en) * | 2020-12-14 | 2023-09-26 | 佛山科学技术学院 | Movable three-dimensional electromagnetic field measuring device |
| CN113413219A (en) * | 2021-06-16 | 2021-09-21 | 拜斯特医疗科技(北京)有限公司 | Surgical instrument positioning and supporting device |
| CN116038774A (en) * | 2023-03-31 | 2023-05-02 | 无锡卓海科技股份有限公司 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
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Application publication date: 20140702 |