CN111198285A - Wafer test probe station - Google Patents
Wafer test probe station Download PDFInfo
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- CN111198285A CN111198285A CN201811372333.1A CN201811372333A CN111198285A CN 111198285 A CN111198285 A CN 111198285A CN 201811372333 A CN201811372333 A CN 201811372333A CN 111198285 A CN111198285 A CN 111198285A
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- adjusting mechanism
- wafer
- probe station
- test probe
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Abstract
The embodiment of the invention discloses a wafer test probe station, relates to the technical field of silicon wafer test, and can be suitable for fixing a wafer in a vacuum test environment. The method comprises the following steps: the wafer fixing device comprises a carrying platform, wherein a pressure ring for fixing a wafer is arranged on the carrying platform, and a structure corresponding to the outline of the wafer is arranged on the pressure ring. The invention is suitable for the performance test of semiconductors, photoelectric components, integrated circuits and the like, and is particularly suitable for the test of wafers.
Description
Technical Field
The invention relates to the technical field of silicon wafer testing, in particular to a wafer testing probe station.
Background
At present, when a wafer is tested under standard atmospheric pressure, a vacuum adsorption fixing mode is generally adopted, and the principle is that a workpiece is adsorbed by vacuum negative pressure so as to achieve the purpose of clamping the workpiece. When the vacuum chuck works, a pressure vacuum state is formed inside the chuck and is lower than the external atmospheric pressure, a workpiece, such as a wafer, is adsorbed and fixed under the action of the external pressure, and the higher the vacuum degree inside the chuck is, the tighter the adsorption and fixation between the workpiece and the chuck is.
The inventor finds the following problems in the method for fixing the wafer in the process of implementing the invention: when in a vacuum test environment, the inside of the chuck and the outside environment are both in a vacuum state, which will cause the wafer fixing to fail.
Therefore, the conventional method for fixing the wafer by vacuum adsorption is not suitable for fixing the wafer in a vacuum test environment.
Disclosure of Invention
In view of the above, embodiments of the present invention provide a wafer test probe station, which is not only suitable for fixing a wafer under a standard atmospheric pressure, but also suitable for fixing a wafer in a vacuum test environment.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
the embodiment of the invention provides a test probe station which comprises a carrying platform, wherein a pressure ring for fixing a wafer is arranged on the carrying platform, and a structure corresponding to the outline of the wafer is arranged on the pressure ring.
Optionally, the pressing ring includes an arc body, and a concave portion for clamping the edge of the wafer is arranged on the lower edge of the inner side of the arc body.
Optionally, a first positioning portion is arranged on the carrier, and a first notch portion matched with the first positioning portion is further arranged at a position where the upper edge of the inner side of the arc body corresponds to the concave portion; alternatively, the first and second electrodes may be,
the carrying platform is provided with a first positioning part, the upper edge of the inner side of the arc body is provided with a first notch part and a second notch part which are matched with the first positioning part at positions corresponding to the concave parts, and the radian between the first positioning part and the second positioning part is 90 degrees.
Optionally, the probe station further comprises a bottom plate, a stage position adjusting mechanism and a probe card mounting mechanism, wherein the stage position adjusting mechanism is mounted on the bottom plate, and the stage is mounted on the stage position adjusting mechanism;
the needle clamp mounting mechanism comprises a needle clamp mounting seat, a vertical plate and a needle clamp pressing block, the needle clamp mounting seat is fixed at the first end of the vertical plate and is correspondingly arranged above the carrying platform, the second end of the vertical plate is fixed on the bottom plate, a needle clamp mounting groove is formed in the needle clamp mounting seat, and the needle clamp pressing block is used for fixing a needle clamp in the needle clamp mounting groove.
Optionally, a plurality of probes are installed in the probe card.
Optionally, the stage position adjustment mechanism includes: the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism, the fourth adjusting mechanism, the fifth adjusting mechanism and the sixth adjusting mechanism;
the first adjusting mechanism is used for roughly adjusting the position of the carrying platform in the Y-axis direction, and the second adjusting mechanism is used for roughly adjusting the position of the carrying platform in the X-axis direction;
the first adjusting mechanism is arranged on the bottom plate, and the second adjusting mechanism is arranged on the first adjusting mechanism;
the third adjusting mechanism is used for fine-tuning the position of the carrier in the X-axis direction, the fourth adjusting mechanism is used for fine-tuning the position of the carrier in the Y-axis direction, the fifth adjusting mechanism is used for fine-tuning the position of the carrier in the Z-axis direction, and the sixth adjusting mechanism is used for fine-tuning the horizontal rotation angle of the carrier;
the third adjusting mechanism is arranged on the second adjusting mechanism, the fourth adjusting mechanism is arranged on the third adjusting mechanism, the fifth adjusting mechanism is positioned above the fourth adjusting mechanism, the sixth adjusting mechanism is positioned above the fifth adjusting mechanism, and the carrier is arranged on the sixth adjusting mechanism;
the X-axis direction and the Y-axis direction are parallel to the plane where the bottom plate is located, and the Z-axis direction is perpendicular to the plane where the bottom plate is located.
Optionally, the first adjusting mechanism includes a first slide rail and a first platform, the first slide rail is fixed on the bottom plate, a first slide block which is matched with the first slide rail and slides is arranged on the lower surface of the first platform, and the first platform is mounted on the first slide rail through the first slide block;
the second adjusting mechanism comprises a second slide rail and a second platform, the second slide rail is arranged on the upper surface of the first platform, a second slide block matched with the second slide rail to slide is arranged on the lower surface of the second platform, and the second platform is arranged on the second slide rail through the second slide block;
the third, fourth, fifth and sixth adjusting mechanisms respectively comprise a sliding table and a micrometer head arranged on the sliding table, and the sliding table is driven to slide by the micrometer head so as to respectively finely adjust the position of the carrying table on the X, Y, Z shaft and the rotation angle of the carrying table in the horizontal direction.
Optionally, a first locking mechanism is arranged on the first adjusting mechanism and the second adjusting mechanism; and/or the presence of a gas in the gas,
the first adjusting mechanism and the second adjusting mechanism are provided with first locking mechanisms, and the third adjusting mechanism, the fourth adjusting mechanism and the fifth adjusting mechanism are provided with limiting parts for limiting the sliding distance of the carrying platform in the directions of X, Y and the Z axis.
Optionally, a limiting locking ring for limiting the Z-axis moving position of the probe station is arranged on the circumference of the micrometer head of the fifth adjusting mechanism.
Optionally, an observation hole is further formed in the needle clamp mounting seat, and an observation port corresponding to the observation hole is formed in the needle clamp.
In a second aspect, the present embodiment further provides a wafer test probe apparatus, including: a vacuum space and the wafer test probe station of any of the first aspect, the wafer test probe station being disposed in the vacuum space.
Optionally, the vacuum space includes a box and a vacuum pumping module connected to the box, and the wafer test probe station is disposed in the box.
The wafer test probe station comprises a carrying platform, wherein a pressure ring for fixing a wafer is arranged on the carrying platform, and a structure corresponding to the outline of the wafer is arranged on the pressure ring. The wafer is fixed in a mode of mechanically fixing and locking the compression ring without being influenced by an external pressure environment, so that the wafer fixing device not only can be suitable for fixing the wafer under the standard atmospheric pressure, but also can be suitable for fixing the wafer in a vacuum test environment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer test probe station according to an embodiment of the present invention;
FIG. 2 is an exploded view of the wafer test probe station of FIG. 1 according to the present invention;
FIG. 3 is a schematic structural diagram of one embodiment of the wafer mounting method of FIG. 1;
FIG. 4 is a schematic structural diagram of an embodiment of a coarse adjustment mechanism according to the present invention;
FIG. 5 is a schematic structural diagram of an embodiment of a fine adjustment mechanism according to the present invention;
FIG. 6 is an exploded view of an embodiment of a fine adjustment mechanism according to the present invention;
fig. 7 is a schematic structural diagram of an embodiment of a pincard mounting mechanism according to the present invention.
Detailed Description
A test probe station according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1 to 3, an embodiment of the invention provides a wafer test probe station, which is mainly applied to performance tests of semiconductors, optoelectronic devices, integrated circuits, and the like, and is particularly used for wafer (wafer) tests; the wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape. The probe station comprises a carrying platform 1, wherein a pressing ring 2 used for fixing a wafer W is arranged on the carrying platform 1, and a structure corresponding to the outline of the wafer is arranged on the pressing ring.
In this embodiment, the corresponding means that the profiles are the same, and the structures can be installed or fixed in a matching manner, for example, the profile of the wafer is circular, and correspondingly, the pressure ring is provided with a circular arc or circular structural feature to match with the profile of the wafer to fix the wafer.
The wafer test probe station comprises a carrying platform, wherein a pressure ring for fixing a wafer is arranged on the carrying platform, and a structure corresponding to the outline of the wafer is arranged on the pressure ring. The wafer is fixed in a mode of mechanically fixing and locking the compression ring without being influenced by an external pressure environment, so that the wafer fixing device not only can be suitable for fixing the wafer under the standard atmospheric pressure, but also can be suitable for fixing the wafer in a vacuum test environment.
Referring to fig. 3, in the present embodiment, as an alternative embodiment, the pressing ring includes an arc body 21, and a concave portion 22 for clamping the edge of the wafer is disposed on the lower edge of the inner side of the arc body.
When the wafer clamping device is used specifically, two or more clamping rings can be arranged as required, the clamping rings are uniformly distributed and pressed on the edge of a wafer, and then the clamping rings are locked and fixed on the carrying platform by using the fastening pieces. The clamping ring can be matched and locked by arranging a clamping structure at the corresponding position of the clamping ring and the carrying platform. The pressing ring can also be a ring body. Preferably, a flexible gasket, such as a rubber or silicone gasket, having a shape consistent with the inner surface of the concave portion is further disposed in the concave portion 22, so that the friction between the concave portion and the wafer can be increased, and the reliability of wafer fixing can be improved; in addition, due to the arrangement of the flexible gasket, the wafer can be protected to a certain extent, and the wafer is prevented from being extruded and damaged in the process of fixing the wafer by the compression ring.
It can be understood that, in general, when a probe card (the probe card refers to a probe card, and belongs to a test interface, and mainly utilizes a probe on the probe card to directly contact with a Pad on a chip for testing parameters of a bare chip) is designed, an arrangement direction of a test probe is an X direction or a direction that is already determined, and when the test probe is installed on a wafer test probe station, the test probe needs to be installed according to the arrangement direction of the probe, that is, the test probe direction is already fixed. Pad points (where Pad is translated into contact points or welding pressure points, which refer to points or blocks on a wafer for contact connection between a unit to be tested and a probe) on the wafer W are usually arranged in an array, and when the Pad points are manufactured, a manufacturer may arrange the Pad points along the X direction of the wafer or along the Y direction of the wafer, that is, the arrangement direction of the Pad points on the wafer is not determined, so as to facilitate matching with mounting and positioning in a subsequent wafer testing process (it is necessary to ensure that the arrangement direction of the test probe is consistent with the arrangement direction of the Pad points on the wafer), and the edge of the wafer W is provided with a mark notch O when the wafer W is manufactured.
In this embodiment, in order to ensure that the wafer mounting direction can be adjusted conveniently during testing so that the arrangement direction of Pad points on the wafer can be consistent with the probe testing direction, as shown in fig. 3, a first notch portion 23 is further provided at a position corresponding to the concave portion on the inner side of the ring, and a first positioning portion (a position corresponding to the position of the mark notch O in fig. 3) for positioning in cooperation with the mark notch is provided on the stage; or a second positioning part matched and positioned with the mark notch is further arranged on the carrying platform, and the radian between the first positioning part and the second positioning part is 90 degrees. The first positioning part and the second positioning part can be positioning pin holes, and after the Pad point on the wafer is consistent with the probe testing direction, positioning pins are inserted into the mark gap and the positioning pin holes so as to fix the position of the wafer.
It can be understood that, when the arrangement direction of Pad points on the wafer is not consistent with the arrangement direction of the probes, for example, the arrangement direction of Pad points on the wafer is Y direction, the arrangement direction of probes is X direction, after the mark notch on the wafer is aligned with the first positioning portion and mounted on the stage, the wafer can be rotated by 90 ° in the clockwise direction, and then the wafer is fixedly mounted when the mark notch is aligned with the second positioning portion, and the direction of Pad points on the stage at this time is changed to X direction, so that the arrangement direction of Pad points is consistent with the arrangement direction of probes, that is, all the Pad points are arranged in X direction on the stage.
Referring to fig. 1, 2 and 6, the probe station further includes a bottom plate 3, a stage position adjusting mechanism 4 and a probe card mounting mechanism 5, wherein the stage position adjusting mechanism 4 is mounted on the bottom plate, and the stage 1 is mounted on the stage position adjusting mechanism;
the needle clip mounting mechanism 5 comprises a needle clip mounting seat 51, a vertical plate 52 and a needle clip pressing block 53, the needle clip mounting seat is fixed at the first end of the vertical plate and is correspondingly arranged above the carrying platform, the second end of the vertical plate is fixed on the bottom plate 3, a needle clip mounting groove 511 is arranged on the needle clip mounting seat 51, and the needle clip pressing block 53 is used for fixing a needle clip 54 in the needle clip mounting groove.
Referring to fig. 1 and 2, in the present embodiment, as an alternative embodiment, a plurality of probes are installed in the needle card 54.
It can be understood that, when the wafer is tested by the existing test probe station, the mode of probe movement, wafer fixation and single-point test is adopted, and the test efficiency is low because a unit to be tested of the wafer needs to be pricked for many times.
In this embodiment, with the above structure, a test mode in which the probes are fixed and the wafer can move along with the stage is adopted, so that multi-point simultaneous testing of a plurality of probes is realized. Specifically, a plurality of probes are adopted to contact one unit to be tested on the 8' wafer at a time, the test data of the unit to be tested can be read at one time, the phenomenon that the same unit to be tested is pricked by moving the probes for multiple times is avoided, and the test efficiency is improved.
It will be appreciated that there are multiple pads (contacts) on the one unit under test.
In this embodiment, the pincer and the wafer are prevented from being damaged by pressure. As an optional embodiment, the pin card pressing block and the wafer pressing ring are made of materials with hardness smaller than that of the pin card and the wafer, for example, the pin card pressing block and the wafer pressing ring are made of plastic materials, and the pin card and the wafer can be effectively protected from being damaged by pressing because the hardness of the plastic materials is smaller than that of the pin card and the wafer.
Referring to fig. 1, 2, and 4 to 6, in this embodiment, as an alternative embodiment, the stage position adjustment mechanism 4 includes: a first adjustment mechanism 41, a second adjustment mechanism 42, a third adjustment mechanism 43, a fourth adjustment mechanism 44, a fifth adjustment mechanism 45, and a sixth adjustment mechanism 46;
the first adjusting mechanism is used for roughly adjusting the position of the carrying platform in the Y-axis direction, and the second adjusting mechanism is used for roughly adjusting the position of the carrying platform in the X-axis direction; the first adjusting mechanism 41 is disposed on the bottom plate 3, and the second adjusting mechanism 42 is disposed on the first adjusting mechanism 41.
The third adjusting mechanism is used for fine tuning the position of the carrier in the X-axis direction, the fourth adjusting mechanism is used for fine tuning the position of the carrier in the Y-axis direction, the fifth adjusting mechanism is used for fine tuning the position of the carrier in the Z-axis direction, and the sixth adjusting mechanism is used for fine tuning the horizontal rotation angle of the carrier.
The third adjusting mechanism 43 is disposed on the second adjusting mechanism 42, the fourth adjusting mechanism 44 is disposed on the third adjusting mechanism 43, the fifth adjusting mechanism 45 is located above the fourth adjusting mechanism 44, the sixth adjusting mechanism 46 is located above the fifth adjusting mechanism 45, and the carrier 1 is disposed on the sixth adjusting mechanism 46;
the X-axis direction and the Y-axis direction are parallel to the plane where the bottom plate is located, and the Z-axis direction is perpendicular to the plane where the bottom plate is located.
It is understood that the X-axis and the Y-axis are relative to each other, and they may be switched according to the actual application. The specific configurations of the first to sixth adjustment mechanisms are not limited in this embodiment, as long as the functions of adjusting the position of the stage in the corresponding directions can be achieved.
In the embodiment, the position of the carrier is adjusted by adopting an adjusting mode combining rough adjustment and fine adjustment, so that the adjusting range of the position in the wafer test is increased, and the testing range of the specification and the type of the wafer is expanded.
With continued reference to fig. 1, 2, 4, and 5, in this embodiment, as an optional embodiment, the first adjusting mechanism 41 includes a first slide rail 411 and a first platform 412, the first slide rail 411 is fixed on the bottom plate 3, a first slider 413 which is matched with the first slide rail 411 to slide is disposed on a lower surface of the first platform 412, and the first platform is mounted on the first slide rail 411 through the first slider 413;
the second adjusting mechanism 42 includes a second slide rail 421 and a second platform 422, the second slide rail 421 is disposed on the upper surface of the first platform 412, a second slide block that is matched with the second slide rail 421 to slide is disposed on the lower surface of the second platform 422, and the second platform is mounted on the second slide rail 421 through the second slide block;
the third, fourth, fifth and sixth adjusting mechanisms respectively comprise a sliding table and a micrometer head arranged on the sliding table, and the sliding table is driven to slide by the micrometer head so as to finely adjust the position of the carrying table on the X, Y, Z shaft and the rotation angle of the carrying table in the horizontal direction.
In this embodiment, the first slider and the first slide rail may also be an integrated finished product, the first platform is provided with a mounting hole, the slider is provided with a threaded hole, the slider is fixed on the first platform by a threaded connector such as a bolt, the slide rail is provided with a threaded connector, the upper surface of the fixing seat is provided with a threaded hole, and the slide rail is locked and fixed on the fixing seat; similarly, the second sliding block and the second sliding rail can also be an integral finished piece and can be installed correspondingly. In addition, the carrying platform can be provided with mounting holes, the sixth adjusting mechanism can be provided with corresponding mounting holes, and the carrying platform is locked and fixed on the sixth adjusting mechanism through fasteners.
The micrometer head is a measuring main body part of a micrometer (also called a micrometer), and comprises a micrometer screw, a locking device, a force measuring device and a micro-cylinder, and the position connection or the matching relationship of the structure is the prior art, so that the description is omitted. The third, fourth, fifth and sixth adjusting mechanisms are precision sliding tables, and the precision sliding tables are sliding platforms which are driven by micrometer heads and can manually perform fine displacement adjustment. The third and fourth adjusting mechanisms may adopt an integrated precision sliding table with X, Y direction adjustable, for example, the type of LAM-1252W produced by spain transmission element (shanghai) limited is an X/Y precision sliding table, the fifth adjusting mechanism may adopt a precision sliding table with Z-axis direction position adjustable, for example, the type of spain transmission element (shanghai) limited is an LAM-1003W precision sliding table, and the sixth adjusting mechanism may adopt a precision sliding table rotating around an axis, for example, the type of spain transmission element (shanghai) limited is a TAM-1006W precision rotary sliding table. The position adjusting precision of the above exemplary product can reach 0.01 mm. It should be noted that the above-mentioned examples are only for the purpose of fully disclosing the embodiments of the present invention, and are not to be construed as exclusive limitations on other implementable schemes.
Specifically, referring to fig. 4 to 6, the third adjusting mechanism 43 includes a third sliding table 431, a first micrometer head 432 is disposed on the third sliding table 431, the fourth adjusting mechanism 44 includes a fourth sliding table 441, a second micrometer head 442 is disposed on the fourth sliding table, the fifth adjusting mechanism 45 includes a fifth sliding table 451, a third micrometer head 452 is disposed on the fifth sliding table, the sixth adjusting mechanism 46 includes a sixth sliding table 461, and a fourth micrometer head 462 is disposed on the sixth sliding table;
the fourth sliding table is located on the third sliding table, the fifth sliding table is located on the fourth sliding table, the sixth sliding table is located on the fifth sliding table, and the carrier 1 is arranged on the sixth sliding table.
It is understood that each sliding table is further provided with a transmission mechanism which is matched with the micrometer screw rod of the micrometer head to realize position sliding, and although the specific transmission mechanism on the sliding table is not shown in the figure, it is conceivable that the transmission mechanism can be a gear transmission mechanism, a screw transmission mechanism and the like. The micrometer head is used as a driving part for adjusting the carrier in the corresponding direction, and the precision of the micrometer head can be adjusted to the thousand decimals of millimeters, so that the micrometer head is used as the driving part and is creatively used for adjusting the position of the carrier, the precision adjustment of the position of the carrier can be realized, and the alignment degree of the installation position of the wafer and the probe can be improved.
In addition, referring to fig. 4 and 5, as an alternative embodiment, a locking mechanism 414 is provided on the first and second adjusting mechanisms for locking the adjusted position.
As an alternative embodiment, the locking mechanism 414 is a rail clamp.
It can be understood that when the guide rail clamp is locked, the coarse adjustment mechanism can be locked on the guide rail only by rotating, and the guide rail clamp is simple in structure and convenient to operate. In addition, the fine adjustment mechanism can lock the position through the self-locking function of the micrometer head.
It can be understood that, by arranging the locking mechanism, the phenomenon that the tested unit Pad is separated from the probe due to the position change can be avoided in the test process, so that the accuracy and reliability of test data can be ensured.
Further, referring to fig. 5, in the present embodiment, specifically, the third, fourth, and fifth adjusting mechanisms are provided with a limiting portion 6 for limiting the sliding distance of the stage in the X, Y and Z-axis directions, so as to limit the magnitude of the adjustment range.
Referring to fig. 5, in the present embodiment, as an alternative embodiment, the micrometer head of the fifth adjusting mechanism is circumferentially provided with a limiting locking ring 7 for limiting the Z-axis moving position of the probe station.
Specifically, the limiting locking ring comprises a clamping part for clamping the micrometer head, and the clamping part is arranged on the circumference of the micrometer screw of the micrometer head, so that the stroke of the micrometer screw of the micrometer head can be limited, the height position of the carrier on the Z axis can be limited, and the phenomenon that the probe is damaged due to overlarge deformation caused by the fact that the carrier moves in the Z axis direction and displaces overlarge is avoided.
Referring to fig. 1 or fig. 2, in this embodiment, as an optional embodiment, the needle card mounting base is further provided with an observation hole 55, and the needle card is provided with an observation port corresponding to the observation hole.
A microscope (not shown) can be arranged right above the observation hole and the observation port.
It can be understood that the Pad of the unit to be tested of the wafer is small (generally 100 μm × 100 μm), and it is not easy to directly observe and clear whether the Pad is aligned with the probe by naked eyes during the test, and by arranging the observation hole and arranging the microscope above the observation hole, it is convenient for an operator to move the Pad of the unit to be tested to the lower side of the probe for accurate alignment and then perform the probe insertion during the test.
In order to further disclose the technical solution of the embodiment of the present invention, the working process and functions of the wafer test probe station and the components thereof are described as follows:
when a wafer is loaded, the micrometer head on the fifth adjusting mechanism is rotated, the carrying platform is lowered to the lowest position, the locking mechanism, namely the guide rail clamp device, is loosened, the carrying platform is pulled out of the position below the needle clamp mounting mechanism along the Y-axis direction, the locking screw on the carrying platform is loosened, a processed wafer, such as a wafer with the specification of 8' is placed on the carrying platform, the marking notch on the edge of the wafer is aligned with the positioning hole on the carrying platform when the wafer is placed, the positioning pin is inserted to determine the mounting direction of the wafer, then the pressing ring is pressed on the edge of the wafer, and the pressing ring is locked by the screw to fix the wafer.
The locking mechanism, specifically the guide rail clamp of the X-axis and the Y-axis in the figure, is released, the wafer carrying platform is moved in the X-axis direction and the Y-axis direction through the first adjusting mechanism and the second adjusting mechanism, the positions of the wafer carrying platform on the X-axis and the Y-axis are adjusted, the rough adjustment of the wafer position is completed, and the guide rail clamp of the X-axis and the Y-axis is locked.
Since the Pad of the unit under test is small (typically 100 μm × 100 μm), it is impossible to directly observe with the naked eye whether the Pad and the probe are in the alignment position corresponding to each other, and therefore, with the aid of the microscope, whether the Pad and the probe are aligned can be clearly observed.
Observing through a microscope, rotating the micrometer heads of the third adjusting mechanism, the fourth adjusting mechanism, the fifth adjusting mechanism and the sixth adjusting mechanism, finely adjusting the carrying platform in the X axis, the Y axis, the Z axis and the horizontal rotating direction respectively, aligning the Pad of the unit to be measured and the needle point of the needle card one by one, and then rotating the micrometer head of the fifth adjusting mechanism until the micrometer head touches a Z axis limiting locking piece, namely a limiting locking ring in the figure, so that the Pad of the unit to be measured is reliably contacted with the needle card, and the position correction of the Pad and the probe is completed. In the process of fine adjustment of the position of the carrying platform, the limiting locking ring can avoid damage caused by overlarge deformation of the probe due to the fact that acting force is possibly applied to the probe due to overlarge movement displacement in the Z-axis direction.
After the units to be tested are tested, the micrometer head on the fifth adjusting mechanism is rotated, the carrier is lowered to the lowest position, the locking mechanism, namely the X-axis guide rail clamp and the Y-axis guide rail clamp, is loosened, the next unit to be tested is quickly moved to the position below the needle clamp mounting mechanism, the X-axis guide rail clamp and the Y-axis guide rail clamp are locked, then the carrier is finely adjusted by the third adjusting mechanism, the sixth adjusting mechanism and the third adjusting mechanism until pads of the units to be tested are aligned with the probes one by one, needle pricking testing is carried out, and the steps are repeated until the wafers on the wafers are completely tested and then replaced.
The wafer test probe station of the embodiment provides a wafer fixing mode suitable for a vacuum test environment, and a stage position adjusting mode combining rough adjustment and fine adjustment is set, so that the adjusting range of the test is increased, and the alignment is convenient; the test mode that the probes are fixed and the wafer can move along with the carrying platform is further provided, so that multi-point simultaneous test of the probes is realized, and the test efficiency can be improved.
The embodiment also provides a wafer test probe apparatus, including: the wafer test probe station and the vacuum space of any of the foregoing embodiments, wherein the wafer test probe station is disposed in the vacuum space.
The wafer test probe apparatus provided by the embodiment can be suitable for performance test of a wafer in a vacuum environment.
As an optional embodiment, the vacuum space includes a box and an evacuation module connected to the box, and the wafer test probe station is disposed in the box.
It can be understood that the vacuumizing module is used for vacuumizing the interior of the box body, so that a vacuum environment is formed in the box body, and the equipment has a performance testing function on the wafer in the vacuum environment.
It should be noted that, in this document, the emphasis points of the solutions described in the embodiments are different, but there is a certain correlation between the embodiments, and in understanding the solution of the present invention, the embodiments may be referred to each other; in the embodiments of the present application, when a technical feature element is fixed to another technical feature element, the technical feature element may be directly in contact with a surface of the other technical feature element, or an intervening additional technical feature element may be present. Moreover, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or station that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or station. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or station that comprises the element.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (12)
1. A wafer test probe station is characterized by comprising a carrying platform, wherein a pressing ring for fixing a wafer is arranged on the carrying platform, and a structure corresponding to the outline of the wafer is arranged on the pressing ring.
2. The test probe station of claim 1, wherein the clamping ring comprises an arc body, and a concave portion for clamping the edge of the wafer is arranged on the lower edge of the inner side of the arc body.
3. The test probe station of claim 2, wherein the carrier is provided with a first positioning portion, and a first notch portion engaged with the first positioning portion is further provided at a position corresponding to the concave portion on the upper edge of the inner side of the arc body; alternatively, the first and second electrodes may be,
the carrying platform is provided with a first positioning part, the upper edge of the inner side of the arc body is provided with a first notch part and a second notch part which are matched with the first positioning part at positions corresponding to the concave parts, and the radian between the first positioning part and the second positioning part is 90 degrees.
4. The test probe station of any of claims 1 to 3, wherein the probe station further comprises a base plate, a stage position adjustment mechanism and a probe card mounting mechanism, the stage position adjustment mechanism being mounted on the base plate, the stage being mounted on the stage position adjustment mechanism;
the needle clamp mounting mechanism comprises a needle clamp mounting seat, a vertical plate and a needle clamp pressing block, the needle clamp mounting seat is fixed at the first end of the vertical plate and is correspondingly arranged above the carrying platform, the second end of the vertical plate is fixed on the bottom plate, a needle clamp mounting groove is formed in the needle clamp mounting seat, and the needle clamp pressing block is used for fixing a needle clamp in the needle clamp mounting groove.
5. The test probe station of claim 4, wherein the pin card has a plurality of probes mounted therein.
6. The probe station of claim 4, wherein the stage position adjustment mechanism comprises: the first adjusting mechanism, the second adjusting mechanism, the third adjusting mechanism, the fourth adjusting mechanism, the fifth adjusting mechanism and the sixth adjusting mechanism;
the first adjusting mechanism is used for roughly adjusting the position of the carrying platform in the Y-axis direction, and the second adjusting mechanism is used for roughly adjusting the position of the carrying platform in the X-axis direction;
the first adjusting mechanism is arranged on the bottom plate, and the second adjusting mechanism is arranged on the first adjusting mechanism;
the third adjusting mechanism is used for fine-tuning the position of the carrier in the X-axis direction, the fourth adjusting mechanism is used for fine-tuning the position of the carrier in the Y-axis direction, the fifth adjusting mechanism is used for fine-tuning the position of the carrier in the Z-axis direction, and the sixth adjusting mechanism is used for fine-tuning the horizontal rotation angle of the carrier;
the third adjusting mechanism is arranged on the second adjusting mechanism, the fourth adjusting mechanism is arranged on the third adjusting mechanism, the fifth adjusting mechanism is positioned on the fourth adjusting mechanism, the sixth adjusting mechanism is positioned above the fifth adjusting mechanism, and the carrier is arranged on the sixth adjusting mechanism;
the X-axis direction and the Y-axis direction are parallel to the plane where the bottom plate is located, and the Z-axis direction is perpendicular to the plane where the bottom plate is located.
7. The test probe station of claim 6, wherein the first adjustment mechanism comprises a first slide rail and a first platform, the first slide rail is fixed on the base plate, a first slider is disposed on a lower surface of the first platform and is matched with the first slide rail to slide, and the first platform is mounted on the first slide rail through the first slider;
the second adjusting mechanism comprises a second slide rail and a second platform, the second slide rail is arranged on the upper surface of the first platform, a second slide block matched with the second slide rail to slide is arranged on the lower surface of the second platform, and the second platform is arranged on the second slide rail through the second slide block;
the third, fourth, fifth and sixth adjusting mechanisms respectively comprise a sliding table and a micrometer head arranged on the sliding table, and the sliding table is driven to slide by the micrometer head so as to finely adjust the position of the carrying table on the X, Y, Z shaft and the rotation angle of the carrying table in the horizontal direction.
8. The test probe station of claim 6 or 7, wherein the first and second adjustment mechanisms are provided with first locking mechanisms; and/or the presence of a gas in the gas,
the first adjusting mechanism and the second adjusting mechanism are provided with first locking mechanisms, and the third adjusting mechanism, the fourth adjusting mechanism and the fifth adjusting mechanism are provided with limiting parts for limiting the sliding distance of the carrying platform in the directions of X, Y and the Z axis.
9. The test probe station of claim 6 or 7, wherein the micrometer head of the fifth adjusting mechanism is circumferentially provided with a limiting locking ring for limiting the Z-axis moving position of the probe station.
10. The test probe station of claim 4, wherein the needle card mounting base further comprises an observation hole, and the needle card is provided with an observation port corresponding to the observation hole.
11. A wafer test probe apparatus, comprising: a vacuum space and the wafer test probe station of any one of claims 1 to 10 disposed in the vacuum space.
12. The test probe station of claim 11, wherein the vacuum space comprises a vacuum box and an evacuation module disposed on the vacuum box, the wafer test probe station being disposed within the vacuum box.
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| CN201811372333.1A CN111198285B (en) | 2018-11-16 | 2018-11-16 | Wafer test probe station |
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