CN114325295A - Test method for laser chip - Google Patents
Test method for laser chip Download PDFInfo
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- CN114325295A CN114325295A CN202110906709.8A CN202110906709A CN114325295A CN 114325295 A CN114325295 A CN 114325295A CN 202110906709 A CN202110906709 A CN 202110906709A CN 114325295 A CN114325295 A CN 114325295A
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Abstract
The invention discloses a test method for a laser chip, which is based on a test device, wherein the test device comprises a substrate, a test board arranged on the upper surface of the substrate, a driving bracket arranged on the outer side of the substrate and a test probe assembly arranged on the driving bracket and positioned above the test board, and the test probe assembly comprises: the probe that is used for with the chip contact that awaits measuring with body, backup pad that drive leg joint, be used for and move point contact probe, a cantilever is installed to backup pad one end, and the other end is installed move point contact probe, terminal surface one side is provided with one and is located move point contact probe upper portion and rather than the quiet point contact probe who corresponds under the body, the cantilever is kept away from backup pad one end and is fixed with one and install the probe seat of probe. The invention ensures the accuracy of the detection status and further improves the stability, repeatability, comparability and consistency of the detection data.
Description
Technical Field
The invention relates to a test method for a laser chip, and belongs to the technical field of chip test.
Background
In the production test link of the Laser in the optical communication industry, before the COC aging process, the photoelectric performance test of a single Laser chip (LD) is required, so that the performance of the Laser chip (LD) is screened once before aging, the Laser with the problem performance is selected in advance, and the overall yield of the aged COC is improved.
In the testing process of an optical communication single laser chip (LD), the stability of a probe plays a very important role, because the size of a single chip is very small (generally in the range of 300 μm), the position or the angle of the chip is more or less pushed to be deviated by the test probe in the process of contacting the chip, once the position and the angle of the chip are changed, the stability and the test efficiency of subsequent test indexes are directly influenced, and the pressure stability of the test probe is also directly fed back to the stability of a test value, in the mass production test link, one probe needs to detect a large number of chips, and needs to detect the same chip for many times, and the stability and durability of the power-on probe assembly can directly influence the consistency and reproducibility of test data, so that a very strict requirement is provided for the long-term stability of a probe station in the test process.
Disclosure of Invention
The inventor finds that: the pressure change of the probe acting on the chip can cause the change of the contact resistance, thereby influencing the consistency of test data, and in the long-time test process, if the pressure change is overlarge, the change which can cause the test result to be indistinguishable is caused by the chip or the machine table, thereby causing the test result to lose the comparability. Based on the above findings, the present invention aims to provide a test method for a laser chip, which solves the problems of instability and inconsistency of test data during long-term use due to fatigue of a probe station in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: a test method for a laser chip is based on a test device, the test device comprises a substrate, a test bench arranged on the upper surface of the substrate, a driving bracket arranged on the outer side of the substrate, and a test probe assembly arranged on the driving bracket and positioned above the test bench, the test probe assembly comprises: the probe comprises a body, a supporting plate, a probe and a moving point contact probe, wherein the body is connected with a driving support, the probe is used for being in contact with a chip to be tested, one end of the supporting plate is provided with a cantilever, the other end of the supporting plate is provided with the moving point contact probe, one side of the lower end surface of the body is provided with a fixed point contact probe which is positioned at the upper part of the moving point contact probe and corresponds to the moving point contact probe, and one end of the cantilever, which is far away from the supporting plate, is fixedly provided with a probe seat provided with the probe;
a transfer seat is arranged on the upper surface of the middle part of the supporting plate, the front side and the rear side of the transfer seat are respectively provided with a front baffle and a rear baffle, the front baffle and the rear baffle are respectively provided with a first through hole and 2 guide grooves positioned at two sides of the first through hole, and two ends of a first pin shaft are respectively positioned in the respective first through holes of the front baffle and the rear baffle;
a second pin shaft and a third pin shaft are arranged on the lower convex block on the other side of the lower end face of the body in parallel, the second pin shaft and the third pin shaft are positioned above the first pin shaft and positioned on two sides of the first pin shaft, two ends of the second pin shaft and two ends of the third pin shaft respectively extend out from the front side and the rear side of the lower convex block, a first bearing and a second bearing are respectively sleeved on two ends of the second pin shaft and positioned on the front side and the rear side of the lower convex block, and a third bearing and a fourth bearing are respectively sleeved on two ends of the third pin shaft and positioned on the front side and the rear side of the lower convex block;
the first bearing, the third bearing, the second bearing and the fourth bearing are respectively positioned between the lower lug and the front baffle and the rear baffle, one end of a first elastic part positioned in a vertical through hole of the lower lug is connected with a middle area of a first pin shaft positioned between the front baffle and the rear baffle, the other end of the first elastic part is connected with a fourth pin shaft positioned in the body and positioned above the second pin shaft and the third pin shaft, and the first elastic part is in a stretching state, so that respective moving coils of the first bearing, the second bearing, the third bearing and the fourth bearing are in pressing contact with the side surface of the first pin shaft;
a hanging rod is arranged in the area of the supporting plate between the moving point contact probe and the adapter, a lifting rod is arranged in the guide channel of the body, two ends of a second elastic piece are respectively connected to the lower ends of the hanging rod and the lifting rod, and the lower end of a rotating rod is connected with the upper end of the lifting rod;
the test method comprises the following steps:
step one, installing a fixture provided with a plurality of chips to be tested on the upper surface of a test bench;
moving the driving support to enable a probe of a test probe assembly arranged on the driving support to be in contact with the surface of a conductive area of a chip to be tested, and simultaneously, along with the rotation of the supporting plate, a moving point contact probe on the supporting plate and a static point contact probe on the test probe assembly body are changed from a contact state to a separation state;
and step three, powering up the chip to be tested through a probe of the test probe assembly, and simultaneously testing and recording test data of the chip.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the first elastic member and the second elastic member are both springs.
2. In the above scheme, the cantilever further includes the riser and the horizontal plate of being connected with the riser upper end, the riser lower extreme is connected with the backup pad, the horizontal plate is kept away from riser one end and is installed the probe seat.
3. In the above scheme, the drive support further includes two parallel arrangement's pole setting, connects the mounting panel between two pole setting upper ends and connects the connecting plate between two pole setting lower extremes, 2 the test probe subassembly is installed respectively on the upper surface at mounting panel both ends.
4. In the scheme, a fixing plate installed on the base plate is vertically arranged between the vertical rod of the driving support and the base plate, a motor is installed on the lower portion of the fixing plate, a lead screw is installed on an output shaft of the motor in the vertical direction, and a lead screw nut sleeved on the lead screw is connected with a connecting plate of the driving support.
5. In the above scheme, the two sides of the screw rod and the position between the vertical rod and the fixed plate are respectively provided with a sliding rail, and the vertical rod is movably connected with the sliding rails through at least two sliding blocks.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the invention relates to a test method for a laser chip, which is based on a test device.A first pin shaft which is vertical to the length direction of a support plate is arranged on the rotatable support plate provided with a probe, a second pin shaft and a third pin shaft which are fixed on a body are arranged at two sides above the first pin shaft, four bearings which are jointed with the first pin shaft are arranged at two ends of the second pin shaft and the third pin shaft, and finally the first pin shaft on the support plate and the fourth pin shaft in the body are tensioned by a first elastic part, so that outer rings of the four bearings are kept in pressing contact with the outer circumferential surface of the first pin shaft and can rotate relatively, the fatigue problem in the prior art is solved, the accurate setting of position parameters in the horizontal direction and the vertical direction is facilitated, and the stability of an initial pressure set value can be kept after long-term and high-frequency use, thereby improving the stability, repeatability and the reliability of detection data, The probe has comparability and consistency, and the defect that the probe has micro-jitter in the vertical direction when the probe is separated from the chip is overcome, so that the time between adjacent detections is favorably shortened, the detection efficiency is improved, and unnecessary damage to the chip is avoided; and the micro rotation offset of the probe in the horizontal direction is eliminated, the accuracy of the detection data is ensured, and the stability, repeatability, comparability and consistency of the detection data are further improved.
2. According to the test method for the laser chip, a hanging rod is arranged in a region, located between a moving point contact probe and an adapter, of a supporting plate, a lifting rod is located in a guide channel of a body, two ends of a second elastic piece are connected to the upper end of the hanging rod and the lower end of the lifting rod respectively, the lower end of a rotating rod is connected with the upper end of the lifting rod and used for driving the lifting rod to move in the vertical direction, and the downward pressure of a probe is conveniently adjusted, so that application objects are greatly expanded, accuracy of the probe on the pressure of the chip is achieved when different chips are tested, and the application range is wide; furthermore, the surface that its direction passageway and lifter contact is provided with at least a pair of locating pin and the location line recess that supplies the locating pin embedding, and the lifter is with changeing when can effectively avoiding adjusting through the rotary rod, guarantees the precision and the stability of adjusting.
Drawings
FIG. 1 is a schematic diagram of the structure of a test apparatus on which the present invention is based;
FIG. 2 is a schematic diagram of a test probe assembly of the test apparatus according to the present invention;
FIG. 3 is a first partial cross-sectional view of a test probe assembly in a test apparatus according to the present invention;
FIG. 4 is an exploded view of a test probe assembly of the test apparatus according to the present invention;
FIG. 5 is a partial cross-sectional view of a test probe assembly of the test apparatus according to the present invention.
In the above drawings: 1. a body; 2. a support plate; 31. the moving point contacts the probe; 32. a stationary point contact probe; 4. a cantilever; 41. a vertical plate; 42. a horizontal plate; 5. a probe base; 51. a probe; 6. a transfer seat; 61. a front baffle; 62. a tailgate; 7. a first through hole; 8. a guide groove; 9. a first pin shaft; 10. a lower bump; 11. a second pin shaft; 12. a third pin shaft; 13. a first bearing; 14. a second bearing; 15. a third bearing; 16. a fourth bearing; 17. a vertical through hole; 18. a first elastic member; 19. a fourth pin shaft; 20. a hanging rod; 21. a lifting rod; 22. a guide channel; 23. a second elastic member; 24. rotating the rod; 26. a substrate; 27. a test bench; 28. a drive bracket; 281. erecting a rod; 282. mounting a plate; 283. a connecting plate; 29. testing the probe assembly; 30. a fixing plate; 31. a motor; 32. a screw rod; 33. a feed screw nut; 34. a slide rail; 35. a slide block.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a testing method for a laser chip is based on a testing apparatus including a substrate 26, a testing table 27 mounted on an upper surface of the substrate 26, a driving bracket 28 mounted on an outer side of the substrate 26, and a test probe assembly 29 mounted on the driving bracket 28 and located above the testing table 27, the test probe assembly 29 comprising: the probe device comprises a body 1, a support plate 2, a probe 51 used for contacting with a chip to be tested and a moving point contact probe 31 which are connected with a driving support 28, wherein one end of the support plate 2 is provided with a cantilever 4, the other end of the support plate is provided with the moving point contact probe 31, one side of the lower end surface of the body 1 is provided with a fixed point contact probe 32 which is positioned at the upper part of the moving point contact probe 31 and corresponds to the moving point contact probe, and one end of the cantilever 4, which is far away from the support plate 2, is fixedly provided with a probe seat 5 provided with the probe 51;
a transfer seat 6 is arranged on the upper surface of the middle part of the support plate 2, the front side and the rear side of the transfer seat 6 are respectively provided with a front baffle 61 and a rear baffle 62, the front baffle 61 and the rear baffle 62 are respectively provided with a first through hole 7 and 2 guide grooves 8 positioned at two sides of the first through hole 7, and two ends of a first pin shaft 9 are respectively positioned in the respective first through holes 7 of the front baffle 61 and the rear baffle 62;
a second pin shaft 11 and a third pin shaft 12 are arranged on the lower convex block 10 positioned on the other side of the lower end face of the body 1 in parallel, the second pin shaft 11 and the third pin shaft 12 are positioned above the first pin shaft 9 and positioned on two sides of the first pin shaft, two ends of the second pin shaft 11 and two ends of the third pin shaft 12 respectively extend out from the front side and the rear side of the lower convex block 10, a first bearing 13 and a second bearing 14 are respectively sleeved on two ends of the second pin shaft 11 and positioned on the front side and the rear side of the lower convex block 10, and a third bearing 15 and a fourth bearing 16 are respectively sleeved on two ends of the third pin shaft 12 and positioned on the front side and the rear side of the lower convex block 10;
the first bearing 13, the third bearing 15, the second bearing 14 and the fourth bearing 16 are respectively positioned between the lower lug 10 and the front baffle plate 61 and the rear baffle plate 62, one end of a first elastic part 18 positioned in a vertical through hole 17 of the lower lug 10 is connected with the middle area of the first pin shaft 9 positioned between the front baffle plate 61 and the rear baffle plate 62, the other end of the first elastic part is connected with a fourth pin shaft 19 positioned in the body 1 and positioned above the second pin shaft 11 and the third pin shaft 12, and the first elastic part 18 is in a stretching state, so that moving coils of the first bearing 13, the second bearing 14, the third bearing 15 and the fourth bearing 16 are respectively in pressing contact with the side surface of the first pin shaft 9;
a hanging rod 20 is arranged in the area of the support plate 2 between the moving point contact probe 31 and the adapter 6, a lifting rod 21 is arranged in the guide channel 22 of the body 1, two ends of a second elastic element 23 are respectively connected to the lower ends of the hanging rod 20 and the lifting rod 21, and the lower end of a rotating rod 24 is connected with the upper end of the lifting rod 21;
the test method comprises the following steps:
step one, installing a fixture provided with a plurality of chips to be tested on the upper surface of a test bench 27;
moving the driving bracket 28 to make the probe 51 of the test probe assembly 29 mounted on the driving bracket 28 contact with the surface of the conductive area of a chip to be tested, and simultaneously, along with the rotation of the supporting plate 2, the moving point contact probe 31 on the supporting plate 2 and the fixed point contact probe 32 on the test probe assembly 29 body 1 are changed from a contact state to a separation state;
and step three, powering up the chip to be tested through the probe 51 of the test probe assembly 29, and simultaneously testing and recording test data of the chip.
The first elastic member 18 and the second elastic member 23 are both springs; the cantilever 4 further comprises a vertical plate 41 and a horizontal plate 42 connected with the upper end of the vertical plate 41, the lower end of the vertical plate 41 is connected with the supporting plate 2, and the end of the horizontal plate 42 far away from the vertical plate 41 is provided with a probe seat 5.
Example 2: a testing method for a laser chip is based on a testing apparatus including a substrate 26, a testing table 27 mounted on an upper surface of the substrate 26, a driving bracket 28 mounted on an outer side of the substrate 26, and a test probe assembly 29 mounted on the driving bracket 28 and located above the testing table 27, the test probe assembly 29 comprising: the probe device comprises a body 1, a support plate 2, a probe 51 used for contacting with a chip to be tested and a moving point contact probe 31 which are connected with a driving support 28, wherein one end of the support plate 2 is provided with a cantilever 4, the other end of the support plate is provided with the moving point contact probe 31, one side of the lower end surface of the body 1 is provided with a fixed point contact probe 32 which is positioned at the upper part of the moving point contact probe 31 and corresponds to the moving point contact probe, and one end of the cantilever 4, which is far away from the support plate 2, is fixedly provided with a probe seat 5 provided with the probe 51;
a transfer seat 6 is arranged on the upper surface of the middle part of the support plate 2, the front side and the rear side of the transfer seat 6 are respectively provided with a front baffle 61 and a rear baffle 62, the front baffle 61 and the rear baffle 62 are respectively provided with a first through hole 7 and 2 guide grooves 8 positioned at two sides of the first through hole 7, and two ends of a first pin shaft 9 are respectively positioned in the respective first through holes 7 of the front baffle 61 and the rear baffle 62;
a second pin shaft 11 and a third pin shaft 12 are arranged on the lower convex block 10 positioned on the other side of the lower end face of the body 1 in parallel, the second pin shaft 11 and the third pin shaft 12 are positioned above the first pin shaft 9 and positioned on two sides of the first pin shaft, two ends of the second pin shaft 11 and two ends of the third pin shaft 12 respectively extend out from the front side and the rear side of the lower convex block 10, a first bearing 13 and a second bearing 14 are respectively sleeved on two ends of the second pin shaft 11 and positioned on the front side and the rear side of the lower convex block 10, and a third bearing 15 and a fourth bearing 16 are respectively sleeved on two ends of the third pin shaft 12 and positioned on the front side and the rear side of the lower convex block 10;
the first bearing 13, the third bearing 15, the second bearing 14 and the fourth bearing 16 are respectively positioned between the lower lug 10 and the front baffle plate 61 and the rear baffle plate 62, one end of a first elastic part 18 positioned in a vertical through hole 17 of the lower lug 10 is connected with the middle area of the first pin shaft 9 positioned between the front baffle plate 61 and the rear baffle plate 62, the other end of the first elastic part is connected with a fourth pin shaft 19 positioned in the body 1 and positioned above the second pin shaft 11 and the third pin shaft 12, and the first elastic part 18 is in a stretching state, so that moving coils of the first bearing 13, the second bearing 14, the third bearing 15 and the fourth bearing 16 are respectively in pressing contact with the side surface of the first pin shaft 9;
a hanging rod 20 is arranged in the area of the support plate 2 between the moving point contact probe 31 and the adapter 6, a lifting rod 21 is arranged in the guide channel 22 of the body 1, two ends of a second elastic element 23 are respectively connected to the lower ends of the hanging rod 20 and the lifting rod 21, and the lower end of a rotating rod 24 is connected with the upper end of the lifting rod 21;
the test method comprises the following steps:
step one, installing a fixture provided with a plurality of chips to be tested on the upper surface of a test bench 27;
moving the driving bracket 28 to make the probe 51 of the test probe assembly 29 mounted on the driving bracket 28 contact with the surface of the conductive area of a chip to be tested, and simultaneously, along with the rotation of the supporting plate 2, the moving point contact probe 31 on the supporting plate 2 and the fixed point contact probe 32 on the test probe assembly 29 body 1 are changed from a contact state to a separation state;
and step three, powering up the chip to be tested through the probe 51 of the test probe assembly 29, and simultaneously testing and recording test data of the chip.
The driving bracket 28 further includes two uprights 281 disposed in parallel, a mounting plate 282 connected between upper ends of the two uprights 281, and a coupling plate 283 connected between lower ends of the two uprights 281, and 2 of the test probe assemblies 29 are respectively mounted on upper surfaces of both ends of the mounting plate 282;
a fixing plate 30 installed on the base plate 26 is vertically arranged between the upright 281 of the driving bracket 28 and the base plate 26, a motor 31 is installed at the lower part of the fixing plate 30, a screw rod 32 is installed on the output shaft of the motor 31 along the vertical direction, and a screw rod nut 33 sleeved on the screw rod 32 is connected with a connecting plate 283 of the driving bracket 33;
a slide rail 34 is respectively arranged on two sides of the screw rod 32 and between the upright 281 and the fixing plate 30, and the upright 281 is movably connected with the slide rail 34 through at least two slide blocks 35;
the mounting plate 282 and the test probe assembly 29 are connected to each other through an X-direction fine adjustment sliding table and a Y-direction fine adjustment sliding table which are superposed, a body of the X-direction fine adjustment sliding table is mounted on the mounting plate 282, a body of the Y-direction fine adjustment sliding table is mounted on a movable portion of the X-direction fine adjustment sliding table, and the test probe assembly 29 is mounted on the movable portion of the Y-direction fine adjustment sliding table through a transfer plate.
When the test method for the laser chip is adopted, the probe is contacted with the chip to be tested by moving the driving support, the probe applies downward pressure to the chip and simultaneously receives upward reaction force from the chip to drive the supporting plate to rotate, the movable point contact probe arranged on the supporting plate moves downward, the initial state of contact with the fixed point contact probe is changed into a state of separation from the fixed point contact probe, the probe applies proper pressure to the chip, at the moment, a control system for testing the chip executes power-on operation to electrically conduct the probe and the chip and test various parameters of the chip, after the test is finished, the supporting plate reversely rotates under the action of the second elastic piece to restore to the initial horizontal position, and meanwhile, the movable point contact probe is contacted with the fixed point contact probe;
in the process of testing a large number of chips for a long time and reciprocating rotation of the supporting plate, the first pin shaft arranged on the supporting plate is attached to the four bearings which are arranged on the body and arranged at two sides and two ends of the first pin shaft through the first elastic piece, so that the first pin shaft can be accurately limited while the supporting plate can smoothly rotate by taking the first pin shaft as a fulcrum, and the supporting plate can only rotate without deviating in other directions; the problem of fatigue in the prior art adopting the elastic sheet is solved, the position parameters in the horizontal and vertical directions can be accurately set, and the stability of the initial pressure set value can be still kept after long-term and high-frequency use, so that the stability, repeatability, comparability and consistency of detection data are improved, the defect that the probe has micro-jitter in the vertical direction when the probe is separated from the chip is overcome, the time between adjacent detections can be favorably shortened, the detection efficiency is improved, and unnecessary damage to the chip is avoided;
furthermore, the micro rotation offset of the probe in the horizontal direction is eliminated, the accuracy of the detection data is ensured, and the stability, repeatability, comparability and consistency of the detection data are further improved;
in addition, the adjustment of the pressure under the probe is convenient, so that the application objects are greatly expanded, the accuracy of the probe on the pressure of the chip is realized when different chips are tested, and the application range is wide; furthermore, the surface that its direction passageway and lifter contact is provided with at least a pair of locating pin and the location line recess that supplies the locating pin embedding, and the lifter is with changeing when can effectively avoiding adjusting through the rotary rod, guarantees the precision and the stability of adjusting.
The testing method for the laser chip can be expanded to other industries for testing the semiconductor chip, is not limited to the optical communication industry, can be synchronously expanded and used in all industries needing to use the testing method for the laser chip, and has wide application range.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (6)
1. A test method for a laser chip is characterized in that based on a test device, the test device comprises: a substrate (26), a test bed (27) mounted on an upper surface of the substrate (26), a drive bracket (28) mounted on an outer side of the substrate (26), and a test probe assembly (29) mounted on the drive bracket (28) and positioned above the test bed (27), the test probe assembly (29) comprising: the probe comprises a body (1) connected with a driving support (28), a supporting plate (2), a probe (51) used for contacting with a chip to be tested and a moving point contact probe (31), wherein one end of the supporting plate (2) is provided with a cantilever (4), the other end of the supporting plate is provided with the moving point contact probe (31), one side of the lower end surface of the body (1) is provided with a fixed point contact probe (32) which is positioned at the upper part of the moving point contact probe (31) and corresponds to the moving point contact probe, and one end, far away from the supporting plate (2), of the cantilever (4) is fixedly provided with a probe seat (5) provided with the probe (51);
a switching seat (6) is arranged on the upper surface of the middle part of the supporting plate (2), the front side and the rear side of the switching seat (6) are respectively provided with a front baffle (61) and a rear baffle (62), the front baffle (61) and the rear baffle (62) are respectively provided with a first through hole (7) and 2 guide grooves (8) positioned at two sides of the first through hole (7), and two ends of a first pin shaft (9) are respectively positioned in the respective first through holes (7) of the front baffle (61) and the rear baffle (62);
a second pin shaft (11) and a third pin shaft (12) are arranged on a lower convex block (10) on the other side of the lower end face of the body (1) in parallel, the second pin shaft (11) and the third pin shaft (12) are arranged above the first pin shaft (9) and are arranged on two sides of the first pin shaft, two ends of the second pin shaft (11) and two ends of the third pin shaft (12) respectively extend out from the front side and the rear side of the lower convex block (10), a first bearing (13) and a second bearing (14) are respectively sleeved at two ends of the second pin shaft (11) and are arranged on the front side and the rear side of the lower convex block (10), and a third bearing (15) and a fourth bearing (16) are respectively sleeved at two ends of the third pin shaft (12) and are arranged on the front side and the rear side of the lower convex block (10);
the first bearing (13), the third bearing (15), the second bearing (14) and the fourth bearing (16) are respectively positioned between the lower lug (10) and the front baffle (61) and the rear baffle (62), one end of a first elastic piece (18) positioned in a vertical through hole (17) of the lower lug (10) is connected with the middle area of the first pin shaft (9) positioned between the front baffle (61) and the rear baffle (62), the other end of the first elastic piece is connected with a fourth pin shaft (19) positioned in the body (1) and positioned above the second pin shaft (11) and the third pin shaft (12), and the first elastic piece (18) is in a stretching state, so that respective moving rings of the first bearing (13), the second bearing (14), the third bearing (15) and the fourth bearing (16) are in pressing contact with the side surface of the first pin shaft (9);
a hanging rod (20) is arranged in the area, located between the moving point contact probe (31) and the adapter (6), of the supporting plate (2), a lifting rod (21) is located in a guide channel (22) of the body (1), two ends of a second elastic piece (23) are respectively connected to the lower ends of the hanging rod (20) and the lifting rod (21), and the lower end of a rotating rod (24) is connected with the upper end of the lifting rod (21);
the test method comprises the following steps:
step one, installing a fixture provided with a plurality of chips to be tested on the upper surface of a test bench (27);
moving the driving bracket (28) to enable a probe (51) of a test probe assembly (29) arranged on the driving bracket (28) to be in contact with the surface of a conductive area of a chip to be tested, and simultaneously, along with the rotation of the supporting plate (2), a moving point contact probe (31) on the supporting plate (2) and a static point contact probe (32) on a body (1) of the test probe assembly (29) are changed from a contact state to a separation state;
and step three, powering up the chip to be tested through a probe (51) of the test probe assembly (29), and simultaneously testing and recording test data of the chip.
2. The test method for a laser chip according to claim 1, characterized in that: the first elastic piece (18) and the second elastic piece (23) are both springs.
3. The test method for a laser chip according to claim 1, characterized in that: cantilever (4) further include riser (41) and horizontal plate (42) be connected with riser (41) upper end, riser (41) lower extreme is connected with backup pad (2), vertical plate (41) one end is kept away from in horizontal plate (42) and probe seat (5) are installed.
4. The test method for a laser chip according to claim 1, characterized in that: the driving bracket (28) further comprises two parallel uprights (281), a mounting plate (282) connected between the upper ends of the two uprights (281), and a connecting plate (283) connected between the lower ends of the two uprights (281), and 2 of the test probe assemblies (29) are respectively mounted on the upper surfaces of both ends of the mounting plate (282).
5. The test method for a laser chip according to claim 4, wherein: a fixing plate (30) installed on the base plate (26) is vertically arranged between the vertical rod (281) of the driving support (28) and the base plate (26), a motor (31) is installed on the lower portion of the fixing plate (30), a screw rod (32) is installed on an output shaft of the motor (31) in the vertical direction, and a screw rod nut (33) sleeved on the screw rod (32) is connected with a connecting plate (283) of the driving support (33).
6. The test method for a laser chip according to claim 5, wherein: the two sides of the screw rod (32) are respectively provided with a sliding rail (34) between the vertical rod (281) and the fixed plate (30), and the vertical rod (281) is movably connected with the sliding rails (34) through at least two sliding blocks (35).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110906709.8A CN114325295A (en) | 2021-08-09 | 2021-08-09 | Test method for laser chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110906709.8A CN114325295A (en) | 2021-08-09 | 2021-08-09 | Test method for laser chip |
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| Publication Number | Publication Date |
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| CN114325295A true CN114325295A (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110906709.8A Pending CN114325295A (en) | 2021-08-09 | 2021-08-09 | Test method for laser chip |
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| CN (1) | CN114325295A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114660442A (en) * | 2022-05-24 | 2022-06-24 | 苏州联讯仪器有限公司 | Multi-probe testing device for chip |
| WO2023201965A1 (en) * | 2022-04-21 | 2023-10-26 | 河北圣昊光电科技有限公司 | Probe mount and testing platform having same |
-
2021
- 2021-08-09 CN CN202110906709.8A patent/CN114325295A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023201965A1 (en) * | 2022-04-21 | 2023-10-26 | 河北圣昊光电科技有限公司 | Probe mount and testing platform having same |
| CN114660442A (en) * | 2022-05-24 | 2022-06-24 | 苏州联讯仪器有限公司 | Multi-probe testing device for chip |
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