CN114325295A - Test method for laser chip - Google Patents

Abstract

The invention discloses a testing method for a laser chip, which is based on a testing device, the testing device comprises a substrate, a testing table mounted on the upper surface of the substrate, a driving bracket mounted on the outside of the substrate, and a driving bracket mounted on the driving bracket and located in the test device. A test probe assembly above the stage, the test probe assembly includes: a body connected to the drive bracket, a support plate, a probe for contacting the chip to be tested and a moving point contact probe, and one end of the support plate is mounted with a cantilever , the other end is installed with the moving point contact probe, one side of the lower end face of the body is provided with a static point contact probe located on the upper part of the moving point contact probe and corresponding to it, and one end of the cantilever away from the support plate is fixed with a fixed point contact probe installed with the probe needle probe holder. The invention ensures the accuracy of the detection position, and further improves the stability, repeatability, comparability and consistency of the detection data.

Description

Test methods for laser chips

technical field

The invention relates to a testing method for laser chips, belonging to the technical field of chip testing.

Background technique

In the production and testing of lasers in the optical communication industry, before the COC aging process, the optoelectronic performance test of a single laser chip (Laser Diode, LD) is also required, so that the performance of the laser chip (LD) can be screened before aging. Problematic lasers are picked out ahead of time, improving overall yield after COC burn-in.

In the test process of a single laser chip (LD) for optical communication, the stability of the probe plays a very important role. Since the size of a single chip is very small (generally in the range of 300 μm), the test probe may be in contact with the chip during the process, or more At least it will push the position or angle of the chip to shift. Once the position and angle of the chip change, it will directly affect the stability and test efficiency of the subsequent test indicators, and the pressure stability of the test probe will also be directly fed back. In terms of the stability of the test value, for mass production testing, a probe needs to detect a large number of chips, and the same chip needs to be tested multiple times. The stability and durability of the power-on probe assembly will directly affect the test. The consistency and reproducibility of the test data put very strict requirements on the long-term stability of the probe station during the test.

SUMMARY OF THE INVENTION

The inventor found that the change of the pressure applied by the probe on the chip will lead to the change of the contact resistance, thus affecting the consistency of the test data. The change is brought about by the chip itself or the machine, resulting in the loss of comparability of test results. Based on the above findings, the object of the present invention is to provide a testing method for a laser chip, which solves the existing problems in the prior art due to the fatigue of the probe station during long-term use. Test data instability and inconsistency.

In order to achieve the above object, the technical solution adopted in the present invention is: a testing method for a laser chip, based on a testing device, the testing device includes a substrate, a test table mounted on the upper surface of the substrate, and a driver mounted on the outside of the substrate A bracket and a test probe assembly mounted on the drive bracket and located above the test table, the test probe assembly includes: a body connected with the drive bracket, a support plate, a probe for contacting the chip to be tested, and a moving point contact Probe, one end of the support plate is installed with a cantilever, the other end is installed with the moving point contact probe, one side of the lower end face of the body is provided with a static point contact probe located on the upper part of the moving point contact probe and corresponding to it, the cantilever is far away from the moving point contact probe One end of the support plate is fixed with a probe seat on which the probe is installed;

An adapter seat is installed on the upper surface of the middle part of the support plate. The front side and the rear side of the adapter seat are respectively provided with a front baffle and a rear baffle. Two guide grooves on both sides of a through hole, two ends of a first pin shaft are respectively located in the respective first through holes of the front baffle and the rear baffle;

A second pin shaft and a third pin shaft are arranged in parallel on the lower bump located on the other side of the lower end face of the body. Both ends of the pin shaft and the third pin shaft extend from the front and rear sides of the lower bump. The first bearing and the second bearing are respectively sleeved on both ends of the second pin shaft and located on the front and rear sides of the lower bump. The third bearing and The fourth bearing is respectively sleeved on both ends of the third pin shaft and located on the front and rear sides of the lower bump;

The first bearing, the third bearing, the second bearing and the fourth bearing are respectively located between the lower bump and the front baffle and the rear baffle, and one end of the first elastic member located in the vertical through hole of the lower bump is connected to the The first pin is connected in the middle area between the front baffle and the rear baffle, and the other end is connected with the fourth pin located in the body and above the second pin and the third pin. The first elastic member in a stretched state, so that the respective moving rings of the first bearing, the second bearing, the third bearing and the fourth bearing are pressed and contacted with the side surface of the first pin shaft;

A hanging rod is installed on the support plate between the moving point contact probe and the adapter seat, a lifting rod is located in the guide channel of the main body, and both ends of a second elastic member are respectively connected to the hanging rod and the lower end of the lifting rod , the lower end of a rotating rod is connected with the upper end of the lifting rod;

The test method includes the following steps:

Step 1. Install the fixture with several chips to be tested on the upper surface of the test bench;

Step 2: Move the drive bracket so that the probe of the test probe assembly mounted on the drive bracket contacts the conductive area surface of a chip to be tested. At the same time, with the rotation of the support plate, the moving point on the support plate contacts the probe with the The static point contact probe on the test probe assembly body changes from the contact state to the separated state;

Step 3: Power on the chip to be tested through the probe of the test probe assembly, and test and record the test data of the chip at the same time.

The further improved scheme in the above-mentioned technical scheme is as follows:

1. In the above solution, the first elastic member and the second elastic member are both springs.

2. In the above solution, the cantilever further includes a vertical plate and a horizontal plate connected to the upper end of the vertical plate, the lower end of the vertical plate is connected to the support plate, and a probe seat is installed at one end of the horizontal plate away from the vertical plate.

3. In the above-mentioned scheme, the drive bracket further comprises two vertical poles arranged in parallel, a mounting plate connected between the upper ends of the two vertical poles and a connecting plate connected between the lower ends of the two vertical poles. The test probe assemblies are respectively mounted on the upper surfaces of both ends of the mounting plate.

4. In the above scheme, a fixing plate installed on the base plate is vertically arranged between the vertical rod of the drive bracket and the base plate, a motor is installed on the lower part of the fixing plate, and a motor is installed on the output shaft of the motor along the vertical direction. A screw rod is provided, and a screw nut sleeved on the screw rod is connected with the connecting plate of the driving bracket.

5. In the above solution, a slide rail is provided on both sides of the screw rod and between the vertical rod and the fixed plate, and the vertical rod is movably connected to the slide rail through at least two sliders.

Due to the application of the above-mentioned technical solutions, the present invention has the following advantages compared with the prior art:

1. The test method for laser chips of the present invention is based on a test device, where a first pin shaft perpendicular to the length direction of the support plate is installed on a rotatable support plate with probes installed, and a first pin shaft is installed on the first pin shaft. The second and third pin shafts fixed on the body are arranged on both sides of the upper part, and then four bearings that fit with the first pin shaft are installed at both ends of the second and third pin shafts, and finally are tightened by the first elastic member The first pin on the support plate and the fourth pin in the body make the outer rings of the four bearings keep in pressing contact with the outer circumferential surface of the first pin and can rotate relative to each other, eliminating the existing problems in the prior art. The fatigue problem is conducive to accurately setting the position parameters in the horizontal and vertical directions, and can maintain the stability of the initial pressure setting value after long-term and high-frequency use, thereby improving the stability, repeatability, and comparability of test data. It also overcomes the defect of slight jitter in the vertical direction of the probe when the probe is separated from the chip, which is beneficial to shorten the time between adjacent inspections, improve the inspection efficiency and avoid unnecessary damage to the chip. It also eliminates the slight rotation offset of the probe in the horizontal direction, ensures the accuracy of the test data, and further improves the stability, repeatability, comparability and consistency of the test data.

2. The testing method of the present invention is used for laser chips. The support plate is located between the moving point contact probe and the adapter seat. A hanging rod is installed, and a lifting rod is located in the guide channel of the main body. Both ends of the second elastic member It is connected to the hanging rod and the lower end of the lifting rod respectively, and the lower end of a rotating rod is connected to the upper end of the lifting rod, which is used to drive the lifting rod to move in the vertical direction, which is convenient to adjust the downward pressure of the probe, thus greatly expanding the application The object realizes the accuracy of the pressure of the probe on the chip when testing different chips, and has a wide range of adaptability; further, the surface of the guide channel in contact with the lifting rod is provided with at least a pair of positioning pins and positioning pins for embedding. The line groove can effectively avoid the following rotation of the lifting rod when adjusting by the rotating rod, so as to ensure the accuracy and stability of the adjustment.

Description of drawings

Accompanying drawing 1 is the structural representation of the test device on which the present invention is based;

2 is a schematic structural diagram of a test probe assembly in a test device based on the present invention;

3 is a partial structural cross-sectional view 1 of the test probe assembly in the test device based on the present invention;

Fig. 4 is the structural exploded schematic diagram of the test probe assembly in the test device on which the present invention is based;

FIG. 5 is a second partial structural cross-sectional view of the test probe assembly in the test device based on the present invention.

In the above drawings: 1, body; 2, support plate; 31, dynamic point contact probe; 32, static point contact probe; 4, cantilever; 41, vertical plate; 42, horizontal plate; 5, probe seat; 51, Probe; 6. Adapter seat; 61. Front baffle; 62. Back baffle; 7. First through hole; 8. Guide groove; 9. First pin; 10. Lower bump; 11. No. 1 Two pins; 12, the third pin; 13, the first bearing; 14, the second bearing; 15, the third bearing; 16, the fourth bearing; 17, the vertical through hole; 18, the first elastic member; 19 20, hanging rod; 21, lifting rod; 22, guide channel; 23, second elastic part; 24, rotating rod; 26, base plate; 27, test bench; 28, driving bracket; 281, vertical Rod; 282, mounting plate; 283, connecting plate; 29, test probe assembly; 30, fixing plate; 31, motor; 32, lead screw; 33, lead screw nut; 34, slide rail; 35, slider.

Detailed ways

In the description of this patent, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limiting the invention; the terms "first", "second", "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; furthermore, unless otherwise Clearly stipulated and defined, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or a Electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal connection of two components. For those of ordinary skill in the art, the specific meanings of the above terms in this patent can be understood in specific situations.

Embodiment 1: A test method for a laser chip, based on a test device, the test device includes a substrate 26, a test table 27 mounted on the upper surface of the substrate 26, a drive bracket 28 mounted on the outside of the substrate 26, and a The test probe assembly 29 on the drive bracket 28 and located above the test table 27, the test probe assembly 29 includes: a main body 1 connected to the drive bracket 28, a support plate 2, and probes 51 for contacting the chip to be tested and the moving point contact probe 31, one end of the support plate 2 is mounted with a cantilever 4, the other end is mounted with the moving point contact probe 31, one side of the lower end face of the main body 1 is provided with a cantilever 4 located on the upper part of the moving point contact probe 31 and corresponding to it The static point contact probe 32 is fixed at one end of the cantilever 4 away from the support plate 2 with a probe seat 5 on which the probe 51 is installed;

An adapter seat 6 is installed on the upper surface of the middle part of the support plate 2. The front side and the rear side of the adapter seat 6 respectively have a front baffle 61 and a rear baffle 62. The front baffle 61 and the rear baffle 62 both have a The first through hole 7 and the two guide grooves 8 located on both sides of the first through hole 7, the two ends of a first pin 9 are respectively located in the respective first through holes 7 of the front baffle 61 and the rear baffle 62;

A second pin shaft 11 and a third pin shaft 12 are arranged in parallel on the lower bump 10 on the other side of the lower end face of the main body 1 , and the second pin shaft 11 and the third pin shaft 12 are located above the first pin shaft 9 and located On its two sides, and both ends of the second pin 11 and the third pin 12 extend from the front and rear sides of the lower bump 10 , the first bearing 13 and the second bearing 14 are respectively sleeved on both ends of the second pin 11 The third bearing 15 and the fourth bearing 16 are respectively sleeved on both ends of the third pin shaft 12 and are located on the front and rear sides of the lower bump 10;

The first bearing 13 , the third bearing 15 , the second bearing 14 , and the fourth bearing 16 are respectively located between the lower bump 10 and the front baffle 61 and the rear baffle 62 , and are located in the vertical through holes of the lower bump 10 . One end of the first elastic member 18 in 17 is connected with the first pin 9 in the middle area between the front baffle 61 and the rear baffle 62, and the other end is connected with the second pin 11 and the third pin located in the main body 1 and the third pin The fourth pin 19 above the shaft 12 is connected, and the first elastic member 18 is in a stretched state, so as to connect the respective moving rings of the first bearing 13 , the second bearing 14 , the third bearing 15 and the fourth bearing 16 with the first bearing 13 , the second bearing 14 , the third bearing 15 and the fourth bearing 16 . A side surface of the pin shaft 9 is pressed and contacted;

A hanging rod 20 is installed on the support plate 2 in the area between the moving point contact probe 31 and the adapter seat 6, a lifting rod 21 is located in the guide channel 22 of the main body 1, and both ends of a second elastic member 23 are respectively connected to the The lower end of the hanging rod 20 and the lifting rod 21, the lower end of a rotating rod 24 is connected with the upper end of the lifting rod 21;

The test method includes the following steps:

Step 1, install the fixture with several chips to be tested on the upper surface of the test table 27;

Step 2: Move the drive bracket 28 so that the probes 51 of the test probe assembly 29 mounted on the drive bracket 28 are in contact with the conductive area surface of a chip to be tested. The moving point contact probe 31 and the static point contact probe 32 on the main body 1 of the test probe assembly 29 change from the contact state to the separated state;

Step 3: Power on the chip to be tested through the probe 51 of the test probe assembly 29, and test and record the test data of the chip at the same time.

The first elastic member 18 and the second elastic member 23 are both springs; the cantilever 4 further includes a vertical plate 41 and a horizontal plate 42 connected to the upper end of the vertical plate 41, the lower end of the vertical plate 41 is connected to the support plate 2, and the horizontal plate A probe seat 5 is installed at one end of 42 away from the vertical plate 41 .

Embodiment 2: A test method for a laser chip, based on a test device, the test device includes a substrate 26, a test table 27 mounted on the upper surface of the substrate 26, a drive bracket 28 mounted on the outside of the substrate 26, and a A test probe assembly 29 on the drive bracket 28 and above the test table 27, the test probe assembly 29 includes: a main body 1 connected to the drive bracket 28, a support plate 2, and probes 51 for contacting the chip to be tested and the moving point contact probe 31, one end of the support plate 2 is mounted with a cantilever 4, the other end is mounted with the moving point contact probe 31, and one side of the lower end face of the main body 1 is provided with a cantilever 4 located on the upper part of the moving point contact probe 31 and corresponding to it. The static point contact probe 32 is fixed at one end of the cantilever 4 away from the support plate 2 with a probe seat 5 on which the probe 51 is installed;

An adapter seat 6 is installed on the upper surface of the middle part of the support plate 2. The front side and the rear side of the adapter seat 6 respectively have a front baffle 61 and a rear baffle 62. The front baffle 61 and the rear baffle 62 both have a The first through hole 7 and the two guide grooves 8 located on both sides of the first through hole 7, the two ends of a first pin 9 are respectively located in the respective first through holes 7 of the front baffle 61 and the rear baffle 62;

A second pin shaft 11 and a third pin shaft 12 are arranged in parallel on the lower bump 10 on the other side of the lower end face of the main body 1 , and the second pin shaft 11 and the third pin shaft 12 are located above the first pin shaft 9 and located On its two sides, and both ends of the second pin 11 and the third pin 12 extend from the front and rear sides of the lower bump 10 , the first bearing 13 and the second bearing 14 are respectively sleeved on both ends of the second pin 11 The third bearing 15 and the fourth bearing 16 are respectively sleeved on both ends of the third pin shaft 12 and are located on the front and rear sides of the lower bump 10;

The first bearing 13 , the third bearing 15 , the second bearing 14 , and the fourth bearing 16 are respectively located between the lower bump 10 and the front baffle 61 and the rear baffle 62 , and are located in the vertical through holes of the lower bump 10 . One end of the first elastic member 18 in 17 is connected with the first pin 9 in the middle area between the front baffle 61 and the rear baffle 62, and the other end is connected with the second pin 11 and the third pin located in the main body 1 and the third pin The fourth pin 19 above the shaft 12 is connected, and the first elastic member 18 is in a stretched state, so as to connect the respective moving rings of the first bearing 13 , the second bearing 14 , the third bearing 15 and the fourth bearing 16 with the first bearing 13 , the second bearing 14 , the third bearing 15 and the fourth bearing 16 . A side surface of the pin shaft 9 is pressed and contacted;

A hanging rod 20 is installed on the support plate 2 in the area between the moving point contact probe 31 and the adapter seat 6, a lifting rod 21 is located in the guide channel 22 of the main body 1, and both ends of a second elastic member 23 are respectively connected to the The lower end of the hanging rod 20 and the lifting rod 21, the lower end of a rotating rod 24 is connected with the upper end of the lifting rod 21;

The test method includes the following steps:

Step 1, install the fixture with several chips to be tested on the upper surface of the test table 27;

Step 2: Move the drive bracket 28 so that the probes 51 of the test probe assembly 29 mounted on the drive bracket 28 are in contact with the conductive area surface of a chip to be tested. The moving point contact probe 31 and the static point contact probe 32 on the main body 1 of the test probe assembly 29 change from the contact state to the separated state;

Step 3: Power on the chip to be tested through the probe 51 of the test probe assembly 29, and test and record the test data of the chip at the same time.

The above-mentioned drive bracket 28 further comprises two vertical rods 281 arranged in parallel, a mounting plate 282 connected between the upper ends of the two vertical rods 281 and a connecting plate 283 connected between the lower ends of the two vertical rods 281. The needle assemblies 29 are respectively mounted on the upper surfaces of both ends of the mounting plate 282;

A fixing plate 30 installed on the base plate 26 is vertically arranged between the vertical rod 281 of the above-mentioned driving bracket 28 and the base plate 26, a motor 31 is installed on the lower part of the above-mentioned fixing plate 30, and a motor 31 is installed on the output shaft of the motor 31 along the vertical direction. A lead screw 32 is provided, and a lead screw nut 33 sleeved on the lead screw 32 is connected to the connecting plate 283 of the drive bracket 33;

A slide rail 34 is provided on both sides of the above-mentioned screw rod 32 and between the vertical rod 281 and the fixed plate 30, and the above-mentioned vertical rod 281 is movably connected to the slide rail 34 through at least two sliders 35;

The above-mentioned mounting plate 282 and the test probe assembly 29 are connected by overlapping X-direction fine-tuning slides and Y-direction fine-tuning slides. The main body is installed on the movable part of the X-direction fine-tuning slide table, and the above-mentioned test probe assembly 29 is installed on the movable part of the Y-direction fine-tuning slide table through an adapter plate.

When the above-mentioned testing method for laser chips is adopted, the probe is brought into contact with the chip to be tested by moving the drive bracket, and the probe exerts downward pressure on the chip while receiving an upward reaction force from the chip, which drives the support plate to rotate, The moving point contact probe installed on the support plate moves down, from the initial state of contact with the static point contact probe to the state of being separated from the static point contact probe, indicating that the probe has applied appropriate pressure to the chip, at this time, The control system of the chip test performs the power-on operation to make the probe and the chip electrically conductive, and test various parameters of the chip. After the test is completed, the support plate rotates in the opposite direction under the action of the second elastic member and returns to the initial horizontal position. , at the same time the moving point contact probe is in contact with the static point contact probe;

During the long-term testing of a large number of chips and the reciprocating rotation of the support plate, the first pin shaft mounted on the support plate is made to fit with the four bearings mounted on the body on both sides and at both ends through the first elastic member. While ensuring that the support plate can rotate smoothly with the first pin shaft as a fulcrum, the precise position limit of the first pin shaft is realized, so that the support plate can only be rotated without deviation in other directions; The fatigue problem existing in the prior art is conducive to accurately setting the position parameters in the horizontal and vertical directions. After long-term and high-frequency use, the stability of the initial pressure setting value can still be maintained, thereby improving the stability of the detection data. It also overcomes the defect of slight jitter in the vertical direction of the probe when the probe is separated from the chip, which is conducive to shortening the time between adjacent detections, thereby improving the detection performance. efficiency and avoid unnecessary damage to the chip;

Further, it also eliminates the slight rotation offset of the probe in the horizontal direction, ensures the accuracy of the detection data, and further improves the stability, repeatability, comparability and consistency of the detection data;

In addition, it is convenient to adjust the downward pressure of the probe, thus greatly expanding the application object, realizing the accuracy of the pressure of the probe on the chip when testing different chips, and the adaptability is wide; further, its guiding channel and lifting rod The contacting surface is provided with at least a pair of positioning pins and a positioning line groove for the positioning pins to be embedded, which can effectively avoid the following rotation of the lifting rod when adjusting by the rotating rod, and ensure the accuracy and stability of the adjustment.

The testing method for laser chips of the present invention can be extended to other industries of semiconductor chip testing, and the application is not limited to the optical communication industry. All industries that need to use the testing method for laser chips can be simultaneously expanded and used, and the application range is wide. .

The above-mentioned embodiments are only intended to illustrate the technical concept and characteristics of the present invention, and the purpose thereof is to enable those who are familiar with the art to understand the content of the present invention and implement them accordingly, and cannot limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included within the protection scope of the present invention.

Claims (6)

1. A test method for a laser chip, characterized in that, based on a test device, the test device comprises: a substrate (26), a test table (27) mounted on the upper surface of the substrate (26), a test table (27) mounted on the substrate (26) (26) An outer drive bracket (28) and a test probe assembly (29) mounted on the drive bracket (28) and located above the test table (27), the test probe assembly (29) comprising: and the drive bracket (28) The connected body (1), the support plate (2), the probe (51) for contacting the chip to be tested, and the moving point contact probe (31), one end of the support plate (2) is mounted with a cantilever ( 4), the other end is equipped with the moving point contact probe (31), and one side of the lower end face of the body (1) is provided with a static point contact probe (32) located on the upper part of the moving point contact probe (31) and corresponding to it, A probe seat (5) on which the probe (51) is mounted is fixed at one end of the cantilever (4) away from the support plate (2); An adapter seat (6) is installed on the upper surface of the middle part of the support plate (2). The front and rear sides of the adapter seat (6) are respectively provided with a front baffle (61) and a rear baffle (62). (61) and the rear baffle (62) have a first through hole (7) and two guide grooves (8) on both sides of the first through hole (7), a first pin (9) The two ends are respectively located in the respective first through holes (7) of the front baffle (61) and the rear baffle (62); A second pin shaft (11) and a third pin shaft (12) are arranged in parallel on the lower bump (10) on the other side of the lower end face of the main body (1). The second pin shaft (11) and the third pin shaft (12) is located above and on both sides of the first pin shaft (9), and both ends of the second pin shaft (11) and the third pin shaft (12) extend from the front and rear sides of the lower bump (10), The first bearing (13) and the second bearing (14) are respectively sleeved on both ends of the second pin shaft (11) and located on the front and rear sides of the lower projection (10). The third bearing (15) and the fourth bearing (16) ) are respectively sleeved on both ends of the third pin (12) and located on the front and rear sides of the lower bump (10); The first bearing (13), the third bearing (15), the second bearing (14), and the fourth bearing (16) are respectively located on the lower bump (10) and the front baffle (61) and the rear baffle (62) ), one end of the first elastic member (18) located in the vertical through hole (17) of the lower bump (10) and the first pin (9) are located at the front baffle (61) and the rear baffle (62). ) in the middle area, and the other end is connected with the fourth pin (19) located in the body (1) and above the second pin (11) and the third pin (12). The first elastic The member (18) is in a stretched state, thereby connecting the respective moving rings of the first bearing (13), the second bearing (14), the third bearing (15) and the fourth bearing (16) to the first pin (9) Side surface pressing contact; A hanging rod (20) is installed on the support plate (2) in the area between the moving point contact probe (31) and the adapter seat (6), and a lifting rod (21) is located in the guide channel (22) of the main body (1). Inside, both ends of a second elastic member (23) are respectively connected to the lower end of the hanging rod (20) and the lifting rod (21), and the lower end of a rotating rod (24) is connected to the upper end of the lifting rod (21); The test method includes the following steps: Step 1. Install the fixture with several chips to be tested on the upper surface of the test table (27); Step 2: Move the drive bracket (28) so that the probe (51) of the test probe assembly (29) mounted on the drive bracket (28) is in contact with the conductive area surface of a chip to be tested. (2) rotation, the dynamic point contact probe (31) on the support plate (2) and the static point contact probe (32) on the main body (1) of the test probe assembly (29) change from the contact state to the separated state; Step 3: Power on the chip to be tested through the probe ( 51 ) of the test probe assembly ( 29 ), and simultaneously test and record the test data of the chip. 2 . The testing method for a laser chip according to claim 1 , wherein the first elastic member ( 18 ) and the second elastic member ( 23 ) are both springs. 3 . 3 . The testing method for laser chips according to claim 1 , wherein the cantilever ( 4 ) further comprises a vertical plate ( 41 ) and a horizontal plate ( 42 ) connected with the upper end of the vertical plate ( 41 ), 3 . The lower end of the vertical plate (41) is connected to the support plate (2), and a probe seat (5) is installed at one end of the horizontal plate (42) away from the vertical plate (41). 4. The testing method for a laser chip according to claim 1, wherein the driving bracket (28) further comprises two vertical rods (281) arranged in parallel, connected to the two vertical rods (281) The mounting plate (282) between the upper ends and the connecting plate (283) connected between the lower ends of the two vertical rods (281), the two test probe assemblies (29) are respectively mounted on the two ends of the mounting plate (282). on the upper surface. 5. The testing method for a laser chip according to claim 4, characterized in that: between the upright rod (281) of the driving bracket (28) and the base plate (26), there is a vertical installation on the base plate (26). ) on the fixing plate (30), a motor (31) is installed at the lower part of the fixing plate (30), and a screw rod (32) arranged in the vertical direction is installed on the output shaft of the motor (31). The screw nut (33) on the rod (32) is connected with the connecting plate (283) of the drive bracket (33). 6 . The testing method for laser chips according to claim 5 , wherein a slide rail is provided on both sides of the lead screw ( 32 ) and between the vertical rod ( 281 ) and the fixing plate ( 30 ). 7 . (34), the vertical rod (281) is movably connected to the slide rail (34) through at least two sliding blocks (35).

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