CN215833555U

CN215833555U - Testing mechanism of optical communication chip

Info

Publication number: CN215833555U
Application number: CN202121730581.6U
Authority: CN
Inventors: 黄建军; 吴永红; 赵山; 胡海洋
Original assignee: Stelight Instrument Inc
Current assignee: Suzhou Lianxun Instrument Co ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2022-02-15
Anticipated expiration: 2031-07-28

Abstract

The utility model discloses a testing mechanism of an optical communication chip, which comprises a substrate, a bracket body arranged on the substrate through an adapter plate, and a supporting plate connected below the bracket body, wherein one end of the supporting plate is provided with a cantilever, the other end of the supporting plate is provided with a moving point contact probe, one side of the lower end surface of the bracket body is provided with a dead point contact probe which is positioned at the upper part of the moving point contact probe and corresponds to the moving point contact probe, and a probe used for contacting with a chip to be tested is arranged at one end of the cantilever, which is far away from the supporting plate, through a probe seat; the centroid moment of the supporting plate part, the cantilever, the probe seat and the probe which are positioned on the right side of the first pin shaft is larger than the centroid moment of the rest part of the supporting plate and the moving point contact probe which are positioned on the left side of the first pin shaft. The utility model eliminates the micro rotation offset of the probe in the horizontal direction, ensures the accuracy of the detection position, and further improves the stability, repeatability, comparability and consistency of the detection data.

Description

Testing mechanism of optical communication chip

Technical Field

The utility model relates to a testing mechanism of an optical communication chip, and belongs to the technical field of chip testing.

Background

In the testing process of an optical communication single laser chip (LD), the stability of a probe plays a very important role, because the size of a single chip is very small (generally in the range of 300 μm), the position or the angle of the chip is more or less pushed to be deviated by the test probe in the process of contacting the chip, once the position and the angle of the chip are changed, the stability and the test efficiency of subsequent test indexes are directly influenced, and the pressure stability of the test probe is also directly fed back to the stability of a test value, in the mass production test link, one probe needs to detect a large number of chips, and needs to detect the same chip for many times, and the stability and durability of the power-on probe assembly can directly influence the consistency and reproducibility of test data, so that a very strict requirement is provided for the long-term stability of a probe station in the test process.

In the probe platform structure of generally adopting in the trade, a general spring leaf bearing structure has all been adopted, through fixed and the small size deformation of spring leaf, give front end probe structure and support, the advantage of this structure lies in simple structure, can install and use in narrow and small space range, the shortcoming lies in the spring leaf at every time the chip detects the use, all can appear the deformation of small-amplitude, this kind of deformation is in long-term high frequency use, the metal fatigue problem of reed can appear, and the metal fatigue can directly reduce the deformation torque moment of reed, the size of this moment can directly influence terminal probe operating pressure's size, and the change of pressure can directly influence test index's stability, need regularly carry out the calibration and the debugging of probe pressure to probe platform structure.

Disclosure of Invention

The utility model aims to provide a testing mechanism of an optical communication chip, which eliminates the tiny rotation deviation of a probe in the horizontal direction, ensures the accuracy of the detection position, and improves the stability, repeatability, comparability and consistency of the detection data.

In order to achieve the purpose, the utility model adopts the technical scheme that: a testing mechanism of an optical communication chip comprises a substrate, a bracket body arranged on the substrate through an adapter plate and a supporting plate connected below the bracket body, wherein one end of the bracket body is provided with an upwards extending installation part which is arranged on a movable part of a Z-direction sliding table, a main body part of the Z-direction sliding table is arranged on the adapter plate, a main body part of an X-direction sliding table is arranged on the substrate, a Y-direction sliding table is arranged on the movable part of the X-direction sliding table, the main body part of the Y-direction sliding table is connected with the movable part of the X-direction sliding table, and the movable part of the Y-direction sliding table is connected with the adapter plate;

one end of the supporting plate is provided with a cantilever, the other end of the supporting plate is provided with a moving point contact probe, one side of the lower end surface of the bracket body is provided with a fixed point contact probe which is positioned at the upper part of the moving point contact probe and corresponds to the moving point contact probe, and a probe used for contacting a chip to be tested is arranged at one end of the cantilever, which is far away from the supporting plate, through a probe seat;

a transfer seat is arranged on the upper surface of the middle part of the supporting plate, the front side and the rear side of the transfer seat are respectively provided with a front baffle and a rear baffle, the front baffle and the rear baffle are respectively provided with a first through hole and 2 guide grooves positioned at two sides of the first through hole, and two ends of a first pin shaft are respectively positioned in the respective first through holes of the front baffle and the rear baffle;

a second pin shaft and a third pin shaft are arranged on the lower convex block on the other side of the lower end face of the bracket body in parallel, the second pin shaft and the third pin shaft are positioned above the first pin shaft and positioned on two sides of the first pin shaft, two ends of the second pin shaft and two ends of the third pin shaft respectively extend out from the front side and the rear side of the lower convex block, a first bearing and a second bearing are respectively sleeved on two ends of the second pin shaft and positioned on the front side and the rear side of the lower convex block, and a third bearing and a fourth bearing are respectively sleeved on two ends of the third pin shaft and positioned on the front side and the rear side of the lower convex block;

the first bearing, the third bearing, the second bearing and the fourth bearing are respectively positioned between the lower lug and the front baffle and the rear baffle, one end of a first elastic part positioned in a vertical through hole of the lower lug is connected with a middle area of the first pin shaft positioned between the front baffle and the rear baffle, the other end of the first elastic part is connected with a fourth pin shaft positioned in the support body and positioned above the second pin shaft and the third pin shaft, and the first elastic part is in a stretching state, so that respective moving coils of the first bearing, the second bearing, the third bearing and the fourth bearing are in pressing contact with the side surface of the first pin shaft;

the centroid moment of the supporting plate part, the cantilever, the probe seat and the probe which are positioned on the right side of the first pin shaft is larger than the centroid moment of the rest part of the supporting plate and the moving point contact probe which are positioned on the left side of the first pin shaft.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the probe seat comprises a base and a clamping piece, the probe is positioned between the base and the clamping piece, and the clamping piece is connected to the base through an adjusting nut.

2. In the scheme, at least one of the surfaces of the base and the clamping piece, which are contacted with the probe, is provided with a V-shaped groove for the probe to be embedded into.

3. In the above scheme, Z is to the slip table, Y is to slip table and X is to the slip table fine setting slip table.

4. In the above scheme, the keysets includes horizontal connecting portion and vertical connecting portion, the main part of Z to the slip table is installed on the vertical connecting portion of keysets, Y is connected with the horizontal connecting portion of keysets to the movable part of slip table.

5. In the above scheme, the end faces of the support plate and the cantilever are provided with wiring grooves for placing cables.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

the utility model relates to a testing mechanism of an optical communication chip, which is characterized in that on the basis of realizing the accurate movement of a bracket provided with a probe in the XYZ direction, a first pin shaft vertical to the length direction of a supporting plate is arranged on the rotatable supporting plate provided with the probe, a second pin shaft and a third pin shaft which are fixed on a body are arranged at two sides above the first pin shaft, four bearings jointed with the first pin shaft are arranged at two ends of the second pin shaft and the third pin shaft, and finally the first pin shaft on the supporting plate and the fourth pin shaft in the body are tensioned by a first elastic part, so that outer rings of the four bearings are kept in pressing contact with the outer circumferential surface of the first pin shaft and can rotate relatively, the fatigue problem in the prior art is solved, the testing mechanism is favorable for accurately setting position parameters in the horizontal direction and the vertical direction, and can still keep the stability of an initial pressure set value after long-term and high-frequency use, thereby improving the stability of detected data, The repeatability, the comparability and the consistency also overcome the defect that the probe has micro-jitter in the vertical direction when the probe is separated from the chip, thereby being beneficial to shortening the time between adjacent detections, improving the detection efficiency and avoiding unnecessary damage to the chip; and the micro rotation offset of the probe in the horizontal direction is eliminated, the accuracy of the detection data is ensured, and the stability, repeatability, comparability and consistency of the detection data are further improved.

Drawings

FIG. 1 is a schematic structural diagram of a testing mechanism of an optical communication chip according to the present invention;

FIG. 2 is a schematic view of a partial structure of a testing mechanism of an optical communication chip according to the present invention;

FIG. 3 is a schematic partial exploded view of a testing mechanism for an optical communication chip according to the present invention;

FIG. 4 is a first partial sectional view of the testing mechanism of the optical communication chip according to the present invention;

FIG. 5 is a schematic diagram of a second partial structure of a testing mechanism of the optical communication chip according to the present invention;

FIG. 6 is a sectional view of a second partial structure of a testing mechanism of the optical communication chip according to the present invention;

fig. 7 is a schematic structural diagram of a probe seat in a testing mechanism of an optical communication chip according to the present invention.

In the above drawings: 1. a stent body; 101. an installation part; 2. a support plate; 31. the moving point contacts the probe; 32. a stationary point contact probe; 4. a cantilever; 5. a probe base; 51. a probe; 52. a base; 53. a clip; 54. adjusting the nut; 55. a V-shaped groove; 6. a transfer seat; 61. a front baffle; 62. a tailgate; 7. a first through hole; 8. a guide groove; 9. a first pin shaft; 10. a lower bump; 11. a second pin shaft; 12. a third pin shaft; 13. a first bearing; 14. a second bearing; 15. a third bearing; 16. a fourth bearing; 17. a vertical through hole; 18. a first elastic member; 19. a fourth pin shaft; 21. a substrate; 22. an adapter plate; 221. a horizontal connecting portion; 222. a vertical connecting portion; 23. a wiring groove; 24. a Z-direction sliding table; 25. an X-direction sliding table; 26. and a Y-direction sliding table.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: a testing mechanism of an optical communication chip comprises a base plate 21, a support body 1 arranged on the base plate 21 through an adapter plate 22 and a support plate 2 connected below the support body 1, wherein one end of the support body 1 is provided with an installation part 101 extending upwards, the installation part 101 is arranged on a movable part of a Z-direction sliding table 24, a main part of the Z-direction sliding table 24 is arranged on the adapter plate 22, a main part of an X-direction sliding table 25 is arranged on the base plate 21, a Y-direction sliding table 26 is arranged on the movable part of the X-direction sliding table 25, the main part of the Y-direction sliding table is connected with the movable part of the X-direction sliding table 25, and the movable part of the Y-direction sliding table 26 is connected with the adapter plate 22;

a cantilever 4 is installed at one end of the support plate 2, a moving point contact probe 31 is installed at the other end of the support plate 2, a fixed point contact probe 32 which is located at the upper part of the moving point contact probe 31 and corresponds to the moving point contact probe is arranged on one side of the lower end surface of the support body 1, a probe 51 which is used for being in contact with a chip to be tested is installed at one end, far away from the support plate 2, of the cantilever 4 through a probe seat 5, when the probe is in contact with the chip to be tested, the moving point contact probe rotates along with the support plate to be far away from the fixed point contact probe, the moving point contact probe and the fixed point contact probe are changed into a mutually separated state from each other from an initial state of mutual contact, and after a control system for testing the chip receives signals that the moving point contact probe and the fixed point contact probe are mutually separated, electrifying operation is carried out to enable the probe to be electrically conducted with the chip, and then various parameters of the chip are tested;

a transfer seat 6 is arranged on the upper surface of the middle part of the support plate 2, the front side and the rear side of the transfer seat 6 are respectively provided with a front baffle 61 and a rear baffle 62, the front baffle 61 and the rear baffle 62 are respectively provided with a first through

hole

7 and 2 guide grooves 8 positioned at two sides of the first through hole 7, and two ends of a first pin shaft 9 are respectively positioned in the respective first through holes 7 of the front baffle 61 and the rear baffle 62;

a second pin shaft 11 and a third pin shaft 12 are arranged in parallel on a lower convex block 10 positioned on the other side of the lower end face of the support body 1, the second pin shaft 11 and the third pin shaft 12 are positioned above the first pin shaft 9 and positioned on two sides of the first pin shaft, two ends of the second pin shaft 11 and two ends of the third pin shaft 12 respectively extend out from the front side and the rear side of the lower convex block 10, a first bearing 13 and a second bearing 14 are respectively sleeved on two ends of the second pin shaft 11 and positioned on the front side and the rear side of the lower convex block 10, and a third bearing 15 and a fourth bearing 16 are respectively sleeved on two ends of the third pin shaft 12 and positioned on the front side and the rear side of the lower convex block 10;

the first bearing 13, the third bearing 15, the second bearing 14 and the fourth bearing 16 are respectively positioned between the lower lug 10 and the front baffle plate 61 and the rear baffle plate 62, one end of a first elastic part 18 positioned in a vertical through hole 17 of the lower lug 10 is connected with the middle area of the first pin shaft 9 positioned between the front baffle plate 61 and the rear baffle plate 62, the other end of the first elastic part is connected with a fourth pin shaft 19 positioned in the bracket body 1 and positioned above the second pin shaft 11 and the third pin shaft 12, and the first elastic part 18 is in a stretching state, so that moving coils of the first bearing 13, the second bearing 14, the third bearing 15 and the fourth bearing 16 are respectively in pressing contact with the side surface of the first pin shaft 9;

the moment of the center of mass of the part of the support plate 2, the cantilever 4, the probe holder 5 and the probe 51 located on the right side of the first pin 9 is greater than the moment of the center of mass of the rest of the support plate 2, the moving point contact probe 31 located on the left side of the first pin 9.

The probe seat 5 comprises a base 52 and a clip 53, the probe 51 is positioned between the base 52 and the clip 53, and the clip 53 is connected to the base 52 through an adjusting nut 54; at least one of the surfaces of the base 52 and the clip 53 contacting the probe 51 is formed with a V-shaped groove 55 into which the probe 51 is inserted.

Example 2: a test mechanism of an optical communication chip, the base plate 21, mount the body 1 of the support on the base plate 21 and connect to the back plate 2 below the body 1 of the support through a switching board 22, the said body 1 of the support has upwardly extending mounting department 101, this mounting department 101 is mounted on the activity portion of a Z-direction sliding table 24, the said main body portion of Z-direction sliding table 24 is mounted on switching board 22, the main body portion of an X-direction sliding table 25 is mounted on base plate 21, mount a Y-direction sliding table 26 on the activity portion of the said X-direction sliding table 25, the said main body portion of Y-direction sliding table is connected with activity portion of X-direction sliding table 25, the activity portion of this Y-direction sliding table 26 is connected with switching board 22;

a cantilever 4 is installed at one end of the supporting plate 2, a moving point contact probe 31 is installed at the other end of the supporting plate, a fixed point contact probe 32 which is located at the upper part of the moving point contact probe 31 and corresponds to the moving point contact probe is arranged on one side of the lower end surface of the bracket body 1, and a probe 51 which is used for contacting with a chip to be tested is installed at one end, far away from the supporting plate 2, of the cantilever 4 through a probe seat 5;

hole

The Z-direction sliding table, the Y-direction sliding table and the X-direction sliding table are fine adjustment sliding tables; the adapter plate 22 comprises a horizontal connecting part 221 and a vertical connecting part 222, the main body part of the Z-direction sliding table is mounted on the vertical connecting part 222 of the adapter plate 22, and the movable part of the Y-direction sliding table is connected with the horizontal connecting part 221 of the adapter plate 22; the terminal surface of above-mentioned backup pad 2, cantilever 4 is opened has the confession and is placed the line recess 23 of walking of cable for probe seat, backup pad rotate many electric wires, data line steady state in-process repeatedly during the test, avoid the interference to the test, guarantee test data's precision and stability.

When the testing mechanism of the optical communication chip is adopted, the probe is in contact with the chip to be tested by adjusting the XYZ directional sliding table, the probe applies downward pressure to the chip and simultaneously receives upward reaction force from the chip to drive the supporting plate to rotate, the movable point contact probe arranged on the supporting plate moves downward, the initial state of contact with the fixed point contact probe is changed into a state of separation from the fixed point contact probe, the probe applies proper pressure to the chip, at the moment, a control system for testing the chip executes power-on operation to enable the probe to be electrically conducted with the chip and test various parameters of the chip, after the test is finished, the supporting plate reversely rotates under the action of the second elastic element to restore to the initial horizontal position, and meanwhile, the movable point contact probe is in contact with the fixed point contact probe;

in the process of testing a large number of chips for a long time and reciprocating rotation of the supporting plate, the first pin shaft arranged on the supporting plate is attached to the four bearings which are arranged on the body and arranged at two sides and two ends of the first pin shaft through the first elastic piece, so that the first pin shaft can be accurately limited while the supporting plate can smoothly rotate by taking the first pin shaft as a fulcrum, and the supporting plate can only rotate without deviating in other directions; therefore, on the basis of realizing the accurate movement of the support provided with the probe in the XYZ direction, the fatigue problem in the prior art that the front-end probe structure is supported by adopting a spring piece supporting structure is eliminated, the accurate setting of the position parameters in the horizontal and vertical directions is facilitated, and the stability of the initial pressure set value can be still kept after long-term and high-frequency use, so that the stability, the repeatability, the comparability and the consistency of detection data are improved, the defect that the probe has micro-jitter in the vertical direction when the probe is separated from the chip is overcome, the time between adjacent detections is facilitated to be shortened, the detection efficiency is improved, and the unnecessary damage to the chip is avoided;

furthermore, the micro rotation offset of the probe in the horizontal direction is eliminated, the accuracy of the detection data is ensured, and the stability, repeatability, comparability and consistency of the detection data are further improved.

The testing mechanism of the optical communication chip can be expanded to other industries for testing semiconductor chips, is not limited to the optical communication industry, can be synchronously expanded and used in all industries needing the testing mechanism of the optical communication chip, and has wide application range.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A test mechanism for an optical communication chip, comprising: the support comprises a base plate (21), a support body (1) and a support plate (2), wherein the support body (1) is installed on the base plate (21) through an adapter plate (22), the support plate (2) is connected below the support body (1), one end of the support body (1) is provided with an installation part (101) which extends upwards, the installation part (101) is installed on a movable part of a Z-direction sliding table (24), a main body part of the Z-direction sliding table (24) is installed on the adapter plate (22), a main body part of an X-direction sliding table (25) is installed on the base plate (21), a Y-direction sliding table (26) is installed on a movable part of the X-direction sliding table (25), the main body part of the Y-direction sliding table is connected with the movable part of the X-direction sliding table (25), and the movable part of the Y-direction sliding table (26) is connected with the adapter plate (22);

one end of the supporting plate (2) is provided with a cantilever (4), the other end of the supporting plate is provided with a moving point contact probe (31), one side of the lower end surface of the bracket body (1) is provided with a fixed point contact probe (32) which is positioned at the upper part of the moving point contact probe (31) and corresponds to the moving point contact probe, and a probe (51) which is used for contacting with a chip to be tested is arranged at one end of the cantilever (4) far away from the supporting plate (2) through a probe seat (5);

a switching seat (6) is arranged on the upper surface of the middle part of the supporting plate (2), the front side and the rear side of the switching seat (6) are respectively provided with a front baffle (61) and a rear baffle (62), the front baffle (61) and the rear baffle (62) are respectively provided with a first through hole (7) and 2 guide grooves (8) positioned at two sides of the first through hole (7), and two ends of a first pin shaft (9) are respectively positioned in the respective first through holes (7) of the front baffle (61) and the rear baffle (62);

a second pin shaft (11) and a third pin shaft (12) are arranged on a lower convex block (10) positioned on the other side of the lower end face of the support body (1) in parallel, the second pin shaft (11) and the third pin shaft (12) are positioned above the first pin shaft (9) and positioned on two sides of the first pin shaft, two ends of the second pin shaft (11) and two ends of the third pin shaft (12) respectively extend out from the front side and the rear side of the lower convex block (10), a first bearing (13) and a second bearing (14) are respectively sleeved at two ends of the second pin shaft (11) and positioned on the front side and the rear side of the lower convex block (10), and a third bearing (15) and a fourth bearing (16) are respectively sleeved at two ends of the third pin shaft (12) and positioned on the front side and the rear side of the lower convex block (10);

the first bearing (13), the third bearing (15), the second bearing (14) and the fourth bearing (16) are respectively positioned between the lower lug (10) and the front baffle (61) and the rear baffle (62), one end of a first elastic part (18) positioned in a vertical through hole (17) of the lower lug (10) is connected with the middle area of the first pin shaft (9) positioned between the front baffle (61) and the rear baffle (62), the other end of the first elastic part is connected with a fourth pin shaft (19) positioned in the bracket body (1) and positioned above the second pin shaft (11) and the third pin shaft (12), and the first elastic part (18) is in a stretching state, so that respective moving rings of the first bearing (13), the second bearing (14), the third bearing (15) and the fourth bearing (16) are in pressing contact with the side surface of the first pin shaft (9);

the centroid moment of the supporting plate (2) part, the cantilever (4), the probe seat (5) and the probe (51) on the right side of the first pin shaft (9) is larger than the centroid moment of the rest part and the moving point contact probe (31) of the supporting plate (2) on the left side of the first pin shaft (9).

2. The optical communication chip test mechanism of claim 1, wherein: the probe seat (5) comprises a base (52) and a clamping piece (53), the probe (51) is positioned between the base (52) and the clamping piece (53), and the clamping piece (53) is connected to the base (52) through an adjusting nut (54).

3. The optical communication chip test mechanism of claim 2, wherein: at least one of the surfaces of the base (52) and the clamping piece (53) which are contacted with the probe (51) is provided with a V-shaped groove (55) for the probe (51) to be embedded.

4. The optical communication chip test mechanism of claim 1, wherein: z is to the slip table, Y is to slip table and X to the slip table all to finely tune the slip table.

5. The optical communication chip test mechanism of claim 1, wherein: the adapter plate (22) comprises a horizontal connecting portion (221) and a vertical connecting portion (222), the main body portion of the Z-direction sliding table is mounted on the vertical connecting portion (222) of the adapter plate (22), and the movable portion of the Y-direction sliding table is connected with the horizontal connecting portion (221) of the adapter plate (22).

6. The optical communication chip test mechanism of claim 1, wherein: the end faces of the supporting plate (2) and the cantilever (4) are provided with wiring grooves (23) for placing cables.