CN116008780A - Folding and testing integrated device - Google Patents
Folding and testing integrated device Download PDFInfo
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- CN116008780A CN116008780A CN202310025070.1A CN202310025070A CN116008780A CN 116008780 A CN116008780 A CN 116008780A CN 202310025070 A CN202310025070 A CN 202310025070A CN 116008780 A CN116008780 A CN 116008780A
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Abstract
The application provides a roll over and survey integrative device belongs to test fixture technical field. The folding and testing integrated device comprises: the upper test assembly comprises an upper die substrate, an upper needle module and a bottom surface bending cutter, the lower test assembly comprises a lower die substrate, a product carrier plate, a lower needle module and a top surface bending cutter, and the upper die substrate is used for pressing down to mold the lower die substrate; in the process of closing the upper die substrate and the lower die substrate, the upper needle module is electrically communicated with the top surface golden finger and the external electrical testing equipment, the lower needle module is electrically communicated with the bottom surface golden finger and the external electrical testing equipment, the bottom surface bending cutter forms a bending line on the bottom surface of the flexible board product, and the top surface bending cutter forms a bending line on the top surface of the flexible board product. The folding and testing integrated device can simultaneously carry out folding line formation and electrical test on the flexible board product, manual operation is not needed in the folding and testing process, and the time consumption is short.
Description
Technical Field
The application relates to the technical field of test jigs, in particular to a folding and testing integrated device.
Background
The flexible circuit board is called a flexible board for short, and the flexible board product is required to be bent in the production process to form a folding line and is electrically tested. In the related art, fold line formation and electrical test of the flexible board product are respectively carried out on different equipment, and after the fold line is formed, a tester is required to take out the flexible board product from the bending equipment and then connect with the electrical test equipment to carry out the electrical test. This process relies on manual operations and is time consuming.
Disclosure of Invention
The main aim at of this embodiment provides a roll over and survey integrative device to through setting up needle module and lower needle module to make the golden finger of compliance board product put through with outside electrical test equipment at the in-process that the compound die formed the broken line, thereby can carry out broken line formation and electrical test to compliance board product simultaneously, roll over the survey process and need not manual operation, the consuming time is shorter.
To achieve the above-mentioned purpose, the embodiment of the application provides a roll over and survey integrative device, roll over and survey integrative device and be used for testing the compliance board product, the top surface of compliance board product is equipped with top surface golden finger, the bottom surface of compliance board product is equipped with bottom surface golden finger, roll over and survey integrative device includes:
the upper test assembly comprises an upper die substrate, an upper needle module and a bottom bending cutter, wherein the upper needle module and the bottom bending cutter are both fixed on the bottom surface of the upper die substrate,
the lower test assembly comprises a lower die substrate, a product carrier plate, a lower needle module and a top surface bending cutter, wherein the product carrier plate, the lower needle module and the top surface bending cutter are all fixed on the top surface of the lower die substrate, and the upper die substrate is used for pressing down to clamp the lower die substrate;
in the process of clamping the upper die substrate and the lower die substrate, the upper needle module is electrically communicated with the top golden finger and external electrical testing equipment, the lower needle module is electrically communicated with the bottom golden finger and external electrical testing equipment, the bottom bending cutter forms a bending line on the bottom surface of the flexible board product, and the top bending cutter forms a bending line on the top surface of the flexible board product.
In some embodiments, the upper test assembly further comprises a mold clamping guide post, the lower test assembly further comprises a mold clamping guide sleeve, the lower mold base plate is provided with a guide sleeve hole, the mold clamping guide sleeve is fixed in the guide sleeve hole, one end of the mold clamping guide post is in sliding connection with the mold clamping guide sleeve, and the other end of the mold clamping guide post is fixedly connected with the upper mold base plate.
In some embodiments, the upper test assembly further includes an alignment post, the product carrier plate is provided with an alignment hole, one end of the alignment post is fixedly connected with the upper die substrate, and the other end of the alignment post is clamped with the alignment hole.
In some embodiments, the upper test assembly further comprises an upper die pressing plate, a fixing spring and a fold line pressing bar, one end of the fixing spring is fixed on the bottom surface of the upper die substrate, the other end of the fixing spring is connected with the top surface of the upper die pressing plate, the fold line pressing bar is fixed on the bottom surface of the upper die pressing plate, and the fold line pressing bar is used for buffering the top surface bending cutter.
In some embodiments, the upper test assembly further comprises a cutter backing plate and a pin die block, the top surface of the cutter backing plate is connected with the bottom surface of the upper die substrate through a screw, the bottom surface of the cutter backing plate is fixedly connected with the bottom surface bending cutter, the pin die block is connected with the bottom surface of the upper die substrate, and the pin die block is used for pressing the flexible plate product so that the bottom surface golden finger is in electrical communication with the lower pin die set.
In some embodiments, the lower test assembly further comprises a fold line filler strip secured to the top surface of the product carrier plate, the fold line filler strip for cushioning the bottom surface bending cutter.
In some embodiments, the lower test assembly further comprises a product pad secured to the top surface of the product carrier plate, the product pad being of PAI plastic.
In some embodiments, a bottom surface of the product carrier plate is provided with a cutter mounting groove, and the top surface bends a cutter to be accommodated in the cutter mounting groove.
In some embodiments, the lower test assembly further comprises a movable guide post and a movable bushing, the lower die base plate is provided with a bushing hole, the movable bushing is fixed in the bushing hole, one end of the movable guide post is fixedly connected with the bottom surface of the product carrier plate, and the cylinder of the movable guide post is in sliding connection with the movable bushing.
In some embodiments, the upper needle module and the lower needle module are both elastic probe modules, the elastic probe modules comprise probe blocks and communication joints, the probe blocks are provided with elastic metal probes, and the communication joints are used for connecting external electrical test equipment.
According to the folding and testing integrated device, the upper needle module and the lower needle module are arranged, so that the golden finger of the flexible board product is communicated with external electrical testing equipment in the folding line forming process, folding line formation and electrical testing can be carried out on the flexible board product at the same time, manual operation is not needed in the folding and testing process, and time consumption is short.
Drawings
Fig. 1 is an overall schematic diagram of a folding and testing integrated device provided in an embodiment of the present application;
FIG. 2 is an exploded view of one embodiment of a test assembly of the present application;
FIG. 3 is an exploded view of one embodiment of a test assembly under the present application;
FIG. 4 is a schematic view of one embodiment of the product carrier plate of FIG. 3;
FIG. 5 is a schematic diagram of one embodiment of a flexible probe module of the present application.
Reference numerals:
the upper test assembly 100, the lower test assembly 200, the upper mold base plate 110, the upper needle module 120, the bottom bending cutter 130, the lower mold base plate 210, the product carrier plate 220, the lower needle module 230, the top bending cutter 240, the mold clamping guide post 140, the mold clamping guide sleeve 250, the guide sleeve hole 211, the alignment post 150, the alignment hole 221, the upper mold pressing plate 160, the fixed spring 161, the fold line pressing strip 162, the cutter backing plate 170, the needle pressing block 180, the fold line backing strip 260, the product backing plate 270, the cutter mounting groove 222, the movable guide post 280, the movable bushing 290, the bushing hole 212, the probe block 300, the communication joint 400, and the elastic metal probe 310.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It should be noted that although the functional block division is performed in the schematic diagram of the apparatus, in some cases, the block division may be different from that in the apparatus. The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the present application.
The flexible board product is required to be bent in the production process to form a folding line, and the flexible board product is electrically tested. In the related art, fold line formation and electrical test of the flexible board product are respectively carried out on different equipment, and after the fold line is formed, a tester is required to take out the flexible board product from the bending equipment and then connect with the electrical test equipment to carry out the electrical test. This process relies on manual operations and is time consuming.
Based on this, the application provides a folding and testing integrated device, which aims to simplify the testing process and shorten the testing time.
Referring to fig. 1, 2 and 3, an integrated folding and testing device in an embodiment of the present application is used for testing a flexible board product, a top surface of the flexible board product is provided with a top surface golden finger, a bottom surface of the flexible board product is provided with a bottom surface golden finger, and the integrated folding and testing device includes:
an upper test assembly 100, the upper test assembly 100 comprises an upper die base plate 110, an upper needle module 120 and a bottom bending cutter 130, the upper needle module 120 and the bottom bending cutter 130 are fixed on the bottom surface of the upper die base plate 110,
the lower test assembly 200, the lower test assembly 200 includes a lower mold substrate 210, a product carrier 220, a lower needle module 230 and a top bending tool 240, the product carrier 220, the lower needle module 230 and the top bending tool 240 are all fixed on the top surface of the lower mold substrate 210, and the upper mold substrate 110 is used for pressing down to mold the lower mold substrate 210;
in the process of clamping the upper die substrate 110 and the lower die substrate 210, the upper pin module 120 is electrically connected to the top golden finger and the external electrical testing device, the lower pin module 230 is electrically connected to the bottom golden finger and the external electrical testing device, the bottom bending tool 130 forms a bending line on the bottom surface of the flexible board product, and the top bending tool 240 forms a bending line on the top surface of the flexible board product.
In the embodiment of the application, the top golden finger and the bottom golden finger are respectively arranged at two ends of the soft board product. When the upper die substrate 110 and the lower die substrate 210 are clamped, the upper pin module 120 is pressed down and is in electrical contact with the golden finger on the top surface of the flexible board product, and the golden finger on the bottom surface of the flexible board product is in electrical contact with the lower pin module 230 under the pressing of the upper test assembly 100. The upper pin module 120 and the lower pin module 230 are connected with the external electrical testing equipment, so that the flexible board product is also connected with the external electrical testing equipment at this time, and thus electrical testing can be performed. The bottom bending tool 130 and the top bending tool 240 are used to bend the flexible sheet product during the process of clamping the upper and lower mold substrates 110 and 210.
In some embodiments, referring to fig. 2 and 3, the upper test assembly 100 further includes a mold clamping guide post 140, the lower test assembly 200 further includes a mold clamping guide sleeve 250, the lower mold base plate 210 is provided with a guide sleeve hole 211, the mold clamping guide sleeve 250 is fixed in the guide sleeve hole 211, one end of the mold clamping guide post 140 is slidably connected to the mold clamping guide sleeve 250, and the other end of the mold clamping guide post 140 is fixedly connected to the upper mold base plate 110. The number of the mold clamping guide posts 140 and the number of the mold clamping guide sleeves 250 are two, and the mold clamping guide posts 140 are used for roughly aligning the upper mold base plate 110 and the lower mold base plate 210 in the mold clamping process.
In some embodiments, referring to fig. 2 and 3, the upper test assembly 100 further includes an alignment post 150, the product carrier 220 is provided with an alignment hole 221, one end of the alignment post 150 is fixedly connected to the upper die substrate 110, and the other end of the alignment post 150 is clamped to the alignment hole 221. The alignment posts 150 are used for fine alignment of the upper die substrate 110 and the lower die substrate 210 to ensure that the test is performed smoothly. In this embodiment, the number of alignment posts 150 is three. In other embodiments, the number of alignment posts 150 is not particularly limited.
In some embodiments, referring to fig. 2 and 3, the upper test assembly 100 further includes an upper molding plate 160, a fixing spring 161, and a fold line bead 162, wherein one end of the fixing spring 161 is fixed to the bottom surface of the upper mold substrate 110, the other end of the fixing spring 161 is connected to the top surface of the upper molding plate 160, the fold line bead 162 is fixed to the bottom surface of the upper molding plate 160, and the fold line bead 162 is used for buffering the top surface bending tool 240. The number of the fixing springs 161 is set according to the need. The fold line layering 162 is made of elastic materials such as silica gel and is used as a cushion of the top surface bending cutter 240, so that fold line forming is facilitated.
In some embodiments, referring to fig. 2, the upper test assembly 100 further includes a cutter pad 170 and a pin molding block 180, wherein the top surface of the cutter pad 170 is connected to the bottom surface of the upper die substrate 110 by screws, the bottom surface of the cutter pad 170 is fixedly connected to the bottom surface bending cutter 130, the pin molding block 180 is connected to the bottom surface of the upper die substrate 110, and the pin molding block 180 is used for pressing the flexible plate product to electrically communicate the bottom golden finger with the lower pin module 230. The cutter backing plate 170 is connected with the upper die base plate 110 through a height-adjustable screw, so that the height of the bottom bending cutter 130 can be adjusted conveniently, the production requirements of soft board products on different deep and shallow folding lines are met, and the debugging is convenient. Springs may be provided between the pin molding blocks 180 and the upper mold base plate 110 to ensure that the pin molding blocks 180 can adaptively press the flexible plate product in place after adjusting the height of the bottom bending cutter 130.
In some embodiments, referring to fig. 3, the lower test assembly 200 further includes a folding line spacer 260, the folding line spacer 260 is fixed on the top surface of the product carrier 220, and the folding line spacer 260 is used for buffering the bottom surface bending tool 130. Similar to the fold line batten 162, the fold line filler strip 260 is made of elastic materials such as silica gel and is used as a cushion of the bottom surface bending cutter 130, so that fold line forming is facilitated.
In some embodiments, referring to fig. 3, the lower test assembly 200 further includes a product pad 270, wherein the product pad 270 is fixed on the top surface of the product carrier 220, and the product pad 270 is made of PAI plastic. The product pad 270 is made of PAI plastic, and can process high-precision pin holes, so that the pin-down module 230 is electrically connected with the golden finger on the bottom surface.
In some embodiments, referring to fig. 3 and 4, a bottom surface of the product carrier 220 is provided with a cutter mounting groove 222, and a top bending cutter 240 is accommodated in the cutter mounting groove 222.
In some embodiments, referring to fig. 3 and 4, the lower test assembly 200 further includes a movable guide post 280 and a movable bushing 290, the lower mold base plate 210 is provided with a bushing hole 212, the movable bushing 290 is fixed in the bushing hole 212, one end of the movable guide post 280 is fixedly connected with the bottom surface of the product carrier 220, and the column body of the movable guide post 280 is slidably connected with the movable bushing 290. In the embodiment of the present application, the number of movable guide posts 280 and movable bushings 290 is four. The movable guide sleeve is provided with an internal spring, so that the product carrier 220 maintains a sprung state in a non-testing state, in which the top bending cutter 240 is completely accommodated in the cutter mounting groove 222. During the mold closing process, the product carrier 220 is pressed downward by the pushing of the upper mold plate 160, so that the blade of the top bending tool 240 is exposed out of the tool mounting groove 222 to contact with the flexible plate product, thereby bending the flexible plate product.
In some embodiments, referring to fig. 3 and 5, the upper needle module 120 and the lower needle module 230 are elastic probe modules, the elastic probe modules include a probe block 300 and a communication connector 400, the probe block 300 is provided with elastic metal probes 310, and the communication connector 400 is used for connecting with external electrical test equipment. In this embodiment, the upper needle module 120 is elastically mounted on the bottom surface of the upper mold substrate 110 through a spring, a screw, and other components, so that the bottom surface bending tool 130 can be matched for height adjustment, and meanwhile, the self-adaptive contact between the elastic metal probe 310 of the upper needle module 120 and the gold finger on the top surface of the soft board product can be ensured in place in the mold closing process. When the product carrier 220 is in a non-testing state, the elastic metal probes 310 of the lower pin module 230 are under the pin holes of the product pad 270. During the mold closing process, the product carrier 220 is pressed downward under the pushing of the upper mold plate 160, so that the elastic metal probes 310 of the lower pin module 230 are exposed from the pin holes of the product pad 270, and are contacted with the golden fingers on the bottom surface of the soft board product.
The embodiments described in the embodiments of the present application are for more clearly describing the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application, and as those skilled in the art can know that, with the evolution of technology and the appearance of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.
It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be understood that in this application, "at least one" means one or more, and "a plurality" means two or more. "and/or" for describing the association relationship of the association object, the representation may have three relationships, for example, "a and/or B" may represent: only a, only B and both a and B are present, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b or c may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.
The embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application. Furthermore, embodiments of the present application and features of the embodiments may be combined with each other without conflict.
Claims (10)
1. The utility model provides a roll over and survey integrative device, its characterized in that, roll over and survey integrative device and be used for testing the compliance board product, the top surface of compliance board product is equipped with top surface golden finger, the bottom surface of compliance board product is equipped with bottom surface golden finger, roll over and survey integrative device includes:
the upper test assembly comprises an upper die substrate, an upper needle module and a bottom bending cutter, wherein the upper needle module and the bottom bending cutter are both fixed on the bottom surface of the upper die substrate,
the lower test assembly comprises a lower die substrate, a product carrier plate, a lower needle module and a top surface bending cutter, wherein the product carrier plate, the lower needle module and the top surface bending cutter are all fixed on the top surface of the lower die substrate, and the upper die substrate is used for pressing down to clamp the lower die substrate;
in the process of clamping the upper die substrate and the lower die substrate, the upper needle module is electrically communicated with the top golden finger and external electrical testing equipment, the lower needle module is electrically communicated with the bottom golden finger and external electrical testing equipment, the bottom bending cutter forms a bending line on the bottom surface of the flexible board product, and the top bending cutter forms a bending line on the top surface of the flexible board product.
2. The integrated folding and testing device according to claim 1, wherein the upper testing assembly further comprises a clamping guide post, the lower testing assembly further comprises a clamping guide sleeve, the lower die base plate is provided with a guide sleeve hole, the clamping guide sleeve is fixed in the guide sleeve hole, one end of the clamping guide post is in sliding connection with the clamping guide sleeve, and the other end of the clamping guide post is fixedly connected with the upper die base plate.
3. The integrated folding and testing device according to claim 1, wherein the upper testing assembly further comprises an alignment post, the product carrier plate is provided with an alignment hole, one end of the alignment post is fixedly connected with the upper die substrate, and the other end of the alignment post is clamped with the alignment hole.
4. The integrated folding and testing device according to claim 1, wherein the upper testing assembly further comprises an upper die pressing plate, a fixing spring and a folding line pressing strip, one end of the fixing spring is fixed on the bottom surface of the upper die substrate, the other end of the fixing spring is connected with the top surface of the upper die pressing plate, the folding line pressing strip is fixed on the bottom surface of the upper die pressing plate, and the folding line pressing strip is used for buffering the top surface bending cutter.
5. The integrated folding and testing device according to claim 1, wherein the upper testing assembly further comprises a cutter backing plate and a needle molding block, the top surface of the cutter backing plate is connected with the bottom surface of the upper die substrate through a screw, the bottom surface of the cutter backing plate is fixedly connected with the bottom surface bending cutter, the needle molding block is connected with the bottom surface of the upper die substrate, and the needle molding block is used for pressing the soft board product so that the bottom golden finger is in electrical communication with the lower needle module.
6. The integrated folding and testing device of claim 1, wherein the lower testing assembly further comprises a folding line filler strip secured to a top surface of the product carrier, the folding line filler strip for cushioning the bottom surface folding knife.
7. The integrated folding and testing device of claim 1, wherein the lower testing assembly further comprises a product pad, the product pad is fixed to the top surface of the product carrier, and the product pad is made of PAI plastic.
8. The integrated folding and measuring device according to claim 1, wherein a cutter mounting groove is formed in the bottom surface of the product carrier plate, and the top surface bending cutter is accommodated in the cutter mounting groove.
9. The integrated folding and testing device according to any one of claims 1 to 8, wherein the lower testing assembly further comprises a movable guide post and a movable bushing, the lower die base plate is provided with a bushing hole, the movable bushing is fixed in the bushing hole, one end of the movable guide post is fixedly connected with the bottom surface of the product carrier plate, and the column body of the movable guide post is slidably connected with the movable bushing.
10. The integrated fold and test device of any one of claims 1 to 8, wherein the upper and lower needle modules are elastic probe modules, the elastic probe modules comprising a probe block provided with elastic metal probes and a communication connector for connecting an external electrical test apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310025070.1A CN116008780A (en) | 2023-01-09 | 2023-01-09 | Folding and testing integrated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310025070.1A CN116008780A (en) | 2023-01-09 | 2023-01-09 | Folding and testing integrated device |
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| CN116008780A true CN116008780A (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310025070.1A Pending CN116008780A (en) | 2023-01-09 | 2023-01-09 | Folding and testing integrated device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117169623A (en) * | 2023-08-18 | 2023-12-05 | 浙江普可医疗科技有限公司 | Testing device for detecting wearable flexible electrocardiograph monitoring |
-
2023
- 2023-01-09 CN CN202310025070.1A patent/CN116008780A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117169623A (en) * | 2023-08-18 | 2023-12-05 | 浙江普可医疗科技有限公司 | Testing device for detecting wearable flexible electrocardiograph monitoring |
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