CN218087586U - Tin ball conveying mechanism - Google Patents
Tin ball conveying mechanism Download PDFInfo
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- CN218087586U CN218087586U CN202222356856.5U CN202222356856U CN218087586U CN 218087586 U CN218087586 U CN 218087586U CN 202222356856 U CN202222356856 U CN 202222356856U CN 218087586 U CN218087586 U CN 218087586U
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Abstract
The utility model discloses a carry tin ball mechanism sets up in the frame and is used for carrying the tin ball, wherein carry tin ball mechanism to include: the conveying part is movably arranged on the rack; cheng Qiubu, cheng Qiubu is arranged on the conveying part, and a placing cavity for placing solder balls is arranged on the ball containing part; the air blowing part is communicated with the placing cavity. The problem of some suction holes on the sucking disc suck the tin ball and some suction holes do not suck the tin ball in the prior art, thereby leading to the chip unqualified is solved.
Description
Technical Field
The utility model relates to a production field is retrieved to the chip, what especially relate to is a carry tin ball mechanism.
Background
The chip recycling not only can reuse the chip to realize the recycling of resources, but also can save production resources and reduce the consumption of copper, wafers and other substances. The existing tin ball conveying mechanism has the functions of conveying very small tin balls to a tin ball implanting station, sucking the tin balls by negative pressure generated by the tin ball implanting machine, and then implanting tin.
In the chip production process, need once suck the contact position that shifts to the chip behind a lot of tin balls, plant the ball, and the in-process of tin ball is only sucked up through the negative pressure to current equipment, because the tin ball in the box is piled up, the accumulational high difference of tin ball, inhale the ball in-process through the negative pressure like this, it is too far away apart from the tin ball to have some suction holes, and need not inhale the tin ball, lead to sucking the hole on the sucking disc like this and having absorbed the tin ball, and some suction holes do not suck the tin ball, thereby adjust the chip well back through the sucking disc, the tin ball has been implanted on some contacts on making the chip, and some contacts do not implant the tin ball, thereby lead to the chip unqualified.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art not enough, an object of the utility model is to provide a carry tin ball mechanism has solved some suction holes on the sucking disc among the prior art and has absorbed the tin ball and some suction holes do not absorb the tin ball to lead to the unqualified problem of chip.
The technical scheme of the utility model as follows:
a tin ball conveying mechanism is arranged on a rack and used for conveying tin balls, wherein the tin ball conveying mechanism comprises:
the conveying part is movably arranged on the rack;
cheng Qiubu, the Cheng Qiubu is arranged on the conveying part, and a placing cavity for placing solder balls is arranged on the ball containing part;
the air blowing part is communicated with the placing cavity.
Further, the air blowing part includes: the blowing disc is positioned below the ball containing part;
the driving part is connected with the blowing disc and drives the blowing disc to move in a reciprocating mode.
Further, the air blowing tray includes:
the middle plate is provided with a buffer cavity, the side surface of the middle plate is provided with an air guide hole communicated with the buffer cavity, and the air guide hole is used for connecting an external air pipe;
the upper cover plate is fixedly arranged on the upper surface of the middle plate and seals the upper opening of the buffer cavity, and an air outlet hole is formed in the upper cover plate and communicated with the buffer cavity;
the lower supporting plate is fixedly arranged on the lower surface of the middle plate and seals the lower opening of the buffer cavity.
Further, the driving part includes: the ball box driving cylinder is fixedly connected to the rack;
the mounting plate is fixedly arranged on a piston rod of the driving cylinder, and the blowing part is fixedly connected onto the mounting plate.
Further, the ball box driving cylinder is a double-shaft cylinder.
Further, the ball containing part includes: a cartridge mounting plate, and a cartridge body;
the box body is arranged on the box mounting plate, and the periphery of the box mounting plate protrudes out of the outer wall of the box body;
the placing cavity is formed in the box body, the box mounting plate is provided with a ball blowing hole, and the ball blowing hole penetrates through the box mounting plate and is communicated with the placing cavity.
Further, the conveying part comprises a turntable, the Cheng Qiubu is fixedly arranged on the turntable, and the turntable is provided with a clearance hole for avoiding the ball blowing hole;
the driving part is positioned below the turntable.
Further, the aperture of the air outlet is larger than that of the ball blowing hole.
Further, it is provided with two side by side to place the chamber, the cushion chamber corresponds and is provided with two.
Compared with the prior art, the utility model provides a carry tin ball mechanism adopts in this scheme on the conveying part carries Cheng Qiubu the sucking disc station, set up on the flourishing ball portion and place the chamber and place the bobble of treating the absorption, the sucking disc of planting the ball can follow the upper shed of placing the chamber and absorb the bobble, inhale the in-process of ball at the sucking disc, blow to placing the chamber through the portion of blowing, will place the tin ball of intracavity and blow, make accumulational tin ball remove, make the tin ball dispersion like this, the distribution of tin ball in placing the intracavity is more even like this. When the sucking disc carries out the negative pressure absorption to the tin ball that blows, the tin ball of evenly distributed in sucking disc adsorption zone is adsorbed by the suction hole of sucking disc more easily, also makes the suction hole homoenergetic on the sucking disc adsorb the tin ball like this. The problem of some suction holes on the sucking disc suck the tin ball and some suction holes do not suck the tin ball in the prior art, thereby leading to the chip unqualified is solved.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of a solder ball conveying mechanism according to the present invention;
FIG. 2 is a schematic structural view of a ball holding portion and an air blowing portion of an embodiment of a solder ball conveying mechanism according to the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2;
fig. 4 is a sectional view of the ball holding portion and the air blowing portion of the embodiment of the solder ball conveying mechanism of the present invention.
The reference numbers in the figures: 100. a conveying section; 110. a turntable; 120. avoiding a void; 200. cheng Qiubu; 210. a placement chamber; 220. a box mounting plate; 230. a cartridge body; 240. blowing a ball hole; 300. a blowing section; 310. an air blowing tray; 311. an upper cover plate; 312. a middle plate; 313. a lower supporting plate; 314. a buffer chamber; 315. an air vent; 316. an air outlet; 320. a drive section; 321. the ball box driving cylinder; 322. and (7) mounting the plate.
Detailed Description
The utility model provides a carry tin ball mechanism, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and it is right that the following refers to the attached drawing and lifts the example the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, the present invention provides a solder ball conveying mechanism, which is disposed on a frame and used for conveying solder balls, and for facilitating the structural description, the vertical and horizontal directions in the figure are used as references. The solder ball conveying mechanism comprises: a conveying part 100, a ball holding part 200, and an air blowing part 300. The conveying part 100 is movably arranged on the rack, the ball containing part 200 is arranged on the conveying part 100, and a placing cavity 210 for placing a solder ball is arranged on the ball containing part 200; when the ball needs to be planted, the conveying part 100 can convey the ball containing part 200 to the position of the sucker, so that the sucker can conveniently suck the small solder balls in the placing cavity 210 through negative pressure. The air blowing part 300 communicates with the placing chamber 210. The blowing part 300 can be arranged on the conveying part 100, or can be arranged at other positions, the conveying blowing part 300 in the embodiment is arranged on a machine frame, when the conveying part 100 conveys the ball containing part 200 to the position of the sucker, the ball containing part 200 reaches the position of the blowing part 300, and the blowing part 300 is started, so that the blowing part 300 blows towards the placing cavity 210. After the suction cup sucks up the solder ball, the conveying part 100 drives the ball containing part 200 to be away from the position of the suction cup, and the air blowing part 300 is closed, so that the air blowing part 300 stops blowing air to the placing cavity 210.
Adopt in the above-mentioned scheme on the conveyer part 100 will hold ball portion 200 and carry the sucking disc station, set up on the ball portion 200 and place the chamber 210 and place the bobble of treating the absorption, the sucking disc of planting the ball can follow the upper shed who places chamber 210 and absorb the bobble, inhale the in-process of ball at the sucking disc, blow to placing chamber 210 through the portion 300 of blowing, will place the tin ball blowing in the chamber 210, make accumulational tin ball remove, make the tin ball dispersion like this, the distribution of tin ball in placing chamber 210 is more even like this. When the sucking disc carries out the negative pressure absorption to the tin ball that blows, the tin ball of evenly distributed in sucking disc adsorption zone is adsorbed by the suction hole of sucking disc more easily, also makes the suction hole homoenergetic on the sucking disc adsorb the tin ball like this.
As shown in fig. 1 and 4, in the specific structure of this embodiment, the conveying unit 100 includes a rotating disc 110, the rotating disc 110 is rotatably disposed on the rack in a horizontal plane, the ball-containing unit 200 is fixedly disposed on the rotating disc 110 by screws and is located at a non-rotating center of the rotating disc 110, and the ball-containing unit 200 is disposed at a periphery of the rotating disc 110 so that the rotation of the rotating disc 110 can drive the ball-containing unit 200 to achieve a large displacement. The ball holding part 200 is moved close to or away from the suction cup by the rotation of the turntable 110. The air blowing part 300 is positioned below the turntable 110 and is coupled to the bracket.
As shown in fig. 2 and 3, the ball holding part 200 includes: a cartridge mounting plate 220, and a cartridge body 230; the cartridge body 230 is disposed on the cartridge mounting plate 220. The periphery of the cartridge mounting plate 220 protrudes from the outer wall of the cartridge body 230, through holes or threaded holes may be formed in the protruding portion of the cartridge mounting plate 220, and the cartridge mounting plate 220 is fixedly mounted on the turntable 110 by screws. The placing cavity 210 is arranged on the box body 230, the box mounting plate 220 is provided with a plurality of ball blowing holes 240, the aperture of each ball blowing hole 240 is smaller than that of each solder ball, so that the solder balls cannot leak in the placing cavity 210, and the ball blowing holes 240 penetrate through the box mounting plate 220 in the up-down direction and are communicated with the placing cavity 210. In this embodiment, the plurality of ball blowing holes 240 are arranged in a rectangle, the formed rectangle can correspond to the shape of the chip, and the number of the ball blowing holes 240 corresponds to the number of contacts on the chip, so that the ball blowing holes 240 can blow the solder balls with the same amount when blowing air, and the solder balls with the same amount as the contacts of the chip can be sucked by the suction cup. In order to enable the air to enter the ball blowing hole 240, the turntable 110 is provided with a clearance hole 120 for avoiding the ball blowing hole 240. The clearance hole 120 in this embodiment is square, and the opening range of the square clearance hole is larger than the rectangular range in which the plurality of ball blowing holes 240 are arranged.
As shown in fig. 2 and 4, the specific structure of the air blowing unit 300 includes: a blowing plate 310, and a driving part 320. The blowing tray 310 is located below the ball holding portion 200, specifically, the blowing tray 310 is located below the turntable 110, and the driving portion 320 is connected to the blowing tray 310 and drives the blowing tray 310 to reciprocate. The driving part 320 in this embodiment drives the blowing tray 310 to reciprocate in the left-right direction. Through the reciprocating movement of the blowing disc 310, the blowing disc 310 is circularly switched between a state of aligning with the ball blowing hole 240 to supply air and a state of deviating from the interruption air supply state of the ball blowing hole 240, so that the air in the placing cavity 210 is sometimes absent, the solder balls in the placing cavity are blown or dropped, the solder balls are disturbed, the solder balls are prevented from being piled up, and the distribution of the solder balls in the placing cavity 210 is more uniform.
As shown in fig. 1 and 2, the driving unit 320 includes: ball box drive cylinder 321 and mounting panel 322, ball box drive cylinder 321 passes through screw fixed connection and is in on the upper surface of frame, mounting panel 322 is fixed to be set up drive on the cylinder rod of cylinder, the portion of blowing 300 is in through screw fixed connection on the mounting panel 322. The piston rod is arranged along the left-right direction, and the blowing part 300 can rapidly move left and right through the driving of the ball box driving air cylinder 321. The ball box driving cylinder 321 in this embodiment is a double-shaft cylinder. The double-shaft cylinder enables the stress to be more uniform, and thus the air blowing part 300 can be stably propelled. It is easy to think that the driving part 320 may be an electric push rod, a ball screw linear moving mechanism, or the like.
As shown in fig. 1 and 4, the blowing tray 310 in this embodiment specifically includes: a middle plate 312, an upper cover plate 311, and a lower support plate 313. The middle plate 312 is provided with a buffer cavity 314, the buffer cavity 314 penetrates through the middle plate 312, the side surface of the middle plate 312 is provided with an air guide hole 315 communicated with the buffer cavity 314, the air guide hole 315 is used for connecting an external air pipe, the upper cover plate 311 is fixedly arranged on the upper surface of the middle plate 312 and seals the upper opening of the buffer cavity 314, the upper cover plate 311 is provided with an air outlet hole 316, and the air outlet hole 316 is communicated with the buffer cavity 314; the lower supporting plate 313 is fixedly arranged on the lower surface of the middle plate 312, and seals the lower opening of the buffer cavity 314, so that the buffer cavity 314 is blocked by the upper cover plate 311 and the lower supporting plate 313, the blowing disc 310 is divided into the middle plate 312, the upper cover plate 311 and the lower supporting plate 313 can be conveniently processed, and three plate-shaped structures are processed respectively and then spliced. Air supply is carried out through an external air pipe, so that air can enter the buffer cavity 314, the direction of the air is changed into upward blowing from the side entering of the buffer cavity 314, the direct blowing of the air can be avoided, and the impact force of the air has a buffering effect. In order to seal the buffer cavity 314, seal grooves may be respectively formed on the upper and lower surfaces of the middle plate 312, and seal rings are disposed in the seal grooves, so as to avoid gas leakage and save gas resources.
In another embodiment, in order to prevent excessive leakage of the gas between the turntable 110 and the blowing tray 310, a flexible retainer ring (not shown) is disposed on the upper surface of the blowing tray 310, and surrounds the gas outlet hole 316, and the upper end of the flexible retainer ring abuts against the lower surface of the turntable 110. The gas can be blocked to a certain extent through the flexible retainer ring, so that the gas can enter the placing cavity 210 through the ball blowing hole 240, a large amount of gas is prevented from overflowing out of the placing cavity 210 to cause a large amount of waste, and the flexible retainer ring has certain compressibility and cannot influence the rotation of the turntable 110.
The aperture of the air outlet 316 in this embodiment is larger than the aperture of the ball blowing hole 240. The aperture of the air outlet hole 316 is enlarged, so that the impact force of the air flow rushing out of the air outlet hole 316 can be reduced, and the impact force is not very large when the air flow enters the ball blowing hole 240, and only the force of blowing the solder balls is required.
As shown in fig. 2, in order to improve the ball mounting efficiency, two placing cavities 210 are arranged side by side in the embodiment, and two buffer cavities 314 are correspondingly arranged. The two placing cavities 210 are arranged side by side along the left-right direction, and the two buffer cavities 314 are correspondingly arranged side by side along the left-right direction. Thus, the tin balls of two chip positions can be sucked by the sucking disc at one time, and then the tin balls are planted on the two chips. The production efficiency is improved.
To sum up, the utility model provides a carry tin ball mechanism adopts in this scheme transport portion 100 will hold on ball portion 200 carries the sucking disc station, set up on the ball portion 200 and place chamber 210 and place the bobble of treating the absorption, the sucking disc of planting the ball can follow the upper shed of placing chamber 210 and absorb the bobble, inhale the in-process of ball at the sucking disc, blow to placing chamber 210 through the portion of blowing 300, will place the tin ball in the chamber 210 and blow, make accumulational tin ball remove, make the tin ball dispersion like this, the tin ball is more even placing the distribution in chamber 210 like this. When the sucking disc carries out the negative pressure absorption to the tin ball that blows, the tin ball of evenly distributed in sucking disc adsorption zone is adsorbed by the suction hole of sucking disc more easily, also makes the suction hole homoenergetic on the sucking disc adsorb the tin ball like this. The problem of some suction holes on the sucking disc suck the tin ball and some suction holes do not suck the tin ball in the prior art, thereby leading to the chip unqualified is solved.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (9)
1. A tin ball conveying mechanism is arranged on a rack and used for conveying tin balls, and is characterized by comprising:
the conveying part is movably arranged on the rack;
cheng Qiubu, cheng Qiubu is arranged on the conveying part, and a placing cavity for placing solder balls is arranged on the ball containing part;
the air blowing part is communicated with the placing cavity.
2. The mechanism of claim 1, wherein the blowing unit comprises: the blowing disc is positioned below the ball containing part;
the driving part is connected with the blowing disc and drives the blowing disc to move in a reciprocating mode.
3. The mechanism of claim 2, wherein the blowing plate comprises:
the middle plate is provided with a buffer cavity, the side surface of the middle plate is provided with an air guide hole communicated with the buffer cavity, and the air guide hole is used for connecting an external air pipe;
the upper cover plate is fixedly arranged on the upper surface of the middle plate and seals the upper opening of the buffer cavity, and an air outlet hole is formed in the upper cover plate and communicated with the buffer cavity;
the lower supporting plate is fixedly arranged on the lower surface of the middle plate and seals the lower opening of the buffer cavity.
4. The mechanism of claim 2, wherein the driving unit comprises: the ball box driving cylinder is fixedly connected to the rack;
the mounting plate is fixedly arranged on a piston rod of the driving cylinder, and the blowing part is fixedly connected onto the mounting plate.
5. The mechanism of claim 4, wherein the ball box driving cylinder is a two-axis cylinder.
6. The solder ball conveying mechanism of claim 3, wherein the ball holding portion comprises: a cartridge mounting plate, and a cartridge body;
the box body is arranged on the box mounting plate, and the periphery of the box mounting plate protrudes out of the outer wall of the box body;
the placing cavity is formed in the box body, the box mounting plate is provided with a ball blowing hole, and the ball blowing hole penetrates through the box mounting plate and is communicated with the placing cavity.
7. The solder ball conveying mechanism of claim 6, wherein the conveying unit comprises a turntable, the Cheng Qiubu is fixedly disposed on the turntable, and the turntable is formed with clearance holes for avoiding the ball blowing holes;
the driving part is positioned below the turntable.
8. The mechanism of claim 6, wherein the diameter of the air vent is larger than the diameter of the ball blowing hole.
9. The solder ball conveying mechanism of claim 6, wherein two placing cavities are arranged side by side, and two buffer cavities are correspondingly arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222356856.5U CN218087586U (en) | 2022-09-05 | 2022-09-05 | Tin ball conveying mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222356856.5U CN218087586U (en) | 2022-09-05 | 2022-09-05 | Tin ball conveying mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218087586U true CN218087586U (en) | 2022-12-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222356856.5U Active CN218087586U (en) | 2022-09-05 | 2022-09-05 | Tin ball conveying mechanism |
Country Status (1)
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|---|---|
| CN (1) | CN218087586U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116682774A (en) * | 2023-07-27 | 2023-09-01 | 深圳市立可自动化设备有限公司 | Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards |
-
2022
- 2022-09-05 CN CN202222356856.5U patent/CN218087586U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116682774A (en) * | 2023-07-27 | 2023-09-01 | 深圳市立可自动化设备有限公司 | Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards |
| CN116682774B (en) * | 2023-07-27 | 2023-12-22 | 深圳市立可自动化设备有限公司 | Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards |
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