CN115274513A - Automatic ball mounting equipment and automatic ball mounting method - Google Patents

Automatic ball mounting equipment and automatic ball mounting method Download PDF

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Publication number
CN115274513A
CN115274513A CN202211081869.4A CN202211081869A CN115274513A CN 115274513 A CN115274513 A CN 115274513A CN 202211081869 A CN202211081869 A CN 202211081869A CN 115274513 A CN115274513 A CN 115274513A
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CN
China
Prior art keywords
ball
chip
glue scraping
planting
plate
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Pending
Application number
CN202211081869.4A
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Chinese (zh)
Inventor
江宏
罗维剑
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Wansheng Semiconductor Technology Shenzhen Co ltd
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Wansheng Semiconductor Technology Shenzhen Co ltd
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Application filed by Wansheng Semiconductor Technology Shenzhen Co ltd filed Critical Wansheng Semiconductor Technology Shenzhen Co ltd
Priority to CN202211081869.4A priority Critical patent/CN115274513A/en
Publication of CN115274513A publication Critical patent/CN115274513A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Abstract

The invention discloses automatic ball planting equipment and an automatic ball planting method, and the automatic ball planting equipment comprises a rack and a station rotating mechanism, wherein the station rotating mechanism comprises a turntable which is rotatably arranged on the rack, a carrier which is arranged on the turntable and used for loading a chip, and Cheng Qiubu which is arranged on the turntable and used for placing a solder ball; the chip glue scraping mechanism is arranged on the rack and positioned on one side of the rotary table, the chip glue scraping mechanism comprises a glue scraping component positioned above the rotary table, and the glue scraping component reciprocates along the radial direction of the rotary table to coat solder paste on the chip; the ball planting mechanism is arranged on the rack and positioned on one side of the turntable, and comprises a sucker for sucking and releasing solder balls; the solder balls in the ball containing part and the chips coated with the paste by the glue scraping component are positioned below the sucking disc instead through the rotation of the rotary disc. The problems that the production efficiency of the chip is low, manpower is wasted, and the quality consistency of the chip is difficult to guarantee in the manual operation process are solved.

Description

Automatic ball mounting equipment and automatic ball mounting method
Technical Field
The invention relates to the field of chip recovery production, in particular to automatic ball mounting equipment and an automatic ball mounting method.
Background
The chip recovery can not only reuse the chip to realize the recycling of resources, but also save production resources and reduce the consumption of materials such as copper, wafers and the like. In the existing chip recycling production process, solder paste needs to be scraped on a contact of a chip, and then the chip with the scraped solder paste needs to be subjected to ball planting.
And each current process is accomplished through the manual work, and after artifical frictioning was accomplished, take off the chip, place again and plant under the ball station, accomplish the ball process of planting. Therefore, the production efficiency of the chip is low, manpower is wasted, and the quality consistency of the chip is difficult to guarantee in the manual operation process.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide an automatic ball mounting device and an automatic ball mounting method, which solve the problems that in the prior art, the production efficiency of chips is low, manpower is wasted, and the quality consistency of the chips is difficult to ensure due to the manual operation process.
The technical scheme of the invention is as follows:
the utility model provides an automatic plant ball equipment, includes the frame, wherein, automatic plant ball equipment still includes:
the station rotating mechanism comprises a turntable which is rotationally arranged on the rack, a carrier which is arranged on the turntable and used for loading a chip, and Cheng Qiubu which is arranged on the turntable and used for placing a solder ball;
the chip glue scraping mechanism is arranged on the rack and positioned on one side of the rotary table, and comprises a glue scraping component positioned above the rotary table, and the glue scraping component reciprocates along the radial direction of the rotary table to coat the solder paste on the chip;
the ball planting mechanism is arranged on the rack and positioned on one side of the turntable, and comprises a sucker for sucking and releasing solder balls;
the solder balls in the Cheng Qiu part and the chip pasted by the frictioning component are positioned below the sucker instead through the rotation of the turntable.
Further, chip is scraped gluey mechanism and is still included:
the glue scraping lifting assembly is fixedly arranged on the rack along the vertical direction;
the glue scraping moving assembly is connected to the glue scraping lifting assembly and driven by the glue scraping lifting assembly to move up and down;
the glue scraping screen plate is connected to the glue scraping lifting assembly and driven by the glue scraping lifting assembly to move up and down;
the glue scraping device comprises a left glue scraping assembly and a right glue scraping assembly, wherein the left glue scraping assembly and the right glue scraping assembly are arranged on the glue scraping moving assembly side by side along the left-right direction;
the chip is located below the glue scraping screen plate, the solder paste is located on the glue scraping screen plate, and the left glue scraping assembly and the right glue scraping assembly are located on the upper surface of the glue scraping screen plate and move in the left-right direction through driving of the glue scraping moving assembly.
Further, the frictioning moving component comprises a movable plate, a frictioning component supporting plate is fixedly arranged on the movable plate, the frictioning component supporting plate extends along the left and right direction;
left frictioning subassembly includes:
the left glue scraping cylinder is fixedly arranged on the glue scraping assembly supporting plate along the vertical direction;
the left scraper mounting block is fixedly arranged on a piston shaft of the left frictioning cylinder and extends along the front-back direction;
the left scraper is arranged on the left scraper mounting block along the front-back direction, and the knife edge of the left scraper faces to the upper surface of the glue scraping screen plate.
The right frictioning subassembly includes:
the right frictioning cylinder is fixedly arranged on the frictioning assembly supporting plate along the vertical direction, and the right frictioning cylinder and the left frictioning cylinder are arranged side by side;
the right scraper mounting block is fixedly arranged on a piston shaft of the right scraping glue cylinder and extends along the front-back direction;
the right scraper is arranged on the right scraper mounting block along the front-back direction, and the edge of the right scraper faces the upper surface of the glue scraping screen plate;
the left scraper and the right scraper are arranged side by side along the left-right direction.
Further, the ball mounting mechanism includes: the ball planting lifting assembly is fixedly arranged on the rack along the vertical direction;
the sucker mounting assembly is connected to the ball planting lifting assembly and driven by the ball planting lifting assembly to move up and down, and the sucker is arranged on the sucker mounting assembly; and
and the knocking component is connected to the ball planting lifting component and is used for knocking the sucker.
Furthermore, the ball planting mechanism also comprises a ball planting base, and the ball planting base is fixedly arranged on the rack;
plant ball lifting unit includes:
the ball planting lifting cylinder is connected to the ball planting base along the vertical direction;
the ball planting template is arranged on a piston rod of the ball planting lifting cylinder along the horizontal direction;
the upper and lower ball-planting guide parts are arranged on the ball-planting base along the vertical direction, and the ball-planting template is connected with the upper and lower ball-planting guide parts in a sliding manner.
Further, the suction cup mounting assembly includes:
the left mounting part and the right mounting part are arranged on the left side and the right side of the ball-planting template in a mirror image manner;
the two sides of the clamping part are respectively connected to the left mounting part and the right mounting part;
the clamping portion is provided with a clamping groove, and the sucker is clamped and embedded in the clamping groove.
Further, the left mounting portion includes: the left guide rail mounting plate extends along the front-back direction;
the left pulling plate is arranged on the left guide rail mounting plate and extends towards the right mounting part;
the left guide rail is fixedly arranged on the left guide rail mounting plate along the vertical direction, and a left sliding table is connected onto the left guide rail in a sliding manner;
the left clamping groove connecting plate is fixedly connected to the left sliding table, and the clamping portion is connected to the left clamping groove connecting plate;
and the screw head of the limit screw is positioned above the left pulling plate, and the screw rod of the limit screw penetrates through the left pulling plate and is fixedly connected to the left clamping groove connecting plate.
Further, the ball planting connecting plate is connected to the ball planting template along the up-down direction;
the rapping assembly comprises: the knocking rod is positioned above the sucking disc, and the knocking rod moving up and down knocks the sucking disc;
the knocking air cylinder is arranged on the ball planting connecting plate along the vertical direction;
the knocking plate is connected to a piston rod of the knocking cylinder, the knocking plate extends along one side facing the sucker, the knocking rod is fixedly arranged on the knocking plate along the vertical direction, and the lower end of the knocking rod faces the sucker;
the knocking auxiliary plate is arranged in parallel below the knocking plate and fixedly connected to the cylinder body of the knocking cylinder, and the knocking rod penetrates through and slides to be arranged on the knocking auxiliary plate.
Furthermore, a plurality of ball containing parts and a plurality of carriers are arranged on the turntable, and the ball containing parts and the carriers are alternately arranged at intervals;
the ball containing part is provided with a placing cavity for placing a solder ball;
station rotary mechanism still includes: the blowing part is arranged on the rack, and when the Cheng Qiubu rotates to the position below the sucking disc, the blowing part is communicated with the placing cavity.
Based on the same concept, the scheme further comprises an automatic ball planting method, wherein the automatic ball planting method is used for the automatic ball planting equipment, and comprises the following steps:
step A, starting a station rotating mechanism, rotating the turntable, rotating the carrier for loading the chip to the position below the glue scraping assembly, and simultaneously rotating Cheng Qiubu for loading the solder balls to the position below the sucker;
b, starting a chip glue scraping mechanism, coating solder paste on the chip on the carrier by the glue scraping component, starting a ball planting mechanism at the same time, and sucking the solder balls in the ball containing part by the sucking disc;
rotating the turntable to enable the chip coated with the solder paste to be positioned below the sucking disc, and simultaneously enabling the other ball containing part to be positioned below the glue scraping assembly;
d, starting a ball mounting mechanism, wherein the sucking disc places the solder balls on the chip coated with the solder paste below the chip, and the chip glue scraping mechanism is not started at the same time;
e, rotating the turntable to enable another carrier loaded with chips to rotate to the position below the glue scraping assembly, simultaneously rotating another Cheng Qiubu loaded with solder balls to the position below the sucking disc, and moving the chips subjected to ball planting out of the ball planting mechanism;
and F, taking off the chip on which the balls are planted from the carrier, replacing the chip with a new chip on which the balls are not planted, and executing the step B.
Compared with the prior art, the automatic ball planting equipment and the automatic ball planting method provided by the invention have the advantages that the ball containing part and the carrier are driven to rotate to different positions by rotating the turntable on the station rotating mechanism, so that the solder balls and the chips are circularly replaced, and the circulating process of scraping glue, sucking balls, planting balls, scraping glue, sucking balls, planting balls … … can be continuously realized. The specific process is as follows: first the chip-loading carrier is rotated under the squeegee assembly while the solder ball-loading Cheng Qiubu is rotated under the chuck. And then starting the chip glue scraping mechanism, coating solder paste on the chip on the carrier by the glue scraping component, and simultaneously starting the ball planting mechanism, wherein the suction disc sucks the solder balls in the ball containing part. And then the turntable is driven to rotate, so that the chip coated with the solder paste is positioned below the sucking disc, and the other ball containing part is positioned below the glue scraping assembly. And starting the ball planting mechanism, placing the solder balls on the chip coated with the solder paste below by the sucking disc, and simultaneously, not starting the chip glue scraping mechanism. And then the turntable is driven to rotate, so that another carrier loaded with a chip rotates to the position below the glue scraping component, meanwhile, another carrier loaded with a solder ball Cheng Qiubu rotates to the position below the sucking disc, and the chip subjected to ball planting is moved out of the ball planting mechanism at the moment. And finally, taking down the chip with the planted balls on the carrier, replacing the chip with a new chip without the planted balls, simultaneously starting the chip glue scraping mechanism, scraping glue on another chip, and continuing the subsequent steps, so that glue scraping and ball planting can be continuously carried out, the process of automatically planting the balls is realized, the labor cost is saved, and the production efficiency is improved. The problem of among the prior art artifical process of planting the ball lead to planting the ball efficiency slow, extravagant manpower is solved.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of an automatic ball mounting apparatus according to the present invention;
fig. 2 is a schematic partial structural view of a station rotating mechanism according to an embodiment of the automatic ball mounting apparatus of the present invention;
fig. 3 is a schematic structural diagram of a carrier of an embodiment of an automatic ball mounting apparatus according to the invention;
FIG. 4 is a left side view of a station rotating mechanism of an embodiment of an automatic ball mounting apparatus of the present invention;
FIG. 5 is a left side view of a chip glue spreading mechanism of an embodiment of an automatic ball mounting apparatus of the present invention;
FIG. 6 is a schematic structural diagram of a chip glue scraping mechanism according to an embodiment of the automatic ball mounting apparatus of the present invention;
fig. 7 is a schematic structural diagram of another view angle of the chip glue spreading mechanism according to an embodiment of the automatic ball mounting apparatus of the present invention;
FIG. 8 is a schematic view of a part of the structure of an embodiment of an automatic ball mounting apparatus according to the present invention;
fig. 9 is a schematic partial structural view of a station rotating mechanism according to an embodiment of the automatic ball mounting apparatus of the present invention;
FIG. 10 is a schematic structural diagram of a ball holding part and an air blowing part of an embodiment of an automatic ball mounting device of the present invention;
FIG. 11 is an enlarged view of portion A of FIG. 10;
FIG. 12 is a sectional view of the ball holding part and the air blowing part of the automatic ball mounting apparatus according to the embodiment of the present invention;
fig. 13 is a schematic structural view of a ball mounting mechanism of an embodiment of an automatic ball mounting apparatus of the present invention;
fig. 14 is a schematic structural diagram of another view angle of the ball mounting mechanism of the embodiment of the automatic ball mounting device of the invention;
fig. 15 is a schematic structural view of a ball-planting lifting assembly and a suction cup mounting assembly in an embodiment of an automatic ball-planting apparatus of the present invention;
FIG. 16 is a left side view of the ball placement elevating assembly and the suction cup mounting assembly of an embodiment of the automatic ball placement apparatus of the present invention;
fig. 17 is a sectional view of a suction cup of an embodiment of an automatic ball mounting apparatus of the present invention.
The reference numbers in the figures: 1000. a frame; 1100. a station rotating mechanism; 1110. rotary disc (ii) a; 1111. a working platform; 1300. a station drive assembly; 1310. a motor; 1320. a speed reducer; 1330. a coupling; 1340. a main shaft; 1400. a carrier; 1410. a substrate; 1411. a chip placing groove; 1420. a fixing member; 1421. a spring plate; 1430. a spring plate movable groove; 1440. taking out the slot position; 1450. avoiding a void; 1500. an encoder; 1510. a code disc; 1520. an inductor; 2120. avoiding a void; 2200. cheng Qiubu; 2210. a placement chamber; 2220. a box mounting plate; 2230. a cartridge body; 2240. blowing a ball hole; 2300. a blowing section; 2310. an air blowing tray; 2311. an upper cover plate; 2312. a middle plate; 2313. a lower supporting plate; 2314. a buffer chamber; 2315. a gas-guide hole; 2316. an air outlet; 2320. a drive section; 2321. the ball box driving cylinder; 2322. mounting a plate; 3000. a chip glue scraping mechanism; 3100. a frictioning base; 3110. a base plate; 3120. a cylinder mounting plate; 3200. a frictioning lifting assembly; 3210. a frictioning lifting cylinder; 3220. scraping the glue template; 3230. an upper and lower guiding part for scraping glue; 3231. a vertical linear bearing block; 3232. a vertical guide shaft; 3300. a squeegee movement assembly; 3310. a glue scraping moving cylinder; 3320. a fixing plate; 3321. a left fixing plate and a right fixing plate; 3322. front and rear fixing plates; 3330. a movable plate; 3340. a left and right guiding part for scraping glue; 3341. left and right linear bearing blocks; 3342. a left guide shaft and a right guide shaft; 3350. a frictioning assembly support plate; 3400. a left squeegee assembly; 3410. a left glue scraping cylinder; 3420. a left scraper mounting block; 3430. a left scraper; 3500. a right squeegee assembly; 3510. a right frictioning cylinder; 3520. a right scraper mounting block; 3530. a right scraper; 3600. scraping the glue screen plate; 3610. scraping the adhesive connecting plate; 3620. a screen plate mounting plate; 3621. an accommodating cavity; 3700. a fine adjustment component; 3710. a differential headstock; 3720. differentiating the head; 3730. a differential head adjusting block; 4000. a ball planting mechanism; 4100. a ball planting base; 4110. planting a ball bottom plate; 4120. mounting plates of ball planting cylinders; 4200. a ball planting lifting component; 4210. a ball planting lifting cylinder; 4220. planting a ball template; 4230. an upper and lower ball-planting guide part; 4231. a second vertical linear bearing block; 4232. a second vertical guide shaft; 4300. a suction cup mounting assembly; 4310. a left mounting section; 4311. a left guide rail mounting plate; 4312. a left pulling plate; 4313. a left guide rail; 4314. a left sliding table; 4315. a left card slot connecting plate; 4316. a limit screw; 4320. a right mounting portion; 4330. a clamping part; 4331. an upper clamping and connecting plate; 4332. a lower clamping and connecting plate; 4333. a card slot; 4334. a mounting cavity; 4340. planting a ball connecting plate; 4400. a suction cup; 4410. sucking a plate; 4420. a limiting boss; 4430. an air tube; 4440. a ball suction hole; 4450. chamfering; 4500. a knocking component; 4510. knocking the cylinder; 4520. knocking the plate; 4530. knocking the rod; 4540. knocking the auxiliary plate; 4600. a ball planting fine adjustment component; 4610. planting a ball and making a micro head seat; 4620. planting a micro-dividing head; 4630. a ball planting micro head regulating block.
Detailed Description
The invention provides an automatic ball mounting device and an automatic ball mounting method, and in order to make the purpose, technical scheme and effect of the invention clearer and clearer, the invention is further described in detail below by referring to the attached drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, the present invention provides an automatic ball-planting device, which is disposed on a frame 1000, and the frame 1000 is vertically placed on the ground for structural description, and the automatic ball-planting device is vertically disposed on the frame 1000, and the vertical direction and the horizontal direction indicated in fig. 1 are used as reference. The automatic ball mounting equipment further comprises: station rotating mechanism 1100, chip glue spreading mechanism 3000, and ball mounting mechanism 4000. The station rotation mechanism 1100 includes a turntable 1110 rotatably disposed on the rack 1000, a carrier 1400 disposed on the turntable 1110 and used for loading a chip, and a Cheng Qiubu 2200 disposed on the turntable 1110 and used for placing solder balls. Chip scrape gluey mechanism 3000 sets up frame 1000 is last and is located one side of carousel 1110, chip scrape gluey mechanism 3000 including being located the frictioning subassembly of carousel 1110 top, the frictioning subassembly is followed the radial reciprocating motion of carousel 1110 and coats the tin cream on the chip. Plant ball mechanism 4000 and set up in frame 1000 and be located one side of carousel 1110, plant ball mechanism 4000 including sucking disc 4400, sucking disc 4400 is used for the suction to put the tin ball. The solder balls Cheng Qiubu and the chip pasted by the squeegee assembly are alternately positioned under the chuck 4400 by the rotation of the turntable 1110.
In the scheme, the turntable 1110 on the station rotating mechanism 1100 rotates to drive the ball containing part 2200 and the carrier 1400 to rotate to different positions, so that the solder balls and the chips are circularly replaced, and the circulating process of glue scraping, ball sucking, ball planting, glue scraping, ball sucking, ball planting … … can be continuously realized. The specific process is as follows: first, the chip-loading carrier 1400 rotates under the squeegee assembly, and simultaneously the solder ball-loading Cheng Qiubu 2200 rotates under the suction cup 4400. And then, starting a chip glue spreading mechanism 3000, coating solder paste on the chip on the carrier 1400 by using the glue spreading assembly, and simultaneously starting a ball planting mechanism 4000, wherein the sucker 4400 sucks the solder balls in Cheng Qiubu 2200. The turntable 1110 is driven to rotate, so that the chip coated with the solder paste is located below the suction cup 4400, and the other ball holding part 2200 is located below the glue scraping assembly. And then the ball planting mechanism 4000 is started, the sucking disc 4400 places the solder balls on the chip with the solder paste coated below, and the chip glue scraping mechanism 3000 is not started at the same time. Then, the turntable 1110 is driven to rotate, so that another carrier 1400 for loading chips rotates to the lower side of the glue scraping component, and simultaneously another Cheng Qiubu 2200 for loading solder balls rotates to the lower side of the suction cup 4400, and at this time, the chips subjected to ball planting are moved out of the ball planting mechanism 4000. Finally, the chip which is subjected to ball planting on the carrier 1400 is taken down, a new chip which is not subjected to ball planting is replaced, the chip glue scraping mechanism 3000 is started simultaneously, glue scraping is carried out on another chip, and subsequent steps are continued, so that glue scraping and ball planting can be continuously carried out, the process of automatic ball planting is realized, the labor cost is saved, the production efficiency is improved, automatic production is realized, and the consistency of the chips can be ensured. The problems that in the prior art, the production efficiency of the chip is low, manpower is wasted, and the quality consistency of the chip is difficult to guarantee due to the manual operation process are solved.
As shown in fig. 1 and 2, in a specific structure, the station switching mechanism 1100 further includes: turntable 1100, station drive assembly 1300, carrier 1400 and the Cheng Qiubu 2200 are disposed on the turntable 1100. The station driving assembly 1300 is connected to the turntable 1100, and the turntable 1100 is driven to rotate by the station driving assembly 1300. As shown in fig. 3, specifically, the rack includes a working platform 1111, and as shown in fig. 1 and 4, the station driving assembly 1300 is disposed below the working platform 1111 and penetrates through the working platform 1111 in the up-down direction, and one end of the station driving assembly 1300 penetrating through the working platform 1111 protrudes out of the upper surface of the working platform 1111 and is connected to the turntable 1100. The station driving assembly 1300 can be started after being powered on, and the started station driving assembly 1300 drives the turntable 1100 to rotate by different angles. The carrier 1400 and the Cheng Qiubu 2200 are fixedly disposed on a non-rotating shaft center of the turntable 1100, so that the carrier 1400 is rotated by a predetermined angle and then deviates from the original position, thereby realizing the movement of the carrier 1400. The carrier 1400 includes a substrate 1410 and a fixing member 1420, wherein a chip placement groove 1411 is formed on the substrate 1410, the chip is located in the chip placement groove 1411, and the fixing member 1420 is disposed on the substrate 1410 and is used for pressing the chip. The chip is placed in the placing groove, so that the chip is limited and is not easy to be separated from the carrier 1400, and the fixing piece 1420 compresses the chip, so that the chip can be fixed on the carrier 1400, and the chip can be conveniently conveyed.
In the above scheme, the turntable 1100 is provided with the plurality of carriers 1400 and the plurality of ball containing portions 2200, the chips are fixed in the carriers 1400, the solder balls are placed in the ball containing portions, the turntable 1100 is driven to rotate by the station driving assembly 1300, so that the carriers 1400 can rotate at positions, such as 45 degrees, 90 degrees or 180 degrees, the chips in the carriers 1400 and the solder balls in the Cheng Qiubu 2200 reach different positions after rotation, automatic conveying of the chips is realized, therefore, the station switching mechanism enables the chips to be transmitted between different stations, the existing manual transmission is replaced, and the advantages of high transmission efficiency, manpower saving and capability of ensuring positioning consistency of the chips are achieved.
As shown in fig. 2 and fig. 3, in the specific structure of this embodiment, the fixing member 1420 includes a resilient piece 1421, one end of the resilient piece 1421 is fixedly disposed on a sidewall of the chip placement slot 1411, and the other end extends into the chip placement slot 1411. Specifically, the elastic piece 1421 has certain elasticity, one end of the elastic piece 1421 is embedded in a slot formed in a side wall of the chip placement slot 1411, and the other end extends into the chip placement slot 1411 and can move freely. When the chip will be placed in chip standing groove 1411, apply pressure to the one end of the free activity of shell fragment 1421, make shell fragment 1421 move backward towards the direction deformation that deviates from in chip standing groove 1411, the chip is placed in chip standing groove 1411, loosen the one end of the free activity of shell fragment 1421 again, the free expansion end that makes shell fragment 1421 can support and lean on the side of chip, thereby the elasticity through elastic deformation exerts pressure to the chip, make the chip can be close to the inner wall of chip standing groove 1411, thereby make the chip fix in chip standing groove 1411. When the chip is to be taken out, the free end of the elastic sheet 1421 is pressed to loosen the side wall of the chip from the free end of the elastic sheet 1421, so that the chip can be taken out quickly. The elastic sheet 1421 in this embodiment is a square sheet, and the square sheet in this embodiment is a straight sheet, and the elastic sheet 1421 that is a straight line and the inner wall of the chip placement groove 1411 are inclined. In further embodiments: the square plate is connected and is buckled in the one end of chip standing groove 1411 inner wall, forms the kink, inserts in chip standing groove 1411 inner wall through the kink, makes the difficult not hard up of fixing of shell fragment 1421 like this.
The chip is limited by the inner wall of the chip placing groove 1411, the freedom degree of the chip in the front-back direction and the left-right direction can be limited, and in order to enable the elastic sheet 1421 to have enough deformation space, the base plate 1410 is provided with an elastic sheet movable groove 1430, the elastic sheet 1421 is movably arranged in the elastic sheet movable groove 1430 towards one end of the chip, and the elastic sheet movable groove 1430 is communicated with the chip placing groove 1411. The resilient piece 1421 extends into the chip placement groove 1411 toward one end of the chip, so that the chip placed in the chip placement groove 1411 can be pressed against each other.
As shown in fig. 3, in the present embodiment, the bottom of the spring piece moving slot 1430 is recessed from the bottom of the chip placing slot 1411, and the spring piece moving slot 1430 extends into the chip placing slot 1411. Like this form first step portion between the bottom surface of shell fragment activity groove 1430 and the bottom surface of chip standing groove 1411, first step portion is located chip standing groove 1411, and when the chip was placed in chip standing groove 1411, the chip was kept away the sky towards the below of the position of shell fragment activity groove 1430 like this, and the space of keeping away that first step portion formed can make things convenient for the finger to get into, and more makes things convenient for the chip to be taken out chip standing groove 1411.
In this embodiment, a slot 1440 is disposed on an inner wall of the chip placing slot 1411, and a bottom of the slot 1440 is recessed below a bottom of the chip placing slot 1411. The removal slot is deeper than the chip placement slot 1411, and when fingers are inserted into the removal slot 1440, the fingers can grip the entire side of the chip, thereby allowing better access to the chip. The two withdrawing slot positions 1440 are symmetrically arranged, and the two withdrawing slot positions 1440 are symmetrically arranged on the opposite inner walls of the chip placing slot 1411 respectively. The two side walls of the slot 1440 are adjacent to the inner wall of the movable groove 1430. Thus, the slot 1440 and the flexible tab 1430 are disposed on different inner walls of the chip placement groove 1411. The chip is convenient to take and place, and the space of the substrate 1410 is more reasonable. The withdrawing groove 1440 may be formed in a square, circular, or oval shape to communicate with the chip placing groove 1411. The slot 1440 is a semi-oval shape that is through with the chip placement slot 1411, and thus fits the shape of a finger, facilitating the finger to pick and place a chip.
As shown in fig. 3, the chip placement groove 1411 is square, and clearance holes 1450 are formed at four corners of the chip placement groove 1411. When the chip is placed in the chip placement groove 1411, the clearance hole 1450 avoids four corners of the chip, so that four side walls of the chip can be matched with the four inner walls of the chip placement groove 1411. The chip is stably limited. The substrate 1410 is provided with 2 chip placement grooves 1411, so that two chips can be processed at a time, and the processing efficiency of the chips is improved. 2 chip placement grooves 1411 are arranged side by side in a tangential direction parallel to the disk; specifically, a line connecting intersections of diagonal lines of the 2 chip placement grooves 1411 is taken as a center line of the 2 chip placement grooves 1411, and a line connecting a midpoint of the center line and a rotation center of the turntable 1100 is perpendicular to the center line. Thus, when the turntable 1100 rotates 90 degrees or 180 degrees, the chip placing grooves 1411 are aligned, so that the positioning operation of each process device is facilitated, and the automation is facilitated.
As shown in fig. 2 and 4, the station driving assembly 1300 in this embodiment includes: a motor 1310, and a reducer 1320. The motor 1310 is fixedly disposed on the frame, the speed reducer 1320 is connected to the motor 1310, and the turntable 1100 is fixedly disposed on the speed reducer 1320 through a coupling 1330. In a specific structure, the motor 1310 is fixed on the rack by screws and is located below the working platform 1111. The speed reducer 1320 is connected to an output shaft of the motor 1310, the output shaft of the speed reducer 1320 is connected to a main shaft 1340 through a coupling 1330, the other end of the main shaft 1340 is fixedly connected to the turntable 1100, and the main shaft is coaxially connected to the turntable 1100. Rotate after the circular telegram through motor 1310 like this, pivoted motor 1310 decelerates through speed reducer 1320, and speed reducer 1320 drives the main shaft and rotates, and then drives the position that carousel 1100 is rotatory to the difference, can become reasonable rotational speed with the output rotational speed of motor 1310 through speed reducer 1320 to make carousel 1100 can stabilize the rotation, make the chip can stable rotation in carrier 1400 to different stations.
As shown in fig. 4, the station switching mechanism in this embodiment further includes an encoder 1500, and the encoder 1500 is configured to detect a position where the turntable 1100 is rotated, and control the motor 1310 to halt when a predetermined rotation angle is reached. If the dial 1100 is set to rotate 90 ° and then pause for a period of time, this is detected by the encoder 1500 if the dial 1100 is rotated 90 °. The encoder 1500 specifically includes: the rotary table 1100 comprises an encoding disc 1510 and a sensor 1520 matched with the encoding disc 1510, wherein the encoding disc 1510 is coaxially arranged on the rotary table 1100, and the sensor 1520 is arranged on the rack. The encoder 1510 is disposed coaxially with the spindle and is rotatable synchronously with the spindle, and the sensor 1520 is fixed to the frame and is configured to sense the rotation of the encoder 1510.
As shown in fig. 1 and 8, the turntable 1110 is provided with a plurality of the ball holding portions 2200 and a plurality of the carriers 1400, and the ball holding portions 2200 and the carriers 1400 are alternately arranged at intervals; specifically, the Cheng Qiubu 2200 and the two carriers 1400 are respectively provided with two, and the two Cheng Qiubu 2200 and the two carriers 1400 are alternately arranged at four quadrant point positions of the turntable 1110 at intervals. The connecting line of the chip glue scraping mechanism 3000 and the center of the rotary disc 1110 is perpendicular to the connecting line of the ball planting mechanism 4000 and the center of the rotary disc 1110.
As shown in fig. 1 and 5, the structure is as follows. Chip doctor constructs 3000 still includes: a squeegee elevating assembly 3200, a squeegee moving assembly 3300, and a squeegee web plate 3600. The frictioning assembly includes a left frictioning assembly 3400 and a right frictioning assembly 3500. The frictioning lifting component 3200 is fixedly arranged on the rack along the vertical direction. The frictioning moving assembly 3300 is connected to the frictioning lifting assembly 3200, and moves up and down by the driving of the frictioning lifting assembly 3200. Left side frictioning subassembly 3400 with right side frictioning subassembly 3500 sets up side by side along left right direction on the frictioning removal subassembly 3300, frictioning otter board 3600 is connected on frictioning lifting unit 3200, and through frictioning lifting unit 3200's drive and reciprocate. The chip is located below the glue scraping screen plate 3600, the solder paste is located on the glue scraping screen plate 3600, and the left glue scraping assembly 3400 and the right glue scraping assembly 3500 are located on the upper surface of the glue scraping screen plate 3600 and are driven by the glue scraping moving assembly 3300 to move in the left-right direction.
In the embodiment, the frictioning lifting component 3200 is adopted to drive the frictioning screen plate 3600 and the frictioning moving component 3300 to synchronously descend, so that the frictioning screen plate 3600 contacts with a chip below, the meshes on the frictioning screen plate 3600 are aligned to the contacts on the chip, the left frictioning component 3400 and the right frictioning component 3500 are driven by the frictioning moving component 3300 to move left and right, and when the left frictioning component 3400 and the right frictioning component 3500 moving left and right carry solder paste to pass through the mesh area, the solder paste can be coated on the contacts of the chip through the meshes. Therefore, the automatic coating of the solder paste on the chip is realized, the manual work is replaced, the production efficiency is improved, the manpower resource is saved, and the product consistency can be ensured through standardized production. The left glue scraping component 3400 and the right glue scraping component 3500 which are arranged at the left side and the right side can move back and forth in the left-right direction, and when the glue scraping components move rightwards under the driving of the glue scraping moving component 3300, the left glue scraping component 3400 can push solder paste; when moving left under the drive of frictioning removal subassembly 3300, right frictioning subassembly 3500 can promote the tin cream, makes the round trip movement of left and right directions all have the function of coating the tin cream like this, has further improved the efficiency of coating the tin cream.
The concrete structure of this embodiment does, as shown in fig. 5, fig. 6, chip is scraped gluey mechanism 3000 and is still included frictioning base 3100, frictioning base 3100 is fixed to be set up in the frame, frictioning base 3100 specifically includes the bottom plate 3110 of horizontal setting, and vertical setting is in cylinder mounting panel 3120 on the bottom plate 3110, the bottom plate 3110 passes through screw fixed mounting and is in the upper surface of frame, cylinder mounting panel 3120 is in through screw fixed mounting on the bottom plate 3110.
As shown in fig. 5 and 6, the frictioning lifting assembly 3200 in this embodiment specifically includes: a squeegee lifting cylinder 3210, a squeegee template 3220, and a squeegee upper and lower guide portion 3230. The frictioning lift cylinder 3210 is connected on the frictioning base 3100 along vertical direction, specifically is frictioning lift cylinder 3210 passes through screw fixed connection in the cylinder mounting plate 3120 deviates from the chip on the surface. The frictioning template 3220 is disposed on a piston shaft of the frictioning lifting cylinder 3210 along a horizontal direction, specifically, the frictioning lifting cylinder 3210 employs a double-shaft cylinder, a mounting block is labeled between the double shafts of the existing double-shaft cylinder, and the frictioning template 3220 is fixedly connected to the mounting block on the piston shaft of the frictioning lifting cylinder 3210 through a screw. The upper and lower frictioning guide parts 3230 are arranged on the frictioning base 3100 along the vertical direction, and the frictioning template 3220 is connected with the upper and lower frictioning guide parts 3230 in a sliding manner; specifically, the lower end of the upper and lower frictioning guide portions 3230 is fixedly clamped on the bottom plate 3110, and the frictioning template 3220 is driven by the frictioning lifting cylinder 3210 to directionally slide on the upper and lower frictioning guide portions 3230. Thus, the glue scraping template 3220 can stably slide up and down.
As shown in fig. 6 and 7, the upper and lower frictioning guide portion 3230 of the present embodiment includes: a vertical linear bearing housing 3231, and a vertical guide shaft 3232. The vertical linear bearing seat 3231 is disposed on the frictioning template 3220 and penetrates through the frictioning template 3220 in the vertical direction, the vertical guide shaft 3232 is fixedly disposed on the frictioning base 3100 in the vertical direction, and the vertical guide shaft 3232 is disposed in the vertical linear bearing seat 3231 and penetrates through the vertical linear bearing seat 3231. Specifically, the vertical linear bearing seat 3231 is fixedly connected to the upper surface of the frictioning template 3220 through a screw, the vertical linear bearing seat 3231 penetrates through the frictioning template 3220, a linear bearing is embedded in the existing vertical linear bearing seat 3231, the vertical guide shaft 3232 adopts an optical axis, and is matched with the linear bearing through the optical axis, so that the frictioning template 3220 slides up and down stably along the vertical guide shaft 3232. The upper and lower frictioning guide portions 3230 are four, and the four upper and lower frictioning guide portions 3230 are symmetrically arranged around the frictioning lifting cylinder 3210, so that the frictioning template 3220 is limited on a horizontal plane, and the directional sliding of the frictioning template 3220 is more stable.
As shown in fig. 6 and 7, the squeegee movement assembly 3300 includes: a squeegee moving cylinder 3310, a fixed plate 3320, a movable plate 3330, and a squeegee left and right guide portion 3340. The fixing plate 3320 is connected to the surface of the frictioning template 3220 and extends to protrude out of the edge of the frictioning template 3220; the glue scraping moving cylinder 3310 is fixedly arranged on the fixing plate 3320 along the left-right direction; the movable plate 3330 is fixedly disposed on the piston shaft of the frictioning movable cylinder 3310; guiding part 3340 about the frictioning, guiding part 3340 is fixed to be set up about the frictioning on the fixed plate 3320, the fly leaf 3330 sets up that slides guiding part 3340 about the frictioning. Specifically do fixed plate 3320 is including controlling fixed plate 3321 and front and back fixed plate 3322, it is in through screw fixed connection to control fixed plate 3321 along left right direction on the frictioning template 3220, front and back fixed plate 3322 passes through screw fixed connection along the fore-and-aft direction on the front and back fixed plate 3322, frictioning removes cylinder 3310 and passes through screw fixed connection on left and right sides fixed plate 3321, and the frictioning removes the one end that cylinder 3310 deviates from the chip and supports and lean on the surface at front and back fixed plate 3322. The frictioning moving cylinder 3310 is a double-shaft cylinder, and the movable plate 3330 is connected to the frictioning moving cylinder 3310 through an installation block marked and matched with the double-shaft cylinder. When the frictioning moving cylinder 3310 is activated, the movable plate 3330 is pushed to move in the left and right directions, and the movable plate 3330 performs the limiting and guiding operations due to the frictioning left and right guiding portions 3340, so that the movable plate 3330 slides back and forth in the left and right directions.
As shown in fig. 6 and 7, the left and right frictioning guide portion 3340 in this embodiment specifically includes: left and right linear bearing blocks 3341, and left and right guide shafts 3342. The left and right linear bearing blocks 3341 are disposed on the movable plate 3330 and penetrate the stripper plate 3220 in the left-right direction. The left and right guide shafts 3342 are fixedly provided on the fixing plate 3320 in the left and right directions, and the left and right guide shafts 3342 are provided in the left and right linear bearing blocks 3341 and penetrate the left and right linear bearing blocks 3341. Specifically, the left and right guide shafts 3342 adopt optical axes, one end of each of the left and right guide shafts 3342 is fixed to the front and rear fixing plates 3322 by screws, and the other end extends toward the chip direction and penetrates through the left and right linear bearing seats 3341. The guiding part 3340 is provided with two, two about the frictioning the guiding part 3340 is located the bilateral symmetry sets up around the frictioning removes cylinder 3310.
Fixed frictioning subassembly backup pad 3350 that is provided with on fly leaf 3330, frictioning subassembly backup pad 3350 extends the setting along left right direction, and frictioning subassembly backup pad 3350 passes through screw fixed connection on fly leaf 3330, and frictioning subassembly backup pad 3350 is used for supporting left frictioning subassembly 3400 and right frictioning subassembly 3500.
As shown in fig. 5 and 6, the left glue spreading assembly 3400 in this embodiment specifically includes: a left squeegee cylinder 3410, a left squeegee mounting block 3420, and a left squeegee 3430. The left squeegee cylinder 3410 is fixedly disposed on the squeegee assembly support plate 3350 in a vertical direction, the left squeegee blade mounting block 3420 is fixedly disposed on a piston shaft of the left squeegee cylinder 3410, the left squeegee blade mounting block 3420 extends in a front-rear direction, the left squeegee blade 3430 is disposed on the left squeegee blade mounting block 3420 in a front-rear direction, and a blade of the left squeegee blade 3430 faces an upper surface of the squeegee mesh plate 3600. The right squeegee assembly 3500 includes: a right squeegee cylinder 3510, a right squeegee mounting block 3520, and a right squeegee 3530. The right glue scraping cylinder 3510 is fixedly arranged on the glue scraping assembly supporting plate 3350 along the vertical direction, and the right glue scraping cylinder 3510 and the left glue scraping cylinder 3410 are arranged side by side; the right scraper mounting block 3520 is fixedly arranged on a piston shaft of the right scraping glue cylinder 3510, and the right scraper mounting block 3520 extends in the front-back direction; the right scraper 3530 is arranged on the right scraper mounting block 3520 along the front-back direction, and the edge of the right scraper 3530 faces the upper surface of the squeegee web plate 3600.
When the left frictioning assembly 3400 and the right frictioning assembly 3500 work, the left frictioning cylinder 3410 and the right frictioning cylinder 3510 respectively push the left scraper 3430 and the right scraper 3530 downwards, so that the left scraper 3430 and the right scraper 3530 synchronously descend to the upper surface of the frictioning screen plate 3600, the frictioning moving cylinder 3310 is started, the left scraper 3430 and the right scraper 3530 move left and right on the frictioning screen plate 3600, and therefore tin paste on the frictioning screen plate 3600 is pushed by the left scraper 3430 and the right scraper 3530 to penetrate through the frictioning screen plate 3600 and be coated on a chip below.
In this embodiment, a frictioning connecting plate 3610 is fixedly connected to the frictioning template 3220, the frictioning connecting plate 3610 is arranged in a vertical direction, a screen plate mounting plate 3620 is fixedly connected to the frictioning connecting plate 3610, the screen plate mounting plate 3620 is arranged in a horizontal direction, a mounting opening is formed in the screen plate mounting plate 3620, and the frictioning screen plate 3600 is fixedly arranged in the mounting opening and forms an accommodating cavity 3621 for placing solder paste. The solder paste is arranged in the accommodating cavity 3621, and the inner wall of the mounting opening forms a rib of the accommodating cavity 3621 to prevent the solder paste from flowing outwards.
As shown in fig. 5 and 6, the die squeegee mechanism in this embodiment further includes a fine adjustment assembly 3700, where the fine adjustment assembly 3700 includes: a differential head mount 3710, a differential head 3720, and a differential head adjustment block 3730. The differential head seat 3710 is fixedly arranged on one side of the air cylinder mounting plate 3120 departing from the frictioning lifting air cylinder 3210, the differential head 3720 is connected to the differential head seat 3710 along the vertical direction, the differential head adjusting block 3730 is fixedly arranged on one side of the frictioning template 3220 facing the frictioning lifting air cylinder 3210, and one end of the differential head 3720 abuts against the differential head adjusting block 3730. Through fine setting subassembly 3700, can adjust the height that stops after the frictioning template 3220 descends, have a stop nut on frictioning lift cylinder 3210 in addition, after fine setting subassembly 3700 can very accurate adjustment target in place with frictioning template 3220, have a stop nut on frictioning lift cylinder 3210 with fixed position, frictioning lift cylinder 3210 drives the frictioning template 3220 and descends to predetermined height at every turn like this, is blockked by stop nut. When frictioning template 3220 drives frictioning removal subassembly 3300, left frictioning subassembly 3400, right frictioning subassembly 3500 and goes up and down like this, can carry out accurate spacing to the descending position of left scraper 3430 and right scraper 3530 to carry out accurate control to the degree that covers the tin cream.
As shown in fig. 1, 8, and 9, the ball mounting mechanism 4000 in this embodiment further includes: ball planting lifting unit 4200, sucking disc installation component 4300. The ball-planting lifting assembly 4200 is fixedly disposed on the frame 1000 in a vertical direction, and the suction cup mounting assembly 4300 is connected to the ball-planting lifting assembly 4200 and driven by the ball-planting lifting assembly 4200 to move up and down. The sucking disc 4400 is arranged on the sucking disc mounting assembly 4300, the station rotating mechanism 1100 is arranged on the rack 1000, and the solder balls and the chips are sent to the lower portion of the sucking disc 4400 instead through rotation of the turntable on the station rotating mechanism 1100.
In the above embodiment, in this scheme, the solder ball is firstly fed to the position below the suction cup 4400 by the station rotating mechanism 1100, the ball planting lifting assembly 4200 is started, when the ball planting lifting assembly 4200 is started, the suction cup mounting assembly 4300 is driven to move up and down, when the suction cup mounting assembly 4300 moves down, the suction cup 4400 is driven to move down, the suction cup 4400 is started, and the solder ball is sucked by the negative pressure generated by the suction cup 4400. After the solder balls are sucked, the ball-planting lifting assembly 4200 drives the suction cup 4400 to ascend, meanwhile, the station rotating mechanism 1100 rotates through a turntable, and the chip which is coated with the solder paste by the chip glue scraping mechanism is replaced below the suction cup 4400 while the rest solder balls are conveyed away. And starting the ball planting lifting assembly 4200 again, driving the sucker 4400 to move downwards to be close to the chip to be ball planted, stopping the negative pressure on the sucker 4400, sticking the solder ball through the solder paste on the chip, lifting the sucker 4400, and finishing the ball planting process. The solder balls and the chips are circularly replaced by the station rotating mechanism 1100, so that the circulating process of glue scraping, ball sucking, ball planting, glue scraping, ball sucking and ball planting … … can be continuously realized.
As shown in fig. 8, the specific structure of this embodiment is that the station rotating mechanism 1100 further includes a blowing section 2300. As shown in fig. 9 and 10, a placing cavity 2210 for placing a solder ball is disposed on the Cheng Qiubu 2200; when the ball needs to be planted, the turntable 1110 can convey the ball holding portion 2200 to the position of the suction cup, so that the suction cup can suck the small solder balls in the placing cavity 2210 by negative pressure. The air blowing part 2300 is communicated with the placing cavity 2210. The air blowing part 2300 can be arranged on the rotary table 1110, or can be arranged at other positions, the conveying air blowing part 2300 in the embodiment is arranged on the frame, when the rotary table 1110 conveys the ball containing part 2200 to the position of the sucking disc, the Cheng Qiubu 2200 reaches the position of the air blowing part 2300, and the air blowing part 2300 is started to blow air towards the placing cavity 2210. After the solder ball is sucked by the sucker, the turntable 1110 drives Cheng Qiubu 2200 to be away from the position of the sucker 4400, and the air blowing part 2300 is closed, so that the air blowing part 2300 stops blowing air to the placing cavity 2210. In addition, the carrier 1400 on the turntable 1110 is used for loading chips. By the rotation of the turntable 1110, the solder balls in the ball holding portion 2200 and the chips on the carrier 1400 can be continuously and alternately fed to the lower part of the suction cup 4400.
In the above scheme, the turntable 1110 is adopted to convey the ball holding part 2200 to the sucker station, the ball holding part 2200 is provided with the placing cavity 2210 to place small balls to be sucked, the ball planting lifting component 4200 drives the sucker to move to the position of the placing cavity 2210, negative pressure is started to suck the small balls from the upper opening of the placing cavity 2210, in the process of sucking the balls by the sucker 4400, the placing cavity 2210 is blown by the blowing part 2300, the tin balls in the placing cavity 2210 are blown, the accumulated tin balls are moved, and thus the tin balls are dispersed, and the distribution of the tin balls in the placing cavity 2210 is more uniform. When the sucking disc carries out negative pressure adsorption to the tin ball that blows, the tin ball that evenly distributed in sucking disc adsorption zone is adsorbed by the suction hole of sucking disc more easily, also makes the suction hole homoenergetic on the sucking disc adsorb the tin ball like this. After the ball sucking process is completed, the rotary table is rotated to switch the positions of the chip and the sucking ball, so that the chip is positioned under the sucking disc to prepare for the next ball planting.
As shown in fig. 9 and 12, in the specific structure of this embodiment, the turntable 1110 is rotatably disposed on the frame 1000 in a horizontal plane, the Cheng Qiubu 2200 and the carrier 1400 are both fixedly disposed on the turntable 1110 by screws and located on a non-rotating center of the turntable 1110, and in order to enable rotation of the turntable 1110 to drive the ball holding portion 2200 to achieve a large displacement, the Cheng Qiubu 2200 and the carrier 1400 are both disposed at a peripheral edge of the turntable 1110. The rotation of the dial 1110 causes Cheng Qiubu 2200 to move closer to or further away from the suction cup. The air blowing part 2300 is positioned below the turntable 1110 and is coupled to the frame 1000.
As shown in fig. 10 and 11, the specific structure of Cheng Qiubu 2200 includes: a cartridge mounting plate 2220, and a cartridge body 2230; the cartridge body 2230 is provided on the cartridge mounting plate 2220. The periphery of the cartridge mounting plate 2220 protrudes out of the outer wall of the cartridge body 2230, a through hole or a threaded hole may be formed in the protruding portion of the cartridge mounting plate 2220, and the cartridge mounting plate 2220 is fixedly mounted on the turntable 1110 by screws. The utility model provides a ball blowing device, including placing chamber 2210, blow ball hole 2240 on the box mounting panel 2220, blow ball hole 2240 and be provided with a plurality ofly, blow the aperture of ball hole 2240 and be less than the aperture of tin ball, the tin ball can not leak down in placing chamber 2210 like this, blow ball hole 2240 along upper and lower direction run through the box mounting panel 2220 and with place chamber 2210 and be linked together. In this embodiment, the plurality of ball blowing holes 2240 are arranged in a rectangle, the formed rectangle can correspond to the shape of the chip, and the number of the ball blowing holes 2240 corresponds to the number of the contacts on the chip, so that the ball blowing holes 2240 can blow the solder balls with the same amount when blowing air, and the solder balls with the same amount as the contacts on the chip can be sucked up by the sucking disc conveniently. In order to enable the ball blowing holes 2240 to intake air, the turntable 1110 is provided with clearance holes 2120 for avoiding the ball blowing holes 2240. The clearance holes 2120 in this embodiment are square, and the opening range of the square clearance holes is larger than the rectangular range where the plurality of ball blowing holes 2240 are arranged.
As shown in fig. 10 and 12, the specific structure of the air blowing unit 2300 includes: a blow plate 2310, and a drive 2320. The blowing disc 2310 is located below the Cheng Qiubu 2200, specifically, the blowing disc 2310 is located below the turntable 1110, and the driving part 2320 is connected with the blowing disc 2310 and drives the blowing disc 2310 to reciprocate. The driving part 2320 in this embodiment drives the air blowing plate 2310 to reciprocate in the left-right direction. By the reciprocating movement of the blowing disc 2310, the blowing disc 2310 is circularly switched between a state of carrying out air supply by aligning with the ball blowing holes 2240 and a state of interrupting the air supply by deviating from the ball blowing holes 2240, so that the air in the placing cavity 2210 is occasionally not blown, the solder balls in the placing cavity 2210 are blown or dropped, the solder balls are disturbed, the solder balls are prevented from being piled up, and the distribution of the solder balls in the placing cavity 2210 is more uniform.
As shown in fig. 9 and 10, the driving unit 2320 includes: the ball box driving device comprises a ball box driving cylinder 2321 and a mounting plate 2322, the ball box driving cylinder 2321 is fixedly connected to the upper surface of the rack through screws, the mounting plate 2322 is fixedly arranged on a piston rod of the driving cylinder, and the air blowing part 2300 is fixedly connected to the mounting plate 2322 through screws. The piston rod is arranged along the left-right direction, and the blowing part 2300 can rapidly move left and right through the driving of the ball box driving cylinder 2321. The ball box driving cylinder 2321 in this embodiment is a double-shaft cylinder. The double-shaft cylinder enables the stress to be more uniform, and therefore the air blowing part 2300 can be stably propelled. It is conceivable that the driving unit 2320 may be an electric push rod, a ball screw linear movement mechanism, or the like.
As shown in fig. 9 and 12, the blowing tray 2310 in the present embodiment specifically includes: a middle plate 2312, an upper cover plate 2311, and a lower plate 2313. The middle plate 2312 is provided with a buffer cavity 2314, the buffer cavity 2314 penetrates through the middle plate 2312, the side surface of the middle plate 2312 is provided with an air guide hole 2315 communicated with the buffer cavity 2314, the air guide hole 2315 is used for connecting an external air pipe, the upper cover plate 2311 is fixedly arranged on the upper surface of the middle plate 2312 and seals an upper opening of the buffer cavity 2314, the upper cover plate 2311 is provided with an air outlet hole 2316, and the air outlet hole 2316 is communicated with the buffer cavity 2314; the lower supporting plate 2313 is fixedly arranged on the lower surface of the middle plate 2312 and seals the lower opening of the buffer cavity 2314, so that the buffer cavity 2314 is blocked by the upper cover plate 2311 and the lower supporting plate 2313, the air blowing disc 2310 is divided into the middle plate 2312, the upper cover plate 2311 and the lower supporting plate 2313, the processing is convenient, and the three plate-shaped structures are processed respectively and then spliced. Air supply is carried out through an external air pipe, so that air can enter the buffer cavity 2314, the direction of the air enters from the side surface of the buffer cavity 2314 and is converted into upward blow-out air, direct air blowing can be avoided, and the impact force of the air is buffered. In order to seal the buffer cavity 2314, seal grooves may be formed in the upper and lower surfaces of the intermediate plate 2312, and seal rings are disposed in the seal grooves, so that gas leakage is prevented and gas resources are saved.
In another embodiment, in order to prevent excessive leakage of air between the turntable 1110 and the air blowing disc 2310, a flexible retainer ring (not shown) is disposed on the upper surface of the air blowing disc 2310, the flexible retainer ring is disposed around the air outlet 2316, and the upper end of the flexible retainer ring abuts against the lower surface of the turntable 1110. Can carry out certain stopping to gas through flexible retaining ring, make gas enter into through blowing ball hole 2240 and place in the chamber 2210, avoid a large amount of gas to spill over and place outside the chamber 2210 and cause a large amount of wastes, because flexible retaining ring has certain compressibility, flexible retaining ring can not cause the influence to the rotation of carousel 1110.
In this embodiment, the aperture of the air outlet 2316 is larger than that of the ball blowing hole 2240. The aperture of the air outlet 2316 is enlarged, so that the impact force of the air flow rushing out of the air outlet 2316 can be reduced, and the impact force is not very large when the air flow enters the ball blowing holes 2240, and only the force of blowing the solder balls is required.
As shown in fig. 10, in order to improve the ball mounting efficiency, two placing cavities 2210 are arranged side by side in the present embodiment, and two buffer cavities 2314 are correspondingly arranged. The two placing cavities 2210 are arranged side by side along the left-right direction, and the two buffering cavities 2314 are correspondingly arranged side by side along the left-right direction. Thus, the tin balls of two chip positions can be sucked by the sucking disc at one time, and then the tin balls are planted on the two chips. The production efficiency is improved.
As shown in fig. 8 and 13, the automatic ball mounting device specifically includes: a ball planting base 4100, wherein the ball planting base 4100 is fixedly arranged on the rack, the ball planting base 4100 specifically comprises a horizontally arranged ball planting base plate 4110 and a ball planting cylinder mounting plate 4120 vertically arranged on the ball planting base plate 4110, the ball planting base plate 4110 is fixedly arranged on the upper surface of the rack through screws, and the ball planting cylinder mounting plate 4120 is fixedly arranged on the ball planting base plate 4110 through screws.
As shown in fig. 13 and 14, the ball mounting lifting assembly 4200 in this embodiment specifically includes: a ball planting lifting cylinder 4210, a ball planting template 4220 and a ball planting upper and lower guide part 4230. The ball planting lifting cylinder 4210 is connected to the ball planting base 4100 in the vertical direction, and specifically, the ball planting lifting cylinder 4210 is fixedly connected to the surface of the ball planting cylinder mounting plate 4120 departing from the chip through screws. The ball planting template 4220 is arranged on a piston rod of the ball planting lifting cylinder 4210 in the horizontal direction, specifically, the ball planting lifting cylinder 4210 adopts a double-shaft cylinder, an installation block is marked between the double shafts of the existing double-shaft cylinder, and the ball planting template 4220 is fixedly connected on the installation block on the piston rod of the ball planting lifting cylinder 4210 through screws. The ball planting upper and lower guide parts 4230 are arranged on the ball planting base 4100 along the vertical direction, and the ball planting template 4220 is connected with the ball planting upper and lower guide parts 4230 in a sliding manner; specifically, the lower ends of the ball-planting upper and lower guide portions 4230 are fixedly disposed on the bottom plate, and the ball-planting template 4220 is driven by a ball-planting lifting cylinder 4210 to directionally slide on the ball-planting upper and lower guide portions 4230. Thus, the ball-planting template 4220 slides up and down stably.
As shown in fig. 13 and 14, the ball attachment upper and lower guide portion 4230 in the present embodiment includes: a second vertical linear bearing seat 4231, and a second vertical guide shaft 4232. The second vertical linear bearing seat 4231 is disposed on the ball planting template 4220 and penetrates through the ball planting template 4220 in the vertical direction, the second vertical guide shaft 4232 is fixedly disposed on the ball planting base 4100 in the vertical direction, and the second vertical guide shaft 4232 is disposed in the second vertical linear bearing seat 4231 and penetrates through the second vertical linear bearing seat 4231. The concrete vertical straight line bearing seat 4231 of second passes through screw fixed connection at the upper surface of planting ball template 4220, the vertical straight line bearing seat 4231 of second runs through planting ball template 4220, and the embedded linear bearing that has the vertical straight line bearing seat 4231 of current second, the vertical guide shaft 4232 of second adopts the optical axis, matches with linear bearing through the optical axis to realize planting ball template 4220 and carry out stable upper and lower slip along vertical guide shaft. The four ball planting upper and lower guide portions 4230 are symmetrically arranged around the ball planting lifting cylinder 4210, so that the ball planting templates 4220 are limited on a horizontal plane, and the directional sliding of the ball planting templates 4220 is more stable.
As shown in fig. 13 and 15, the suction cup mounting assembly 4300 includes: a left mounting portion 4310, a right mounting portion 4320, and a snap-in portion 4330. Left side installation department 4310 with right side installation department 4320 is the mirror image setting and is in plant ball template 4220 left and right sides, joint portion 4330's both sides are connected respectively left side installation department 4310 with on the right side installation department 4320, draw-in groove 4333 has been seted up on the joint portion 4330, sucking disc 4400 inlay in draw-in groove 4333. In the specific structure, a ball-planting connecting plate 4340 is connected to the ball-planting template 4220 in the up-down direction, the ball-planting connecting plate 4340 is fixedly connected to the front surface of the ball-planting template 4220 by screws, and the left mounting portion 4310 and the right mounting portion 4320 are respectively fixedly connected to the left side and the right side of the ball-planting connecting plate 4340 by screws. After the left installation part 4310 and the right installation part 4320 are connected with the clamping part 4330, the suction cup 4400 can be fixed from the left side and the right side through the clamping part 4330, so that the suction cup 4400 can be stably connected.
As shown in fig. 13 and 15, the left mounting portion 4310 and the right mounting portion 4320 in this embodiment have the same structure, and taking the left mounting portion 4310 as an example, the left mounting portion 4310 includes: left guide rail mounting plate 4311, left pull plate 4312, left guide rail 4313, left clamp groove connecting plate 4315 and limit screw 4316. The left guide rail mounting plate 4311 extends along the front-rear direction, and the left pull plate 4312 is disposed on the left guide rail mounting plate 4311 and extends toward the right mounting portion 4320. The left guide rail 4313 is fixedly arranged on the left guide rail mounting plate 4311 along the up-down direction, and the left guide rail 4313 is connected with a left sliding table 4314 in a sliding manner. The left clamping groove connecting plate 4315 is fixedly connected to the left sliding table 4314, and the clamping portion 4330 is connected to the left clamping groove connecting plate 4315. In the concrete structure, screw fixed connection is passed through in the left side of planting ball even board 4340 in the one end of left guide rail mounting panel 4311, the other end of left guide rail mounting panel 4311 extends towards the place ahead, left side guide rail 4313 passes through screw fixed connection on the right flank of left guide rail mounting panel 4311 along vertical direction, left side slip table 4314 with left side guide rail 4313 matches, and left slip table 4314 slides on left guide rail 4313 along upper and lower direction, pass through screw fixed connection on the slip table 4314 of a left side draw-in groove even board 4315. The left clamping groove connecting plate 4315 extends in the front-rear direction. One end of the left pull plate 4312 is fixedly connected to the upper surface of the left guide rail mounting plate 4311 through a screw, the other end of the left pull plate 4312 extends towards the right side to the upper side of the left clamping groove connecting plate 4315, a screw head of the limit screw 4316 is located above the left pull plate 4312, a through hole is formed in the left pull plate 4312, and a screw rod of the limit screw 4316 penetrates through the through hole and is fixedly connected to the left clamping groove connecting plate 4315. The left end of joint portion 4330 is connected on left draw-in groove even board 4315, the opposite side right installation department 4320 sets up with left installation department 4310 mirror symmetry, the right-hand member of joint portion 4330 is connected on right installation department 4320. Thus, when the suction cup 4400 is mounted on the clamping portion 4330, the left mounting portion 4310 and the right mounting portion 4320 fix the suction cup 4400 through the clamping groove 4333. During the ball sucking process, the ball mounting lifting component 4200 moves downward to drive the ball mounting template 4220 to move downward, the ball mounting connecting plate 4340 is driven to move downward by the ball mounting template 4220, the left guide rail mounting plate 4311 on the downward moving ball mounting connecting plate 4340 is driven to move downward, the sucker 4400 is driven to move downward above the ball holding portion by the clamping portion 4330, when the sucker 4400 abuts against the opening of the ball holding portion, the ball mounting lifting component 4200 can continuously descend, the left clamping groove connecting plate 4315 slides upward relative to the left guide rail 4313, the screw of the limiting screw 4316 is equivalent to the guide rod to limit the sliding of the left clamping groove connecting plate 4315, and therefore the sucker 4400 on the opening of the ball holding portion can press the opening of the ball holding portion, and the solder balls in the Cheng Qiubu are sucked by negative pressure. When the ball-planting lifting assembly 4200 is lifted, the left card slot connecting plate 4315 moves downwards under the action of the gravity of the suction cup 4400, and the screw head of the limit screw 4316 can abut against the upper surface of the left pulling plate 4312, so that the suction cup 4400 does not move downwards after moving to a preset position.
As shown in fig. 15, the clamping portion 4330 in this embodiment includes: the clamping device comprises an upper clamping plate 4331 and a lower clamping plate 4332 which is arranged in parallel with the upper clamping plate 4331, wherein the upper clamping plate 4331 and the lower clamping plate 4332 are arranged at intervals to form the clamping groove 4333. An installation cavity 4334 is formed in the upper surfaces of the upper clamping plate 4331 and the lower clamping plate 4332 in a penetrating manner, two sides of the suction cup 4400 are clamped and embedded in the clamping groove 4333, and the suction cup 4400 is arranged in the installation cavity 4334. In a specific structure, one side of the mounting cavity 4334 extends out of one side of the upper clamping plate 4331, so that the contour of the mounting cavity 4334 is a square with an opening at one side. The card slot 4333 is located on a side surface of the card portion 4330. Thus, the locking grooves 4333 are formed on both left and right side walls of the mounting chamber 4334. The clamping grooves 4333 on the two side walls of the installation cavity 4334 are used for clamping and embedding the two sides of the sucker 4400.
As shown in fig. 13 and 17, the suction cup 4400 in this embodiment includes: a suction plate 4410, and a limit boss 4420 connected to the suction plate 4410. An air cavity is formed between the suction plate 4410 and the limit boss 4420, and is communicated with an air pipe 4430. The lower surface of the suction plate 4410 is provided with a suction ball hole 4440, and the suction ball hole 4440 is communicated with the air cavity. The two sides of the suction plate 4410 are embedded in the clamping grooves 4333, and the limiting bosses 4420 are located in the mounting cavity 4334. In the specific structure, a step position is formed between the suction plate 4410 and the limiting boss 4420, and when the left side and the right side of the suction plate 4410 are clamped and embedded in the clamping groove 4333, the step position abuts against the inner wall of the mounting cavity 4334, so that the suction disc 4400 can be limited through the matching of the mounting cavity 4334 and the limiting boss 4420, and the suction disc 4400 can be mounted on the clamping portion 4330 more conveniently. Suction is performed through the air tube 4430 to generate a negative pressure at the position of the ball suction hole 4440, thereby sucking up the solder ball. The position of the air suction hole is arranged corresponding to the contact position of the chip needing ball mounting. So that the solder balls sucked on the suction holes can be correspondingly placed on the contact positions of the chip. The chamfer 4450 is formed at the edge of the downward hole of the ball suction hole 4440 in the embodiment, the solder ball can be better sucked by negative pressure through the chamfer 4450, the chamfer 4450 can provide a suction position for the solder ball sucked on the sucking disc 4400, and the solder ball can be stably sucked on the sucking disc 4400.
As shown in fig. 13 and 15, the ball-planting mechanism further includes a striking assembly 4500 connected to the ball-planting lifting assembly, and the striking assembly 4500 in this embodiment includes: a knock bar 4530, a knock cylinder 4510, a knock plate 4520, and a knock sub-plate 4540. The knocking cylinder 4510 is arranged on the ball-planting connecting plate 4340 in the up-down direction through screw fixation, the knocking plate 4520 is connected to a piston rod of the knocking cylinder 4510 through a mounting block on the piston rod of the knocking cylinder 4510, and the knocking plate 4520 extends along one side facing the suction cup 4400, namely the knocking plate 4520 extends towards the front. The tapping rod 4530 is fixedly connected to the tapping plate 4520 through screws in the up-down direction, and the lower end of the tapping rod 4530 faces the suction cup 4400. In the process of sucking the solder ball by the sucker 4400, the knocking cylinder 4510 is started, a piston rod of the knocking cylinder 4510 drives the knocking plate 4520 to move downwards, the knocking rod 4520 drives the knocking rod 4530 to move downwards, the knocking rod 4530 in the movement downwards knocks the sucker 4400, and therefore the solder ball adsorbed by the negative pressure with large adsorption force is knocked off on the sucker 4400, and the knocking force is controlled, so that the phenomenon that the solder ball adsorbed by the negative pressure with large adsorption force is knocked off can be avoided.
The knocking sub plate 4540 in the embodiment is arranged below the knocking sub plate 4520 in parallel and is fixedly connected to the cylinder body of the knocking cylinder 4510 through a screw, and the knocking rod 4530 penetrates through the knocking sub plate 4540 and is slidably arranged on the knocking sub plate 4540. Thus, the slap sub-plate 4540 has a guiding function for the slap 4530, so that the slap 4530 is oriented in the up-down direction and stably slides.
As shown in fig. 14 and 16, the ball attachment mechanism in this embodiment further includes a ball attachment fine adjustment assembly 4600, and the ball attachment fine adjustment assembly 4600 includes: a ball planting differential head seat 4610, a ball planting differential head 4620 and a ball planting differential head adjusting block 4630. The ball planting differential head seat 4610 is fixedly arranged on one side of the ball planting cylinder mounting plate 4120, which is far away from the ball planting lifting cylinder 4210, through screws, the ball planting differential head 4620 is connected to the ball planting differential head seat 4610 in the vertical direction, the ball planting differential head adjusting block 4630 is fixedly arranged on one side of the ball planting and planting template 4220, which faces the ball planting lifting cylinder 4210, and one end of the ball planting differential head 4620 abuts against the ball planting differential head adjusting block 4630. The height of the ball planting template 4220 staying after descending can be adjusted through the ball planting fine adjustment assembly 4600, in addition, a limiting nut is arranged on the ball planting lifting cylinder 4210, after the ball planting fine adjustment assembly 4600 can accurately adjust the ball planting template 4220 in place, the position is fixed through the limiting nut arranged on the ball planting lifting cylinder 4210, and therefore the ball planting lifting cylinder 4210 drives the ball planting template 4220 to descend to the preset height each time and is blocked by the limiting nut. When planting ball template 4220 and driving sucking disc installation component 4300 and sucking disc 4400 and go up and down like this, can carry out accurate spacing to the decline position of sucking disc 4400 to the high accurate control of lift of sucking disc 4400.
In addition, the scheme also provides an automatic ball planting method, which is used for the automatic ball planting equipment, and the automatic ball planting method comprises the following steps:
step A, starting a station rotating mechanism, rotating the turntable, rotating the carrier for loading the chip to the position below the glue scraping assembly, and simultaneously rotating Cheng Qiubu for loading the solder balls to the position below the sucker;
b, starting a chip glue scraping mechanism, coating solder paste on the chip on the carrier by the glue scraping component, starting a ball planting mechanism at the same time, and sucking the solder balls in the ball containing part by the sucking disc;
rotating the turntable to enable the chip coated with the solder paste to be positioned below the sucking disc, and simultaneously enabling the other ball containing part to be positioned below the glue scraping assembly;
d, starting a ball mounting mechanism, wherein the sucking disc places the solder balls on the chip coated with the solder paste below, and the chip glue scraping mechanism is not started at the same time;
e, rotating the turntable to enable another carrier loaded with chips to rotate to the position below the glue scraping assembly, simultaneously rotating another Cheng Qiubu loaded with solder balls to the position below the sucking disc, and moving the chips subjected to ball planting out of the ball planting mechanism;
and F, taking off the chip on which the balls are planted from the carrier, replacing the chip with a new chip on which the balls are not planted, and executing the step B.
And after the step B is executed, sequentially executing the subsequent steps. A continuous loop is formed until the "auto stop" button is pressed, stopping the entire process. In addition, the chip glue spreading mechanism can also operate independently, and the ball mounting mechanism can also operate independently.
In conclusion, the rotary table on the station rotating mechanism rotates to drive the ball containing part and the carrier to rotate to the position below the chip glue scraping mechanism or the ball planting mechanism, so that the solder balls and the chips are circularly replaced, and the circulating process of glue scraping, ball sucking, ball planting, glue scraping, ball sucking and ball planting can be continuously realized. Glue scraping and ball planting are continuously and uninterruptedly carried out, the process of automatically planting balls is realized, the labor cost is saved, and the production efficiency is improved. The problems that in the prior art, the production efficiency of the chip is low, manpower is wasted, and the quality consistency of the chip is difficult to guarantee due to the manual operation process are solved.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides an automatic plant ball equipment, includes the frame, its characterized in that, automatic plant ball equipment still includes:
the station rotating mechanism comprises a turntable which is rotatably arranged on the rack, a carrier which is arranged on the turntable and used for loading a chip, and Cheng Qiubu which is arranged on the turntable and used for placing a solder ball;
the chip glue scraping mechanism is arranged on the rack and positioned on one side of the rotary table, and comprises a glue scraping component positioned above the rotary table, and the glue scraping component reciprocates along the radial direction of the rotary table to coat the solder paste on the chip;
the ball planting mechanism is arranged on the rack and positioned on one side of the turntable, and comprises a sucker for sucking and releasing solder balls;
the solder balls in the Cheng Qiu part and the chips pasted by the glue scraping component are alternately positioned below the sucking disc through the rotation of the turntable.
2. The automatic ball mounting apparatus of claim 1, wherein the chip glue spreading mechanism further comprises:
the glue scraping lifting assembly is fixedly arranged on the rack along the vertical direction;
the glue scraping moving assembly is connected to the glue scraping lifting assembly and driven by the glue scraping lifting assembly to move up and down;
the glue scraping screen plate is connected to the glue scraping lifting assembly and driven by the glue scraping lifting assembly to move up and down;
the glue scraping assembly comprises a left glue scraping assembly and a right glue scraping assembly, and the left glue scraping assembly and the right glue scraping assembly are arranged on the glue scraping moving assembly side by side along the left-right direction;
the chip is located below the glue scraping screen plate, the solder paste is located on the glue scraping screen plate, and the left glue scraping assembly and the right glue scraping assembly are located on the upper surface of the glue scraping screen plate and move in the left-right direction through driving of the glue scraping moving assembly.
3. The automatic ball mounting equipment according to claim 2, wherein the frictioning moving assembly comprises a movable plate, a frictioning assembly supporting plate is fixedly arranged on the movable plate, and the frictioning assembly supporting plate extends along the left-right direction;
left frictioning subassembly includes:
the left glue scraping cylinder is fixedly arranged on the glue scraping assembly supporting plate along the vertical direction;
the left scraper mounting block is fixedly arranged on a piston shaft of the left frictioning cylinder and extends along the front-back direction;
the left scraper is arranged on the left scraper mounting block along the front-back direction, and the edge of the left scraper faces the upper surface of the glue scraping screen plate;
the right frictioning subassembly includes:
the right frictioning cylinder is fixedly arranged on the frictioning assembly supporting plate along the vertical direction, and the right frictioning cylinder and the left frictioning cylinder are arranged side by side;
the right scraper mounting block is fixedly arranged on a piston shaft of the right frictioning cylinder and extends along the front-back direction;
the right scraper is arranged on the right scraper mounting block along the front-back direction, and the edge of the right scraper faces the upper surface of the glue scraping screen plate;
the left scraper and the right scraper are arranged side by side along the left-right direction.
4. The automatic ball mounting apparatus of claim 1, wherein the ball mounting mechanism comprises: the ball planting lifting assembly is fixedly arranged on the rack along the vertical direction;
the sucker mounting assembly is connected to the ball planting lifting assembly and driven by the ball planting lifting assembly to move up and down, and the sucker is arranged on the sucker mounting assembly; and
and the knocking component is connected to the ball planting lifting component and is used for knocking the sucker.
5. The automatic ball mounting equipment of claim 4, wherein the ball mounting mechanism further comprises a ball mounting base, and the ball mounting base is fixedly arranged on the rack;
plant ball lifting unit includes:
the ball planting lifting cylinder is connected to the ball planting base along the vertical direction;
the ball planting template is arranged on a piston rod of the ball planting lifting cylinder along the horizontal direction;
the upper and lower ball-planting guide parts are arranged on the ball-planting base along the vertical direction, and the ball-planting template is connected with the upper and lower ball-planting guide parts in a sliding manner.
6. The automatic ball placement device of claim 5, wherein the suction cup mounting assembly comprises:
the left mounting part and the right mounting part are arranged on the left side and the right side of the ball-planting template in a mirror image manner;
the two sides of the clamping part are respectively connected to the left mounting part and the right mounting part;
the clamping portion is provided with a clamping groove, and the sucker is clamped and embedded in the clamping groove.
7. The automatic ball mounting apparatus of claim 6, wherein the left mounting portion comprises: the left guide rail mounting plate extends along the front-back direction;
the left pulling plate is arranged on the left guide rail mounting plate and extends towards the right mounting part;
the left guide rail is fixedly arranged on the left guide rail mounting plate along the vertical direction, and a left sliding table is connected onto the left guide rail in a sliding manner;
the left clamping groove connecting plate is fixedly connected to the left sliding table, and the clamping portion is connected to the left clamping groove connecting plate;
and the screw head of the limiting screw is positioned above the left pulling plate, and the screw rod of the limiting screw penetrates through the left pulling plate and is fixedly connected to the left clamping groove connecting plate.
8. The automatic ball planting device of claim 5, wherein the ball planting template is connected with a ball planting connecting plate along the up-down direction;
the rapping assembly comprises: the knocking rod is positioned above the sucking disc, and the sucking disc is knocked by the knocking rod which moves up and down;
the knocking cylinder is arranged on the ball-planting connecting plate along the vertical direction;
the knocking plate is connected to a piston rod of the knocking cylinder, the knocking plate extends along one side facing the sucker, the knocking rod is fixedly arranged on the knocking plate along the vertical direction, and the lower end of the knocking rod faces the sucker;
the knocking auxiliary plate is arranged in parallel below the knocking plate and fixedly connected to the cylinder body of the knocking cylinder, and the knocking rod penetrates through the knocking auxiliary plate and is arranged on the knocking cylinder in a sliding mode.
9. The automatic ball planting device of claim 1, wherein the turntable is provided with a plurality of the ball holding portions and a plurality of the carriers, and the plurality of the ball holding portions and the plurality of the carriers are alternately arranged at intervals;
the ball containing part is provided with a placing cavity for placing a solder ball;
station rotary mechanism still includes: the blowing part is arranged on the rack, and when the Cheng Qiubu rotates to the position below the sucker, the blowing part is communicated with the placing cavity.
10. An automatic ball mounting method for an automatic ball mounting apparatus according to any one of claims 1 to 9, the automatic ball mounting method comprising:
step A, starting a station rotating mechanism, rotating the turntable, rotating the carrier for loading the chip to the position below the glue scraping assembly, and simultaneously rotating Cheng Qiubu for loading the solder balls to the position below the sucker;
b, starting a chip glue scraping mechanism, coating solder paste on the chip on the carrier by the glue scraping component, starting a ball planting mechanism at the same time, and sucking the solder balls in the ball containing part by the sucking disc;
rotating the turntable to enable the chip coated with the solder paste to be positioned below the sucking disc, and simultaneously enabling the other ball containing part to be positioned below the glue scraping assembly;
d, starting a ball mounting mechanism, wherein the sucking disc places the solder balls on the chip coated with the solder paste below, and the chip glue scraping mechanism is not started at the same time;
step E, rotating the turntable to enable another carrier loaded with chips to rotate to the position below the glue scraping assembly, simultaneously rotating another Cheng Qiubu loaded with solder balls to the position below the sucking disc, and then moving the chips subjected to ball planting out of the ball planting mechanism;
and F, taking off the chip on which the balls are planted from the carrier, replacing the chip with a new chip on which the balls are not planted, and executing the step B.
CN202211081869.4A 2022-09-05 2022-09-05 Automatic ball mounting equipment and automatic ball mounting method Pending CN115274513A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211081869.4A CN115274513A (en) 2022-09-05 2022-09-05 Automatic ball mounting equipment and automatic ball mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211081869.4A CN115274513A (en) 2022-09-05 2022-09-05 Automatic ball mounting equipment and automatic ball mounting method

Publications (1)

Publication Number Publication Date
CN115274513A true CN115274513A (en) 2022-11-01

Family

ID=83756358

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211081869.4A Pending CN115274513A (en) 2022-09-05 2022-09-05 Automatic ball mounting equipment and automatic ball mounting method

Country Status (1)

Country Link
CN (1) CN115274513A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116682774A (en) * 2023-07-27 2023-09-01 深圳市立可自动化设备有限公司 Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116682774A (en) * 2023-07-27 2023-09-01 深圳市立可自动化设备有限公司 Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards
CN116682774B (en) * 2023-07-27 2023-12-22 深圳市立可自动化设备有限公司 Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards

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