TW508029U - Ball placement mechanism for automatic post-replacement of solder ball - Google Patents

Ball placement mechanism for automatic post-replacement of solder ball

Info

Publication number
TW508029U
TW508029U TW90219673U TW90219673U TW508029U TW 508029 U TW508029 U TW 508029U TW 90219673 U TW90219673 U TW 90219673U TW 90219673 U TW90219673 U TW 90219673U TW 508029 U TW508029 U TW 508029U
Authority
TW
Taiwan
Prior art keywords
ball
replacement
placement mechanism
automatic post
solder ball
Prior art date
Application number
TW90219673U
Other languages
Chinese (zh)
Inventor
Jiun-Rung Jang
Je-Jin Su
Original Assignee
Hon Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Tech Inc filed Critical Hon Tech Inc
Priority to TW90219673U priority Critical patent/TW508029U/en
Publication of TW508029U publication Critical patent/TW508029U/en

Links

TW90219673U 2001-11-13 2001-11-13 Ball placement mechanism for automatic post-replacement of solder ball TW508029U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90219673U TW508029U (en) 2001-11-13 2001-11-13 Ball placement mechanism for automatic post-replacement of solder ball

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90219673U TW508029U (en) 2001-11-13 2001-11-13 Ball placement mechanism for automatic post-replacement of solder ball

Publications (1)

Publication Number Publication Date
TW508029U true TW508029U (en) 2002-10-21

Family

ID=27622433

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90219673U TW508029U (en) 2001-11-13 2001-11-13 Ball placement mechanism for automatic post-replacement of solder ball

Country Status (1)

Country Link
TW (1) TW508029U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116682774A (en) * 2023-07-27 2023-09-01 深圳市立可自动化设备有限公司 Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116682774A (en) * 2023-07-27 2023-09-01 深圳市立可自动化设备有限公司 Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards
CN116682774B (en) * 2023-07-27 2023-12-22 深圳市立可自动化设备有限公司 Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees