TW500257U - Pin-type integrated circuit connection device - Google Patents

Pin-type integrated circuit connection device

Info

Publication number
TW500257U
TW500257U TW090219743U TW90219743U TW500257U TW 500257 U TW500257 U TW 500257U TW 090219743 U TW090219743 U TW 090219743U TW 90219743 U TW90219743 U TW 90219743U TW 500257 U TW500257 U TW 500257U
Authority
TW
Taiwan
Prior art keywords
pin
integrated circuit
connection device
circuit connection
type integrated
Prior art date
Application number
TW090219743U
Other languages
Chinese (zh)
Inventor
Kuen-Yau He
Jen-Yue Gung
Lin-Jou Dung
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW090219743U priority Critical patent/TW500257U/en
Priority to US10/151,679 priority patent/US6699046B2/en
Publication of TW500257U publication Critical patent/TW500257U/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2027—Guiding means, e.g. for guiding flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
TW090219743U 2001-11-16 2001-11-16 Pin-type integrated circuit connection device TW500257U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW090219743U TW500257U (en) 2001-11-16 2001-11-16 Pin-type integrated circuit connection device
US10/151,679 US6699046B2 (en) 2001-11-16 2002-05-20 Pin grid array integrated circuit connecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090219743U TW500257U (en) 2001-11-16 2001-11-16 Pin-type integrated circuit connection device

Publications (1)

Publication Number Publication Date
TW500257U true TW500257U (en) 2002-08-21

Family

ID=21687349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090219743U TW500257U (en) 2001-11-16 2001-11-16 Pin-type integrated circuit connection device

Country Status (2)

Country Link
US (1) US6699046B2 (en)
TW (1) TW500257U (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7233061B1 (en) * 2003-10-31 2007-06-19 Xilinx, Inc Interposer for impedance matching
US7566960B1 (en) 2003-10-31 2009-07-28 Xilinx, Inc. Interposing structure
US7180752B2 (en) * 2004-05-28 2007-02-20 International Business Machines Corporation Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications
US7193300B2 (en) * 2004-09-13 2007-03-20 Honeywell International Inc. Plastic leadframe and compliant fastener
US7327261B2 (en) * 2005-07-27 2008-02-05 Zih Corp. Visual identification tag deactivation
CN100409405C (en) * 2005-09-02 2008-08-06 义华科技有限公司 Method and device for regulating IC component pin
KR100699874B1 (en) * 2005-11-08 2007-03-28 삼성전자주식회사 BGA package having embedded solder ball and method ofthe same and board mounted the same
US7347701B2 (en) * 2006-05-17 2008-03-25 Intel Corporation Differential I/O spline for inexpensive breakout and excellent signal quality
US7278859B1 (en) * 2006-08-31 2007-10-09 Intel Corporation Extended package substrate
JP4496240B2 (en) * 2007-08-10 2010-07-07 株式会社東芝 LSI package with interface module
TWM337870U (en) * 2007-12-03 2008-08-01 Hon Hai Prec Ind Co Ltd Electrical connector
TWI516182B (en) * 2014-05-16 2016-01-01 緯創資通股份有限公司 Process apparatus capable of pushing panel-shaped object and process method thereof
US9603276B2 (en) * 2014-12-26 2017-03-21 Intel Corporation Electronic assembly that includes a plurality of electronic packages
TWI576022B (en) * 2016-05-16 2017-03-21 中華精測科技股份有限公司 Support structure and manufacture method thereof
US10103463B1 (en) 2017-09-28 2018-10-16 ColdQuanta, Inc. In-place clamping of pin-grid array

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5481436A (en) * 1992-12-30 1996-01-02 Interconnect Systems, Inc. Multi-level assemblies and methods for interconnecting integrated circuits
TW383955U (en) * 1998-08-31 2000-03-01 Hon Hai Prec Ind Co Ltd Module apparatus for slot connector
US6081429A (en) * 1999-01-20 2000-06-27 Micron Technology, Inc. Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods

Also Published As

Publication number Publication date
US6699046B2 (en) 2004-03-02
US20030096514A1 (en) 2003-05-22

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model