CN111587475A - Ball planting machine - Google Patents

Ball planting machine Download PDF

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Publication number
CN111587475A
CN111587475A CN201980005233.1A CN201980005233A CN111587475A CN 111587475 A CN111587475 A CN 111587475A CN 201980005233 A CN201980005233 A CN 201980005233A CN 111587475 A CN111587475 A CN 111587475A
Authority
CN
China
Prior art keywords
ball
outer box
box body
movable drawer
planting machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980005233.1A
Other languages
Chinese (zh)
Inventor
郭太杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinguan Technology Co ltd
Original Assignee
Xinguan Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xinguan Technology Co ltd filed Critical Xinguan Technology Co ltd
Publication of CN111587475A publication Critical patent/CN111587475A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cultivation Receptacles Or Flower-Pots, Or Pots For Seedlings (AREA)

Abstract

A ball planting machine comprises an outer box body (1), wherein the inner part of the outer box body is hollow, at least one surface of the outer box body is of an open structure, a steel mesh (2) is arranged on the top surface of the outer box body, a plurality of ball guide holes (3) communicated with the inner part of the outer box body (1) are formed in the steel mesh (2), and the number, the positions and the arrangement modes of the ball guide holes (3) are the same as those of ball seats on a semiconductor substrate (4) to be planted with balls; the ball planting machine also comprises a movable drawer (5) which can enter and exit the inner part of the outer box body (1) through one open surface in the outer box body (1); when the semiconductor substrate (4) to be subjected to ball planting is placed on the movable drawer (5), and the movable drawer (5) completely enters the outer box body (1), all the ball guide holes (3) correspond to the ball seats on the semiconductor substrate (4) to be subjected to ball planting in a one-to-one mode; the box body shaking mechanism comprises a positioning rod (6) which extends along the direction of the longitudinal width of the outer box body (1) and is fixed on the outer box body (1), and two ends of the positioning rod (6) are respectively pivoted on a bearing seat (7). The ball mounting machine can uniformly and accurately guide the solder balls into the ball seat of the semiconductor substrate (4), and effectively reduces the probability of ball shortage.

Description

Ball planting machine Technical Field
The utility model relates to a semiconductor production technical field, concretely relates to ball planting machine.
Background
In semiconductor production, there are various package forms such as BGA packages, TSOP, and the like. The BGA package method arranges the pins in a full grid hash manner, and uses solder balls as the pins and solder points (solder balls).
The existing ball planting method mainly comprises the following steps of holding, placing and planting balls, wherein the following defects mainly exist in the holding, placing and planting balls: when the solder ball is sucked, the suction probability of the solder ball is completely determined, and if the suction hole of the sucking disc does not suck the solder ball, the solder ball does not fall on the ball seat at the corresponding position of the substrate, so that the state of ball shortage is caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a ball planting machine, can realize evenly, accurately leading-in the ball seat of semiconductor substrate with the tin ball on, effectively reduce the probability that the ball condition of lacking takes place.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a ball planting machine comprises an outer box body, wherein the outer box body is hollow, and at least one surface of the outer box body is of an open structure; the top surface of the outer box body is provided with a steel mesh, the steel mesh is provided with a plurality of ball guide holes communicated with the interior of the outer box body, and the number, the positions and the arrangement modes of the ball guide holes are the same as those of the ball seats on the semiconductor substrate to be planted with balls; the ball planting machine also comprises a movable drawer, and the movable drawer can enter and exit the inner part of the outer box body through the opened surface in the outer box body; when the semiconductor substrate to be subjected to ball planting is placed on the movable drawer and the movable drawer completely enters the outer box body, all the ball guide holes correspond to the ball seats on the semiconductor substrate to be subjected to ball planting in a one-to-one mode; the ball planting machine further comprises an outer box shaking mechanism, the outer box shaking mechanism comprises a positioning rod which extends along the longitudinal width direction of the outer box and is fixed on the outer box, and two ends of the positioning rod are respectively pivoted on a bearing seat.
Further, the lateral length and the longitudinal width of the movable drawer are identical to those of the hollow interior of the outer case.
Furthermore, the top surface of the outer box body is provided with a concave structure, and the steel mesh is arranged at the bottom of the concave structure.
Furthermore, the ball planting machine also comprises a material tray, a plurality of semiconductor substrate fixing grooves are formed in the material tray, and when the semiconductor substrates to be planted with balls are placed in the semiconductor substrate fixing grooves and the movable drawer completely enters the outer box body, all the ball guide holes correspond to the ball seats of the semiconductor substrates to be planted with balls one by one.
Furthermore, the top surface of the movable drawer is provided with a material tray fixing groove, the size of the material tray is consistent with that of the material tray, and the top surface of the material tray is exactly positioned on the same horizontal plane with that of the movable drawer after the material tray is fixed in the material tray fixing groove.
Furthermore, ball planting machine is still including removing drawer guiding mechanism, remove drawer guiding mechanism and locate the bottom of the inside of outer box, including the guide rail that extends along the direction of the longitudinal width of outer box, and be fixed in the bottom surface of removing the drawer and assemble the slider on the guide rail slidably.
Further, the number of the guide rails is two.
Furthermore, the positioning rod penetrates through and is fixed on the outer box body.
Furthermore, the front of the movable drawer is provided with a push-pull part.
The beneficial effects of the utility model reside in that: through the setting of steel mesh and ball guide hole, removal drawer, outer box rocking mechanism, can with the ball accuracy import to the ball seat of base plate in, the semiconductor substrate appearance of making is pleasing to the eye, the quality is average, and can provide fully on the steel mesh for the ball, roll over promptly on the ball guide hole and fall into the chance in the ball seat, effectively reduce the condition of lacking the ball and take place. Moreover, the operation is simple and convenient, and one set of ball mounting machine and one operator can realize the ball mounting of a plurality of semiconductor substrates at one time.
Drawings
Fig. 1 is a schematic front view of an embodiment of the present invention;
fig. 2 is a schematic side view of an embodiment of the present invention;
FIG. 3 is a schematic top view of an outer case according to an embodiment of the present invention;
FIG. 4 is a schematic view of the arrangement of ball guide holes in FIG. 3;
FIG. 5 is a perspective view of the outer case of FIG. 3;
FIG. 6 is a schematic top view of a movable drawer according to an embodiment of the present invention;
fig. 7 is a schematic top view of a material tray according to an embodiment of the present invention;
fig. 8 is a schematic view of a single semiconductor substrate of fig. 7.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, and it should be noted that the present embodiment is based on the technical solution, and the detailed embodiments and the specific operation processes are provided, but the protection scope of the present invention is not limited to the present embodiment.
As shown in fig. 1 to 8, a ball planting machine comprises an outer box 1, wherein the outer box 1 is hollow, and at least one surface (in the embodiment, the front surface) of the outer box 1 is an open structure; the top surface of the outer box body 1 is provided with a steel mesh 2, the steel mesh 2 is provided with a plurality of ball guide holes 3 communicated with the interior of the outer box body 1, and the number, the positions and the arrangement modes of the ball guide holes 3 are the same as those of ball seats on a semiconductor substrate 4 to be planted with balls; the ball planting machine also comprises a movable drawer 5, and the movable drawer 5 can enter and exit the inner part of the outer box body 1 through one open surface in the outer box body 1; when the semiconductor substrate 4 to be ball-planted is placed on the movable drawer 5 and the movable drawer 5 completely enters the inner part of the outer box 1, all the ball guide holes 3 correspond to the ball seats on the semiconductor substrate 4 to be ball-planted in a one-to-one manner; the ball planting machine further comprises an outer box shaking mechanism, the outer box shaking mechanism comprises a positioning rod 6 which extends along the longitudinal width direction of the outer box 1 and is fixed on the outer box 1, and two ends of the positioning rod 6 are respectively pivoted on a bearing seat 7.
Further, in the present embodiment, the lateral length and the longitudinal width of the movable drawer 5 correspond to those of the hollow interior of the outer case 1. Through this setting, can play the positioning action to removing the drawer entering, push the inside of outer box completely when can not continue to impel when removing the drawer, accomplish the location of removing the drawer promptly, the position one-to-one of ball guide hole and the ball seat on the semiconductor substrate of waiting to plant the ball.
In this embodiment, after the movable drawer 5 enters the interior of the outer box 1, the top surface of the semiconductor substrate to be ball-planted is close to the top surface of the interior of the outer box 1, i.e. the bottom surface of the steel net 2.
Further, the top surface of the outer box 1 is provided with a recessed structure 8, and the steel mesh 2 is arranged at the bottom of the recessed structure 8. The steel mesh is arranged at the bottom of the concave structure on the top surface of the outer box body, so that when excessive solder balls are poured onto the steel mesh, the solder balls can roll on the steel mesh at will but cannot roll out of the outer box body.
Further, the ball planting machine further comprises a material tray 9, a plurality of semiconductor substrate fixing grooves 10 are formed in the material tray 9, and when the semiconductor substrates 4 to be planted with balls are placed in the semiconductor substrate fixing grooves 10 and the movable drawer 5 completely enters the outer box body 1, all the ball guide holes 3 correspond to ball seats of the semiconductor substrates 4 to be planted with balls in a one-to-one mode. In this embodiment, 56 semiconductor substrate fixing grooves are formed in the tray, and 56 semiconductor substrates to be mounted with balls can be placed in the tray at one time, so that the mounting of 56 semiconductor substrates can be completed at one time. The specific number of the semiconductor substrate fixing grooves can be set according to actual needs in practical application.
Furthermore, the top surface of the movable drawer 5 is provided with a material tray fixing groove 11, the size of the material tray fixing groove is consistent with that of the material tray 9, and the top surface of the material tray 9 is just positioned on the same horizontal plane with that of the movable drawer 5 after the material tray 9 is fixed in the material tray fixing groove 11.
Further, in this embodiment, the ball planting machine further includes a movable drawer guide mechanism, which is disposed at the bottom of the inside of the outer box 1, and includes a guide rail 12 extending along the longitudinal width direction of the outer box 1, and a slider 13 fixed to the bottom surface of the movable drawer 5 and slidably fitted on the guide rail 12.
In the present embodiment, the number of the guide rails 12 is two.
In this embodiment, the positioning rod 6 penetrates and is fixed to the outer case 1. In addition to this fixing method, other fixing methods such as fixing the positioning rod to the outer bottom of the outer case may be adopted.
Further, a push-pull portion 14 is provided on the front surface of the movable drawer 5. In this embodiment, the push-pull portion is a U-shaped handle, and may also be in other forms such as a handle, which is mainly used to assist in driving the movable drawer to slide in and out.
The working principle of the ball planting machine is as follows:
the semiconductor substrate of ball will be waited to plant is fixed on removing the drawer, then will remove the drawer and push outer box internal portion completely, until can not forward propulsion again, all ball guide holes and the position one-to-one of the ball seat on the semiconductor substrate of waiting to plant the ball this moment, the bottom surface of steel mesh is pressed close to the top surface of the semiconductor substrate of waiting to plant the ball. And pouring excessive solder balls on the steel mesh, shaking the outer box body left and right, and rotating two ends of the positioning rod around the bearing seat. The solder balls roll left and right on the steel mesh along with the left and right shaking of the outer box body, and when passing through the ball guide holes in the steel mesh, the solder balls can fall into the ball seats of the semiconductor substrates to be implanted with the balls at the corresponding positions through the ball guide holes. In this process, an auxiliary tool (such as a broom, cloth, etc.) can be used to sweep back on the steel mesh to speed up the introduction of the solder balls into the ball guide holes.
When the material tray is arranged, the solder balls can be implanted into the plurality of semiconductor substrates at one time, and the mass production of the semiconductor substrates is facilitated.
Various changes and modifications can be made by those skilled in the art based on the above technical solutions and concepts, and all such changes and modifications should be included in the protection scope of the present invention.

Claims (9)

  1. The ball planting machine is characterized by comprising an outer box body (1), wherein the outer box body (1) is hollow, and at least one surface of the outer box body is of an open structure; the top surface of the outer box body (1) is provided with a steel mesh (2), the steel mesh (2) is provided with a plurality of ball guide holes (3) communicated with the interior of the outer box body (1), and the number, the positions and the arrangement modes of the ball guide holes (3) are the same as those of ball seats on a semiconductor substrate (4) to be planted with balls; the ball planting machine also comprises a movable drawer (5), and the movable drawer (5) can enter and exit the inner part of the outer box body (1) through the opened surface in the outer box body (1); when the semiconductor substrate (4) to be subjected to ball planting is placed on the movable drawer (5) and the movable drawer (5) completely enters the outer box body (1), all the ball guide holes (3) correspond to the ball seats on the semiconductor substrate (4) to be subjected to ball planting in a one-to-one mode; the ball planting machine further comprises an outer box shaking mechanism, the outer box shaking mechanism comprises a positioning rod (6) which extends along the longitudinal width direction of the outer box (1) and is fixed on the outer box (1), and two ends of the positioning rod (6) are respectively pivoted on a bearing seat (7).
  2. Ball planting machine according to claim 1, characterized in that the transverse length and the longitudinal width of the movable drawer (5) correspond to the transverse length and the longitudinal width of the hollow interior of the outer box (1).
  3. The ball planting machine according to claim 1, wherein the top surface of the outer box body (1) is provided with a concave structure (8), and the steel mesh (2) is arranged at the bottom of the concave structure (8).
  4. The ball mounting machine according to claim 1, wherein the ball mounting machine further comprises a material tray (9), a plurality of semiconductor substrate fixing grooves (10) are formed in the material tray (9), and when the semiconductor substrates (4) to be mounted with the balls are placed in the semiconductor substrate fixing grooves (10) and the movable drawer (5) completely enters the outer box body (1), all the ball guide holes (3) correspond to the ball seats of the semiconductor substrates (4) to be mounted with the balls in a one-to-one manner.
  5. A ball planting machine according to claim 4, characterized in that the top surface of the movable drawer (5) is provided with a material tray fixing groove (11) which is consistent with the size of the material tray (9), and the top surface of the material tray (9) is just positioned on the same horizontal plane with the top surface of the movable drawer (5) after being fixed on the material tray fixing groove (11).
  6. The ball planting machine according to claim 1, further comprising a movable drawer guide mechanism provided at the bottom of the inside of the outer case (1), including a guide rail (12) extending in the direction of the longitudinal width of the outer case (1), and a slider (13) fixed to the bottom surface of the movable drawer (5) and slidably fitted on the guide rail (12).
  7. A ball planting machine according to claim 6, wherein the number of the guide rails (12) is two.
  8. The ball planting machine according to claim 1, wherein the positioning rod (6) penetrates through and is fixed to the outer box body (1).
  9. Ball planting machine according to claim 1, characterized in that the front of the movable drawer (5) is provided with a push-pull part (14).
CN201980005233.1A 2018-07-12 2019-07-11 Ball planting machine Pending CN111587475A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
HK18109073.1 2018-07-12
HK18109073A HK1248462A2 (en) 2018-07-12 2018-07-12 A ball mounter
PCT/CN2019/095627 WO2020011233A1 (en) 2018-07-12 2019-07-11 Ball mounter

Publications (1)

Publication Number Publication Date
CN111587475A true CN111587475A (en) 2020-08-25

Family

ID=68465562

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980005233.1A Pending CN111587475A (en) 2018-07-12 2019-07-11 Ball planting machine

Country Status (5)

Country Link
KR (1) KR20200054289A (en)
CN (1) CN111587475A (en)
HK (1) HK1248462A2 (en)
RU (1) RU2020114684A (en)
WO (1) WO2020011233A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HK1248462A2 (en) * 2018-07-12 2018-10-12 Newchamp Tech Limited A ball mounter
CN115003055B (en) * 2022-05-25 2023-01-31 哈尔滨理工大学 Electronic component processing equipment
CN115763309A (en) * 2022-11-10 2023-03-07 上海世禹精密机械有限公司 Ball-sucking and ball-missing detection device for ball-planting jig and using method

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH06344132A (en) * 1993-06-10 1994-12-20 Hitachi Ltd Method and device for positioning minute soldering ball
JP3029529U (en) * 1996-03-27 1996-10-01 財団法人工業技術研究院 Automatic planting device for ball grid array substrate
JP3044857U (en) * 1997-06-27 1998-01-16 ファン クアン−シュウ IC element tin ball filling machine
JP2009088574A (en) * 2009-01-29 2009-04-23 Texas Instr Japan Ltd Micro-ball mounting device and mounting method therefor
CN108063103A (en) * 2016-11-08 2018-05-22 竑腾科技股份有限公司 Ball attachment machine directing plate

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Publication number Priority date Publication date Assignee Title
CN201122585Y (en) * 2007-12-03 2008-09-24 唐中卫 Hand-shaking integrated chip embedding ball seat
CN101604618B (en) * 2009-06-09 2011-02-09 上海微松工业自动化有限公司 Ball-planting device of semiconductor packaging equipment
CN204067308U (en) * 2014-08-25 2014-12-31 烽火通信科技股份有限公司 Bga chip plant ball instrument
US9721919B2 (en) * 2015-12-14 2017-08-01 International Business Machines Corporation Solder bumps formed on wafers using preformed solder balls with different compositions and sizes
CN206293416U (en) * 2016-11-22 2017-06-30 南京高喜电子科技有限公司 A kind of BGA ball-planting devices
CN206774503U (en) * 2017-04-02 2017-12-19 厦门芯光润泽科技有限公司 A kind of hand-shaking integrated chip embedding ball seat
HK1248462A2 (en) 2018-07-12 2018-10-12 Newchamp Tech Limited A ball mounter

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06344132A (en) * 1993-06-10 1994-12-20 Hitachi Ltd Method and device for positioning minute soldering ball
JP3029529U (en) * 1996-03-27 1996-10-01 財団法人工業技術研究院 Automatic planting device for ball grid array substrate
JP3044857U (en) * 1997-06-27 1998-01-16 ファン クアン−シュウ IC element tin ball filling machine
JP2009088574A (en) * 2009-01-29 2009-04-23 Texas Instr Japan Ltd Micro-ball mounting device and mounting method therefor
CN108063103A (en) * 2016-11-08 2018-05-22 竑腾科技股份有限公司 Ball attachment machine directing plate

Also Published As

Publication number Publication date
RU2020114684A (en) 2021-10-25
KR20200054289A (en) 2020-05-19
HK1248462A2 (en) 2018-10-12
WO2020011233A1 (en) 2020-01-16

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Application publication date: 20200825