CN216161710U - Integral wafer roll adjustment wafer conveying machine - Google Patents
Integral wafer roll adjustment wafer conveying machine Download PDFInfo
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- CN216161710U CN216161710U CN202121929943.4U CN202121929943U CN216161710U CN 216161710 U CN216161710 U CN 216161710U CN 202121929943 U CN202121929943 U CN 202121929943U CN 216161710 U CN216161710 U CN 216161710U
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Abstract
The utility model relates to an integral wafer distance-adjusting wafer conveying machine, which comprises a machine body, a material pushing assembly, a connecting assembly, a clamping assembly, an adjusting assembly and a conveying assembly, wherein the material pushing assembly is arranged on the machine body; the machine body comprises an upper frame, a discharging table and a lower frame, the material pushing assembly is specifically located in the lower frame, the material pushing assembly corresponds to the discharging table in position, the upper frame is movably connected with the machine body through a carrying assembly, the adjusting assembly is movably connected with the upper frame through a pushing piece, the connecting assembly is connected with the upper frame through an adjusting assembly, the clamping assembly is located on the adjusting assembly, a clamping strip is arranged on the clamping assembly, and a distance adjusting plate is arranged on the adjusting assembly. The integral wafer distance-adjusting wafer conveying machine provided by the utility model reduces the conveying times, improves the working efficiency and saves the production cost.
Description
Technical Field
The utility model relates to the field of wafer conveying machines, in particular to an integral wafer distance-adjusting and conveying machine.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the raw material of the wafer is silicon; wafer transfer machines are devices that handle round wafers during the production process.
The distance between the wafers produced in the previous process in the production process is small, when the wafers are required to be placed on the rear production line, the distance between the wafers in the rear process is large, the wafers are usually 12 inches and thin in thickness, damage is easy to occur in the transmission process, the wafers produced in the previous process need to be carried one by one, the distance between the wafers is adjusted in the process, and the working efficiency is low.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model is: provides an integral wafer distance-adjusting wafer-conveying machine, which solves the problems.
In order to achieve the above purpose, the present invention provides the following technical solutions:
an integral wafer distance-adjusting wafer conveying machine comprises a machine body, a material pushing assembly, a connecting assembly, a clamping assembly, an adjusting assembly and a conveying assembly; the machine body comprises an upper frame, a discharging table and a lower frame, the material pushing assembly is specifically located in the lower frame, the material pushing assembly corresponds to the discharging table in position, the upper frame is movably connected with the machine body through a carrying assembly, the adjusting assembly is movably connected with the upper frame through a pushing piece, the connecting assembly is connected with the upper frame through an adjusting assembly, the clamping assembly is located on the adjusting assembly, a clamping strip is arranged on the clamping assembly, and a distance adjusting plate is arranged on the adjusting assembly.
Furthermore, the clamping assembly is symmetrical relative to the pushing piece, the adjusting assembly comprises a push plate, a moving plate, a connecting strip and a distance adjusting plate, the push plate is connected with the push rod of the pushing piece, and the moving plate is connected with the push plate through a guide mechanism.
Further, guiding mechanism specifically is slide rail set spare, clamping component passes through axle and two connecting strip swing joint, two the motion board is connected through the piece that resets, the roll adjustment board is connected with the push pedal through adapting unit.
Furthermore, clamping component includes a plurality of holding strips, be provided with the chuck on the holding strip, be provided with the guide way on the roll adjustment board, the holding strip leads to pivot and roll adjustment board swing joint.
Furthermore, the chuck is provided with clamping grooves which are V-shaped, the clamping strips are connected with the guide grooves through rotating shafts, the number of the guide grooves is two, and each guide groove in the upper row is positioned in the middle of the upper part of the lower row of the two guide grooves.
Further, the material placing table is provided with a hollow part, the material pushing assembly penetrates through the hollow part, and the connecting assembly comprises a sliding table cylinder, a driving plate and a driven plate.
Furthermore, the pushing assembly corresponds to the clamping assembly in position, the driven plate is connected with the sliding table cylinder through the driving plate, a driving groove is formed in the driven plate, and the driven plate is connected with the moving plate.
Furthermore, the material pushing assemblies are specifically two, the driven plate is symmetrical relative to the sliding table cylinder, and the driving plate is connected with the driving groove through a sliding shaft.
The utility model has the beneficial effects that: the utility model provides an integral wafer roll adjustment passes mascerating machine, uses through organism, material pushing component, coupling assembling, clamping components, adjustment subassembly and transport subassembly mutually supporting, realizes once carrying a plurality of wafers in the handling of wafer, adjusts the effect of the distance between the wafer simultaneously, has reduced the transport number of times, has improved work efficiency, has practiced thrift manufacturing cost.
Drawings
Fig. 1 is an isometric view of the overall structure of an integrated wafer-distance-adjusting wafer-transferring machine of the present invention.
Fig. 2 is an isometric view of a portion of an integrated wafer pitch wafer conveyor of the present invention.
Fig. 3 is an isometric view of another portion of an integrated wafer pitch wafer conveyor of the present invention.
Fig. 4 is a partial front view of an integrated wafer pitch wafer conveyor of the present invention.
FIG. 5 is an isometric view of another portion of an integrated wafer pitch wafer conveyor of the present invention.
FIG. 6 is an isometric view of yet another portion of an integrated wafer pitch wafer transfer machine of the present invention.
Fig. 7 is an isometric view of a portion of a clamping structure of an integrated wafer pitch wafer conveyor of the present invention.
FIG. 8 is a front view of another embodiment of an integrated wafer pitch wafer conveyor of the present invention.
Fig. 9 is a partially enlarged view of a portion a in fig. 7.
In the figure: 1. a body; 2. a lower frame; 3. a material pushing assembly; 4. a discharge table; 41. a hollow-out section; 5. an upper frame; 6. a connecting assembly; 61. a sliding table cylinder; 62. a driving plate; 63. a driven plate; 7. a handling assembly; 8. a clamping assembly; 81. clamping strips; 82. a chuck; 83. a clamping groove; 9. an adjustment assembly; 91. pushing the plate; 92. a connecting strip; 93. a distance adjusting plate; 94. a guide groove; 95. a motion plate; 96. a guide mechanism; 97. a connecting member; 98. a reset member; 10. a pusher member.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1 to 9, an integral wafer distance-adjusting wafer conveying machine includes a machine body 1, a material pushing assembly 3, a connecting assembly 6, a clamping assembly 8, an adjusting assembly 9, and a carrying assembly 7; the machine body 1 comprises an upper frame 5, a material discharging platform 4 and a lower frame 2, the material pushing assembly 3 is specifically positioned in the lower frame 2, used for pushing the wafer box and the receiving box to be close to the clamping component 8, the pushing component 3 corresponds to the discharging platform 4, the upper frame 5 is movably connected with the machine body 1 through a carrying component 7, the adjusting component 9 is movably connected with the upper frame 5 through a pushing component 10, the connecting assembly 6 is connected with the upper frame 5 through an adjusting assembly 9, the clamping assembly 8 is positioned on the adjusting assembly 9, used for clamping the wafer when the adjusting component 9 adjusts the distance of the wafer, the clamping component 8 is provided with a clamping strip 81, used for clamping the wafer, the adjusting component 9 is provided with a distance adjusting plate 93 used for adjusting the distance between the holding strips 81, the machine body 1, the pushing assembly 2, the carrying assembly 7, the connecting assembly 6 and the pushing member 10 are all connected with an external control system.
The clamping assembly 8 is symmetrical about the pushing member 10, the adjusting assembly 9 comprises a push plate 91, a moving plate 95, a connecting strip 92 and a distance adjusting plate 93, the push plate 91 is connected with a push rod of the pushing member 10 and used for providing power for movement of the push plate 91, and the moving plate 95 is connected with the push plate 91 through a guide mechanism 96 and used for ensuring accuracy of a movement path of the moving plate 95.
The clamping assembly 8 comprises a plurality of clamping strips 81 for clamping a plurality of wafers, the clamping strips 81 are provided with clamping heads 82, the distance adjusting plate 93 is provided with a guide groove 94, and the clamping strips 81 are movably connected with the distance adjusting plate 93 through a rotating shaft and used for adjusting the distance between the clamping strips 81 when the clamping strips and the distance adjusting plate produce relative movement.
The chuck 82 is provided with a clamping groove 83 for placing a wafer, the clamping groove 83 is in a V shape, the clamping strip 81 is connected with two guide grooves 94 through a rotating shaft, the two guide grooves 94 are in two rows, and each guide groove 94 of the upper row is positioned in the middle of the upper part of the two guide grooves 94 of the lower row, so that the clamping strip 81 can be normally installed when the clamping strip is large in size and the guide grooves are small in size.
The material placing table 4 is provided with a hollow part 41 for preventing interference with other parts, the material pushing assembly 3 penetrates through the hollow part 41, and the connecting assembly 6 comprises a sliding table cylinder 61, a driving plate 62 and a driven plate 63.
The pushing assembly 3 corresponds to the clamping assembly 8 in position, the driven plate 63 is connected with the sliding table cylinder 61 through the driving plate 62, a driving groove is formed in the driven plate 63, and the driven plate 63 is connected with the moving plate 95 and used for driving the moving plate 95 to move.
The material pushing assembly 3 is specifically provided with two material pushing assemblies, the two material pushing assemblies are used for discharging and receiving materials respectively, the driven plate 63 is symmetrical about the sliding table cylinder 61 and used for ensuring that the two sides of the wafer are stressed uniformly, the driving plate 62 is connected with the driving groove through a sliding shaft and used for ensuring that the driving part 62 can drive the driven plate 63 to move, and then the moving plate 96 and the clamping strips 81 are driven to move, so that the purpose of clamping the wafer is achieved.
The working principle of the utility model is as follows: before the carrying work is started, the wafer conveying machine is connected with a production line; then, the use of a chip conveyor is started: on 25 slice wafer boxes that outside transport mechanism will last section process production carried pushing equipment 3, the wafer box was located fretwork portion 41 department this moment, then began to carry the roll adjustment step, and impeller 10 work drives the wafer box and moves to clamping component 8, and then the wafer box reachs and presss from both sides two upper portions partially between the clamping component 8, then coupling assembling 6 works: the sliding table cylinder 61 drives the moving plate 95 to approach each other through the driving plate 62 and the driven plate 63, the reset part 98 is partially compressed in the process, the clamping groove 83 reaches the lower surface of the wafer in the process, the component 3 is further pushed to drive the wafer box to reset, the wafer box is conveyed to a specified position by an external conveying mechanism, the wafer partially descends to the clamping groove 83 in the process, and the wafer clamping step is completed; then the carrying component 7 starts to work to drive the wafer to move towards the upper part of the other pushing component 3; in the process, the push rod of the pushing piece 10 extends out to drive the push plate 91 to move downwards, in the process, the push plate 91 drives the distance adjusting plate 93 to move downwards through the connecting part 97, in the process, the guide groove 94 on the distance adjusting plate 93 and the clamping strips 81 generate relative motion through the rotating shaft, and in the process, the clamping strips 81 are driven to be away from each other, so that the distance between the wafers on the clamping strips 81 is adjusted, and when the clamping component 8 reaches the position above the other pushing component 3, the distance adjusting step is completed; and the other pushing assembly 3 works to drive the material receiving box on the pushing assembly to move towards the wafer, the wafer with the distance adjusted between the clamping strips 81 is placed in the material receiving box in the process, the connecting assembly 6 is reset to loosen the wafer, then the pushing assembly 10 drives the adjusting assembly 9 to reset, all parts are reset finally, the material receiving box is conveyed to a production line by an external conveying mechanism, and the working procedures are repeated until the work is finished.
The above examples are intended to further illustrate the present invention, but are not intended to limit the utility model to these specific embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be understood to be within the protection scope of the present invention.
Claims (8)
1. An integral wafer roll adjustment wafer conveying machine is characterized in that: comprises a machine body (1), a pushing component (3), a connecting component (6), a clamping component (8), an adjusting component (9) and a carrying component (7); the machine body (1) comprises an upper frame (5), a discharging table (4) and a lower frame (2), wherein the pushing assembly (3) is specifically located in the lower frame (2), the pushing assembly (3) corresponds to the discharging table (4), the upper frame (5) is movably connected with the machine body (1) through a carrying assembly (7), the adjusting assembly (9) is movably connected with the upper frame (5) through a pushing piece (10), the connecting assembly (6) is connected with the upper frame (5) through the adjusting assembly (9), the clamping assembly (8) is located on the adjusting assembly (9), a clamping strip (81) is arranged on the clamping assembly (8), and a distance adjusting plate (93) is arranged on the adjusting assembly (9).
2. An integral wafer pitch wafer conveyor as in claim 1 wherein: the clamping assembly (8) is symmetrical relative to the pushing piece (10), the adjusting assembly (9) comprises a pushing plate (91), a moving plate (95), a connecting strip (92) and a distance adjusting plate (93), the pushing plate (91) is connected with a pushing rod of the pushing piece (10), and the moving plate (95) is connected with the pushing plate (91) through a guide mechanism (96).
3. An integral wafer pitch wafer conveyor as in claim 2 wherein: guiding mechanism (96) specifically are slide rail set spare, clamping assembly (8) are through axle and two connecting strip (92) swing joint, two motion board (95) are connected through piece (98) that resets, roll adjustment board (93) are connected with push pedal (91) through adapting unit (97).
4. An integral wafer pitch wafer conveyor as in claim 1 wherein: the clamping assembly (8) comprises a plurality of clamping strips (81), clamping heads (82) are arranged on the clamping strips (81), guide grooves (94) are formed in the distance adjusting plate (93), and the clamping strips (81) are movably connected with the distance adjusting plate (93) through rotating shafts.
5. An integral wafer pitch wafer conveyor as in claim 4 wherein: the clamping head (82) is provided with clamping grooves (83), the clamping grooves (83) are V-shaped, the clamping strips (81) are connected with guide grooves (94) through rotating shafts, the guide grooves (94) are divided into two rows, and each guide groove (94) in the upper row is located in the middle of the upper portion of the two guide grooves (94) in the lower row.
6. An integral wafer pitch wafer conveyor as in claim 1 wherein: the material placing table is characterized in that a hollow-out portion (41) is arranged on the material placing table (4), the material pushing assembly (3) penetrates through the hollow-out portion (41), and the connecting assembly (6) comprises a sliding table cylinder (61), a driving plate (62) and a driven plate (63).
7. An integral wafer pitch wafer conveyor as in claim 6 wherein: the material pushing assembly (3) corresponds to the clamping assembly (8) in position, the driven plate (63) is connected with the sliding table cylinder (61) through the driving plate (62), the driven plate (63) is provided with a driving groove, and the driven plate (63) is connected with the moving plate (95).
8. An integral wafer pitch wafer conveyor as in claim 7 wherein: the material pushing assembly (3) is specifically provided with two, the driven plate (63) is symmetrical relative to the sliding table cylinder (61), and the driving plate (62) is connected with the driving groove through a sliding shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121929943.4U CN216161710U (en) | 2021-08-18 | 2021-08-18 | Integral wafer roll adjustment wafer conveying machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121929943.4U CN216161710U (en) | 2021-08-18 | 2021-08-18 | Integral wafer roll adjustment wafer conveying machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216161710U true CN216161710U (en) | 2022-04-01 |
Family
ID=80839048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121929943.4U Active CN216161710U (en) | 2021-08-18 | 2021-08-18 | Integral wafer roll adjustment wafer conveying machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216161710U (en) |
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2021
- 2021-08-18 CN CN202121929943.4U patent/CN216161710U/en active Active
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