CN104159407A - High-accuracy small-size reinforcement part attaching method - Google Patents

High-accuracy small-size reinforcement part attaching method Download PDF

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Publication number
CN104159407A
CN104159407A CN201410424638.8A CN201410424638A CN104159407A CN 104159407 A CN104159407 A CN 104159407A CN 201410424638 A CN201410424638 A CN 201410424638A CN 104159407 A CN104159407 A CN 104159407A
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Prior art keywords
reinforcement
glue
raw material
line
support plate
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CN201410424638.8A
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CN104159407B (en
Inventor
王健
邓晓敏
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AKM ELECTRONIC TECHNOLOGY (SUZHOU) Co Ltd
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AKM ELECTRONIC TECHNOLOGY (SUZHOU) Co Ltd
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Publication of CN104159407A publication Critical patent/CN104159407A/en
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Abstract

The invention provides a high-accuracy small-size reinforcement part attaching method. A reinforcement raw material plate is attached to a carrying plate in advance and directly cut by a needed size, and then is aligned with and attached to a product in a positioning hole nail inserting or CCD alignment mode, and finally the reinforcement part is tightly attached to the product through preheating and two times of pressurization. The whole process reduces the difficulty of attaching the small-size reinforcement part, the attaching efficiency is improved, and the position accuracy of the reinforcement part is guaranteed.

Description

A kind of high accuracy small size reinforcement applying method
Technical field
The present invention relates to a kind of reinforcement applying method, particularly a kind of high accuracy small size reinforcement applying method.
Background technology
Reinforcement is widely used in printed circuit board (PCB), and reinforcement has solved the suppleness problem of printed circuit board (PCB), improves the intensity of plugging position, facilitates the overall package of product.Tradition reinforcement is to attach or reinforcement equipment is drawn reinforcement and completed attaching by manual the completing of positioning fixture.For size, be less than 5*5mm reinforcement, it is large that existing reinforcement is carried out difficulty, and efficiency is very low, and fetch inconvenience because size is little, can not guarantee the positional precision of reinforcement.
Summary of the invention
The present invention seeks in order to overcome the deficiencies in the prior art, a kind of high accuracy small size reinforcement applying method is provided, the method makes reinforcement laminating easily, and laminating efficiency is higher.
In order to achieve the above object, the present invention is by the following technical solutions:
A high accuracy small size reinforcement applying method, comprises the steps:
A. prepare a reinforcement raw material plate, comprise the diffusion barrier, reinforcement glue-line and the strengthening course that stack gradually; Described strengthening course is fitted on a support plate, and described reinforcement raw material plate and support plate form reinforcing block;
B. on reinforcing block, delimit the zone of action, beyond the zone of action for removing region; Offer registration holes removing on the reinforcing block in region; Profile along the zone of action is cut to the bottom of reinforcement raw material plate from the top of reinforcement raw material plate;
C. the reinforcement raw material plate that removes region is removed, the diffusion barrier of reinforcement raw material plate on the zone of action is removed;
D. by location borehole jack nail mode or CCD contraposition, reinforcing block is aimed at product, and reinforcement glue-line and the product of reinforcement raw material plate on the zone of action are affixed;
E. the reinforcement glue-line thermoplastic to reinforcement raw material plate on the zone of action, and reinforcing block and product are pressurizeed;
F. peel off support plate;
G. remaining reinforcement raw material plate and product are pressurizeed, and by baking-curing reinforcement glue-line, reinforcement has been fitted.
As preferably, the material of described strengthening course is polyimides, polyester resin, and liquid crystal polymer, PEN, polytetrafluoroethylene is film, FR-1, FR-2, FR-4, pottery, any one in steel disc.
As preferably, the thickness of described strengthening course is 0.01mm-0.3mm; The thickness of described reinforcement glue-line is 0.01mm-0.2mm.
As preferably, in b step, adopt laser equipment or blanking equipment to reinforcing block perforate and cutting.
As preferably, described support plate comprises support plate glue-line and the carrier plate material film stacking gradually, and described strengthening course and substrate glue laminating close.
As preferably, the material of described carrier plate material film is polyimides, polyester resin, and liquid crystal polymer, PEN, polytetrafluoroethylene is any one in film.
As preferably, the thickness of described carrier plate material film is 0.025-0.2mm, and the thickness of described support plate glue-line is 0.01-0.1mm.
As preferably, in f step, adopt and peel off support plate with the mechanical arm of vacuum cups, or peel manually is from support plate.
As preferably, described support plate glue-line to the stickiness of strengthening course lower than reinforcement glue-line the stickiness to product surface
Compared with prior art, the present invention has following beneficial effect:
Reinforcement raw material plate is fitted in and on support plate, forms reinforcing block, then attach with product, realized the mode that jigsaw attaches supporting material, improved production efficiency.By location borehole jack nail mode or CCD contraposition, realize and aiming at, met high-precision requirement, and laminating size to be less than 5*5mm reinforcement also very convenient.By above-mentioned technical characterictic, reduced the difficulty of laminating small size reinforcement, improve laminating efficiency, and guarantee the positional precision of reinforcement.
Accompanying drawing explanation
Fig. 1 is flow process a, the b step schematic diagram of high accuracy small size reinforcement applying method of the present invention;
Fig. 2 is flow process c, d, the e step schematic diagram of high accuracy small size reinforcement applying method of the present invention;
Fig. 3 is flow process f, the g step schematic diagram of high accuracy small size reinforcement applying method of the present invention;
Fig. 4 is the zone of action of high accuracy small size reinforcement applying method of the present invention and the schematic diagram that removes region.
In figure:
11-strengthening course; 12-reinforcement glue-line; 13-diffusion barrier; 21-carrier plate material film; 22-support plate glue-line; 3-product; 4-registration holes.
Now the invention will be further described with specific embodiment by reference to the accompanying drawings.
Embodiment
As shown in Figures 1 to 4, be a kind of high accuracy small size reinforcement applying method of the present invention, in turn include the following steps:
A. prepare a reinforcement raw material plate and a support plate; Reinforcement raw material plate comprises diffusion barrier 13, reinforcement glue-line 12 and the strengthening course 11 stacking gradually; Support plate comprises support plate glue-line 22 and the carrier plate material film 21 stacking gradually; Reinforcement raw material plate and support plate laminating are to stick on support plate glue-line 22 by strengthening course 11, and reinforcement raw material plate and support plate form reinforcing block.
The material of carrier plate material film 21 is polyimides (PI), polyester resin (PET), and liquid crystal polymer (LCP), PEN (PEN), polytetrafluoroethylene (PTFE) is any one in film.
B. the outer surface of diffusion barrier 13 is the top of reinforcement raw material plate, and strengthening course 11 is the bottom of reinforcement raw material plate with the one side that support plate glue-line 22 is pasted.
On reinforcing block, delimit the zone of action (profile of the zone of action is on diffusion barrier 13), beyond the zone of action for removing region; On the reinforcing block in region, offer registration holes 4 removing; Profile along the zone of action is cut to the bottom of reinforcement raw material plate from the top of reinforcement raw material plate.By laser equipment or blanking equipment, reinforcing block is carried out to perforate and cutting.
C. the reinforcement raw material plate that removes region is removed, the diffusion barrier 13 of reinforcement raw material plate on the zone of action is removed.Shown in Fig. 4, A is the zone of action, and B is for removing region.
In the d of Fig. 2, e step and in the f of Fig. 3, g step, A represents CCD para-forms, B representative location borehole jack nail mode.
D. by location borehole jack nail mode or CCD contraposition, reinforcing block is aimed at product 3, and the reinforcement glue-line of reinforcement raw material plate on the zone of action 12 and product 3 are affixed.
E. reinforcement glue-line 12 thermoplastics to reinforcement raw material plate on the zone of action, and reinforcing block and product 3 are pressurizeed.
F. adopt with the mechanical arm of vacuum cups and peel off support plate, or peel manually is from support plate.
G. remaining reinforcement raw material plate and product 3 are pressurizeed, and by baking-curing reinforcement glue-line 12, reinforcement has been fitted.
The mode of described location borehole jack nail mode indication is: on product 3, corresponding registration holes 4 arranges perforate, and registration holes 4 is alignd with perforate, then nail is inserted to registration holes 4 and perforate, realizes product 3 and reinforcing block location.Adopt location borehole jack nail mode to aim at product, need to use special fixture, after having aimed at, product is shifted out from special fixture.
Wherein:
Strengthening course 11 materials are polyimides (PI), polyester resin (PET), liquid crystal polymer (LCP), PEN (PEN), polytetrafluoroethylene (PTFE) is film, FR-1, FR-2, FR-4, pottery, any one in steel disc.
Strengthening course 11 thickness are 0.01mm-0.3mm; Reinforcement bondline thickness is 0.01mm-0.2mm.
The thickness of carrier plate material film 21 is 0.025-0.2mm, and the thickness of support plate glue-line 22 is 0.01-0.1mm.
The advantage of reinforcement applying method of the present invention:
Reinforcement raw material plate and support plate laminating, stick reinforcement to product 3 subsequently again; Allow in reinforcement laminating process, all very convenient to picking and placeing of reinforcing block, and more easily locate and aim at, and then accelerate the speed of whole reinforcement laminating.
Adopt laser cutting, cut quality is good, cutting efficiency is high; During cutting, cutting torch and workpiece are contactless, so can not produce wearing and tearing to reinforcing block, further, the joint-cutting of laser cutting is narrow, are out of shape littlely, generally speaking protect the integrality of whole reinforcing block and protect its performance.The cutting of employing stamping-out, efficiency is high, accurate positioning.
By location borehole jack nail mode or CCD contraposition, realized and being aimed at, aligning accuracy is high and quick, meets high-precision requirement.
Laminating, then preheating pressurization, finally dries laminating, guarantees that the laminating of reinforcement and product 3 is tight, and both are not easily separated.
Reinforcement raw material plate and support plate fitted in advance and directly cut out the size needing, then by location borehole jack nail mode or CCD contraposition, aim at laminating with product 3, finally by preheating and twice pressurization, allowing reinforcement and product 3 fit tightly.Whole flow process has reduced the difficulty of laminating small size reinforcement, improves laminating efficiency, and guarantees the positional precision of reinforcement.
The thickness that strengthening course 11 arranges guarantees reinforcing effect optimization, and reinforcement glue-line 12 thickness guarantee that the combination between strengthening course 11 and product 3 is stable and can not cause adverse effect.
In the present invention, the stickiness of 22 pairs of strengthening courses of support plate glue-line is lower than the stickiness on 12 pairs of product 3 surfaces of reinforcement glue-line, and when peeling off carrier plate material, on product and on strengthening course, can not have cull.In d, e step, in objective circumstances, likely there will be support plate glue-line 22 also to stick on product 3, so the stickiness of 22 pairs of products 3 of support plate glue-line is also lower than the stickiness on 12 pairs of product 3 surfaces of reinforcement glue-line.
Support plate and reinforcement raw material plate do not need contraposition, and positional precision is realized by blanking equipment or laser equipment.
Support plate has played framework effect in the method, and with isolated, small size reinforcement raw material plate becomes as a whole in technique, has avoided the highly difficult processing to small size reinforcement raw material plate.The thickness that carrier plate material film 21 arranges, guarantees it as the steadiness of a framework and can not form and hinder to reinforcement raw material plate, the thickness assurance of support plate glue-line 22 and the stable bond between reinforcement raw material plate.
The present invention is not limited to above-mentioned execution mode, if various changes of the present invention or modification are not departed to the spirit and scope of the present invention, if within these changes and modification belong to claim of the present invention and equivalent technologies scope, the present invention is also intended to comprise these changes and change.

Claims (9)

1. a high accuracy small size reinforcement applying method, is characterized in that, comprises the steps:
A. prepare a reinforcement raw material plate, comprise the diffusion barrier, reinforcement glue-line and the strengthening course that stack gradually; Described strengthening course is fitted on a support plate, and described reinforcement raw material plate and support plate form reinforcing block;
B. on reinforcing block, delimit the zone of action, beyond the zone of action for removing region; Offer registration holes removing on the reinforcing block in region; Profile along the zone of action is cut to the bottom of reinforcement raw material plate from the top of reinforcement raw material plate;
C. the reinforcement raw material plate that removes region is removed, the diffusion barrier of reinforcement raw material plate on the zone of action is removed;
D. by location borehole jack nail mode or CCD contraposition, reinforcing block is aimed at product, and reinforcement glue-line and the product of reinforcement raw material plate on the zone of action are affixed;
E. the reinforcement glue-line thermoplastic to reinforcement raw material plate on the zone of action, and reinforcing block and product are pressurizeed;
F. peel off support plate;
G. remaining reinforcement raw material plate and product are pressurizeed, and by baking-curing reinforcement glue-line, reinforcement has been fitted.
2. high accuracy small size reinforcement applying method according to claim 1, is characterized in that, the material of described strengthening course is polyimides, polyester resin, liquid crystal polymer, PEN, polytetrafluoroethylene is film, FR-1, FR-2, FR-4, pottery, any one in steel disc.
3. high accuracy small size reinforcement applying method according to claim 1 and 2, is characterized in that, the thickness of described strengthening course is 0.01mm-0.3mm; The thickness of described reinforcement glue-line is 0.01mm-0.2mm.
4. high accuracy small size reinforcement applying method according to claim 1, is characterized in that, in b step, adopts laser equipment or blanking equipment to reinforcing block perforate and cutting.
5. high accuracy small size reinforcement applying method according to claim 1, is characterized in that, described support plate comprises support plate glue-line and the carrier plate material film stacking gradually, and described strengthening course and substrate glue laminating close.
6. high accuracy small size reinforcement applying method according to claim 5, is characterized in that, the material of described carrier plate material film is polyimides, polyester resin, and liquid crystal polymer, PEN, polytetrafluoroethylene is any one in film.
7. high accuracy small size reinforcement applying method according to claim 5, is characterized in that, the thickness of described carrier plate material film is 0.025-0.2mm, and the thickness of described support plate glue-line is 0.01-0.1mm.
8. high accuracy small size reinforcement applying method according to claim 1, is characterized in that, in f step, adopt and peel off support plate with the mechanical arm of vacuum cups, or peel manually is from support plate.
9. high accuracy small size reinforcement applying method according to claim 1, is characterized in that, described support plate glue-line to the stickiness of strengthening course lower than reinforcement glue-line the stickiness to product surface.
CN201410424638.8A 2014-08-26 2014-08-26 High-accuracy small-size reinforcement part attaching method Active CN104159407B (en)

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CN104159407B CN104159407B (en) 2017-04-19

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108135072A (en) * 2017-12-07 2018-06-08 江苏联康电子有限公司 A kind of production method of flexible circuit board reinforcement
CN109817101A (en) * 2019-03-25 2019-05-28 云谷(固安)科技有限公司 A kind of Flexible Displays mould group and flexible display screen
CN110536543A (en) * 2019-08-29 2019-12-03 深圳市实锐泰科技有限公司 A kind of flexible board reinforcing chip applying method

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JP2006196831A (en) * 2005-01-17 2006-07-27 Fujikura Ltd Method for producing substrate
WO2007099654A1 (en) * 2006-03-03 2007-09-07 Beac Co., Ltd. Reinforcement plate bonding device, reinforcement plate punch device, cutting device for creating reinforcement plate, flexible substrate, and electronic apparatus
CN101772271A (en) * 2010-02-02 2010-07-07 浙江龙威电子科技有限公司 Method for single-sided lamination reinforcement of flexible printed circuit board
CN102421254A (en) * 2011-08-19 2012-04-18 深南电路有限公司 Method for adhering island adhesive tape to flexible printed circuit
CN102802358A (en) * 2012-08-16 2012-11-28 东莞森玛仕格里菲电路有限公司 Method for bonding circuit board reinforcing patches
CN103517563A (en) * 2013-10-16 2014-01-15 镇江华印电路板有限公司 Flexible printed circuit board reinforcement steel piece pasting method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196831A (en) * 2005-01-17 2006-07-27 Fujikura Ltd Method for producing substrate
WO2007099654A1 (en) * 2006-03-03 2007-09-07 Beac Co., Ltd. Reinforcement plate bonding device, reinforcement plate punch device, cutting device for creating reinforcement plate, flexible substrate, and electronic apparatus
CN101772271A (en) * 2010-02-02 2010-07-07 浙江龙威电子科技有限公司 Method for single-sided lamination reinforcement of flexible printed circuit board
CN102421254A (en) * 2011-08-19 2012-04-18 深南电路有限公司 Method for adhering island adhesive tape to flexible printed circuit
CN102802358A (en) * 2012-08-16 2012-11-28 东莞森玛仕格里菲电路有限公司 Method for bonding circuit board reinforcing patches
CN103517563A (en) * 2013-10-16 2014-01-15 镇江华印电路板有限公司 Flexible printed circuit board reinforcement steel piece pasting method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108135072A (en) * 2017-12-07 2018-06-08 江苏联康电子有限公司 A kind of production method of flexible circuit board reinforcement
CN109817101A (en) * 2019-03-25 2019-05-28 云谷(固安)科技有限公司 A kind of Flexible Displays mould group and flexible display screen
CN110536543A (en) * 2019-08-29 2019-12-03 深圳市实锐泰科技有限公司 A kind of flexible board reinforcing chip applying method
CN110536543B (en) * 2019-08-29 2022-05-10 深圳市实锐泰科技有限公司 Flexible plate reinforcing sheet laminating method

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