CN205812532U - A kind of SMT carrier controlling tin cream thickness - Google Patents
A kind of SMT carrier controlling tin cream thickness Download PDFInfo
- Publication number
- CN205812532U CN205812532U CN201620754796.4U CN201620754796U CN205812532U CN 205812532 U CN205812532 U CN 205812532U CN 201620754796 U CN201620754796 U CN 201620754796U CN 205812532 U CN205812532 U CN 205812532U
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- China
- Prior art keywords
- base plate
- thickness
- cover plate
- plate
- projection
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of SMT carrier controlling tin cream thickness, it is characterized in that: include installing the carrier body of flexible PCB, described carrier body is Split type structure, including base plate and cover plate, described cover plate matches with the outer edge surface of base plate, described flexible PCB is installed between described base plate and cover plate, described base plate and cover plate are that steel plate is made, plural number row's Magnet it is evenly equipped with bottom described base plate, being provided with opening in the middle part of described cover plate, described opening size is less than described flexible circuit board size；Being additionally provided with a projection in the middle part of the end face of described base plate, described opening is just arranged by described projection, and the width of described projection is less than the width of described opening, and described projection thickness is equal with described cover sheet thickness.This utility model improves the crudy of flexible PCB, reduces processing cost, extends the service life of carrier body, it is ensured that the coating thickness of tin cream.
Description
Technical field
This utility model relates to a kind of circuit board processing carrier, particularly relates to a kind of SMT controlling tin cream thickness and carries
Tool.
Background technology
Along with the development of electronic product, its product is light, and thin, high integration is more and more higher, present wiring board PCB thickness from
0.8,0.6,0.4,0.2 is the thinnest, and FPCB has the thickness of 0.1mm or 0.075mm especially, the encapsulation of components and parts
Also it is more and more less, then the mounting technology for ultra-thin wiring board requires it is also more and more higher.
Because ultra-thin wiring board or FPC are attachment when, the equipment that cannot directly go up SMT operates, so needing
First to do a supporting plate, FPC or ultra-thin PCB is attached on supporting plate, just be easy on the equipment of SMT carry out components and parts
Attachment and processing.
Existing FPC pallet majority uses, and medium hard steel plate or other hardboard paste the micro-viscous silica gel material of last layer,
Then FPC is attached on silica gel material, makes stiff board material become the hard base dish of FPC.
But, said structure has the drawback that the access times of silica gel material are low, and stability is bad, this micro-viscous silica gel
After materials'use more than 10 time, viscosity just without, just cannot be further continued for employing, the life-span of a set of carrier is comparatively short, SMT process
Cost increases.
Meanwhile, being limited to the encapsulation of device, the thinnest encapsulation limit of device is all at about 0.3mm, so in technique
Can middle energy effectively control tin cream thickness and the most just determine the thickness of whole electronics module after SMT is completed.
Such as in visual intelligent card industry, or ultra-thin Packaging Industry, for the thickness control of tin cream after the processing of SMT
System is the strictest, therefore, how to solve above-mentioned technical problem, is those skilled in the art directions of needing to make great efforts.
Summary of the invention
This utility model purpose is to provide a kind of SMT carrier controlling tin cream thickness, by using this structure, reduces
Production cost, extends the service life of carrier, it is ensured that the control of components and parts height, the control of tin cream amount.
For reaching above-mentioned purpose, the technical solution adopted in the utility model is: a kind of SMT controlling tin cream thickness carries
Tool, including the carrier body of installation flexible PCB, described carrier body is Split type structure, including base plate and cover plate, described lid
Plate matches with the outer edge surface of base plate, and described flexible PCB is installed between described base plate and cover plate, described base plate and cover plate
Making for steel plate, be evenly equipped with plural number row's Magnet, be provided with opening in the middle part of described cover plate bottom described base plate, described opening size is less than
Described flexible circuit board size；Being additionally provided with a projection in the middle part of the end face of described base plate, described opening is just arranged by described projection, institute
Stating the width width less than described opening of projection, described projection thickness is equal with described cover sheet thickness.
In technique scheme, the edge of described flexible PCB is installed between described cover plate and described base plate, described
The bottom surface, middle part of flexible PCB is butted on the end face of described projection.
In technique scheme, the thickness of described cover plate is 0.06～0.04, and described base plate thickness is 1～2,
Described magnet thickness is 0.3～0.7.
In technique scheme, the bottom of described base plate is evenly equipped with plural number row's groove, and each described Magnet is pasted through glue
In a groove.
In technique scheme, being provided with gap between outer edge surface and the described opening of described projection, described gap width is more than
The thickness of described flexible PCB.
Owing to technique scheme is used, this utility model compared with prior art has the advantage that
1. in this utility model, carrier body uses Split type structure, uses steel plate including base plate and cover plate, base plate and cover plate
Or hard iron plate makes, multiple groove is set bottom cover plate, Magnet is set in each groove, make base plate possess magnetic, logical
Cross and flexible PCB be positioned on base plate, utilize magnet adsorption to live cover plate, flexible PCB is stuck between base plate and cover plate,
And opening is on the cover board set, opening is for pasting components and parts on flexible PCB, compared with conventional structure, improves flexible circuit
Plate yields in the SMT course of processing, extends the service life of carrier body, reduces processing cost；
2. being additionally provided with a projection in this utility model in the middle part of the end face of base plate, described opening is just arranged by described projection,
The width of described projection is less than the width of described opening, by protruding setting, can by the components and parts jack-up of flexible PCB,
It is made to flush with the end face of cover plate, it is simple to the coating of tin cream, it is ensured that the uniformity of components and parts tin cream coating, it is ensured that components and parts height
Qualified, it is ensured that flexible PCB produce qualification rate.
Accompanying drawing explanation
Fig. 1 is the structural representation in this utility model embodiment one.
Wherein: 1, flexible PCB；2, base plate；3, cover plate；4, Magnet；5, opening；6, protruding.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is further described by embodiment:
Embodiment one: shown in Figure 1, a kind of SMT carrier controlling tin cream thickness, including installing flexible PCB 1
Carrier body, described carrier body is Split type structure, including base plate 2 and cover plate 3, the outer edge surface phase of described cover plate 3 and base plate 2
Coupling, described flexible PCB 1 is installed between described base plate 2 and cover plate 3, and described base plate 2 and cover plate 3 are steel plate or hard ferrum
Plate is made, and is evenly equipped with plural number row's Magnet 4, is provided with opening 5 in the middle part of described cover plate 3 bottom described base plate 2, and described opening 5 size is little
In described flexible PCB 1 size.
In the present embodiment, flexible PCB 1 is provided with components and parts and pastes position, and wherein, it is the most corresponding that components and parts paste position
Being arranged at opening part, the edge of described flexible PCB is installed between described cover plate and described base plate, in the process of SMT processing
In, by the opening up track being positioned over SMT process equipment in carrier body, flexible PCB is processed, passes through
Opening carries out components and parts to flexible PCB and pastes.
Wherein, when utilizing the coating that steel mesh carries out tin cream, tin cream to be first filled in opening, is then coated with, steel mesh brush
Tin cream thickness out, in addition it is also necessary to add the thickness of upper cover plate, so can cause tin cream thickness blocked up.Therefore, at described base plate 2
Being additionally provided with a projection 6 in the middle part of end face, described opening 5 is just arranged by described protruding 6, and the described width of protruding 6 is less than described opening 5
Width, described protruding 6 thickness are equal with described cover plate 3 thickness.Therefore, flexible PCB is positioned on base plate, to be coated
The end face of components and parts just to opening, the bottom surface, middle part of described flexible PCB is butted on the end face of described projection.Utilize projection
By the components and parts jack-up of flexible PCB so that it is flush with cover plate end face, during the coating of such tin cream, its coating height just can be below
The thickness of one cover plate of fall, can be effectively ensured the thickness of tin cream, it is ensured that the thickness of components and parts, it is ensured that the processing of flexible PCB is closed
Lattice.
The thickness of described cover plate is 0.06～0.04, and described base plate thickness is 1～2, and described magnet thickness is
0.3～0.7.
The bottom of described base plate 2 is evenly equipped with plural number row's groove, and each described Magnet 4 is in glue is pasted on a groove.
In the present embodiment, base plate and cover plate all use steel plate to make, due to the thickness of base plate, cover plate and flexible PCB
All ratios are relatively thin, therefore, by being installed in the groove bottom base plate by Magnet, make base plate itself to be magnetic by band, pass through magnetic
Suction, after flexible PCB is positioned on base plate, then cover plate is positioned on flexible PCB, by the suction of base plate
Power, is placed on cover plate absorption on flexible PCB, is compressed by flexible PCB, it is ensured that the installation quality of flexible PCB.
Claims (5)
1. the SMT carrier that can control tin cream thickness, it is characterised in that: include the carrier body installing flexible PCB, institute
Stating carrier body is Split type structure, and including base plate and cover plate, described cover plate matches with the outer edge surface of base plate, described flexible circuit
Plate is installed between described base plate and cover plate, and described base plate and cover plate are that steel plate is made, and is evenly equipped with plural number row bottom described base plate
Magnet, is provided with opening in the middle part of described cover plate, described opening size is less than described flexible circuit board size；In the end face of described base plate
Portion is additionally provided with a projection, and described opening is just arranged by described projection, and the width of described projection is less than the width of described opening, described
Projection thickness is equal with described cover sheet thickness.
The SMT carrier controlling tin cream thickness the most according to claim 1, it is characterised in that: described flexible PCB
Edge is installed between described cover plate and described base plate, and the bottom surface, middle part of described flexible PCB is butted on the end face of described projection
On.
The SMT carrier controlling tin cream thickness the most according to claim 1, it is characterised in that: the thickness of described cover plate is
0.06～0.04, described base plate thickness is 1～2, and described magnet thickness is 0.3～0.7.
The SMT carrier controlling tin cream thickness the most according to claim 3, it is characterised in that: the bottom of described base plate is equal
Being furnished with plural number row's groove, each described Magnet is in glue is pasted on a groove.
The SMT carrier controlling tin cream thickness the most according to claim 3, it is characterised in that: the outer edge surface of described projection
And being provided with gap between described opening, described gap width is more than the thickness of described flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620754796.4U CN205812532U (en) | 2016-07-18 | 2016-07-18 | A kind of SMT carrier controlling tin cream thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620754796.4U CN205812532U (en) | 2016-07-18 | 2016-07-18 | A kind of SMT carrier controlling tin cream thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205812532U true CN205812532U (en) | 2016-12-14 |
Family
ID=57507733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620754796.4U Expired - Fee Related CN205812532U (en) | 2016-07-18 | 2016-07-18 | A kind of SMT carrier controlling tin cream thickness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205812532U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901142A (en) * | 2018-08-14 | 2018-11-27 | 奇酷互联网络科技（深圳）有限公司 | A kind of SMT tin feeding device and add tin method |
-
2016
- 2016-07-18 CN CN201620754796.4U patent/CN205812532U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901142A (en) * | 2018-08-14 | 2018-11-27 | 奇酷互联网络科技（深圳）有限公司 | A kind of SMT tin feeding device and add tin method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20170718 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |