CN103456870A - COB light source coated by fluorescent powder glue and manufacturing method thereof - Google Patents
COB light source coated by fluorescent powder glue and manufacturing method thereof Download PDFInfo
- Publication number
- CN103456870A CN103456870A CN2013104115086A CN201310411508A CN103456870A CN 103456870 A CN103456870 A CN 103456870A CN 2013104115086 A CN2013104115086 A CN 2013104115086A CN 201310411508 A CN201310411508 A CN 201310411508A CN 103456870 A CN103456870 A CN 103456870A
- Authority
- CN
- China
- Prior art keywords
- transparent substrates
- light source
- light
- cob light
- silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to an LED light source, in particular to a COB light source coated by fluorescent powder glue and a manufacturing method thereof. The manufacturing method of the COB light source comprises the following steps that A, firstly, light-transmitting substrates are manufactured, and one face of each light-transmitting substrate is coated by the fluorescent powder glue; B, one light-transmitting substrate manufactured in the step A is taken out, and circuits are manufactured on the other face deviated from the face coated by the fluorescent powder glue; C, another light-transmitting substrate manufactured in the step A is taken out, and the another light-transmitting substrate and the light-transmitting substrate manufactured in the step B serve as an upper substrate and a lower substrate of the COB light source to carry out LED packaging, and therefore the COB light source is manufactured. The COB light source is formed by stacking and fixing the upper layer light-transmitting substrate and the lower layer light-transmitting substrate, the lower layer of the upper layer light-transmitting substrate and the lower layer of the lower layer light-transmitting substrate both adhere to fluorescent powder glue layers, a plurality of LED chips are fixedly arranged on the upper layer of the lower layer light-transmitting substrate, the circuits are arranged on the upper layer of the lower layer light-transmitting substrate, and the LED chips and the circuits are welded through bonding of conductive metal wires. The method is used for manufacturing the COB light source simple and reliable in structure and better in heat dissipation, light extraction efficiency, lighting effect and light distribution angle.
Description
Technical field
The present invention relates to LED light source, relate in particular to LED light source and the manufacture method thereof of COB encapsulation.
Background technology
The COB encapsulation is encapsulation technology on direct plate, is a kind of emerging integrated LED encapsulation technology.Along with the rising of LED packaging cost, the low-cost characteristic of this integrated form encapsulation starts to highlight, and has obtained numerous concerns.COB by adhesive glue or scolder by a plurality of LED chips directly and circuit board interconnect, then realizes encapsulating by Bonding.The LED substrate of COB encapsulation is mainly aluminium base and ceramic substrate at present.The former cost is low, but thermal diffusivity is poor, gets light rate, light distribution and can be subject to the surface of the load district specular aluminium of substrate/silver to affect restriction, the latter thermal diffusivity is good, get the light result and affected by the ceramic surface diffuse reflection, get the light rate and the light distribution angle degree all is better than aluminium base, but cost is high.
The application for a patent for invention that publication number is CN102664229A discloses a kind of luminous dipolar object light source structure, but this complex structure comprises transparent substrates, is fixed on LED device and translucent roof plate, printing opacity side plate etc. on transparent substrates.Its transparent substrates, top board comprise both sides slide and the fluorescent adhesive layer be coated with between the two.More than in this light-source structure, slide at least needs the 4-6 piece, fiber-loss is large, optical length, and light extraction efficiency is low, complex process.
Summary of the invention
Weak point for existing LED light source, COB light source and manufacture method thereof that the transparent substrates that the present invention proposes transparent substrates that a kind of phosphor gel applies, apply based on this phosphor gel is realized, can produce simple and reliable for structure, thermal diffusivity, get all COB light sources preferably of light rate, light efficiency and light distribution angle degree (being greater than 240 °).
A kind of manufacture method of COB light source, comprise the steps:
A, first produce one side and have the transparent substrates that phosphor gel applies;
B, get the transparent substrates that the described A step of a slice is made, and on it deviates from the another side of phosphor gel face, makes circuit;
C, get the transparent substrates of the described A step making of a slice and the transparent substrates of described B step making and be used as the upper and lower substrate of this COB light source and carry out the LED encapsulation, thereby produce the COB light source.
Wherein, steps A is to adopt silk-screen printing technique or adopt atomizing spraying technique to produce one side to have the transparent substrates that phosphor gel applies.
Above-mentioned
The preferred realization of silk-screen printing technique is:
A1, make the arrange silk-screen half tone of pattern of array, and the order number of silk-screen half tone is 10 ~ 1000 orders;
A2, configuration fluorescent material sizing material, fluorescent material adopts wherein one or more the mixing of bloom, green powder, rouge and powder;
A3, by the silk-screen half tone of made in ultrawhite float flat glass, steps A 1, scraper, and other operation associated materials, instrument cleaned;
A4, with the silk-screen half tone apart from this plate glass certain distance scraper under certain downforce and scraper speed, make phosphor gel under scraper pushes, evenly be coated on this operation surface of this plate glass from the silk screen through hole;
A5, be cured processing to the phosphor gel of silk-screen on above-mentioned plate glass;
A6, cut the plate glass of above-mentioned making, cuts out independently cell substrate.
Wherein, step B adopts the plasma sputtering method to form the electrode circuit of ITO, or adopt mull technique to attach the electrode circuit of conductive metal sheet, or adopt stencil to adhere to the electrode circuit of conductive metal layer, or adopt vapour deposition method to adhere to the electrode circuit of conductive metal layer.
The preferred realization that above-mentioned plasma sputtering method forms the electrode circuit of ITO is:
B1, have to the one side of made in steps A the transparent substrates that phosphor gel applies and cleaned;
B2, make a plate of covering with the electrode circuit figure that will form;
B3, cover by this another side that deviates from the phosphor gel face that plate is attached at transparent substrates;
B4, adopt the plasma sputtering method that tin indium oxide (ITO) is deposited on this this surface of posting the glass substrate of covering plate;
B5, remove and cover plate, thereby form the ITO electrode circuit on this glass surface of glass substrate.
The preferred realization that above-mentioned mull technique attaches the electrode circuit of conductive metal sheet is:
B1 ', have to the one side of made in steps A the transparent substrates that phosphor gel applies and cleaned;
B2 ' cuts 2 conductive metal sheets as electrode circuit on conductive metal thin plate;
B3 ', be attached to two side positions of the another side that deviates from the phosphor gel face of transparent substrates by these 2 conductive metal sheet bondings, thereby form the electrode circuit of electric metal sheet on this glass surface of glass substrate.
Wherein, step C be the lower transparent substrates that adopts upper transparent substrates that transparent colloid and box dam mode make described A step and described B step to make fix or adopts transparent cured glue directly bonding fix, adopt single super-high-power LED chip or several high-power chips to be connected or more middle low power chips carry out connection in series-parallel LED chip and lower transparent substrates nation are determined.
The preferred realization of above-mentioned step C is:
C1, with the die bond machine, many blue-light LED chips are fixed on to the face that deviates from the phosphor gel face of the lower transparent substrates of described B step making, forming matrix form arranges, multiple chips series connection and in parallel, after LED chip solidifies, with conducting metal silk thread (as spun gold or Si-Al wire) bonding welding LED chip and circuit;
C2, at the glass surface use box dam glue box dam of lower transparent substrates, and solidify;
C3 fills transparent colloid in the box dam district, covers the upper transparent substrates of another sheet, is heating and curing.
Perhaps, the preferred realization of above-mentioned step C is:
C1 ', with the die bond machine, many blue-light LED chips are fixed on to the face that deviates from the phosphor gel face of the lower transparent substrates of described B step making, the multiple chips serial or parallel connection, after LED chip solidifies, with conducting metal silk thread (as spun gold or Si-Al wire) bonding welding LED chip and circuit;
C2 ', at the glass surface use box dam glue box dam of lower transparent substrates, and solidify;
C3 ' fills transparent colloid in the box dam district, covers the upper transparent substrates of another sheet, is heating and curing.
Or the preferred realization of above-mentioned step C is:
C1 ", with the die bond machine, 1 blue-light LED chip is fixed on to the face that deviates from the phosphor gel face of the lower transparent substrates of described B step making, after LED chip solidifies, with conducting metal silk thread (as spun gold or Si-Al wire) bonding welding LED chip and electrode circuit;
C2 ", on lower transparent substrates, be solidified with LED chip above and inject Photosetting glue on periphery surface;
C3 ", cover the upper transparent substrates of another sheet, by ultraviolet light, be cured.
The manufacture method of the transparent substrates that a kind of phosphor gel applies is characterized in that following steps:
A, be mixed into fluorescent material and glue in the mixture of fluorescent material and glue;
B, clean the surface clean of transparent substrates, and, by other surface protection good seals of its non-spraying, be placed in the sealing spray chamber;
C, will send to after the mixture atomization of fluorescent material and glue in the sealing spray chamber;
D, the fog of the mixture of fluorescent material and glue is attached to of this transparent substrates by spraying and treats on operation surface;
E, take out this transparent substrates and carry out solid glue, makes one side and have the transparent substrates that phosphor gel applies.
The manufacture method of the transparent substrates that a kind of phosphor gel applies is characterized in that following steps:
A, the silk-screen half tone of making phosphor gel layer pattern;
B, configuration fluorescent material sizing material;
C, by transparent substrates, silk-screen half tone, scraper, and other operation associated materials, instrument cleaned;
D, the silk-screen half tone, apart from transparent substrates one determining deviation, makes phosphor gel under the scraper extruding, evenly is coated on this operation surface of this plate glass from the silk screen through hole;
E, be cured processing to the phosphor gel of silk-screen on transparent substrates.
Wherein, the preferred realization of steps A is: the order number of silk-screen half tone is selected 50 ~ 400 orders.
Wherein, the preferred realization of step D is: the silk-screen half tone is apart from transparent substrates 1 ~ 5mm, and the scraper downforce is 0.1 ~ 1kg, and scraper speed is 0.1-20cm/s.
The transparent substrates that a kind of phosphor gel applies, is characterized in that, at transparent substrates, wherein on one side, is coated with the fluorescent material glue-line.
A kind of COB light source, comprise: by upper strata transparent substrates, lower floor's transparent substrates, undertaken stacked fixing, the layer of fluorescent powder glue-line all adheres in the lower floor of upper strata, lower floor's transparent substrates, wherein the upper strata of lower floor's transparent substrates is fixed with some LEDs chips, and be provided with circuit, and by conductive wire bonding welding LED chip and circuit.
Wherein, the upper strata of lower floor's transparent substrates, at the outer box dam that is arranged with of LED chip, is perfused with transparent colloid between stacked upper strata, lower floor's transparent substrates, for fixing the two within box dam.
Perhaps, the upper strata of lower floor's transparent substrates on LED chip and periphery be marked with transparent cured glue, this transparent cured glue is arranged between stacked upper strata, lower floor's transparent substrates, for fixing the two.
The manufacture method of the COB light source of realizing based on the phosphor gel coated glass substrates of the present invention, can produce simple and reliable for structure, thermal diffusivity, get all COB light sources preferably of light rate, light efficiency and light distribution angle degree (being greater than 240 °).
The accompanying drawing explanation
Fig. 1 is the structural representation of the plate glass with phosphor gel coating of an embodiment made.
Fig. 2 is the structural representation of the COB light source of an embodiment manufacturing.
Embodiment
The manufacture of COB light source of the present invention mainly comprise 3 large step: A, first produce one side and there is the transparent substrates that phosphor gel applies.B, get the transparent substrates that the described A step of a slice is made, and on it deviates from the another side of phosphor gel face, makes circuit.C, get the transparent substrates of the described A step making of a slice and the transparent substrates of described B step making and be used as the upper and lower substrate of this COB light source and carry out the LED encapsulation, thereby produce COB light source of the present invention.Below in conjunction with the drawings and specific embodiments, come, to top manufacture process, to be elaborated.
The transparent substrates making that the one side of steps A has the phosphor gel coating can adopt silk-screen printing technique or adopt the technique of atomizing spraying to carry out.
Adopt the technique of atomizing spraying to comprise: (1) is mixed into fluorescent material and glue in the mixture of fluorescent material and glue; (2) clean the surface clean of transparent substrates (as glass plate), and, by other surface protection good seals of its non-spraying, be placed in the sealing spray chamber; (3) will after the mixture atomization of fluorescent material and glue, send in the sealing spray chamber; (4) fog of the mixture of fluorescent material and glue is attached to of this transparent substrates by spraying and treats on operation surface; (5) this transparent substrates taken out and carry out solid glue, making one side and there is the transparent substrates that phosphor gel applies.Atomizing spraying technique is compared silk-screen printing technique is more emerging technique, about the detailed process of atomizing spraying, those skilled in the art can consult as publication number 102832329A patent application was disclosed.
Adopt silk-screen printing technique mainly to comprise: to make that silk-screen half tone, transparent substrates carrier surface clean, the fluorescent powder paste material configuration, fluorescent powder paste material is printed on the transparent substrates carrier, solidifies etc.Because silk-screen printing technique is a kind of maturation process, thereby production cost is lower, and the present invention preferably adopts.Below only with the implementation step of a preferred silk screen printing, be further elaborated, but and be not used in the implementation procedure of this steps A of limitation.The execution mode of this steps A specifically comprises:
A1, make 3 * 3 of arrays, the silk-screen half tone of the square pattern of length of side 30mm (abbreviation silk screen).Preferably, the order number of silk-screen half tone is 10 ~ 1000 orders, is more preferably 100 ~ 200 orders.General, for manufacturing efficiency is provided, all can adopt the mode of a plurality of unit sheet splicing in a layout.Certain, the pattern of silk-screen half tone should design according to needs of production, and be not limited to 3 * 3 of above-mentioned arrays, the square of length of side 25mm, as be the circle of diameter 1 ~ 30mm, or the square of the length of side 1 ~ 30mm, or the rectangle of long 10 ~ 50mm, wide ~ 10mm, be single or a plurality of array and arrange;
A2, configuration fluorescent material sizing material.In this embodiment, colloid is adopted as silica gel, and fluorescent material adopts the aluminate bloom, and the mass ratio of fluorescent material and colloid is 1:2.Certain, the colloid material of this fluorescent material sizing material, fluorescent material material and the proportioning of the two should design according to needs of production, and be not limited to this, as the phosphor material powder component can be wherein one or more the mixing of aluminate bloom, Suse green powder, nitride rouge and powder etc., colloid can be silica gel, epoxy resin etc.The mass ratio of fluorescent material and colloid is 1:(0.1 ~ 20);
A3, will be of a size of operation associated materials, the instruments such as the silk-screen half tone of made in 100mm * 100mm ultrawhite float flat glass, A1 and scraper and be cleaned, and preferably adopt plasma cleaning 1 ~ 20 minute.Certain, the ultrawhite float flat glass is because having high transmission rate, therefore the transparent substrates in this embodiment is to take the ultrawhite float flat glass as example, yet actual production can be as required, adopt other transparent substrates to realize, as adopted the light-transmissive resin substrate of the materials such as PMMA, PC;
A4, with the silk-screen half tone, apart from this plate glass 1mm, the scraper downforce is 0.5kg, scraper speed is 0.1cm/s, makes phosphor gel under the scraper extruding, evenly is coated on this operation surface of this plate glass from the silk screen through hole.Certain, each controlled condition of above-mentioned silk-screen operation can be adjusted change according to needs of production, as silk screen apart from plate glass 1 ~ 5mm, scraper downforce 0.1 ~ 1kg, scraper speed 0.1 ~ 20cm/s, and the fluorescent material glue-line of formation different-thickness, as 0.01-0.8mm;
A5, be cured processing to the phosphor gel of silk-screen on above-mentioned plate glass.Curing processing should adopt corresponding curing mode according to the difference of adopted fluorescent material sizing material;
A6, cut the plate glass of above-mentioned making (as shown in Figure 1, the one side of plate glass 101 is coated with 9 foursquare fluorescent material glue-lines 102 of 30mm * 30mm), cuts out the square substrate of 9 30mm * 30mm.
The circuit of step B is made the electrode circuit that can adopt the plasma sputtering method to form ITO, perhaps directly adopt mull technique to attach the electrode circuit of conductive metal sheet, perhaps also can adopt stencil to adhere to the electrode circuit of conductive metal layer, or adopt vapour deposition method to adhere to the electrode circuit of conductive metal layer.
Adopt the plasma sputtering method to form the electrode circuit of ITO, specifically comprise:
B1, preferred, in order to ensure transparent substrates, have than high cleanliness so that the making of circuit can be more firm, before making, need one side to made in steps A to there is the transparent substrates that phosphor gel applies and cleaned.Preferably, this phosphor gel coated glass substrates is carried out to plasma cleaning 2 minutes;
B2, make a plate of covering with the electrode circuit figure that will form.Preferably, design the electrode circuit figure of 2 1mm * 30mm in both sides;
B3, cover by this another side that deviates from the phosphor gel face (without the glass surface of phosphor gel one side) that plate is attached at transparent substrates;
B4, adopt the plasma sputtering method that tin indium oxide (ITO) is deposited on this this surface of posting the glass substrate of covering plate;
B5, remove and cover plate, thereby form the ITO electrode circuit on this glass surface of glass substrate.
Adopt mull technique to attach the electrode circuit of conductive metal sheet, specifically comprise:
B1 ', preferred, in order to ensure transparent substrates, have than high cleanliness so that the making of circuit can be more firm, before making, need one side to made in steps A to there is the transparent substrates that phosphor gel applies and cleaned.Preferably, this phosphor gel coated glass substrates is carried out to plasma cleaning 1 minute;
B2 ', cut or laser cutting is cut 2 5mm * 10mm sheffield plate on silver-plated copper thin slice (or other conductive metal thin plate) by cutter.
B3 ', be attached to two side positions of the another side that deviates from the phosphor gel face (without the glass surface of phosphor gel one side) of transparent substrates by these 2 sheffield plate bondings, thereby form the electrode circuit of electric metal sheet on this glass surface of glass substrate.
The LED encapsulation of step C is made and is mainly comprised, the nation stacked fixing and LED chip and lower transparent substrates of lower transparent substrates is fixed, can adopt: the lower transparent substrates that the upper transparent substrates that transparent colloid+box dam mode is made described A step and described B step are made fix or adopt transparent cured glue directly bonding fix or other modes by upper, lower transparent substrates is fixed, and LED chip and lower transparent substrates nation surely can adopt single super-high-power LED chip or several high-power chips to be connected or more middle low power chips carry out the various ways such as connection in series-parallel (being the array chip layout), bonding wherein, the metal wire of welding can be that spun gold or Si-Al wire or other conduct electricity good conducting metal silk thread.The execution mode of encapsulation of 3 step C of below only take describes as example.
The execution mode one of the encapsulation of step C comprises:
C1, with the die bond machine, 108 0.03W small-power blue-light LED chips are fixed on to the glass surface (deviating from the face phosphor gel face, that be manufactured with circuit) of the lower transparent substrates of described B step making, the matrix form of composition 12 * 9 is arranged, 12 chips series connection, 9 tunnel parallel connections.After LED chip solidifies, with Si-Al wire bonding welding LED chip and electrode circuit;
C2, the glass surface use box dam glue box dam at lower transparent substrates solidifies 1-4 hour under 100-150 ℃;
C3 fills transparent colloid (as transparent silica gel) in the box dam district, covers the upper transparent substrates of another sheet, heats 100-150 ℃ and solidifies in 1 hour.
The execution mode two of the encapsulation of step C comprises:
C1 ', be fixed on 20 high-power blue-light LED chips of 1W with the die bond machine glass surface (deviating from the face phosphor gel face, that be manufactured with circuit) of the lower transparent substrates that described B step makes, and forms 10 * 2 matrix form and arrange, 20 chips series connection.After LED chip solidifies, with gold wire bonding welding LED chip and electrode circuit;
C2 ', the glass surface use box dam glue box dam at lower transparent substrates solidifies 1-4 hour under 100-150 ℃;
C3 ' fills transparent colloid (as transparent silica gel) in the box dam district, covers the upper transparent substrates of another sheet, heats 100-150 ℃ until fully curing.
The execution mode three of the encapsulation of step C comprises:
C1 ", the glass surface that 1 high-power blue-light LED chip of 15W is fixed on to the lower transparent substrates of described B step making with the die bond machine (deviates from the face phosphor gel face, that be manufactured with circuit.After LED chip solidifies, with gold wire bonding welding LED chip and electrode circuit;
C2 ", on lower transparent substrates, be solidified with LED chip above and inject Photosetting glue (as ultra-violet curing glue) by glue-injection machine on peripheral glass surface;
C3 ", cover the upper transparent substrates of another sheet, by ultraviolet light, be cured.
The present invention adopts above-mentioned steps A, B, C can produce simple and reliable for structure, thermal diffusivity, gets all COB light sources preferably of light rate and light distribution angle degree.For example, by above-mentioned steps A 1 ~ A6, B1 ' ~ B3 ', C1 ~ C3, can produce a kind of COB light source as shown in Figure 2, its structure is: mainly by upper strata transparent substrates 201, lower floor's transparent substrates 201 ' is stacked fixing, layer of fluorescent powder glue-line 202 adheres in the lower floor of upper strata transparent substrates 201, layer of fluorescent powder glue-line 202 ' adheres in the lower floor of lower floor's transparent substrates 201 ', wherein the upper strata of lower floor's transparent substrates 201 ' is fixed with some LEDs chips 205, both sides are provided with electrode circuit 204, and by conductive wire 206 bonding welding LED chips 205 and electrode circuit 204, the periphery of LED chip 205 has box dam 203, stacked upper strata transparent substrates 201, be perfused with transparent colloid 207 between lower floor's transparent substrates 201 ' within box dam 203, for fixing the two.Certain, if adopt the step B of different circuit making and the step C of encapsulation, the structure of the COB light source of manufacturing can be slightly different, as adopt step C1 " ~ C3 ", the periphery of LED chip must not possess the box dam part, be the upper strata of lower floor's transparent substrates 201 ' on LED chip 205 and periphery be marked with transparent Photosetting glue, this transparent cured glue is arranged between stacked upper strata, lower floor's transparent substrates 201,201 ', for fixing the two, other same sections no longer describe in detail in this.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (10)
1. the manufacture method of a COB light source, is characterized in that, comprises the steps:
A, first produce one side and have the transparent substrates that phosphor gel applies;
B, get the transparent substrates that the described A step of a slice is made, and on it deviates from the another side of phosphor gel face, makes circuit;
C, get the transparent substrates of the described A step making of a slice and the transparent substrates of described B step making and be used as the upper and lower substrate of this COB light source and carry out the LED encapsulation, thereby produce the COB light source.
2. the manufacture method of COB light source according to claim 1, is characterized in that, steps A is to adopt silk-screen printing technique to produce one side to have the transparent substrates that phosphor gel applies.
3. the manufacture method of COB light source according to claim 2, is characterized in that, the preferred realization of silk-screen printing technique is:
A1, make the arrange silk-screen half tone of pattern of array, and the order number of silk-screen half tone is 10 ~ 1000 orders;
A2, configuration fluorescent material sizing material, fluorescent material adopts wherein one or more the mixing of bloom, green powder, rouge and powder;
A3, by the silk-screen half tone of made in ultrawhite float flat glass, steps A 1, scraper, and other operation associated materials, instrument cleaned;
A4, with the silk-screen half tone apart from this plate glass certain distance scraper under certain downforce and scraper speed, make phosphor gel under scraper pushes, evenly be coated on this operation surface of this plate glass from the silk screen through hole;
A5, be cured processing to the phosphor gel of silk-screen on above-mentioned plate glass;
A6, cut the plate glass of above-mentioned making, cuts out independently cell substrate.
4. the manufacture method of COB light source according to claim 1, is characterized in that, steps A is to adopt atomizing spraying technique to produce one side to have the transparent substrates that phosphor gel applies.
5. the manufacture method of COB light source according to claim 1, is characterized in that, step B adopts the plasma sputtering method to form the electrode circuit of ITO, is somebody's turn to do
The preferred realization that the plasma sputtering method forms the electrode circuit of ITO is:
B1, have to the one side of made in steps A the transparent substrates that phosphor gel applies and cleaned;
B2, make a plate of covering with the electrode circuit figure that will form;
B3, cover by this another side that deviates from the phosphor gel face that plate is attached at transparent substrates;
B4, adopt the plasma sputtering method that tin indium oxide (ITO) is deposited on this this surface of posting the glass substrate of covering plate;
B5, remove and cover plate, thereby form the ITO electrode circuit on this glass surface of glass substrate.
6. the manufacture method of COB light source according to claim 1, it is characterized in that, step B adopts mull technique to attach the electrode circuit of conductive metal sheet, or adopts stencil to adhere to the electrode circuit of conductive metal layer, or adopts vapour deposition method to adhere to the electrode circuit of conductive metal layer.
7. the manufacture method of COB light source according to claim 1, it is characterized in that, step C be the lower transparent substrates that adopts upper transparent substrates that transparent colloid and box dam mode make described A step and described B step to make fix or adopts transparent cured glue directly bonding fix, adopt single super-high-power LED chip or several high-power chips to be connected or more middle low power chips carry out connection in series-parallel LED chip and lower transparent substrates nation are determined.
8. the manufacture method of COB light source according to claim 7, is characterized in that, the preferred realization of step C is:
C1, with the die bond machine, many blue-light LED chips are fixed on to the face that deviates from the phosphor gel face of the lower transparent substrates of described B step making, form matrix form and arrange, multiple chips series connection and/or in parallel, after LED chip solidifies, with conducting metal silk thread bonding welding LED chip and circuit;
C2, at the glass surface use box dam glue box dam of lower transparent substrates, and solidify;
C3 fills transparent colloid in the box dam district, covers the upper transparent substrates of another sheet, is heating and curing.
9. the manufacture method of COB light source according to claim 7, is characterized in that, the preferred realization of step C is:
C1 ', be fixed on 1 blue-light LED chip with the die bond machine face that deviates from the phosphor gel face of the lower transparent substrates of described B step making, after LED chip solidifies, with spun gold or Si-Al wire bonding welding LED chip and electrode circuit;
C2 ', on lower transparent substrates, be solidified with LED chip above and inject Photosetting glue on periphery surface;
C3 ', cover the upper transparent substrates of another sheet, by ultraviolet light, is cured.
10. a COB light source, it is characterized in that, comprise: by upper strata transparent substrates, lower floor's transparent substrates, undertaken stacked fixing, the layer of fluorescent powder glue-line all adheres in the lower floor of upper strata, lower floor's transparent substrates, wherein the upper strata of lower floor's transparent substrates is fixed with some LEDs chips, and be provided with circuit, and by conductive wire bonding welding LED chip and circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310411508.6A CN103456870B (en) | 2013-09-11 | 2013-09-11 | The COB light source of phosphor gel coating and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310411508.6A CN103456870B (en) | 2013-09-11 | 2013-09-11 | The COB light source of phosphor gel coating and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103456870A true CN103456870A (en) | 2013-12-18 |
| CN103456870B CN103456870B (en) | 2016-06-01 |
Family
ID=49739030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310411508.6A Active CN103456870B (en) | 2013-09-11 | 2013-09-11 | The COB light source of phosphor gel coating and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103456870B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022213A (en) * | 2014-04-11 | 2014-09-03 | 深圳市迈克光电子科技有限公司 | Remote phosphor COB integrated light source and preparation method thereof |
| CN104600180A (en) * | 2015-01-23 | 2015-05-06 | 张国生 | LED printed circuit board having fluorescence converting function and manufacturing method thereof |
| CN106129227A (en) * | 2016-09-26 | 2016-11-16 | 麦科勒（滁州）新材料科技有限公司 | A kind of fluorescent material that wraps up is in LED flip chip upper surface and the method on top layer, side |
| CN108594531A (en) * | 2018-05-24 | 2018-09-28 | 扬州中科半导体照明有限公司 | A kind of liquid crystal display backlight module and production method |
| CN109013227A (en) * | 2017-06-11 | 2018-12-18 | 深圳市虎成科技有限公司 | A kind of the heat-conducting glue smearing method and smearing screen frame of UVLED light source |
| CN110021694A (en) * | 2019-04-01 | 2019-07-16 | 深圳市华星光电半导体显示技术有限公司 | Backlight module and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159070B (en) * | 2016-08-26 | 2019-01-15 | 曾广祥 | A kind of highly dense display screen unit panel and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034473A (en) * | 2006-07-26 | 2008-02-14 | Toyoda Gosei Co Ltd | Surface light source |
| JP2010073592A (en) * | 2008-09-22 | 2010-04-02 | Toshiba Lighting & Technology Corp | Lighting system |
| CN101846256A (en) * | 2010-05-04 | 2010-09-29 | 蔡州 | Led light source |
| CN202712266U (en) * | 2012-05-21 | 2013-01-30 | 苏州晶品光电科技有限公司 | Fluorescent transparent ceramic LED sealing structure |
| CN202758885U (en) * | 2012-06-21 | 2013-02-27 | 东莞李洲电子科技有限公司 | Light emitting diode module packaging structure |
| CN203118987U (en) * | 2013-01-25 | 2013-08-07 | 廖旭文 | Double-sided luminous LED lamp panel structure |
-
2013
- 2013-09-11 CN CN201310411508.6A patent/CN103456870B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034473A (en) * | 2006-07-26 | 2008-02-14 | Toyoda Gosei Co Ltd | Surface light source |
| JP2010073592A (en) * | 2008-09-22 | 2010-04-02 | Toshiba Lighting & Technology Corp | Lighting system |
| CN101846256A (en) * | 2010-05-04 | 2010-09-29 | 蔡州 | Led light source |
| CN202712266U (en) * | 2012-05-21 | 2013-01-30 | 苏州晶品光电科技有限公司 | Fluorescent transparent ceramic LED sealing structure |
| CN202758885U (en) * | 2012-06-21 | 2013-02-27 | 东莞李洲电子科技有限公司 | Light emitting diode module packaging structure |
| CN203118987U (en) * | 2013-01-25 | 2013-08-07 | 廖旭文 | Double-sided luminous LED lamp panel structure |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022213A (en) * | 2014-04-11 | 2014-09-03 | 深圳市迈克光电子科技有限公司 | Remote phosphor COB integrated light source and preparation method thereof |
| CN104600180A (en) * | 2015-01-23 | 2015-05-06 | 张国生 | LED printed circuit board having fluorescence converting function and manufacturing method thereof |
| CN106129227A (en) * | 2016-09-26 | 2016-11-16 | 麦科勒（滁州）新材料科技有限公司 | A kind of fluorescent material that wraps up is in LED flip chip upper surface and the method on top layer, side |
| CN109013227A (en) * | 2017-06-11 | 2018-12-18 | 深圳市虎成科技有限公司 | A kind of the heat-conducting glue smearing method and smearing screen frame of UVLED light source |
| CN108594531A (en) * | 2018-05-24 | 2018-09-28 | 扬州中科半导体照明有限公司 | A kind of liquid crystal display backlight module and production method |
| CN110021694A (en) * | 2019-04-01 | 2019-07-16 | 深圳市华星光电半导体显示技术有限公司 | Backlight module and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103456870B (en) | 2016-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103456870A (en) | COB light source coated by fluorescent powder glue and manufacturing method thereof | |
| CN104282819B (en) | Flip-over type LED encapsulation module and its manufacturing method | |
| CN103972369B (en) | LED (Light Emitting Diode) lamp bar and manufacturing method thereof | |
| CN109817769B (en) | Novel LED chip packaging manufacturing method | |
| TW200922430A (en) | Flexible circuit | |
| CN103872227B (en) | The manufacture method of a kind of 360 degree of luminous LED filament light sources | |
| CN102709281A (en) | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source | |
| JP6107060B2 (en) | Method for manufacturing light emitting device | |
| CN102709278A (en) | Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film | |
| CN102903705B (en) | Light emitting diode packaging structure and manufacturing method thereof | |
| CN103367599A (en) | Manufacturing method of light emitting diode packaging structure | |
| CN102691921A (en) | Light-emitting diode light bar and method for manufacturing same | |
| CN102683555A (en) | Packaging structure and packaging method for light-emitting diode | |
| CN101707234A (en) | LED luminescence module and manufacture method thereof | |
| CN105870297A (en) | LED light source and packaging method thereof | |
| CN107681041A (en) | A kind of LED car lamp method for packing | |
| CN105870298A (en) | Packaging method of LED light source | |
| CN114023777B (en) | Circuit board assembly, light-emitting assembly and manufacturing method thereof | |
| TW201327934A (en) | Method for manufacturing LED package and phosphor film thereof | |
| CN202796951U (en) | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source | |
| TWI393274B (en) | Light emitting diode package and method for manufacturing same | |
| CN102855825B (en) | Linear array and digital combined light-emitting diode (LED) display process | |
| CN105757467A (en) | LED light-emitting lamp bar as well as LED filament bulb lamp and LED lamp tube using same | |
| CN201927604U (en) | LED (light-emitting diode) light source | |
| CN104300067A (en) | A flexible LED package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: Xiamen Hualian electronic Limited by Share Ltd Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: Xiamen Hualian Electronics Co., Ltd. |