CN102522478A - Light-emitting diode module and support thereof - Google Patents
Light-emitting diode module and support thereof Download PDFInfo
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- CN102522478A CN102522478A CN201110439617XA CN201110439617A CN102522478A CN 102522478 A CN102522478 A CN 102522478A CN 201110439617X A CN201110439617X A CN 201110439617XA CN 201110439617 A CN201110439617 A CN 201110439617A CN 102522478 A CN102522478 A CN 102522478A
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- emitting diode
- light
- diode module
- support
- light emitting
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Abstract
The invention relates to a light-emitting diode module, which comprises a support and a plurality of light-emitting diode chips. The support comprises a plurality of strip metal substrates which are sequentially arranged at intervals in the width direction. A plurality of reflection cups stretching across each two adjacent metal substrates are formed on the adjacent metal substrates, and each two adjacent metal substrates are partially positioned in each reflection cup stretching across the substrates to form two electrodes. Each light-emitting diode chip is contained in one reflection cup and electrically connected with the two electrodes of the corresponding reflection cup. The light-emitting diode module is provided with the support same in size and shape as the light-emitting diode module, the requirements of clients on different dimensions of the light-emitting diode module in different places can be met by means of subsequent optional cutting, and the light-emitting diode module has high universality.
Description
Technical field
The present invention relates to a kind of semiconductor light-emitting elements, relate in particular to a kind of light emitting diode module and support thereof.
Background technology
At present, light-emitting diode (Light Emitting Diode, LED) low in energy consumption because of having, the life-span is long, volume is little and characteristic such as brightness height has been widely applied to a lot of fields.
Existing light emitting diode module encapsulating structure is made up of one or more reflector mostly; Reflector on one of them module can not be disassembled; Just can only produce a kind of module of profile after a module support is decided, this kind way versatility is very poor, can not satisfy the requirement of client's differentiation.
Summary of the invention
In view of this, be necessary to provide a kind of light emitting diode module and support thereof, to solve the existing relatively poor technical problem of light emitting diode module versatility.
A kind of support of light emitting diode module; It comprises the metal substrate of a plurality of strips; Said a plurality of strip metal substrate is along being spaced successively on the strip metal substrate width direction; Be formed with a plurality of reflectors on said per two adjacent metal substrates across said two adjacent metal substrates, said any two adjacent metal substrates all have a part be positioned at each across on it reflector to constitute two electrodes.
And, a kind of light emitting diode module, it comprises said support and is placed in a plurality of light-emitting diode chip for backlight unit in a plurality of reflectors of said support, said each light-emitting diode chip for backlight unit is connected with two electrode electricity in said each reflector.
In the said light emitting diode module; The both positive and negative polarity that connects power supply through the metal substrate for a plurality of strips in its support successively at interval promptly can be the light-emitting diode chip for backlight unit energising in the whole light emitting diode module; And phenomenons such as short circuit can not occur, therefore, said light emitting diode module cuts into arbitrarily that phenomenons such as short circuit all can not appear in profile and size; So; Said light emitting diode module adopts the support of size of the same race and profile, and can satisfy the requirement of different occasion clients to light emitting diode module different size specification through follow-up any cutting, thereby can solve the existing relatively poor technical problem of light emitting diode module versatility.
Description of drawings
Below in conjunction with accompanying drawing embodiments of the invention are described, wherein:
Fig. 1 is the vertical view of a kind of light emitting diode module of providing of the embodiment of the invention;
Fig. 2 is the cutaway view of a kind of single package structure for LED in the light emitting diode module among Fig. 1;
Fig. 3 is the cutaway view before the light-emitting diode chip for backlight unit that is sticked of the package structure for LED among Fig. 2;
Fig. 4 is the vertical view before the light-emitting diode chip for backlight unit that is sticked of the package structure for LED among Fig. 2;
Fig. 5 is the upward view before the light-emitting diode chip for backlight unit that is sticked of the package structure for LED among Fig. 2; And
Fig. 6 is the cutaway view of another kind of single package structure for LED in the light emitting diode module among Fig. 1.
Embodiment
Below based on accompanying drawing specific embodiment of the present invention is further elaborated.Should be appreciated that specific embodiment described herein as just embodiment, and be not used in qualification protection scope of the present invention.
See also Fig. 1 and Fig. 2, a kind of light emitting diode module 100 that the embodiment of the invention provides comprises support 10, a plurality of light-emitting diode chip for backlight unit 20 and is used to cover the packaging body 30 of said light-emitting diode chip for backlight unit 20.Said light emitting diode module 100 can be applicable in light-emitting diode bulb lamp, light-emitting diode lamp tube, light-emitting diode Down lamp, light-emitting diode projecting lamp and the light emitting diode road lamp etc.
Said support 10 comprises metal substrate 11 and numerous reflector 12 of a plurality of strips.Said a plurality of strip metal substrate 11 keeps having certain clearance between per two adjacent strip metal substrates 11 along being spaced successively on the Width of strip metal substrate 11.Preferably, said a plurality of strip metal substrate 11 is arranged along the Width equal intervals of strip metal substrate 11.Be formed with a plurality of reflectors 12 on said per two adjacent metal substrates 11 across said two adjacent metal substrates 11; As shown in Figure 2, said any two adjacent metal substrates 11 all have a part be positioned at each across on it reflector 12 to constitute two electrodes 111.Said metal substrate 11 can form through punching press, thereby can improve the production efficiency of metal substrate 11 greatly.Preferably, also be electroplate with one deck bright metal on the said metal substrate 11, to improve the reflectivity of metal substrate 11 surfaces to light.Preferably, said bright metal is a silver.
Please continue to consult Fig. 2, be equipped with a light-emitting diode chip for backlight unit 20 in said each reflector 12, said packaging body 30 is filled in the said reflector 12 and covers said light-emitting diode chip for backlight unit 20.Said each reflector 12, two electrodes 111 that are positioned at this reflector 12, the light-emitting diode chip for backlight unit 20 that is positioned at this reflector 12 and packaging body 30 are formed single package structure for LED.Said light-emitting diode chip for backlight unit 20 can be electrically connected through modes such as routings with two electrodes 111 in the reflector 12, and said light-emitting diode chip for backlight unit 20 can be fixed in the said reflector 12 through crystal-bonding adhesive.In the present embodiment; Said light-emitting diode chip for backlight unit 20 is sticked on one of two electrodes 111 in said reflector 12; Because electrode 111 generally has good heat conductivility; Through said light-emitting diode chip for backlight unit 20 is arranged on the said electrode 111, can improve the radiating efficiency of light-emitting diode chip for backlight unit 20 greatly.Light-emitting diode chip for backlight unit described in Fig. 2 20 is the horizontal structure light-emitting diode chip for backlight unit; Two electrodes on it are positioned at the same side; Promptly all be positioned on the surface of light-emitting diode chip for backlight unit 20 away from electrode 111, and be electrically connected respectively with two electrodes 111 through two bonding lines 21 respectively.
See also Fig. 6; Light-emitting diode chip for backlight unit 20 in the said reflector 12 is the light emitting diode with vertical structure chip; Two electrodes on it are positioned at its both sides; Promptly lay respectively at light-emitting diode chip for backlight unit 20 on the surface and surface of electrode 111 away from electrode 111; Its electrode towards the surface of electrode 111 that is positioned at of said light-emitting diode chip for backlight unit 20 directly contacts with an electrode 111, and its surperficial top electrode away from electrode 111 that is positioned at of said light-emitting diode chip for backlight unit 20 is electrically connected through a bonding line 21 with another electrode 111.
Said packaging body 30 is filled in the said reflector 12, and covering luminousing diode chip 20, thereby can protect light-emitting diode chip for backlight unit 20, prevents that light-emitting diode chip for backlight unit 20 from receiving pollutions such as steam, dust.In the present embodiment, further be doped with fluorescent material in the said packaging body 30, the fluorescent material in the said packaging body 30 can be according to the different photochromic requirement configurations of its corresponding single package structure for LED.
Said light emitting diode module 100 during fabrication; Can be at first needing crystal-bonding adhesive on the location point of fixing light-emitting diode chip for backlight unit 20 on the full wafer support 10; After intact light-emitting diode chip for backlight unit 20 is placed the crystal-bonding adhesive top; After baking treated that crystal-bonding adhesive solidifies, solder bonds line 21 was welded on the both positive and negative polarity of light-emitting diode chip for backlight unit 20 respectively on two electrodes 111 in the reflector 12; The encapsulated layer 30 that is doped with fluorescent material is disposed in photochromic requirement according to difference then; Encapsulated layer 30 is coated on the light-emitting diode chip for backlight unit 20, baking, layer 30 baking finishing to be packaged back cuts into full wafer light emitting diode module 100 according to different requirement the light emitting diode module module of different size profile.
In the said light emitting diode module 100; The both positive and negative polarity that connects power supply through the metal substrate 11 for a plurality of strips in its support 10 successively at interval promptly can be light-emitting diode chip for backlight unit 20 energisings in the whole light emitting diode module 100; And phenomenons such as short circuit can not appear; Therefore; Said light emitting diode module 100 cuts into arbitrarily that phenomenons such as short circuit all can not appear in profile and size, and so, said light emitting diode module 100 adopts the support of sizes of the same race and profile; And can satisfy the requirement of different occasion clients, thereby can solve the existing relatively poor technical problem of light emitting diode module versatility to light emitting diode module different size specification through follow-up any cutting.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the support of a light emitting diode module; It is characterized in that; The metal substrate that comprises a plurality of strips; Said a plurality of strip metal substrate is formed with a plurality of reflectors across said two adjacent metal substrates along being spaced successively on the strip metal substrate width direction on said per two adjacent metal substrates, said any two adjacent metal substrates all have a part be positioned at each across on it reflector to constitute two electrodes.
2. the support of light emitting diode module as claimed in claim 1 is characterized in that, the reflector on the support of said light emitting diode module is according to rectangular arrangement.
3. the support of light emitting diode module as claimed in claim 1 is characterized in that, the reflector on the support of said light emitting diode module is to form through injection molding way.
4. the support of light emitting diode module as claimed in claim 1 is characterized in that, said metal substrate is to form through punching press.
5. the support of light emitting diode module as claimed in claim 1 is characterized in that, also is electroplate with one deck bright metal on the said metal substrate.
6. the support of light emitting diode module as claimed in claim 5 is characterized in that, said bright metal is a silver.
7. the support of light emitting diode module as claimed in claim 1 is characterized in that, is provided with insulating tape between two electrodes in said each reflector, and said insulating tape and said reflector are structure as a whole.
8. the support of light emitting diode module as claimed in claim 7 is characterized in that, said two gaps between electrodes are curved.
9. light emitting diode module; It comprises like each described support of claim 1-8 and is placed in a plurality of light-emitting diode chip for backlight unit in a plurality of reflectors of said support, and said each light-emitting diode chip for backlight unit is connected with two electrode electricity in said each reflector.
10. light emitting diode module as claimed in claim 9 is characterized in that, all is formed with packaging body in said each reflector, and said packaging body covers the light-emitting diode chip for backlight unit that is positioned at reflector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110439617XA CN102522478A (en) | 2011-12-23 | 2011-12-23 | Light-emitting diode module and support thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110439617XA CN102522478A (en) | 2011-12-23 | 2011-12-23 | Light-emitting diode module and support thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102522478A true CN102522478A (en) | 2012-06-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110439617XA Pending CN102522478A (en) | 2011-12-23 | 2011-12-23 | Light-emitting diode module and support thereof |
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| Country | Link |
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| CN (1) | CN102522478A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820407A (en) * | 2012-07-25 | 2012-12-12 | 深圳市中庆微科技开发有限公司 | Bracket and LED (light emitting diode) lamp and module thereof |
| CN102856315A (en) * | 2012-09-22 | 2013-01-02 | 歌尔声学股份有限公司 | Light-emitting diode device |
| WO2014056235A1 (en) * | 2012-10-10 | 2014-04-17 | 深圳市华星光电技术有限公司 | Direct-type backlight module structure |
| CN105990494A (en) * | 2015-02-17 | 2016-10-05 | 黄秀璋 | Flip-chip type light emitting diode and fabrication method thereof |
| CN107438905A (en) * | 2015-03-18 | 2017-12-05 | Lg伊诺特有限公司 | Light-emitting device array and the illuminator comprising the light-emitting device array |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201787386U (en) * | 2010-08-19 | 2011-04-06 | 苏州科医世凯半导体技术有限责任公司 | Metal substrate LED module for illumination |
| CN102135244A (en) * | 2010-01-25 | 2011-07-27 | 亚世达科技股份有限公司 | Multi-light emitting diode light source lamp |
| US20110292302A1 (en) * | 2010-04-30 | 2011-12-01 | Samsung Led Co., Ltd. | Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus |
-
2011
- 2011-12-23 CN CN201110439617XA patent/CN102522478A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102135244A (en) * | 2010-01-25 | 2011-07-27 | 亚世达科技股份有限公司 | Multi-light emitting diode light source lamp |
| US20110292302A1 (en) * | 2010-04-30 | 2011-12-01 | Samsung Led Co., Ltd. | Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus |
| CN201787386U (en) * | 2010-08-19 | 2011-04-06 | 苏州科医世凯半导体技术有限责任公司 | Metal substrate LED module for illumination |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820407A (en) * | 2012-07-25 | 2012-12-12 | 深圳市中庆微科技开发有限公司 | Bracket and LED (light emitting diode) lamp and module thereof |
| CN102820407B (en) * | 2012-07-25 | 2016-06-01 | 深圳市中庆微科技开发有限公司 | A kind of support and LED and module thereof |
| CN102856315A (en) * | 2012-09-22 | 2013-01-02 | 歌尔声学股份有限公司 | Light-emitting diode device |
| WO2014056235A1 (en) * | 2012-10-10 | 2014-04-17 | 深圳市华星光电技术有限公司 | Direct-type backlight module structure |
| CN105990494A (en) * | 2015-02-17 | 2016-10-05 | 黄秀璋 | Flip-chip type light emitting diode and fabrication method thereof |
| CN107438905A (en) * | 2015-03-18 | 2017-12-05 | Lg伊诺特有限公司 | Light-emitting device array and the illuminator comprising the light-emitting device array |
| CN107438905B (en) * | 2015-03-18 | 2020-07-10 | Lg伊诺特有限公司 | Light emitting device array and lighting system including the same |
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Application publication date: 20120627 |