CN102135244A - Multi-light emitting diode light source lamp - Google Patents
Multi-light emitting diode light source lamp Download PDFInfo
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- CN102135244A CN102135244A CN2010101053690A CN201010105369A CN102135244A CN 102135244 A CN102135244 A CN 102135244A CN 2010101053690 A CN2010101053690 A CN 2010101053690A CN 201010105369 A CN201010105369 A CN 201010105369A CN 102135244 A CN102135244 A CN 102135244A
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Abstract
The invention relates to a multi-light emitting diode light source lamp. The lamp comprises a metal guide plate and a plurality of light-emitting diode assemblies; the metal guide plate consists of a plurality of plate bodies; a gap is reserved between any two adjacent plate bodies to separate the substantial contact between the adjacent plate bodies; the light-emitting diode assemblies are arranged in the gaps respectively; each light-emitting diode assembly is electrically connected with the plate bodies on the two sides of the light-emitting diode assembly; and the light-emitting diode assemblies are electrically connected in series and in parallel through the plate bodies on the two sides of the light-emitting diode assemblies.
Description
Technical field
The invention relates to a kind of LED light lamp spare, particularly relevant for a kind of multiple optical diode illuminator spare.
Background technology
At present, (Light Emitting Diode LED), can be divided into vertical type (top-view) or side-view type (side-view) has the efficient height to light emitting diode, and the life-span is long, not conventional light source such as cracky advantage that can't compare with it.The canned program of general known light emitting diode is through after base injection molding, solid crystalline substance, routing, sealing and cutting the pin program, still needs and carries out the program of a bending stitch, just calculates and finishes the known light emitting diode of this kind.The stitch of this light emitting diode can increase the area that contacts with tin cream after bending, to be stable on the circuit board.
With reference to Fig. 1, Fig. 1 is a structural representation of looking the type light-emitting diode (LED) module on illustrate according to known technology a kind of.With the LED encapsulation module 5 of up looking type, comprise an encapsulation base plate 50 and two conductive connecting pins 51.This two conductive connecting pin 51 is stretched out by encapsulation base plate 50 respectively, and is bent on the one side of encapsulation base plate 50 face circuit board 6 outside 50 liang of respective side of encapsulation base plate.
Yet light emitting diode must just be accomplished through above-mentioned numerous programs, certainly will improve manufacturing cost and manufacturing time.And light-emitting diode (LED) module must must just can use on a circuit board 6 by welding conductive connecting pin 51, can't form electroluminescent lamp spare separately.In addition, the radiating effect of this kind light-emitting diode (LED) module also needs to install additional heat sink or radiating fin, is just derived heat energy.
So, if can control the expenditure of above-mentioned manufacturing cost and manufacturing time, can not needing circuit board again and form electroluminescent lamp spare separately, is the target that this people in the industry desires to reach.
Summary of the invention
The present invention reveals a kind of multiple optical diode (Light Emitting Diode, LED) illuminator spare, a plurality of light-emitting diode components directly are packaged on the guide metal, by the conductive characteristic of guide metal itself, as the media that conducts electricity between the light-emitting diode component.
Simultaneously, by the variation of guide metal shape, reach the electric connection that light-emitting diode component forms serial or parallel connection to each other, so, led light source lamp spare more than this kind need not be mounted on the circuit board assemblies, can directly carry out luminous work.So, the present invention can save the expense of circuit board, also can exempt the processing charges that is mounted to circuit board assemblies.
The present invention discloses a kind of many led light sources lamp spare, has the characteristic of vast surface area by guide metal itself, improves the radiating effect to light-emitting diode component.
The present invention discloses a kind of many led light sources lamp spare, can once encapsulation base plate be taken shape on each light-emitting diode component simultaneously, and need not need cut and take off each light-emitting diode component one by one as prior art.
Directly carry out luminously after the multiple optical diode of this kind illuminator spare is suitable for powering up, in one embodiment, comprise a guide metal and a plurality of first light-emitting diode component.Guide metal is made up of a plurality of plate body, comprises one first plate body and one second plate body.Be separated with one first gap between between second plate body and first plate body.A plurality of first chip carriers of the first plate body tool, first chip carrier is arranged on first plate body, and extends to first gap, and electrically connects by first plate body each other.A plurality of first junctions of the second plate body tool, first junction is arranged on second plate body, extends to first gap, electrically connect by second plate body each other, and corresponding one by one respectively these first chip carriers.First light-emitting diode component lays respectively on first gap, and each first light-emitting diode component all electrically connects first plate body and second plate body, and wherein these first light-emitting diode components are electrically connected by first plate body and second plate body each other.
The multiple optical diode of this kind illuminator spare in another embodiment, comprises a guide metal and a plurality of light-emitting diode component.Guide metal comprises at least two plate bodys.First plate body has a plurality of first chip carriers, and first chip carrier electrically connects by first plate body each other.Be separated with one first gap between between second plate body and first plate body, second plate body has a plurality of first junctions, corresponding one by one respectively these first chip carriers of these first junctions, and electrically connect by second plate body each other.Light-emitting diode component is arranged in respectively on first gap, and each light-emitting diode component comprises a light-emitting diode chip for backlight unit, encapsulation on the encapsulation and once.Light-emitting diode chip for backlight unit be positioned at these first chip carriers one of them, and electrically connect first chip carrier and first junction.Following encapsulation is in conjunction with first chip carrier and first junction.Last encapsulation covering luminousing diode chip.
The present invention discloses a kind of many LED (Light Emitting Diode, LED) illuminator spare, the electric energy by separating light-emitting diode component and the approach that transports of heat energy make light-emitting diode component have independently to dispel the heat approach and power supply approach, so that more stable electric energy to be provided.
The multiple optical diode of this kind (LED) illuminator spare comprises a metal single layer guide plate and a plurality of light-emitting diode component.The metal single layer guide plate comprises one first plate body, one second plate body and one the 3rd plate body, second plate body is between first plate body and the 3rd plate body, respectively and have one first gap between first plate body, and has one second gap between the 3rd plate body, first gap is in order to separate the entity contact each other of first plate body and second plate body, and second gap is in order to separate the entity contact each other of second plate body and the 3rd plate body.Light-emitting diode component lays respectively on second plate body, is electrically insulated with second plate body, and derives heat energy from second plate body, and light-emitting diode component all is electrically connected first plate body and the 3rd plate body.These light-emitting diode components electrically connect by first plate body and the 3rd plate body each other.
So, the present invention utilizes guide metal to connect with the circuit that is varied to series and parallel as base material, so that directly carry out luminous multiple optical diode illuminator spare as after powering up.
Description of drawings
For above and other objects of the present invention, feature, advantage and embodiment can be become apparent, being described in detail as follows of appended accompanying drawing:
Fig. 1 is a structural representation of looking the type light-emitting diode (LED) module on illustrate according to known technology a kind of;
Fig. 2 is that many led light sources of the present invention lamp spare is according to the schematic diagram under the embodiment;
Fig. 3 is the 3-3 profile of Fig. 2;
Fig. 4 is the circuit diagram of Fig. 2;
Fig. 5 is that many led light sources of the present invention lamp spare is according to the schematic diagram under another embodiment;
Fig. 6 is the circuit diagram of Fig. 5;
Fig. 7 is that many led light sources of the present invention lamp spare is according to the schematic diagram under the another embodiment.
[primary clustering symbol description]
10: 512: the second electrodes of multiple optical diode illuminator spare
100,101,102: guide metal 520: following encapsulation
200,201: the first plate bodys 530: go up encapsulation
211: the protruding wing 600,601: the three plate bodys
212: 610: the second junctions of groove
300,301: the second plate bodys 700,701: the second gaps
310: the first junctions 800,801: the second light-emitting diode components
400,812: the four electrodes in 401: the first gaps
500,900: the three light-emitting diode components of 501: the first light-emitting diode components
510: 910: the first long and narrow breach of light-emitting diode chip for backlight unit
920: the second long and narrow breach of 511: the first electrodes
The specific embodiment
Below will clearly demonstrate spirit of the present invention with accompanying drawing and detailed description, as the person skilled in the art after understanding embodiments of the invention, when can be by the technology of teachings of the present invention, change and modification, it does not break away from spirit of the present invention and scope.
The LED package module that is different from the past must be soldered on the circuit board more one by one by after taking off on the support, just can become one and can directly carry out alight spare after powering up.A kind of many led light sources lamp spare provided by the present invention, comprise a guide metal and a plurality of light-emitting diode component, light-emitting diode component directly is packaged on the guide metal respectively, wherein guide metal may be molded to a plurality of plate bodys after cutting, wherein has a gap between two plate bodys, to separate the entity contact between this two adjacent plate body.Light-emitting diode component is arranged in respectively on this gap, electrically connects this two plate body separately, makes light-emitting diode component electrically connect by this two plate body each other.
Conductive characteristic by guide metal itself, as the media that conducts electricity between the light-emitting diode component, make directly to change between these light-emitting diode components, and reach the electric connection that light-emitting diode component produces serial or parallel connection to each other through the outer shape of guide metal after cutting.
So, led light source lamp spare more than this kind need not be mounted on the circuit board assemblies, can directly carry out luminous work.In addition, have the characteristic of vast surface area, can design bigger area of dissipation in advance, to improve radiating effect light-emitting diode component by guide metal itself.
Fig. 2 is that many led light sources of the present invention lamp spare is according to the schematic diagram under the embodiment.Fig. 3 is the 3-3 profile of Fig. 2.In one embodiment of this invention, guide metal 100 (is the metal of tool conductive characteristic, as copper, nickel or the like) comprise one first plate body 200, one second plate body 300 and one first gap 400 at least, first gap 400 and isolates first plate body 200 and contacts with the entity of second plate body 300 between first plate body 200 and second plate body 300.First plate body 200 is provided with a plurality of first chip carriers 210, and these first chip carriers 210 equidistantly are located at a lateral edges of first plate body 200 respectively, and stretches out towards the direction in first gap 400.These first chip carriers 210 electrically connect each other by first plate body, 200 conductive characteristics own jointly.
In the transformable example of one, whether first chip carrier 210 is not limit need be one-body molded with first plate body 200.When each first chip carrier 210 and first plate body 200 by one-body molded when obtained, each first chip carrier 210 is electrically connected with first plate body 200 respectively.When each first chip carrier 210 not with first plate body 200 by one-body molded when obtained, the material and first plate body 200 of each first chip carrier 210 are electrically conducted mutually.
Note that between first junction 310 and corresponding first chip carrier 210 still to be separated with first gap 400 mutually, meaning promptly first junction 310 still not with corresponding first chip carrier, 210 entities contact.
In the transformable example of one, whether first junction 310 is not limit need be one-body molded with second plate body 300.When each first junction 310 and second plate body 300 by one-body molded when obtained, each first junction 310 is electrically connected with second plate body 300 respectively.When each first junction 310 not with second plate body 300 by one-body molded when obtained, the material and second plate body 300 of each first junction 310 are electrically conducted mutually.
Light-emitting diode component for example has first light-emitting diode component 500.First light-emitting diode component 500 is arranged in respectively on first gap 400, and each first light-emitting diode component 500 all has a light-emitting diode chip for backlight unit 510, encapsulation 530 on the encapsulation 520 and once.Light-emitting diode chip for backlight unit 510 lays respectively on wherein one first chip carrier 210, electrically connects first chip carrier 210 and first junctions 310 by a lead 540 respectively.Following encapsulation 520 coats first chip carrier 210 and first junction 310 simultaneously, being one in conjunction with first chip carrier 210 and first junction 310, and therefore unlikely separation.Last encapsulation 530 covering luminousing diode chips 510 are with the electric connection of guardwire 540 and first chip carrier 210 and first junction 310.
Fig. 4 is the circuit diagram of Fig. 2, referring to Fig. 2 and Fig. 4.Particularly, these first light-emitting diode components 500 are first electrode 511 and second electrode 512 of tool opposite polarity respectively, first electrode 511 is electrically connected its first light-emitting diode component, 500 pairing first chip carrier, 210, the second electrodes 512 respectively and is electrically connected its first light-emitting diode component, 500 pairing first junctions 310 respectively.So, first light-emitting diode component 500 is electrically connected with being connected in parallel to each other.
Referring to Fig. 2, in addition, guide metal 100 also comprises one the 3rd plate body 600, one second gap 700.Light-emitting diode component for example has a plurality of second light-emitting diode components 800 again.
The 3rd plate body 600 side by side in a side of second plate body 300, second gap 700 is interval between the 3rd plate body 600 and second plate body 300, and isolates the 3rd plate body 600 and contact with the entity of second plate body 300.The 3rd plate body 600 is provided with a plurality of second junctions 610, and these second junctions 610 equidistantly are located at a lateral edges of the 3rd plate body 600 respectively, and stretches out towards the direction in second gap 700.These second junctions 610 electrically connect each other by the 3rd plate body 600 conductive characteristics own jointly.In the transformable example of one, whether second junction 610 is not limit need be one-body molded with the 3rd plate body 600.
One side of second plate body, 300 corresponding first junctions 310 comprises a plurality of second chip carriers 320.These second chip carriers 320 equidistantly be located at respectively second plate body 300 the opposite side edge, stretch out and corresponding one by one respectively these second junctions 610 of these second chip carriers 320 towards the direction in second gap 700.In addition, these second chip carriers 320 electrically connect each other by second plate body, 300 conductive characteristics own jointly.In the transformable example of one, whether second chip carrier 320 is not limit need be one-body molded with the 3rd plate body 600.
Note that between second junction 610 and corresponding second chip carrier 320 still to be separated with second gap 700 mutually, meaning promptly second junction 610 still not with corresponding second chip carrier, 320 entities contact.
Second light-emitting diode component 800 is along second gap 700, and linear array is on second gap 700, and each second light-emitting diode component 800 all has a light-emitting diode chip for backlight unit 510, encapsulation 530 on the encapsulation 520 and once.Light-emitting diode chip for backlight unit 510 lays respectively on wherein one second chip carrier 320, electrically connects second chip carrier 320 and second junctions 610 by a lead 540 respectively.Following encapsulation 520 coats second chip carrier 320 and second junction 610 simultaneously, with in conjunction with second chip carrier 320 and second junction 610.Last encapsulation 530 covering luminousing diode chips 510 are with the electric connection of guardwire 540 and second chip carrier 320 and second junction 610.
Referring to Fig. 2 and Fig. 4, particularly, second light-emitting diode component 800 is the third electrode 811 and the 4th electrode 812 of tool opposite polarity respectively, third electrode 811 is electrically connected its second light-emitting diode component, 800 pairing second chip carriers 320 respectively, the 4th electrode 812 is electrically connected its second light-emitting diode component, 800 pairing second junctions 610 respectively, wherein third electrode 811 is opposite with the polarity of second electrode 512, meaning is promptly when first electrode 511 is positive pole, second electrode 512 is a negative electrode, at this moment, third electrode 811 is anodal, and the 4th electrode 812 is a negative electrode.So, arbitrary first light-emitting diode component 500 is electrically connected with arbitrary second light-emitting diode component 800 with being one another in series.
Fig. 5 is that many led light sources of the present invention lamp spare is according to the schematic diagram under another embodiment.In the another embodiment of the present invention, present dynasty first gap 400 and second gap 700 cut a guide metal 101 and (are the metal of tool conductive characteristic, as copper, nickel or the like) time, can get at least one first long and narrow breach 910, the first long and narrow breach 910, for example vertically cross over first gap 400 and second gap 700, but the present invention does not limit the feature of vertical leap.The first long and narrow breach 910 blocks second plate body 300, and connects first gap 400, makes to be blocked into first junction 310 (with reference to the figure 2) electric connection to each other that second plate body 300 behind the two-section can't provide the first long and narrow breach, 910 both sides.In addition, the first long and narrow breach 910 can also block second plate body 300 and the 3rd plate body 600 simultaneously, and connects second gap 700, and the 3rd plate body 600 that feasible quilt blocks into behind the two-section can't provide second light-emitting diode component 801 electric connection to each other.
So, (seen Fig. 6 for the electric connection of series connection to each other by first light-emitting diode component 501 of second plate body, 300 both sides after blocking.Fig. 6 is the circuit diagram of Fig. 5).
Referring to Fig. 5.In the another embodiment of the present invention, when present dynasty first gap 400 and second gap 700 cut guide metal 101, can get at least one second long and narrow breach 920, the second long and narrow breach 920, for example vertically cross over first gap 400 and second gap 700, but the present invention does not limit the feature of vertical leap.The second long and narrow breach 920 blocks first plate body 200, and connects first gap 400, makes to be blocked into first chip carrier 210 (with reference to the figure 2) electric connection to each other that first plate body 200 behind the two-section can't provide the second long and narrow breach, 920 both sides.In addition, the second long and narrow breach 920 can also block first plate body 200 and second plate body 300 simultaneously, and connects second gap 700, and second plate body 300 that feasible quilt blocks into behind the two-section can't provide second light-emitting diode component 801 electric connection to each other.
So, (seen Fig. 6 for the electric connection of series connection to each other by second light-emitting diode component 801 of second plate body, 300 both sides after blocking.Fig. 6 is the circuit diagram of Fig. 5).
In addition, see Fig. 3, mention among the another embodiment that the first above-mentioned chip carrier 210 (or second chip carrier 320) can comprise the two protruding wings 211 and a groove 212.The protruding wing 211 is positioned on first plate body 200 (or second plate body 300), jointly towards equidirectional extension, for fixing of following encapsulation 520, forms groove 212 between the protruding wing 211, to place light-emitting diode chip for backlight unit 510.
The first above-mentioned junction 310 (or second junction 610) can comprise the two protruding wings 611.The protruding wing 611 is jointly towards equidirectional extension, for fixing of following encapsulation 520.
In addition, see Fig. 7, mention among the another embodiment between one first plate body 201 of a guide metal 102 (being the metal of tool conductive characteristic) and one the 3rd plate body 601 and have one second plate body 301 as copper, nickel or the like.Second plate body 301 is between first plate body 201 and the 3rd plate body 601, respectively and have one first gap 401 between first plate body 201, and have 701, the first gaps 401, one second gap between the 3rd plate body 601 and separate first plate body 201 and the entity contact each other of second plate body 301.Second plate body 301 and the entity contact each other of the 3rd plate body 601 are separated in second gap 701.
Light-emitting diode component for example has one the 3rd light-emitting diode component 900 again.The 3rd light-emitting diode component 900 is arranged in respectively on second plate body 301, is electrically insulated with second plate body 301, but contacts with second plate body, 301 entities, can derive the heat energy that the 3rd light-emitting diode component 900 is produced from second plate body 301.
Each the 3rd light-emitting diode component 900 all has a light-emitting diode chip for backlight unit 510, encapsulation 530 on the encapsulation 520 and once.Light-emitting diode chip for backlight unit 510 is positioned on the chip carrier (not shown) of second plate body 301, electrically connects first plate body 201 and the 3rd plate body 601 by a lead 540 respectively.Following encapsulation 520 coats first plate body 201, second plate body 301 and the 3rd plate body 601 simultaneously, makes in conjunction with first plate body 201, second plate body 301 and the 3rd plate body 601 to be one, and therefore unlikely separation.Last encapsulation 530 covering luminousing diode chips 510 and these leads 540 are on second plate body 301, with the electric connection of guardwire 540 and first plate body 201, the 3rd plate body 601.These the 3rd light-emitting diode components 900 just can electrically connect by first plate body 201 and the 3rd plate body 601 each other.
So, the electric energy by separating the 3rd light-emitting diode component 900 and the approach that transports of heat energy make the 3rd light-emitting diode component 900 have independently dispel the heat approach and power supply approach, so that more stable electric energy to be provided.
Present embodiment also can develop into many rows' the 3rd light-emitting diode component 900 (as shown in the figure), and also can form long and narrow breach same as above 910,920 on guide metal 102, so that the 3rd light-emitting diode component 900 of plate body both sides becomes the electric connection of series connection each other.
The preparation method of a kind of many led light sources lamp spare of the present invention may further comprise the steps:
(1) at first obtain a guide metal, guide metal can for example be a lamina, and its material can be for example has the high heat-conductivity conducting alloy sheet for high heat-conducting copper sheet, aluminium flake or other.
(2) guide metal is carried out all and prejudge, make the above-mentioned plate body of moulding in advance, and tentatively manifest above-mentioned gap, chip carrier and junction.Realize that this step can process guide metal by punching machine mold, to form the external form of similar metallic support (lead frame).And these plate bodys do not limit same size, and those skilled in the art is when can be according to the plate body of actual demand situation moulding required size, and the plate body that size is big more can provide radiating effect more.
(3) carry out Plastic Package and make encapsulation down.Realize that this step can utilize the injection mold of ejection formation to carry out on guide metal.Wherein owing to the protruding wing of chip carrier and junction, the glue material of feasible encapsulation down is each protruding wing of grasping more closely, the strength under improving on the encapsulation fixing metal guide plate.
(4) by the solid crystalline substance of a glue light-emitting diode chip for backlight unit is positioned in the groove of encapsulation under these one by one, and electrically connects first electrode to the first chip carrier, second electrode to the first junction of light-emitting diode chip for backlight unit through the pressure welding routing with aluminium wire or spun gold welding machine.
(5) the encapsulating encapsulation is to form encapsulation in these following encapsulation, to coat light-emitting diode chip for backlight unit and lead (as aluminium wire or spun gold) and to produce packaging protection.
(6) cut the both side edges of guide metal by stamping machine, meaning is that two corresponding end of above-mentioned each plate body are cut simultaneously, makes each plate body fixing by encapsulation down only to each other, and the entity that loses to each other connects, and can form shown in Figure 2.
So, this many led light sources lamp spare just can directly power up to carry out luminously after test is finished, and does not need as is known that the LED package module must be soldered on the circuit board more one by one by after taking off on the support, could become the lamp spare of a plurality of LED.
The light-emitting diode component of this many led light sources lamp spare is not limited to the array shown in the figure or other is arranged on the guide metal 100 as modes such as concentric circles.
Taking when the circuit of this many led light sources lamp spare and light-emitting diode component just in time satisfy institute, itself is exactly many led light sources lamp spare that can directly use.On real the work, the external form of this many led light sources lamp spare can present the banner shape, and collects through the mode of reel.
So, the dealer just can take out the guide metal of appropriate length according to demand, according to design guide metal is done various forms of cutting again, have series connection to form above-mentioned long and narrow breach (seeing the long and narrow breach 910 or 920 etc. of Fig. 5), just can obtain immediately, the multiple optical diode illuminator spare of single in parallel or string and combinational circuit.
When light-emitting diode component is an electric conductor when being the thermoelectric one-piece type light-emitting diode component of radiator again, guide metal 100 can be conductive media and heat radiation media simultaneously.If light-emitting diode component is that metal substrate only uses as conductive media when including the thermoelectric divergence type light-emitting diode component of independent heat radiation pin; The power of single light-emitting diode component is 0.03～5W.
What deserves to be explained is:
1. the first above-mentioned light-emitting diode component 500, second light-emitting diode component 800 and the 3rd light-emitting diode component 900 difference are the same assembly of symbolic animal of the birth year all; First plate body 201, second plate body 301 and the 3rd plate body 601 difference are the same assembly of symbolic animal of the birth year all; First chip carrier 210 and second chip carrier, 320 difference are the same assembly of symbolic animal of the birth year all; And first junction 310, second junction 610 same assembly of symbolic animal of the birth year all respectively, giving different titles only is to help the reader to understand with numbering.
2. the mode that cuts is not also limit above-mentioned enforcement, and the field person all can finish the multiple optical diode illuminator spare of various series connection, single parallel connection or string and combinational circuit by above-mentioned long and narrow breach idea under the present invention.
3. the composition plate body of guide metal is not limit its shape, can be circle, ellipse or banner shape etc.
The above, only for preferred embodiment of the present invention, so can not limit scope of the invention process with this, i.e. the equivalence of doing according to claims of the present invention and description changes and modification, all should still belong in the scope that patent of the present invention contains.
Claims (10)
1. a multiple optical diode illuminator spare is characterized in that, comprising:
One guide metal comprises:
One first plate body;
One second plate body, and be separated with one first gap between between this first plate body;
A plurality of first chip carriers are arranged on this first plate body, and extend to this first gap, and electrically connect by this first plate body each other;
A plurality of first junctions are arranged on this second plate body, extend to this first gap, electrically connect by this second plate body each other, and corresponding one by one respectively those first chip carriers; And
A plurality of first light-emitting diode components, lay respectively on this first gap, each those first light-emitting diode component all electrically connects this first plate body and this second plate body, and wherein those first light-emitting diode components are electrically connected by this first plate body and this second plate body each other.
2. multiple optical diode illuminator spare according to claim 1 is characterized in that those first light-emitting diode components are electrically connected with being connected in parallel to each other.
3. multiple optical diode illuminator spare according to claim 1 is characterized in that, each those first light-emitting diode component comprises:
One light-emitting diode chip for backlight unit, be positioned at those first chip carriers one of them, electrically connect this first chip carrier and this first junction;
Encapsulation once is in conjunction with this first chip carrier and this first junction; And
Encapsulation on one covers this light-emitting diode chip for backlight unit.
4. multiple optical diode illuminator spare according to claim 2 is characterized in that this guide metal more comprises:
One the 3rd plate body, and be separated with one second gap between between this second plate body, this second gap contacts with the 3rd plate body entity each other in order to separate this second plate body; And
A plurality of second light-emitting diode components lay respectively on this second gap, and each those second light-emitting diode component all electrically connects this second plate body and the 3rd plate body,
Wherein those first light-emitting diode components and those second light-emitting diode components electrically connect by this second plate body each other.
5. multiple optical diode illuminator spare according to claim 4 is characterized in that, arbitrary those first light-emitting diode components and arbitrary those second light-emitting diode components are electrically connected with being one another in series.
6. multiple optical diode illuminator spare according to claim 4, it is characterized in that, this guide metal also comprises one first long and narrow breach, this first long and narrow breach blocks this second plate body, and connect this first gap, in order to those first junction electric connections to each other of these first long and narrow breach both sides of electrical isolation.
7. multiple optical diode illuminator spare according to claim 4, it is characterized in that, this guide metal also comprises one second long and narrow breach, this second long and narrow breach blocks this first plate body, and connect this first gap, in order to those first chip carrier electric connections to each other of these second long and narrow breach both sides of electrical isolation.
8. multiple optical diode illuminator spare according to claim 3 is characterized in that, each those first chip carrier comprises:
The two protruding wings are jointly towards equidirectional extension, in order to the fixing of this time encapsulation to be provided; And
One groove is formed between those protruding wings, in order to placing this light-emitting diode chip for backlight unit, and for the filling of this time encapsulation.
9. a multiple optical diode illuminator spare is characterized in that, comprising:
One metal single layer guide plate, comprise one first plate body, one second plate body and one the 3rd plate body, wherein this second plate body is between this first plate body and the 3rd plate body, respectively and have one first gap between this first plate body, and has one second gap between the 3rd plate body, this first gap is in order to separate the entity contact each other of this first plate body and this second plate body, and this second gap is in order to separate the entity contact each other of this second plate body and the 3rd plate body; And
A plurality of light-emitting diode components lay respectively on this second plate body, be electrically insulated with this second plate body, and this second plate body are derived heat energy certainly, and each those light-emitting diode component all is electrically connected this first plate body and the 3rd plate body,
Wherein those light-emitting diode components electrically connect by this first plate body and the 3rd plate body each other.
10. multiple optical diode illuminator spare according to claim 9 is characterized in that, each those light-emitting diode component comprises:
One light-emitting diode chip for backlight unit is positioned at a chip carrier of this second plate body, electrically connects this first plate body and the 3rd plate body by a lead respectively;
Encapsulation once is in conjunction with this first plate body, this second plate body and the 3rd plate body; And
Encapsulation on one covers this light-emitting diode chip for backlight unit and those leads on this second plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010105369.0A CN102135244B (en) | 2010-01-25 | 2010-01-25 | Multi-light emitting diode light source lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010105369.0A CN102135244B (en) | 2010-01-25 | 2010-01-25 | Multi-light emitting diode light source lamp |
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| CN102135244A true CN102135244A (en) | 2011-07-27 |
| CN102135244B CN102135244B (en) | 2014-09-17 |
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| CN201010105369.0A Expired - Fee Related CN102135244B (en) | 2010-01-25 | 2010-01-25 | Multi-light emitting diode light source lamp |
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| CN102522478A (en) * | 2011-12-23 | 2012-06-27 | 深圳市瑞丰光电子股份有限公司 | Light-emitting diode module and support thereof |
| JP2014036225A (en) * | 2012-08-08 | 2014-02-24 | Samsung Display Co Ltd | Backlight assembly and display device having the same |
| WO2015000289A1 (en) * | 2013-07-01 | 2015-01-08 | 临安市新三联照明电器有限公司 | Led filament carrier cascaded forming method based on carrier flitch |
| CN104654191A (en) * | 2015-01-08 | 2015-05-27 | 威立达数码科技(深圳)有限公司 | Electronic candle lamp and light-emitting diode lamp |
| CN104795479A (en) * | 2014-01-22 | 2015-07-22 | 亚世达科技股份有限公司 | Light emitting device |
| CN104930476A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | Metallic LED (light emitting diode) lamp support |
| CN107191859A (en) * | 2016-03-14 | 2017-09-22 | 市光法雷奥（佛山）汽车照明系统有限公司 | Light source assembly for car light |
| CN107191857A (en) * | 2016-03-14 | 2017-09-22 | 市光法雷奥（佛山）汽车照明系统有限公司 | The method for making light source assembly |
| CN107191858A (en) * | 2016-03-14 | 2017-09-22 | 市光法雷奥（佛山）汽车照明系统有限公司 | Motor vehicles signal lamp |
| CN107990168A (en) * | 2016-12-03 | 2018-05-04 | 邓放明 | The corn lamp that patch lamp bead is curved with conducting wire |
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| CN201190965Y (en) * | 2008-01-24 | 2009-02-04 | 和谐光电科技（泉州）有限公司 | Surface type led lamp |
| CN201336320Y (en) * | 2009-01-19 | 2009-10-28 | 健策精密工业股份有限公司 | Light-emitting diode packaging structure and lead frame |
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| CN102522478A (en) * | 2011-12-23 | 2012-06-27 | 深圳市瑞丰光电子股份有限公司 | Light-emitting diode module and support thereof |
| JP2014036225A (en) * | 2012-08-08 | 2014-02-24 | Samsung Display Co Ltd | Backlight assembly and display device having the same |
| WO2015000289A1 (en) * | 2013-07-01 | 2015-01-08 | 临安市新三联照明电器有限公司 | Led filament carrier cascaded forming method based on carrier flitch |
| CN104795479A (en) * | 2014-01-22 | 2015-07-22 | 亚世达科技股份有限公司 | Light emitting device |
| CN104654191B (en) * | 2015-01-08 | 2017-03-15 | 威立达数码科技(深圳)有限公司 | Electric candle light fixture and LED lamp |
| CN104654191A (en) * | 2015-01-08 | 2015-05-27 | 威立达数码科技(深圳)有限公司 | Electronic candle lamp and light-emitting diode lamp |
| US10436401B2 (en) | 2015-01-08 | 2019-10-08 | Atake Digital Technology (Shenzhen) Co., Ltd. | Electronic candle lamp and light-emitting diode (LED) lamp |
| WO2016197957A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light metal frame |
| CN104930476A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | Metallic LED (light emitting diode) lamp support |
| CN107191859A (en) * | 2016-03-14 | 2017-09-22 | 市光法雷奥（佛山）汽车照明系统有限公司 | Light source assembly for car light |
| CN107191857A (en) * | 2016-03-14 | 2017-09-22 | 市光法雷奥（佛山）汽车照明系统有限公司 | The method for making light source assembly |
| CN107191858A (en) * | 2016-03-14 | 2017-09-22 | 市光法雷奥（佛山）汽车照明系统有限公司 | Motor vehicles signal lamp |
| CN107990168A (en) * | 2016-12-03 | 2018-05-04 | 邓放明 | The corn lamp that patch lamp bead is curved with conducting wire |
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