CN107191857A - The method for making light source assembly - Google Patents

The method for making light source assembly Download PDF

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Publication number
CN107191857A
CN107191857A CN201610144659.3A CN201610144659A CN107191857A CN 107191857 A CN107191857 A CN 107191857A CN 201610144659 A CN201610144659 A CN 201610144659A CN 107191857 A CN107191857 A CN 107191857A
Authority
CN
China
Prior art keywords
light source
source assembly
matrix
metallic carrier
luminous component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610144659.3A
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Chinese (zh)
Other versions
CN107191857B (en
Inventor
刘莉先
张春明
伊望
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Ichikoh China Auto Lighting Co Ltd
Original Assignee
Foshan Ichikoh Valeo Auto Lighting Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foshan Ichikoh Valeo Auto Lighting Systems Co Ltd filed Critical Foshan Ichikoh Valeo Auto Lighting Systems Co Ltd
Priority to CN201610144659.3A priority Critical patent/CN107191857B/en
Priority to EP17160420.0A priority patent/EP3228923B1/en
Priority to US15/457,424 priority patent/US10488010B2/en
Publication of CN107191857A publication Critical patent/CN107191857A/en
Application granted granted Critical
Publication of CN107191857B publication Critical patent/CN107191857B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V2200/00Use of light guides, e.g. fibre optic devices, in lighting devices or systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V2200/00Use of light guides, e.g. fibre optic devices, in lighting devices or systems
    • F21V2200/20Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape

Abstract

The embodiment provides a kind of method for making light source assembly, including:A) at least one metallic carrier is made, each metallic carrier includes the breakthrough part of the second direction extension that light load section and one or more edges intersect with first direction extended in a first direction;B) at least one described metallic carrier is placed in mold cavity and injects the material of matrix to form the matrix of the light source assembly on the side of light load section by injection molding manner in mold cavity, described matrix is run through by the breakthrough part of the metallic carrier;And c) luminous component is installed on the side opposite with described matrix of the light load section of metallic carrier.

Description

The method for making light source assembly
Technical field
The present invention relates to car light field, more particularly to a kind of method for making light source assembly.
Background technology
Light source is indispensable part in various illuminations and/or optical indicating device, for carrying For the light for illuminating and/or optics is indicated.In the car light of motor vehicles, light source is for car The design of lamp has great importance.Especially low energy consumption in the last few years, high brightness it is luminous The application of part (light emitting diode etc.), the design to light source proposes higher want Ask, not only to meet the requirement of luminosity, also to meet the demand of radiating and structure design. In existing technology, light emitting diode is often carried on baroque printed circuit board (PCB), The making complexity and structure constraint of light source part.It is used to carry luminous two due to being related to make The printed circuit board (PCB) of pole pipe, the making of light source part is also more complicated.
The content of the invention
It is an object of the invention to provide a kind of method for making light source assembly, which employs by gold There is provided a kind of low light source group of technology difficulty for the mode of category bearing part and matrix injection molded The preparation method of part, reduces cost of manufacture.
The embodiment provides a kind of method for making light source assembly, including:
A) at least one metallic carrier is made, each metallic carrier is included along first The second party that the light load section and one or more edges of direction extension intersect with first direction To the breakthrough part of extension;
B) at least one described metallic carrier is placed in mold cavity and by the material of matrix It is described to be formed by injection molding manner on the side of light load section in material injection mold cavity The matrix of light source assembly, described matrix is run through by the breakthrough part of the metallic carrier;And
C) luminous component is installed on metallic carrier light load section with described matrix phase On anti-side.
In one embodiment, at least one described metallic carrier includes the be spaced apart from each other One metallic carrier and the second metallic carrier, the luminous component have two electrodes, In the step c), described two electrodes of luminous component are held with first metal respectively Holder and the electrical connection of the second metallic carrier.
In one embodiment, in the step b), held in matrix back to the light source Matrix fin is formed on the side in load portion.
In one embodiment, the breakthrough part generally parallel prolongs with described matrix fin Stretch and be spaced.
In one embodiment, the first direction and the second direction are substantially vertical.
In one embodiment, in the step b), formed on the matrix for sending out The wiring slot of light part.
In one embodiment, the method for making light source assembly also includes:
D) drive device for driving luminous component is made, and one end of bundle conductor is welded In in the drive device;And
E) the wiring slot on the other end and described matrix of the bundle conductor is connected.
In one embodiment, in the step b), in described matrix formed one or More mounting holes, for being connected with light guide.
In one embodiment, the luminous component is light emitting diode.
In one embodiment, the material of described matrix is plastics.
In one embodiment, the plastics are heat-conducting plastics, and the heat-conducting plastic is electric insulation Or dielectric.
In one embodiment, described matrix is made up of heat-conducting resin, in the heat-conducting resin Dispersedly it is disposed with thermal conductivity filler.
The side of making light source assembly as described at least one above-mentioned embodiment of the present invention Method, by injection molded by matrix and the metallic carrier formation integral piece with a variety of functions, To install luminous component, it is to avoid make and using the baroque print of carrying luminous component The technique of printed circuit board, simplifies the manufacture craft of light source assembly, has saved cost.
Brief description of the drawings
Fig. 1 shows the flow of the method for the making light source assembly according to one embodiment of the invention Figure;
Fig. 2 shows each of the method for the making light source assembly according to one embodiment of the invention Product schematic diagram corresponding to step;
Fig. 3 shows to use is used for car light according to what the method for one embodiment of the invention was made The schematic perspective view of light source assembly;
Fig. 4 shows to use is used for car light according to what the method for one embodiment of the invention was made The cross-sectional side schematic diagram of light source assembly;And
Fig. 5 shows to use is used for car light according to what the method for one embodiment of the invention was made Another schematic perspective view of light source assembly.
Embodiment
Below by embodiment, and with reference to accompanying drawing, further is made to technical scheme Specific description.In the description, same or analogous drawing reference numeral represents same or similar Part.Following explanations referring to the drawings to embodiment of the present invention are intended to the total of the present invention Body inventive concept is explained, and is not construed as a kind of limitation to the present invention.
According to the present general inventive concept there is provided a kind of method for making light source assembly, including: A) at least one metallic carrier is made, each metallic carrier is included in the first direction The light load section of extension and one or more edges are prolonged with the second direction that first direction intersects The breakthrough part stretched;B) at least one described metallic carrier is placed in mold cavity and by base Body material injection mold cavity in by injection molding manner on the side of light load section shape Into the matrix of the light source assembly, described matrix is run through by the breakthrough part of the metallic carrier; And c) luminous component is installed on metallic carrier light load section with described matrix phase On anti-side.
In addition, in the following detailed description, for ease of explaining, elaborating many specific thin Save to provide the comprehensive understanding to present disclosure embodiment.It should be apparent, however, that one or more Embodiment can also be carried out in the case of these no details.
Fig. 1-2 shows a kind of method for making light source assembly according to an embodiment of the invention. The method of the making light source assembly includes:
Step S1:At least one metallic carrier 20 is made, each metallic carrier 20 include the light load section 21 of (such as the x directions shown in Fig. 2) extension in the first direction Second direction (such as y shown in Fig. 2 intersected with one or more edges and first direction Direction) extension breakthrough part 22;
Step S2:At least one described metallic carrier 20 is placed in mold cavity and incited somebody to action Matrix 10 material injection mold cavity in by injection molding manner in light load section 21 The matrix 10 of the light source assembly 100 is formed on side, described matrix 10 is held by the metal The breakthrough part 22 of holder 20 runs through;And
Step S3:Luminous component 30 is installed on to the light load section 21 of metallic carrier 20 The side opposite with described matrix 10 on.
The above method according to an embodiment of the invention, using the method for injection molded by matrix 10 are contoured for installing the integral piece of luminous component 30 with metallic carrier 20, without Make the printed circuit board (PCB) of carrying luminous component 30.The method provides a kind of structure phase To simple light source assembly, technique is simplified, cost is reduced.
In the light source part that this method makes, as an example, light load section 21 can be used In installing luminous component 30, breakthrough part 22 may be used as fin.As an example, light source is held Load portion 21 and breakthrough part 22 can be made with integrally formed, with company after can also being respectively prepared Fitting links together.Metallic carrier 20 can be formed by sheet metal.As an example, In step S3, luminous component 30 can be installed and (for example welded) with surface mount manner Onto metallic carrier 20.
In one example, at least one described metallic carrier 20 can include being spaced apart from each other The first metallic carrier 20a and the second metallic carrier 20b, the luminous component 30 has There are two electrodes, can be by two electrodes of luminous component 30 point in above-mentioned steps S3 Do not electrically connected with the first metallic carrier 20a and the second metallic carrier 20b.
In one example, in step s 2, in matrix back to the one of the light load section Matrix fin is formed on side.Matrix fin 13 can be formed together with breakthrough part 22 to be dissipated Warm channel, is preferably radiated.As an example, the breakthrough part 22 can be with the base Body fin 13 generally parallel extends and is spaced.
As an example, the first direction can be substantially vertical with the second direction. That is, the breakthrough part 22 of metallic carrier 20 can substantially hang down with light load section 21 Directly.
In one example, in the step S2, formed in described matrix 10 for sending out The wiring slot 18 of light part 30.The wiring slot 18 can be with luminous component 30 electrode Electrical connection.
As an example, making the method for light source assembly according to an embodiment of the invention, may be used also With including (as shown in Fig. 1 dotted line frames):
Step S4:Drive device 40 is made, and one end of bundle conductor 43 is welded in described In drive device 40;And
Step S5:The other end of the bundle conductor 43 and the wiring in described matrix 10 are inserted Groove 18 is connected.
As an example, the drive device 40 can include driver printed circuit board (PCB).It is described Drive device 40 is used to drive luminous component 30 to light.Making drive device 40 can use Any preparation method known in the art is carried out, and the method for for example making printed circuit board (PCB) is come Carry out.
In one example, in the step S2, one can be formed in described matrix 10 Individual or more mounting hole 16, for being connected with light guide.
In embodiments herein, luminous component 30 be able to can be sent out for light emitting diode etc. The part of light.Luminous component 30 can be attached to metallic carrier for example, by modes such as welding On 20.Embodiments herein is particularly suitable for use in surface-mount type light emitting part.
In embodiments herein, matrix 10 can be such as the shapable insulation as plastics Material is made.This is easy to make matrix 10 with forming mode.Metallic carrier 20 can be such as By copper, aluminium, titanium etc., the metal in solid-state is made at normal temperatures.
In one example, matrix 10 can be made up of heat-conducting plastic, and the heat-conducting plastic is electricity (if provided, with matrix fin 13, matrix fin 13 can be made insulate or dielectric Equally it is made up of a part for matrix 10 of the heat-conducting plastic).As an example, the heat conduction is moulded The thermal conductivity of material can be in 10Wm-1·K-1More than.This mode can ensure matrix 10 With higher heat conduction efficiency, so as to preferably be radiated to luminous component.
As an example, matrix 10 can be made up of heat-conducting resin, can in the heat-conducting resin To be dispersedly disposed with thermal conductivity filler.The material of heat-conducting resin for example can from polyamide, Polyethylene, polyethylene terephthalate, polybutylene terephthalate (PBT), poly- adjacent benzene Selected in diformamide and polyacrylic acid, thermal conductivity filler can be, for example, boron nitride or oxygen Change zinc.As an example, thermal conductivity filler can be present in heat-conducting resin in granular form. However, the material not limited to this of heat-conducting resin and thermal conductivity filler, as known in the art Any material suitable for heat-conducting resin or thermal conductivity filler can be used.
Fig. 3-5 was schematically shown according to being used for that the method for one embodiment of the invention makes The light source assembly 100 of car light.The light source assembly 100 includes:Matrix 10;At least one gold Belong to bearing part 20, each metallic carrier 20 include light load section 21 and one or More breakthrough parts 22, the light load section 21 is arranged at the first table of described matrix 10 On face 11, the breakthrough part 22 runs through matrix 10 from the first surface 11 of described matrix 10 And extend from the second surface 12 of matrix 10 to outside matrix, the second surface 12 and first Surface 11 is opposite;And luminous component 30, (such as light-emitting diodes of luminous component 30 Pipe etc.) it is installed on the light load section 21 of at least one metallic carrier 20.
In the above-described embodiments, luminous component 30 is carried on by base by metallic carrier 20 On body 10, the printed circuit board (PCB) using carrying luminous component 30 can be avoided.As showing Example, matrix 10 can be used for forming radiator structure.The one side of metallic carrier 20 can rise The effect (light load section 21) of luminous component 30 is supported, on the other hand can also be by passing through Logical portion 22 is formed on the second surface 12 of matrix 10 can realize the structure of other functions, For example form heat radiating fin structure.The metallic carrier 20 can for example be made up of sheet metal.This The structure of light source assembly 100 can effectively be simplified by planting multi-functional metallic carrier 20.
In one example, at least one described metallic carrier 20 can be held including the first metal Holder 20a and the second metallic carrier 20b, as shown in Figure 4.Correspondingly, luminous component 30 (such as light emitting diodes) have two electrodes, and described two electrodes are respectively with described the One metallic carrier 20a and the second metallic carrier 20b electrical connections, first metal is held Holder 20a and the second metallic carrier 20b is electrically isolated.In this example, it is possible to use the One metallic carrier 20a and the second metallic carrier 20b conduction property come for luminous component 30 provide electrical connection.However, embodiments of the invention not limited to this, for example, it is also possible to from The electrode of luminous component 30 passes through at the position not contacted with metallic carrier 20 of matrix 10 Pin or lead is drawn to realize the electrical connection of luminous component 30.
In example as shown in Figure 5, the first metallic carrier 20a has two to be put down each other Capable breakthrough part 22, and the second metallic carrier 20b has a breakthrough part 22.This Kind it is arranged in and forms three on the side of second surface 12 of matrix 10 and be approximately perpendicular to second The breakthrough part 22 that surface 12 extends.However, the quantity not limited to this of breakthrough part 22, each Metallic carrier can have in other any amount of breakthrough parts 22, each metallic carrier The quantity of breakthrough part 22 can be with identical, can also be different.
Although in the above-described embodiments with the first metallic carrier 20a and the second metallic carrier Metallic carrier 20 is described exemplified by 20b, still, those skilled in the art should Understand, the quantity of metallic carrier 20 is not limited to two, for example, can be arranged as required to One, three, four or more metallic carriers 20.
In one example, the formation metal of breakthrough part 22 of at least one metallic carrier 20 dissipates Backing.Due to the heating in the course of work of luminous component 30, fin is often needs. And in this example, metallic carrier 20 has the effect of carrying luminous component 30 and radiating concurrently, Enable to the formation compact structure of light source assembly 100.
In order to preferably form heat dissipation channel, the metal fin formed by breakthrough part 22 is removed Outside, described matrix 10 can be provided with matrix fin 13 on the second surface 12. The matrix fin 13 can respectively be distributed with the metal fin, as shown in Figure 3. As an example, the breakthrough part 22 can generally parallel extend with described matrix fin And be spaced.In one example, the breakthrough part 22 can with described matrix fin 13 With along with the extension of the generally perpendicular direction of the second surface 12 of matrix 10, for example with Angle of the second surface into 80 to 100 degree.
In one example, the breakthrough part 22 can be disposed through the outer of described matrix 10 The groove 14 in week extends through matrix 10, can also be disposed through in described matrix 10 Between the perforate 15 at position extend through matrix 10, as shown in Figure 5.
In one example, described matrix 10 is also provided with one or more running through the first table The mounting hole 16 of face 11 and second surface 12.In the car light of motor vehicles, in order to obtain Effect is preferably illuminated or lighted, generally requires the light that luminous component 30 is sent being incorporated into light Lead in device, projected again after by light guide luminous intensity distribution.So-called light guide, generally Refer to the light guide member for mainly making light be transmitted inside it with total reflection mode.It can be with With variously-shaped, such as cylindrical (can be described as lamp guide), strip (can be described as leaded light Bar, lamp bar), plate shape (can be described as light guide plate), annular (can be described as light guide ring) etc.. Such as light can inject light guide and constantly complete by light guide from one end of light guide Reflection, can also set light decoupling-structure at least one region of the side of light guide (such as prism structure).The effect of the light decoupling-structure is destruction light in light guide Total reflection condition, makes to reflex to light in light guide and photodissociation coupling knot by light decoupling-structure It is not totally reflected and is projected from light guide on the opposite side of structure.Light decoupling-structure can be used To make light be projected from the correct position of light guide.Light guide can be over the whole length Launch light.In communication process in the light guide, some light are leaving light guide Before by multiple reflections.Set mounting hole 16 can be used for filling with light guide on matrix 10 Put connection.If desired, mounting hole 16 can run through the light source loading of metallic carrier 20 Portion 21.
In one embodiment, light source assembly 100 can also include drive device 40, such as Fig. 2 It is shown.The drive device 40 for example can be the drive circuit board for being loaded with light source driving circuit, It can be used in driving luminous component 30 to light to be operated accordingly.The drive device 40 Attaching plug 41 and wire harness plug 42 can for example be included.Attaching plug 41 fills for driving Offer electric power is provided, and wire harness plug 42 is used for by bundle conductor 43 and the electricity of luminous component 30 Connection.As an example, being also provided with joint 17 (such as on the first surface 11 of matrix 10 Shown in Fig. 3), the joint 17 is electrically connected by bundle conductor 43 with the drive device 40. In the examples described above, metallic carrier 20 of the drive device 40 with being provided with luminous component 30 And matrix 10 can be electrically connected with bundle conductor 43 with physically separate.This is for motor vehicle Car light design be beneficial.In current car light design, for the tight of structure space Gathering property requires more and more higher, and according to the arrangement of above-mentioned example, can set luminous component 30 Put in a tight space (such as the end of light guide), and drive device 40 is arranged at In the spacious space that certain position is left with it.This can improve the utilization rate in space, also Be easily achieved a drive device 40 be used for drive be in car light in diverse location it is multiple light Part 30.Drive device 40, which can be included, to be used to drive this area needed for luminous component 30 Known any circuit devcie, such as resistance, driving chip, electric capacity.
Although with reference to accompanying drawing, the present invention is described, the embodiment disclosed in accompanying drawing Be intended to it is illustrative to the preferred embodiment for the present invention, and it is not intended that to this hair A kind of bright limitation.
Although some embodiments of present general inventive concept are shown and illustrated, this area is general Logical technical staff will be understood that, in the principle and the situation of spirit without departing substantially from this present general inventive concept Under, these embodiments can be made a change, the scope of the present invention with claim and they Equivalent is limited.

Claims (12)

1. a kind of method for making light source assembly, including:
A) at least one metallic carrier is made, each metallic carrier is included along first The second party that the light load section and one or more edges of direction extension intersect with first direction To the breakthrough part of extension;
B) at least one described metallic carrier is placed in mold cavity and by the material of matrix It is described to be formed by injection molding manner on the side of light load section in material injection mold cavity The matrix of light source assembly, described matrix is run through by the breakthrough part of the metallic carrier;And
C) luminous component is installed on metallic carrier light load section with described matrix phase On anti-side.
2. it is according to claim 1 make light source assembly method, wherein it is described at least One metallic carrier includes the first metallic carrier being spaced apart from each other and the carrying of the second metal Part, the luminous component has two electrodes, in the step c), by luminous component Described two electrodes are electrically connected with first metallic carrier and the second metallic carrier respectively Connect.
3. the method according to claim 1 for making light source assembly, wherein, described In step b), matrix fin is formed on the side back to the light load section of matrix.
4. the method according to claim 3 for making light source assembly, wherein, it is described to pass through Logical portion generally parallel extends and is spaced with described matrix fin.
5. the method for the making light source assembly according to any one of claim 1-4, its In, the first direction and the second direction are substantially vertical.
6. the method for the making light source assembly according to any one of claim 1-4, its In, in the step b), the wiring slot for luminous component is formed on the matrix.
7. the method according to claim 6 for making light source assembly, in addition to:
D) drive device for driving luminous component is made, and one end of bundle conductor is welded In in the drive device;And
E) the wiring slot on the other end and described matrix of the bundle conductor is connected.
8. the method for the making light source assembly according to any one of claim 1-4, its In, in the step b), one or more mounting holes are formed in described matrix, are used It is connected in light guide.
9. the method for the making light source assembly according to any one of claim 1-4, its In, the luminous component is light emitting diode.
10. the method for the making light source assembly according to any one of claim 1-4, Wherein, the material of described matrix is plastics.
11. the method according to claim 10 for making light source assembly, wherein, it is described Plastics are heat-conducting plastics, and the heat-conducting plastic is electric insulation or dielectric.
12. the method for the making light source assembly according to any one of claim 1-4, Wherein, described matrix is made up of heat-conducting resin, is dispersedly disposed with the heat-conducting resin Thermal conductivity filler.
CN201610144659.3A 2016-03-14 2016-03-14 Method for making light source assembly Active CN107191857B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201610144659.3A CN107191857B (en) 2016-03-14 2016-03-14 Method for making light source assembly
EP17160420.0A EP3228923B1 (en) 2016-03-14 2017-03-10 Light source assembly for vehicle lamp, method for producing light source assembly, signal lamp for automobile vehicle
US15/457,424 US10488010B2 (en) 2016-03-14 2017-03-13 Light source assembly for vehicle lamp, method for producing light source assembly, signal lamp for automobile vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610144659.3A CN107191857B (en) 2016-03-14 2016-03-14 Method for making light source assembly

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CN107191857A true CN107191857A (en) 2017-09-22
CN107191857B CN107191857B (en) 2021-08-31

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102102838A (en) * 2009-12-16 2011-06-22 株式会社小糸制作所 Vehicular lamp and light source assembly
CN102135244A (en) * 2010-01-25 2011-07-27 亚世达科技股份有限公司 Multi-light emitting diode light source lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102102838A (en) * 2009-12-16 2011-06-22 株式会社小糸制作所 Vehicular lamp and light source assembly
CN102135244A (en) * 2010-01-25 2011-07-27 亚世达科技股份有限公司 Multi-light emitting diode light source lamp

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