CN104916764A - LED lamp wick - Google Patents
LED lamp wick Download PDFInfo
- Publication number
- CN104916764A CN104916764A CN201510340383.1A CN201510340383A CN104916764A CN 104916764 A CN104916764 A CN 104916764A CN 201510340383 A CN201510340383 A CN 201510340383A CN 104916764 A CN104916764 A CN 104916764A
- Authority
- CN
- China
- Prior art keywords
- led lamp
- substrate
- sealing
- led
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses an LED lamp wick. The LED lamp wick comprises a transparent base plate, wherein a plurality of LED chips are arranged on the base plate, and the LED chips are connected through gold threads or printed circuits or electrode pins; a layer of sealing compound is wrapped on the outer side of the base plate; and a transparent heat dissipating layer is wrapped on the outer side of the sealing compound. The LED lamp wick can realize 360-degree luminescence without deal angle, good heat dissipation is achieved integrally, and radiating assemblies do not need to be additionally arranged, so that the manufacturing is simpler and more convenient, the luminescence colors are the same, no color spot or mist is generated, radiating devices do not need to be additionally arranged on the whole lamp, low cost and high quality are realized, and the LED lamp wick can be used for various LED lighting products.
Description
Technical field
The present invention relates to LED lamp field, specifically a kind of LED lamp.
Background technology
There is many defects in existing LED product, LED illumination product as patch type and COB class cannot realize 360 ° of luminescences, color rendering index is not high, incandescent lamp can not be replaced, and LED silk product glow color consistency is poor, does not have radiating element, causes power to do not high, cost is also very high simultaneously, and product is luminous unstable.
Summary of the invention
The object of the present invention is to provide a kind of LED lamp, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the invention provides following technical scheme:
A kind of LED lamp, comprises transparent substrate; Described substrate is provided with multiple LED chip, and LED chip is connected by gold thread or printed circuit or electrode pin; The outside of described substrate is enclosed with one deck sealing, and the outside of sealing is enclosed with layer of transparent heat dissipating layer.
A kind of LED lamp, comprises transparent substrate; Described substrate is provided with multiple LED chip, and LED chip is connected by gold thread or printed circuit or electrode pin; The outside of described substrate is provided with one deck sealing, and the interior outside of sealing is equipped with layer of transparent heat dissipating layer.
As the further scheme of the present invention: described substrate adopts optical ceramics or glass or plastics or metal to make.
As the present invention's further scheme: described LED chip adopts the adhesive of silica type or polyesters to paste on substrate, or adopt tin cream class, conductive glue class is fixed on substrate.
As the present invention's further scheme: described sealing is the mixture of silica gel or resin and fluorescent material.
As the present invention's further scheme: described transparent heat-sink adopts category of glass or ceramic-like or high polymer class transparent material to make.
As the present invention's further scheme: be marked with fluorescent material in described transparent heat-sink.
Compared with prior art, the invention has the beneficial effects as follows: the present invention can realize 360 degree of luminescences, luminous without dead angle, entirety has good thermal diffusivity, without the need to installing radiating subassembly additional, make to manufacture more easy, glow color is consistent, without color spot, do not haze, whole lamp does not need to install radiating element additional, realizes low cost, high-quality, can be used for various LED illumination product.
Accompanying drawing explanation
Fig. 1 is the structural representation one of a kind of LED lamp of the present invention.
Fig. 2 is the profile of a kind of LED lamp of the present invention.
Fig. 3 is the structural representation two of a kind of LED lamp of the present invention.
Fig. 4 is the structural representation three of a kind of LED lamp of the present invention.
In figure: 1-substrate, 2-LED chip, 3-sealing, 4-transparent heat-sink.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1 ~ 3, in the embodiment of the present invention 1, a kind of LED lamp, comprises transparent substrate 1; Described substrate 1 is provided with multiple LED chip 2, and LED chip 2 is connected by gold thread or printed circuit or electrode pin; The outside of described substrate 1 is enclosed with one deck sealing 3, and the outside of sealing 3 is enclosed with layer of transparent heat dissipating layer 4.
Described substrate 1 adopts optical ceramics or glass or plastics or metal to make.
Described LED chip 2 adopts the adhesive of silica type or polyesters to paste on substrate 1, or adopts tin cream class, conductive glue class fixing on substrate 1.
Described sealing 3 is the mixture of silica gel or resin and fluorescent material.
Described transparent heat-sink 4 adopts category of glass or ceramic-like or high polymer class transparent material to make.
Fluorescent material is marked with in described transparent heat-sink 4.
Refer to Fig. 4, in the embodiment of the present invention 2, a kind of LED lamp, comprises transparent substrate 1; Described substrate 1 is provided with multiple LED chip 2, and LED chip 2 is connected by gold thread or printed circuit or electrode pin; The outside of described substrate 1 is provided with one deck sealing 3, and the interior outside of sealing 3 is equipped with layer of transparent heat dissipating layer 4.
First incite somebody to action in the process made, LED chip 2 is fixing on substrate 1, then wraps up sealing 3 in the outside of substrate 1 or set up layer of transparent heat dissipating layer 4 between sealing 3 and substrate 1.
When wrapping up sealing 3, only need the substrate 1 of parcel sealing 3 to put into transparent heat-sink 4, the substrate 1 of multiple parcel sealing 3 simultaneously can put into same transparent heat-sink 4.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (7)
1. a LED lamp, is characterized in that, comprises transparent substrate; Described substrate is provided with multiple LED chip, and LED chip is connected by gold thread or printed circuit or electrode pin; The outside of described substrate is enclosed with one deck sealing, and the outside of sealing is enclosed with layer of transparent heat dissipating layer.
2. a LED lamp, is characterized in that, comprises transparent substrate; Described substrate is provided with multiple LED chip, and LED chip is connected by gold thread or printed circuit or electrode pin; The outside of described substrate is provided with one deck sealing, and the interior outside of sealing is equipped with layer of transparent heat dissipating layer.
3. LED lamp according to claim 1 and 2, is characterized in that, described substrate adopts optical ceramics or glass or plastics or metal to make.
4. LED lamp according to claim 1 and 2, is characterized in that, described LED chip adopts the adhesive of silica type or polyesters to paste on substrate, or adopt tin cream class, conductive glue class is fixed on substrate.
5. LED lamp according to claim 1 and 2, is characterized in that, described sealing is the mixture of silica gel or resin and fluorescent material.
6. LED lamp according to claim 1 and 2, is characterized in that, described transparent heat-sink adopts category of glass or ceramic-like or high polymer class transparent material to make.
7. LED lamp according to claim 1 and 2, is characterized in that, is marked with fluorescent material in described transparent heat-sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510340383.1A CN104916764A (en) | 2015-06-15 | 2015-06-15 | LED lamp wick |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510340383.1A CN104916764A (en) | 2015-06-15 | 2015-06-15 | LED lamp wick |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104916764A true CN104916764A (en) | 2015-09-16 |
Family
ID=54085636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510340383.1A Pending CN104916764A (en) | 2015-06-15 | 2015-06-15 | LED lamp wick |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104916764A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742668A (en) * | 2017-10-07 | 2018-02-27 | 谭瑞银 | Easily changeable LED |
| CN108321278A (en) * | 2018-01-23 | 2018-07-24 | 深圳市璨阳光电有限公司 | A kind of LED packagings |
| WO2020063103A1 (en) * | 2018-09-27 | 2020-04-02 | 张国兴 | Light emitting diode filament and light emitting diode filament bulb |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120007130A1 (en) * | 2009-03-19 | 2012-01-12 | Koninklijke Philips Electronics N.V. | Illumination device with remote luminescent material |
| CN104218139A (en) * | 2014-08-20 | 2014-12-17 | 深圳市晶台股份有限公司 | Novel LED package structure |
| CN104300073A (en) * | 2014-11-04 | 2015-01-21 | 常州晶玺照明有限公司 | 360-degree complete cycle type LED lamp filament based on purple light chips |
-
2015
- 2015-06-15 CN CN201510340383.1A patent/CN104916764A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120007130A1 (en) * | 2009-03-19 | 2012-01-12 | Koninklijke Philips Electronics N.V. | Illumination device with remote luminescent material |
| CN104218139A (en) * | 2014-08-20 | 2014-12-17 | 深圳市晶台股份有限公司 | Novel LED package structure |
| CN104300073A (en) * | 2014-11-04 | 2015-01-21 | 常州晶玺照明有限公司 | 360-degree complete cycle type LED lamp filament based on purple light chips |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107742668A (en) * | 2017-10-07 | 2018-02-27 | 谭瑞银 | Easily changeable LED |
| CN108321278A (en) * | 2018-01-23 | 2018-07-24 | 深圳市璨阳光电有限公司 | A kind of LED packagings |
| WO2020063103A1 (en) * | 2018-09-27 | 2020-04-02 | 张国兴 | Light emitting diode filament and light emitting diode filament bulb |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20220178527A1 (en) | Light emitting apparatus | |
| EP2635841A2 (en) | Lighting device with multiple emitters and remote lumiphor | |
| CN205264758U (en) | High heat dissipating LED filament | |
| CN102024804B (en) | Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness | |
| CN104916764A (en) | LED lamp wick | |
| JP2012028652A (en) | Warm white light led lamp having high luminance and high color index and led module | |
| CN201237097Y (en) | LED luminous panel | |
| CN105042387A (en) | Lamp with LED lamp wick | |
| CN203746846U (en) | LED luminous structure | |
| TWI525280B (en) | High color rendering index lamp | |
| CN202992710U (en) | Light-emitting diode (LED) illumination lamp | |
| CN204927343U (en) | LED wick | |
| CN101630678B (en) | Luminous device and method for manufacturing same | |
| CN202469579U (en) | Double-surface light-emitting planar sheet LED lamp | |
| US9324695B2 (en) | Method of tuning color temperature of light-emitting device | |
| CN203503654U (en) | High-brightness dimmable COB light source | |
| CN203322806U (en) | LED (light-emitting diode) light source module capable of linear light emitting | |
| CN102322572A (en) | High-power LED (light-emitting diode) lamp packaged with ceramics | |
| CN202216200U (en) | Ceramic packaged high-power LED lamp | |
| CN203118943U (en) | COB lamp source board structure | |
| CN202633304U (en) | Distributed high-voltage LED die set | |
| CN205037097U (en) | Adopt lamp of LED wick | |
| CN207080814U (en) | A kind of Dimmable LED module | |
| CN207250564U (en) | A kind of LED filament | |
| CN202901966U (en) | Light emitting diode (LED) lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150916 |
|
| RJ01 | Rejection of invention patent application after publication |