CN107768504A - A kind of paster LED bracket - Google Patents

A kind of paster LED bracket Download PDF

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Publication number
CN107768504A
CN107768504A CN201711105108.7A CN201711105108A CN107768504A CN 107768504 A CN107768504 A CN 107768504A CN 201711105108 A CN201711105108 A CN 201711105108A CN 107768504 A CN107768504 A CN 107768504A
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China
Prior art keywords
reflecting surface
base
small
reflective surface
reflective
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CN201711105108.7A
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Chinese (zh)
Inventor
胡康乐
许辉胜
王祖亮
楚新
苏哲
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Fujian Xinda Photoelectric Technology Co ltd
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SHENZHEN GLORY SKY OPTOELECTRONIC CO Ltd
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Priority to CN201711105108.7A priority Critical patent/CN107768504A/en
Publication of CN107768504A publication Critical patent/CN107768504A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means

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  • Led Device Packages (AREA)

Abstract

The present invention discloses a kind of paster LED bracket, including reflector and base;Base sets positive pole and negative pole, LED chip to be mounted on base and be connected with positive pole and negative pole, and reflector is arranged on base, and LED chip is placed in the bottom of reflector;The reflector includes circumferentially eight reflectings surface of adjoining successively, and the angle between each reflecting surface and base is 130 degree 145 degree.The present invention can reduce light radiant flux loss, so as to improve the light extraction efficiency of LED chip.

Description

一种贴片LED支架A patch LED bracket

技术领域technical field

本发明涉及LED封装技术领域,尤其是指一种贴片LED支架。The invention relates to the technical field of LED packaging, in particular to a patch LED bracket.

背景技术Background technique

LED(Light Emitting Diode 发光二极管)是一种固态半导体器件,可将电能转换成光能,具有耗电量小、聚光效果好、反应速度快、可控性强、能承受高压冲击、使用寿命长及环保等优点。LED (Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into light energy. Advantages of long life and environmental protection.

现有技术中,LED半导体器件的封装大多使用导热胶将芯片固定在支架上,再用金属引线导通芯片实现LED发光。由于固定LED芯片的支架是至关重要的封装材料,支架的各项性能指标直接影响封装成品的各项性能,对芯片的性能发挥起到至关重要的作用,其中之一体现在封装成品的出光效率,因此,为提高LED出光效率,支架须有较好的出光效果。In the prior art, the packaging of LED semiconductor devices mostly uses heat-conducting glue to fix the chip on the bracket, and then uses metal leads to conduct the chip to realize LED light emission. Since the bracket for fixing the LED chip is a crucial packaging material, the performance indicators of the bracket directly affect the performance of the packaged product and play a vital role in the performance of the chip, one of which is reflected in the light output of the packaged product Efficiency. Therefore, in order to improve the light output efficiency of the LED, the bracket must have a better light output effect.

然而,现有技术中,LED封装用的贴片支架在设计上存在不足:支架的设计最初考虑机械结构与加工工艺方面,而在出光效率的设计上没有较多的研究,导致现有的支架反射杯与底座的夹角不合理,芯片的出光通道过长,产生很多不必要的全反射,导致光辐射通量损失,从而导致封装成品的光通量损失。However, in the prior art, there are deficiencies in the design of the chip bracket used for LED packaging: the design of the bracket initially considers the mechanical structure and processing technology, but there is not much research on the design of the light extraction efficiency, resulting in the existing bracket The angle between the reflective cup and the base is unreasonable, and the light output channel of the chip is too long, resulting in many unnecessary total reflections, resulting in the loss of light radiation flux, which leads to the loss of light flux of the packaged product.

有鉴于此,经深入研究试验,本发明研发出一种克服所述缺陷的贴片LED支架,本案由此产生。In view of this, after in-depth research and testing, the present invention has developed a patch LED bracket that overcomes the above-mentioned defects, and this case arises from it.

发明内容Contents of the invention

本发明的目的在于提供一种贴片LED支架,以减少光辐射通量损失,从而提高LED芯片的出光效率。The purpose of the present invention is to provide a patch LED bracket to reduce the loss of light radiation flux, thereby improving the light extraction efficiency of the LED chip.

为了达成上述目的,本发明的解决方案为:In order to achieve the above object, the solution of the present invention is:

一种贴片LED支架,包括反射杯和底座;底座设置正极和负极,LED芯片贴装在底座上与正极和负极连接,反射杯设置在底座上,而LED芯片置于反射杯的底部;所述反射杯包括沿周向依次邻接的八个反射面,且每一个反射面与底座之间的夹角为130度-145度。A patch LED bracket, comprising a reflective cup and a base; the base is provided with a positive pole and a negative pole, an LED chip is mounted on the base and connected to the positive pole and the negative pole, the reflective cup is disposed on the base, and the LED chip is placed at the bottom of the reflective cup; The reflective cup includes eight reflective surfaces adjacent in turn along the circumferential direction, and the included angle between each reflective surface and the base is 130°-145°.

进一步,反射面包括第一大反射面、第一小反射面、邻接第一大反射面与第一小反射面的第一邻接反射面、第二大反射面、邻接第一小反射面与第二大反射面的第二邻接反射面、第二小反射面、邻接第二大反射面与第二小反射面的第三邻接反射面、以及邻接第二小反射面与第一大反射面的第四邻接反射面,整体呈方形,第一大反射面的反射面积等于第二大反射面的反射面积,第一小反射面的反射面积等于第二小反射面的反射面积,第一至第四邻接反射面的反射面积相等,且第一、第二大反射面的反射面积大于第一、第二小反射面的反射面积,第一、第二小反射面的反射面积大于第一至第四邻接反射面的反射面积。Further, the reflective surface includes a first large reflective surface, a first small reflective surface, a first adjacent reflective surface adjacent to the first large reflective surface and the first small reflective surface, a second large reflective surface, adjoining the first small reflective surface and the first small reflective surface The second adjacent reflective surface of the two large reflective surfaces, the second small reflective surface, the third adjacent reflective surface adjacent to the second large reflective surface and the second small reflective surface, and the adjacent second small reflective surface and the first large reflective surface The fourth adjacent reflective surface is square as a whole, the reflection area of the first large reflective surface is equal to the reflective area of the second large reflective surface, the reflective area of the first small reflective surface is equal to the reflective area of the second small reflective surface, the first to the second The reflection areas of the four adjacent reflection surfaces are equal, and the reflection areas of the first and second large reflection surfaces are larger than those of the first and second small reflection surfaces, and the reflection areas of the first and second small reflection surfaces are larger than those of the first to second small reflection surfaces. The reflective area of the four adjacent reflective surfaces.

进一步,底座为金属底座。Further, the base is a metal base.

进一步,底座为铜、铜的合金或者铝合金。Further, the base is copper, copper alloy or aluminum alloy.

进一步,安装LED芯片的底座表面设置电镀反光层。Further, an electroplating reflective layer is provided on the surface of the base on which the LED chip is installed.

进一步,电镀反光层为镀银层或者镀镍上银层。Further, the electroplated reflective layer is a silver-plated layer or a silver-plated nickel-plated layer.

进一步,底座设置的正极和负极位于同一平面内。Further, the positive pole and the negative pole provided on the base are located in the same plane.

进一步,反射面的材质为白色塑胶、陶瓷或树脂。Further, the reflective surface is made of white plastic, ceramic or resin.

采用上述方案后,本发明反射杯包括沿周向依次邻接的八个反射面,且每一个反射面与底座之间的夹角为130度-145度,使得LED芯片的出光通道较短,减少LED芯片的出光全反射,380-800nm的光谱反光率大于或者等于95%,从而减少光辐射通量损失,达到提升光通量的效果,从而提高LED芯片的出光效率。After adopting the above-mentioned solution, the reflective cup of the present invention includes eight reflective surfaces successively adjacent in the circumferential direction, and the included angle between each reflective surface and the base is 130°-145°, so that the light-emitting channel of the LED chip is relatively short, reducing The light output of the LED chip is totally reflected, and the spectral reflectance rate of 380-800nm is greater than or equal to 95%, thereby reducing the loss of light radiation flux and achieving the effect of increasing the luminous flux, thereby improving the light output efficiency of the LED chip.

附图说明Description of drawings

图1是本发明的俯视图;Fig. 1 is a top view of the present invention;

图2是图1中A-A的剖视图;Fig. 2 is the sectional view of A-A among Fig. 1;

图3是图1中B-B的剖视图;Fig. 3 is the sectional view of B-B among Fig. 1;

图4是本发明的发光原理图。Fig. 4 is a schematic diagram of the light emitting principle of the present invention.

标号说明Label description

反射杯1 反射面11Reflector 1 Reflector 11

第一大反射面111 第一小反射面112First large reflective surface 111 First small reflective surface 112

第一邻接反射面113 第二大反射面114First adjacent reflective surface 113 Second large reflective surface 114

第二邻接反射面115 第二小反射面116Second adjacent reflective surface 115 Second small reflective surface 116

第三邻接反射面117 第四邻接反射面118Third adjacent reflective surface 117 Fourth adjacent reflective surface 118

底座2 LED芯片3Base 2 LED chip 3

胶水4 荧光粉5Glue 4 Phosphor 5

光线6、7、8。Rays 6, 7, 8.

具体实施方式Detailed ways

以下结合附图及具体实施例对本发明做详细描述。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

请参阅图1至图4所述,本发明揭示的一种贴片LED支架,包括反射杯1和底座2。底座2设置正极和负极,优选为,底座2设置的正极和负极位于同一平面内,LED芯片3贴装在底座2上与正极和负极连接,实现LED发光,反射杯1设置在底座2上,而LED芯片3置于反射杯1的底部。Referring to FIG. 1 to FIG. 4 , a patch LED bracket disclosed by the present invention includes a reflective cup 1 and a base 2 . The base 2 is provided with a positive pole and a negative pole. Preferably, the positive pole and the negative pole provided on the base 2 are located in the same plane, and the LED chip 3 is mounted on the base 2 and connected with the positive pole and the negative pole to realize LED light emission. The reflective cup 1 is arranged on the base 2. And the LED chip 3 is placed at the bottom of the reflective cup 1 .

所述反射杯1包括沿周向依次邻接的八个反射面11,且每一个反射面11与底座2之间的夹角为130度-145度,使得LED芯片3的出光通道较短,减少LED芯片3的出光全反射,380-800nm的光谱反光率大于或者等于95%,从而减少光辐射通量损失,达到提升光通量的效果,从而提高LED芯片3的出光效率。The reflective cup 1 includes eight reflective surfaces 11 that are sequentially adjacent along the circumferential direction, and the angle between each reflective surface 11 and the base 2 is 130°-145°, so that the light exit channel of the LED chip 3 is relatively short, reducing the The light output of the LED chip 3 is totally reflected, and the spectral reflectance of 380-800nm is greater than or equal to 95%, thereby reducing the loss of light radiation flux, achieving the effect of increasing the luminous flux, thereby improving the light output efficiency of the LED chip 3 .

本实施例中,反射面11包括第一大反射面111、第一小反射面112、邻接第一大反射面111与第一小反射面112的第一邻接反射面113、第二大反射面114、邻接第一小反射面112与第二大反射面114的第二邻接反射面115、第二小反射面116、邻接第二大反射面114与第二小反射面116的第三邻接反射面117、以及邻接第二小反射面116与第一大反射面111的第四邻接反射面118,如图1所示,整体呈方形,第一大反射面111的反射面积等于第二大反射面114的反射面积,第一小反射面112的反射面积等于第二小反射面116的反射面积,第一至第四邻接反射面(113、115、117、118)的反射面积相等,且第一、第二大反射面(111、114)的反射面积大于第一、第二小反射面(112、116)的反射面积,第一、第二小反射面(112、116)的反射面积大于第一至第四邻接反射面(113、115、117、118)的反射面积。In this embodiment, the reflective surface 11 includes a first large reflective surface 111, a first small reflective surface 112, a first adjacent reflective surface 113 adjacent to the first large reflective surface 111 and the first small reflective surface 112, and a second large reflective surface. 114. The second adjacent reflective surface 115 adjacent to the first small reflective surface 112 and the second large reflective surface 114, the second small reflective surface 116, the third adjacent reflective surface adjacent to the second large reflective surface 114 and the second small reflective surface 116 Surface 117, and the fourth adjacent reflective surface 118 adjacent to the second small reflective surface 116 and the first large reflective surface 111, as shown in Figure 1, are square as a whole, and the reflection area of the first large reflective surface 111 is equal to the second large reflective surface 118. The reflection area of the surface 114, the reflection area of the first small reflection surface 112 is equal to the reflection area of the second small reflection surface 116, the reflection areas of the first to fourth adjacent reflection surfaces (113, 115, 117, 118) are equal, and 1. The reflection area of the second largest reflection surface (111, 114) is larger than the reflection area of the first and second small reflection surfaces (112, 116), and the reflection area of the first and second small reflection surfaces (112, 116) is larger than Reflecting areas of the first to fourth adjacent reflecting surfaces (113, 115, 117, 118).

如图2所示,第二小反射面116与底座2之间的夹角a为133度,第三邻接反射面117与底座2之间的夹角b为145度,如图3所示,第二大反射面114与底座2之间的夹角c为145度,第二邻接反射面115与底座2之间的夹角d为139度。所述八个发射面11与底座2之间的夹角可以设置为相同,也可以设置为不同。As shown in Figure 2, the angle a between the second small reflecting surface 116 and the base 2 is 133 degrees, and the angle b between the third adjacent reflecting surface 117 and the base 2 is 145 degrees, as shown in Figure 3, The included angle c between the second large reflective surface 114 and the base 2 is 145 degrees, and the included angle d between the second adjacent reflective surface 115 and the base 2 is 139 degrees. The included angles between the eight emitting surfaces 11 and the base 2 may be set to be the same or different.

本实施例中,底座2为金属底座,为电、热的良好导体,可以为铜、铜的合金或者铝合金。安装LED芯片3的底座2表面设置电镀反光层,电镀反光层可以为镀银层或者镀镍上银层。反射面11的材质为白色塑胶、陶瓷或树脂。In this embodiment, the base 2 is a metal base, which is a good conductor of electricity and heat, and can be copper, copper alloy or aluminum alloy. An electroplating reflective layer is provided on the surface of the base 2 on which the LED chip 3 is installed, and the electroplating reflective layer can be a silver-plated layer or a silver-plated nickel-plated layer. The reflective surface 11 is made of white plastic, ceramic or resin.

如图4所示,LED芯片3置于反射杯1的底部,并在反射杯1中封装胶水4,胶水4中混有荧光粉5,LED芯片3通过激发荧光粉5发光,荧光粉5四面八方发光。胶水4的折射率n为1.42-1.57,从光密介质到光疏介质会有全反射角,胶水4的折射率n为1.42时,全反射角为Arcsin(1/1.42),查表对应的角度为44.767度,同理,胶水4的折射率n为1.57时,反射杯1的每一个反射面11与底座2之间的夹角为130度-145度,使得如图4所示的光线6、7、8通过反射杯1的杯壁可以完全破坏胶水4的全反射角,进而使得荧光粉5发光至反射杯1的杯壁的光能直接出去,降低光线的出光路径。As shown in Figure 4, the LED chip 3 is placed at the bottom of the reflective cup 1, and the glue 4 is encapsulated in the reflective cup 1. The glue 4 is mixed with phosphor powder 5, and the LED chip 3 emits light by exciting the phosphor powder 5, and the phosphor powder 5 is in all directions. glow. The refractive index n of glue 4 is 1.42-1.57, and there will be a total reflection angle from the optically dense medium to the optically sparse medium. When the refractive index n of glue 4 is 1.42, the total reflection angle is Arcsin (1/1.42), and the table corresponding The angle is 44.767 degrees. Similarly, when the refractive index n of the glue 4 is 1.57, the angle between each reflective surface 11 of the reflective cup 1 and the base 2 is 130-145 degrees, so that the light shown in Figure 4 6, 7, 8 can completely destroy the total reflection angle of the glue 4 through the cup wall of the reflective cup 1, and then make the light energy emitted by the fluorescent powder 5 to the cup wall of the reflective cup 1 go out directly, reducing the light path of the light.

以上所述仅为本发明的优选实施例,并非对本案设计的限制,凡依本案的设计关键所做的等同变化,均落入本案的保护范围。The above descriptions are only preferred embodiments of the present invention, and are not limitations on the design of this case. All equivalent changes made according to the key points of the design of this case fall within the scope of protection of this case.

Claims (8)

  1. A kind of 1. paster LED bracket, it is characterised in that:Including reflector and base;Base sets positive pole and negative pole, LED chip It is mounted on base and is connected with positive pole and negative pole, reflector is arranged on base, and LED chip is placed in the bottom of reflector;Institute Stating reflector includes circumferentially adjacent eight reflectings surface successively, and the angle between each reflecting surface and base be 130 degree- 145 degree.
  2. A kind of 2. paster LED bracket as claimed in claim 1, it is characterised in that:Reflecting surface includes the first big reflecting surface, first Small reflecting surface, the first adjoining reflecting surface of adjacent first big reflecting surface and the first small reflecting surface, second largest reflecting surface, adjacent first Second adjoining reflecting surface of small reflecting surface and second largest reflecting surface, the second small reflecting surface, adjacent second largest reflecting surface and second are small 3rd adjoining reflecting surface of reflecting surface and the neighbours of adjacent second small reflecting surface and the first big reflecting surface connect reflecting surface, whole Body is square, and the reflective surface area of the first big reflecting surface is equal to the reflective surface area of second largest reflecting surface, the reflection of the first small reflecting surface Area is equal to the reflective surface area of the second small reflecting surface, and the reflective surface area of first to fourth adjoining reflecting surface is equal, and first, second The reflective surface area of big reflecting surface is more than the reflective surface area of first, second small reflecting surface, the reflective surface area of first, second small reflecting surface More than the reflective surface area of first to fourth adjoining reflecting surface.
  3. A kind of 3. paster LED bracket as claimed in claim 1, it is characterised in that:Base is metab.
  4. A kind of 4. paster LED bracket as claimed in claim 3, it is characterised in that:Base is that copper, the alloy of copper or aluminium close Gold.
  5. A kind of 5. paster LED bracket as claimed in claim 1, it is characterised in that:The susceptor surface for installing LED chip sets electricity Plate reflector layer.
  6. A kind of 6. paster LED bracket as claimed in claim 5, it is characterised in that:It is silver coating or nickel plating to electroplate reflector layer Upper silver layer.
  7. A kind of 7. paster LED bracket as claimed in claim 1, it is characterised in that:The positive pole and negative pole that base is set are positioned at same In one plane.
  8. A kind of 8. paster LED bracket as claimed in claim 1, it is characterised in that:The material of reflecting surface is white plastic, ceramics Or resin.
CN201711105108.7A 2017-11-10 2017-11-10 A kind of paster LED bracket Pending CN107768504A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110034223A (en) * 2019-03-13 2019-07-19 东莞中之光电股份有限公司 A kind of large power white light LED lamp bead
WO2020118702A1 (en) * 2018-12-14 2020-06-18 泉州三安半导体科技有限公司 Light-emitting diode packaging body

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