CN205621765U - White -light LED package structure - Google Patents
White -light LED package structure Download PDFInfo
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- CN205621765U CN205621765U CN201620331373.1U CN201620331373U CN205621765U CN 205621765 U CN205621765 U CN 205621765U CN 201620331373 U CN201620331373 U CN 201620331373U CN 205621765 U CN205621765 U CN 205621765U
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- colloid layer
- powder colloid
- fluorescent powder
- led chip
- phosphor powder
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Abstract
The utility model discloses a white -light LED package structure, including base plate, LED chip, first phosphor powder colloid layer and second phosphor powder colloid layer, the LED chip is located on the base plate, first phosphor powder colloid layer is located LED chip top, second phosphor powder colloid layer is located first phosphor powder colloid layer top, the utility model discloses a phosphor powder colloid layer of layered structure for mixed embedment direct for prior art has higher luminous flux in the colloid layer of phosphor powder more than two kinds or two kinds.
Description
Technical field
This utility model relates to the technical field of LED encapsulation, particularly relates to the encapsulating structure of a kind of white light LEDs.
Background technology
Tradition multi-chip white light encapsulating structure, as it is shown in figure 1, include: substrate 10, LED chip 20, is directly packaged in the mixture of phosphor gel 30(above LED chip i.e. colloid and fluorescent material).This encapsulating structure has a disadvantage in that (1) exists hot spot: owing to the luminous intensity of each angle of LED chip is different, and phosphor gel is directly filled so that the phosphor concentration of each angle is consistent, do not mate with LED blue chip lighting angle, cause product that blue hot spot occurs in the region that LED blue chip luminous intensity is stronger；(2) luminous flux is the highest: owing to directly mixing two or more fluorescent material of embedding makes the fluorescent material of high excitation wavelength, secondary excitation by blue chip Yu short excitation wavelength fluorescent material, the conversion efficiency making fluorescent material reduces, thus reduces the luminous flux of entirety.
In view of this, the present inventor studies and devises the encapsulating structure of a kind of white light LEDs, and this case thus produces.
Utility model content
The purpose of this utility model is to provide the encapsulating structure of a kind of white light LEDs, by arranging the fluorescent powder colloid layer of layering, to improve the luminous flux of white light LEDs.
To achieve these goals, the technical scheme in the invention for solving the technical problem is:
A kind of encapsulating structure of white light LEDs, including substrate, LED chip, the first fluorescent powder colloid layer and the second fluorescent powder colloid layer, described LED chip is located on described substrate, described first fluorescent powder colloid layer is located at above described LED chip, and described second fluorescent powder colloid layer is located at above described first fluorescent powder colloid layer.
As the optimal way of embodiment, the wavelength of fluorescence of described first fluorescent powder colloid layer is more than the wavelength of fluorescence of described second fluorescent powder colloid layer.
Optimal way as embodiment, also include the 3rd fluorescent powder colloid layer, described 3rd fluorescent powder colloid layer is located at the top of described second fluorescent powder colloid layer, and the wavelength of fluorescence of described second fluorescent powder colloid layer is more than the wavelength of fluorescence of described 3rd fluorescent powder colloid layer.
Owing to the encapsulating structure of a kind of white light LEDs of this utility model have employed above-mentioned technical scheme, i.e. include substrate, LED chip, the first fluorescent powder colloid layer and the second fluorescent powder colloid layer, described LED chip is located on described substrate, described first fluorescent powder colloid layer is located at above described LED chip, and described second fluorescent powder colloid layer is located at above described first fluorescent powder colloid layer；Make this utility model relative to prior art, the luminous flux of white light LEDs can be greatly improved.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art LED encapsulation；
Fig. 2 is structural representation of the present utility model.
Detailed description of the invention
As shown in Figure 2, this utility model discloses the encapsulating structure of a kind of white light LEDs, including substrate 1, LED chip the 2, first fluorescent powder colloid layer 3 and the second fluorescent powder colloid layer 4, described LED chip 2 is located on described substrate 1, described first fluorescent powder colloid layer 3 is located at above described LED chip 2, and described second fluorescent powder colloid layer 4 is located at above described first fluorescent powder colloid layer 3.Described substrate includes that base plate and side plate, described side plate are arranged on all walls of base plate, and described first fluorescent powder colloid layer 3 and the second fluorescent powder colloid layer 4 are arranged in substrate with the form of isosceles trapezoid.
As the optimal way of embodiment, the wavelength of fluorescence of described first fluorescent powder colloid layer 3 is more than the wavelength of fluorescence of described second fluorescent powder colloid layer 4.
Optimal way as embodiment, also include the 3rd fluorescent powder colloid layer (not shown), described 3rd fluorescent powder colloid layer is located at the top of described second fluorescent powder colloid layer, and the wavelength of fluorescence of described second fluorescent powder colloid layer is more than the wavelength of fluorescence of described 3rd fluorescent powder colloid layer.Certainly, fluorescent powder colloid number layer by layer number can also determine according to the actual needs, with the wavelength of fluorescence of above a layer less than the wavelength of fluorescence of following a layer as principle.
The white light that this utility model LED chip sends sequentially passes through wavelength of fluorescence the first fluorescent powder colloid layer, the second fluorescent powder colloid layer and the 3rd fluorescent powder colloid layer from high to low, and the colloid layer so directly mixing two or more fluorescent material of embedding relative to prior art has higher luminous flux.
The above, only this utility model preferred embodiment, therefore the scope that this utility model is implemented can not be limited according to this, the equivalence change i.e. made according to this utility model the scope of the claims and description with modify, all should still belong in the range of this utility model contains.
Claims (3)
1. the encapsulating structure of a white light LEDs, it is characterized in that: include substrate, LED chip, the first fluorescent powder colloid layer and the second fluorescent powder colloid layer, described LED chip is located on described substrate, described first fluorescent powder colloid layer is located at above described LED chip, and described second fluorescent powder colloid layer is located at above described first fluorescent powder colloid layer.
The encapsulating structure of a kind of white light LEDs the most as claimed in claim 1, it is characterised in that: the wavelength of fluorescence of described first fluorescent powder colloid layer is more than the wavelength of fluorescence of described second fluorescent powder colloid layer.
The encapsulating structure of a kind of white light LEDs the most as claimed in claim 1, it is characterized in that: also include the 3rd fluorescent powder colloid layer, described 3rd fluorescent powder colloid layer is located at the top of described second fluorescent powder colloid layer, and the wavelength of fluorescence of described second fluorescent powder colloid layer is more than the wavelength of fluorescence of described 3rd fluorescent powder colloid layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620331373.1U CN205621765U (en) | 2016-04-20 | 2016-04-20 | White -light LED package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620331373.1U CN205621765U (en) | 2016-04-20 | 2016-04-20 | White -light LED package structure |
Publications (1)
| Publication Number | Publication Date |
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| CN205621765U true CN205621765U (en) | 2016-10-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201620331373.1U Active CN205621765U (en) | 2016-04-20 | 2016-04-20 | White -light LED package structure |
Country Status (1)
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| CN (1) | CN205621765U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482000A (en) * | 2017-08-10 | 2017-12-15 | 广州硅能照明有限公司 | A kind of LED light source and preparation method thereof |
-
2016
- 2016-04-20 CN CN201620331373.1U patent/CN205621765U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482000A (en) * | 2017-08-10 | 2017-12-15 | 广州硅能照明有限公司 | A kind of LED light source and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |