US20160035947A1 - Package structure of light-emitting diode module and method for manufacturing the same - Google Patents

Package structure of light-emitting diode module and method for manufacturing the same Download PDF

Info

Publication number
US20160035947A1
US20160035947A1 US14/450,414 US201414450414A US2016035947A1 US 20160035947 A1 US20160035947 A1 US 20160035947A1 US 201414450414 A US201414450414 A US 201414450414A US 2016035947 A1 US2016035947 A1 US 2016035947A1
Authority
US
United States
Prior art keywords
light
colloid
emitting diode
transparent
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US14/450,414
Other versions
US9257620B1 (en
Inventor
Chen-Lun Hsing Chen
Feng-Chuan Tsai
Jung-Hao Hung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Prolight Opto Technology Corp
Original Assignee
Prolight Opto Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prolight Opto Technology Corp filed Critical Prolight Opto Technology Corp
Priority to US14/450,414 priority Critical patent/US9257620B1/en
Assigned to PROLIGHT OPTO TECHNOLOGY CORPORATION reassignment PROLIGHT OPTO TECHNOLOGY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHEN-LUN HSING, HUNG, JUNG-HAO, TSAI, FENG-CHUAN
Publication of US20160035947A1 publication Critical patent/US20160035947A1/en
Application granted granted Critical
Publication of US9257620B1 publication Critical patent/US9257620B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

  • the present invention relates generally to a structure for reducing total reflection of light-emitting diode chips, and particularly to a package structure of light-emitting diode module and the method for manufacturing the same.
  • LEDs Limit-emitting diodes
  • Their applications are developing promisingly, including backlight plates of LCD, large signboards, headlights, and lighting applications.
  • Taiwan early involvement was in die and wafer fabrication.
  • the LED industry has established a delicate division of the supply chain.
  • the domestic LED companies all endeavor in improving their capabilities in research and development for expanding to high value-added markets.
  • a part of the innovation is related to the package material and structure of LEDs.
  • LEDs are usually used as indicators or displays. They can convert electrical energy to photo energy directly with high efficiency. They also long usage hours as long as several tens to hundreds of thousands of hours. Moreover, in comparison with traditional bulbs, they also have the advantages of breakage resistance and saving power. Nonetheless, they all need a reasonable package form for various types before they are adopted in practical applications.
  • the package form of LED depends on the application scenario, the appearance, the size, the heat dissipation solution, and the light emitting effect. There are many types in the package forms of LED. Currently, according to the package forms, LED chips are categorized into Lamp-LED, TOP-LED, Side-LED, SMD-LED, Flip Chip-LED, and High-Power-LED.
  • the overall light-emitting performance is influenced by the LED chip, the package form, and the package material.
  • the internal light-emitting efficiency of LED chip has reached above 90%. Nonetheless, owing to the influences of package structure and material, the equivalent light-emitting efficiency cannot be reached from the outside of LED modules. Thereby, the package structure and material of LED chips are important to the brightness of LED chips.
  • the present invention improves the drawbacks in the prior art and provides a package structure of LED module and the method for manufacturing the same.
  • the method mainly comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member.
  • the light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material.
  • An objective of the present invention is to provide a package structure of LED module and the method for manufacturing the same.
  • the light-pervious member and colloid member are used for reducing the total reflection effect in the package.
  • the present invention provides a package structure of LED module and the method for manufacturing the same.
  • the method mainly comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member.
  • the light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material.
  • FIG. 1 shows a three-dimensional view of the package structure of LED module according the first embodiment of the present invention
  • FIG. 2 shows a flowchart for manufacturing the package structure of LED module according the first embodiment of the present invention
  • FIG. 3 shows a cross-sectional view of the package structure of LED module according the first embodiment of the present invention
  • FIG. 4 shows a cross-sectional view of the package structure of LED module according the second embodiment of the present invention.
  • FIG. 5 shows a three-dimensional view of the package structure of LED module according the third embodiment of the present invention.
  • FIG. 6 shows a flowchart for manufacturing the package structure of LED module according the third embodiment of the present invention.
  • FIG. 7 shows a cross-sectional view of the package structure of LED module according the third embodiment of the present invention.
  • FIG. 8 shows a cross-sectional view of the package structure of LED module according the fourth embodiment of the present invention.
  • the package structure of LED module and the method for manufacturing the same according to the present invention solve the problem of larger refractivity in a general LED module than outside.
  • most of the light generate by the LED module is totally reflected back to the inside of the LED module from the interface between the package structure and the LED module.
  • the totally reflected light is absorbed by the internal electrodes and substrate.
  • the light extraction efficiency of the LED chip is far lower than the internal quantum efficiency.
  • the present invention improves the drawbacks in the light emitting efficiency of the LED module according to the prior art.
  • the light-pervious member and the colloid member the total reflection effect in the package can be reduced.
  • the structure according to the present invention is endowed with nonobviousness and novelty.
  • FIG. 1 shows a three-dimensional view of the package structure of LED module according the first embodiment of the present invention.
  • the present invention uses a chip fixing member 10 , a light-pervious member 20 , a colloid member 30 , and at least an LED chip 40 .
  • the chip fixing member 10 further includes a recess 110 , a first electrode 120 , and a second electrode 130 .
  • the LED chip 40 includes a first electrical connecting wire 410 and a second electrical connecting wire 420 .
  • the present invention includes the fundamental structure described above.
  • FIG. 2 shows a flowchart for manufacturing the package structure of LED module according the first embodiment of the present invention.
  • the chip fixing member 10 provided.
  • the chip fixing member 10 includes the recess 110 .
  • the first and second electrodes 120 , 130 are disposed on the sidewalls of the recess 110 on both sides.
  • the at least one LED chip 40 is disposed in the recess 110 of the chip fixing member 10 .
  • the LED chip 40 has said first and second electrical connecting wires 410 , 420 .
  • the first electrical connecting wire 410 is connected to the first electrode 120 and the second electrical connecting wire 420 is connected to the second electrode 130 for forming electrical circuitry.
  • the light-pervious member 20 is disposed on the recess 110 and thus covering the recess 110 .
  • the LED chip 40 is sealed in the recess 110 by using the chip fixing member 10 and the light-pervious member 20 .
  • the recess 110 is filled with air, transparent colloid material, or fluorescent powder for forming a light-emitting module 50 .
  • the light-emitting module 50 uses the first and second electrodes 120 , 130 for connecting electrically the internal and external circuits.
  • a colloid material is disposed on the light-pervious member 20 by dripping for forming a colloid member 30 .
  • the colloid member 30 is a transparent colloid material. Due to the surface tension of the colloid material, the structure has a thick center and a thin periphery, enabling the lens effect. Besides, the surface of the colloid member 30 is curved.
  • the present invention forms the light-emitting module 50 by using the chip fixing member 10 , the light-pervious member 20 , and the LED chip 40 .
  • the chip fixing member 10 , the light-pervious member 20 , and the colloid member 30 are all transparent structures.
  • the chip fixing member 10 and the light-pervious member 20 can be glass or transparent ceramics.
  • the colloid member 30 is made of silica gel materials, silica gel composite materials, epoxy resin, or epoxy resin composite materials.
  • the total reflection effect in the package structure of the light-emitting module 50 can be reduced. Furthermore, the structure formed by dripping of the colloid member 30 can be used.
  • the colloid member 30 has a thick center and a thin periphery, forming a curved surface and enabling a convex lens effect. Consequently, the light of the LED chip 40 can be concentrated by passing through the colloid member 30 .
  • FIG. 3 and FIG. 4 show cross-sectional views of the package structure of LED module according the first and second embodiments of the present invention.
  • the embodiment of the colloid member 30 according to the present invention is disclosed.
  • the colloid member 30 is disposed on one side of the light-emitting module 50 .
  • the colloid member 30 is dripped on the light-pervious member 20 .
  • the chip fixing member 10 is a transparent structure.
  • At least one colloid member 30 is dripped on one side of the light-emitting module 50 , as shown in FIG. 3 .
  • the colloid member 30 is dripped surrounding the light-emitting module 50 , as shown in FIG. 4 , so that the light-emitting paths of the LED chip 40 inside the light-emitting module 50 are all surrounded by the colloid member 30 .
  • the light emitted by the LED chip 40 will pass through the colloid member 30 , which is a structure formed integrally.
  • a plurality of LED chips 40 can be disposed in the recess 110 .
  • the fluorescent powder 60 (not shown in the figures) can be filled inside the recess 110 for covering the light-emitting paths of the LED chips 40 . Consequently, the LED chip 40 can be adjusted for emitting the required color of light.
  • FIG. 5 and FIG. 6 show a three-dimensional view of and a flowchart for manufacturing the package structure of LED module according the third embodiment of the present invention.
  • the third embodiment of the present invention changes the structure and method according to the first embodiment.
  • a chip fixing member 11 provided.
  • the chip fixing member 11 includes a plane 140 .
  • a first electrode 121 and a second electrode 131 are disposed on the sides of the plane 140 .
  • at least one LED chip 40 is disposed on the plane 140 .
  • the LED chip 40 has a first electrical connecting wire 410 and a second electrical connecting wire 420 .
  • the first electrical connecting wire 410 is connected to the first electrode 121 and the second electrical connecting wire 420 is connected to the second electrode 131 for forming electrical circuitry.
  • a sealing colloid 70 is a transparent colloid material.
  • a light-pervious member 20 is disposed on the sealing colloid 70 .
  • the chip fixing member, the LED chip 40 , the sealing colloid 70 , and the light-pervious member 20 are used for forming a light-emitting module 51 .
  • the light-emitting module 51 uses the first and second electrodes 121 , 131 for connecting electrically the internal and external circuits of the sealing colloid 70 .
  • a colloid material is disposed on the light-pervious member 20 by dripping for forming at least a colloid member 30 .
  • the colloid member 30 is a transparent colloid material. Due to the surface tension of the colloid material, the structure has a thick center and a thin periphery, enabling the lens effect. Besides, the surface of the colloid member 30 is curved.
  • FIG. 7 and FIG. 8 show cross-sectional views of the package structure of LED module according the third and fourth embodiments of the present invention.
  • the third and fourth embodiments of the present invention are shown.
  • the third and fourth embodiments are the same as the first and second embodiments. The difference is only on the structure of the light-emitting module 51 .
  • the chip fixing member 11 is also a transparent structure. Hence, the details will not be described again.
  • both of the third and fourth embodiments include a plurality of LED chips 40 on the plane 140 .
  • the light-emitting module 51 is thus formed by the chip fixing member 11 , the light-pervious member 20 , the sealing colloid 70 , and the plurality of LED chips 40 .
  • the chip fixing member 11 , the light-pervious member 20 , and the colloid member 30 are all transparent structures.
  • the chip fixing member 11 and the light-pervious member 20 can be glass or transparent ceramics.
  • the sealing colloid 70 and the colloid member 30 are silica gel materials, silica gel composite materials, epoxy resin, or epoxy resin composite materials.
  • the fluorescent powder 60 (not shown in the figures) can cover the light-emitting paths of the plurality of LED chips 40 . Consequently, the plurality of LED chip 40 can be adjusted for emitting the required color of light.
  • the present invention provides a package structure of LED module and the method for manufacturing the same.
  • the present invention mainly provides the chip fixing member 10 having the recess 110 .
  • At least an LED chip 40 is disposed in the recess 110 .
  • the light-pervious member 20 which is a transparent structure, covers the recess 110 .
  • At least a colloid member 30 is dripped on the light-pervious member 20 .
  • the colloid member 30 is a transparent structure having a thick center and a thin periphery.
  • the chip fixing member 11 is used as well.
  • the chip fixing member 11 has the plane 140 .
  • At least an LED chip 40 is disposed on the plane 40 .
  • the sealing colloid 70 is further disposed for covering the LED chip 40 .
  • the light-pervious member 20 is disposed on the sealing colloid 70 and is a transparent structure.
  • the colloid member 30 is a transparent structure having a thick center and a thin periphery.
  • the chip fixing members 10 , 11 are transparent structures.
  • At least a colloid member 30 is dripped on one side of the light-emitting modules 50 , 51 .
  • the colloid member 30 can cover the light-emitting paths of the light-emitting modules 50 , 51 completely.
  • the light-pervious member 20 and the colloid member 30 are disposed on the light-emitting paths of the light-emitting modules 50 . 51 for reducing the total reflection in the package.
  • the present invention is endowed with nonobviousness and novelty.
  • the present invention conforms to the legal requirements owing to its novelty, nonobviousness, and utility.
  • the foregoing description is only embodiments of the present invention, not used to limit the scope and range of the present invention. Those equivalent changes or modifications made according to the shape. structure, feature, or spirit described in the claims of the present invention are included in the appended claims of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.

Description

    FIELD OF THE INVENTION
  • The present invention relates generally to a structure for reducing total reflection of light-emitting diode chips, and particularly to a package structure of light-emitting diode module and the method for manufacturing the same.
    • BACKGROUND OF THE INVENTION
  • In the trend of energy shortage, energy conservation and carbon reduction have become the guidelines for everyone's living. Various manufacturing technologies using advanced technologies appear. Many industrial products and electronic products are invented, facilitating people's living significantly. Limit-emitting diodes (LEDs) have a special light-emitting mechanism and the advantages of environmental protection and energy conservation. Their applications are developing prosperously, including backlight plates of LCD, large signboards, headlights, and lighting applications. In Taiwan, early involvement was in die and wafer fabrication. At present. the LED industry has established a delicate division of the supply chain. In addition, the domestic LED companies all endeavor in improving their capabilities in research and development for expanding to high value-added markets. A part of the innovation is related to the package material and structure of LEDs.
  • Many industrial and electronic products are demanding increasingly in technologies. This is the case for LEDs particularly. These semiconductor devices are usually used as indicators or displays. They can convert electrical energy to photo energy directly with high efficiency. They also long usage hours as long as several tens to hundreds of thousands of hours. Moreover, in comparison with traditional bulbs, they also have the advantages of breakage resistance and saving power. Nonetheless, they all need a reasonable package form for various types before they are adopted in practical applications.
  • The package form of LED depends on the application scenario, the appearance, the size, the heat dissipation solution, and the light emitting effect. There are many types in the package forms of LED. Currently, according to the package forms, LED chips are categorized into Lamp-LED, TOP-LED, Side-LED, SMD-LED, Flip Chip-LED, and High-Power-LED.
  • In general, the overall light-emitting performance is influenced by the LED chip, the package form, and the package material. As the epitaxy technology progresses, the internal light-emitting efficiency of LED chip has reached above 90%. Nonetheless, owing to the influences of package structure and material, the equivalent light-emitting efficiency cannot be reached from the outside of LED modules. Thereby, the package structure and material of LED chips are important to the brightness of LED chips.
  • Accordingly, the present invention improves the drawbacks in the prior art and provides a package structure of LED module and the method for manufacturing the same. The method mainly comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. By using the transparent structure of the light-pervious member and the colloid member described above, the total reflection effect in the package is reduced. Hence, the structure according to the present invention is endowed with nonobviousness and novelty.
    • SUMMARY
  • An objective of the present invention is to provide a package structure of LED module and the method for manufacturing the same. The light-pervious member and colloid member are used for reducing the total reflection effect in the package.
  • In order to achieve the objective and efficacy described above, the present invention provides a package structure of LED module and the method for manufacturing the same. The method mainly comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 shows a three-dimensional view of the package structure of LED module according the first embodiment of the present invention;
  • FIG. 2 shows a flowchart for manufacturing the package structure of LED module according the first embodiment of the present invention;
  • FIG. 3 shows a cross-sectional view of the package structure of LED module according the first embodiment of the present invention;
  • FIG. 4 shows a cross-sectional view of the package structure of LED module according the second embodiment of the present invention;
  • FIG. 5 shows a three-dimensional view of the package structure of LED module according the third embodiment of the present invention;
  • FIG. 6 shows a flowchart for manufacturing the package structure of LED module according the third embodiment of the present invention;
  • FIG. 7 shows a cross-sectional view of the package structure of LED module according the third embodiment of the present invention; and
  • FIG. 8 shows a cross-sectional view of the package structure of LED module according the fourth embodiment of the present invention.
    •  DETAILED DESCRIPTION
  • In order to make the structure and characteristics as well as the effectiveness of the present invention to be further understood and recognized, the detailed description of the present invention is provided as follows along with embodiments and accompanying figures.
  • The package structure of LED module and the method for manufacturing the same according to the present invention solve the problem of larger refractivity in a general LED module than outside. In other words, most of the light generate by the LED module is totally reflected back to the inside of the LED module from the interface between the package structure and the LED module. The totally reflected light is absorbed by the internal electrodes and substrate. Thereby, the light extraction efficiency of the LED chip is far lower than the internal quantum efficiency. The present invention improves the drawbacks in the light emitting efficiency of the LED module according to the prior art. By using the light-pervious member and the colloid member, the total reflection effect in the package can be reduced. Hence, the structure according to the present invention is endowed with nonobviousness and novelty.
  • Please refer to FIG. 1, which shows a three-dimensional view of the package structure of LED module according the first embodiment of the present invention. As shown in the figure, the present invention uses a chip fixing member 10, a light-pervious member 20, a colloid member 30, and at least an LED chip 40. The chip fixing member 10 further includes a recess 110, a first electrode 120, and a second electrode 130. The LED chip 40 includes a first electrical connecting wire 410 and a second electrical connecting wire 420. The present invention includes the fundamental structure described above.
  • Please refer to FIG. 2, which shows a flowchart for manufacturing the package structure of LED module according the first embodiment of the present invention. As shown in the figure, in the step S100, first, the chip fixing member 10 provided. The chip fixing member 10 includes the recess 110. The first and second electrodes 120, 130 are disposed on the sidewalls of the recess 110 on both sides. Next, in the step S200, the at least one LED chip 40 is disposed in the recess 110 of the chip fixing member 10. The LED chip 40 has said first and second electrical connecting wires 410, 420. The first electrical connecting wire 410 is connected to the first electrode 120 and the second electrical connecting wire 420 is connected to the second electrode 130 for forming electrical circuitry. Then, in the step S300, the light-pervious member 20 is disposed on the recess 110 and thus covering the recess 110. Afterwards, in the step S400, the LED chip 40 is sealed in the recess 110 by using the chip fixing member 10 and the light-pervious member 20. The recess 110 is filled with air, transparent colloid material, or fluorescent powder for forming a light-emitting module 50. The light-emitting module 50 uses the first and second electrodes 120, 130 for connecting electrically the internal and external circuits. In addition, a colloid material is disposed on the light-pervious member 20 by dripping for forming a colloid member 30. The colloid member 30 is a transparent colloid material. Due to the surface tension of the colloid material, the structure has a thick center and a thin periphery, enabling the lens effect. Besides, the surface of the colloid member 30 is curved.
  • The present invention forms the light-emitting module 50 by using the chip fixing member 10, the light-pervious member 20, and the LED chip 40. The chip fixing member 10, the light-pervious member 20, and the colloid member 30 are all transparent structures. The chip fixing member 10 and the light-pervious member 20 can be glass or transparent ceramics. The colloid member 30 is made of silica gel materials, silica gel composite materials, epoxy resin, or epoxy resin composite materials. Thereby, the light emitted from the LED chip 40 inside the light-emitting module 50 will not be limited by the package structure of the light-emitting module 50. The light of the LED chip 40 passes through the light-emitting module 50 and emits outwards. By using the above method, the total reflection effect in the package structure of the light-emitting module 50 can be reduced. Furthermore, the structure formed by dripping of the colloid member 30 can be used. The colloid member 30 has a thick center and a thin periphery, forming a curved surface and enabling a convex lens effect. Consequently, the light of the LED chip 40 can be concentrated by passing through the colloid member 30.
  • Please refer to FIG. 3 and FIG. 4, which show cross-sectional views of the package structure of LED module according the first and second embodiments of the present invention. As shown in the figures, the embodiment of the colloid member 30 according to the present invention is disclosed. The colloid member 30 is disposed on one side of the light-emitting module 50. According to the first embodiment, as shown in FIG. 3, the colloid member 30 is dripped on the light-pervious member 20. When the light of the LED chip 40 passes through the light-pervious member 20 and the colloid member 30, there will be no total reflection. Thereby, the light-emitting efficiency inside the light-emitting module 50 approaches that of outside. In addition, according to the second embodiment, the chip fixing member 10 is a transparent structure. At least one colloid member 30 is dripped on one side of the light-emitting module 50, as shown in FIG. 3. Alternatively, the colloid member 30 is dripped surrounding the light-emitting module 50, as shown in FIG. 4, so that the light-emitting paths of the LED chip 40 inside the light-emitting module 50 are all surrounded by the colloid member 30. The light emitted by the LED chip 40 will pass through the colloid member 30, which is a structure formed integrally. Furthermore, according to both of the two embodiments described above, a plurality of LED chips 40 can be disposed in the recess 110. Besides, the fluorescent powder 60 (not shown in the figures) can be filled inside the recess 110 for covering the light-emitting paths of the LED chips 40. Consequently, the LED chip 40 can be adjusted for emitting the required color of light.
  • Please refer to FIG. 5 and FIG. 6, which show a three-dimensional view of and a flowchart for manufacturing the package structure of LED module according the third embodiment of the present invention. As shown in the figures, the third embodiment of the present invention changes the structure and method according to the first embodiment. In the step S101, a chip fixing member 11 provided. The chip fixing member 11 includes a plane 140. A first electrode 121 and a second electrode 131 are disposed on the sides of the plane 140. Next, in the step S201, at least one LED chip 40 is disposed on the plane 140. The LED chip 40 has a first electrical connecting wire 410 and a second electrical connecting wire 420. The first electrical connecting wire 410 is connected to the first electrode 121 and the second electrical connecting wire 420 is connected to the second electrode 131 for forming electrical circuitry. Then, in the step S301, use a sealing colloid 70 to cover the LED chip 40. The sealing colloid 70 is a transparent colloid material. Afterwards, in the step S401, a light-pervious member 20 is disposed on the sealing colloid 70. Finally, in the step S501, the chip fixing member, the LED chip 40, the sealing colloid 70, and the light-pervious member 20 are used for forming a light-emitting module 51. The light-emitting module 51 uses the first and second electrodes 121, 131 for connecting electrically the internal and external circuits of the sealing colloid 70. In addition, a colloid material is disposed on the light-pervious member 20 by dripping for forming at least a colloid member 30. The colloid member 30 is a transparent colloid material. Due to the surface tension of the colloid material, the structure has a thick center and a thin periphery, enabling the lens effect. Besides, the surface of the colloid member 30 is curved.
  • Please refer to FIG. 7 and FIG. 8, which show cross-sectional views of the package structure of LED module according the third and fourth embodiments of the present invention. As shown in the figures, the third and fourth embodiments of the present invention are shown. The third and fourth embodiments are the same as the first and second embodiments. The difference is only on the structure of the light-emitting module 51. In the second embodiment, the chip fixing member 11 is also a transparent structure. Hence, the details will not be described again. Furthermore, both of the third and fourth embodiments include a plurality of LED chips 40 on the plane 140. The light-emitting module 51 is thus formed by the chip fixing member 11, the light-pervious member 20, the sealing colloid 70, and the plurality of LED chips 40. The chip fixing member 11, the light-pervious member 20, and the colloid member 30 are all transparent structures. The chip fixing member 11 and the light-pervious member 20 can be glass or transparent ceramics. The sealing colloid 70 and the colloid member 30 are silica gel materials, silica gel composite materials, epoxy resin, or epoxy resin composite materials. Besides, the fluorescent powder 60 (not shown in the figures) can cover the light-emitting paths of the plurality of LED chips 40. Consequently, the plurality of LED chip 40 can be adjusted for emitting the required color of light.
  • To sum up, the present invention provides a package structure of LED module and the method for manufacturing the same. The present invention mainly provides the chip fixing member 10 having the recess 110. At least an LED chip 40 is disposed in the recess 110. Then the light-pervious member 20, which is a transparent structure, covers the recess 110. At least a colloid member 30 is dripped on the light-pervious member 20. The colloid member 30 is a transparent structure having a thick center and a thin periphery. In addition, the chip fixing member 11 is used as well. The chip fixing member 11 has the plane 140. At least an LED chip 40 is disposed on the plane 40. The sealing colloid 70 is further disposed for covering the LED chip 40. Next, the light-pervious member 20 is disposed on the sealing colloid 70 and is a transparent structure. The colloid member 30 is a transparent structure having a thick center and a thin periphery. Furthermore, the chip fixing members 10, 11 are transparent structures. At least a colloid member 30 is dripped on one side of the light-emitting modules 50, 51. Alternatively, the colloid member 30 can cover the light-emitting paths of the light-emitting modules 50, 51 completely. According to the present invention, the light-pervious member 20 and the colloid member 30 are disposed on the light-emitting paths of the light-emitting modules 50. 51 for reducing the total reflection in the package. Hence, the present invention is endowed with nonobviousness and novelty.
  • Accordingly, the present invention conforms to the legal requirements owing to its novelty, nonobviousness, and utility. However, the foregoing description is only embodiments of the present invention, not used to limit the scope and range of the present invention. Those equivalent changes or modifications made according to the shape. structure, feature, or spirit described in the claims of the present invention are included in the appended claims of the present invention.

Claims (13)

1. A method for manufacturing a light-emitting diode module, comprising steps of:
providing a light-emitting module including at least a light-emitting diode disposed in a recess of a chip fixing member, and said chip fixing member is a transparent structure;
disposing a light-pervious member in the light-emitting path of said light-emitting module, and said light-pervious member being a transparent structure; and
dripping a plurality of colloid members on said light-pervious member and a plurality of surrounding surfaces of the light-emitting module respectively, and each said colloid member forming a transparent structure having a thick center and a thin periphery owing to the surface tension of the colloid material.
2. The method for manufacturing a light-emitting diode module of claim 1, wherein said colloid member is silica gel, silica gel composite material, epoxy resin, or epoxy resin composite material.
3. The method for manufacturing a light-emitting diode module of claim 1, wherein said light-pervious member is glass or transparent ceramics.
4. A package structure of light-emitting diode module, comprising:
a chip fixing member, having a recess, and having at least a light-emitting diode disposed in said recess;
a light-pervious member, used for covering said recess, and being a flat transparent structure; and
a plurality of colloid members, disposed on said light-pervious member and surrounding the light-emitting module, and being a plurality of transparent structures;
wherein said chip fixing member is a transparent structure.
5. (canceled)
6. The package structure of light-emitting diode module of claim 4, wherein said light-pervious member is glass or transparent ceramics.
7. The package structure of light-emitting diode module of claim 4, wherein said colloid member is silica gel, silica gel composite material, epoxy resin, or epoxy resin composite material.
8. The package structure of light-emitting diode module of claim 4, wherein said recess is filled with air, transparent colloid material, or fluorescent powder.
9. A package structure of light-emitting diode module, comprising:
a chip fixing member, having a plane, and having at least a light-emitting diode disposed on said plane;
a sealing colloid, covering said light-emitting diode chip, and being a transparent structure;
a light-pervious member, disposed on said sealing colloid, and being a flat transparent structure; and
a plurality of colloid members, disposed on said light-pervious member and surrounding the light-emitting module, and being a plurality of transparent structures
wherein said chip fixing member is a transparent structure.
10. (canceled)
11. The package structure of light-emitting diode module of claim 9, wherein said light-pervious member is glass or transparent ceramics.
12. The package structure of light-emitting diode module of claim 9, wherein said colloid member is silica gel, silica gel composite material, epoxy resin, or epoxy resin composite material.
13. The package structure of light-emitting diode module of claim 9, wherein said sealing colloid is mixed with fluorescent powder.
US14/450,414 2014-08-04 2014-08-04 Package structure of light-emitting diode module and method for manufacturing the same Active US9257620B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/450,414 US9257620B1 (en) 2014-08-04 2014-08-04 Package structure of light-emitting diode module and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/450,414 US9257620B1 (en) 2014-08-04 2014-08-04 Package structure of light-emitting diode module and method for manufacturing the same

Publications (2)

Publication Number Publication Date
US20160035947A1 true US20160035947A1 (en) 2016-02-04
US9257620B1 US9257620B1 (en) 2016-02-09

Family

ID=55180912

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/450,414 Active US9257620B1 (en) 2014-08-04 2014-08-04 Package structure of light-emitting diode module and method for manufacturing the same

Country Status (1)

Country Link
US (1) US9257620B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD788083S1 (en) * 2015-09-20 2017-05-30 Airgain Incorporated Antenna
CN108258108A (en) * 2016-12-27 2018-07-06 佛山市国星光电股份有限公司 The LED support and its manufacturing method of a kind of high contrast, LED component and LED display
CN112054109A (en) * 2020-09-11 2020-12-08 天津中环电子照明科技有限公司 Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9502612B2 (en) * 2009-09-20 2016-11-22 Viagan Ltd. Light emitting diode package with enhanced heat conduction
CN102683514B (en) * 2011-03-06 2017-07-14 维亚甘有限公司 LED package and manufacture method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD788083S1 (en) * 2015-09-20 2017-05-30 Airgain Incorporated Antenna
CN108258108A (en) * 2016-12-27 2018-07-06 佛山市国星光电股份有限公司 The LED support and its manufacturing method of a kind of high contrast, LED component and LED display
CN112054109A (en) * 2020-09-11 2020-12-08 天津中环电子照明科技有限公司 Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure

Also Published As

Publication number Publication date
US9257620B1 (en) 2016-02-09

Similar Documents

Publication Publication Date Title
US20090101932A1 (en) Semiconductor light-emitting device and method of fabricating the same
CN102800789A (en) Light-emitting module and lighting apparatus
TWI450422B (en) Structure of the led package
US20170110443A1 (en) Led light bar manufacturing method and led light bar
TWM453969U (en) Light emitting device
TW201538887A (en) Lighting-emitting diode assembly and LED bulb using the same
US9257620B1 (en) Package structure of light-emitting diode module and method for manufacturing the same
US8536593B2 (en) LED device having two LED dies separated by a dam
KR101255671B1 (en) Led package module and manufacturing method thereof
KR102153082B1 (en) Light emitting apparatus
CN202758885U (en) Light emitting diode module packaging structure
TW201426966A (en) Light emitting diode light bar
CN102322584A (en) Ultrathin LED (light-emitting diode) surface light source based on COB (chip on board) packaging technology
CN106229311B (en) A kind of production technology of LED light emitting diode
TWI573299B (en) Compound semiconductor device package module structure and fabricating method thereof
EP2325908A2 (en) Light emitting device package
TW201316565A (en) Packaging method of light emitting diode with glue wall
US20140319562A1 (en) Light-emitting diode package structure
US20120273809A1 (en) Light emitting diode device
KR20110061421A (en) Light emitting diode package and liquid crystal display device having thereof
TWI566439B (en) Package structure and method for fabricating the same
US20090050910A1 (en) Flat panel based light emitting diode package structure
TWI596803B (en) LED module package structure and manufacturing method thereof
CN204011469U (en) LED package and lighting device
CN210073844U (en) LED packaging structure

Legal Events

Date Code Title Description
AS Assignment

Owner name: PROLIGHT OPTO TECHNOLOGY CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, CHEN-LUN HSING;TSAI, FENG-CHUAN;HUNG, JUNG-HAO;REEL/FRAME:033454/0458

Effective date: 20140528

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2551); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2552); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

Year of fee payment: 8