KR102153082B1 - Light emitting apparatus - Google Patents

Abstract

The light emitting device according to the embodiment includes a body having a cavity; A first lead frame disposed in the cavity and extending in a direction of a first side of the body; A second lead frame disposed in the cavity and extending toward a second side of the body; A light emitting device disposed on at least one of the first and second lead frames disposed in the cavity, and including a light emitting chip electrically connected to the first and second lead frames; And an optical lens disposed on the light-emitting element, wherein the optical lens includes an incident surface and a plurality of bosses; The plurality of bosses include first and second bosses having different shapes, the light emitting element includes a plurality of coupling portions recessed lower than the upper surface of the body in an outer region, and the plurality of coupling portions in each of the coupling portions At least one of the bosses is combined.

Description

Light emitting device {LIGHT EMITTING APPARATUS}

The present invention relates to a light emitting device.

A light-emitting device, for example, a light-emitting diode, is a type of semiconductor device that converts electrical energy into light, and is in the spotlight as a next-generation light source by replacing conventional fluorescent and incandescent lamps.

Since light-emitting diodes use semiconductor devices to generate light, they consume very little power compared to incandescent lamps that generate light by heating tungsten, or fluorescent lamps that generate light by colliding with a phosphor with ultraviolet rays generated through high-pressure discharge. .

In addition, since the light emitting diode generates light using the potential gap of a semiconductor device, it has a longer lifespan, faster response characteristics, and eco-friendly characteristics compared to conventional light sources.

Accordingly, many studies are being conducted to replace existing light sources with light-emitting diodes, and the use of light-emitting diodes is increasing as a light source of lighting devices such as various lamps, liquid crystal displays, electric signs, and street lights used indoors and outdoors.

The embodiment provides a light emitting device having a tilt prevention structure for preventing tilt of an optical lens.

The embodiment provides a light emitting device in which a tilt prevention structure is formed at a coupling portion between a boss protruding from an optical lens and a light emitting element.

The light emitting device according to the embodiment includes a body having a cavity; A first lead frame disposed in the cavity and extending in a direction of a first side of the body; A second lead frame disposed in the cavity and extending toward a second side of the body; A light emitting device disposed on at least one of the first and second lead frames disposed in the cavity, and including a light emitting chip electrically connected to the first and second lead frames; And an optical lens disposed on the light-emitting element, wherein the optical lens includes an incident surface and a plurality of bosses; The plurality of bosses include first and second bosses having different shapes, the light emitting element includes a plurality of coupling portions recessed lower than the upper surface of the body in an outer region, and the plurality of coupling portions in each of the coupling portions At least one of the bosses is combined.

The embodiment may suppress the tilt of the optical lens coupled to the light emitting device.

The embodiment may improve the reliability of a light emitting device having an optical lens.

The embodiment may improve the reliability of an optical member such as an optical lens.

The embodiment may improve the reliability of a lighting system having a light emitting device.

1 is a perspective view of a light emitting device according to a first embodiment.
2 is a plan view of a light emitting element of the light emitting device of FIG. 1.
3 is a cross-sectional view on the AA side of the light emitting device of FIG. 2.
4 is a cross-sectional view of the light emitting device of FIG. 1 on the BB side.
5 is a plan view as viewed from the CC line of the light emitting device of FIG. 4.
6 is a bottom view of an optical lens of the light emitting device of FIG. 1.
7 is a side cross-sectional view illustrating a light emitting device according to a second embodiment.
8 is an enlarged view showing an example of coupling the bosses of the light emitting lens of FIG. 7.
9 is a plan view illustrating an example of the light emitting device of FIG. 7.
10 is a plan view illustrating another example of the light emitting device of FIG. 9.
11 is a plan view illustrating another example of the light emitting device of FIG. 9.
12 and 13 are views showing another example of a coupling portion of a light emitting element in the light emitting device according to the embodiment.
14 is a side cross-sectional view of a light emitting device according to a third embodiment.
15 is a side cross-sectional view of a light emitting device according to a fourth embodiment.
16 is a side cross-sectional view of a light emitting device according to the fifth embodiment.
17 is a side cross-sectional view of a light emitting device according to the sixth embodiment.
18 is a side cross-sectional view illustrating a light emitting device according to the seventh embodiment.
19 is a diagram illustrating a modified example of a boss of an optical lens according to an embodiment.
20 is a diagram illustrating a modified example of a boss of an optical lens according to an embodiment.
21 is a side cross-sectional view illustrating a light emitting device according to an eighth embodiment.
22 is a side cross-sectional view illustrating a light emitting device according to the ninth embodiment.
23 is a diagram illustrating a light emitting element of the light emitting device of FIG. 22.
24 is a side view of a light emitting element of the light emitting device of FIG. 23.
25 is a side view of a light emitting device according to a thirteenth embodiment.
26 is a plan view of the light emitting device of FIG. 25.
27 is a diagram illustrating a light directivity distribution of a light emitting device according to an embodiment.
28 is a diagram illustrating a light emitting chip according to an embodiment.
29 is a diagram illustrating another example of a light emitting chip according to the embodiment.
30 is a diagram illustrating a display device having a light emitting device according to an exemplary embodiment.
31 is a diagram illustrating another example of a display device having a light emitting device according to the embodiment.
32 is a perspective view illustrating a lighting device having a light emitting device according to an embodiment.

Hereinafter, embodiments will be clearly revealed through the accompanying drawings and descriptions of the embodiments. In the description of the embodiments, each layer (film), region, pattern, or structure is “on” or “under/under” the substrate, each layer (film), region, pad, or patterns. In the case of being described as being "formed in", "on" and "under" are both "directly" or "indirectly" formed Include. In addition, the standards for the top/top or bottom/bottom of each layer will be described based on the drawings.

In the drawings, the sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of each component does not fully reflect the actual size. Also, the same reference numerals denote the same elements throughout the description of the drawings. Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a light emitting device according to a first embodiment, FIG. 2 is a plan view of a light emitting device of the light emitting device of FIG. 1, FIG. 3 is a cross-sectional view of the light emitting device of FIG. 2, and FIG. 4 is It is a cross-sectional view on the BB side of the light emitting device, FIG. 5 is a plan view as viewed from the CC line of the light emitting device of FIG. 4, and FIG. 6 is a bottom view of an optical lens of the light emitting device of FIG.

1 to 6, the light emitting device 100 includes a light emitting element 110 and an optical lens 161 coupled to the light emitting element 110.

The light emitting device 110 includes a body 141 having a cavity 142, a plurality of lead frames 121 and 131 extending in opposite directions within the cavity 142; A light emitting chip 145 disposed on at least one of a plurality of lead frames 121 and 131 disposed in the cavity 142; A translucent resin layer 151 is included in the cavity 142. The light emitting device 110 may be coupled to or attached to the lens unit 155 on the light-transmitting resin layer 151, and may include the lens unit 155.

In the light emitting device 110, a first direction (X) is described as a length (X1), a second direction (Y) perpendicular to the first direction (X) is described as a width (Y1), and the light emitting chip A direction Z perpendicular to the upper surface of the light emitting chip 145 may be described as a normal direction to the upper surface of the light emitting chip 145.

The body 141 is coupled to the plurality of lead frames 121 and 131 and supports the plurality of lead frames 121 and 131. The body 141 may include at least one of an insulating material, a conductive material, a transmissive material, and a reflective material, and will be described as an insulating material for convenience of description, and the insulating material includes a reflective material or a transmissive material. The reflective material may be formed of a material having a reflectance higher than transmittance with respect to the wavelength emitted from the light emitting chip 145, for example, a material having a reflectivity of 70% or more. When the body 141 has a reflectance of 70% or more, it may be defined as a non-transmissive material. When the body 141 is a transmissive material, it may be formed of a material having a transmittance higher than the reflectance, for example, a material having a transmittance of 70% or more, with a transmittance higher than the reflectance for a wavelength emitted from the light emitting chip 145. have.

The body 141 may be formed of a resin material such as a resin-based insulating material, for example, polyphthalamide (PPA), an epoxy-based material, or a silicone-based material. The silicone or epoxy includes a white resin. The body 141 may be formed of a thermosetting resin, or a material having high heat resistance and high light resistance. In addition, an acid anhydride, an antioxidant, a release material, a light reflecting material, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added to the body 141. Contains. The body 141 may be molded by at least one selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and an acid composed of hexahydro phthalic anhydride, 3-methylhexahydro phthalic anhydride 4-methylhexahydro phthalic anhydride, Anhydride was added DBU (1,8-Diazabicyclo(5,4,0)undecene-7) as a curing accelerator to the epoxy resin, ethylene glycol, titanium oxide pigment, and glass fiber as a cocatalyst, and partially by heating. A solid epoxy resin composition obtained by curing and forming a B-stage may be used, but is not limited thereto.

In addition, a light-shielding material or a diffusing agent may be mixed in the body 141 to reduce transmitted light. In addition, the body 141 is suitably mixed with at least one selected from the group consisting of a diffusion agent, a pigment, a fluorescent material, a reflective material, a light-shielding material, a light stabilizer, and a lubricant in the thermosetting resin in order to have a predetermined function You may do it.

The body 141 may have a metal oxide or metal nitride added to a resin material such as epoxy or silicon. The metal oxide includes at least one of TiO ₂ , SiO ₂ , Al ₂ O _3, ZrO ₃ , Y ₂ O ₃ , and the metal nitride includes AlN, and is added in a ratio of 5 wt% or more in the body 141 Can be. The addition ratio of impurities such as metal oxide and metal nitride may vary depending on light reflection efficiency.

The body 141 may have a flat or rough upper surface, and reflect light incident through the upper surface.

The body 141 has a circular top view or a polygonal shape. In the case of a polygonal shape, the body 141 may have a curved or angular edge, but is not limited thereto.

When the body 141 has a polygonal shape, the first and second side surfaces 11 and 12 disposed on opposite sides and the first and second side surfaces 11 and 12 are adjacent to each other and disposed on opposite sides. Including the third and fourth sides (13, 14), the distance between the first and second sides (11, 12) may be equal to or shorter than the length (X1) of the light-emitting element 110, the third And a gap between the fourth side surfaces 13 and 14 may be equal to or shorter than the width Y1 of the light emitting device 110. The lengths of the first and second side surfaces 11 and 12 may be the same as or different from the lengths of the third and fourth side surfaces 13 and 14, but are not limited thereto.

Looking at the cavity 142 of the body 141, when the top view shape is a circular or polygonal shape, or a polygonal shape, a corner portion may be formed in a curved surface, and the shape of the cavity 142 is not limited. Further, the circumferential surface of the cavity 142 may be formed to be inclined or perpendicular to the upper surfaces of the first and second lead frames 121 and 131.

First and second lead frames 121 and 131 are disposed at the bottom of the cavity 142, and the first lead frame 121 is formed at the bottom of the cavity 142 and the first side surface 11 of the body 141 ), and extends in the direction of the third and fourth sides 13 and 14.

The second lead frame 131 extends from the bottom of the cavity 142 toward the second side surface 12 and the third and fourth side surfaces 13 and 14 of the body 141.

At least one of the first and second lead frames 121 and 131 includes a recess or a through hole 123 recessed in the upper or lower surface, and the recess and the coupling hole 123 include a Some 143 are combined. Accordingly, a bonding force between the body 141 and the first and second lead frames 121 and 131 may be strengthened.

The first lead frame 121 and the second lead frame 131 are made of metal, such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum. Contains at least one or two or more alloys of nium (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P), and may be formed of a single layer or different metal layers, limited to this I don't. The first and second lead frames 121 and 131 are made of metal, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), At least one of platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P), or an alloy of two or more materials may be included. When any one layer is an alloy, the first and second lead frames 121 and 131 are copper (Cu) and at least one type of metal alloy, such as copper-zinc alloy, copper-iron alloy, copper-chromium alloy, copper -Contains alloys such as silver-iron. The thicknesses of the first and second lead frames 121 and 131 may be 0.1mm to 1.5mm, and include, for example, 0.1mm to 0.5mm.

The first lead frame 121 may be exposed under the first side surface 11 of the body 141, and the second lead frame 131 is under the second side surface 12 of the body 141 Can be exposed as. The first and second lead frames 121 and 131 may or may not be exposed under the third and fourth side surfaces 13 and 14 of the body 141. The lower surfaces of the first and second lead frames 121 and 131 may be exposed on the lower surface of the light emitting element 110 and may be disposed on the same plane as the lower surface of the body 141.

A gap 115 is disposed between the first and second lead frames 121 and 131, and the gap 115 may be formed of a material of the body 141. The gap 115 may have a lower width wider than an upper width, or an upper width wider than a lower width. The gap 115 is physically coupled to the first lead frame 121 and the second lead frame 131, and the first lead frame 121 and the second lead frame 131 are spaced apart from each other. Will support

The light emitting chip 145 may be disposed on at least one of the first and second lead frames 121 and 131 disposed in the cavity 142 and is electrically connected to the first and second lead frames 121 and 131 do. The light emitting chip 145 may be bonded to and connected to the first lead frame 121 with a conductive adhesive, and may be connected to the second lead frame 131 by a wire 147. As another example, the light emitting chip 145 may be connected to the first and second lead frames 121 and 131 by wires.

The light emitting chip 145 may include at least one of an LED chip using a semiconductor compound, for example, an ultraviolet (UV) LED chip, a blue LED chip, a green LED chip, a white LED chip, and a red LED chip. The light-emitting chip 145 may be a group II-VI compound semiconductor or a group III-V compound semiconductor, and the inner active layer is a double junction structure, a single well structure, a multiple well structure, a single quantum well, and a multiple It may be formed of at least one of a quantum well (MQW), a quantum line, and a quantum dot structure. In the active layer, well layers/barrier layers are alternately arranged, and the cycle of the well layer/barrier layer is, for example, InGaN/GaN, GaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, or InAlGaN/InAlGaN stacked structure. Thus, it can be formed in 2 to 30 cycles. In addition, the active layer may include a semiconductor of a series such as ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, and AlInGaP, but is not limited thereto. The light emission wavelength of the active layer may selectively emit light from light in the ultraviolet band to light in the visible light band, but is not limited thereto. The thickness of the light emitting chip 145 may be formed in the range of 80 µm to 500 µm, for example, 80 µm to 150 µm, but is not limited thereto.

A translucent resin layer 151 is disposed in the cavity 142, and the translucent resin layer 151 molds the light emitting chip 145. A circumference of the light-transmitting resin layer 151 may be adhered to a circumference of the cavity 142, and a lower part may be adhered to the first and second lead frames 121 and 131. The upper surface of the light-transmitting resin layer 151 may be formed as a flat horizontal surface, a concave surface, or a convex surface.

The light-transmitting resin layer 151 may be formed of a resin material such as silicone or epoxy, and the transmittance of the light emitting chip 145 is 70% or more, eg, 90% or more, for a wavelength emitted from the light emitting chip 145 Can be. The refractive index of the translucent resin layer 151 is 2.0 or less, for example, 1.6 or less, and may be lower than the refractive index of the body 141.

The translucent resin layer 151 may be a layer to which impurities are not added or may be formed as a layer to which impurities are added. Here, the impurity may include at least one of a filler, a diffusion agent, a pigment, a phosphor, and a reflector. The phosphor mixed with the translucent resin layer 151 absorbs light emitted from the light emitting chip 145 and converts it into light of a different wavelength. The phosphor may include at least one of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor, and for example, a nitride-based phosphor, an oxynitride-based phosphor, which is mainly activated by a lanthanoid-based element such as Eu or Ce. Alkaline earth halogen apatite phosphor, alkaline earth metal boric acid halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal aluminate phosphor, which is mainly activated by elements of lanthanide type such as Eu, transition metal type such as Mn, etc. Earth sulfide, alkaline earth thiogallate, alkaline earth silicon nitride, germanate, or rare earth aluminate mainly activated by lanthanoid elements such as Ce, rare earth silicate, or lanthanoid elements such as Eu. It may be at least one or more selected from organic and organic complexes. As a specific example, the above phosphor can be used, but is not limited thereto.

The cavity 142 and the light-transmitting resin layer 151 include a lens unit 155, the lens unit 155 has a diameter or width wider than the width of the cavity 142, and the upper surface of the body 141 It can be adhered on (148). The lens unit 155 refracts light incident through the translucent resin layer 151 and converts it into a desired direction. The lens unit 155 may be made of a resin material such as silicone or epoxy, or may include a plastic material or glass material. For example, the lens unit 155 may use a transparent material having a refractive index in the range of 1.4 to 1.7, for example, polymethyl methacrylate (PMMA) having a refractive index of 1.49, polycarbonate (PC) having a refractive index of 1.59, It may be formed of a transparent resin material of epoxy resin (EP) or a transparent glass (Glass). In addition, the lens unit 155 may be of the same material as the material of the light-transmitting resin layer 151 or the optical lens 161, and thus, light emitted from the light emitting chip 145 is transferred to the lens unit 155 without loss. Can be entered.

The lower surface of the lens unit 155 may be bonded to the upper surface of the translucent resin layer 151, and the upper surface may have a hemispherical shape or a curved shape. Since the top surface of the lens unit 155 protrudes in a direction opposite to the light emitting chip 145, incident light may be emitted to the incident surface of the optical lens 161.

An optical lens 161 is disposed on the light-emitting element 110, and the optical lens 161 may be coupled to the light-emitting element 110 to have a tilt prevention structure. The optical lens 161 may be attached or detached from the light emitting device 110.

The optical lens 161 may have a circular column shape, a polygonal column shape, or a hemispherical shape, or may have a shape having a lower diameter and an upper diameter different from each other.

As shown in FIG. 4, the optical lens 161 includes an incident surface 164 disposed on the light emitting device 110, a total reflection surface 163 that reflects light incident from the incident surface 164, and the overall It includes an emission surface 162 for emitting light reflected by the slope 163 and light incident on the incident surface 164.

The incident surface 164 of the optical lens 161 may be a horizontal surface, or may be formed in a direction opposite to the light emitting chip 145 as a convex surface (164A in FIG. 4) in a normal direction or an optical axis direction. . When the incident surface 164 is formed as a convex surface 164A, the incident efficiency of the light emitted from the lens unit 155 may be increased.

The total reflection surface 163 may be formed around the concave portion 163A that is concave from the top of the optical lens 161 toward the light emitting chip 145, and the total reflection surface 163 is a curved or flat surface. Includes a face, or comprises a face having at least one inflection point. When viewed from a top view, the concave portion 163A may be formed in a rotationally symmetrical shape, and a region corresponding to the light emitting chip 145 may be the deepest, that is, a point closest to the light emitting chip 145. .

The light exit surface 162 is a surface disposed around the optical lens 161 and may include an inclined surface or a curved surface. The light exit surface 162 emits light reflected by the total reflection surface 163 or light transmitted through the incident surface 164. Accordingly, the optical lens 161 may provide a wide light directivity distribution as shown in FIG. 27.

The area 150 between the lens unit 155 and the incident surface 164 of the optical lens 161 is an air area, and the distance E2 may be separated by 1 mm or more, and this distance E2 is the It may vary depending on the incident efficiency of the optical lens 161 on the incident surface 164.

The light emitting device 110 and the optical lens 161 may include a structure to prevent tilt due to a combination of structures corresponding to each other. The tilt prevention structure may be implemented using factors such as the number, position, and shape of bosses protruding from the optical lens 161, for example. Hereinafter, examples of the tilt prevention structure implemented by the number, position, or shape of the bosses will be described.

2 and 5, a plurality of coupling portions 41, 42, 43, and 44 are formed in an outer region of the light emitting device 110, and each of the coupling portions 41, 42, 43, and 44 The upper surface 148 of the body 141 includes a stepped structure and, for example, a region recessed lower than the upper surface of the body 141 may be formed. A part of the body 141 may be disposed on the bottom of each of the coupling portions 41, 42, 43, 44, and the depth T2 of the coupling portions 41, 42, 43, 44 is the body ( It may be formed to be equal to or greater than 1/2 of the thickness T1 of 141, and may be formed to such an extent that upper surfaces of the lead frames 121 and 131 are not exposed. The coupling portions 41, 42, 43, 44 are regions in which each corner portion of the body 141 is recessed in the direction of the light emitting chip 145, for example, the first to fourth sides (11,12) The edge portion between two adjacent side surfaces of ,13,14) is a region recessed in the direction of the light emitting chip 145.

The coupling portions 41, 42, 43, 44 include first and second coupling portions 41 and 42 disposed in a first diagonal direction passing through the light emitting chip 145, and a second coupling portion 41 and 42 passing through the light emitting chip 145. It includes third and fourth coupling portions 43 and 44 arranged in two diagonal directions. At least one inner side or at least two inner side surfaces of the first to fourth coupling portions 41, 42, 43 and 44 may have different numbers of inflection points from the other inner side surfaces. In addition, the inner side surfaces 21 and 23 of the first and third coupling portions 41 and 43 have the same outline, and the inner side surfaces 22 and 24 of the second and fourth coupling portions 42 and 44 are The first and third coupling portions 41 and 43 may have an outline different from that of the inner side surfaces 21 and 23.

The inner side surfaces 21 and 23 of the first and third coupling portions 41 and 43 may be curved or spherical, or may be formed as a flat surface having no inflection point. The inner side surfaces 22 and 24 of the second and fourth coupling portions 42 and 44 may be formed as angular surfaces having at least one inflection point. The inner side (21,22,23,24) of the first to fourth coupling portions (41,42,43,44) is the upper surface 148 of the body 141 and the first to fourth coupling portions ( As a surface connected between the bottoms of 41, 42, 43, 44, it may be formed as a surface perpendicular to the upper surface 148 of the body 141, or may be formed as an inclined surface.

As shown in FIG. 5, the optical lens 161 includes first to fourth bosses 61,62,63,64 coupled to the first to fourth coupling portions 41,42,43,44, , At least one of the first to fourth bosses 61, 62, 63 and 64 may be formed in a different shape, for example, at least two may be formed in a different shape from the other bosses. The first and third bosses (61, 63) have the same shape, and the second and fourth bosses (62, 64) have the same shape and are different from the shapes of the first and third bosses (61, 63). It can be a shape.

The first and third bosses 61 and 63 may have a bottom view shape, a circular shape, a spherical shape, or a curved shape, and for example, the outer shape may include a circular column or an elliptical column. The second and fourth bosses 62 and 64 may have a bottom view shape including at least one angular surface or a polygonal shape, and for example, the outer shape of the second and fourth bosses 62 and 64 may include a polygonal column or fan column shape of a triangle or more. .

Each of the bosses 61,62,63,64 is disposed on each of the coupling portions 41,42,43,44, and the outer circumferential surfaces of the first and third bosses 61,63 are the first and It is in contact with the inner side surfaces (21, 23) of the third coupling portion (41, 43), and the outer peripheral surfaces of the second and fourth bosses (62, 64) are It can be in contact with the inner side (22, 24).

As shown in Figure 4, the height (B1) of the boss (61, 62, 63, 64) may be greater than the distance (E1) between the optical lens 161 and the upper surface of the body 141, for example 3.5mm It can be formed as above. In addition, the height B1 of the bosses 61, 62, 63 and 64 may be formed to be 2 mm or more when the lens unit 155 is removed.

As shown in FIG. 5, the distance D5 between the first and third coupling portions 41 and 43 may be equal to or smaller than the distance between the first and third bosses 61 and 63, and the second and The interval D6 between the four coupling portions 42 and 44 may be equal to or smaller than the interval between the second and fourth bosses 62 and 64. The interval D5 and the interval D6 may be the same as or different from each other, but are not limited thereto.

The diameter or width B2 of each of the bosses 61, 62, 63 and 64 may be formed in a range of 0.8 mm or more, for example, 1 mm to 2 mm, and the width of the bosses 61, 62, 63, 64 is If the width is larger than the range, the light efficiency may be lowered. If the width of the bosses 61, 62, 63, and 64 is smaller than the above range, there is a problem in that the boss is difficult to form and the tilt prevention function is not performed. The bosses 61, 62, 63, and 64 serve as legs of the optical lens 161.

4 and 5, each of the bosses 61, 62, 63, 64 of the optical lens 161 may be adhered to each of the coupling portions 41, 42, 43, 44 with an adhesive 111. In addition, the adhesive 111 may be an adhesive such as silicone or epoxy, or a double-sided tape.

Each boss (61, 62, 63, 64) of the optical lens 161 is coupled to and adhered to each of the coupling portions (41, 42, 43, 44) of the light emitting element 110, so that the optical lens 161 ) Can be prevented from tilting. That is, each boss (61, 62, 63, 64) of the optical lens 161 is coupled to the coupling portions (41, 42, 43, 44) of the light emitting element 110, so that the tilt of the optical lens 161 Can be managed within 30㎛. Accordingly, it is possible to minimize a change in the distribution of the directivity angle of light emitted from the optical lens 161, thereby improving the optical reliability of the light emitting device. Also, the uniformity of the image emitted from the light emitting device 100 may be stabilized. In addition, by forming the surface of each coupling portion (41, 42, 43, 44) of the body 141 by injection, the flatness of the surface of each coupling portion (41, 42, 43, 44) can be improved. I can.

As shown in Fig. 6, the first to fourth bosses 61,62,63,64 are the presidential line segments connecting the first and third bosses 61,63 and the second and fourth bosses 62,64 The angle θ1 formed by the different line segments at the point R2 where diagonal line segments connecting) intersect may be formed in a range of 80 degrees to 100 degrees, for example, 88 degrees to 92 degrees.

2 and 6, the diameter or width Y2 of the incident surface 164 of the optical lens 161 is the length X1 of the light emitting device 110 in the first direction and the length X1 in the second direction. It may be formed longer than the width Y1. This allows the light emitted from the light-emitting device 110 to be effectively incident through the incident surface 164 of the optical lens 161. In addition, the plurality of bosses 61, 62, 63, 64 are disposed within the area of the incident surface 164 of the optical lens 161, or at least one part is disposed outside the outer peripheral surface of the optical lens 161 Can be. The positions of the bosses 61, 62, 63 and 64 may be changed according to the size of the incident surface 164 of the optical lens 161. In addition, the shapes or positions of the bosses 61, 62, 63 and 64 and the coupling portions 41, 42, 43 and 44 may be changed as shown in FIGS. 9 to 11.

The embodiment has been described as an example protruding from the plurality of bosses 61,62,63,64 and the incident surface 164 of the optical lens 161, but the plurality of bosses 61,62,63,64 It may be formed in a structure bonded to the incident surface 164 of the lens 161. In this case, a connection structure for connecting the plurality of bosses 61, 62, 63, and 64 to each other to fix the position of the plurality of bosses 61, 62, 63 and 64 may be further included. In addition, the incident surface 164 of the optical lens 161 may include an uneven pattern for light incident efficiency.

In the following description of another embodiment, a detailed description of the same configuration as the first embodiment will be omitted, and the description of the first embodiment will be referred to.

7 is a plan view showing a light emitting device according to a second embodiment, and FIG. 8 is a combination of the bosses 61, 62, 63 and 64 of the optical lens of FIG. 7 and the light emitting elements 41, 42, 43 and 44 It is a view showing an example of a combination of, and Figure 9 is a plan view of the light emitting device of FIG.

7 to 9, in the light emitting device, the outer portion 122 of the first lead frame 121 and the outer portion 132 of the second lead frame 131 are exposed outward than the side surface of the body 141 And the bosses 61, 62, 63, 64 of the optical lens 161 on the outer portion 122 of the first lead frame 121 and the outer portion 132 of the second lead frame 131 They can be arranged correspondingly.

8 and 9, the bosses 61, 62A, 63, and 64A of the optical lens 161 are coupled on each of the coupling portions 41, 42A, 43, and 44A of the body 141. Here, each of the bosses 61, 62A, 63, 64A includes a protrusion protruding in a downward direction, and the protrusions may be disposed on the outer portions 122 and 132 of the first and second lead frames 121 and 131. have. For example, as shown in FIGS. 7 and 8, the lower surfaces of the first and third bosses 61 and 63 are adhered to the first and third coupling portions 41 and 43 with an adhesive 111, and The protrusions (1,3) protruding from the outer surfaces of the first and third bosses (61,63) are exposed to the outside of the first and third coupling portions (41,43) and the first and second lead frames (121,131). ) May be adhered to the outer portions 122 and 132 with an adhesive 111. These bosses 61, 62A, 63, 64A are adhered to the upper surfaces of each of the coupling portions 41, 42A, 43, and 44A and the outer portions 122 and 132 of each lead frame 121, 131, so that the adhesion can be enhanced. have.

8, in order to reduce contact with the inner surfaces 21, 22A, 23, 24A of each of the coupling portions 41, 42A, 43, 44A, each of the bosses 61, 62A, 63, 64A, It includes a sloped surface (2). The inclined surface 2 of each of the bosses 61, 62A, 63, 64A is in a region corresponding to the inner surfaces 21, 22A, 23, 24A of each of the coupling portions 41, 42A, 43, 44A. As a structure in which a part of the corner is cut, it is possible to facilitate the insertion of the bosses 61, 62A, 63, and 64A. The inclined surface 2 may be applied to two bosses or all bosses corresponding to each other, but is not limited thereto.

The protrusions of the bosses 61, 62A, 63, and 64A may be spaced apart from the outer portions 122 and 132 of the lead frames 121 and 131, which is the height of the protrusion 1 of the first boss 61 (C2 ) May protrude lower than the thickness C1 of each of the coupling portions 41, 42A, 43, and 44A.

In addition, the diameter (Y2) of the incident surface 164 of the optical lens 161 may be formed wider than the length (X1) of the lower surface of the light emitting element 110, the plurality of bosses (61, 62, 63, 64) ) May protrude within the area of the incident surface 164.

The width (D4) of each of the coupling portions (41, 42, 43, 44) is formed to be wider than the width (D3) of the outer portion (122,132) of each lead frame (121,131), the bosses (61, 62, 63, 64) can be strengthened, and also can prevent the optical lens 161 from tilting.

Referring to FIG. 9, the coupling portions 41, 42A, 43, and 44A of the light emitting device 110 are respectively formed at the vertices of a square centered on the light emitting chip 145, and the first and fourth coupling portions ( 41, 44A) may be formed in a corner region formed by the second side 12, the third side 13 and the fourth side 14 of the body 141, and the second and third coupling portions 42A , 43 may be formed in a corner region formed by the first side 11, the third side 13 and the fourth side 14 of the body 141. The first and third coupling portions 41 and 43 are formed as inner surfaces 21 and 23 having a curved or spherical contour, and the second and fourth coupling portions 42 and 44 have at least one inflection point. It is formed with the inner side surfaces 22A and 24A having.

The first and third bosses 61 and 63 of the optical lens 161 may have a circular shape, and the second and fourth bosses 62 and 64 may have a polygonal shape, for example, a square shape.

The outer portion 122 of the first lead frame 121 may protrude more outward than the first side surface 11 of the body 141, and the second and third coupling portions 42A and 43 It can extend outward. The outer portion 132 of the second lead frame 131 may protrude more outward than the second side surface 12 of the body 141, and the first and fourth coupling portions 41 and 44A It can be placed on the outside. Some (ie, protrusions) of the second and third bosses 62A and 63 are adhered to the outer portion 122 of the first lead frame 121, and the first and fourth bosses 61 and 64A A part (ie, protrusion) of the second lead frame 131 may be adhered to the outer portion 132 of the second lead frame 131.

10 is a plan view illustrating another example of the light emitting device of FIG. 9.

Referring to FIG. 10, in the light emitting device, the positions of the coupling portions 45, 46, and 47 of the light emitting device 110 are arranged in a vertex area of a triangle centered on the light emitting chip 145, and the first and second couplings The portions 45 and 46 are disposed at an adjacent edge of the light emitting device 110, for example, at a corner formed by the first side 11 and the third and fourth side surfaces 13 and 14 of the body 141, and The coupling portion 47 may be disposed in the center of the second side surface 12 of the body 141.

In addition, the inner side surfaces 25 and 26 of the first and second coupling portions 45 and 46 may be spherical or curved surfaces that do not have an inflection point, and the inner side surfaces 27 of the third coupling portion 43 are two It may be formed as a polygonal surface having the above inflection points.

The bosses 65, 66, and 67 of the optical lens 161 are formed in the number and positions corresponding to the first to third coupling portions 45, 46, and 47, respectively, and the first and second bosses ( Reference numerals 65 and 66 may have a circular outer circumferential surface, and the third boss 67 may have a polygonal outer circumferential surface.

The outer portion 122 of the first lead frame 121 may protrude more outward than the first side surface 11 of the body 141, and the first and second coupling portions 41 and 42 It can extend outward. The outer portion 132 of the second lead frame 131 may protrude more outward than the second side surface 12 of the body 141, and may be adhered to an outer portion of the third coupling portion 47. I can. Some of the first and second bosses 65 and 66 may be adhered to the outer portion 122 of the first lead frame 121.

11 is a plan view illustrating another example of the light emitting device of FIG. 9.

Referring to FIG. 11, in the light emitting device, the positions of the coupling portions 41, 42B, 43, and 44B of the light emitting element 110 are positioned in a rectangular shape centered on the light emitting chip 145, and the first and third couplings The parts 41 and 43 are formed as inner surfaces 21 and 23 having a curved or spherical contour, and the second and fourth coupling parts 42B and 44B are formed as inner surfaces 22B and 24B having a flat surface. Can be. The inner side surfaces 22B and 24B of the second and fourth coupling portions 42B and 44B face each other.

The first and third bosses 61 and 63 of the optical lens 161 may have a circular shape, and the second and fourth bosses 62B and 64B may have a polygonal shape, for example, a square shape. Sides of the second and fourth bosses 62B and 64B may be disposed to face each other.

In FIGS. 10 and 11, the size of the incident surface of the optical lens 161 may be the same as that of FIG. 4 or the same as that of FIG. 10, but is not limited thereto.

12 is a diagram illustrating another example of a coupling portion between a boss of the optical lens of FIG. 8 and a light emitting element.

Referring to FIG. 12, the protrusion 1 protruding outward of the first boss 61 may protrude adjacent to the outer portion 132 of the second lead frame 131. The height of the protrusion 1 may be the same as the thickness C1 of the first coupling part 41. Accordingly, the first boss 61 has an inner surface 21 of the coupling part 41, an upper surface of the first coupling part 41, and an upper surface of the outer outer part 132 of the second lead frame 131 It may be adhered to the adhesive 111. Accordingly, the fixing of the optical lens 161 may be strengthened.

13 is a diagram illustrating another example of a coupling portion between a boss of the optical lens of FIG. 8 and a light emitting element.

Referring to FIG. 13, the first coupling part 41 of the light emitting device 110 has an inner surface 21A having a thickness T1 of the body 141 and an outer part of the second lead frame 131 ( 132). The inner side 21A of the first coupling part 41 may be in contact with the inner side of the first boss 61 at the same height as the thickness T1 of the body 141.

The outer portion 132 of the second lead frame 131 protrudes outward from the inner side surface 21A of the first coupling portion 41. Accordingly, the first boss 61 of the optical lens 161 is guided along the inner surface 21 of the first coupling part 41 and disposed on the outer part 132 of the second lead frame 131 , It may be adhered with an adhesive 111. That is, the front surfaces of the plurality of bosses of the optical lens 161 are disposed to correspond to the outer portions of the lead frame, and are adhered.

12 and 13 describe the coupling structure of the first coupling portion and the first boss, but the coupling structure of the other coupling portion and the other boss may be applied to the structure of FIGS. 12 and 13. In addition, in FIGS. 12 and 13, the inner surface of each coupling portion may be a curved surface or a structure having an inflection point depending on the position of the coupling portion, and such a structure will be referred to the embodiment disclosed above.

14 is a side cross-sectional view illustrating a light emitting device according to a third embodiment.

Referring to FIG. 14, in the light emitting device, bosses 61 and 63 of the optical lens 161 are coupled to the coupling portions 41 and 43 of the light emitting element 110. A lens unit 155 is coupled to an upper surface of the body 141, and the lens unit 155 may be formed to be wider than the width of the cavity 142 of the body 141.

The body 141 includes a step structure 31 in a region corresponding to the lower surface of the lens unit 155, and the step structure 31 has a lower depth than the upper surface 148 of the body 141 (T4 ) Can be formed. Accordingly, the lower portion of the lens unit 155 may be accommodated in the stepped structure 31, and the lens unit 155 is stabilized because the lower surface 154 is positioned lower than the upper surface 148 of the body 141 Can be. In addition, the lower surface 153 of the lens unit 155 may be adhered to the stepped structure 31, thereby preventing the lens unit 155 from tilting. Since the high point of the upper surface 153 of the lens unit 155 is lowered, the thickness of the light emitting device may be reduced.

15 is a side cross-sectional view illustrating a light emitting device according to a fourth embodiment.

Referring to FIG. 15, the light emitting device includes a recess 149 on an upper surface of the body 141 of the light emitting element 110 and a groove 32 in the recess 149, and the recess 149 and At least one of the grooves 32 may include a continuous loop shape or a discontinuous loop shape. For example, when the top view shape of the cavity 142 is circular, the recess 149 and the groove 32 may be formed in a loop shape or a plurality of spaced apart along the circumference of the cavity 142.

The lens unit 155 includes a leg portion 75 and a fixing protrusion 76, the leg portion 75 protrudes downward from the lens unit 155, and the fixing protrusion 76 is the It extends in a horizontal outward direction from the leg portion 75. Accordingly, the leg portion 75 of the lens portion 155 is disposed in the recess 149 of the body 141, and the fixing protrusion 76 is coupled to the groove 32 in the recess 149 Can be. The leg portion 75 and the fixing protrusion 76 of the lens portion 155 may be bonded with an adhesive in the recess 149 and the groove 32. Accordingly, it is possible to prevent the lens unit 155 from tilting.

16 is a side cross-sectional view illustrating a light emitting device according to a fifth embodiment.

Referring to FIG. 16, the light emitting device includes a recess 149 on an upper surface of the body 141 of the light emitting element 110 and a groove 32 in the recess 149, and the recess 149 and At least one of the grooves 32 may include a continuous loop shape or a discontinuous loop shape. For example, if the top view shape of the cavity 142 is circular, the recess 149 and the groove 32 may be formed in a single loop shape along the circumference of the cavity 142 or may be formed to be spaced apart from each other. . The recess 149 and the groove 32 are spaced apart from the cavity 142 by a predetermined distance.

The lens unit 155 includes an extension portion 77 extending into the recess 149 along the upper surface 149 of the body 141, and a leg portion 78 extending downward from the extension portion 77 , And a fixing protrusion 79 protruding from the leg portion 78 in a horizontal outer direction. The extension part 77 extends outwardly of the cavity 142 along the upper surface 148 of the body 141, and the leg part 78 has a recess lower than the upper surface of the body 141 ( 149), the fixing protrusion 79 is coupled to the groove 32 in the recess 149. The lens unit 155 is adhered with an adhesive in the recess 149, so that tilting may be prevented.

17 is a side cross-sectional view illustrating a light emitting device according to a sixth embodiment.

Referring to FIG. 17, the light emitting device 110 may form an upper body 141B on the body 141 and a cavity 142 in the upper body 141B. A light emitting chip 145 and a light-transmitting resin layer 151 are formed in the cavity 142, and a lens unit 155 is coupled to the light-transmitting resin layer 151.

The upper body 141B may be formed of a material different from the body 141, for example, a material having a higher transmittance than the transmittance of the body 141, or a material having a reflectance lower than that of the body 141. . The upper body 141B may be formed of a light-transmitting material such as silicon or epoxy.

The body 141 may reflect light transmitted through the upper body 141B, and the upper body 141B extracts light in the lateral direction, thereby increasing the directivity of the light emitting element 110 You can widen it. In addition, the plurality of bosses 61 and 63 of the optical lens 161 may be adhered to the coupling portions 41 and 43 of the light emitting device 110 with an adhesive, and this configuration is referred to the description of the embodiment disclosed above. I will do it.

18 is a side cross-sectional view illustrating a light emitting device according to the seventh embodiment.

Referring to FIG. 18, the optical lens 161 of the light emitting device includes a guide portion 165 extending outwardly around a lower circumference, and the guide portion 165 extends outward than an outer peripheral surface of the optical lens 161 And may be arranged in one or a plurality. When there are a plurality of guide portions 165, they may be arranged at equal intervals. The guide part 165 may be provided for a manufacturing process of the optical lens 161 and may increase the area of the incident surface 164.

19 is a diagram illustrating a first modified example of a boss of an optical lens according to an embodiment.

Referring to FIG. 19, the boss 61 may be a circular boss, and the circular boss includes a tilt preventing portion 3A having a polygonal shape at a lower portion. The boss 161 has a structure in which a polygonal tilt prevention portion 3A is formed at a portion that contacts the inner surface of each coupling portion. That is, the boss 61 may have a structure having a different upper shape and a lower shape, and the lower tilt prevention part 3A may be formed as a surface having at least one inflection point for coupling with each coupling part. .

20 is a diagram illustrating a second modified example of a boss of an optical lens according to an embodiment.

Referring to FIG. 20, the boss 62 may be a polygon boss having an inflection point, and the polygon boss includes a tilt preventing portion 2A having a circular shape at the lower portion. The boss 62 has a structure in which a circular-shaped tilt prevention part 2A is formed in a portion contacting the inner surface of each coupling part. That is, the boss 62 may have a structure having a different upper shape and a lower shape, and the lower tilt prevention part 2A may be formed as a spherical surface or a curved surface for coupling with each coupling part.

21 is a side cross-sectional view illustrating a light emitting device according to an eighth embodiment.

Referring to FIG. 21, the light emitting device includes coupling portions 48 and 49 protruding from the upper surface of the body 141 around the outer periphery of the body 141 of the light emitting element 110, and the coupling portion 48 , 49) may be spaced apart from each other in a plurality of outer portions of the body 141. The positions of the coupling portions 48 and 49 of the body 141 may be arranged in a polygonal or triangular position, and reference will be made to FIGS. 9 to 11.

The optical lens 161 includes recesses 5 and 7 in which bosses 61, 62, 63 and 64 are coupled to the coupling portions 48 and 49, and the outer side of the recesses 5 and 7 Protrusions (6, 8) are arranged on. The recesses 5 and 7 may be bonded to the upper surfaces of the coupling portions 48 and 49 with an adhesive, and the protrusions 6 and 8 extend to the outer side of the body 141.

The outer side surfaces of each of the coupling portions 48 and 49 of the body 141 and the inner surfaces of the protrusions 6 and 8 of the optical lens 161 may have a corresponding tilt prevention structure. For example, the body ( The inner surfaces of the protrusions 6 and 8 of the coupling portions 48 and 49 and the bosses 61 and 63 of 141) may have an inflection point or may be formed as a spherical or curved surface. Let's refer to an example.

22 is a side cross-sectional view illustrating a light emitting device according to the ninth embodiment, and FIG. 23 is a diagram illustrating a light emitting device of the light emitting device of FIG. 22. 24 is a side view of a light emitting element of the light emitting device of FIG. 23.

22 to 24, the light emitting device includes a body 241 having a plurality of cavities 242; A plurality of lead frames (221,231) coupled to the body (241); A light emitting chip 345 and a light-transmitting resin layer 251 disposed in each of the cavities 242; A light-emitting element 210 including a lens unit 255 covering a plurality of cavities 242 on the body 241; And an optical lens 261 having a plurality of concave portions 263A and 263B on the light-emitting element 210.

The light-emitting element 210 may have a length Y5 in the second direction that is twice or more longer than the length X5 in the first direction, and includes a plurality of cavities 242 spaced apart from each other in the body 241 Is done. First and second lead frames 221 and 231 are disposed in the plurality of cavities 242, and the light emitting chip 245 is electrically connected to each other. A translucent resin layer 251 is disposed in the cavity 242.

A lens unit 255 covering each of the cavities 242 is disposed on the body 241, and the lens unit 255 has protrusions 256 and 257 that protrude convexly on each cavity 242 and the protrusions ( It may include a connector 258 connecting the 256,257.

It includes a plurality of coupling portions (81,82,83,84,85,86) adjacent to the first and second side surfaces (11,12) of the body 241, and the plurality of coupling portions (81,82, Among 83,84,85,86), the first to fourth coupling portions 81,82,83,84 disposed at each corner are in the center of the first and second side surfaces 11,12 of the body 241 It may have a different shape from the arranged fifth and sixth coupling portions 85 and 86. At least one inner surface of the first to fourth coupling portions 81,82,83,84 may be a spherical surface, a curved surface, or a shape having an inflection point, and the fifth and sixth coupling portions 85,86 At least one of the first to fourth coupling portions 81, 82, 83, and 84 may have a different shape.

The outer portion 222 of the first lead frame 221 is exposed to the outside of the first side 11 of the body 241 and the first, second and fifth coupling portions 81, 82, 85 It can be placed on the outside. The outer portion 232 of the second lead frame 231 is exposed to the outside of the second side surface 12 of the body 241, and the third, fourth and sixth coupling portions 83, 84, 86 It can be placed on the outside. Bosses 91, 92, 93 of the optical lens 161 are provided in the respective coupling portions 81, 82, 83, 84, 85, 86 and outer portions 222 and 232 of the first and second lead frames 221 and 231 Is coupled, and this coupling structure will be referred to the embodiment disclosed above.

25 is a side view of a light emitting device according to the thirteenth embodiment, and FIG. 26 is a plan view of the light emitting device of FIG. 25.

Referring to FIGS. 25 and 26, the light emitting device includes a body 241 having a plurality of cavities 242; A plurality of lead frames (221,231) coupled to the body (241); A light emitting chip 245 and a light-transmitting resin layer (not shown) disposed in each of the cavities 242; A light emitting element 210A including a plurality of lens units 255A and 255B covering each cavity 242 on the body 241; It includes a plurality of optical lenses (261A, 261B) on the light emitting device (210A).

The light-emitting element 210A may be formed to be twice or more in length in the second direction than in the first direction, and includes a plurality of cavities 242 spaced apart from each other in the body 241. First and second lead frames 121 and 131 are disposed in the plurality of cavities 242, and the light emitting chip 245 is electrically connected to each other. A translucent resin layer (not shown) is disposed in the cavity 242.

A plurality of lens portions 255A and 255B covering the respective cavities 242 are disposed on the body 241 to be spaced apart from each other.

As shown in Fig. 26, the bosses 94,96 of each optical lens 161 are coupled to the coupling portions 81,82,83,84,85,86 of the body 241, and each optical lens 161 The bosses 94 and 96 of the body 241 may be bonded to the coupling portions 81, 82, 83, 84, 85 and 86 of the body 241 with an adhesive. The coupling portions 81,82,83,84,85,86 of the body 241 will refer to the structure of FIG. 23, and each coupling portion 81,82,83,84,85,86 and the boss Each of the 94 and 96 may have a tilt preventing structure, and the tilt preventing structure will be referred to the embodiment disclosed above.

27 is a view showing the light directivity distribution of the light emitting device according to the embodiment, in which the side beam has a wide directivity angle of 160 degrees or more, and the intensity of the center beam and the side beam are substantially the same Is distributed as. In addition, in the directivity angle distribution of light, almost the same beam distribution is shown even in directions orthogonal to each other, such as a thick solid line and a thin solid line.

The light emitting chip according to the embodiment will be described with reference to the examples of FIGS. 28 and 29.

28 is a diagram illustrating a light emitting chip according to an embodiment.

Referring to FIG. 28, a light emitting chip according to an embodiment includes a substrate 311, a buffer layer 312, a light emitting structure 310, a first electrode 316 and a second electrode 317. The substrate 311 includes a substrate made of a translucent or non-transmissive material, and also includes a conductive or insulating substrate.

The buffer layer 312 reduces a difference in lattice constant between the substrate 311 and the material of the light-emitting structure 310, and may be formed of a nitride semiconductor. A nitride semiconductor layer not doped with a dopant may be further formed between the buffer layer 312 and the light emitting structure 310 to improve crystal quality.

The light emitting structure 310 includes a first conductive type semiconductor layer 313, an active layer 314, and a second conductive type semiconductor layer 315.

The first conductive type semiconductor layer 313 is implemented as a group III-V compound semiconductor doped with a first conductive type dopant, and the first conductive type semiconductor layer 313 is an n type semiconductor layer, and the first The conductivity type dopant is an n-type dopant and includes Si, Ge, Sn, Se, and Te.

A first cladding layer may be formed between the first conductive semiconductor layer 313 and the active layer 314. The first cladding layer may be formed of a GaN-based semiconductor, and a band gap thereof may be formed to be greater than or equal to the band gap of the active layer 314. This first cladding layer is formed in a first conductive type and serves to confine a carrier.

The active layer 314 is disposed on the first conductive type semiconductor layer 313 and optionally includes a single quantum well, a multiple quantum well (MQW), a quantum wire structure, or a quantum dot structure. do. The active layer 314 includes a cycle of a well layer and a barrier layer. The well layer includes a composition formula of In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and the barrier layer is In _x Al _y It may include a composition formula of Ga _1-xy N (0≦x≦1, 0≦y≦1, 0≦x+y≦1). The cycle of the well layer/barrier layer may be formed in one or more cycles using a stacked structure of, for example, InGaN/GaN, GaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, InAlGaN/InAlGaN. The barrier layer may be formed of a semiconductor material having a band gap higher than the band gap of the well layer.

A second conductive semiconductor layer 315 is formed on the active layer 314. The second conductive semiconductor layer 315 may be formed of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, for example, a semiconductor doped with a second conductive dopant. The second conductivity-type semiconductor layer 315 is a p-type semiconductor layer, and the second conductivity-type dopant is a p-type dopant, and may include Mg, Zn, Ca, Sr, and Ba.

The second conductive semiconductor layer 315 may include a superlattice structure, and the superlattice structure may include an InGaN/GaN superlattice structure or an AlGaN/GaN superlattice structure. The superlattice structure of the second conductive type semiconductor layer 315 may irregularly diffuse a current included in a voltage to protect the active layer 314.

In addition, the conductive type of the light emitting structure 310 may be reversed. For example, the first conductive type semiconductor layer 313 is a P type semiconductor layer, and the second conductive type semiconductor layer 315 is an n type semiconductor layer. can do. A first conductive type semiconductor layer having a polarity opposite to that of the second conductive type may be further disposed on the second conductive type semiconductor layer 315.

The light emitting structure 310 may be implemented in any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Here, p is a p-type semiconductor layer, n is an n-type semiconductor layer, and-includes a structure in which the p-type semiconductor layer and the n-type semiconductor layer are in direct contact or indirect contact. Hereinafter, for convenience of description, the uppermost layer of the light emitting structure 310 will be described as a second conductive type semiconductor layer 315.

A first electrode 316 is disposed on the first conductive type semiconductor layer 313 and a second electrode 317 having a current diffusion layer is disposed on the second conductive type semiconductor layer 315.

29 is a diagram illustrating another example of a light emitting chip according to the embodiment. In describing FIG. 29, the same parts as those of FIG. 28 will be omitted and briefly described.

Referring to FIG. 29, in the light emitting chip according to the embodiment, an ohmic contact layer 321 is formed under the light emitting structure 310, a reflective layer 324 is formed under the ohmic contact layer 321, and the reflective layer ( A support member 325 may be formed under the 324, and a protective layer 323 may be formed around the reflective layer 324 and the light emitting structure 310.

Such a light emitting chip is formed by forming an ohmic contact layer 321 and a protective layer 323, a reflective layer 324, and a support member 325 under the second conductive semiconductor layer 315, and then removing the growth substrate. I can.

The ohmic contact layer 321 is in ohmic contact with the lower layer of the light emitting structure 310, for example, the second conductive semiconductor layer 315, and the material may be selected from metal oxide, metal nitride, insulating material, and conductive material, For example, ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum) zinc oxide), antimony tin oxide (ATO), gallium zinc oxide (GZO), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and optional combinations thereof It can be formed in. In addition, it can be formed in a multilayer by using the metal material and a translucent conductive material such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, for example, IZO/Ni, AZO/Ag, IZO/Ag/Ni, AZO Can be laminated with /Ag/Ni, etc. A layer for blocking current may be further formed inside the ohmic contact layer 321 so as to correspond to the electrode 316.

The protective layer 323 may be selected from a metal oxide or an insulating material, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), and IGZO. (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), SiO ₂ , SiO _x , SiO _x N _y , It may be selectively formed from Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ . The protective layer 323 may be formed using a sputtering method or a vapor deposition method, and a metal such as the reflective layer 324 may prevent the layers of the light emitting structure 310 from shorting.

The reflective layer 324 may be formed of a material composed of a metal such as Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and selective combinations thereof. The reflective layer 324 may be formed larger than the width of the light emitting structure 310, which may improve light reflection efficiency. A metal layer for bonding and a metal layer for heat diffusion may be further disposed between the reflective layer 324 and the support member 325, but the embodiment is not limited thereto.

The support member 325 is a base substrate, such as copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu-W) or a metal such as a carrier wafer (for example: Si, Ge, GaAs, ZnO, SiC). A bonding layer may be further formed between the support member 325 and the reflective layer 324, and the bonding layer may bond two layers to each other. The disclosed light emitting chip is an example, and is not limited to the features disclosed above. The light emitting chip may be selectively applied to the embodiment of the light emitting device, but is not limited thereto.

<Lighting system>

The light emitting device according to the embodiment may be applied to a lighting system. The lighting system includes a structure in which a plurality of light emitting elements are arrayed, and includes the display device shown in FIGS. 30 and 31, the lighting device shown in FIG. 32, and may include a lighting lamp, a traffic light, a vehicle headlight, an electric sign, etc. have.

30 is an exploded perspective view of a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 30, the display device 1000 according to the embodiment includes a light guide plate 1041, a light source module 1031 providing light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), an optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light source module 1031, and a reflective member 1022. The bottom cover 1011 may be included, but is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin series such as PMMA (polymethyl metaacrylate), PET (polyethylene terephthlate), PC (polycarbonate), COC (cycloolefin copolymer), and PEN (polyethylene naphthalate). It may contain one of the resins.

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.

The light source module 1031 may include at least one in the bottom cover 1011 and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 1031 includes a support member 1033 and a light emitting device 1035 according to the disclosed embodiment(s), and the light emitting device 1035 is disposed on the support member 1033 at predetermined intervals. Can be arrayed. The support member 1033 may be a substrate or a heat dissipating plate, but is not limited thereto.

The substrate may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate may include not only a general PCB, but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB), etc., but is not limited thereto. The light emitting device 1035 may be mounted on a side surface of the bottom cover 1011 or on a heat dissipation plate. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

Further, the plurality of light emitting devices 1035 may be mounted on the support member 1033 such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but the embodiment is not limited thereto. Since the light-emitting device 1035 includes an optical lens 161, the distance between the light-emitting elements can be spaced apart, so that the number of light-emitting elements can be reduced. The light-emitting device 1035 may directly or indirectly provide light to a light-incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and directs it upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, PVC resin, or the like, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light source module 1031, and the reflective member 1022. To this end, the bottom cover 1011 may include a receiving portion 1012 having a box shape with an open top surface, but is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but the embodiment is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes first and second substrates made of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, and the structure of the polarizing plate is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041, and includes at least one translucent sheet. The optical sheet 1051 may include at least one of, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, the horizontal or/and vertical prism sheet condenses incident light to a display area, and the brightness enhancement sheet reuses lost light to improve luminance. In addition, a protective sheet may be disposed on the display panel 1061, but the embodiment is not limited thereto.

Here, as an optical sheet member on the light path of the light source module 1031, the light guide plate 1041 and the optical sheet 1051 may be included, but the embodiment is not limited thereto.

33 is a diagram illustrating a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 33, a display device 1100 includes a bottom cover 1152, a support member 1120 in which the light emitting devices 1124 disclosed in the above embodiment(s) are arrayed, an optical sheet member 1154, and a display. Includes panel 1155.

The support member 1120 and the light emitting device 1124 may be defined as a light source module 1060. The bottom cover 1152, at least one light source module 1060, and the optical sheet member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include an accommodating part 1153, but the embodiment is not limited thereto. The light source module 1060 includes a support member 1120 and a plurality of light emitting devices 1124 arranged on the support member 1120.

Here, the optical sheet member 1154 may include at least one of a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methyl methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses incident light, the horizontal and vertical prism sheets condense incident light into a display area, and the brightness enhancement sheet reuses lost light to improve brightness.

The optical sheet member 1154 is disposed on the light source module 1060 and performs a surface light source, diffusion, or condensation of light emitted from the light source module 1060.

31 is an exploded perspective view of a lighting device having a lighting device according to an embodiment.

Referring to FIG. 31, the lighting device according to the embodiment includes a cover 2100, a light source module 2200, a radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. I can. In addition, the lighting device according to the embodiment may further include one or more of a member 2300 and a holder 2500. The light source module 2200 may include a light emitting device according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape with a hollow and an open portion. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical support member. The cover 2100 may be coupled to the radiator 2400. The cover 2100 may have a coupling portion coupled to the radiator 2400.

A milky white paint may be coated on the inner surface of the cover 2100. The milky white paint may include a diffuser that diffuses light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is to allow light from the light source module 2200 to be sufficiently scattered and diffused to be emitted to the outside.

The material of the cover 2100 may be glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent or opaque so that the light source module 2200 is visible from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the radiator 2400. Accordingly, heat from the light source module 2200 is conducted to the radiator 2400. The light source module 2200 may include a light emitting device 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the radiator 2400 and has guide grooves 2310 into which a plurality of light emitting devices 2210 and a connector 2250 are inserted. The guide groove 2310 corresponds to the substrate and the connector 2250 of the light emitting device 2210.

The surface of the member 2300 may be coated or coated with a light reflective material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects light reflected on the inner surface of the cover 2100 and returning toward the light source module 2200 toward the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting device according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Accordingly, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating part 2710 of the inner case 2700. Accordingly, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides it to the light source module 2200. The power supply unit 2600 is accommodated in the storage groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide portion 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A number of components may be disposed on one surface of the base 2650. A number of components include, for example, a DC converter for converting AC power provided from an external power source to DC power, a driving chip for controlling the driving of the light source module 2200, and an ESD for protecting the light source module 2200. (ElectroStatic discharge) may include a protection element, but is not limited thereto.

The extension part 2670 has a shape protruding outward from the other side of the base 2650. The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the extension part 2670 may be provided equal to or smaller than the width of the connection part 2750 of the inner case 2700. Each end of the "+ wire" and "- wire" may be electrically connected to the extension part 2670, and the other end of the "+ wire" and "- wire" may be electrically connected to the socket 2800. .

The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding part is a part where the molding liquid is solidified, and allows the power supply part 2600 to be fixed inside the inner case 2700.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Further, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Accordingly, contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been described above, these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention belongs are illustrated above within the scope not departing from the essential characteristics of the present embodiment. It will be seen that various modifications and applications that are not available are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

41,42,43,44,45,46,47,81,82,83,84,85,86: joint
61,62,62A,62B,63,64,64A,64B,65,66,67,91,92,93,94,96: Boss
100: light-emitting device 110,210,210A: light-emitting element
121,131,221,231: lead frame 141,241: body
151,251: light-transmitting resin layer 145,245: light emitting chip
155,255,255A,255B: lens unit 161,261, 261A,261B: optical lens

Claims (13)

A body with a cavity; A first lead frame disposed in the cavity and extending in a direction of a first side of the body; A second lead frame disposed in the cavity and extending toward a second side of the body; A light emitting device disposed on at least one of the first lead frame and the second lead frame disposed in the cavity and including a light emitting chip electrically connected to the first lead frame and the second lead frame; And
And an optical lens disposed on the light-emitting element and including an incident surface and a plurality of bosses,
The body includes a plurality of coupling portions in which an edge portion of the body is recessed in the direction of the light emitting chip and has a stepped structure with respect to the upper surface of the body,
At least one of the plurality of bosses is coupled to the coupling portion,
An outer portion of the first lead frame and the second lead frame protrudes outward from a side surface of the body,
The plurality of bosses protrude from a lower surface of the boss in the direction of the body and include protrusions disposed on outer portions of the first and second lead frames. A body with a cavity; A first lead frame disposed in the cavity and extending in a direction of a first side of the body; A second lead frame disposed in the cavity and extending toward a second side of the body; A light emitting device disposed on at least one of the first lead frame and the second lead frame disposed in the cavity and including a light emitting chip electrically connected to the first lead frame and the second lead frame; And
And an optical lens disposed on the light-emitting element and including an incident surface and a plurality of bosses,
The body includes a plurality of coupling portions in which an edge portion of the body is recessed in the direction of the light emitting chip and has a stepped structure with respect to the upper surface of the body,
At least one of the plurality of bosses is coupled to the coupling portion,
The plurality of bosses includes a first boss and a second boss having different shapes,
The front surface of the plurality of bosses is a light emitting device adhered to the outer portion of the first lead frame and the second lead frame. The method of claim 2,
The first boss includes a shape in which at least a portion of the outer circumferential surface has a spherical surface, and the second boss includes a shape in which at least a portion of the outer circumferential surface has at least one inflection point,
The plurality of coupling portions include a first coupling portion having an inner surface corresponding to a spherical surface of the first boss, and a second coupling portion having an inner surface having an inflection point corresponding to at least one inflection point of the second boss,
The second boss includes a polygonal shape,
A light emitting device in which inner surfaces of the second coupling portion to which the second boss is coupled among the plurality of coupling portions are disposed to face each other. delete delete The method of claim 3,
The light emitting device is disposed at a vertex position of a triangle or a quadrangle centering on the light emitting chip. delete delete delete The method of claim 2,
And a lens unit disposed on the body and formed wider than the width of the cavity to be coupled to the body,
The body includes a stepped structure having a lower depth than the upper surface of the body in a region corresponding to the lower surface of the lens part,
The lower portion of the lens unit is a light emitting device accommodated in the stepped structure of the body. delete delete delete

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