CN112054109A - Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure - Google Patents
Ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance and packaging structure Download PDFInfo
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- CN112054109A CN112054109A CN202010955273.7A CN202010955273A CN112054109A CN 112054109 A CN112054109 A CN 112054109A CN 202010955273 A CN202010955273 A CN 202010955273A CN 112054109 A CN112054109 A CN 112054109A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 94
- 239000000853 adhesive Substances 0.000 title claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 33
- 238000000605 extraction Methods 0.000 title claims abstract description 29
- 230000032683 aging Effects 0.000 title claims abstract description 22
- 239000000084 colloidal system Substances 0.000 claims abstract description 59
- 150000001412 amines Chemical class 0.000 claims abstract description 12
- 239000004611 light stabiliser Substances 0.000 claims abstract description 12
- 150000003254 radicals Chemical class 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910018557 Si O Inorganic materials 0.000 claims abstract description 9
- 229910008284 Si—F Inorganic materials 0.000 claims abstract description 9
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000007822 coupling agent Substances 0.000 claims abstract description 5
- 239000002270 dispersing agent Substances 0.000 claims abstract description 5
- 238000010791 quenching Methods 0.000 claims abstract description 3
- 230000000171 quenching effect Effects 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 11
- -1 thiodiphenol ester Chemical class 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 150000003053 piperidines Chemical class 0.000 claims description 5
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 claims description 4
- 239000012990 dithiocarbamate Substances 0.000 claims description 4
- 206010051246 Photodermatosis Diseases 0.000 claims description 3
- WAMKWBHYPYBEJY-UHFFFAOYSA-N duroquinone Chemical compound CC1=C(C)C(=O)C(C)=C(C)C1=O WAMKWBHYPYBEJY-UHFFFAOYSA-N 0.000 claims description 3
- 150000008624 imidazolidinones Chemical class 0.000 claims description 3
- 230000008845 photoaging Effects 0.000 claims description 3
- 150000004885 piperazines Chemical class 0.000 claims description 3
- IYSYLWYGCWTJSG-XFXZXTDPSA-N n-tert-butyl-1-phenylmethanimine oxide Chemical compound CC(C)(C)[N+](\[O-])=C\C1=CC=CC=C1 IYSYLWYGCWTJSG-XFXZXTDPSA-N 0.000 claims description 2
- 229940066771 systemic antihistamines piperazine derivative Drugs 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 abstract description 9
- 230000015556 catabolic process Effects 0.000 abstract description 7
- 238000006731 degradation reaction Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 4
- 239000005022 packaging material Substances 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 5
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 5
- JLFNLZLINWHATN-UHFFFAOYSA-N pentaethylene glycol Chemical compound OCCOCCOCCOCCOCCO JLFNLZLINWHATN-UHFFFAOYSA-N 0.000 description 5
- 239000010452 phosphate Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- ZXKXJHAOUFHNAS-UHFFFAOYSA-N fenfluramine hydrochloride Chemical compound [Cl-].CC[NH2+]C(C)CC1=CC=CC(C(F)(F)F)=C1 ZXKXJHAOUFHNAS-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 125000005936 piperidyl group Chemical group 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- WPRMJBJYCFNTKE-UHFFFAOYSA-L (3,5-ditert-butyl-4-hydroxyphenyl)methyl-ethoxyphosphinate;nickel(2+) Chemical compound [Ni+2].CCOP([O-])(=O)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1.CCOP([O-])(=O)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 WPRMJBJYCFNTKE-UHFFFAOYSA-L 0.000 description 1
- IAINWMUGEQGIGE-HFASVGIHSA-N (5s)-n-[(2s,3r)-4-[1,3-benzodioxol-5-ylsulfonyl(2-methylpropyl)amino]-3-hydroxy-1-phenylbutan-2-yl]-2-oxo-3-[3-(trifluoromethyl)phenyl]-1,3-oxazolidine-5-carboxamide Chemical compound C([C@@H]([C@H](O)CN(CC(C)C)S(=O)(=O)C=1C=C2OCOC2=CC=1)NC(=O)[C@H]1OC(=O)N(C1)C=1C=C(C=CC=1)C(F)(F)F)C1=CC=CC=C1 IAINWMUGEQGIGE-HFASVGIHSA-N 0.000 description 1
- VPYDVGWWXAYRPP-UHFFFAOYSA-N 1-[2-[[4,6-bis[cyclohexyl-[2-(3,3,5,5-tetramethyl-2-oxopiperazin-1-yl)ethyl]amino]-1,3,5-triazin-2-yl]-cyclohexylamino]ethyl]-3,3,5,5-tetramethylpiperazin-2-one Chemical compound O=C1C(C)(C)NC(C)(C)CN1CCN(C=1N=C(N=C(N=1)N(CCN1C(C(C)(C)NC(C)(C)C1)=O)C1CCCCC1)N(CCN1C(C(C)(C)NC(C)(C)C1)=O)C1CCCCC1)C1CCCCC1 VPYDVGWWXAYRPP-UHFFFAOYSA-N 0.000 description 1
- JLZIIHMTTRXXIN-UHFFFAOYSA-N 2-(2-hydroxy-4-methoxybenzoyl)benzoic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1C(O)=O JLZIIHMTTRXXIN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- FLPKSBDJMLUTEX-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) 2-butyl-2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]propanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)(CCCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 FLPKSBDJMLUTEX-UHFFFAOYSA-N 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance, which comprises the following components: the packaging structure comprises colloid containing Si-O, C-F, Si-F bonds, a quenching agent accounting for 0.1-10% of the colloid by mass, a hydroperoxide decomposer accounting for 0.1-10% of the colloid by mass, a free radical trapping agent accounting for 0.1-15% of the colloid by mass, a hindered amine light stabilizer accounting for 0.1-15% of the colloid by mass, a coupling agent accounting for 0.5-5% of the colloid by mass, and a dispersing agent accounting for 1-5% of the colloid by mass, and also provides a packaging structure. The packaging adhesive and the packaging structure can prolong the degradation and aging time of the polymer, achieve the long-term stable light aging resistant effect, effectively reduce the total reflection light loss generated in the ultraviolet refraction process, and improve the light extraction efficiency of the packaging material.
Description
Technical Field
The invention belongs to the technical field of LED chip packaging, and particularly relates to ultraviolet LED packaging glue with high light extraction efficiency and light aging resistance and a packaging structure.
Background
The existing high-power ultraviolet packaging adopts two packaging modes of organic and inorganic. The organic encapsulation adopts organic colloid to bond the lens and the support together, the structure is simple, the operation is convenient, but the encapsulation is not resistant to high-power ultraviolet irradiation, the organic encapsulation causes serious photo-aging phenomenon of organic materials because of the irradiation of high-intensity ultraviolet light, the materials are yellowed and then broken, and the service life is short. Inorganic encapsulation adopts the one deck alloy cladding material of plating on the lens, bonds through tin cream or silver glue etc. between lens and the ceramic substrate, and the cost is higher, and the cladding material drops easily simultaneously, and life is also not long, and inorganic encapsulation has increased the light loss because through twice refraction, leads to the light extraction efficiency low.
Disclosure of Invention
In view of the above, the present invention provides a light-aging-resistant ultraviolet LED packaging adhesive with high light extraction efficiency and a packaging structure thereof, which can prolong the degradation and aging time of a polymer, achieve a long-term stable light-aging resistant effect, effectively reduce total reflection loss generated in the ultraviolet refraction process, and improve the light extraction efficiency of a packaging material.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the ultraviolet LED packaging adhesive with high light extraction efficiency and light aging resistance comprises the following components: the adhesive comprises colloid containing Si-O, C-F, Si-F bonds, a quenching agent accounting for 0.1-10% of the colloid by mass, a hydroperoxide decomposer accounting for 0.1-10% of the colloid by mass, a free radical trapping agent accounting for 0.1-15% of the colloid by mass, a hindered amine light stabilizer accounting for 0.1-15% of the colloid by mass, a coupling agent accounting for 0.5-5% of the colloid by mass and a dispersing agent accounting for 1-5% of the colloid by mass.
The packaging adhesive contains Si-O, C-F, Si-F bonds, and the application selection material bonds have energy higher than the application ultraviolet minimum waveband photon energy so as to reduce the molecular chain fracture damage caused by the absorption of the colloidal material to ultraviolet rays; the total reflection of interfaces of different materials is reduced, the light-emitting window material of the ultraviolet LED chip mainly comprises sapphire and GaNAl, the refractive indexes of the sapphire and the GaNAl are respectively 1.7 and 2.4, the refractive index of air is 1.0, the refractive index of packaging glue is 1.7-1.0, the packaging glue is packaged on the surface of the ultraviolet LED chip, the total reflection light loss generated in the ultraviolet refraction process can be effectively reduced, and the light extraction efficiency of the packaging material is improved.
Further, the quencher is a nickel light stable quencher.
Further, the quencher is preferably a quencher having a model number of Chimassorb N-705, Cyasorb UV-1084, Irgastab2002, SanduvorNPU, UV-chekAM 101.
The quencher can receive the energy absorbed by the chromophore and the impurities in the organic matters and radiate the energy in the form of heat energy, fluorescence or phosphorescence, so that the absorption of the chromophore and the impurities to ultraviolet light is prevented or the quantity of the light absorbed by the chromophore and the impurities is reduced, and the polymer can be effectively protected from aging degradation.
Further, the hydroperoxide decomposer is one or more of dialkyl dithiocarbamate, dialkyl dithiophosphate and thiodiphenol ester.
The hydroperoxide decomposer can rapidly decompose the hydroperoxide formed in the photooxidation process, reduce the free radical generated by the hydroperoxide, further reduce the molecular chain breakage caused by the free radical, and reduce the possibility of polymer aging degradation.
Further, the free radical trapping agent is one or a mixture of 2, 2-diphenyl-1-trinitrophenylhydrazine, p-benzoquinone, tetramethylbenzoquinone, 2-methyl-2-nitrosomethane and phenyl-N-tert-butyl nitrone.
The free radical trapping agent can trap a small amount of free radicals, and further reduce the aging degradation of the polymer.
Further, the hindered amine light stabilizer is one or a mixture of a plurality of piperidine derivatives, piperazine derivatives and imidazolidinone derivatives.
Further, the hindered amine light stabilizer is preferably a hindered amine light stabilizer with the model number of Tinuvin770, Eversorb90Chimassorb944, Tinuvin144, Chimassorb2030, Dastib1082, Uvinul4049H, Goodrite3150, Hostavin N30, GW540, Uvasorb HA 88.
The hindered amine light stabilizer is characterized in that after the assistant is used for oxidation, piperidine nitroxide radical is generated, the activity of the piperidine nitroxide radical is high, the piperidine nitroxide radical can react with free radicals in a polymer to generate piperidyl amine ether and piperidyl amine peroxide ether, degradation of the polymer is stopped, and the hindered amine can also play a role of a quencher.
Further, the coupling agent is preferably a mixture of one or more of KH550, KH560, NDZ101, phosphate ester and titanate ester.
The coupling agent is added into the packaging colloid system to ensure that the adhesive force between the silica gel and the bracket is larger.
Further, the dispersing agent is preferably one or a mixture of more of EBS, HTG, ZnSt, PEG400 and K60.
The dispersing agent is added to ensure that all the additives are dispersed more uniformly in a colloid system, and the system has good smoothness and is convenient to process and prepare.
Furthermore, the refractive index of the packaging adhesive is 1.0-1.7.
A high light extraction efficiency and light aging resistant ultraviolet LED packaging structure comprises an ultraviolet LED chip with the wavelength of 200-400nm, a packaging substrate and a packaging adhesive layer which covers the ultraviolet LED chip and is made of the packaging adhesive of any one of claims 1-6, wherein positive and negative chip electrodes of the ultraviolet LED chip (2) are respectively communicated with two substrate electrodes of the packaging substrate.
Further, the thickness of the encapsulating adhesive layer is preferably 20 micrometers.
Furthermore, one end of the packaging adhesive layer, which is far away from the packaging substrate, is of a hemispherical structure protruding outwards.
The shape of the packaging adhesive is preferably a hemispherical structure, the light emitted by the ultraviolet LED chip is perpendicular to the spherical tangent plane, the total reflection of the light emitting surface is effectively reduced, and the extraction efficiency of ultraviolet light is improved.
Further, the ultraviolet LED chip is completely coated by the packaging adhesive layer.
The external packaging adhesive layer has extrusion stress on the chip electrode, the insulating layer can buffer the extrusion stress, the comprehensive stress borne by the chip electrode is reduced, and the reliability of the packaging structure can be improved.
Compared with the prior art, the packaging adhesive and the packaging structure have the following advantages:
(1) the packaging adhesive and the packaging structure can prolong the degradation and aging time of the polymer, achieve the long-term stable light aging resistant effect, effectively reduce the total reflection light loss generated in the ultraviolet refraction process, and improve the light extraction efficiency of the packaging material.
(2) According to the packaging adhesive and the packaging structure, the light stabilizer has mobility in the polymer, and the light stabilizer can migrate and precipitate to form white frost in the long-term use process, so that the light stabilizer has a loss problem, and the problem of short effective time is caused by adopting a single light stabilizer.
(3) According to the packaging adhesive and the packaging structure, the quencher, the hydroperoxide decomposer, the free radical trapping agent and the hindered amine are added, so that the ultraviolet irradiation resistance intensity of the packaging adhesive is increased, the aging and yellowing of the packaging adhesive are avoided, and the service life of the packaging adhesive is prolonged.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the invention without limitation. In the drawings:
fig. 1 is a schematic diagram of a package structure according to an embodiment of the present invention.
Description of reference numerals:
1-packaging a glue layer; 2-LED chip; 21-chip electrodes; 3-a package substrate; 31-substrate electrode.
Detailed Description
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which are merely for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, the meaning of "a plurality" is two or more unless otherwise specified.
In the description of the invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be construed broadly, e.g. as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Unless otherwise specifically stated or limited, the term "fixedly connected" may be a commonly used fixedly connected manner such as a plug, a weld, a threaded connection, a bolt connection, etc. The specific meaning of the above terms in the creation of the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be described in detail with reference to the following embodiments with reference to the attached drawings.
Example 1
An ultraviolet LED packaging structure with high light extraction efficiency and long service life comprises an ultraviolet LED chip 2 with the wavelength of 200-400nm, a packaging substrate 3 and a packaging adhesive layer 1 covering the ultraviolet LED chip 2, wherein positive and negative chip electrodes 21 of the ultraviolet LED chip 2 are respectively communicated with two substrate electrodes 31 of the packaging substrate 3.
The packaging adhesive of the packaging adhesive layer 1 comprises colloid with Si-O, C-F, Si-F bonds, nickel light-stable quencher accounting for 0.1 percent of the mass percent of the colloid, dialkyl dithiocarbamate accounting for 3 percent of the mass percent of the colloid, 2-diphenyl-1-trinitrophenylhydrazine accounting for 5 percent of the mass percent of the colloid, piperidine derivative accounting for 10 percent of the mass percent of the colloid, phosphate accounting for 2 percent of the mass percent of the colloid, and PEG400 accounting for 3 percent of the mass percent of the colloid.
Example 2
An ultraviolet LED packaging structure with high light extraction efficiency and long service life comprises an ultraviolet LED chip 2 with the wavelength of 200-400nm, a packaging substrate 3 and a packaging adhesive layer 1 covering the ultraviolet LED chip 2, wherein positive and negative chip electrodes 21 of the ultraviolet LED chip 2 are respectively communicated with two substrate electrodes 31 of the packaging substrate 3.
The packaging adhesive of the packaging adhesive layer 1 comprises colloid with Si-O, C-F, Si-F bonds, nickel light-stable quencher accounting for 5% of the colloid by mass, dialkyl dithiophosphate accounting for 5% of the colloid by mass, p-benzoquinone accounting for 7% of the colloid by mass, piperazine derivative accounting for 8% of the colloid by mass, titanate accounting for 5% of the colloid by mass and EBS accounting for 3% of the colloid by mass.
Example 3
An ultraviolet LED packaging structure with high light extraction efficiency and long service life comprises an ultraviolet LED chip 2 with the wavelength of 200-400nm, a packaging substrate 3 and a packaging adhesive layer 1 covering the ultraviolet LED chip 2, wherein positive and negative chip electrodes 21 of the ultraviolet LED chip 2 are respectively communicated with two substrate electrodes 31 of the packaging substrate 3.
The packaging adhesive of the packaging adhesive layer 1 comprises colloid with Si-O, C-F, Si-F bonds, nickel light-stable quencher accounting for 10% of the colloid by mass, thiodiphenol ester accounting for 10% of the colloid by mass, 2-methyl-2-nitrosomethane accounting for 15% of the colloid by mass, piperidine derivative accounting for 15% of the colloid by mass, phosphate accounting for 5% of the colloid by mass, and PEG400 accounting for 5% of the colloid by mass.
Example 4
An ultraviolet LED packaging structure with high light extraction efficiency and long service life comprises an ultraviolet LED chip 2 with the wavelength of 200-400nm, a packaging substrate 3 and a packaging adhesive layer 1 covering the ultraviolet LED chip 2, wherein positive and negative chip electrodes 21 of the ultraviolet LED chip 2 are respectively communicated with two substrate electrodes 31 of the packaging substrate 3.
The packaging adhesive of the packaging adhesive layer 1 comprises colloid with Si-O, C-F, Si-F bonds, nickel light-stable quencher accounting for 0.1 percent of the mass percent of the colloid, thiodiphenol ester accounting for 0.1 percent of the mass percent of the colloid, tetramethylbenzoquinone accounting for 0.1 percent of the mass percent of the colloid, imidazolidinone derivatives accounting for 0.1 percent of the mass percent of the colloid, phosphate accounting for 0.5 percent of the mass percent of the colloid, and PEG400 accounting for 1 percent of the mass percent of the colloid.
Example 5
An ultraviolet LED packaging structure with high light extraction efficiency and long service life comprises an ultraviolet LED chip 2 with the wavelength of 200-400nm, a packaging substrate 3 and a packaging adhesive layer 1 covering the ultraviolet LED chip 2, wherein positive and negative chip electrodes 21 of the ultraviolet LED chip 2 are respectively communicated with two substrate electrodes 31 of the packaging substrate 3.
The packaging adhesive of the packaging adhesive layer 1 comprises colloid with Si-O, C-F, Si-F bonds, nickel light-stable quencher accounting for 4% of the colloid by mass, dialkyl dithiocarbamate accounting for 7% of the colloid by mass, 2-diphenyl-1-trinitrophenylhydrazine accounting for 10% of the colloid by mass, piperidine derivatives accounting for 8% of the colloid by mass, phosphate accounting for 4% of the colloid by mass, and PEG400 accounting for 2% of the colloid by mass.
Comparative examples 1 to 5
The LED chip 2 is the same as the LED chip 2 used in the embodiments 1-5, and the packaging structure is completely the same, except that the LED chip 2 is packaged by using a planar quartz lens in the comparative examples 1-5, and the LED chip is packaged by using the packaging adhesive layer 1 disclosed by the invention in the embodiments 1-5.
The package structures obtained in examples 1 to 5 and comparative examples 1 to 5 were subjected to light extraction efficiency test, and the test data are shown in table 1 below:
TABLE 1 List of data for measuring light extraction efficiency of examples 1-5 and comparative examples 1-5
From the above table, compared with an inorganic quartz lens, the LED chip packaged by the packaging adhesive provided by the invention can reduce energy loss caused by secondary refraction, remarkably improves the light extraction efficiency from 80-90% to more than 130%, and has a remarkable effect.
Comparative example 6
The LED chip 2 used in embodiment 1 is the same, and the packaging structure is completely the same, except that the LED chip 2 is packaged by using a common silica gel layer in comparative example 6, and the LED chip is packaged by using the packaging adhesive layer 1 in embodiment 1.
After the completion of the encapsulation, the encapsulation structures of example 1 and comparative example 5 were respectively subjected to uv irradiation, and an anti-aging performance test was performed, and changes of the encapsulation layer were observed with the increase of irradiation time, and the results are shown in table 2 below:
TABLE 2 anti-aging Performance test results of example 1 and comparative example 5 tabulated
As can be seen from the above table, the encapsulation layer of comparative example 6 is yellow after being irradiated for 120h-168h, and has fine lines and cracks after being irradiated by ultraviolet light for 168-360 h; the encapsulation layer in example 1 still has no obvious yellowing phenomenon after the ultraviolet irradiation for 360h-2880 h. The aging resistance of the packaging layer is obviously improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the invention, so that any modifications, equivalents, improvements and the like, which are within the spirit and principle of the present invention, should be included in the scope of the present invention.
Claims (8)
1. The utility model provides a high light extraction efficiency and ultraviolet LED encapsulation of resistant photoaging glues which characterized in that:
comprises the following components: the adhesive comprises colloid containing Si-O, C-F, Si-F bonds, a quenching agent accounting for 0.1-10% of the colloid by mass, a hydroperoxide decomposer accounting for 0.1-10% of the colloid by mass, a free radical trapping agent accounting for 0.1-15% of the colloid by mass, a hindered amine light stabilizer accounting for 0.1-15% of the colloid by mass, a coupling agent accounting for 0.5-5% of the colloid by mass and a dispersing agent accounting for 1-5% of the colloid by mass.
2. The high light extraction efficiency and light aging resistant ultraviolet LED packaging adhesive of claim 1, wherein: the hindered amine light stabilizer is one or a mixture of more of piperidine derivatives, piperazine derivatives and imidazolidinone derivatives.
3. The high light extraction efficiency and light aging resistant ultraviolet LED packaging adhesive of claim 1, wherein: the quencher is a nickel light stable quencher.
4. The high light extraction efficiency and light aging resistant ultraviolet LED packaging adhesive of claim 1, wherein: the hydroperoxide decomposer is one or more of dialkyl dithiocarbamate, dialkyl dithiophosphate and thiodiphenol ester.
5. The high light extraction efficiency and light aging resistant ultraviolet LED packaging adhesive of claim 1, wherein: the free radical trapping agent is one or a mixture of 2, 2-diphenyl-1-trinitrophenylhydrazine, p-benzoquinone, tetramethylbenzoquinone, 2-methyl-2-nitrosomethane and phenyl-N-tert-butyl nitrone.
6. The high light extraction efficiency and light aging resistant ultraviolet LED packaging adhesive of claim 1, wherein: the refractive index of the packaging adhesive is 1.0-1.7.
7. The utility model provides a high light extraction efficiency and ultraviolet LED packaging structure of resistant photoaging which characterized in that: the LED packaging structure comprises an ultraviolet LED chip (2) with the wavelength of 200-400nm, a packaging substrate (3) and a packaging adhesive layer (1) which covers the ultraviolet LED chip (2) and is made of the packaging adhesive according to any one of claims 1-6, wherein positive and negative chip electrodes (21) of the ultraviolet LED chip (2) are respectively communicated with two substrate electrodes (31) of the packaging substrate (3).
8. The high light extraction efficiency and light aging resistant ultraviolet LED package structure of claim 7, wherein: the packaging adhesive layer (1) completely covers the ultraviolet LED chip (2).
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102093719A (en) * | 2010-12-27 | 2011-06-15 | 东莞市阿比亚能源科技有限公司 | High-power light emitting diode (LED) chip packaging soft gel |
| US20160035947A1 (en) * | 2014-08-04 | 2016-02-04 | Prolight Opto Technology Corporation | Package structure of light-emitting diode module and method for manufacturing the same |
| CN106085344A (en) * | 2016-07-13 | 2016-11-09 | 东莞市和天新材料有限公司 | Ultraviolet leds lamp bead encapsulation glue and preparation method thereof |
| JP2017115145A (en) * | 2015-12-21 | 2017-06-29 | 住友化学株式会社 | Silicone resin composition, cured product and encapsulation material for semiconductor light-emitting element |
| CN107369676A (en) * | 2017-08-02 | 2017-11-21 | 厦门市三安光电科技有限公司 | A kind of ultraviolet LED modular structure |
| CN111106225A (en) * | 2019-12-31 | 2020-05-05 | 厦门市三安光电科技有限公司 | Ultraviolet LED packaging structure |
-
2020
- 2020-09-11 CN CN202010955273.7A patent/CN112054109B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102093719A (en) * | 2010-12-27 | 2011-06-15 | 东莞市阿比亚能源科技有限公司 | High-power light emitting diode (LED) chip packaging soft gel |
| US20160035947A1 (en) * | 2014-08-04 | 2016-02-04 | Prolight Opto Technology Corporation | Package structure of light-emitting diode module and method for manufacturing the same |
| JP2017115145A (en) * | 2015-12-21 | 2017-06-29 | 住友化学株式会社 | Silicone resin composition, cured product and encapsulation material for semiconductor light-emitting element |
| CN106085344A (en) * | 2016-07-13 | 2016-11-09 | 东莞市和天新材料有限公司 | Ultraviolet leds lamp bead encapsulation glue and preparation method thereof |
| CN107369676A (en) * | 2017-08-02 | 2017-11-21 | 厦门市三安光电科技有限公司 | A kind of ultraviolet LED modular structure |
| CN111106225A (en) * | 2019-12-31 | 2020-05-05 | 厦门市三安光电科技有限公司 | Ultraviolet LED packaging structure |
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