CN204045627U - A kind of LED support of modified node method - Google Patents
A kind of LED support of modified node method Download PDFInfo
- Publication number
- CN204045627U CN204045627U CN201420516829.2U CN201420516829U CN204045627U CN 204045627 U CN204045627 U CN 204045627U CN 201420516829 U CN201420516829 U CN 201420516829U CN 204045627 U CN204045627 U CN 204045627U
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- China
- Prior art keywords
- led
- insulating heat
- line
- conductive glue
- layer
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Abstract
The utility model relates to LED technology field, especially a kind of LED support of modified node method, comprise carrier, substrate and insulating heat-conductive glue-line, it is characterized in that, also comprise reflector layer and the accommodating layer of LED, the accommodating layer of described LED is located at above reflector layer, insulating heat-conductive glue-line is located at above the accommodating layer of LED, and the accommodating layer of LED is covered between insulating heat-conductive glue-line and reflector layer, is provided with substrate below described reflector layer, described insulating heat-conductive glue-line, reflector layer, substrate are all located between two carriers in left and right.The surrounding of LED chip additionally arranges one deck insulating heat-conductive glue-line, joint temperature when LED chip can be worked outwards is transmitted fast, the temperature of LED chip can be reduced, the packaging plastic above LED chip is avoided sharply to turn yellow by high temperature barbecue and lost efficacy, improve the reliability of LED, the useful life of LED can be extended simultaneously.
Description
Technical field
The utility model relates to LED technology field, especially a kind of LED support of modified node method.
Background technology
Light-emitting diode (LED) is a class can be directly the light-emitting component of luminous energy by electric energy conversion, i.e. the local light emitting semiconductor device that can send visible ray, infrared light, ultraviolet light when applying forward current in semiconductor P-N ties.It is as the new and effective solid light source of one, has the remarkable advantages such as long-life, energy-conservation, environmental protection.In recent years, along with the fast development of LED technology, the progressively raising of luminous efficiency, the application market of LED is more extensive, under the background of increasingly sharpening in the worry of current global energy shortage especially, LED more gets most of the attention in the prospect of illumination market, is thought to be expected most and maximum market at coming 10 years by industry, replaces one of the conventional light source such as incandescent lamp, tungsten lamp and fluorescent lamp high-tech sector most with prospects 2l century by being.In recent years, LED illumination light source Developing mainstream is high power white LED, just towards high brightness, high durability, high uniformity of luminance, high reliability future development.Therefore to determine LED three large key elements chip, filling colloid, support bowl cup requirement also more and more higher, but as high power LED package in current domestic high-end LED field, mostly be rely on to use the filling colloidal materials of import to promote LED quality, LED application cost is increased, is unfavorable for the wide popularization and application of high-end LED in China.
Summary of the invention
The technical problems to be solved in the utility model is, overcomes deficiency of the prior art, provides a kind of LED support of modified node method.
For technical solution problem, solution of the present invention is:
A kind of LED support of modified node method is provided, comprise carrier, substrate and insulating heat-conductive glue-line, it is characterized in that, also comprise reflector layer and the accommodating layer of LED, the accommodating layer of described LED is located at above reflector layer, and insulating heat-conductive glue-line is located at above the accommodating layer of LED, and the accommodating layer of LED is covered between insulating heat-conductive glue-line and reflector layer, be provided with substrate below described reflector layer, described insulating heat-conductive glue-line, reflector layer, substrate are all located between two carriers in left and right; Be provided with LED chip in the accommodating layer of described LED, and the P level of LED chip and N level are respectively by the derivation mechanism of the solder joint be provided with below it as electrode, described two solder joints are connected respectively carrier and the outside thereof of the left and right sides.
In the utility model, described insulating heat-conductive glue-line comprises transparent adhesive tape and is mixed in the insulating heat-conductive nano particle in described transparent adhesive tape.
In the utility model, described insulating heat-conductive nano particle conductive coefficient is greater than 35w/m.k.
In the utility model, the thickness of described insulating heat-conductive glue-line is less than or equal to the height of described LED chip.
In the utility model, the thickness of described insulating heat-conductive glue-line is 50 ~ 60 microns.
Compared with prior art, the utility model has the advantages that:
The utility model is on substrate, the surrounding of LED chip additionally arranges one deck insulating heat-conductive glue-line, joint temperature when LED chip can be worked outwards is transmitted fast, the temperature of LED chip can be reduced, the packaging plastic above LED chip is avoided sharply to turn yellow by high temperature barbecue and lost efficacy, improve the reliability of LED, the useful life of LED can be extended simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in below describing is only embodiments more of the present utility model, for those of ordinary skills, under the prerequisite not paying creative work, other embodiment and accompanying drawing thereof can also be obtained according to these accompanying drawing illustrated embodiments.
Fig. 1 is overall structure schematic diagram of the present utility model;
Wherein: the accommodating layer 2 of insulating heat-conductive glue-line 1, LED, solder joint 21, reflector layer 3, substrate 4, carrier 5.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described.
Consult Fig. 1, the utility model provides a kind of specific embodiment of LED support of modified node method, comprise carrier 5, substrate 4 and insulating heat-conductive glue-line 1, it is characterized in that, also comprise reflector layer 3 and the accommodating layer 2 of LED, the accommodating layer 2 of described LED is located at above reflector layer 3, insulating heat-conductive glue-line 1 is located at above the accommodating layer 2 of LED, and the accommodating layer 2 of LED is covered between insulating heat-conductive glue-line 1 and reflector layer 3, be provided with substrate 4 below described reflector layer 3, described insulating heat-conductive glue-line 1, reflector layer 3, substrate 4 are all located between two carriers 5 in left and right; Be provided with LED chip in the accommodating layer 2 of described LED, and the P level of LED chip and N level are respectively by the derivation mechanism of the solder joint 21 be provided with below it as electrode, described two solder joints 21 are connected respectively carrier 5 and the outside thereof of the left and right sides.
Described insulating heat-conductive glue-line 1 comprises transparent adhesive tape and is mixed in the insulating heat-conductive nano particle in described transparent adhesive tape.Described insulating heat-conductive nano particle conductive coefficient is greater than 35w/m.k.The thickness of described insulating heat-conductive glue-line 1 is less than or equal to the height of described LED chip.The thickness of described insulating heat-conductive glue-line 1 is 50 ~ 60 microns.
On substrate 4, the surrounding of LED chip additionally arranges one deck insulating heat-conductive glue-line 1, joint temperature when LED chip can be worked outwards is transmitted fast, the temperature of LED chip can be reduced, the packaging plastic above LED chip is avoided sharply to turn yellow by high temperature barbecue and lost efficacy, improve the reliability of LED, the useful life of LED can be extended simultaneously.
Above-described embodiment is only for illustrating technical conceive of the present utility model and feature; its object is to person skilled in the art can be understood content of the present utility model and be implemented; protection range of the present utility model can not be limited with this; all equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed in protection range of the present utility model.
Claims (5)
1. the LED support of a modified node method, comprise carrier, substrate and insulating heat-conductive glue-line, it is characterized in that, also comprise reflector layer and the accommodating layer of LED, the accommodating layer of described LED is located at above reflector layer, and insulating heat-conductive glue-line is located at above the accommodating layer of LED, and the accommodating layer of LED is covered between insulating heat-conductive glue-line and reflector layer, be provided with substrate below described reflector layer, described insulating heat-conductive glue-line, reflector layer, substrate are all located between two carriers in left and right; Be provided with LED chip in the accommodating layer of described LED, and the P level of LED chip and N level are respectively by the derivation mechanism of the solder joint be provided with below it as electrode, described two solder joints are connected respectively carrier and the outside thereof of the left and right sides.
2. LED support according to claim 1, is characterized in that, described insulating heat-conductive glue-line comprises transparent adhesive tape and is mixed in the insulating heat-conductive nano particle in described transparent adhesive tape.
3. LED support according to claim 2, is characterized in that, described insulating heat-conductive nano particle conductive coefficient is greater than 35w/m.k.
4. the LED support according to any one of claim 1-3, is characterized in that, the thickness of described insulating heat-conductive glue-line is less than or equal to the height of described LED chip.
5. the LED support according to any one of claim 1-3, is characterized in that, the thickness of described insulating heat-conductive glue-line is 50 ~ 60 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420516829.2U CN204045627U (en) | 2014-09-10 | 2014-09-10 | A kind of LED support of modified node method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420516829.2U CN204045627U (en) | 2014-09-10 | 2014-09-10 | A kind of LED support of modified node method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204045627U true CN204045627U (en) | 2014-12-24 |
Family
ID=52246262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420516829.2U Expired - Fee Related CN204045627U (en) | 2014-09-10 | 2014-09-10 | A kind of LED support of modified node method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204045627U (en) |
-
2014
- 2014-09-10 CN CN201420516829.2U patent/CN204045627U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20150910 |
|
| EXPY | Termination of patent right or utility model |