CN204809253U - Improvement heat dispersion's LED packaging structure - Google Patents
Improvement heat dispersion's LED packaging structure Download PDFInfo
- Publication number
- CN204809253U CN204809253U CN201520531814.8U CN201520531814U CN204809253U CN 204809253 U CN204809253 U CN 204809253U CN 201520531814 U CN201520531814 U CN 201520531814U CN 204809253 U CN204809253 U CN 204809253U
- Authority
- CN
- China
- Prior art keywords
- metal parts
- electrode metal
- utility
- model
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an improvement heat dispersion's LED packaging structure, which comprises a pedestal, the base on be provided with the chip, its characterized in that, the base bottom left and right sides be provided with first electrode metal parts and second electrode metal parts respectively, first electrode metal parts and second electrode metal parts in the middle of be unconnected space portion, the side that first electrode metal parts and second electrode metal parts are close to space portion is the echelonment, be provided with three or three above " S " type louvre on first electrode metal parts and the second electrode metal parts respectively, the base on be provided with convex reflector, the printing opacity glass layer of reflector for mixing phosphor powder owing to adopt " S " type louvre, the utility model discloses better radiating effect can be reached, LED's life has been prolonged, the utility model discloses the light transmissivity is good, has strengthened the illumination performance of product itself.
Description
[technical field]
The utility model relates to a kind of LED chip encapsulating structure, relates to a kind of LED encapsulation structure of improved heat radiation performance specifically.
[background technology]
Light-emitting diode (LED, LightEmittingDiode) has been widely used in the occasions such as various illumination or luminescence display.The transparent colloid that the encapsulating structure of existing LED generally includes support, is arranged at the LED chip on described support and covers on described LED chip.The heat dissipation problem of LED is the key factor affecting LED product performance always, in order to improve the heat dispersion of LED product, China utility model patent CN203826423U discloses a kind of LED encapsulation structure, comprise support, the transparent colloid being arranged at the LED chip on described support and covering on described LED chip, described support has the first electrode metal parts, second electrode metal parts and the space for electric insulation be arranged between described first electrode metal parts and described second electrode metal parts, described space is in " convex " font, its defect is that heat dispersion is poor, affect the useful life of product, and light transmission is bad, have impact on illumination performance.
[utility model content]
The technical problems to be solved in the utility model overcomes above-mentioned defect, there is provided a kind of LED encapsulation structure of improved heat radiation performance, the utility model has more excellent heat dispersion, extends product useful life, and light transmission is good, enhance the illumination performance of product itself.
Technical solutions of the utility model are as described below: a kind of LED encapsulation structure of improved heat radiation performance, comprise a pedestal, described pedestal is provided with chip, it is characterized in that, the described base bottom left and right sides is respectively arranged with the first electrode metal parts and the second electrode metal parts, be unconnected space part in the middle of the first described electrode metal parts and the second electrode metal parts, described first electrode metal parts and the second electrode metal parts are stepped near the side of space part, described first electrode metal parts and the second electrode metal parts are respectively arranged with " S " type louvre of more than three or three, described pedestal is provided with circular arc reflection shield, described reflection shield is the translucent glass layer mixing fluorescent material.
According to above-mentioned technical characteristic, the beneficial effects of the utility model are, owing to adopting " S " type louvre, the utility model can reach better radiating effect, extends the useful life of LED, in addition, owing to adopting circular arc reflection shield, especially adopt the translucent glass layer mixing fluorescent material as reflection shield, the utility model light transmission is good, enhances the illumination performance of product itself.
[accompanying drawing explanation]
Fig. 1 is structural representation of the present utility model.
In the drawings: 1, pedestal; 2, chip; 3, reflection shield; 4, the second electrode metal parts; 5, the first electrode metal parts; 6, louvre; 7, stepped; 8, space part.
[embodiment]
As shown in Figure 1, a kind of LED encapsulation structure of improved heat radiation performance, comprise a pedestal 1, described pedestal 1 is provided with chip 2, it is characterized in that, bottom described pedestal 1, the left and right sides is respectively arranged with the first electrode metal parts 5 and the second electrode metal parts 4, be unconnected space part 8 in the middle of the first described electrode metal parts 5 and the second electrode metal parts 4, described first electrode metal parts 5 and the second electrode metal parts 4 are stepped 7 near the side of space part 8, described first electrode metal parts 5 and the second electrode metal parts 4 are respectively arranged with " S " type louvre 6 of more than three or three, described pedestal 1 is provided with circular arc reflection shield 3, described reflection shield 3 is for mixing the translucent glass layer of fluorescent material.
Claims (1)
1. the LED encapsulation structure of an improved heat radiation performance, comprise a pedestal, described pedestal is provided with chip, it is characterized in that, the described base bottom left and right sides is respectively arranged with the first electrode metal parts and the second electrode metal parts, be unconnected space part in the middle of the first described electrode metal parts and the second electrode metal parts, described first electrode metal parts and the second electrode metal parts are stepped near the side of space part, described first electrode metal parts and the second electrode metal parts are respectively arranged with " S " type louvre of more than three or three, described pedestal is provided with circular arc reflection shield, described reflection shield is the translucent glass layer mixing fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520531814.8U CN204809253U (en) | 2015-07-22 | 2015-07-22 | Improvement heat dispersion's LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520531814.8U CN204809253U (en) | 2015-07-22 | 2015-07-22 | Improvement heat dispersion's LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204809253U true CN204809253U (en) | 2015-11-25 |
Family
ID=54594028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520531814.8U Active CN204809253U (en) | 2015-07-22 | 2015-07-22 | Improvement heat dispersion's LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204809253U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111223976A (en) * | 2020-01-14 | 2020-06-02 | 昆山琉明光电有限公司 | High-brightness LED packaging method and structure |
-
2015
- 2015-07-22 CN CN201520531814.8U patent/CN204809253U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111223976A (en) * | 2020-01-14 | 2020-06-02 | 昆山琉明光电有限公司 | High-brightness LED packaging method and structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101539250A (en) | LED lamp with high power | |
| CN205752232U (en) | A kind of COB light module | |
| CN204809253U (en) | Improvement heat dispersion's LED packaging structure | |
| CN203082797U (en) | Mirror surface aluminium substrate of light-emitting diode (LED) light source | |
| CN203787454U (en) | Led bracket and led luminous body | |
| CN201973584U (en) | High-efficiency and heat-radiating LED (Light Emitting Diode) spotlight | |
| CN204809254U (en) | High heat dissipation LED packaging structure | |
| CN201893369U (en) | LED (Light-Emitting Diode) | |
| CN203477964U (en) | LED area light source lamp emitting light by 360 degrees | |
| CN103208578A (en) | All-angle luminous light-emitting diode (LED) light source | |
| CN203589021U (en) | 360-degree light-transmitting LED lamp filament | |
| CN203176771U (en) | LED lamp bulb with heat radiation structure | |
| CN202032320U (en) | Light-emitting diode (LED) fluorescent tube | |
| CN203733795U (en) | LED packaging structure | |
| US20140319562A1 (en) | Light-emitting diode package structure | |
| CN204792912U (en) | High -power imitative lumen light source packaging structure | |
| CN204155957U (en) | A kind of LED COB light source | |
| CN204067419U (en) | The package structure for LED of high-cooling property | |
| CN202473918U (en) | High-bright multichip white light LED package | |
| CN203215311U (en) | High-brightness light-emitting diode lamp structure having heat radiation unit | |
| CN203784709U (en) | Safe light emitting diode (LED) bulb lamp | |
| CN202839746U (en) | Light-emitting diode device | |
| CN203883044U (en) | Novel surface mounted technology type LED | |
| CN201582760U (en) | Heat emission structure of LED lamp | |
| CN202332958U (en) | Encapsulating structure of LED illuminating lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 house community Stone Ring Road 202 wealth B building science and Technology Parks plant 3-5 layer Patentee after: SHENZHEN LEPOWER OPTO ELECTRONICS CO., LTD. Address before: 518000, Baoan District, Shiyan City, Guangdong province Shenzhen street community B the Great Wall Road, paddy field industrial zone, 5 floor Patentee before: Shenzhen Leyond Opto Electronics Co., Ltd. |